JP2009265779A - Data conversion device, cad system, automatic data creation method using them, and its program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a data conversion device for automatically creating foot print data or three-dimensional CAD data without manual operation. <P>SOLUTION: The data conversion device (CAD device 1) is used at least for a CAD system for supporting the design of electric components and components including a semiconductor. The data conversion device includes an input means (input part 15) for inputting component information acquired by describing the shape information of components and foot print information showing a pad installed for mounting the components on a printed circuit board in XML by a fixed notation method; and a generation means (conversion program 132) for generating at least the foot print data and three-dimensional CAD data to be used by a CAD system based on the component information input by the input means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a data conversion apparatus, a CAD system, an automatic data creation method used therefor, and a program therefor, and more particularly to a creation method of footprint data and three-dimensional CAD data in CAD (Computer Aided Design).

  The CAD device related to the present invention, for a long time, manually creates footprints and 3D CAD data used in CAD from component outline information by referring to data sheets provided by paper from component manufacturers. is doing. Even after a data sheet from a component manufacturer becomes an electronic medium, the effort for creating a footprint or three-dimensional CAD data does not change.

  Here, the footprint indicates a pad provided for attaching an electronic component to the printed circuit board, and the three-dimensional CAD draws the shape of the product three-dimensionally (X, Y, Z).

Patent Document 1 below describes a technique for automatically and automatically generating footprints and objects having a layer configuration using user know-how. In this technology, a shape definition that allows parameter input is performed for the pad stack, and from the data input for each parameter according to the shape definition, the arithmetic processing unit creates a pad stack in which internal objects constituting the footprint are superimposed for each layer. Based on a predetermined design rule for generation, the layer structure customized and the overlay coordinates of the internal object are calculated.
JP 2007-323170 A

  In the CAD apparatus related to the present invention described above, the component information is only the outline drawing on the data sheet. When the same component is used in the CAD, the footprint and three-dimensional CAD data used in the CAD are provided for each manufacturer. There is a problem that it must be created manually.

  Also in the above-mentioned Patent Document 1, when creating a footprint or an object, it is necessary to define a shape that allows parameter input for the pad stack, and to input data for each parameter according to the shape definition. Data must be created manually for each manufacturer.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems and to automatically create footprint data and three-dimensional CAD data without relying on manpower, a CAD system, and an automatic data creation method used for them. And providing the program.

A data conversion apparatus according to the present invention is a data conversion apparatus used in a CAD (Computer Aided Design) system that supports design of at least an electrical component and a component including a semiconductor.
Input means for inputting part information described in XML (extensible Markup Language) by a predetermined notation method on the shape information of the part and footprint information indicating a pad provided for attaching the part to the printed circuit board; and the input means Generating means for generating at least footprint data and three-dimensional CAD data to be used in the CAD system based on the component information input from.

  A CAD system according to the present invention includes the data conversion apparatus described above.

An automatic data creation method according to the present invention is an automatic data creation method used for a data converter in a CAD (Computer Aided Design) system that supports design of at least an electrical component and a component including a semiconductor,
A first step of inputting component information described in XML (extensible Markup Language) by a predetermined notation method, and information on the shape of the component and footprint information indicating a pad provided for attaching the component to the printed circuit board; And a second step of generating at least footprint data and three-dimensional CAD data to be used in the CAD system based on the component information input from the input means.

A program according to the present invention is a program to be executed by a central processing unit in a data conversion device in a CAD (Computer Aided Design) system that supports design of at least an electrical component and a component including a semiconductor,
A first process of inputting component information described in XML (extensible Markup Language) by a predetermined notation method for the shape information of the component and footprint information indicating a pad provided for attaching the component to the printed circuit board; And a second process for generating at least footprint data and three-dimensional CAD data used in the CAD system based on the component information input from the input means.

  By adopting the configuration and operation as described above, the present invention can produce an effect that footprint data and three-dimensional CAD data can be automatically created without depending on human hands.

  Next, embodiments of the present invention will be described with reference to the drawings. First, a description will be given of a CAD (Computer Aided Design) apparatus according to the present invention.

  In the CAD apparatus of the present invention, the part outline information and the recommended pad dimensions that have only been shown on the data sheet up to now are described in XML (extensible Markup Language), so that the part data can be derived from the XML data provided by the part manufacturer. Footprint data and 3D CAD data can be automatically created.

  In the present invention, by describing the component outline information and the recommended footprint information in XML, footprint data and three-dimensional CAD data are automatically created from the XML component outline information and the recommended footprint information. Accordingly, in the present invention, electronic data provided by converting the component information into XML is effectively used on the receiving side, and waste is eliminated.

  FIG. 1 is a block diagram showing a configuration example of a CAD apparatus according to the first embodiment of the present invention. In FIG. 1, a CAD apparatus 1 includes a CPU (central processing unit) 11, a main memory 12 that stores a control program 12 a that is executed by the CPU 11, a storage unit 13 that stores various programs executed by the CPU 11, and an execution of the CPU 11. The display unit 14 displays results and the like, and an input unit 15 (including an interface for inputting electronic data) 15 for inputting various data.

  The storage unit 13 stores at least a CAD program 131 and a conversion program 132 that converts various types of data into footprint data and three-dimensional CAD data, and is converted by the data created by the CAD program 131 and the conversion program 132. A CAD data storage area 133 is provided for storing data.

  FIG. 2 is a diagram showing the outline of the resistor used in the first embodiment of the present invention, and FIG. 3 is a diagram showing a description example in XML of the resistor shown in FIG. With reference to FIG. 2 and FIG. 3, an example of description in XML of the resistor according to the first embodiment of the present invention will be described.

  In FIG. 2, the outer shape of the resistor R is represented by a width W, a length L0, and an electrode grounding length L1. When the resistor R is expressed in XML, as shown in FIG.

That is, the resistance R is
<Parts>
<Model name> xxxXX // Model name>
<Manufacturer name> △△△ </ Maker name>
<Parts classification> Resistance </ Parts classification>
<Part type> 1005 </ Part type>
<Part shape>
<Number of electrodes> 2 <// Number of electrodes>
<Length Dimension = xx. xmm tolerance = 0.0xmm />
<Width dimension = yy. ymm tolerance = 0.0ymm />
<Electrode grounding length Dimensions = x. xmm tolerance = 0.0xmm />
<Height dimension = z. zmm tolerance = 0.0zmm />
</ Part shape>
<Electrical characteristics>
...
<Electrical characteristics>
</ Parts>
It can be expressed as follows.

  In particular, for the part shape, the number of electrodes is described as “a1”, the length L0 is expressed in the <length> tag as “a2” in XML notation, and here, dimensions and tolerances are expressed as attributes. is doing. In this example, the case where the plus and minus tolerances are equal is shown, but if they are different, attributes such as plus tolerance and minus tolerance can be used.

  Similarly to the above, the width W is described as “a3”, the electrode grounding length L1 is described as “a4”, and the height of the part on the data sheet is “a5” in XML notation. Describe as follows.

  In this way, the outline drawing on the data sheet from the component manufacturer is structured and described as in the XML notation A of resistance, thereby standardizing the component description method and the data in XML notation A of the component created by the component manufacturer. To recycle.

  FIG. 4 is a diagram showing the outline of the resistor footprint used in the first embodiment of the present invention, and FIG. 5 is a diagram showing a description example in XML of the resistor footprint shown in FIG. With reference to FIG. 4 and FIG. 5, an example of description in XML of the footprint of the resistor according to the first embodiment of the present invention will be described.

  In FIG. 4, the footprints FP1 and FP2 of the resistor R are represented by the side fillet SF, the top fillet TF, and the back fillet BF. When the footprints FP1 and FP2 of the resistor R are expressed in XML, as shown in FIG. 5, an XML notation B of the resistor and its footprint is obtained.

In other words, the footprints FP1 and FP2 of the resistor R are
<Parts>
<Model name> xxxXX // Model name>
<Manufacturer name> △△△ </ Maker name>
<Parts classification> Resistance </ Parts classification>
<Part type> 1005 </ Part type>
<Part shape>
<Number of electrodes> 2 <// Number of electrodes>
<Length Dimension = xx. xmm tolerance = 0.0xmm />
<Width dimension = yy. ymm tolerance = 0.0ymm />
<Electrode grounding length Dimensions = x. xmm tolerance = 0.0xmm />
<Height dimension = z. zmm tolerance = 0.0zmm />
</ Part shape>
<Footprint>
<Top fillet> x. xmm </ top fillet>
<Back fillet> y. ymm </ back fillet>
<Side fillet> z. zmm </ side fillet>
</ Footprint>
<Electrical characteristics>
...
<Electrical characteristics>
</ Parts>
It can be expressed as follows.

  In the present embodiment, the outer shape of the resistor R is described as XML notation A of the resistor using XML, and then the footprint information of the resistor R is expressed in XML by a component manufacturer or a manufacturer.

  The resistance footprint FP1 in FIG. 4 is expressed by a top fillet TF, a back fillet BF, and a side fillet SF. As shown in XML notation B of the resistor and its footprint, the top fillet TF is expressed as “b1”, the back fillet BF is expressed as “b2”, and the side fillet SF is “b3”. It is expressed as follows.

  In the present embodiment, a conversion program 132 for creating footprint data from the part shape and the footprint information is created using the XML notation B written in this way, and the conversion program 132 creates a footprint from the XML notation B. A print FP1 is created.

  FIG. 6 is a diagram showing the operation of the CAD apparatus according to the first embodiment of the present invention, FIGS. 7 to 10 are flowcharts showing the processing of the conversion program 132 of FIG. 1, and FIG. It is a figure which shows the example of a calculation of the calculation process in 1 embodiment. The operation of the CAD apparatus 1 according to the first embodiment of the present invention will be described with reference to FIGS.

  When an XML notation B of the resistance and its footprint is input from the input unit 15, the CPU 11 executes the conversion program 132 in the storage unit 13. When the conversion program 132 is executed, the CPU 11 operates as shown in FIGS. 7 to 10 and creates footprint data from the component information expressed in XML.

  When executing the conversion program 132, the CPU 11 first determines the component classification (step S1 in FIG. 7). In the XML notation B of the resistor and its footprint shown in FIG. 5, the resistor is described as the component classification. Therefore, the case where the component classification is the resistance will be described below.

  If CPU11 determines with resistance by determination of component classification (step S2 of FIG. 7), it will determine a component type | mold (step S3 of FIG. 7). In the XML notation B of the resistor and its footprint shown in FIG. 5, the component type is described as “1005”. Since “1005” indicates that the resistor is an SMD (Surface Mount Device) type, it is processed as an SMD type component.

  If the CPU 11 determines that the component type is SMD (step S4 in FIG. 7), the CPU 11 sets necessary conditions when creating the footprint data, such as whether to use the maximum value of the component shape as a reference or to perform various corrections. (FIG. 7, step S6). Thereafter, the CPU 11 performs a calculation process for creating footprint data (step S7 in FIG. 7).

  This calculation process is performed as shown in FIG. 11, for example. In FIG. 11, a perpendicular line is drawn from the intersection 20 of the X axis and the Y axis, the point 21 of the length L0 on the X axis, the point 22 of the width W on the Y axis, and the point 21 of the length L0 on the X axis. The four points of the intersection 23 with the perpendicular drawn from the point 22 of the width W on the Y axis are stored, and the number of electrodes is 2, so that the value of the electrode grounding length L1 is added from the storage points 20 and 22 on the Y axis. Two points of points 24 and 25 and two points 26 and 27 obtained by subtracting the electrode grounding length L1 from the two points 21 and 23 on the perpendicular line of the length L0 on the X axis are stored.

  The first electrode is obtained by connecting the points 20, 22, 24, and 25 by straight lines to four points calculated from the top fillet length TF, the back fillet length BF, and the side fillet length SF. Another electrode is formed in the same manner as described above.

  The created footprints FP1 and FP2 are displayed and confirmed on a monitor (not shown) of the display unit 14 (steps S8 and S9 in FIG. 7). If there is no problem with the confirmation result (step S10 in FIG. 7), the CPU 11 outputs the file and saves it in the CAD data storage area 133 (step S11 in FIG. 7).

  CPU 11 performs DIP (Dual Inline Package) component processing (step S5 in FIG. 7) if it is not determined as SMD in the determination of the component type (step S4 in FIG. 7).

  On the other hand, when the CPU 11 determines that it is a capacitor in the determination of the component classification (step S12 in FIG. 8), the CPU 11 performs processing of the capacitor (step S13 in FIG. 8). Moreover, if CPU11 determines with a coil by determination of components classification (step S14 of FIG. 9), it will process a coil (step S15 of FIG. 9). Further, when the CPU 11 determines other in the determination of the component classification (step S16 in FIG. 10), the CPU 11 performs other processing (step S17 in FIG. 10).

  Finally, when the CPU 11 determines that there is no other in the component classification determination (step S16 in FIG. 10), the CPU 11 performs error processing (step S18 in FIG. 10).

  FIG. 12A is a view showing the outer shape of the resistor R used in the first embodiment of the present invention, and FIG. 12B is a three-dimensional CAD of the resistor R used in the first embodiment of the present invention. It is a figure which shows data. As shown in FIG. 12, in this embodiment, it is also possible to automatically create three-dimensional CAD data from the XML notation A (XML component shape information) shown in FIG.

  FIG. 13 is a diagram showing the outer shape of the semiconductor used in the first embodiment of the present invention, and FIG. 14 is a diagram showing a description example in XML of the semiconductor shown in FIG. A description example in XML of the semiconductor according to the first embodiment of the present invention will be described with reference to FIGS.

  In FIG. 13, the outer shape of the semiconductor S is represented by the overall width W0, width W1, length L10, terminal width W2, pitch P, and terminal grounding length L11. When the semiconductor S is expressed in XML, as shown in FIG.

That is, the semiconductor S is
<Parts>
<Model name> XXXXX </ Type name>
<Manufacturer name> □□□ <// Manufacturer name>
<Part classification> Semiconductor </ Part classification>
<Part type> SMD <// Part type>
<Part shape>
<Number of terminals> 16 </ number of terminals>
<Length Dimension = xx. xmm tolerance = 0.0xmm />
<Width dimension = yy. ymm tolerance = 0.0ymm />
<Overall width Dimension = zz. zmm tolerance = 0.0zmm />
<Terminal width Dimensions = w. wmm tolerance = 0.0 wmm />
<Pitch dimension = v. vmm />
<Terminal grounding length Dimensions = x. xmm tolerance = 0.0xmm />
<Height dimension = z. zmm tolerance = 0.0zmm />
</ Part shape>
<Electrical characteristics>
...
<Electrical characteristics>
</ Parts>
It can be expressed as follows.

  In particular, for the part shape, the number of terminals is described as “c1”, the length L10 is expressed in the <length> tag as “c2” in the XML notation, and the dimension and tolerance are expressed here as attributes. is doing. In this example, the case where the plus and minus tolerances are equal is shown, but if they are different, attributes such as plus tolerance and minus tolerance can be used.

  Similarly to the above, the width W1 is described as “c3”, the entire width W0 is described as “c4”, and the terminal width W2 is described as “c5”. As described above, the pitch P is described as “c6”, the terminal grounding length L11 is described as “c7”, and the height of the part on the data sheet is also expressed in XML. Then, it is described as “c8”.

  FIGS. 15A and 15B are views showing the outer shape of the semiconductor footprint used in the first embodiment of the present invention, and FIG. 16 is a description example in XML of the semiconductor footprint shown in FIG. FIG. With reference to FIGS. 15 and 16, description will be given of an XML description example of the semiconductor footprint according to the first embodiment of the present invention.

  In FIG. 15B, the external shape of the footprint FP10 of the semiconductor S is represented by a side fillet SF, a top fillet TF, and a back fillet BF. When the footprint FP10 of the semiconductor S is expressed in XML, as shown in FIG. 16, an XML description D of the semiconductor and its footprint is obtained.

That is, the footprint FP10 of the semiconductor S is
<Parts>
<Model name> XXXXX </ Type name>
<Manufacturer name> □□□ <// Manufacturer name>
<Part classification> Semiconductor </ Part classification>
<Part type> SMD <// Part type>
<Part shape>
<Number of terminals> 16 </ number of terminals>
<Length Dimension = xx. xmm tolerance = 0.0xmm />
<Width dimension = yy. ymm tolerance = 0.0ymm />
<Overall width Dimension = zz. zmm tolerance = 0.0zmm />
<Terminal width Dimensions = w. wmm tolerance = 0.0 wmm />
<Pitch dimension = v. vmm />
<Terminal grounding length Dimensions = x. xmm tolerance = 0.0xmm />
<Height dimension = z. zmm tolerance = 0.0zmm />
</ Part shape>
<Footprint>
<Top fillet> x. xmm </ top fillet>
<Back fillet> y. ymm </ back fillet>
<Side fillet> z. zmm </ side fillet>
</ Footprint>
<Electrical characteristics>
...
<Electrical characteristics>
</ Parts>
It can be expressed as follows.

  A footprint FP10 of the semiconductor S in FIG. 15 is expressed by a top fillet TF, a back fillet BF, and a side fillet SF. As shown in the XML description D of the semiconductor and its footprint, the top fillet TF is expressed as “d1”, the back fillet BF is expressed as “d2”, and the side fillet SF is “d3”. It is expressed as follows.

  Until now, when CAD is used by a manufacturer or the like, footprint data and three-dimensional CAD data are manually created based on part shape and footprint information. In the present embodiment, by describing the part information using the above-described XML notation, it becomes possible to automatically create footprint data and three-dimensional CAD data without depending on human resources. Reductions in development costs can be achieved by reducing and shifting to other operations. Further, in the present embodiment, quality can be improved by eliminating errors due to manpower.

  In the present invention, as shown in FIGS. 13 to 16, XML notation can be applied to components other than resistors. By enacting a standard for XML description of part outline information including non-standard parts, all parts can be converted to XML.

  Further, according to the present invention, not only a footprint but also an automatic creation of a logical library is possible by expressing the electrical characteristics of the above parts in XML.

  Furthermore, in the present invention, it is also conceivable to automate the input of data expressed in XML using a tool that automatically creates XML component information by a component manufacturer. As this tool, it is possible to automatically output XML component information only by inputting the contents described on the data sheet. Furthermore, in the present invention, a method of reading the created footprint data and converting it into XML is also possible.

  In the present invention, in the above embodiment, the conversion program 132 is stored in the CAD device 1 and executed. However, a data conversion device that executes the conversion program 132 exclusively is connected to the CAD device 1. However, the present invention is not limited to this. In this case, the data conversion apparatus has the same configuration as that of the CAD apparatus 1 shown in FIG. 1 except that the CAD program 131 is not stored in the storage unit 13.

  The present invention includes parts manufacturers (semiconductors, resistors, capacitors, etc.), manufacturers (manufacturers using the above-described components), board design vendors (each company that designs boards under the contract of the manufacturer), CAD vendors ( (Providing a program for creating footprints and 3D CAD data from component information described in XML).

1 is a block diagram illustrating a configuration example of a CAD device according to a first embodiment of the present invention. It is a figure which shows the external shape of the resistor used for the 1st Embodiment of this invention. FIG. 3 is a diagram illustrating a description example in XML of the resistor illustrated in FIG. 2. It is a figure which shows the external shape of the footprint of the resistance used for the 1st Embodiment of this invention. FIG. 5 is a diagram illustrating a description example in XML of a footprint of a resistor illustrated in FIG. 4. It is a figure which shows operation | movement of the CAD apparatus by the 1st Embodiment of this invention. It is a flowchart which shows the process of the conversion program of FIG. It is a flowchart which shows the process of the conversion program of FIG. It is a flowchart which shows the process of the conversion program of FIG. It is a flowchart which shows the process of the conversion program of FIG. It is a figure which shows the example of a calculation of the calculation process in the 1st Embodiment of this invention. (A) is a figure which shows the external shape of resistance R used for the 1st Embodiment of this invention, (b) is a figure which shows the three-dimensional CAD data of resistance R used for the 1st Embodiment of this invention. . It is a figure which shows the external shape of the semiconductor used for the 1st Embodiment of this invention. It is a figure which shows the example description in XML of the semiconductor shown in FIG. (A), (b) is a figure which shows the external shape of the footprint of the semiconductor used for the 1st Embodiment of this invention. It is a figure which shows the example of description in XML of the semiconductor footprint shown in FIG.

Explanation of symbols

1 CAD device 11 CPU
12 Main Memory 12a Control Program 13 Storage Unit 14 Display Unit 15 Input Unit 131 CAD Program 132 Conversion Program 133 CAD Data Storage Area

Claims (16)

A data conversion device used in a CAD (Computer Aided Design) system that supports design of at least an electrical component and a component including a semiconductor,
Input means for inputting part information described in XML (extensible Markup Language) by a predetermined notation method on the shape information of the part and footprint information indicating a pad provided for attaching the part to the printed circuit board; and the input means A data conversion apparatus comprising: generation means for generating at least footprint data and three-dimensional CAD data used in the CAD system based on the component information input from the computer.   2. The data conversion apparatus according to claim 1, wherein the component information is information described by structuring the component shape information and recommended pad dimensions in XML.   The data conversion apparatus according to claim 1, wherein the component information represents an electrical characteristic of the component in XML.   4. The data conversion apparatus according to claim 1, wherein the input unit inputs data created by a tool that automatically creates XML-based component information.   5. The data conversion apparatus according to claim 4, wherein the tool automatically outputs the part information converted into XML by inputting the contents described on the data sheet of the part.   The data conversion apparatus according to claim 4, wherein the tool reads the created footprint data and converts it into XML.   7. The data conversion apparatus according to claim 1, wherein the data conversion apparatus is disposed in a CAD apparatus that supports the design of the parts.   A CAD system comprising the data conversion device according to claim 1. An automatic data creation method used for a data converter in a CAD (Computer Aided Design) system that supports design of at least an electrical component and a component including a semiconductor,
A first step of inputting component information described in XML (extensible Markup Language) by a predetermined notation method, and information on the shape of the component and footprint information indicating a pad provided for attaching the component to the printed circuit board; A method of automatically creating data, comprising: a second step of generating at least footprint data and three-dimensional CAD data used in the CAD system based on the part information input from an input means.   10. The data automatic creation method according to claim 9, wherein the component information is information described by structuring the component shape information and recommended pad dimensions in XML.   11. The data automatic creation method according to claim 9, wherein the component information is expressed in XML notation of electrical characteristics of the component.   12. The data automatic creation method according to claim 9, wherein, in the first step, data created by a tool that automatically creates XML component information is input.   13. The data automatic creation method according to claim 12, wherein the tool automatically outputs the XML-formatted part information by inputting contents described on a data sheet of the part.   13. The data automatic creation method according to claim 12, wherein the tool reads the created footprint data and performs XML conversion.   15. The data automatic creation method according to claim 9, wherein the data conversion device is disposed in a CAD device that supports design of the part. A program to be executed by a central processing unit in a data conversion device in a CAD (Computer Aided Design) system that supports design of at least an electric component and a component including a semiconductor,
A first process of inputting component information described in XML (extensible Markup Language) by a predetermined notation method for the shape information of the component and footprint information indicating a pad provided for attaching the component to the printed circuit board; And a second process for generating at least footprint data and three-dimensional CAD data to be used in the CAD system based on the component information input from the input means.

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