JP2009247621A - Imaging unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging unit made small in size and low in height, and also enhancing a yield in assembling in the imaging unit, which is incorporated in a medical instrument desired to be downsized. <P>SOLUTION: The imaging unit 2 is provided with: a solid-state imaging element 15 for forming an image of a subject with an image forming lens 13; light emitting elements 25 for illuminating the subject; a light emitting element drive component 24 for performing drive control over the light emitting elements; a signal processing component 23 for driving the solid-state imaging element and performing signal processing; and at least one board 21 and 22 to which the solid-state imaging element, the light emitting elements, the light emitting element drive component, and the signal processing component are electrically connected. At least either the light emitting element drive component or the signal processing component is incorporated with the board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an image pickup unit in which a solid-state image pickup element, a light emitting element, and components for driving and controlling them are mounted on a substrate.

  Conventionally, in an imaging unit used for a capsule endoscope, a solid-state imaging device for imaging a test site, an LED as an illumination means for the test site, signal processing and drive control from the solid-state imaging device A digital signal processor (DSP) chip, a chip capacitor for driving an LED, electronic components such as a chip resistor are mounted on the surface of a flexible substrate or a rigid substrate and combined with a lens unit to form an imaging unit. Yes.

  For example, an imaging unit included in the capsule endoscope described in Patent Document 1 includes an illumination board on which an illumination component is provided, an imaging board on which an image sensor for imaging a test site is provided, an illumination board, and The illumination board and a flexible board made of a plastic material formed integrally with the imaging board are provided that are electrically connected to the imaging board. In addition, the imaging unit supports a plurality of lenses that form an image of reflected light from a test site of illumination light, and a lens support member made of a cylindrical member with one end positioned with respect to the image sensor, and the lens Positioning and supporting the illumination substrate with respect to the lens support member when the flexible substrate is bent with a hole formed through the illumination substrate with an inner diameter larger than the outer diameter of the lens support member so that the support member can be fitted And a step portion provided on the lens support member.

As a result, the capsule endoscope of Patent Document 1 has a configuration in which it is not necessary to separately connect the imaging substrate and the illumination substrate with a lead wire or the like, and the assembly is simplified.
JP2005-205078

  However, in the medical endoscope field where miniaturization is desired, for example, an imaging unit provided in a capsule endoscope as disclosed in Patent Document 1 includes an image sensor, an illumination component, and the like. A technique is employed in which electronic components such as a DSP, a resistor, and a capacitor for controlling the driving of the sensor are mounted on an imaging substrate or an illumination substrate.

  Therefore, as a result, the conventional imaging unit has a plurality of component layers, specifically, a first layer in which the illumination component is disposed, a second layer of the illumination substrate, and a third layer in which the electronic component is disposed. 6 layers of a layer, a fourth layer in which an image sensor is disposed, a fifth layer of an imaging substrate, and a sixth layer in which electronic components are disposed, and the number of stacked component layers is large. Lowering the height of the imaging unit has been hindered because the surface is not used effectively. Therefore, a medical device such as a capsule endoscope in which an imaging unit having a conventional configuration is incorporated has a problem that its downsizing, in particular, a reduction in height in the photographing optical axis direction is hindered.

  In addition, in the conventional imaging unit, since electronic components are exposed on the substrate, these electronic components may be damaged or separated during assembly in the manufacturing process and assembly to the capsule endoscope. . Therefore, the conventional imaging unit and capsule endoscope have a problem that the manufacturing yield is reduced.

  Therefore, the present invention has been made in view of the above circumstances, and an object of the present invention is an imaging unit incorporated in a medical device for which miniaturization is desired, and includes the number of substrate layers and component layers. It is to provide an imaging unit capable of reducing the size and reducing the size, particularly the height, and improving the yield at the time of assembly.

  In order to achieve the above object, an imaging unit according to the present invention includes a solid-state imaging device on which a subject image is formed by an imaging lens, a light-emitting device that illuminates the subject, and a light-emitting device that drives and controls the light-emitting device. The driving component, the signal processing component that drives and processes the solid-state imaging device, and the solid-state imaging device, the light emitting element, the light emitting element driving component, and the signal processing component are electrically connected. At least one substrate, and at least one of the light-emitting element driving component and the signal processing component is built in the substrate.

  With such a configuration, the number of component layers can be reduced, and the height of the imaging unit can be reduced. In addition, since the light-emitting element driving component or the electronic component that is the signal processing component is not exposed on the substrate, there is little possibility that the electronic component built in the substrate is damaged or separated, and the manufacturing yield. Can be improved.

  According to the present invention, there is provided an imaging unit incorporated in a medical device for which downsizing is desired, and the number of substrate layers and component layers is reduced to reduce the size, in particular, to a low profile, and at the time of assembly. It is possible to realize an imaging unit that can improve the yield.

  The best mode for carrying out the imaging unit according to the present invention (hereinafter simply referred to as “embodiment”) will be described below. It should be noted that the drawings based on each embodiment are schematic, and the relationship between the thickness and width of each part, the thickness ratio of each part, and the like are different from the actual ones. Of course, there are also portions having different dimensional relationships and ratios between the drawings.

(First embodiment)
First, a first embodiment of the present invention will be described below based on FIG. 1 and FIG. 1 and 2 relate to the first embodiment, FIG. 1 is a cross-sectional view of a capsule endoscope apparatus incorporating an image pickup unit, and FIG. 2 is a cross-sectional view schematically showing a configuration of the image pickup unit. It is.

  The capsule endoscope apparatus 1 according to the present embodiment shown in FIG. 1 includes an imaging unit 2 that is a camera module for imaging the inside of a subject, and a signal that performs image signal processing on an imaging signal from the imaging unit 2. A processing circuit unit 3, a battery 4 as a power supply unit, and an RF unit 5 that wirelessly transmits an image signal processed by the signal processing circuit unit 3 to an external device are mainly contained in an outer case 6 as a sealed container. It is stored.

  The outer case 6 includes a bottomed cylindrical outer frame member 7 and a front cover 8 which is a spherical dome member. The front cover 8 is fitted and bonded so as to close the opening of the outer frame member 7. As a result, the internal space is hermetically sealed. The front cover 8 of the outer case 6 is an optical dome having light transparency (transparency). The imaging unit 2 is fitted and fixed to the outer frame member 7 of the outer case 6 so as to face the front cover 8 side.

Next, the imaging unit 2 of the present embodiment will be described in detail below based on FIG.
As shown in FIG. 2, the imaging unit 2 includes a lens unit 10, a solid-state imaging device 15 such as a CCD or CMOS, a first substrate 21 that is a signal processing substrate, and a second substrate that is a lighting component driving substrate. And mainly a substrate 22.

  The lens unit 10 includes a lens holding frame 11 and two objective lenses 12 and 13 held by the lens holding frame 11 here.

  The solid-state imaging device 15 is fixed to the surface thereof so that the base end surface of the lens holding frame 11 is in contact with the periphery of the light receiving device 16 so that the light receiving device 16 that is an imaging region is positioned on the lens unit 10 side. That is, the optical focus position at which the focused subject image having the photographing optical axis O is formed on the light receiving element 16 of the solid-state imaging element 15 by the objective lenses 12 and 13 of the lens unit 10 is set. The base end surface of the lens holding frame 11 is fixed to the surface of the solid-state imaging element 15 so as to cover and contact the periphery of the light receiving element 16.

  A DSP 23 which is a signal processing component for performing signal processing and drive control from the solid-state imaging device 15 is embedded in the first substrate 21 using a component-embedded substrate technology, that is, electrically connected. . The solid-state imaging device 15 has a plurality of bump electrodes 17 provided on the surface thereof electrically connected to the lower surface portion of the second substrate 22.

  The second substrate 22 is formed with an opening that is located immediately above the light receiving element 16 that is the light receiving region of the solid-state imaging element 15 and into which the lens holding frame 11 of the lens unit 10 is inserted.

  The first substrate 21 and the second substrate 22 are electrically connected by the flexible printed circuit board 29, and the first substrate 21 is solid-state imaged via the second substrate 22 and the flexible printed circuit board 29. It is configured to exchange electric signals with the element 15.

  In addition, the second substrate 22 is an illuminating means on its upper surface, and a plurality of LEDs 25 that are light emitting elements are mounted therein, and LEDs that are light emitting element driving components necessary for driving control of these LEDs 25 are internally provided. The drive component 24 is embedded using a component-embedded substrate technology, that is, embedded in an electrically connected state.

  Since the component-embedded substrate technology in which the DSP 23 is incorporated in the first substrate 21 and the LED driving component 24 is incorporated in the second substrate 22 can be realized by a conventionally used method, detailed description thereof is omitted. To do. In addition, each of the boards 21 and 22 of the present embodiment has exemplified that the built-in electronic components are the DSP 23 and the LED driving component 24. However, the substrate 21 and 22 may also be configured to incorporate electronic components such as resistors and capacitors. Of course it is good.

  Furthermore, in the imaging unit 2 of the present embodiment, an example in which both the DSP 23 and the LED driving component 24 are incorporated in the first substrate 21 and the second substrate 22 has been shown. At least one of the component 24 and the electronic component of the DSP 6 may be built in the first substrate 21 or the second substrate 22.

  The imaging unit 2 of the present embodiment configured as described above includes a DSP 23 which is a signal processing component and a LED driving component 24 which is a light emitting element driving component, which are conventionally mounted on the surface of a plurality of substrates. By incorporating it in the substrate (21, 22), the overall size can be reduced, and in particular, the height can be reduced in the direction of the photographing optical axis O, that is, the thickness can be reduced. Further, by incorporating the signal processing component mounted on the substrate surface and the light emitting element driving component into the substrate, the capsule endoscope apparatus 1 can be reduced in size, and the exterior case 6 is vacant. Other parts can also be placed in the area.

  Further, in comparison with the case where there are various components on the substrate surface as in the past, by using the light emitting element driving component and the substrate in which the driving component is built in advance, When the capsule endoscope apparatus 1 is assembled, the light-emitting element driving component and the electronic component that is the driving component are not exposed on the substrate, so that these electronic components may be damaged or separated. Therefore, the manufacturing yield can be improved.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view schematically showing the configuration of the image pickup unit in the second embodiment of the present invention. In the description of the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals for the convenience of description, and detailed description and operational effects thereof are omitted.

  In the imaging unit 2 of the present embodiment shown in FIG. 3, the DSP 23 and the LED driving component 24 are respectively provided on the first substrate 21 and the second substrate 22 as in the first embodiment. Built-in using built-in substrate technology.

  Further, the imaging unit 2 is held in the opening of the second substrate 22 so that the second objective lens 13 which is an imaging lens constituting the transparent member here is built therein. That is, the light collected by the lens unit 10 including the first objective lens 12 and the lens holding frame 11 that holds the first objective lens 12 on the object side is solid-state image pickup device by the second objective lens 13. The light receiving element 16 that is 15 light receiving regions forms an image.

  First, a hole is formed in the second substrate 22 by machining such as punching and drill machining, laser processing, edging, and the like, and the second objective lens 13 is incorporated in the hole that is the formed opening. . That is, the second substrate 22 also serves as a lens holding frame that holds the second objective lens 13.

  The lens holding frame 11 of the lens unit 10 has a light receiving element of the solid-state image pickup device 15 that has a photographic optical axis O collected by the first objective lens 12 and the second objective lens 13 at the base end surface. After the optical in-focus position alignment formed on the image 16 is performed, the base end surface of the lens holding frame 11 is fixed so as to contact the surface of the second substrate 22.

  Since the imaging unit 2 of the present embodiment configured as described above holds and incorporates the second objective lens 13 that is a transparent member in the second substrate 22, the lens unit 10 is configured. The number of objective lenses can be reduced, and the height of the lens unit 10 itself in the direction of the photographing optical axis O can be further reduced (shortened) compared to the first embodiment. In this embodiment, the case where the second objective lens 13 that is an imaging lens is built in the second substrate 22 is shown. However, as other optical transparent members, a flat cover glass, an IR cut filter, and the like are used. Of course, these may be built in the second substrate 22.

  From the above, in addition to the same effects as those of the first embodiment, the imaging unit 2 of the present embodiment incorporates the imaging lens (second objective lens 13) in the substrate, so that the lens unit 10 Can be reduced in height. In addition, since the opening of the substrate (second substrate 22) provided on the light receiving region (light receiving device 16) of the solid-state imaging device 15 is closed with a transparent member such as an imaging lens, the present embodiment In the imaging unit 2, dust or the like adheres to the light receiving element 16, which is a light receiving region, in a process after the solid-state imaging element 15 is electrically connected to the second substrate 22 via the plurality of bump electrodes 17. Therefore, the manufacturing yield can be improved.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIGS. 4 and 5 relate to the third embodiment of the present invention, FIG. 4 is a cross-sectional view schematically showing the configuration of the imaging unit, and FIG. 5 schematically shows the configuration of the imaging unit of the modification. It is sectional drawing. In the description of the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals for the convenience of description, and detailed descriptions and operational effects thereof are omitted.

  The imaging unit 2 of the present embodiment shown in FIG. 4 is a CSP (packaged CSP) in which a cover glass 18 that is a transparent member is disposed on one surface on which a light receiving element 16 that is a light receiving region of a solid-state imaging element 15 is formed. It is configured to include a (Chip Size Package) type solid-state imaging device unit 20.

  In the solid-state image sensor unit 20, a plurality of bump electrodes 17 are formed on the lower surface side opposite to the light receiving element 16 of the solid-state image sensor 15, and the surface of the electronic component built-in substrate 31 is interposed via the bump electrodes 17. It is electrically connected to and mounted.

  In the lens unit 10 of the present embodiment, the optical focus position where the subject image having the photographing optical axis O collected by the objective lenses 12 and 13 is formed on the light receiving element 16 of the solid-state imaging element 15 is formed. Is set, and the base end surface of the lens holding frame 11 is in contact with and fixed to the surface of the cover glass 18 of the solid-state image sensor unit 20. A plurality of LEDs 25 are mounted on the surface of the electronic component built-in substrate 31 so as to surround the outer periphery of the lens unit 10.

  Further, the electronic component built-in substrate 31 incorporates an LED driving component 24 for driving the LED 25 and a DSP 23 for processing a signal of the solid-state imaging device 15 by using the component built-in substrate technology.

  In the imaging unit 2 of the present embodiment configured as described above, the LED driving component 24 and the plurality of electronic components that are the DSP 23 are built in the single electronic component built-in substrate 31, and thus the above-described first unit. Compared with the case where a plurality of substrates are provided as in the first and second embodiments, the height can be further reduced.

Next, a modification of the present embodiment will be described below based on FIG.
In the imaging unit 2 shown in FIG. 5, the CSP-type solid-state imaging device unit 20 has an upper surface of the electronic component built-in substrate 31 and an upper surface of the cover glass 18 that is a transparent member positioned substantially in the same plane. It is buried so as to be exposed. The plurality of bump electrodes 17 provided on the solid-state image sensor 15 of the solid-state image sensor unit 20 are electrically connected inside the electronic component built-in substrate 31. Further, the plurality of LEDs 25 are also embedded in a state where the light emitting surface is exposed in substantially the same plane as the upper surface of the electronic component built-in substrate 31 and is electrically connected to the electronic component built-in substrate 31.

  The electronic component built-in substrate 31 has a multilayer wiring structure, and the LED driving component 24 and the DSP 23 for processing the signals of the solid-state imaging device 15 are built in the lower layer of the electronic component built-in substrate 31.

  That is, the imaging unit 2 according to the present embodiment includes a CSP type solid-state imaging device unit 20, a plurality of LEDs 25, a DSP 23, and an LED driving component 24 built in a single electronic component built-in substrate 31. The lens unit 10 is arranged on the cover glass 18 of the image sensor unit 20.

  As shown in the present modification described above, the imaging unit 2 includes the CSP type solid-state imaging device unit 20 and the plurality of LEDs 25 in the same electronic component built-in substrate 31. It is only necessary to mount the lens unit 10 on the single electronic component built-in substrate 31, and the assembling workability can be improved.

  In the imaging unit according to the present invention described in each of the above embodiments, a light emitting element driving component and a signal processing component are built in a mounting substrate that is conventionally mounted on the surface thereof. Therefore, it is possible to reduce the number of component layers constituting the imaging unit, and as a result, it is possible to reduce the height of the imaging unit.

  An imaging unit according to the present invention includes a solid-state imaging device on which a subject image is formed by an imaging lens, a light-emitting device that illuminates the subject, a light-emitting device driving component for driving and controlling the light-emitting device, and the solid-state A signal processing component for driving the image sensor and performing signal processing; and at least one substrate to which the solid-state image sensor, the light emitting element, the light emitting element driving component, and the signal processing component are electrically connected. And at least one of the light emitting element driving component and the signal processing component is built in the substrate.

  With such a configuration, the number of component layers can be reduced, and the height of the imaging unit can be reduced. In addition, since the light-emitting element driving component or the electronic component that is the signal processing component is not exposed on the substrate, there is little possibility that the electronic component built in the substrate is damaged or separated, and the manufacturing yield. Can be improved.

  In the imaging unit of the present invention, the substrate is composed of a single substrate. Furthermore, in the imaging unit of the present invention, at least one surface of the solid-state imaging element and the light emitting element is built in the substrate so as to be exposed in the same plane as one surface of the substrate. Features.

  With such a configuration, the number of layers of the substrate and parts constituting the imaging unit can be reduced, the imaging unit can be further reduced in height, and assembly workability can be improved.

  In the imaging unit of the present invention, a transparent member is disposed on the subject side of the solid-state imaging device, and the transparent member is built in the substrate. Furthermore, in the imaging unit of the present invention, the transparent member is the imaging lens.

  With such a configuration, the number of component layers can be reduced, the imaging unit can be reduced in height, and in the process after the solid-state image sensor is mounted on the substrate, the shape of the light-receiving area of the solid-state image sensor It is possible to prevent dust from adhering to the substrate, and the yield is improved.

  The invention described above is not limited to each embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Furthermore, each embodiment includes various stages of the invention, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in each embodiment, this constituent requirement can be obtained when the described effect can be obtained for the problem to be solved by the invention. A configuration in which is deleted can be extracted as an invention.

Sectional drawing of the capsule endoscope apparatus with which the imaging unit which concerns on 1st Embodiment was incorporated Sectional drawing which shows the structure of an imaging unit typically Sectional drawing which shows typically the structure of the imaging unit which concerns on 2nd Embodiment. Sectional drawing which shows typically the structure of the imaging unit which concerns on 3rd Embodiment. Sectional drawing which shows the structure of the imaging unit of a modification similarly

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Capsule type endoscope apparatus 2 ... Imaging unit 3 ... Signal processing circuit unit 4 ... Battery 5 ... RF unit 6 ... Outer case 7 ... Outer frame member 8 .. Front cover 10... Lens unit 11... Lens holding frame 12... First objective lens 13. ... Bump electrode 18 ... Cover glass 20 ... Solid-state imaging device unit 21 ... First substrate 22 ... Second substrate 24 ... LED driving component 25 ... LED
29 ... Flexible printed circuit board 31 ... Electronic component built-in circuit board

Claims (5)

A solid-state imaging device on which a subject image is formed by an imaging lens;
A light emitting element for illuminating the subject;
A light-emitting element driving component for driving and controlling the light-emitting element;
A signal processing component that performs driving and signal processing of the solid-state imaging device; and
At least one substrate to which the solid-state imaging device, the light emitting device, the light emitting device driving component, and the signal processing component are electrically connected;
With
An imaging unit, wherein at least one of the light emitting element driving component and the signal processing component is built in the substrate.   The imaging unit according to claim 1, wherein the substrate is constituted by a single substrate.   The at least one surface of the said solid-state image sensor and the said light emitting element is incorporated in the said board | substrate so that it may be located in the same surface as one surface of the said board | substrate, and it may expose. Imaging unit.   The imaging unit according to claim 1, wherein a transparent member is disposed on the subject side of the solid-state imaging device, and the transparent member is built in the substrate.   The imaging unit according to claim 4, wherein the transparent member is the imaging lens.

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