JP2009239233A - Substrate drying apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate drying apparatus having satisfactory reproductivity of a process by separately providing a line for heating. <P>SOLUTION: A control section 91 places a substrate W to which a droplet of demineralized water, or the like has adhered in a treatment tank 9, before allowing a shower nozzle 17 to supply a dry medium. The droplet of the demineralized water, or the like adhering to the substrate W is removed by the physical force of the droplet of the dry medium. In this case, the substrate W is completely covered with the dry medium. Before air is heated by an inline heater 59 and is supplied to the shower nozzle 17 to dry the substrate W, gas is discharged to a gas exhaust pipe 77 while the inline heater 59 is operating, thus discharging the heated air via the gas exhaust pipe 77 without supplying into the chamber 1, and hence preventing the temperature of the chamber 1 from rising naturally and achieving satisfactory reproducibility of a process. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate drying apparatus that supplies a liquid drying medium to a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device (hereinafter simply referred to as a substrate) and performs a drying process.

  Conventionally, a silicon substrate used for solar cells, compound semiconductors, reticles, etc., a compound semiconductor, a glass substrate, a substrate on which a lens for a mobile phone camera is formed, a CCD array substrate, etc. are first washed and dried. As a device of the above, a processing tank for storing a processing liquid for drying, a chamber for sealing the periphery of the processing tank, a pump for decompressing the inside of the chamber, a gas supply source for supplying gas into the chamber, and a gas supply source Some include a heating unit that heats the supplied gas (for example, see Patent Document 1).

  Further, as a second apparatus, a processing tank for storing a processing liquid for drying, a chamber for sealing the periphery of the processing tank, a gas supply source for supplying gas into the chamber, and a gas supplied from the gas supply source There is a thing provided with the heating part which heats (for example, refer to patent documents 2).

In these apparatuses, a drying process is performed as follows.
That is, the substrate to which the pure water droplets are attached is carried into the chamber, placed in the treatment tank, and immersed in the treatment liquid for drying. Furthermore, the heating operation of the heating unit is started and gas is supplied from the gas supply source into the chamber, and the gas in the chamber is replaced with heated air. Thereafter, the substrate is pulled upward from the processing tank, and the drying processing liquid is discharged from the processing tank. Thereafter, the pump is operated to depressurize the chamber. Thereby, the thin film of the very thin processing liquid for drying remaining on the surface of the substrate is evaporated. Thereafter, with the pump stopped and the heating unit stopped, gas is introduced from the gas supply source into the chamber, the decompression in the chamber is released, and the substrate is carried out of the chamber.
JP 2001-1444065 A Japanese Patent No. 3557601

However, the conventional example having such a configuration has the following problems.
That is, after the substrate is carried into the chamber, the gas in the chamber is replaced and the supply of the heated gas in the chamber at the time of pulling up the substrate shares the supply line. May rise naturally and may lead to poor process reproducibility due to inability to manage.

  Further, when the drying medium is discharged or when the atmosphere in the chamber is opened to the atmosphere, the gas supplied to the chamber does not need to be heated and may be at room temperature, but since the heated gas has already been supplied before that, the temperature rises due to residual heat. End up. Therefore, the process reproducibility may deteriorate as described above.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate drying apparatus with good process reproducibility by separately providing a line for warming up.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is a substrate drying apparatus for performing a substrate drying process, a chamber capable of holding the inside in a sealed space, a processing tank disposed in the chamber and containing the substrate, and a liquid A supply nozzle for supplying the drying medium into the processing tank, a gas supply pipe for supplying gas to the supply nozzle, and a heating means disposed in the gas supply pipe for heating the circulating gas. An exhaust line for exhausting the gas in the chamber, a gas exhaust pipe having one end connected to the downstream side of the heating means in the gas supply pipe and the other end connected to the exhaust line, and the supply nozzle A control means for supplying a drying medium, heating the heating means and supplying the dry nozzle to the supply nozzle, and discharging the gas from the gas supply pipe to the gas exhaust pipe in a state where the heating means is operated; And it is characterized in that it comprises.

  [Operation / Effect] According to the first aspect of the present invention, the control means causes the drying medium to be supplied from the supply nozzle after placing the substrate on which droplets of pure water or the like have been deposited on the processing tank. Liquid pickling such as pure water adhering to the substrate is removed by the physical force of the droplets of the drying medium. At this time, the substrate is completely covered with the drying medium. Next, before the gas is heated by the heating means and supplied to the supply nozzle to dry the substrate, the gas is discharged to the gas exhaust pipe while the heating means is operated. Accordingly, the heated gas is not supplied into the chamber but is discharged from the gas supply pipe through the gas exhaust pipe, so that the temperature of the chamber does not rise naturally and the process reproducibility is improved. it can.

  In the present invention, the control means may be configured so that the heating means is operated from the gas supply means while discharging the drying medium supplied from the supply nozzle and staying in the processing tank. Preferably, the gas is discharged from the gas supply pipe to the gas exhaust pipe (claim 2). After the drying medium supplied from the supply nozzle and staying in the processing tank is discharged, the substrate is dried with heated gas.If warming is performed at this timing, the warming can be shortened and energy loss is reduced. Can be minimized.

  In the present invention, the drying medium is preferably a mixture of a volatile liquid and a surfactant (claim 3). It is possible to efficiently replace the droplets attached to the substrate.

  According to the substrate drying apparatus of the present invention, the control unit causes the drying medium to be supplied from the supply nozzle after placing the substrate on which droplets such as pure water are attached in the processing tank. Liquid pickling such as pure water adhering to the substrate is removed by the physical force of the droplets of the drying medium. At this time, the substrate is completely covered with the drying medium. Next, before the gas is heated by the heating means and supplied to the supply nozzle to dry the substrate, the gas is discharged to the gas exhaust pipe while the heating means is operated. Therefore, since the heated gas is not supplied into the chamber but is exhausted through the gas exhaust pipe, the temperature of the chamber does not rise naturally, and the process reproducibility can be improved.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a block diagram illustrating a schematic configuration of a substrate drying apparatus according to an embodiment.

  The substrate drying apparatus includes a chamber 1 that can seal an internal space. The chamber 1 includes a container main body 3 having a transport port at the top and a pair of covers disposed on the top of the container main body 3 and includes an auto cover 5 that opens and closes the transport port of the container main body 3. A drain port 7 is formed at the bottom of the container body 3.

  A processing tank 9 for storing a processing liquid such as a dry medium that is a liquid is disposed inside the chamber 1. The processing tank 9 is an overflow-type tank, and is configured to receive a cassette 11 that stores a plurality of substrates W in an upright posture. A QDR valve 13 is disposed at the rear portion (back side in the paper surface direction) of the processing tank 9. The processing liquid discharged from the QDR valve 13 is quickly discharged through the liquid discharge port 7. At the bottom of the processing tank 1, one ejection pipe 15 for supplying a processing liquid such as a drying medium that is a liquid from below the substrate W is disposed. Note that the cassette 11 contains a substrate W that has been subjected to pure water cleaning in another processing unit.

  A pair of shower nozzles 17 is disposed above the interior of the chamber 1. These shower nozzles 17 supply a liquid dry medium in the form of a shower toward the substrate W accommodated in the cassette 11 in the processing tank 9. Further, an exhaust port 19 for exhausting the internal gas is formed on one side surface of the chamber 1.

  The pair of shower nozzles 17 corresponds to the “supply nozzle” in the present invention.

  The drying medium tank 21 stores a drying medium that is a liquid. As the drying medium that is a liquid, for example, a mixed liquid of a volatile liquid and a surfactant is preferable from the viewpoint of droplet replacement efficiency. Specifically, a mixed liquid of hydrofluoroether (HFE) and isopropyl alcohol (IPA) can be given. The mixing ratio is, for example, 95% by weight of hydrofluoroether and 5% by weight of isopropyl alcohol.

  Note that the volatile liquid in the drying medium is a liquid having a viscosity lower than that of pure water, no direct reaction with the substrate W (not relatively active), and a specific gravity greater than that of pure water or lighter. For example, a material other than the above-mentioned drying medium can be substituted. Moreover, in order to make the explosion-proof structure of an apparatus unnecessary, it is so preferable that flammability is low. Fluorine-based fluoroethanol, fluorooctane, glycol ether, hydrofluorofluorocarbon (HFC), hydrochlorofluorocarbon (HCFC), hydrocarbon-based paraffinic hydrocarbon, chlorine-based methylene chloride, trichlorethylene satisfying the above conditions Perchloroethylene (also called PCE or tetrachloroethylene), 1-bromopropane as a bromine-based solvent, ethers, glycols, glycol ethers, organic solvents, alcohols, ethylene carbonates, glycerins and the like. In addition, examples of the surfactant in the drying medium include all surfactants, alcohols, and organic solvents that do not have a problem of contamination.

  The supply port 23 of the drying medium tank 21 and the pair of shower nozzles 17 are connected in communication by a supply pipe 25. In the supply pipe 25, a circulation pump 27, a filter 29, an on-off valve 31, and a flow rate control valve 33 are arranged in this order from the upstream side. The supply pipe 25 is also connected to the ejection pipe 15 via a supply branch pipe 35. The supply branch pipe 35 is provided with a flow rate control valve 37. The filter 29 removes particles and the like in the circulating drying medium, and the circulation pump 27 sends out the drying medium in the drying medium tank 21.

  A branch portion 39 is provided at one portion of the supply pipe 25. An extension pipe 41 is disposed at the branch portion 39. The extension pipe 41 is provided with a return pipe 43 and a first waste liquid pipe 45. The return pipe 43 is connected in communication with the drying medium tank 21. The first waste liquid pipe 45 is connected in communication with a drainage processing unit (not shown). An opening / closing valve 47 is attached to the return pipe 43, and an opening / closing valve 49 is attached to the first waste liquid pipe 5.

  One end side of the gas supply pipe 51 is further connected to the branch portion 39 in communication. The other end side is connected in communication with a supply source of air or nitrogen gas. A flow rate control valve 53, a flow meter 55, a filter 57, an inline heater 59, and on-off valves 61 and 63 are attached to the gas supply pipe 51 in order from the upstream side. The filter 57 removes particles contained in the air or nitrogen gas, and the in-line heater 59 heats the circulating air or nitrogen gas to a predetermined temperature. The flow rate control valve 53 is opened when supplying heated dry air, which will be described later, or supplying heated nitrogen gas. The flow rate at that time is preset in consideration of the volume of the chamber 1 and the like. ing. The flow rate is, for example, 100 liters per minute or more. The heating temperature by the in-line heater 59 is determined in advance in consideration of the time required for drying, and the temperature is, for example, about 30 to 50 ° C. The control unit 91 described later finely adjusts the opening degree of the flow control valve 53 so as to correct the deviation from the target flow value based on the measurement value of the flow meter 55.

  One end side of the exhaust port 19 is connected to the other end of the exhaust pipe 65 that is connected to an exhaust system facility (not shown). The exhaust pipe 65 is provided with an on-off valve 67 and a cooler 69 from the upstream side. Although the cooler 69 will be described in detail later, it has a function of cooling the exhausted gas.

  The in-line heater 59 corresponds to “heating means” in the present invention, the exhaust pipe 65 corresponds to “exhaust line” in the present invention, and the control unit 91 corresponds to “control means” in the present invention.

  One end side of the tank exhaust pipe 71 is connected to the exhaust pipe 65, and the other end side is connected to the drying medium tank 21. Further, the recovery port 73 of the cooler 69 and the drying medium tank 21 are connected in communication by a recovery pipe 75.

  In the exhaust pipe 65, a gas exhaust pipe 77 is connected in communication with the downstream side of the cooler 69 and between the on-off valves 61 and 63 of the gas supply pipe 51. An open / close valve 79 is disposed in the gas exhaust pipe 77.

  A drainage pipe 81 is connected to the drainage port 7. The drainage pipe 81 is branched into a second waste liquid pipe 83 and a recovery drainage pipe 85. The second waste liquid pipe 83 is connected in communication with a drain processing section (not shown). The recovery drainage pipe 85 is connected in communication with the drying medium tank 21. An opening / closing valve 87 is attached to the recovery drainage pipe 85, and an opening / closing valve 89 is attached to the recovery drainage pipe 85.

  The opening / closing operation of the auto cover 5, the opening / closing operation of the QDR valve 13, the operation of the circulation pump 27, the opening / closing operation of the opening / closing valve 31, the flow rate adjustment of the flow control valves 33, 37, the opening / closing operation of the opening / closing valves 47, 49, the flow control. The control unit 91 controls the flow rate of the valve 53, the temperature adjustment of the in-line heater 59, the opening / closing operation of the on-off valves 61, 63, 67, the cooling operation of the cooler 69, and the opening / closing operation of the on-off valves 79, 87, 89. It is controlled. In FIG. 1, in order to make the block diagram easy to see, all the connections between the control target and the control unit 91 are partially omitted.

  Next, the above-described cooler 69 will be described with reference to FIG. FIG. 2 is a longitudinal sectional view showing a schematic configuration of the cooler.

  The cooler 69 includes a container 93, a plate-like member 95, and a refrigerant circulation tube 97. The container 93 has an inlet 99 in which the exhaust pipe 65 on the exhaust outlet 19 side and the tank exhaust pipe 71 are connected in communication, and an exhaust pipe 65 on the exhaust system facility (not shown) side on the side facing the inlet 99. An outflow port 101 connected in communication is formed. In addition, a recovery port 73 is formed in the container 93. The plate-like member 95 has a plurality of through holes (not shown) and is made of a material having high thermal conductivity. These plate-like members 95 have a refrigerant circulation tube 97 wound around them.

  In the refrigerant circulation tube 97, a cooling medium is circulated to cool the plate-like member 95. As the refrigerant, cooling water or cooled brine is used. The temperature should just be the temperature which can condense the gaseous phase of a cooling medium, for example, is about 2-3 degreeC. The temperature of the exhaust gas flowing into the cooler 69 is about 30 to 50 ° C, and when it passes through the cooler 69, it is cooled to about 5 to 6 ° C. The dry medium in the exhaust gas cooled and condensed is returned to the dry medium tank 21 from the recovery port 73 through the recovery pipe 75. Since the plate-like member 95 having a large surface area is cooled by the refrigerant flow tube 97, the vapor phase of the drying medium can be efficiently condensed and allowed to flow down to the recovery port 73.

  Next, the above-described drying medium tank 21 will be described with reference to FIG. FIG. 3 is a longitudinal sectional view showing a schematic configuration of the dry medium storage tank.

  The drying medium tank 21 includes a first storage unit 103, a second storage unit 105, and a third storage unit 107 in order from the right side of FIG. The drying medium tank 21 includes two partitions 109 and 111 inside. The partition 109 is erected from the bottom surface and partitions only the lower space while the upper space between the first storage portion 103 and the second storage portion 105 is in communication. However, a large number of through holes 113 having a size that does not allow passage of fragments or the like of the substrate W are formed. The first storage unit 103 is a space for supplying a new liquid of the drying medium and for sending the drying medium through the supply pipe 25 by the circulation pump 27.

  The second space 105 and the third space 107 are partitioned only by the upper space while the lower space is in communication with the partition 111 suspended from the ceiling surface. A space between the partitions 109 and 111 is the second storage unit 105. A return pipe 43, a recovery drain pipe 85, and a recovery pipe 75 are connected to the third storage unit 107 so as to recover the drying medium. A tank exhaust pipe 71 is connected in communication, and the volatilized dry medium is exhausted to the cooler 69 together with the gas. Furthermore, one end side of the third waste liquid pipe 115 is connected to be connected slightly below the liquid level in the third reservoir 107. The other end side is connected in communication with a drainage processing unit (not shown).

  The drying medium tank 21 is configured as described above, and a new liquid of the drying medium is sent directly from the first storage unit 103 to the supply pipe 25 by the circulation pump 27. On the other hand, the dry medium collected from each part is gravity-separated according to the specific gravity of the liquid in the third storage unit 107, and only a heavy thing, that is, the dry medium flows to the second storage unit 105. The fragments of the substrate W that may be contained therein are removed by the partition 109 and distributed to the first storage unit 103. In addition, since the light liquid gravity-separated in the 3rd storage part 107, for example, the pure water mixed in the collect | recovered dry medium and the pure water mixed with isopropyl alcohol are light compared with a dry medium, And stays in the third reservoir 107. The supernatant is drained through the third waste liquid tube 115. Therefore, even if a droplet such as pure water flows in, it is separated by gravity separation, so that it is possible to prevent the droplet from entering the first storage unit 103 in the dry medium tank 21.

  Next, the operation of the substrate drying apparatus described above will be described with reference to FIGS. FIG. 4 is a flowchart showing the operation, and FIG. 5 is a schematic diagram showing a change in the surface state of the substrate during the process. (A) is hydrophilic and (b) is hydrophobic. It is.

  It is assumed that the substrate W to be processed has already been subjected to pure water cleaning processing by another apparatus and is accommodated in the cassette 9 in a state where droplets of pure water are attached. It is assumed that the on-off valves 31, 37, 47, 49, 61, 63, 67, 79, 87, 89 are closed. Further, the ejection pipe 15 is not used in the following processing examples.

Step S1
The control unit 91 opens the auto cover 5, loads the substrate W together with the cassette 9 into the chamber 1 by a loading mechanism (not shown), and places the cassette 9 in the processing tank 9. And the auto cover 5 is closed and the inside of the chamber 1 is sealed.

  When the surface state of the substrate W is hydrophilic, the surface state of the substrate W at this time is a state in which the entire surface of the substrate W is covered with pure water droplets DD as shown in FIG. It is. On the other hand, when the surface state of the substrate W is hydrophobic, some portions of the surface of the substrate W are exposed as shown in FIG. 5B, and a part of the surface of the substrate W is a pure water droplet DD. It is in a covered state.

Step S2
The controller 91 opens the flow rate control valve 33 at a predetermined flow rate, opens the on-off valve 31, and further activates the circulation pump 27. Thus, the drying medium is supplied in a shower form from the pair of shower nozzles 17 over the entire surface of the substrate W. The supply time of the drying medium shower is about 10 to 60 seconds. The supply time may be a time that allows the pure water droplet DD adhering to the surface of the substrate W to flow physically and sufficiently cover the entire surface of the substrate W.

  Since the surface condition of the substrate W immediately after this includes a surfactant in the drying medium, even if the surface condition of the substrate W is hydrophilic or hydrophobic, the drying state shown in FIGS. As shown after the medium shower, the pure water droplet DD is completely replaced by the dry medium DL, and the entire surface of the substrate W is covered with a thin film of the dry medium DL.

Step S3
After the supply time described above has elapsed, the control unit 91 stops the circulation pump 27, closes the flow rate control valve 33, and closes the on-off valve 31. The drying medium that has flowed down to the bottom of the processing tank 9 due to the supply described above remains in the lower part of the processing tank 9. Therefore, the supply of the drying medium is finished, and the QDR valve 13 and the opening / closing valve 89 are opened, and the remaining drying medium is recovered from the recovery drain pipe 85 to the drying medium tank 21. Further, the on-off valve 47 is opened, and the dry medium remaining in the supply pipe 25 is collected in the dry medium tank 21 through the return pipe 43. The time required for this recovery is, for example, about 50 to 60 seconds. When the collection is finished, the control unit 91 closes the QDR valve 13 and the on-off valves 47 and 89. Thus, since the drying medium supplied to the processing tank 9 can be recovered from the recovery drainage pipe 85 to the drying medium tank 21, consumption of the drying medium can be further suppressed.

The control unit 91 causes the following processing to be performed in parallel with the above-described discharge and collection of the dry medium.
That is, the on-off valves 61 and 79 are opened, and the flow control valve 53 is opened so as to have a predetermined flow rate. Further, the inline heater 59 is operated so that the heating temperature of the air becomes a predetermined value. The air having a predetermined flow rate is heated to a predetermined temperature by the in-line heater 59 and further discharged from the exhaust pipe 65 to the exhaust system facility (not shown) through the gas exhaust pipe 77. Thereby, warming can be performed in which the gas supply pipe 51 is heated to a predetermined temperature in advance.

Step S4
The controller 91 opens the flow rate control valve 33 and the on-off valves 63 and 67 and closes the on-off valve 79. Thereby, the heated air discharged through the exhaust pipe 77 is supplied from the pair of shower nozzles 17 toward the substrate W through the supply pipe 25. The thin film of the dry medium DL remains not only covering the entire surface of the substrate W but also covering the surfaces of the respective parts inside the chamber 1. Further, the drying medium stays in the chamber 1 as saturated vapor (gas phase). The heated air evaporates and replaces the saturated vapor of the drying medium, and evaporates and replaces a thin film of the drying medium DL that has thinly covered the surface of the substrate W. The time required for this evaporation / replacement is about 50 to 180 seconds including processing of a portion where a droplet tends to stay such as a corner of the cassette 11. However, it is about 10 seconds for the substrate W alone. The state after this processing is shown in the lowermost part of FIGS. 5 (a) and 5 (b).

The following process is performed with the supply of heated air described above.
The gas in the chamber 1 is discharged through the cooler 69 through the exhaust pipe 65. In the cooler 69, the plate-like member 95 is cooled by the refrigerant at 2 to 3 ° C. Vapor pressure is reduced up to. Therefore, the drying medium is condensed and recovered from the exhaust gas including the gas phase of the drying medium, and is recovered to the drying medium tank 21 through the recovery pipe 75. At the same time, the dry medium volatilized inside the dry medium tank 21 is also collected in the same manner.

  Note that the collected drying medium is gravity separated in the third storage unit 107 in the drying medium tank 21 and waste other than the drying medium is discarded, so that the purity of the drying medium is not lowered.

Step S5
After the processing described above, the control unit 91 opens the auto cover 5 and unloads the substrate W together with the cassette 9 out of the chamber 1 by a loading mechanism (not shown).

  By the series of processes described above, the substrate W to which the pure water droplets are attached is dried. This drying process is completed in about 2 to 6 minutes. Since the conventional apparatus requires about 8 to 16 minutes, the drying process can be dramatically shortened.

  According to the above-described embodiment apparatus, the control unit 91 causes the drying medium to be supplied from the shower nozzle 17 after placing the substrate W to which the droplet DD such as pure water is attached on the processing tank 9. The liquid removal DD such as pure water adhering to the substrate W is removed by the physical force of the droplets of the drying medium DL. At this time, the substrate W is completely covered by the drying medium DL. Next, before the substrate W is dried by supplying air to the shower nozzle 17 while heating the air with the inline heater 59, the gas is discharged to the gas exhaust pipe 77 in a state where the inline heater 59 is operated. Accordingly, the heated air is not supplied into the chamber 1 but is exhausted through the gas exhaust pipe 77, so that the temperature of the chamber 1 does not naturally rise and the process reproducibility can be improved. .

  Since the substrate W is dried with heated air after the drying medium supplied from the shower nozzle 17 and staying in the processing tank 9 is discharged, warm air can be shortened and energy loss is minimized. can do.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the embodiment described above, warming of the air supply line is performed when the drying medium is discharged, but warming may be performed before this. Even if it does in this way, there exists the same effect.

  (2) In the embodiment described above, heated air is supplied into the chamber 1, but heated nitrogen gas may be supplied.

  (3) In the above-described embodiment, the substrate W is stored in the processing tank 9 together with the cassette 11. However, the substrate W may be stored in the processing tank 9 while being placed on the transfer arm instead of the cassette 11. Good.

  (4) In the embodiment described above, the drying medium is supplied in a shower form, but may be supplied in an overflow form.

It is a block diagram which shows schematic structure of the board | substrate drying apparatus which concerns on an Example. It is a longitudinal cross-sectional view which shows schematic structure of a cooler. It is a longitudinal cross-sectional view which shows schematic structure of a drying medium tank. It is a flowchart which shows operation | movement. It is a schematic diagram which shows the change of the surface state of the board | substrate in a process, (a) is a hydrophilic thing, (b) is a hydrophobic thing.

Explanation of symbols

W ... Substrate 1 ... Chamber 3 ... Container body 5 ... Auto cover 9 ... Processing tank 11 ... Cassette 13 ... QDR valve 17 ... Shower nozzle 21 ... Drying medium tank 27 ... Circulation pump 65 ... Exhaust pipe 75 ... Recovery pipe 85 ... Recovery exhaust Liquid pipe 71… Tank exhaust pipe

Claims (3)

In a substrate drying apparatus that performs substrate drying processing,
A chamber capable of holding the inside in a sealed space;
A treatment tank disposed in the chamber and containing a substrate;
A supply nozzle for supplying a drying medium, which is a liquid, into the processing tank;
A gas supply pipe for supplying gas to the supply nozzle;
A heating means disposed in the gas supply pipe for heating the circulating gas;
An exhaust line for exhausting the gas in the chamber;
A gas exhaust pipe in which one end side communicates with the downstream side of the heating means in the gas supply pipe and the other end side communicates with the exhaust line;
Before supplying the drying medium from the supply nozzle and heating the gas by the heating means and supplying the gas to the supply nozzle, the gas is discharged from the gas supply pipe to the gas exhaust pipe with the heating means activated. Control means for causing
A substrate drying apparatus comprising: The substrate drying apparatus according to claim 1,
The control means is configured to discharge gas from the gas supply pipe to the gas exhaust pipe while operating the heating means while discharging the drying medium supplied from the supply nozzle and staying in the processing tank. A substrate drying apparatus for discharging. The substrate drying apparatus according to claim 1 or 2,
The substrate drying apparatus, wherein the drying medium is a mixture of a volatile liquid and a surfactant.

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