JP2009267428A - Device packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device packaging structure that packs a device with an excellent reliability, with a good yield, and without lowering workability in conducting electrical connection even when a connection terminal and a forming pitch of a connecting part become smaller. <P>SOLUTION: A first conductive connection part 80 formed on a first face of a substrate and a connection terminal 200a of a device arranged on a second face which is arranged with a level difference from the first face are electrically connected. On the second face which is arranged on the same side as the first face, a second conductive connection part 34 which is connected to the conductive terminal is formed, and a process is included in which the first conductive connection part and the second conductive connection part are electrically connected via a connector 360 which includes a first terminal electrode 36b which at least has the height of the level difference and which is connected to the first conductive connection part; a second terminal electrode 36c which is connected to the second conductive connection part and provided facing the same side as the first terminal electrode; and a connecting wiring 36d which electrically connects between the first terminal electrode and the second terminal electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a device mounting method.

  As a method for arranging and electrically connecting devices such as an IC chip on a circuit board, a wire bonding method has been conventionally known and generally used. For example, even in a droplet discharge head (inkjet recording head) used when applying a droplet discharge method (inkjet method) in forming an image or manufacturing a microdevice, a piezoelectric element for performing an ink discharge operation; A wire bonding method is used for connection with a drive circuit unit (IC chip or the like) that supplies an electrical signal to a piezoelectric element (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3).

JP 2000-127379 A JP 2003-159800 A JP 2004-284176 A

However, the following problems exist in the conventional technology as described above.
In recent years, along with the high integration of IC chips and the like, external connection terminals such as IC chips tend to be narrowed and pitched, and accordingly, wiring patterns formed on circuit boards tend to be narrowed. . For this reason, it has become difficult to apply a connection method using the wire bonding.

  In addition, in the method of forming an image and manufacturing a micro device based on the droplet discharge method, a nozzle opening provided in the droplet discharge head is used in order to realize high definition of the image and miniaturization of the micro device. It is preferable to make the distance (nozzle pitch) between the portions as small as possible (narrow). Since a plurality of the piezoelectric elements are formed corresponding to the nozzle openings, when the nozzle pitch is reduced, it is necessary to reduce the distance between the piezoelectric elements in accordance with the nozzle pitch. However, when the distance between the piezoelectric elements becomes small, it becomes difficult to connect each of the plurality of piezoelectric elements and the driver IC by a wire bonding technique.

  The present invention has been made in consideration of the above points, and an object of the present invention is to provide a method of mounting a device with excellent reliability and high yield.

In order to achieve the above object, the present invention employs the following configuration.
According to the device mounting method of the present invention, the first conductive connection portion formed on the first surface of the base and the connection terminal of the device disposed on the second surface disposed with a step from the first surface are electrically connected. A second conductive connection portion connected to the connection terminal is formed on the second surface arranged on the same side as the first surface, and the first conductive connection portion A first terminal electrode having at least the height of the step and connected to the first conductive connection; and a first terminal electrode connected to the second conductive connection; Electrically connecting via a connector comprising a second terminal electrode provided toward the same side and a connection wiring for electrically connecting the first terminal electrode and the second terminal electrode It is characterized by having.
Therefore, in the device mounting method of the present invention, when various devices such as semiconductor elements are mounted on the base, when the connection terminals of the device and the first conductive connection portion of the base are separated via a step, Since the connector having at least the height of the step is used, the step can be eliminated with a very simple configuration. Therefore, in the device mounting method of the present invention, the device can be mounted efficiently and reliably at low cost. In the present invention, it is also possible to perform a continuity check of the device before mounting the connector by measuring the second conductive connection portion connected to the connection terminal of the device.

In the present invention, a configuration in which the device and the connector are flip-chip mounted on the base body can be suitably employed.
Thereby, in this invention, it becomes possible to mount a device and a connector with the same apparatus (mounting apparatus), and it can contribute to the improvement of production efficiency.

FIG. 2 is a perspective configuration diagram of a droplet discharge head according to the embodiment. FIG. 3 is a perspective configuration diagram of the droplet discharge head as viewed from below. The cross-sectional block diagram which follows the AA line of FIG. The block diagram for demonstrating the connector shown in FIG. Sectional process drawing which shows an example of the manufacturing process of a connector. The block diagram for demonstrating the droplet discharge head which concerns on 2nd Embodiment. FIG. 9 is a configuration diagram for explaining a droplet discharge head according to a third embodiment. The perspective block diagram which shows an example of a droplet discharge device. FIG. 6 is a cross-sectional configuration diagram illustrating an example of a semiconductor device. It is a figure which shows 4th Embodiment, Comprising: It is a perspective block diagram of a droplet discharge head. It is a cross-sectional block diagram which follows the AA line of FIG. It is an external appearance perspective view of a connector. It is a flowchart figure which shows the manufacturing method of a droplet discharge head. It is a perspective block diagram which shows an example of a droplet discharge device.

(First embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments. Moreover, in each drawing referred in the following description, the dimension of each structural member is changed or a part is abbreviate | omitted and displayed in order to make drawing easy to see.

<Droplet ejection head>
First, as an embodiment of the present invention, a droplet discharge head having a device mounting structure according to the present invention will be described with reference to FIGS. 1 is a perspective configuration diagram showing an embodiment of a droplet discharge head, FIG. 2 is a partially cutaway perspective view of the droplet discharge head viewed from below, and FIG. 3 is taken along line AA in FIG. FIG.
In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as the X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as the Y-axis direction, and a direction orthogonal to the X-axis direction and the Y-axis direction (that is, the vertical direction) is defined as the Z-axis direction.

  The droplet discharge head 1 according to the present embodiment discharges ink (functional liquid) from a nozzle in the form of droplets. As shown in FIG. 1 to FIG. 3, the droplet discharge head 1 is connected to a nozzle substrate 16 having a nozzle opening 15 through which droplets are discharged, and an upper surface (+ Z side) of the nozzle substrate 16 to connect an ink flow path. A diaphragm 400 that is connected to the upper surface of the channel forming substrate 10 and is displaced by driving of the piezoelectric element (driving element) 300, and a reservoir 100 that is connected to the upper surface of the diaphragm 400. A reservoir forming substrate (protective substrate) 20 to be formed, four driving circuit units (driver ICs) 200A to 200D for driving the piezoelectric element 300 provided on the reservoir forming substrate 20, and driving circuit units 200A to 200A A plurality of wiring patterns (conductive connection portions) 34 connected to the 200D are provided.

  The operation of the droplet discharge head 1 is controlled by an external controller (not shown) connected to each of the drive circuit units 200A to 200D. In the flow path forming substrate 10 shown in FIG. 2, a plurality of substantially comb-shaped opening regions in plan view are defined, and a portion of these opening regions extending in the X-axis direction is a nozzle. The pressure generating chamber 12 is formed by being surrounded by the substrate 16 and the diaphragm 400. In addition, a portion extending in the Y direction in the figure in the substantially comb-shaped opening region in plan view is surrounded by the reservoir forming substrate 20 and the flow path forming substrate 10 to form the reservoir 100.

  2 and 3, the lower surface side (−Z side) of the flow path forming substrate 10 is open, and the nozzle substrate 16 is connected to the lower surface of the flow path forming substrate 10 so as to cover the opening. ing. The lower surface of the flow path forming substrate 10 and the nozzle substrate 16 are fixed via, for example, an adhesive or a heat welding film. The nozzle substrate 16 is provided with a plurality of nozzle openings 15 for discharging droplets. Specifically, the plurality of nozzle openings 15 provided in the nozzle substrate 16 are arranged in the Y-axis direction. In the present embodiment, a group of nozzle openings 15 arranged in a plurality of regions on the nozzle substrate 16 are arranged. The first nozzle opening group 15A, the second nozzle opening group 15B, the third nozzle opening group 15C, and the fourth nozzle opening group 15D are respectively configured.

The first nozzle opening group 15A and the second nozzle opening group 15B are arranged to face each other in the X-axis direction. The third nozzle opening group 15C is provided on the + Y side of the first nozzle opening group 15A, and the fourth nozzle opening group 15D is provided on the + Y side of the second nozzle opening group 15B. The third nozzle opening group 15C and the fourth nozzle opening group 15D are arranged so as to face each other in the X-axis direction.
In FIG. 2, each of the nozzle opening groups 15 </ b> A to 15 </ b> D is shown to be configured by six nozzle openings 15, but actually, each nozzle opening group has a large number of, for example, about 720 It is constituted by the nozzle opening 15.

  A plurality of partition walls 11 extending in the X direction from the center portion are formed inside the flow path forming substrate 10. In the case of this embodiment, the flow path forming substrate 10 is formed of silicon, and the plurality of partition walls 11 partially remove the silicon single crystal substrate that is the base material of the flow path forming substrate 10 by anisotropic etching. Is formed. A plurality of spaces defined by the flow path forming substrate 10 having the plurality of partition walls 11, the nozzle substrate 16, and the diaphragm 400 are pressure generation chambers 12.

The pressure generating chamber 12 and the nozzle opening 15 are provided corresponding to each other. That is, a plurality of pressure generation chambers 12 are provided side by side in the Y-axis direction so as to correspond to the plurality of nozzle openings 15 constituting each of the first to fourth nozzle opening groups 15A to 15D. A plurality of pressure generation chambers 12 corresponding to the first nozzle opening group 15A constitute a first pressure generation chamber group 12A, and a plurality of pressure generation chambers 12 formed corresponding to the second nozzle opening group 15B. Constitutes the second pressure generating chamber group 12B, and a plurality of pressure generating chambers 12 formed corresponding to the third nozzle opening group 15C constitute the third pressure generating chamber group 12C and correspond to the fourth nozzle opening group 15D. Thus, a plurality of pressure generation chambers 12 form a fourth pressure generation chamber group 12D.
The first pressure generation chamber group 12A and the second pressure generation chamber group 12B are arranged to face each other in the X-axis direction, and a partition wall 10K is formed between them. Similarly, a partition 10K is also formed between the third pressure generation chamber group 12C and the fourth pressure generation chamber group 12D, and they are arranged so as to face each other in the X-axis direction.

  The ends of the plurality of pressure generating chambers 12 forming the first pressure generating chamber group 12A on the substrate center side (−X side) are closed by the partition wall 10K described above, but on the substrate outer edge side (+ X side). The ends are assembled so as to be connected to each other, and are connected to the reservoir 100. The reservoir 100 temporarily holds the functional liquid between the functional liquid inlet 25 and the pressure generation chamber 12 shown in FIGS. 1 and 3, and is a plan view extending in the Y axis direction on the reservoir forming substrate 20. The reservoir portion 21 is formed in a rectangular shape, and the communication portion 13 is formed in the flow path forming substrate 10 in a rectangular shape in plan view extending in the Y-axis direction. The communication section 13 is connected to each pressure generation chamber 12 to form a common functional liquid holding chamber (ink chamber) for the plurality of pressure generation chambers 12 constituting the first pressure generation chamber group 12A. Looking at the path of the functional liquid shown in FIG. 3, the functional liquid introduced from the functional liquid introduction port 25 opened on the upper surface of the outer end of the head flows into the reservoir 100 through the introduction path 26 and passes through the supply path 14 to the first. The pressure generation chamber group 12A is supplied to each of the plurality of pressure generation chambers 12.

  In addition, a reservoir 100 having the same configuration as described above is connected to each of the pressure generation chambers 12 constituting each of the second, third, and fourth pressure generation chamber groups 12B, 12C, and 12D. 14 constitutes a temporary storage unit for the functional fluid supplied to the pressure generation chamber groups 12B to 12D communicated with each other.

  The vibration plate 400 disposed between the flow path forming substrate 10 and the reservoir forming substrate 20 has a structure in which the elastic film 50 and the lower electrode film 60 are laminated in order from the flow path forming substrate 10 side. The elastic film 50 disposed on the flow path forming substrate 10 side is made of, for example, a silicon oxide film having a thickness of about 1 to 2 μm. The lower electrode film 60 formed on the elastic film 50 is, for example, 0. It consists of a metal film having a thickness of about 2 μm. In the present embodiment, the lower electrode film 60 also functions as a common electrode for a plurality of piezoelectric elements 300 disposed between the flow path forming substrate 10 and the reservoir forming substrate 20.

As shown in FIG. 3, the piezoelectric element 300 for deforming the diaphragm 400 has a structure in which a piezoelectric film 70 and an upper electrode film 80 are laminated in order from the lower electrode film 60 side. The thickness of the piezoelectric film 70 is, for example, about 1 μm, and the thickness of the upper electrode film 80 is, for example, about 0.1 μm.
The concept of the piezoelectric element 300 may include the lower electrode film 60 in addition to the piezoelectric film 70 and the upper electrode film 80. This is because the lower electrode film 60 functions as the piezoelectric element 300 and also functions as the diaphragm 400. In the present embodiment, a configuration in which the elastic film 50 and the lower electrode film 60 function as the diaphragm 400 is employed, but the elastic film 50 is omitted and the lower electrode film 60 also serves as the elastic film (50). You can also

  A plurality of piezoelectric elements 300 (the piezoelectric film 70 and the upper electrode film 80) are provided so as to correspond to the plurality of nozzle openings 15 and the pressure generating chambers 12, respectively. In the present embodiment, for the sake of convenience, a group of piezoelectric elements 300 provided in a line in the Y-axis direction so as to correspond to each of the nozzle openings 15 constituting the first nozzle opening group 15A is referred to as a first piezoelectric element group. I will call it. Similarly, a group of piezoelectric elements 300 provided in a line in the Y-axis direction so as to correspond to each of the nozzle openings 15 constituting the second nozzle opening group 15B is referred to as a second piezoelectric element group. Further, a group of piezoelectric elements 300 corresponding to the third nozzle opening group 15C is referred to as a third piezoelectric element group, and a group of piezoelectric elements 300 corresponding to the fourth nozzle opening group 15D is referred to as a fourth piezoelectric element group. .

  In the planar region on the flow path forming substrate 10, the first piezoelectric element group and the second piezoelectric element group are arranged to face each other in the X-axis direction. Similarly, the third and fourth piezoelectric element groups respectively corresponding to the third and fourth nozzle opening groups 15C and 15D are disposed so as to face each other in the X-axis direction.

A reservoir forming substrate 20 is provided so as to cover a region on the vibration plate 400 including the piezoelectric element 300, and the sealing film 31 is fixed to the upper surface of the reservoir forming substrate 20 (the side opposite to the flow path forming substrate 10). A compliance substrate 30 having a structure in which a plate 32 is laminated is bonded. In the compliance substrate 30, the sealing film 31 disposed on the inner side is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide film having a thickness of about 6 μm). The upper part of is sealed. On the other hand, the fixed plate 32 disposed on the outside is a plate-like member made of a hard material such as metal (for example, stainless steel having a thickness of about 30 μm).
The fixing plate 32 has an opening 33 formed by cutting out a planar region corresponding to the reservoir 100. With this configuration, the upper portion of the reservoir 100 is sealed only by the flexible sealing film 31. The flexible portion 22 can be deformed by a change in internal pressure.

  Normally, when the functional liquid is supplied to the reservoir 100 from the functional liquid inlet 25, a pressure change occurs in the reservoir 100 due to, for example, the flow of the functional liquid when the piezoelectric element 300 is driven or the ambient heat. However, as described above, since the upper portion of the reservoir 100 has the flexible portion 22 sealed only by the sealing film 31, the flexible portion 22 bends and deforms to absorb the pressure change. Therefore, the inside of the reservoir 100 is always maintained at a constant pressure. The other parts are held at a sufficient strength by the fixing plate 32. A functional liquid introduction port 25 for supplying a functional liquid to the reservoir 100 is formed on the compliance substrate 30 outside the reservoir 100, and the functional liquid introduction port 25 and the reservoir 100 are formed on the reservoir forming substrate 20. There is provided an introduction path 26 that communicates with the side wall.

  Since the reservoir forming substrate 20 is a member that forms the base of the droplet discharge head 1 together with the flow path forming substrate 10, it is preferable that the reservoir forming substrate 20 be a rigid body, and the material forming the reservoir forming substrate 20 is substantially the same as the flow path forming substrate 10. It is more preferable to use a material having a thermal expansion coefficient. In the present embodiment, since the flow path forming substrate 10 is made of silicon, a silicon single crystal substrate made of the same material as that is suitable. When a silicon single crystal substrate is used, high-precision processing can be easily performed by anisotropic etching. Therefore, there is an advantage that the piezoelectric element holding portion 24 and the groove portion (through hole) 700 can be easily formed. It is done. In addition, similarly to the flow path forming substrate 10, the reservoir forming substrate 20 can be manufactured using glass, a ceramic material, or the like.

As shown in FIG. 1, four drive circuit units 200 </ b> A to 200 </ b> D are disposed on the reservoir forming substrate 20. The drive circuit units 200A to 200D are configured to include, for example, a circuit board or a semiconductor integrated circuit (IC) including a drive circuit. Each of the drive circuit units 200 </ b> A to 200 </ b> D includes a plurality of connection terminals 200 a on the lower surface side in the drawing, and some of the connection terminals 200 a are connected to the wiring pattern 34 formed on the reservoir forming substrate 20. As shown in FIG. 3, other part of the connection terminals 200 a of the drive circuit units 200 </ b> A to 200 </ b> D is connected to the terminal electrode 352 of the connector laminate 350 disposed in the groove of the reservoir forming substrate 20. .
The drive circuit units 200A and 200C are disposed longitudinally along the Y-axis direction on the reservoir forming substrate 20, and the drive circuit units 200B and 200D are longitudinally parallel to the drive circuit units 200A and 200C, respectively, in the Y-axis direction. Is arranged. The wiring patterns 34 that are electrically connected to the drive circuit units 200A to 200D all extend in the X-axis direction from the outer ends of the drive circuit units 200A to 200D. It can be used as a connection terminal.

  In the present embodiment, a group (six in the figure) of wiring patterns 34 electrically connected to the piezoelectric elements 300 of the first piezoelectric element group corresponding to the first nozzle opening group 15A is the first wiring group 34A. A group of wiring patterns 34 electrically connected to the piezoelectric element 300 of the second piezoelectric element group corresponding to the second nozzle opening group 15B constitutes the second wiring group 34B. Similarly, a group of wiring patterns 34 electrically connected to the piezoelectric elements 300 of the third and fourth piezoelectric element groups constitute a third wiring group 34C and a fourth wiring group 34D, respectively.

  A group of wiring patterns 34 constituting the first wiring group 34A is connected to the driving circuit unit 200A, and a group of wiring patterns 34 constituting the second wiring group 34B is connected to the driving circuit unit 200B, and the third wiring group 34C is connected. The group of wiring patterns 34 constituting the group is connected to the driving circuit unit 200C, and the group of wiring patterns 34 constituting the fourth wiring group 34D is connected to the driving circuit unit 200D. In the liquid droplet ejection head 1 of the present embodiment, the first piezoelectric element group to the fourth piezoelectric element group respectively corresponding to the first nozzle opening group 15A to the fourth nozzle opening group 15D are respectively provided by different drive circuit units 200A to 200D. A driving structure is adopted.

  In FIG. 1, each wiring group has six wiring patterns 34, but this is only illustrated in accordance with the number of nozzle openings 15 and the number of pressure generating chambers 12 shown in FIG. 2. First, as described above, the wiring pattern 34 included in each of the wiring groups 34A to 34D constitutes a connection wiring between the driving circuit units 200A to 200D and the external controller, and therefore the number of the wiring patterns 34 is 200A. The number necessary for driving and controlling 200D is sufficient, and is usually smaller than the number of piezoelectric elements 300 driven by each driving circuit unit.

  As shown in FIG. 1, a groove (through hole) 700 extending in the Y-axis direction is formed at the center of the reservoir forming substrate 20 in the X-axis direction. That is, in the liquid droplet ejection head of this embodiment, the groove portion 700 includes the upper electrode film 80 (circuit connection portion) of the piezoelectric element 300 and the connection terminals 200a of the drive circuit portions 200A to 200D to be connected thereto. A step is formed separating the two.

  In the present embodiment, as shown in FIG. 3, a portion of the reservoir forming substrate 20 partitioned by the groove 700 in the X-axis direction is sealed with a plurality of piezoelectric elements 300 connected to the circuit driver 200 </ b> A. A portion where the plurality of piezoelectric elements 300 connected to the drive circuit portion 200B is sealed as the first sealing portion 20A is referred to as a second sealing portion 20B. Each of the first sealing portion 20A and the second sealing portion 20B secures a space that does not hinder the movement of the piezoelectric element 300 in a region facing the piezoelectric element 300, and also seals the space. An element holding unit (element holding unit) 24 is provided. Of the piezoelectric element 300, at least the piezoelectric film 70 is sealed in the piezoelectric element holding portion 24.

Similarly, a portion of the reservoir forming substrate 20 that seals the plurality of piezoelectric elements 300 connected to the circuit driving unit 200C is a third sealing unit, and the plurality of piezoelectric elements 300 connected to the driving circuit 200D. As the fourth sealing portion, the third sealing portion and the fourth sealing portion each have a space that does not hinder the movement of the piezoelectric element 300, and the space A piezoelectric element holding part for sealing is provided.
In the case of the present embodiment, the piezoelectric element holding portion (24) provided in each of the first to fourth sealing portions has dimensions that can seal the entire piezoelectric element 300 included in each piezoelectric element group. Thus, a concave portion having a substantially rectangular shape in plan view extending in the direction perpendicular to the paper surface of FIG. 3 is formed. The piezoelectric element holding portion may be partitioned for each piezoelectric element 300.

  As shown in FIG. 3, in the piezoelectric element 300 sealed by the piezoelectric element holding part 24 of the first sealing part 20A, the end portion on the −X side of the upper electrode film 80 is the first sealing part 20A. It is exposed to the bottom surface of the groove 700. In the case where a part of the lower electrode film 60 is disposed on the flow path forming substrate 10 in the groove portion 700, the insulating film 600 for preventing a short circuit between the upper electrode film 80 and the lower electrode film 60 is the upper electrode. It is interposed between the film 80 and the lower electrode film 60. Similarly, in the piezoelectric element 300 sealed by the piezoelectric element holding part 24 of the second sealing part 20B, the + X side end of the upper electrode film 80 extends to the outside of the second sealing part 20B. The insulating film 600 is interposed between the upper electrode film 80 and the lower electrode film 60 at the exposed end portion. Further, although not shown, in the piezoelectric element 300 sealed by the third and fourth sealing portions, part of the upper electrode film 80 extends to the outside of the third and fourth sealing portions. And exposed in the groove 700.

  And in the groove part 700, the connector laminated body 350 is arrange | positioned in alignment with the upper electrode film | membrane 80 of each piezoelectric element 300 exposed to the bottom face part. In the droplet discharge head 1 of this embodiment, the connector laminate 350 eliminates a step between the bottom surface of the groove 700 and the top surface of the reservoir forming substrate 20 on which the drive circuit units 200A to 200D are arranged, and the drive circuit unit. 200A to 200D are mounted on the reservoir forming substrate 20 in a planar manner.

  4A is a perspective configuration diagram of the connector laminate 350 shown in FIG. 3, and FIG. 4B is a sectional configuration diagram taken along line BB in FIG. 4A. The connector laminate 350 according to the present embodiment is obtained by electrically connecting and laminating a plurality of (in the drawing, five) plate-like connectors 35 to each other. Each connector 35 includes a connector substrate (base material) 351 and a plurality of terminal electrodes (through electrodes) 352 that penetrate the connector substrate 351. As shown in FIG. 4A, the terminal electrodes 352 are arranged along the long side of the connector substrate 351.

  In the present embodiment, among the terminal electrodes 352 arranged along the long side on the + X side of the connector substrate 351, a group of terminal electrodes 352 arranged closer to the −Y side constitutes the first terminal electrode group 352A. , A group of terminal electrodes 352 arranged closer to the + Y side constitutes a third terminal electrode group 352C. Of the terminal electrodes 352 arranged along the long side on the −X side of the connector substrate 351, a group of terminal electrodes 352 arranged closer to the −Y side constitutes a second terminal electrode group 352B. A group of terminal electrodes 352 arranged closer to the + Y side constitutes a fourth terminal electrode group 352D. The first terminal electrode group 352A is a set of terminal electrodes 352 to be connected to each piezoelectric element 300 included in the first piezoelectric element group described above, and the second terminal electrode group 352B is a second piezoelectric element. A set of terminal electrodes 352 to be connected to each piezoelectric element 300 included in the group. Similarly, the third terminal electrode group 352C and the fourth terminal electrode group 352D correspond to the third piezoelectric element group and the fourth piezoelectric element group, respectively.

  In the connector laminated body 350 shown in FIG. 4A, a larger number of terminal electrodes 352 than those of the connection terminals 200a shown in FIG. 1 are shown. In these figures, however, connection is ensured to ensure the visibility of the drawing. The number of terminals 200a and terminal electrodes 352 is reduced and displayed. In an actual droplet discharge head, the number of terminal electrodes 352, the number of piezoelectric elements 300, and the number of connection terminals 200a are the same. . That is, since about 720 piezoelectric elements 300 are provided for each piezoelectric element group, about 720 terminal electrodes 352 connected to each piezoelectric element 300 are actually provided for each terminal electrode group. .

  In the cross-sectional structure shown in FIG. 4B, an insulating layer 353 and a base layer 354 are stacked on the surface of the connector substrate 351 constituting the connector 35. The connector substrate 351 is, for example, a silicon substrate having a thickness of about 50 μm, and the insulating layer 353 is, for example, silicon oxide. The underlayer 354 can be formed by stacking, for example, a barrier layer made of TiW and a seed layer made of Cu.

  The terminal electrode 352 has a substantially T-shaped metal terminal 355 having a part inserted in a through-hole 351 a having an insulating layer 353 and a base layer 354 laminated on the inner surface, and a junction formed on the upper surface of the metal terminal 355. And a layer 356. The metal terminal 355 is made of Cu formed using, for example, a plating method, and the bonding layer 356 is a brazing material such as lead-free solder. The terminal electrode 352 is formed so that a part thereof protrudes on both surfaces of the connector substrate 351, and the protruding height is, for example, about 20 μm. Therefore, the thickness of the connector 35 is about 70 μm.

  The connector laminate 350 laminates the plurality of connectors 35 at substantially the same position in plan view, and has the tip of the metal terminal 355 protruding on the lower surface side of the connector 35 arranged on the upper layer side (+ Z side). The connector 35 is connected to and electrically connected to the bonding material 356 of the connector 35 disposed on the lower layer side (−Z side).

  In the case of this embodiment, the height of the connector laminated body 350 having the above laminated structure substantially matches the depth of the groove 700, and the connector laminated body 350 is disposed in the groove 700 so that the connector laminated body The terminal electrode 352 provided on the uppermost surface of 350 and the wiring pattern 34 provided on the upper surface of the reservoir forming substrate 20 are arranged at substantially the same position in the XY plane. Under such a configuration, the drive circuit units 200A to 200D and the plurality of piezoelectric elements 300 corresponding to the respective drive circuit units are electrically connected via the connector laminate 350, so that each drive circuit unit 200A. The piezoelectric element 300 is driven by ~ 200D.

  In this embodiment, the connector laminated body 350 in which the five connectors 35 are laminated has been described. However, the number of the stacked connectors 35 is the height of the step provided for use of the connector laminated body 350 (in this embodiment, the groove portion). (Depth of 700) can be changed as appropriate. Since the thickness per connector 35 is about 70 μm, if the height of the step is about 200 μm, a connector laminate in which three connectors 35 are laminated may be used.

In the case of the present embodiment, as shown in FIG. 3, the upper electrode film 80 of the piezoelectric element 300 is drawn outside the piezoelectric element holding part 24 and exposed in the groove 700, and the connector laminate is exposed to the exposed part. 350 terminal electrodes 352 are electrically connected. Therefore, the upper electrode film 80 forms a circuit connection portion of the piezoelectric element 300.
An electrode wiring electrically connected to the upper electrode film 80 is formed on the flow path forming substrate 10, and this electrode wiring is drawn out of the piezoelectric element holding portion 24 and electrically connected to the connector laminate 350. You can also In this case, the electrode wiring electrically connected to the upper electrode film 80 constitutes a circuit connection portion of the piezoelectric element 300.

  Here, the conductive connection structure between the terminal electrode 352 and the piezoelectric element 300 (upper electrode film 80) may be a brazing material, an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). An anisotropic conductive material including paste), an insulating resin material including non-conductive film (NCF) and non-conductive paste (NCP: Non Conductive Paste) can be used.

  In addition, when the flip-chip mounting of the drive circuit portions 200A to 200D to the terminal electrode 352 on the upper surface of the connector laminate 350 and the wiring pattern 34 is performed, the anisotropic material containing the brazing material, the anisotropic conductive film, or the anisotropic conductive paste is used. A conductive connection structure using an insulating resin material including a conductive material, a non-conductive film, or a non-conductive paste can be employed. In the present embodiment, it is particularly preferable to use bumps made of Au or bumps made by coating a resin core with a metal film as the connection terminals 200a provided in the drive circuit units 200A to 200D. If the drive circuit units 200A to 200D use these bumps for the connection terminal 200a, the bumps are easily deformed when the connection terminal 200a is pressed against the terminal electrode 352 and the wiring pattern 34. Even if the position of the terminal electrode 352 in the Z-axis direction is deviated from the position flush with the wiring pattern 34 due to the height variation of the multilayer body 350, the deviation can be absorbed by the deformation of the bumps. The electrode 352 or the wiring pattern 34 can be joined.

  Furthermore, in order to improve the ease and certainty of such conductive connection, a positioning mechanism between the connector laminate 350 and the groove 700 (upper electrode film 80) can be provided. As such a positioning mechanism, for example, a mechanism in which a convex portion is provided on the connector laminate 350 and the convex portion is fitted to a concave portion provided on the side wall portion of the groove portion 700 can be employed.

As described above, in the droplet discharge head 1 of the present embodiment, the connector laminate 350 having a height substantially the same as the thickness of the reservoir forming substrate 20 is disposed in the groove 700 provided in the reservoir forming substrate 20. The connector laminate 350 is connected to a circuit connecting portion (upper electrode film 80) of the piezoelectric element 300 that is extended from the piezoelectric element holding portion 24 so as to be exposed in the groove portion 700. The drive circuit portions 200A to 200D are mounted on the terminal electrodes 352 provided on the upper surface of the connector laminate 350 having substantially the same height as the upper surface of the reservoir forming substrate 20.
Thereby, in the droplet discharge head 1 of the present embodiment, a space for drawing a wire, such as a structure for connecting the drive circuit unit and the piezoelectric element by wire bonding, is not required, and the droplet discharge head 1 can be thinned. It has become a thing. Further, since the groove portion 700 is filled with the connector laminate 350, the rigidity of the droplet discharge head 1 itself can be increased, and a decrease in discharge accuracy due to warpage or the like can be effectively prevented.

  In addition, even when the pitch of the piezoelectric elements 300 becomes narrower as the nozzle openings 15 become narrower and wire bonding is extremely difficult, the drive circuit units 200A to 200D and the piezoelectric elements 300 can be easily connected. An electrical connection can be made. That is, since the terminal electrode 352 of the connector 35 constituting the connector laminate 350 can be formed at an accurate position and with an accurate dimension as described in a later manufacturing method, the nozzle openings 15 are formed with a narrow pitch. Accordingly, it is possible to manufacture a device that can be accurately aligned with the piezoelectric elements 300 arranged at a narrow pitch. Therefore, according to the present embodiment, it is possible to obtain the droplet discharge head 1 capable of forming a high-definition image or a functional film pattern.

  Further, in the liquid droplet ejection head 1 of the present embodiment, the reservoir forming substrate 20 functions as a sealing member that seals the piezoelectric element 300 by blocking the piezoelectric element 300 from the external environment. By sealing the piezoelectric element 300 with the reservoir forming substrate 20, it is possible to prevent deterioration of characteristics of the piezoelectric element 300 due to an external environment such as moisture. Further, in this embodiment, the inside of the piezoelectric element holding part 24 is only sealed, but for example, the space inside the piezoelectric element holding part 24 is evacuated, or the piezoelectric element holding part 24 has a nitrogen or argon atmosphere or the like. Configurations that hold the inside of the element holding portion 24 at a low humidity can also be adopted, and the deterioration of the piezoelectric element 300 can be more effectively prevented by these configurations.

  In order to eject droplets of the functional liquid by the droplet discharge head 1 having the above-described configuration, an external controller (not shown) connected to the droplet discharge head 1 is connected to the functional liquid inlet 25 (not shown). The external functional liquid supply device is driven. The functional liquid delivered from the external functional liquid supply device fills the internal flow path of the droplet discharge head 1 from the functional liquid introduction port 25 to the reservoir 100 to the nozzle opening 15.

Further, the external controller transmits drive power and a command signal to the drive circuit unit 200 and the like mounted on the reservoir forming substrate 20. The drive circuit unit 200 that has received a command signal or the like transmits a drive signal based on a command from an external controller to each piezoelectric element 300 that is conductively connected via the wiring pattern 34, the pad 35, the conductive member 36, and the like.
Then, as a result of applying a voltage between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generating chamber 12, the elastic film 50, the lower electrode film 60, and the piezoelectric film 70 are displaced. Due to the displacement, the volume of each pressure generating chamber 12 changes to increase the internal pressure, and a droplet is ejected from the nozzle opening 15.

<Method for manufacturing droplet discharge head>
Next, a method of manufacturing the droplet discharge head 1 will be described with reference to the sectional process diagram of FIG.
Hereinafter, a manufacturing method of the connector laminate 350 used for electrical connection between the drive circuit unit 200 and the piezoelectric element 300 and a connection procedure using the connector laminate 350 will be mainly described. It is assumed that the manufacturing, connection, and arrangement of the nozzle substrate 16, the flow path forming substrate 10, the reservoir forming substrate 20, the piezoelectric element 300, and the like have already been completed.

[Production of connector laminate]
First, a manufacturing process of the connector laminate 350 will be described with reference to FIG. As shown in FIG. 5A, for example, a connector silicon substrate 351A having a thickness of about 500 μm is prepared, and an insulating layer 353 is formed on the entire surface by a method such as thermal oxidation. In the present embodiment, the insulating layer 353 is a silicon oxide film.

  Next, as shown in FIG. 5B, a hole 135 for forming a metal terminal is formed in the connector silicon substrate 351A. These holes 135 are formed with a predetermined opening diameter and depth using a known photolithography technique. The opening diameter is, for example, about 50 μm, and the depth is appropriately changed according to the length of the terminal electrode 352 to be formed. In the connector 35 shown in FIG. 3, the thickness of the thinned connector substrate 351 is reduced. The depth of the hole 135 is about 90 μm because the length of the terminal electrode 352 protruding from the connector substrate 351 is about 20 μm.

  Next, as shown in FIG. 5C, an insulating film 135a is formed to cover the inner surface of the hole 135 formed in the above process. The insulating film 135a is, for example, a silicon oxide film formed by a plasma CVD method using TEOS (tetraethoxysilane) as a source gas or a method of directly oxidizing the silicon substrate surface exposed on the inner surface of the hole 135 by a thermal oxidation method. In order to prevent current leakage from the terminal electrode 352 to the connector substrate 351, deterioration of the connector substrate 351 due to oxygen, moisture, or the like.

  Next, as shown in FIG. 5D, a base layer 354 is formed on the surface of the connector silicon substrate 351A in which the hole 135 has been formed by using a sputtering method, a vacuum deposition method, or the like. In the case of the present embodiment, the base layer 354 is a laminated film in which a barrier layer and a seed layer are laminated in order from the connector silicon substrate 351A side. The barrier layer is made of, for example, TiW, and the seed layer is made of Cu. . As shown in the drawing, the base layer 354 is continuously formed so as to cover the side wall and the bottom wall of the hole 135 from above the connector silicon substrate 351A. The thickness of the barrier layer is about 100 nm, and the thickness of the seed layer is about several hundred nm.

  Next, as shown in FIG. 5E, a plating resist is applied on the connector silicon substrate 351A, and this plating resist patterning is performed, whereby a plating resist pattern having openings 138a for forming the terminal electrodes 352 is formed. 138 is formed. In the present embodiment, the opening 138 a is formed larger than the opening diameter of the hole 135.

  Next, Cu electrolytic plating is performed, and as shown in FIG. 5 (f), Cu (copper) is buried in the hole 135 of the connector silicon substrate 351A and the opening 138a of the plating resist pattern 138, thereby forming a through electrode. A terminal 355 is formed. Next, by using the plating resist pattern 138 as a mask as it is, a bonding material 356 made of a brazing material such as lead-free solder is selectively formed on the metal terminal 355. The bonding material 356 is used to connect the layers when a plurality of manufactured connectors 35 are stacked. The bonding material 356 may be formed after the plating resist pattern 138 is peeled off. Through the above steps, the terminal electrode 352 composed of the metal terminal 355 and the bonding material 356 can be formed on the connector silicon substrate 351A.

  Next, the plating resist pattern 138 is peeled from the silicon substrate 351A, and then, as shown in FIG. 5G, the connector silicon substrate 351A is etched from the lower surface side to the thickness of about 50 to 70 μm. The connector layer 351 is made thin. By this thinning step, a part of the terminal electrode 352 is protruded from the lower surface of the connector substrate 351 in the drawing. At this time, the exposed surface 355 a is formed by exposing the surface of the metal terminal 355 at the tip of the terminal electrode 352. Through the above steps, the connector 35 constituting the connector laminate 350 shown in FIG. 4 can be manufactured.

  When the connector 35 is manufactured by the above-described procedure, as shown in FIG. 4B, a plurality of connectors 35 are stacked, and the terminal electrodes 352 of the connectors 35 arranged adjacent to each other are bonded to each other to form a connector stacked body. 350 is obtained. A bonding material 356 made of a brazing material or the like is formed on one end side of the terminal electrode 352 of the connector 35, and the other end side of the terminal electrode 352 is an exposed surface 355a from which a part of the metal terminal 355 is exposed. As shown in FIG. 4, if the bonding material 356 and the exposed surface 355a are brought into contact with each other and heated or the like, the stacked connectors 35 can be easily bonded and electrically connected. .

[Mounting the drive circuit]
If the connector laminated body 350 is produced by the above process, the drive circuit units 200A to 200D are then mounted using the connector laminated body 350.
First, as shown in FIG. 3, the connector laminate 350 produced in the above process is disposed in the groove 700 of the reservoir forming substrate 20, and is exposed on the lower surface side (the groove 700 bottom surface side) of the connector laminate 350. The terminal electrode 352 is electrically connected to the upper electrode film 80 of the piezoelectric element extending into the groove 700. The terminal electrode 352 and the upper electrode film 80 are electrically connected using a brazing material such as lead-free solder or an anisotropic conductive material such as ACP or ACF. Specifically, before the connector laminate 350 is disposed in the groove 700, a brazing material or anisotropic conductive material is formed on the upper electrode film 80 or the exposed surface 355 a of the terminal electrode 352 connected to the upper electrode film 80. After providing the material and positioning the connector laminate 350 in the groove 700, the upper electrode film 80 and the terminal electrode 352 are electrically connected by heating or pressurization.

The height of the connector laminate 350 disposed in the groove 700 is preferably equal to or greater than the thickness of the reservoir forming substrate 20. When the height of the connector laminate 350 is less than the thickness of the reservoir forming substrate 20, the terminal electrodes 352 that connect the drive circuit units 200 </ b> A to 200 </ b> D are disposed below the wiring pattern 34 (on the flow path forming substrate 10 side). Therefore, there is a possibility that the reliability of connection when mounting the drive circuit units 200A to 200D is lowered.
The height of the connector laminate 350 can be easily adjusted by changing the number of connectors 35 laminated. Alternatively, when the connector 35 is manufactured, the height (thickness) of the bonding material 356 of the terminal electrode 352 and the height of the metal terminal 355 may be adjusted.

  In the above description, among the terminal electrodes 352 of the connector laminate 350 shown in FIG. 4B, the tip portion where the exposed surface 355a is formed and the upper electrode film 80 in the groove 700 are electrically connected. Although the case where it does is demonstrated, you may arrange | position the direction of the connector laminated body 350 upside down. That is, you may arrange | position so that the illustration upper surface side of the connector laminated body 350 shown in FIG.4 (b) may contact | abut to the bottom face part of the groove part 700. FIG. In this case, since the bonding material 356 has already been formed at the tip of the terminal electrode 352 that is electrically connected to the upper electrode film 80, if the connector laminate 350 is placed in the groove 700 and heated, The terminal electrode 352 and the upper electrode film 80 can be electrically connected by the bonding material 356.

  Next, the drive circuit units 200 </ b> A to 200 </ b> D are flip-chip mounted on the wiring pattern 34 formed on the reservoir forming substrate 20 and the terminal electrode 352 exposed on the upper surface of the connector laminate 350. That is, as shown in FIG. 3, the connection terminals 200a formed on one side of the drive circuit units 200A to 200D are arranged toward the reservoir forming substrate 20 side, and aligned with the wiring pattern 34 terminal electrode 352, The wiring pattern 34 and the terminal electrode 352 are electrically connected by bonding directly or through another conductive material. There are various flip chip mounting forms such as Au-Au bonding, bonding with an anisotropic conductive material using ACP, ACF, etc., bonding with a nonconductive material using NCP, NCF, etc. Can be used.

  As described above, in the method of manufacturing the droplet discharge head according to the present embodiment, the circuit connection portion (upper electrode film 80) of the piezoelectric element 300 extending from the piezoelectric element holding portion 24 to the bottom surface portion of the groove portion 700 is used. The terminal electrode 352 exposed to the upper surface of the connector laminate 350 is drawn to a position substantially flush with the wiring pattern 34 formed on the upper surface of the reservoir forming substrate 20 by the connector laminate 350 disposed in the groove 350. The drive circuit units 200 </ b> A to 200 </ b> D are mounted on the wiring pattern 34. Therefore, according to the manufacturing method of the present embodiment, the drive circuit units 200A to 200D can be flip-chip mounted by being arranged substantially parallel to the reservoir forming substrate 20, thereby enabling easy and reliable mounting. In addition, the droplet discharge head can be thinned.

  Further, the manufacturing method of the present embodiment can easily cope with the manufacture of a high-definition droplet discharge head. In other words, even when the distance in the Y-axis direction between the piezoelectric elements 300 is reduced (narrow) by reducing the nozzle pitch, the terminal electrode 352 of the connector 35 can be accurately used by photolithography. Since it can be formed, it is easy to reduce the diameter and the pitch of the terminal electrodes 352 in accordance with the pitch of the piezoelectric elements 300.

  Note that the connector laminate 350 needs to be prepared separately from the flow path forming substrate 10 and the reservoir forming substrate 20 of the droplet discharge head 1, and for the production thereof, the formation of the terminal electrode 352 using photolithography technology or the like Although the wiring is formed, a large number of the connectors 35 constituting the connector laminate 350 can be manufactured at a time using a large silicon substrate, so that the manufacturing cost per unit significantly increases. Absent.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 6A is a cross-sectional configuration diagram of the droplet discharge head of the present embodiment, and corresponds to FIG. 3 in the previous embodiment. FIG. 6B is a perspective configuration diagram of the connector 360 shown in FIG.

  The droplet discharge head of this embodiment is characterized by the configuration of the connector 360 disposed in the groove 700, and the other configurations are the same as those of the droplet discharge head of the first embodiment. . Therefore, hereinafter, the configuration of the connector 360 will be mainly described. In FIG. 6, the same reference numerals as those in FIGS. 1 to 3 are assigned to components common to the droplet discharge head of the previous embodiment, and detailed description thereof is omitted.

  As shown in FIG. 6B, the connector 360 includes a rectangular columnar connector base material 36a, a plurality of terminal electrodes 36b arranged on the upper surface (+ Z side surface) of the connector base material 36a, and these terminals. A plurality of terminal electrodes 36c arranged on the surface (-Z side surface) opposite to the substrate surface on which the electrode 36b is formed, and formed on the side surfaces (+ X side surface, -X side surface) of the connector substrate 36a. A plurality of connection wirings 36d for connecting the terminal electrodes 36b to the corresponding terminal electrodes 36c are provided.

In the connector 360, the terminal electrodes 36b and 36c and the connection wiring 36d that connects them form one connector terminal, and these connector terminals extend into the groove 700 shown in FIG. 6A. The upper electrode films 80 are arranged on the connector base material 36 a at a pitch that matches the pitch of the upper electrode film 80.
Among the plurality of connector terminals arranged in the extending direction of the connector 360, a group of connector terminals arranged close to each other is a first connector terminal group 36A to a fourth connector terminal group shown in FIG. 36D is formed. The first connector terminal group 36A and the second connector terminal group 36B are disposed opposite to each other in the X-axis direction on the upper surface (and the lower surface) of the connector base 36a. The third connector terminal group 36C and the fourth connector The terminal group 36D is also arranged opposite to each other in the X-axis direction on the upper surface (and lower surface) of the connector base material 36a.

The connector base 36a is made of a material having at least an insulating surface. For example, the connector base 36a is oxidized by thermal oxidation on a molded body of an insulating material such as ceramics, glass epoxy, or glass, or a surface of a base made of silicon. Those having a silicon film or those having an insulating resin film formed on the surface of the silicon substrate can be used. When the connector base material 36a having an insulating film formed on the surface of the silicon substrate is used, the coefficient of thermal expansion can be matched with that of the flow path forming substrate 10 and the reservoir forming substrate 20 which are also made of silicon. An advantage is obtained that it is possible to effectively prevent peeling and the like at the conductive joint.
On the other hand, when a molded body such as glass epoxy or ceramics is used, excellent impact resistance and the like can be obtained as compared with the case where a silicon substrate is used.

  The terminal electrodes 36b and 36c and the connection wiring 36d constituting the connector terminal can be formed of a metal material, a conductive polymer, a superconductor, or the like. The connector terminal is preferably made of a metal material such as Au (gold), Ag (silver), Cu (copper), Al (aluminum), Pd (palladium), or Ni (nickel). In particular, the terminal electrodes 36b and 36c are preferably pads or bumps formed using Au. This is because when the connection terminals 200a of the drive circuit units 200A to 200D are Au bumps, reliable bonding can be easily obtained by Au-Au bonding.

As shown in FIG. 6A, the connector 360 having the above configuration is arranged with the terminal electrode 36c facing the bottom surface side of the groove 700, and extends into the groove 700 through the terminal electrode 36c. The piezoelectric element 300 is flip-chip mounted on the upper electrode film 80.
As the form of flip chip mounting, various mounting forms such as mounting using a brazing material, mounting using ACF, ACP, mounting using NCF, NCP, etc. can be adopted as in the connector laminate 350 of the previous embodiment. .

  The mounting state of the connector 360 will be described in more detail. The first connector terminal group 36A includes the first nozzle opening group 15A and the first pressure among the plurality of upper electrode films 80 arranged on the bottom surface of the groove 700. The piezoelectric element 300 constituting the first piezoelectric element group corresponding to the generation chamber group 12A is electrically connected to the upper electrode film 80 via the terminal electrode 36c. The second connector terminal group 36B is connected to the upper electrode film 80 of the piezoelectric element 300 constituting the second piezoelectric element group corresponding to the second nozzle opening group 15B and the second pressure generating chamber group 12B via the terminal electrode 36c. Are electrically connected.

  Although not shown in FIG. 6A, the third connector terminal group 36C is similar to the first connector terminal group 36A with respect to the upper electrode film 80 of the piezoelectric element 300 constituting the third piezoelectric element group. The fourth connector terminal group 36D is connected to the upper electrode film 80 of the piezoelectric element 300 constituting the fourth piezoelectric element group in the same manner as the second connector terminal group 36B. It is electrically connected to the terminal electrode 36c.

The droplet discharge head of the present embodiment having the above configuration electrically connects the piezoelectric element 300 (upper electrode film 80) on the bottom surface of the groove 700 and the drive circuit units 200A to 200D via the connector 360 having a simple configuration. Therefore, it can be manufactured at a lower cost than the droplet discharge head of the first embodiment. In addition, since the groove 700 is filled with the connector 360 that is a rigid body, the rigidity of the droplet discharge head can be increased and excellent reliability can be obtained.
In particular, if a connector base material 36a having an insulating film formed on the surface of a silicon substrate is used, the thermal expansion coefficient can be made uniform with the flow path forming substrate 10 and the reservoir forming substrate 20 that are also formed using the silicon substrate. It is possible to effectively prevent the reliability of the electrical connection from being impaired by the volume change caused by the temperature change.

<Connector manufacturing method>
In the case of using an insulating base material such as ceramics or glass epoxy, the connector 360 used in the liquid droplet ejection head of the present embodiment is connected to the surface of the connector base material 36a formed in a predetermined quadrangular prism shape. The terminals (terminal electrodes 36b and 36c, connection wiring 36d) can be formed by pattern formation. When a conductive substrate such as a silicon substrate is used, a connector substrate obtained by forming a silicon oxide film on the surface of a silicon substrate formed in a predetermined rectangular shape by thermal oxidation or the like, or silicon It can be produced by patterning the connector terminals on the surface of the connector base material obtained by forming an insulating resin film on the surface of the substrate.

  Examples of a method of patterning the connector terminals on the connector base material 36a include a method of patterning a conductive film formed using a vapor phase method using a photolithography technique, and opening a predetermined pattern on the connector base material 36a. A mask material provided with a portion is provided, and a method of selectively forming a conductive film (metal film) by a vapor phase method or a plating method through the mask material, or pattern formation of the conductive film using a droplet discharge method A method and a method of patterning a conductive film on the connector base material 36a using a printing method and the like can be used.

  Hereinafter, as an example of a method for manufacturing the connector 360, a method for forming connector terminals (terminal electrodes 36b and 36c, connection wiring 36d) using a droplet discharge method will be described. In the present embodiment, a case where a square pillar-shaped ceramic molded body is used as the connector base material 36a will be described, but the same applies to the case where a connector base material of another material is used.

For forming the connector terminal by the droplet discharge method, a droplet discharge device IJ as shown in FIG. 8 can be suitably used. That is, the ink is used to form a predetermined pattern on the connector substrate 36a by ejecting ink for forming the connector terminal from the droplet ejection head 101 provided in the droplet ejection apparatus IJ. Thereafter, the ink on the connector substrate 36a is dried and baked to form a metal thin film. The terminal electrodes 36b and 36c and the connection wiring 36d for connecting them can be formed on the connector base 36a by sequentially repeating the above steps on the peripheral surface (four sides) of the connector base 36a.
Note that the configuration of the droplet discharge device IJ is described in the paragraph (Droplet discharge device) in the subsequent stage.

[ink]
When the connector terminal is formed using the droplet discharge device IJ, the ink (functional liquid) discharged from the droplet discharge head is a liquid containing conductive fine particles (pattern forming component). As the liquid containing conductive fine particles, a dispersion liquid in which conductive fine particles are dispersed in a dispersion medium is used. As the conductive fine particles used here, in addition to metal fine particles containing Au, Ag, Cu, Pd, Ni or the like, conductive polymer or superconductor fine particles can also be used.

  The conductive fine particles can be used by coating the surface with an organic substance or the like in order to improve the dispersibility in the ink. Examples of the coating material that coats the surface of the conductive fine particles include organic solvents such as xylene and toluene, citric acid, and the like. The particle diameter of the conductive fine particles is preferably 5 nm or more and 0.1 μm or less. If it is larger than 0.1 μm, nozzle clogging is likely to occur and ejection by the droplet ejection method becomes difficult. On the other hand, if the thickness is smaller than 5 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of the organic matter in the obtained film becomes excessive.

As the dispersion medium of the ink containing conductive fine particles, those having a vapor pressure at room temperature of 0.001 mmHg or more and 200 mmHg or less (about 0.133 Pa or more and 26600 Pa or less) are preferable. This is because when the vapor pressure is higher than 200 mmHg, the dispersion medium rapidly evaporates after discharge, making it difficult to form a good film.
The vapor pressure of the dispersion medium is more preferably 0.001 mmHg or more and 50 mmHg or less (about 0.133 Pa or more and 6650 Pa or less). This is because when the vapor pressure is higher than 50 mmHg, nozzle clogging due to drying tends to occur when droplets are ejected by the droplet ejection method, and stable ejection becomes difficult. On the other hand, in the case of a dispersion medium whose vapor pressure at room temperature is lower than 0.001 mmHg, drying is slow and the dispersion medium tends to remain in the film, and a high-quality conductive film can be obtained after heat and / or light treatment in the subsequent process. Hateful.

  The dispersion medium to be used is not particularly limited as long as it can disperse the above-mentioned conductive fine particles and does not cause aggregation. In addition to water, alcohols such as methanol, ethanol, propanol and butanol, n- Hydrocarbon compounds such as heptane, n-octane, decane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene, or ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl Ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether Le, p- ether compounds such as dioxane, propylene carbonate, .gamma.-butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, may be mentioned polar compounds such as cyclohexanone.

  Among the above-mentioned dispersion media, water, alcohols, hydrocarbon compounds, and ether compounds are used in view of dispersibility of fine particles, stability of the dispersion, and ease of application to the droplet discharge method. More preferable examples of the dispersion medium include water and hydrocarbon compounds. These dispersion media can be used alone or as a mixture of two or more. When the conductive fine particles are dispersed in the dispersion medium, the dispersoid concentration is 1% by mass or more and 80% by mass or less, and can be adjusted according to the desired film thickness of the conductive film. If it exceeds 80% by mass, aggregation tends to occur and it is difficult to obtain a uniform film.

  The surface tension of the ink containing the conductive fine particles is preferably in the range of 0.02 N / m or more and 0.07 N / m or less. When ink is ejected by the droplet ejection method, if the surface tension is less than 0.02 N / m, the wettability of the ink with respect to the nozzle surface increases so that flight bending easily occurs, and if the surface tension exceeds 0.07 N / m. This is because the shape of the meniscus at the nozzle tip is not stable, and it becomes difficult to control the discharge amount and the discharge timing.

  In order to adjust the surface tension, a trace amount of a surface tension adjusting agent such as a fluorine-based material, a silicon-based material, or a nonionic material can be added to the dispersion liquid in a range that does not unduly reduce the contact angle with the substrate. The nonionic surface tension modifier improves the wettability of the liquid to the substrate, improves the leveling property of the film, and helps to prevent the occurrence of crushing of the coating film and the generation of the itchy skin. The dispersion liquid may contain an organic compound such as alcohol, ether, ester, or ketone as necessary.

The viscosity of the dispersion is preferably 1 mPa · s or more and 50 mPa · s or less.
When discharging by the droplet discharge method, if the viscosity is less than 1 mPa · s, the peripheral portion of the nozzle is easily contaminated by the outflow of ink, and if the viscosity is more than 50 mPa · s, the nozzle is clogged. This is because the frequency increases and it becomes difficult to smoothly discharge droplets.

  When the connector terminal shown in FIG. 6B is formed of a gold thin film, for example, a gold fine particle dispersion (trade name “Perfect Gold” manufactured by Vacuum Metallurgical Co., Ltd.) in which gold fine particles having a diameter of about 10 nm are dispersed in toluene is used. The ink is diluted with toluene, adjusted to have a viscosity of about 5 [mPa · s] and a surface tension of about 20 mN / m, and this liquid is used as ink for forming the terminal electrodes 36b and 36c and the connection wiring 36d. Use.

[Connector terminal formation procedure]
When the ink described above is prepared, a step of ejecting ink droplets from the droplet ejection head 101 shown in FIG. 8 and placing them on the connector base material 36a is performed.
Here, prior to the droplet discharge step, a surface treatment may be performed on the connector base material 36a. That is, ink repellent treatment (liquid repellent treatment) may be performed on the ink application surface of the connector base material 36a prior to ink application. By performing such an ink repellent treatment, the position of ink ejected (applied) on the connector base material 36a can be controlled with higher accuracy.

  In order to perform ink repellent treatment on the surface of the connector base material 36a, first, the prepared connector base material 36a is washed with IPA (isopropyl alcohol) or the like. Thereafter, further cleaning (ultraviolet irradiation cleaning) may be performed by irradiating ultraviolet rays having a wavelength of 254 nm with an intensity of about 10 mW / cm 2. When the cleaning process is completed, the connector base material 36a is sealed with 0.1 g of hexadecafluoro-1,1,2,2tetrahydrodecyltriethoxysilane, for example, in order to perform an ink repellent process on the surface of the connector base material 36a. And kept in a heated state (about 120 ° C.). Thereby, an ink-repellent monomolecular film can be formed on the surface of the connector base material 36a. The surface of the connector base material 36a on which the monomolecular film is formed has a contact angle with the ink of, for example, about 60 °.

When the ink repellency of the connector base material 36a is too high, the connector base material 36a on which the monomolecular film is formed may be further irradiated with ultraviolet rays (wavelength 254 nm) for 2 minutes, for example.
By this treatment, the ink repellency on the surface of the connector base material 36a can be lowered.
Moreover, you may form a receiving layer on the connector base material 36a instead of the ink repellent process mentioned above. That is, for example, a porous layer having porous silica particles, alumina, alumina hydrate, and the like and a binder, or a polymer that swells and absorbs ink with a hydrophilic polymer may be formed as the receiving layer.

If the ink repellent treatment is applied to the surface of the connector base material 36a as necessary, the ink droplets are discharged from the liquid droplet discharge head 101 and dropped onto a predetermined position on the connector base material 36a. In this step, a plurality of ink patterns (for example, ink patterns to be terminal electrodes 36b) are formed on one side surface of the connector substrate 36a by discharging droplets while scanning the droplet discharge head 101 on the connector substrate 36a. Form.
At this time, when pattern formation is performed by continuously ejecting droplets, it is preferable to control the degree of overlap between the droplets so as not to cause a bulge. In this case, if a discharge arrangement method is adopted in which a plurality of droplets are discharged and arranged so as not to contact each other in the first discharge, and the gap is filled by the second and subsequent discharges, a good bulge is obtained. Can be prevented.

  If a predetermined ink pattern is formed on the connector base material 36a by ejecting the liquid droplets, then a drying process is performed as necessary to remove the dispersion medium from the ink. The drying process can be performed by lamp annealing, for example, in addition to a process using a normal hot plate or an electric furnace for heating the substrate. The light source used for lamp annealing is not particularly limited, but excimer laser such as infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used as a light source. These light sources generally have a power output in the range of 10 W or more and 5000 W or less, but in this embodiment, a range of 100 W or more and 1000 W or less is sufficient.

Next, the dried film obtained by drying the ink pattern is subjected to a baking treatment for improving the electrical contact between the fine particles. By this firing treatment, the dispersion medium is completely removed from the dried film, and when the surface of the conductive fine particles is provided with an organic coating for improving dispersibility, this coating is also removed.
The baking treatment is performed by heat treatment, light treatment, or a combination of these.
The firing treatment is usually performed in the air, but can also be performed in an inert gas atmosphere such as nitrogen, argon, helium, etc., if necessary. The treatment temperature of the firing treatment includes the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as dispersibility and oxidation of fine particles, the presence and amount of coating material, the heat resistance temperature of the substrate, etc. It is determined as appropriate in consideration. For example, in order to remove the coating material made of organic matter, it is necessary to bake at about 300 ° C. Moreover, when using a board | substrate, such as a plastic, it is preferable to carry out at room temperature or more and 100 degrees C or less.

  The firing process can be performed by lamp annealing in addition to a process using a normal hot plate, electric furnace, or the like. The light source used for lamp annealing is not particularly limited, but excimer laser such as infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used as a light source. These light sources generally have a power output in the range of 10 W or more and 5000 W or less, but in this embodiment, a range of 100 W or more and 1000 W or less is sufficient. Through the above steps, electrical contact between the fine particles in the film is ensured and converted into a conductive film.

Then, the connector 360 in which a plurality of connector terminals are formed on the connector base material 36a is manufactured by performing the above-described droplet discharge process, drying process, and firing process for each side surface of the connector base material 36a. be able to.
In addition, by performing a droplet discharge process and a drying process on each side surface of the connector base material 36a, a dry film having a predetermined pattern is formed on each side surface of the connector base material 36a, and finally a baking process is performed collectively. Thus, the conversion from the dry film to the conductive film may be performed. Since the dry film has many gaps between the conductive fine particles constituting the dry film, the ink can be held well when the ink is disposed thereon. Therefore, the connectivity of the dry film formed on each side surface can be improved by performing the droplet discharge process on the other side surface with the dry film formed on the side surface of the connector base 36a. That is, the connectivity at the connection portion between the terminal electrode 36b and the connection wiring 36d and the connection portion between the terminal electrode 36c and the connection wiring 36d can be improved, and a connector terminal with higher reliability can be formed. .

<Third Embodiment>
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 7A is a cross-sectional configuration diagram of the droplet discharge head of the present embodiment, which corresponds to FIG. 3 in the previous embodiment. FIG. 7B is a plan configuration diagram of the flexible substrate 501 shown in FIG.

  FIG. 6B shows the drive circuit units 200A to 200D through the first flexible substrate 501, the second flexible substrate 502, and the third and fourth flexible substrates (not shown). The configuration mounted on the connector 360 is characteristic. Therefore, in the droplet discharge head of the present embodiment, the configuration other than the mounting structure of the drive circuit units 200A to 200D is the same as that of the droplet discharge head of the second embodiment shown in FIG. Constituent elements common to those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the droplet discharge head of the present embodiment shown in FIG. 7A, a connector 360 is disposed in a groove 700 provided through the reservoir forming substrate 20, and an upper surface (+ Z side surface) of the connector 360 is illustrated. The terminal electrode 36b has a configuration in which a first flexible substrate 501 and a second flexible substrate 502 are mounted. Drive circuit portions 200A and 200B are flip-chip mounted on the lower surfaces (-Z side surfaces) of the flexible substrates 501 and 502 shown in the drawing, respectively, and resin is provided between the drive circuit portions 200A and 200B and the flexible substrates 501 and 502, respectively. The mold 202 is sealed. For the flip-chip mounting of the drive circuit units 200A to 200D, various mounting forms such as mounting with a brazing material, mounting using ACF and ACP, mounting using NCF and NCP, etc. can be adopted as in the previous embodiment. .

  FIG. 7B is a plan view of the first flexible substrate 501 viewed from the lower surface side (−Z side) of FIG. The driving circuit unit 200A is mounted on the first flexible substrate 501 that is substantially convex in plan view, and a plurality of wiring patterns 510 extend in the −X direction from the mounting position of the driving circuit unit 200A. The wiring pattern 510 is electrically connected to a connection terminal group 507 including a plurality of connection terminals arranged at the −X side end of the flexible substrate 501. Also, a plurality of wiring patterns 511 extend in the + X direction from the mounting position of the drive circuit unit 200A, and each wiring pattern 511 is a connection composed of a plurality of connection terminals arrayed and formed at the end of the flexible substrate 501 on the + X side. The terminal group 508 is electrically connected. The first flexible substrate 501 is electrically connected to the terminal electrode 36b (first connector terminal group 36A) of the connector 360 by the connection terminal group 507 at the −X side end, and the connection terminal group 508 at the + X side end. Thus, an external circuit (not shown) is connected.

Although not shown, the second flexible substrate 502 on which the drive circuit unit 200B is mounted also has the same configuration as the first flexible substrate 501. Further, the third flexible substrate and the fourth flexible substrate on which the drive circuit units 200C and 200D are mounted, respectively, have the same configuration as the first flexible substrate 501.
Then, the first flexible substrate 501 shown in FIG. 7B and the second to fourth flexible substrates having the same configuration are provided in the groove 700 formed in the central portion of the reservoir forming substrate 20 in the figure. The droplet discharge head of the present embodiment is configured by being electrically connected to the terminal electrode 36b on the upper surface of the connector 360 disposed. The electrical connection between the first to fourth flexible substrates and the terminal electrode 36b can be performed by bonding using various bonding materials such as brazing material, ACF, ACP, NCF, and NCP.
In the liquid droplet ejection head of this embodiment, it is preferable that the thickness (height) of the connector 360 disposed in the groove portion 700 is larger than the thickness of the reservoir forming substrate 20. This is because each flexible substrate can be easily connected.

According to the droplet discharge head of the present embodiment having the above-described configuration, the drive circuit units 200A to 200D are mounted on the circuit connection unit of the piezoelectric element 300 drawn to the upper surface side of the reservoir forming substrate 20 by the connector 360. Since the first to fourth flexible substrates are electrically connected, when the droplet discharge head is mounted on a droplet discharge device such as a printer unit, the connection terminal portion is handled flexibly. Can be good.
In addition, since the degree of freedom of the mounting form of the drive circuit units 200A to 200D is increased, it is easy to change the wiring routing mode accompanying the change of the drive circuit unit.

  In the present embodiment, the configuration in which separate flexible boards are connected to the connector terminal groups 36A to 36 of the connector 360 has been illustrated and described. However, the four drive circuit units 200A to 200D are combined into one flexible circuit. A configuration in which the flexible board is mounted on a board and the flexible board is electrically connected to the connector 360 may be employed. Further, a flexible substrate obtained by integrating the first flexible substrate and the third flexible substrate disposed on the same side in the X-axis direction with respect to the groove portion 700 is connected to the connector terminal on the + X side of the connector 360, and the second flexible substrate It is also possible to adopt a configuration in which a flexible board in which the first flexible board and the fourth flexible board are integrated is connected to a connector terminal on the -X side.

  Moreover, the structure which sealed further between the drive circuit parts 200A-200D mounted in the lower surface side of the 1st-4th flexible substrate and the reservoir | reserver formation board | substrate 20 with the resin mold etc. is also employable. If the drive circuit units 200A to 200D are sealed and fixed to the reservoir forming substrate 20 in this way, the entire droplet discharge head including the drive circuit units 200A to 200D can be integrally formed, and the droplets have excellent handling properties. A discharge head can be obtained. Further, since the drive circuit units 200A to 200D are sealed between the flexible substrate and the reservoir forming substrate, the drive circuit units 200A to 200D can be well protected, and the reliability of the droplet discharge head is improved. Can do.

(Droplet discharge device)
Next, an example of a droplet discharge device including the droplet discharge head of the previous embodiment will be described with reference to FIG. FIG. 8 is a perspective view illustrating a schematic configuration of a droplet discharge device IJ including the droplet discharge head of each of the embodiments.
The droplet discharge device IJ includes a droplet discharge head 101 according to the present invention, an X-axis direction drive shaft 4, a Y-axis direction guide shaft 5, a control device CONT, a stage 7, a cleaning mechanism 8, and a base. 9 and a heater 15. The stage 7 supports the substrate P on which ink (liquid material) is provided by the droplet discharge device IJ, and includes a fixing mechanism (not shown) that fixes the substrate P at a reference position.

  As described above, the droplet discharge head 101 is a multi-nozzle type droplet discharge head provided with a plurality of discharge nozzles, and the longitudinal direction and the Y-axis direction coincide with each other. The plurality of discharge nozzles are provided on the lower surface of the droplet discharge head 101 at regular intervals along the Y-axis direction. From the nozzles of the droplet discharge head 101, ink (for example, ink containing conductive fine particles) corresponding to the type of functional film to be formed is discharged onto the substrate P supported by the stage 7.

An X-axis direction drive motor 2 is connected to the X-axis direction drive shaft 4. The X-axis direction drive motor 2 is a stepping motor or the like, and rotates the X-axis direction drive shaft 4 when an X-axis direction drive signal is supplied from the control device CONT. When the X-axis direction drive shaft 304 rotates, the droplet discharge head 101 moves in the X-axis direction.
The Y-axis direction guide shaft 5 is fixed so as not to move with respect to the base 9. The stage 7 includes a Y-axis direction drive motor 3. The Y-axis direction drive motor 3 is a stepping motor or the like, and moves the stage 7 in the Y-axis direction when a drive signal in the Y-axis direction is supplied from the control device CONT.

The control device CONT supplies a droplet discharge control voltage to the droplet discharge head 101. In addition, a drive pulse signal for controlling the movement of the droplet discharge head 101 in the X-axis direction is supplied to the X-axis direction drive motor 2, and a drive pulse signal for controlling the movement of the stage 7 in the Y-axis direction is supplied to the Y-axis direction drive motor 3. Supply.
The cleaning mechanism 8 cleans the droplet discharge head 101. The cleaning mechanism 8 is provided with a Y-axis direction drive motor (not shown). By driving the drive motor in the Y-axis direction, the cleaning mechanism moves along the Y-axis direction guide shaft 5.
The movement of the cleaning mechanism 8 is also controlled by the control device CONT.
Here, the heater 15 is a means for heat-treating the substrate P by lamp annealing, and performs evaporation and drying of the solvent contained in the liquid material applied on the substrate P. The heater 15 is also turned on and off by the control device CONT.

The droplet discharge device IJ discharges droplets onto the substrate P while relatively scanning the droplet discharge head 101 and the stage 7 that supports the substrate P. Here, in the following description, the X-axis direction is a scanning direction, and the Y-axis direction orthogonal to the X-axis direction is a non-scanning direction. Therefore, the discharge nozzles of the droplet discharge head 101 are provided side by side at regular intervals in the Y-axis direction, which is the non-scanning direction.
In FIG. 8, the droplet discharge head 101 is disposed at a right angle to the traveling direction of the substrate P. However, the angle of the droplet discharging head 101 is adjusted to intersect the traveling direction of the substrate P. Alternatively, the nozzles may be arranged in a row. In this way, the pitch between the nozzles can be adjusted by adjusting the angle of the droplet discharge head 101. Further, the distance between the substrate P and the nozzle surface may be arbitrarily adjusted.

  The droplet discharge apparatus IJ having the above configuration can be suitably used as a device forming apparatus for forming various devices by a liquid phase method. In this embodiment, as ink (functional liquid) discharged from the droplet discharge head, a liquid crystal display device forming material for forming a liquid crystal display device, an organic EL forming material for forming an organic EL display device, A material including a wiring pattern forming material for forming a wiring pattern of an electronic circuit is used. According to the manufacturing process in which these functional liquids are selectively arranged on a substrate by a droplet discharge device, the pattern arrangement of the functional material is possible without going through a photolithography process, so a liquid crystal display device, an organic EL device, a circuit board Etc. can be manufactured at low cost.

  The droplet discharge device according to the present invention can also be configured as a printer (inkjet printer) having a droplet discharge head as an image forming unit, and is configured as a printer unit realized by incorporating the droplet discharge head. You can also Such a printer unit is attached to, for example, a display device such as a television or an input device such as a whiteboard, and can be used to print an image displayed or input by the display device or the input device.

(Semiconductor device)
In the above-described embodiment, the liquid droplet ejection head having the device mounting structure according to the present invention and the manufacturing method thereof have been described. However, the technical scope of the present invention is not limited to the above-described embodiment. In particular, it can be applied to a mounting structure of a semiconductor device having a structure in which a plurality of IC chips are stacked.

  FIG. 9 is a cross-sectional configuration diagram illustrating an example of a semiconductor device using SIP (System In Package) technology. A semiconductor device 1000 illustrated in FIG. 9 includes a base substrate (base) 1010, a plurality of IC chips (devices) 1020, 1030, and 1040 stacked on the base substrate 1010, and conduction between these IC chips and the base substrate 1010. A plurality of connectors 1060, 1070, and 1080 constituting the connection structure are provided.

  The base substrate 1010 is mainly composed of, for example, a silicon substrate, and a plurality of (eight in the drawing) through-electrodes (conductive connection portions) 1011 penetrating the base substrate 1010 in the thickness direction are provided. Each through electrode 1011 exposed on the lower surface side of the base substrate 1010 is provided with a substantially spherical bump 1012 serving as a connection terminal when the semiconductor device 1000 is mounted on an electronic device or the like.

An IC chip 1020, a connector 1060, and a connector 1070 are mounted in this order from the left side of the through electrode 1011 exposed on the upper surface side of the base substrate 1010 in the figure.
The IC chip 1020 is a double-sided mounting type IC chip having connection terminals on the upper surface side in the figure. The connectors 1060, 1070, and 1080 have a silicon substrate or the like as a base material and have through electrodes (terminal electrodes) 1061, 1071, and 1081 that penetrate the base material. These connectors 1060, 1070, and 1080 can have the same configuration as the connector 35 according to the first embodiment, and can be manufactured using the same method as the connector 35.

  An IC chip 1030 having a width larger than that of the IC chip 1020 is mounted on a pad 1021 provided on the upper surface of the IC chip 1020. The IC chip 1030 is mounted on the through electrode 1071 of the connector 1070 in a region outside the IC chip 1020. In addition, in the same layer as the IC chip 1030, a connector 1080 is stacked on the connector 1070, and the through electrodes 1071 and the through electrodes 1081 of the connectors 1070 and 1080 are electrically connected. An IC chip 1040 having a width larger than that of the IC chip 1030 is mounted on the plurality of pads 1031 provided on the upper surface of the IC chip 1030 and the through electrode 1081 of the connector 1080.

  That is, in the semiconductor device 1000 of the present embodiment, the step formed between the base substrate 1010 and the IC chip 1030 by stacking the larger IC chip 1030 on the IC chip 1020 is a high level corresponding to the step. The connector 1060 has a thickness and the IC chip 1030 and the through electrode 1011 of the base substrate 1010 are electrically connected. Further, the step formed between the base substrate 1010 and the IC chip 1040 by stacking the IC chip 1040 larger than the IC chip 1040 on the IC chip 1030 corresponds to the step by stacking the connector 1070 and the connector 1080. This is eliminated by the height of the connector laminate, and the connection terminal of the IC chip 1040 and the through electrode 1011 of the base substrate 1010 are electrically connected.

  As described above, in the semiconductor device 1000 according to the present embodiment, the small IC chip is arranged on the base substrate 1010 side, and the large IC chip is stacked and mounted on the base substrate 1010 side. , 1040 signal lines can be directly drawn out to the connection terminals of the base substrate 1010 by the connector 1060 and the connectors 1070, 1080. This eliminates the need to provide an electrode for relaying the signal line of the upper IC chip on the IC chip arranged on the lower layer side, so that a general-purpose IC chip can be mounted on the base substrate 1010. A highly functional semiconductor device can be obtained at low cost.

  The configuration shown in FIG. 9 shows one configuration example of the semiconductor device according to the present invention, and the technical scope of the present invention is not limited to such an embodiment.

<Fourth Embodiment>
<Droplet ejection head>
Subsequently, as a fourth embodiment of the present invention, a droplet discharge head having a device mounting structure according to the present invention will be described with reference to FIGS. FIG. 10 is a perspective configuration diagram showing an embodiment of a droplet discharge head, and FIG. 11 is a sectional configuration diagram taken along line AA in FIG.
In these drawings, the same components as those in the first to third embodiments shown in FIGS. 1 to 9 are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  The droplet discharge head 1 according to the present embodiment discharges ink (functional liquid) from a nozzle in the form of droplets. As shown in FIGS. 10 to 11, the droplet discharge head 1 is connected to a nozzle substrate 16 having a nozzle opening 15 through which droplets are discharged, and an upper surface (+ Z side) of the nozzle substrate 16 to connect an ink flow path. A diaphragm 400 that is connected to the upper surface of the channel forming substrate 10 and is displaced by driving of the piezoelectric element (driving element) 300, and a reservoir 100 that is connected to the upper surface of the diaphragm 400. A reservoir forming substrate (protective substrate) 20 to be formed, four driving circuit units (driver ICs, devices) 200A to 200D for driving the piezoelectric element 300 provided on the reservoir forming substrate 20, and a driving circuit unit A plurality of wiring patterns (second conductive connection portions) 34 connected to 200A to 200D are provided. The flow path forming substrate 10 and the reservoir forming substrate 20 constitute a base according to the present invention.

As shown in FIG. 11, the piezoelectric element 300 for deforming the vibration plate 400 is formed on the upper surface (+ Z side surface; first surface) 10a of the flow path forming substrate 10 in order from the lower electrode film 60 side. A structure in which the piezoelectric film 70 and the upper electrode film (first conductive connection portion) 80 are stacked is provided. The thickness of the piezoelectric film 70 is, for example, about 1 μm, and the thickness of the upper electrode film 80 is, for example, about 0.1 μm.
The concept of the piezoelectric element 300 may include the lower electrode film 60 in addition to the piezoelectric film 70 and the upper electrode film 80. This is because the lower electrode film 60 functions as the piezoelectric element 300 and also functions as the diaphragm 400. In the present embodiment, a configuration in which the elastic film 50 and the lower electrode film 60 function as the diaphragm 400 is employed, but the elastic film 50 is omitted and the lower electrode film 60 also serves as the elastic film (50). You can also

  As shown in FIG. 10, four drive circuit units 200 </ b> A to 200 </ b> D are disposed on the reservoir forming substrate 20. The drive circuit units 200A to 200D are configured to include, for example, a circuit board or a semiconductor integrated circuit (IC) including a drive circuit. Each of the drive circuit units 200A to 200D includes a plurality of connection terminals 200a on the lower surface side in the drawing, and the connection terminals 200a are connected to the wiring pattern 34 formed on the upper surface (second surface) 20a of the reservoir forming substrate 20. It is connected.

  As shown in FIGS. 10 and 11, in the reservoir forming substrate 20, a central portion with respect to the X-axis direction has a tapered shape whose diameter decreases as the cross section goes downward, and a groove portion (through hole) extending in the Y-axis direction. ) 700 is formed. That is, in the liquid droplet ejection head of this embodiment, the groove portion 700 includes the upper electrode film 80 (circuit connection portion) of the piezoelectric element 300 and the connection terminals 200a (200a to 200D) of the drive circuit portions 200A to 200D to be connected thereto. A step is formed separating the wiring pattern 34).

  In the groove 700, a connector 360 is disposed so as to be aligned with the upper electrode film 80 of each piezoelectric element 300 exposed on the bottom surface thereof. In the droplet discharge head 1 of the present embodiment, the connector 360 allows the bottom surface of the groove 700 (the upper surface 10a of the flow path forming substrate 10) and the upper surface 20a of the reservoir forming substrate 20 on which the drive circuit units 200A to 200D are disposed. The drive circuit portions 200A to 200D are mounted on the reservoir forming substrate 20 in a planar manner.

  As shown in FIG. 12, the connector 360 has a rectangular columnar flat plate portion 41 and an inclined surface 42a whose diameter is reduced on the upper side, along the length direction (Y-axis direction) at the center in the width direction of the flat plate portion 41. A connector base material 36a comprising projecting protrusions 42, a plurality of terminal electrodes (first terminal electrodes) 36b arranged on the upper surface (+ Z side surface) of the protrusion 42, and an upper surface of the flat plate portion 41. A plurality of terminal electrodes (second terminal electrodes) 36c arranged on the (+ Z side surface) and the inclined surface 42a (+ X side surface, -X side surface) of the protrusion 42 correspond to the terminal electrodes 36b. A plurality of connection wirings 36d for electrically connecting the terminal electrodes 36c and bumps 36e and 36f projecting from the terminal electrodes 36b and 36c are provided.

  As shown in FIG. 11, the protrusion 42 is formed with a width that does not contact the groove 700 of the reservoir forming substrate 20. The height of the protrusion 42 (the length in the Z direction) is a step between the wiring pattern 34 and the upper electrode film 80 (that is, a step between the upper surface 10a of the flow path forming substrate 10 and the upper surface 20a of the reservoir forming substrate 20). ) And substantially the same height.

In the connector 360, the terminal electrodes 36b and 36c, the connection wiring 36d for connecting the two, and the bumps 36e and 36f form one connector terminal, and these connector terminals are provided in the groove 700 shown in FIG. Are arranged on the connector base material 36a at a pitch that matches the pitch of the upper electrode film 80 extending in the direction of the upper electrode film 80.
Among the plurality of connector terminals arranged in the extending direction of the connector 360, a group of connector terminals arranged close to each other forms a first connector terminal group 36A to a fourth connector terminal group 36D shown in FIG. is doing. The first connector terminal group 36A and the second connector terminal group 36B are arranged opposite to each other in the X-axis direction on the upper surface of the connector base 36a, and the third connector terminal group 36C and the fourth connector terminal group 36D are also arranged. The upper surface of the connector base 36a is disposed to face each other in the X-axis direction.

  The connector 360 is formed with an alignment mark AM located on the upper surface of the flat plate portion 41. The alignment mark AM serves as a reference when the positions of the first connector terminal group 36A to the fourth connector terminal group 36D are detected. The alignment mark AM is on the same plane as the terminal electrode 36c and the bump 36f, and is on the −Y side on the + X side. The relative positions of the first connector terminal group 36 </ b> A to the fourth connector terminal group 36 </ b> D are accurate at the position near the end and the position near the + Y end on the −X side surface (this alignment mark is not shown). It is formed by positioning. These alignment marks AM are formed of the same material and in the same process as the terminal electrodes 36c and the bumps 36f, so that the relative positional accuracy with respect to the first connector terminal group 36A to the fourth connector terminal group 36D can be easily maintained. Can do.

The connector base 36a is made of a material having at least an insulating surface. For example, a molded body of an insulating material such as ceramics, glass epoxy, or glass, or a surface of a base made of silicon (Si) is heated. A film in which a silicon oxide film is formed by oxidation or a film in which an insulating resin film is formed on the surface of the silicon substrate can be used. When the connector base material 36a in which an insulating film is formed on the surface of the silicon base is used, the linear expansion coefficient is substantially the same as that of the flow path forming substrate 10 and the reservoir forming substrate 20 which are also made of silicon, and the thermal expansion coefficient can be matched. Therefore, there is an advantage that it is possible to effectively prevent peeling or the like in the conductive joint due to a volume change due to a temperature change.
On the other hand, when a molded body such as glass epoxy or ceramic is used as the connector base material 36a, excellent impact resistance and the like can be obtained as compared with the case where a silicon substrate is used.

  The terminal electrodes 36b and 36c and the connection wiring 36d constituting the connector terminal can be formed of a metal material, a conductive polymer, a superconductor, or the like. The connector terminal is preferably made of a metal material such as Au (gold), Ag (silver), Cu (copper), Al (aluminum), Pd (palladium), or Ni (nickel). In particular, the bumps 36e and 36f in the terminal electrodes 36b and 36c are preferably formed of Au. This is because when the connection terminals 200a of the drive circuit units 200A to 200D are Au bumps, reliable bonding can be easily obtained by Au-Au bonding.

  As shown in FIG. 11, the connector 360 having the above-described configuration is arranged with the terminal electrodes 36 b and the bumps 36 e facing the bottom surface side (upper electrode film 80 side) of the groove portion 700 in the protruding portion 42. Flip-chip mounting is performed on the upper electrode film 80 of the piezoelectric element 300 extending into 700 via bumps 36e. In addition, the connector 360 is disposed in the flat plate portion 41 with the terminal electrodes 36c and the bumps 36f facing the wiring pattern 34 (the upper surface 20a of the reservoir forming substrate 20), and is flip-chip connected to the wiring pattern 34 via the bumps 36f. Has been implemented.

  The mounting state of the connector 360 will be described in more detail. The first connector terminal group 36A includes the first nozzle opening group 15A and the first pressure among the plurality of upper electrode films 80 arranged on the bottom surface of the groove 700. The piezoelectric element 300 constituting the first piezoelectric element group corresponding to the generation chamber group 12A is electrically connected to the upper electrode film 80 via the terminal electrode 36b and the bump 36e. The second connector terminal group 36B has a terminal electrode 36b and a bump against the upper electrode film 80 of the piezoelectric element 300 constituting the second piezoelectric element group corresponding to the second nozzle opening group 15B and the second pressure generating chamber group 12B. 36e is electrically connected.

  Although not shown in FIG. 11, the third connector terminal group 36C has terminal electrodes with respect to the upper electrode film 80 of the piezoelectric element 300 constituting the third piezoelectric element group, like the first connector terminal group 36A. The fourth connector terminal group 36D is electrically connected to the upper electrode film 80 of the piezoelectric element 300 constituting the fourth piezoelectric element group in the same manner as the second connector terminal group 36B. It is electrically connected to the terminal electrode 36b and the bump 36e.

  In the present embodiment, in particular, bumps 36e and 36f made of Au are provided on the terminal electrodes 36b and 36c of the connector 360. Therefore, when the connector 360 is pressed against the wiring pattern 34 and the upper electrode film 80, the bump 36e, Since 36f easily deforms, for example, even if the position of the terminal electrodes 36b and 36c in the Z-axis direction is shifted due to the height variation of the connector 360 (the flat plate portion 41 and the protrusion 42), the deformation of the bumps 36e and 36f This shift can be absorbed, and the terminal electrode 36b and the upper electrode film 80, and the terminal electrode 36c and the wiring pattern 34 can be electrically connected.

As a form of flip chip mounting (conductive connection structure), a brazing material, an anisotropic conductive material including an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP), An insulating resin material including a non-conductive film (NCF) or a non-conductive paste (NCP: Non Conductive Paste) can be used.
Further, when flip-chip mounting the drive circuit portions 200A to 200D on the wiring pattern 34, the above brazing material, an anisotropic conductive material including an anisotropic conductive film or an anisotropic conductive paste, a non-conductive film, or a non-conductive film is used. A conductive connection structure using an insulating resin material containing a conductive paste can be employed.

  In order to eject droplets of the functional liquid by the droplet discharge head 1 having the above-described configuration, an external controller (not shown) connected to the droplet discharge head 1 is connected to the functional liquid inlet 25 (not shown). The external functional liquid supply device is driven. The functional liquid delivered from the external functional liquid supply device fills the internal flow path of the droplet discharge head 1 from the functional liquid introduction port 25 to the reservoir 100 to the nozzle opening 15.

Further, the external controller transmits drive power and a command signal to the drive circuit unit 200 mounted on the reservoir forming substrate 20. The drive circuit unit 200 that has received the command signal or the like transmits a drive signal based on the command from the external controller to each piezoelectric element 300 that is conductively connected via the wiring pattern 34, the terminal electrode of the connector 360, and the like.
Then, as a result of applying a voltage between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generating chamber 12, the elastic film 50, the lower electrode film 60, and the piezoelectric film 70 are displaced. Due to the displacement, the volume of each pressure generating chamber 12 changes to increase the internal pressure, and a droplet is ejected from the nozzle opening 15.

<Connector manufacturing method>
The connector 360 used in the droplet discharge head of this embodiment is subjected to mechanical processing such as grinding when an insulating base material such as ceramics or glass epoxy is used, and is shown in a cross-sectional view in FIG. It can be manufactured by patterning connector terminals (terminal electrodes 36b, 36c, connection wiring 36d, bumps 36e, 36f) on the surface of the connector base 36a formed in a convex shape. When a conductive substrate such as a silicon substrate is used, a silicon oxide film is formed by thermal oxidation or the like on the surface of the silicon substrate that is partially removed by anisotropic etching and formed in a convex shape in cross section. It can be produced by pattern-forming the connector terminal on the surface of the connector base material obtained by forming an insulating resin film on the surface of the connector base material obtained by forming the silicon base material. .

  Examples of a method of patterning the connector terminals on the connector base material 36a include a method of patterning a conductive film formed using a vapor phase method using a photolithography technique, and opening a predetermined pattern on the connector base material 36a. A mask material provided with a portion is provided, and a method of selectively forming a conductive film (metal film) by a vapor phase method or a plating method through the mask material, or pattern formation of the conductive film using a droplet discharge method A method and a method of patterning a conductive film on the connector base material 36a using a printing method and the like can be used.

  Hereinafter, as an example of a method for manufacturing the connector 360, a method for forming connector terminals (terminal electrodes 36b and 36c, connection wiring 36d, bumps 36e and 36f) using a droplet discharge method will be described. In the present embodiment, a case where a ceramic molded body having a convex shape in cross section is used as the connector base material 36a will be described, but the same applies to the case where a connector base material of another material is used.

  In forming the connector terminal by the droplet discharge method, the droplet discharge apparatus having the droplet discharge head 1 can be preferably used. That is, the ink is disposed so that a predetermined pattern is formed on the connector base material 36a by discharging ink for forming the connector terminal from the droplet discharge head 1 provided in the droplet discharge device. Thereafter, the ink on the connector substrate 36a is dried and baked to form a metal thin film. By repeating the above steps sequentially for the upper surface of the protrusion 42 and the inclined surface 42a of the connector base 36a and the upper surface of the flat portion 41, the terminal electrodes 36b and 36c and the connection wiring 36d and the bumps 36e and 36f for connecting them are formed. It can be formed on the connector base material 36a.

  When the connector terminal shown in FIG. 12 is formed of a gold thin film, for example, a gold fine particle dispersion (trade name “Perfect Gold” manufactured by Vacuum Metallurgical Co., Ltd.) in which gold fine particles having a diameter of about 10 nm are dispersed in toluene is diluted with toluene. Then, the viscosity is adjusted to about 5 [mPa · s] and the surface tension is adjusted to about 20 mN / m, and this liquid material is used to form the terminal electrodes 36b and 36c, the connection wiring 36d, and the bumps 36e and 36f. Used as ink.

[Connector terminal formation procedure]
When the ink described above is prepared, a step of ejecting ink droplets from the droplet ejection head 1 and placing them on the connector substrate 36a is performed.
Here, prior to the droplet discharge step, a surface treatment may be performed on the connector base material 36a. That is, ink repellent treatment (liquid repellent treatment) may be performed on the ink application surface of the connector base material 36a prior to ink application. By performing such an ink repellent treatment, the position of ink ejected (applied) on the connector base material 36a can be controlled with higher accuracy.

If the ink repellent treatment is applied to the surface of the connector base material 36a as necessary, the ink droplets are discharged from the liquid droplet discharge head 1 and dropped onto a predetermined position on the connector base material 36a. In this step, a plurality of ink patterns (for example, ink patterns to be terminal electrodes 36b) are formed on one side surface of the connector substrate 36a by discharging the droplets while scanning the droplet discharge head 1 on the connector substrate 36a. Form.
At this time, when pattern formation is performed by continuously ejecting droplets, it is preferable to control the degree of overlap between the droplets so as not to cause a bulge. In this case, if a discharge arrangement method is adopted in which a plurality of droplets are discharged and arranged so as not to contact each other in the first discharge, and the gap is filled by the second and subsequent discharges, a good bulge is obtained. Can be prevented.

  If a predetermined ink pattern is formed on the connector base material 36a by ejecting the liquid droplets, then a drying process is performed as necessary to remove the dispersion medium from the ink. The drying process can be performed by lamp annealing, for example, in addition to a process using a normal hot plate or an electric furnace for heating the substrate. The light source used for lamp annealing is not particularly limited, but excimer laser such as infrared lamp, xenon lamp, YAG laser, argon laser, carbon dioxide laser, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. Can be used as a light source.

Next, the dried film obtained by drying the ink pattern is subjected to a baking treatment for improving the electrical contact between the fine particles. By this firing treatment, the dispersion medium is completely removed from the dried film, and when the surface of the conductive fine particles is provided with an organic coating for improving dispersibility, this coating is also removed.
The baking treatment is performed by heat treatment, light treatment, or a combination of these.
The firing treatment is usually performed in the air, but can also be performed in an inert gas atmosphere such as nitrogen, argon, helium, etc., if necessary. The treatment temperature of the firing treatment includes the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as dispersibility and oxidation of fine particles, the presence and amount of coating material, the heat resistance temperature of the substrate, etc. It is determined as appropriate in consideration. For example, in order to remove the coating material made of organic matter, it is necessary to bake at about 300 ° C. Moreover, when using a board | substrate, such as a plastic, it is preferable to carry out at room temperature or more and 100 degrees C or less.

Through the above steps, electrical contact between the fine particles in the film is ensured and converted into a conductive film.
Then, the connector 360 in which a plurality of connector terminals are formed on the connector base material 36a is manufactured by performing the above-described droplet discharge process, drying process, and firing process for each side surface of the connector base material 36a. be able to.

  In addition, by performing a droplet discharge process and a drying process on each side surface of the connector base material 36a, a dry film having a predetermined pattern is formed on each side surface of the connector base material 36a, and finally a baking process is performed collectively. Thus, the conversion from the dry film to the conductive film may be performed. Since the dry film has many gaps between the conductive fine particles constituting the dry film, the ink can be held well when the ink is disposed thereon. Therefore, the connectivity of the dry film formed on each side surface can be improved by performing the droplet discharge process on the other side surface with the dry film formed on the side surface of the connector base 36a. That is, the connectivity at the connection portion between the terminal electrode 36b and the connection wiring 36d and the connection portion between the terminal electrode 36c and the connection wiring 36d can be improved, and a connector terminal with higher reliability can be formed. .

<Method for manufacturing droplet discharge head>
Next, a method for manufacturing the droplet discharge head 1 will be described with reference to the flowchart of FIG.
In order to manufacture the droplet discharge head 1, for example, anisotropic etching is performed on a silicon single crystal substrate to form the pressure generation chamber 12, the supply path 14, the communication portion 13, and the like shown in FIG. The substrate 10 is produced (Step SA1). Thereafter, the elastic film 50 and the lower electrode film 60 are laminated and formed on the flow path forming substrate 10, and then the piezoelectric film 70 and the upper electrode film 80 are patterned on the lower electrode film 60 to form the piezoelectric element 300. Form (step SA2).

  Further, in a step different from steps SA1 and SA2, anisotropic etching is performed on the silicon single crystal substrate to form the piezoelectric element holding portion 24, the groove portion 700, and the introduction path 26, and the reservoir portion 21 using a dry etching method. To form the reservoir forming substrate 20 (step SA3). Next, the compliance substrate 30 is bonded onto the reservoir forming substrate 20 to form the wiring pattern 34 (step SA4).

Next, the reservoir forming substrate 20 that has undergone step SA4 is aligned with the position that covers the piezoelectric element 300 on the flow passage forming substrate 10 that has undergone step SA2 (step SA5), and then the flow path forming substrate 10 and the reservoir forming substrate. 20 and the connector 360 is inserted into the groove portion 700 to connect the upper electrode film 80 (circuit connection portion) of the piezoelectric element 300 and the wiring pattern 34 (step SA6). When the connector 360 is inserted into the groove 700, the alignment with respect to the reservoir forming substrate 20 can be easily and accurately performed by measuring the alignment mark AM formed on the connector 360.
Next, the drive circuit portions 200A to 200D are flip-chip mounted on the wiring pattern 34 on the reservoir forming substrate 20 (step SA7).
Note that the order of step SA6 and step SA7 may be reversed.
Through the above steps, the droplet discharge head 1 can be manufactured.

As described above, in the present embodiment, by arranging the connector 360 in the groove 700 provided in the reservoir forming substrate 20, the circuit connecting portion (upper electrode film 80) of the piezoelectric element 300 arranged with a step is provided. In addition, the wiring pattern 34 connected to the connection terminals 200a of the drive circuit units 200A to 200D can be electrically connected, and a space for routing a wire like a structure for connecting the drive circuit unit and the piezoelectric element by wire bonding is not required. Thus, it is possible to reduce the thickness of the droplet discharge head 1. Further, since the groove portion 700 is filled with the connector 360, the rigidity of the droplet discharge head 1 itself can be increased, and a decrease in discharge accuracy due to warpage or the like can be effectively prevented.
Further, in the present embodiment, the continuity of the drive circuit units 200A to 200D is mounted before the connector 360 is mounted by checking the continuity with respect to the wiring pattern 34 connected to the connection terminals 200a of the drive circuit units 200A to 200D. It becomes possible to carry out checks.

  Further, in the present embodiment, even when the pitch of the piezoelectric elements 300 becomes narrower as the nozzle openings 15 become narrower and it is extremely difficult to perform wire bonding, the drive circuit units 200A to 200D can be easily connected. Electrical connection with the piezoelectric element 300 can be performed. In other words, since the terminal electrodes 36b to 36f of the connector 360 can be formed at an accurate position and with an accurate dimension, even when the nozzle openings 15 are narrowed, piezoelectric elements arranged at a narrow pitch along with it. A device that can be accurately aligned with the element 300 can be manufactured. Therefore, according to the present embodiment, it is possible to obtain the droplet discharge head 1 capable of forming a high-definition image or a functional film pattern.

  Further, in the present embodiment, since the connector 360 has the inclined surface 42a, it becomes a guide when inserted into the groove 700, and a stable connection work is possible, and the protrusion 42 having the inclined surface 42a becomes the groove 700. Therefore, the wiring pattern 34 can be prevented from coming into contact with the connector 360 and causing a short circuit between the terminals. Furthermore, in this embodiment, the inclined surface 42a intersects at an obtuse angle with respect to the upper surface of the protrusion 42 on which the terminal electrode 36b is formed and the upper surface of the flat plate portion 41 on which the terminal electrode 36c is formed. It is possible to alleviate the stress concentration applied to the terminal electrodes formed at the intersections, and it is possible to suppress the occurrence of disconnection or the like. In addition, compared to the case where the upper surface of the protrusion 42 and the upper surface of the flat plate portion 41 are orthogonal to each other, there is an effect that the formation of wiring on the inclined surface 42a is facilitated.

  In the present embodiment, the bumps 36e and 36f are provided on the connector 360 to be connected to the upper electrode film 80 and the wiring pattern 34. Therefore, when the connector 360 is pressed, the bumps 36e and 36f can be easily deformed. For example, even if the positions of the terminal electrodes 36b and 36c in the Z-axis direction are shifted due to the height variation of the connector 360 (the flat plate portion 41 and the protruding portion 42), the shift can be absorbed by the deformation of the bumps 36e and 36f. In addition, the terminal electrode 36b and the upper electrode film 80, and the terminal electrode 36c and the wiring pattern 34 can be electrically connected stably. In addition, in the present embodiment, the base material 36a of the connector 360 and the flow path forming substrate 10 and the reservoir forming substrate 20 have the same linear expansion coefficient, so that the conductive joint is peeled off due to the volume change due to the temperature change. The advantage that can be effectively prevented is obtained.

  Furthermore, in this embodiment, since the drive circuit units 200A to 200D and the connector 360 are flip-mounted, it is possible to mount them all together using the same device (mounting device), thereby improving production efficiency. Can also contribute.

  Further, in the liquid droplet ejection head 1 of the present embodiment, the reservoir forming substrate 20 functions as a sealing member that seals the piezoelectric element 300 by blocking the piezoelectric element 300 from the external environment. It is possible to prevent the deterioration of the characteristics of the piezoelectric element 300 due to the external environment. Further, in this embodiment, the inside of the piezoelectric element holding part 24 is only sealed, but for example, the space inside the piezoelectric element holding part 24 is evacuated, or the piezoelectric element holding part 24 has a nitrogen or argon atmosphere or the like. Configurations that hold the inside of the element holding portion 24 at a low humidity can also be adopted, and the deterioration of the piezoelectric element 300 can be more effectively prevented by these configurations.

<Droplet ejection device>
Next, an example of a droplet discharge device including the above-described droplet discharge head 1 will be described with reference to FIG. In this example, an ink jet recording apparatus including the above-described droplet discharge head will be described as an example.

  The droplet discharge head constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. As shown in FIG. 14, cartridges 2A and 2B constituting ink supply means are detachably provided in recording head units 1A and 1B having a droplet discharge head, and the recording head units 1A and 1B are mounted. The carriage 3 is attached to a carriage shaft 5 attached to the apparatus main body 4 so as to be movable in the axial direction.

  The recording head units 1A and 1B, for example, are configured to eject a black ink composition and a color ink composition, respectively. Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted moves along the carriage shaft 5. It is like that. On the other hand, the apparatus body 4 is provided with a platen 8 along the carriage shaft 5, and a recording sheet S which is a recording medium such as paper fed by a paper feed roller (not shown) is conveyed onto the platen 8. It is like that. Since the ink jet recording apparatus having the above configuration includes the above-described droplet discharge head, the ink jet recording apparatus is small, highly reliable, and low in cost.

  In FIG. 14, an ink jet recording apparatus as a single printer is shown as an example of the droplet discharge apparatus of the present invention. However, the present invention is not limited to this, and a printer realized by incorporating such a droplet discharge head. It can also be applied to units. Such a printer unit is attached to a display device such as a television or an input device such as a whiteboard, and is used to print an image displayed or input by the display device or the input device.

  The droplet discharge head can also be applied to a droplet discharge apparatus for forming various devices by a liquid phase method. In this embodiment, as the functional liquid discharged from the droplet discharge head, a liquid crystal display device forming material for forming a liquid crystal display device, an organic EL forming material for forming an organic EL display device, an electronic circuit A material including a wiring pattern forming material for forming a wiring pattern is used. According to the manufacturing process in which these functional liquids are selectively arranged on a substrate by a droplet discharge device, the pattern arrangement of the functional material is possible without going through a photolithography process, so a liquid crystal display device, an organic EL device, a circuit board Etc. can be manufactured at low cost.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, the bumps are provided on the connector 360. However, the present invention is not limited to this, and the bumps may be provided on the upper electrode film 80 and the wiring pattern 34. Moreover, in the said embodiment, although the groove part 700 and the protrusion part 42 of the connector 360 were all formed in the taper shape, the structure in which any one or both may be formed with the same diameter may be sufficient. .

  In the above-described embodiment, the example of the droplet discharge head in which the drive circuit units 200A to 200D as devices are mounted on the substrate is described as an example of the semiconductor device. However, the present invention is not limited to this. The present invention can also be applied to a semiconductor device having a structure in which an electronic device is originally mounted.

  DESCRIPTION OF SYMBOLS 1 ... Droplet discharge head, 10 ... Channel formation board | substrate (base | substrate), 10a ... Upper surface (1st surface), 15 ... Nozzle opening, 15A-15D ... Nozzle opening group, 20 ... Reservoir formation board | substrate (protection board | substrate, base | substrate) 20a ... Upper surface (second surface), 21 ... Reservoir part (reservoir), 24 ... Piezoelectric element holding part (element holding part), 34 ... Wiring pattern (conductive connection part, second conductive connection part), 34A to 34D ... Wiring group, 36b ... Terminal electrode (first terminal electrode), 36c ... Terminal electrode (second terminal electrode), 36d ... Connection wiring, 36e, 36f ... Bump, 42a ... Inclined surface, 70 ... Piezoelectric film, 80 ... On Electrode film (circuit connection portion, first conductive connection portion), 200A to 200D ... drive circuit portion (driver IC, device), 200a ... connection terminal, 300 ... piezoelectric element (drive element), 350, 360 ... 1000, semiconductor device, 1010, base substrate (base body), 1011, through electrode (conductive connection portion), 1020, 1030, 1040, IC chip (device), 1060, 1070, 1080, connector, 1061, 1071, 1081 ... Penetration electrode (terminal electrode)

Claims (2)

A device mounting method for electrically connecting a first conductive connection portion formed on a first surface of a substrate and a connection terminal of a device disposed on a second surface disposed with a step between the first surface and the first surface. And
A second conductive connection portion connected to the connection terminal is formed on the second surface arranged on the same side as the first surface,
The first conductive connection portion and the second conductive connection portion have at least the height of the step and are connected to the first terminal electrode connected to the first conductive connection portion and the second conductive connection portion. Via a connector provided with a second terminal electrode provided on the same side as the first terminal electrode, and connection wiring for electrically connecting the first terminal electrode and the second terminal electrode. And a device mounting method characterized by comprising a step of electrical connection. The device mounting method according to claim 1,
A device mounting method comprising a step of flip-chip mounting the device and the connector on the substrate, respectively.

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