JP2009224933A - Lc serial circuit component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LC serial circuit component which is improved in assembly property, is impervious to vibration, is suited to mounting on a metal board. <P>SOLUTION: The LC serial circuit component is provided with: a capacitor 1 for leading lead wire 11 and 12; a core member 2 (2A and 2B) which composes at least one inductor installed so that it may insert the lead wire or may insert a conductor connected to the lead wire when assembled; and a resin material 4 which encircles and integrates the capacitor and the core member so that a tip part of the lead wire is exposed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an LC series circuit component that can be preferably used for, for example, a power supply circuit.

Conventionally, boosted power systems and step-down power systems convert voltage by charging and discharging energy to inductors. Recently, however, systems that charge energy to capacitors and convert voltages have been proposed, for example, switched capacitors. Some type DC / DC converter devices perform power conversion by transferring power by switching the energy charged in a capacitor (see, for example, Patent Document 1). In such a capacitor power conversion system, a capacitor for charging energy is composed of an LC series circuit for improving efficiency, and realizes high efficiency by resonance operation. Conventionally, this circuit has been assembled by mounting a power inductor (L) and a power capacitor (C) on a printed circuit board as respective components, or by directly wiring or screwing to a bus bar or cable.
Also, in order to reduce the amount of metal substrate used, it is necessary to improve the mounting density. As a technique for increasing the efficiency of mass production / higher mounting density, at least one capacitor lead wire is provided on the magnetic body. A hybrid component that has been penetrated through the formed through hole has been proposed (see, for example, Patent Document 2).

JP 2006-262619 A (5th page, FIG. 1, FIGS. 7 to 9) Japanese Utility Model Publication No. 61-9829 (page 2, Fig. 2)

In the LC series circuit components used in the power circuit as described in Patent Document 1 above, because large current is used, the size of components such as capacitors and inductors and the wiring become thick. Problems occurred, and it was not suitable for mass production. For this reason, it has been difficult to disseminate widely. In addition, recent improvements in metal substrate technology have allowed large currents to flow on the metal substrate, and electronic circuit parts including semiconductor switches have been placed on the metal substrate, improving productivity and assembly. ing. Capacitors and inductors can also be mounted on the same metal substrate, but the components L and C are required to be suitable for surface mounting, and since they are arranged in a plane, the metal substrate has a large area. Necessary. Therefore, although the assemblability is improved, since an expensive metal substrate is used per unit area, the component cost is high and it is generally difficult to disseminate it.
Furthermore, in the converter of Patent Document 1, the power that can be supplied is determined by the operating frequency and the capacitor capacity, and the efficiency is greatly influenced by the current effective value. Therefore, the resonant frequency is increased, the current effective value is decreased, and the capacitor The design should keep the capacitance lower, but if the supply power is large, the value of the capacitor will inevitably increase, and the value L of the inductor will be

Where f ₀ : resonance frequency, L: inductance value, C: capacitor capacity,
From Equation 1 above, as shown in Equation 2 below,
L = 1 / {(2πf ₀ ) ² · C} Expression 2
Therefore, there is a tendency to require a low inductance. However, since the supplied power is large, the circuit current becomes large, and the core to be used requires a large current and a low inductance. The core members that make up such an inductor are characterized by long gaps and a wide effective cross-sectional area. They are large and heavy, so they are easily affected by vibrations like capacitors. There was a problem that it was difficult.

  Further, in the technique such as Patent Document 2, although it is suitable for improvement in mounting density on a printed circuit board and mass production such as assemblability and the like, the cost at the time of assembly can be suppressed. When used in such a switched capacitor type DC / DC converter device, the capacitor has to have a large capacitance value and is physically enlarged. As an assembly form at this time, in the case of the structure shown in the same document, since the capacitor does not have a support even if it is a slight vibration (for example, 1G), a strong stress is applied to the connection part. There was a risk of failure such as breakage. In addition, due to the necessity of flowing a large current through these elements, the inductor has a dynamic change in inductance characteristics due to core saturation and the like, which may deteriorate the element characteristics of the LC and change circuit constants.

  The present invention has been made in order to solve the above-described problems of the prior art, and it is possible to obtain an LC series circuit component that is improved in assemblability, resistant to vibration, and suitable for mounting on a metal substrate. It is aimed.

  The LC series circuit component according to the present invention comprises a capacitor from which a lead wire is derived and an inductor provided so that the lead wire can be inserted or a conductor connected to the lead wire can be inserted during assembly. And at least one core member and a resin material that surrounds and integrates the periphery of the capacitor and the core member so that a tip end portion of the lead wire is exposed.

  According to the present invention, since the core member and the capacitor constituting the inductor are integrally formed of the resin material, it is possible to improve the assembling at the time of mounting and improve the vibration resistance characteristics. Is obtained. Further, the configuration is simple, and it is easy to configure in various shapes according to the mode of the attached member, and it is easy to arrange three-dimensionally when mounting or to mount on a metal substrate.

Embodiment 1 FIG.
1 and 2 are diagrams for explaining an LC series circuit component according to Embodiment 1 of the present invention. FIG. 1 is a perspective view schematically showing an LC series circuit component, wherein (a) shows a first example and (b) shows a second example. FIG. 2 is a diagram for explaining a preferred arrangement (a) and an undesirable arrangement (b) of the conductor with respect to the gap when the gap-attached core member shown in FIG. 1 is used. In FIG. 1A, an LC series circuit component 10 includes a radial lead structure capacitor (capacitor element or a capacitor with a simple coating, etc.) 1 in which a plurality of lead wires 11 and 12 protrude upward in the figure. A cylindrical core member 2 with a gap 2 a made of a magnetic material inserted through the lead wire 12, a case (LC case) 3 for housing the capacitor 1 and the core member 2, and a capacitor 1 filled in the case 3. And a resin material (filler) 4 having moisture resistance and / or vibration resistance, in which the core member 2 is integrally molded. In each drawing, in order to facilitate understanding of the configuration, the case 3 and the resin material 4 are displayed transparently for the sake of convenience, and the case 3 shows a ridge line portion.

A gap G is provided between the upper surface 1 a of the capacitor 1 and the lower surface of the core member 2, and the resin material 4 as a filler is densely filled into the internal space A of the core member 2 through the gap G. And the attachment part 31 which has the through-hole 31a for fixing to a board | substrate, a structural member, etc. at the time of mounting is protrudingly provided by the lower part of both sides of the figure of case 3 which comprises an exterior body. The leading ends of the lead wires 11 and 12 protrude from the upper surface of the case 3 as connecting portions 11a and 12a.
As the resin material 4 as the filler, for example, various known thermosetting resins can be used without any particular limitation, but the coefficient of thermal expansion is adjusted for the purpose of preventing the core member 2 from being damaged due to a difference in thermal expansion. However, it is preferable to blend one type or a plurality of types of fillers, and the heat cycle resistance and power cycle performance of the obtained LC series circuit component 10 can be improved. Further, by using a filler having good thermal conductivity as the resin material 4, heat dissipation is improved in response to heat generation of the capacitor 1 and heat generation of the core member 2. Further, by using a resin material having high heat resistance as the resin material 4, it is possible to prevent the insulation performance of the resin material 4 from being deteriorated or damaged by the heat generated at the time of joining such as soldering or welding.

  Further, by using a resin material with good fluidity that can be filled without gaps to the gap portion of the core member 2, the gap 2 a portion of the core member 2 or the gap G portion between the lead wires 11 and 12 of the capacitor 1 and the core member 2. Since it becomes easy to fill the internal space A of the core member 2, it is possible to prevent the lead wires 11, 12 due to vibration and the breakage of a conductor such as a bus bar described later. Further, by inserting a plate material (not shown) such as a mylar sheet having a low relative permeability into the gap 2a of the core member 2 and filling the gap 2a in advance, the gap change of the core member 2 due to temperature change is minimized. It becomes possible to suppress to. Further, as the case 3, generally, a resin insulating material can be preferably used. However, after ensuring insulation to the capacitor 1, the lead wires 11, 12, the core member 2, the wiring bus bar, and the like. By using a metal case, it is possible to improve the heat dissipation characteristics of heat accumulated in the case 3 and to obtain an electromagnetic shielding effect.

  Moreover, when a current passes through the conductor passed through the core member 2 with the gap 2a at a frequency exceeding approximately 50 kHz, heat is generated due to the electromagnetic induction heating phenomenon, and unexpected copper loss may occur. Therefore, in such a case, consideration is given to the positions of the lead wires 11 and 12 of the capacitor 1 and the bus bar so that no conductors are arranged in the region B around the gap 2a of the core member 2 shown by the oblique lines in FIG. It is desirable to set the position of the gap 2a or the direction of the conductor. Specifically, the forbidden area is an oval area including an inner portion of the gap 2a and its periphery, the upper and lower semicircular portions in the drawing indicated by R = t / 2 when the gap length is t. B. Desirably, conductors such as lead wires 11 and 12 and bus bars are disposed outside the hatched area B. FIG. 2A shows a preferred example, and FIG. 2B shows an arrangement to be avoided. In addition, when a toroidal core is used as the core member 2, since there is no gap, the above-described electromagnetic induction overheating phenomenon hardly occurs, and the above consideration is unnecessary.

  In the first example of the first embodiment configured as described above, the LC series circuit component 10 has the core member 2 with a gap inserted into the lead wire 12 of the capacitor 1 and is stored in the case 3 which is the exterior. It can be easily manufactured by filling the resin material 4 and sealing with resin. Since the lead wire 12 of the capacitor 1 is inserted through the core member 2 with a gap, the inductance characteristic is an inductor composed of one core member 2, which is equivalent to one in which a conductor is wound around the core. is there. Therefore, equivalently, when the capacitance of the capacitor 1 is C and the inductance of the core member 2 is L1, the LC series circuit is configured as shown in the lower part of FIG. Further, the LC series circuit component 10 has moisture resistance and vibration resistance because the core member 2 is surrounded and integrated by the resin material 4 together with the lead portions of the capacitor 1 and the lead wires 11 and 12. In addition, regarding the core member 2, you may use the thing without a gap.

  Further, the attachment portion 31 can be set at an arbitrary place depending on the device to be incorporated. Furthermore, the shape of the attachment portion 31 is not limited to the shape protruding from the side as shown in FIG. 1A. For example, the engagement portion for assembling a part of the outer surface of the case 3 with a metal band or the like. Alternatively, an engaging part using a snap fit may be provided, and the engaging part may be used as an attachment part. Furthermore, the case 3 does not necessarily have to be provided. For example, the capacitor 1 and the core member 2 may be integrally cast with the resin material 4 using a mold such as a mold. In that case, the resin material 4 itself forms the outer surface of the LC series circuit component 10. Further, the attachment portion 31 and the like can be integrally formed at an arbitrary position by the resin material 4.

  On the other hand, in the second example of the first embodiment shown in FIG. 1B, core members 2A and 2B with gaps are inserted into both of the lead wires 11 and 12 of the capacitor 1, respectively, and the case 3 which is an exterior is inserted. After the storage, the resin is sealed in the same manner as in the first example to form the LC series circuit component 10A. The inductance characteristics of the LC series circuit component 10A in FIG. 1B is a core having a double cross-sectional area, so that the inductance is equivalent to that obtained by winding two turns of a conductor around the core. , LCL in series, but when the inductance L1 by the core member 2A and the inductance L2 by the core member 2B are equivalent, the inductor (L1 + L2) and the capacitance C are equivalently shown in the lower part of FIG. An LC series circuit composed of a series body of capacitors is formed. Since the core members 2A and 2B can be appropriately changed in the same manner as in the first example, for example, those without gaps can be used, and the description thereof will be omitted.

  As described above, the LC series circuit component 10 (10A) of the first embodiment is inserted into the capacitor 1 from which the plurality of lead wires 11 and 12 are led out and one or both of the lead wires 11 and 12. The core member 2 (core members 2A and 2B) constituting the inductor provided in the case 1, the case 3 accommodating the capacitor 1 and the core members 2 (2A and 2B), and the leading ends of the lead wires 11 and 12 are exposed. In particular, it is suitable for use in a large current circuit such as a power conversion circuit provided with a resin material 4 surrounding and integrating the capacitor 1 and the core member 2. According to the first embodiment, the LC series circuit component 10 (10A) can be easily configured by inserting the core member 2 (2A, 2B) into any one or both of the lead wires 11, 12 at the time of manufacturing the capacitor. it can.

  In addition, since the core member 2 (2A, 2B) and the capacitor 1 can be handled as a single functional component that is solidified integrally, the assembling work is made efficient, the assembling time can be shortened, and the mass production can be handled. . Moreover, since the connection parts 11a and 12a are derived | led-out above the case 1, it becomes easy to set it as a three-dimensional structure arrangement | positioning by 3D structure arrangement | positioning, especially bus-bar wiring. Further, since the resin material 4 is integrally molded, vibration resistance can be improved. In particular, when applied to LC series resonant circuits, the generation of losses due to resistance components related to wiring, such as wiring busbars, wiring resistance of printed circuit boards, connection resistance generated at connections to printed circuit boards, etc. is reduced, and bus bar inductance is reduced. Since it can be minimized, remarkable effects such as improvement in circuit performance can be obtained.

  In addition, since the inductance can be designed under a condition corresponding to the allowable ripple current of the capacitor 1, both the capacitor and the inductor can be configured under a suitable design condition. And since the case 3 is provided with the attachment part 31 for the purpose of attachment to to-be-attached members, such as a structure, assembly property and vibration resistance can be ensured. In addition, since the gap G is provided between the capacitor 1 and the core member 2, the resin material 4 as a filler can be filled up to the internal space A of the core member 2, and the lead wires 11 and 12 are securely connected. The stress applied to the lead wires 11 and 12 can be reduced. In addition, in the second example shown in FIG. 1B, the effective area of the inductor is about twice that in the first example, so that the inductor design value that can prevent saturation of the inductor in a large current operation is obtained. It is also possible to take Therefore, both the capacitor and the inductor can be configured with suitable design conditions both structurally and electrically.

Embodiment 2. FIG.
FIG. 3 is a perspective view conceptually showing an LC series circuit component particularly suitable for a power circuit according to Embodiment 2 of the present invention. Note that the same reference numerals denote the same or corresponding parts throughout the drawings, and redundant descriptions are omitted. In the figure, a core member 2C made of a magnetic material used for the LC series circuit component 10B includes an E-shaped first member 21 having a middle leg 21a, and an I arranged with a gap with respect to the first member 21. The lead wires 11 and 12 are formed of a split core composed of a second member 22 having a letter shape, and lead out upward from the capacitor 1 in the same manner as in the first embodiment. It arrange | positions so that it may penetrate each to the window part 21b. Note that the configuration, manufacturing method, and the like of the case 3 that accommodates the capacitor 1 and the core member 2C and the resin material 4 that molds the case 3 are the same as those in the first embodiment, and thus description thereof is omitted.

  The LC series circuit component 10B according to the second embodiment configured as described above is an inductor composed of one core as an inductance characteristic, which is equivalent to that wound around the core for one turn, and is equivalent. As shown in the lower part of FIG. 2, an LC series circuit of L1 and C is configured. In addition, regarding the core member 2C which consists of a split core, it is not limited to EI type | mold, Combination type cores, such as EE type | mold, can be selected suitably and can be used. Also, there may be no gap. In the second embodiment, in order to manage the gap with high accuracy, a core shape having a middle foot 21a is used. The gap can be managed with high accuracy by cutting the middle foot 21a in the manufacturing process. One of the features is that variation in characteristics is suppressed. Further, by providing a gap G between the capacitor 1 and the core member 2C, the resin material 4 as the filler can be filled into the window 21b of the core member 2C, and the lead wires 11 and 12 are securely fixed. Therefore, the stress applied to the leads 11 and 12 is reduced. Moreover, the attachment part 31 provided in the case 3 ensures the assemblability and vibration resistance when attached to the structure.

  As described above, according to the second embodiment, since the combination type core member 2C having the middle leg 21a such as the EI type is used as the core member constituting the inductor, the middle leg of the core member 2C can be cut. The gap can be managed with high accuracy, and the inductance characteristics can be maintained with higher accuracy than in the first embodiment. For this reason, the inductance value according to the allowable condition of the capacitor 1 can be designed with high accuracy, and the remarkable effect that the optimum condition for both the capacitor and the inductor can be realized with little variation in characteristics even in mass production. Similarly to the first embodiment, since the capacitor 1 having a radial lead structure is used, it is easy to assemble three-dimensionally in the height direction, and the mounting area of components can be reduced. Similar effects can be obtained.

Embodiment 3 FIG.
4A and 4B are perspective views schematically showing an LC series circuit component according to Embodiment 3 of the present invention. FIG. 4A shows a first example, and FIG. 4B shows a second example. The LC series circuit component 10C according to the first example shown in FIG. 4A includes a core member 2 without a gap inserted in the lead wire 11 of the capacitor 1 having an axial lead structure led out in the left-right direction in the figure. And is sealed in the same manner as in the first embodiment by the resin material 4. The case 3 is formed in an elongated rectangular parallelepiped shape, and the lead wire connecting portions 11a and 12a of the LC series circuit component 10C are led out in the same direction straight from the capacitor 1 to the lead wires 11 and 12 of the capacitor 1. Attachment portions 31 for attachment to the body are provided at both ends, and assembling property and vibration resistance are ensured. The inductance characteristic of the LC series circuit component 10C is an inductor composed of one core, which is equivalent to one in which a conductor is wound around the core.

  On the other hand, in the LC series circuit component 10D according to the second example shown in FIG. 4B, the core members 2A and 2B without gaps are inserted into both of the lead wires 11 and 12 led from the capacitor 1 in the axial direction. In the same manner as in the first example, the case 3 is housed and resin-sealed. Inductance characteristics are a core having a double cross-sectional area. Therefore, the inductance is equivalent to two series of conductors wound around the core, and the configuration is an LCL series configuration. Specifically, for example, an LC series circuit is formed as in the example of FIG. In addition, about the core member 2 (2A, 2B), you may use a thing with a gap. Moreover, the attachment part 31 is not limited to the place and shape shown in FIG. 4, and can be configured in any place and shape according to the device to be incorporated. Further, the gap G is provided between the capacitor 1 and the core member 2 (2A, 2B), so that the resin material 4 is filled up to the inside of the core member, etc., as in the first embodiment.

  According to the third embodiment configured as described above, the case 3 has a structure in which the core member 2 (2A, 2B) is inserted into the lead wires 11 and 12 of the capacitor 1 having the axial lead structure and the leads are taken out in the axial direction. In addition, since the resin material 4 is filled and solidified, since it has an axial structure, planar arrangement is possible and the height direction of the parts can be reduced. Furthermore, since it is possible to make the shortest wiring in the longitudinal direction as compared with the first embodiment, a high-density arrangement is possible when a large number of LC series circuit components are used. Therefore, both the capacitor and the inductor can be configured with suitable design conditions both structurally and electrically. In the second example shown in FIG. 4B, the effective area of the inductor is about twice that in the first example shown in FIG. It becomes possible to take inductor design values that can be prevented.

Embodiment 4 FIG.
FIG. 5 is a perspective view conceptually showing an LC series circuit component for a power circuit according to Embodiment 4 of the present invention, where (a) shows a first example and (b) shows a second example. In the fourth embodiment, the lead wires 11 and 12 led to the left and right of the capacitor 1 having the axial lead structure are bent at a predetermined portion at a right angle in the downward direction in the figure, and the bent lead wires 11 and 12 are vertically moved. A core member 2 (2A, 2B) with a gap is inserted into the extending portion so as to have a gap with respect to the capacitor 1, stored in a case 3 which is an exterior, and sealed with a resin material 4. Note that the LC series circuit component 10E according to the first example has one core member 2 attached to only one lead wire 11 as shown in FIG. 5A, and the LC series circuit according to the second example. As shown in FIG. 5B, the component 10 </ b> F has core members 2 </ b> A and 2 </ b> B attached to both the left and right lead wires 11 and 12, respectively. In addition, since the core member 2 can use the thing without a gap here, since the other structure is the same as that of the said Embodiment 1, description is abbreviate | omitted.

  In the fourth embodiment configured as described above, in addition to obtaining the same effects as those of the first embodiment, the size in the height direction is suppressed as compared with the first embodiment. Since it can be preferably used in three-dimensional wiring with other components, particularly in a hierarchical arrangement in which components are arranged below the LC series circuit components, high-density mounting is possible. Therefore, both the capacitor and the inductor can be configured with suitable design conditions both structurally and electrically. Further, in the second example illustrated in FIG. 5B, the effective cross-sectional area of the inductor is approximately twice that of the first example in FIG. It is possible to take an inductor design value that can prevent the above.

Embodiment 5 FIG.
6 to 9 are diagrams for explaining an LC series circuit component according to Embodiment 5 of the present invention, and FIG. 6 shows a positional relationship when the LC series circuit component is assembled to a board on which a conductor composed of a bus bar is erected. 7 is a perspective view schematically showing, FIG. 7 is a perspective view schematically showing a modified example in the case where the assembled portion shown in FIG. 6 is a structural member, and FIG. 8 is a position of the core member shown in FIG. FIG. 9 is a perspective view schematically showing a third modification when the position of the core member shown in FIG. 6 is further changed. is there. In the first to fourth embodiments, the core member 2 (2A, 2B) is inserted into the lead wire 11 (12) led out from the capacitor 1, whereas in the fifth embodiment, The conductor 6 (6A, 6B) such as a bus bar erected on the printed board 5 or the like on the attached member side is inserted into the through holes 32A, 32B of the core member 2 (2A, 2B) so as to constitute an inductor. It is what. In FIG. 6, an LC series circuit component 10 </ b> G includes a radial lead structure capacitor 1 housed in the center of the case 3, and cylindrical core members 2 </ b> A and 2 </ b> B respectively disposed on both sides of the capacitor 1. The capacitor 1 is made of a resin material 4 filled so as to surround the core members 2A and 2B, and a through-hole penetrating the center of the core members 2A and 2B vertically at a position corresponding to the core members 2A and 2B 32A and 32B are provided, respectively.

  As shown in FIG. 6, the lead wires 11 and 12 of the capacitor 1 are led out from the capacitor 1 main body in the radial direction, and then approximately −90 in the directions of the axial centers O and P of the through holes 32A and 32B outside the case 3. When the tip reaches the through-holes 32A and 32B, the tip is further bent by + 90 ° (−90 °) in a direction substantially parallel to the axial centers O and P. The portions are formed as connecting portions 11a and 12a with conductors 6A and 6B constituting a bus bar protruding at a predetermined position such as the printed board 5 on the attached member side. The bases of the conductors 6A and 6B are provided with stress relaxation means 61 in which a material such as a copper plate constituting the conductors 6A and 6B is bent into, for example, a zigzag shape or a continuous S-curve shape.

  In addition, the LC series circuit component 10H according to the modification of FIG. 7 is configured by the through holes provided in the four corners of the case 3 with the attachment portions 31A, and the LC series circuit component 10H having the attachment portions 31A includes: A step is provided with respect to the fixing portion 7a for the printed circuit board 5 provided on the attached member 7 made of a structural member such as a case or a frame, and the three-dimensional assembly is assembled to the fixing portion 7b provided at a predetermined height. Others are substantially the same as FIG. Further, the LC series circuit component 10I according to the second modification shown in FIG. 8 has two core members 2A and 2B arranged in parallel to the side portion of the capacitor 1 to shorten the interval between the core members 2A and 2B. Further, the LC series circuit component 10J according to the third modification shown in FIG. 9 is arranged such that the two core members 2A and 2B are inclined at one side and the other side of the capacitor 1. It is.

  In the fifth embodiment configured as described above, the LC series circuit component is illustrated such that the conductors 6A and 6B protruding on the printed board 5 pass through the through holes 32A and 32B of the core members 2A and 2B. And is fixed to the printed circuit board 5 by a fastening band or the like not shown in the examples of FIGS. In the modification of FIG. 7, a fastener such as a bolt is inserted into the attachment portion 31 </ b> A and fixed to the fixing portion 7 b of the attached member 7. In either case, the LC series circuit is formed by connecting the conductors 6A and 6B and the connecting portions 11a and 12a of the lead wires 11 and 12 by soldering, welding, clip joining, or the like. The stress relaxation means 61 has a function of absorbing various mechanical vibrations or stress due to heat cycles. The printed circuit board 5 is not particularly limited, but for example, a metal board having a high heat dissipation effect can be preferably used. In this case, a power component (power MOS-FET or the like) is provided on the board. Since it can be mounted, a higher-performance power circuit can be configured. Further, when the interval between the conductors 6A and 6B protruding on the printed circuit board 5 is narrow, or when the conductors 6A and 6B are provided at an oblique position, the second modification shown in FIG. By using the third modified example shown, it can be similarly efficiently mounted.

  As described above, according to the fifth embodiment, the conductors 6A and 6B such as bus bars protruding from the printed circuit board 5 and the like are assembled and connected so as to penetrate the through holes 32A and 32B of the LC series circuit components. Since the LC series circuit can be configured simply by connecting the portions 11a, 12a and the conductors 6A, 6B, the assembly can be performed efficiently and the time required for the assembly process can be shortened. In addition, the core members 2A and 2B and the conductors 6A and 6B can be handled as separate members until they are assembled, so that they can be easily assembled into the peripheral structural members, and the three-dimensional assembly is facilitated, and the vibration resistance is greatly improved. To do. In addition, when applied to an LC series resonance circuit, it is easy to reduce the loss caused by resistance components related to wiring, such as wiring busbars, wiring resistance of printed circuit boards, and connection resistance generated at connections to printed circuit boards. Thus, the performance of the circuit is improved. Further, a remarkable effect that the bus bar wiring resistance and the bus bar inductance can be minimized can be obtained. Further, since it can be easily mounted by being lifted from the printed circuit board 5 by a spacer, a step of the structural member, etc., it becomes easy to prevent interference with other components mounted on the printed circuit board 5, and a plurality of floors are built. With the structure, the mounting area can be further reduced.

  Further, particularly in the modified example of FIG. 7 and the like, the attachment portion 31A is formed by a through-hole, so that it can be firmly assembled to the structural member, so that it is suitable for in-vehicle devices such as automobiles and railway vehicles that are severely oscillated. Can be used for Further, since the stress relaxation means 61 is provided on the conductor 6 (6A, 6B) installed on the printed circuit board 5 or the like, even when the vibration conditions of the LC series circuit component and the printed circuit board are different, the connection portion is broken, etc. Physical failure can be prevented. In addition, since the inductance can be designed electrically under a condition corresponding to the allowable ripple current of the capacitor, there is an unprecedented effect that both the capacitor and the inductor can be configured under a suitable design condition. In FIG. 6, one capacitor 1 and two core members 2 </ b> A and 2 </ b> B are arranged. However, the number of core members may be one if necessary. In addition, in the modification of FIG. 7, only one LC series circuit component is configured, but two or more circuits can be configured in series or arranged in parallel. Improvement and miniaturization become possible.

  Further, by arranging the two core members 2A and 2B so as to be adjacent to each other as shown in FIG. 8, it is easy to match the component arrangement pitch on the printed board or the metal board, and as shown in FIG. By arranging the two core members 2A and 2B so as to cross each other, the current loop on the printed circuit board and the current loop of the LC circuit component can be matched. In the example shown in FIGS. 6 to 9, as compared with the first embodiment, as shown in the assembly structure example in FIG. 7, it is easy to attach to the structural member to be attached, and the beam structure. It can also serve as a beam. In addition, since assembly can be performed from above, for example, assembly by an odd-shaped component automatic machine is possible, and mass production is easy. The core members 2A and 2B in FIG. 8 can also have a core shape having a middle leg as in the third embodiment, and the gap can be managed with high accuracy by cutting the middle leg. At this time, the inductance is equivalent to the one wound around the core.

Embodiment 6 FIG.
10 and 11 are diagrams showing LC series circuit components for power circuits according to Embodiment 6 of the present invention, and FIG. 10 is a position when the LC series circuit components are assembled to an insert mold component in which a bus bar is erected. FIG. 11 is a perspective view schematically showing a state after the LC series circuit component shown in FIG. 10 is assembled to the insert mold component. In the figure, the LC series circuit component 10K is configured similarly to the fourth embodiment shown in FIG. The attached member 7A to which the LC series circuit component 10K is assembled is an insert mold part. The attached member 7A has wiring necessary for connection to the outside such as an output terminal (both not shown), The conductors 6A and 6B, which are bus bar wirings for configuring inductors connected to the connection portions 11a and 12a of the LC series circuit component 10K, and the bus bars 8 which are wirings to the printed circuit board 5 are insert-molded. Further, necessary components (not shown) are mounted on the printed board 5 (a metal board may be used), and connection portions 51 and 52 with the bus bar 8 are provided on the upper surface.

  When assembling to the above-mentioned member 7A to be attached, the member to be attached 7A composed of the printed circuit board 5 and the insert mold component is assembled, wiring to the printed circuit board 5 is performed, and then the member to be attached 7A is projected. The LC series circuit component 10K is inserted into the conductors 6A and 6B, which are provided bus bars, from the upper part of the figure and fixed to the attachment member 7A with a fastener such as a bolt (not shown), and then the LC series circuit component 10K. The connection parts 11a, 12a and the conductors 6A, 6B are soldered, joined by welding, clip joining, etc. to complete the LC series circuit. The height of the mounted member 7A needs to be larger than the height of various electronic components (not shown) mounted on the printed circuit board 5, but the LC series circuit component 10K is assembled. Needless to say, the height of the mounted electronic components may be higher than the height of the mounted member 7A at the portions that do not interfere with each other when attached. Further, by using a metal substrate having a high heat dissipation effect as the printed circuit board 5, it is possible to mount power components (such as a power MOS-FET) on the substrate, and it is possible to further increase productivity.

  As described above, according to the sixth embodiment, since it is possible to assemble a bus bar thicker than that of the printed circuit board 5 to the attached member 7A made of insert mold parts, the wiring resistance can be greatly reduced. It becomes possible, and when applied to an LC series resonant circuit, the performance of the circuit is further improved. Further, since the LC series circuit component 10K is a structural member, it can be firmly assembled to the mounted member 7A, and can be used in automobile equipment, electric railway equipment and the like having severe vibration conditions. Furthermore, compared to the fifth embodiment, since it is not necessary to attach the conductors 6A and 6B constituting the bus bar to the printed circuit board 5, it is not necessary to manage the positioning accuracy of the bus bar when assembling the board, and the assemblability is further improved. improves. Further, the stress relaxation means 61 can be easily provided on the conductors 6A and 6B, and the vibration conditions of the LC series circuit component 10K and the printed board 5 or the mounted member 7A made of insert mold components and the conductors 6A and 6B are different. Even in the case, physical failure such as breakage of the connecting portion can be prevented. In addition, since the inductance can be designed electrically according to the conditions according to the allowable ripple current of the capacitor, both the capacitor and the inductor can be configured under suitable design conditions.

  In FIG. 10, one capacitor and two core members are arranged, but the number of core members may be determined according to the required number, for example, one. FIG. 10 illustrates a configuration in which only one LC series circuit component 10K is assembled. However, two or more circuits may be configured in series or arranged in parallel. In this case, the mounting density is further increased. This improves the size and enables downsizing. Also, as shown in FIG. 8 according to the fifth embodiment, a plurality of core members 2A and 2B can be arranged adjacent to each other, or can be arranged as shown in FIG. It goes without saying that various changes, modifications, and combinations are possible, such as the current loop on the printed circuit board and the current loop of the LC series circuit component can be matched as necessary.

It is a perspective view which shows typically the LC series circuit component by Embodiment 1 of this invention, (a) shows a 1st example, (b) shows a 2nd example. The figure explaining the preferable arrangement | positioning (a) of a conductor with respect to a gap when using the core member with a gap shown by FIG. 1, and unfavorable arrangement | positioning (b). It is a perspective view which shows typically the LC series circuit component by Embodiment 2 of this invention, (a) shows a 1st example, (b) shows a 2nd example. It is a perspective view which shows conceptually the LC series circuit component by Embodiment 3 of this invention, (a) shows a 1st example, (b) shows a 2nd example. It is a perspective view which shows notionally LC series circuit components by Embodiment 4 of this invention, (a) shows a 1st example and (b) shows a 2nd example. The perspective view which shows typically the positional relationship when LC serial circuit components by Embodiment 5 of this invention are assembled | attached to the board | substrate with which the conductor which consists of bus bars was installed. The perspective view which shows typically the modification in case the to-be-assembled part shown by FIG. 6 is a structural member. The perspective view which shows typically the 2nd modification at the time of changing the position of the core member shown by FIG. The perspective view which shows typically the 3rd modification at the time of changing further the position of the core member shown by FIG. The perspective view which shows typically the positional relationship when the LC series circuit component by Embodiment 6 of this invention is assembled | attached to the insert mold component in which the bus-bar was erected. FIG. 11 is a perspective view schematically showing a state after the LC series circuit component shown in FIG. 10 is assembled to an insert mold component.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 capacitor | condenser, 1a upper surface, 11, 12 lead wire, 11a, 12a connection part, 2, 2C core member, 2a gap, 21 1st member, 21a middle leg, 21b window part, 22 2nd member, 3 case (LC case) ), 31, 31A mounting portion, 31a through hole, 32A, 32B through hole, 4 resin material (filler), 5 printed circuit board, 6 (6A, 6B) conductor, 61 stress relaxation means, 7, 7A attached member, 7a, 7b fixed part, 10, 10A-10K LC series circuit component, G gap, A internal space.

Claims (12)

  A capacitor from which a lead wire is derived, at least one core member constituting an inductor provided so that the lead wire can be inserted or a conductor connected to the lead wire can be inserted when assembled, and the lead An LC series circuit component comprising: the capacitor and a resin material that surrounds and integrates the periphery of the capacitor and the core member so that a tip end portion of the wire is exposed.   The LC series circuit component according to claim 1, wherein the core member is provided so as to surround the lead wire and is embedded in the resin material.   3. The LC series circuit component according to claim 1, wherein the capacitor comprises an axial lead structure capacitor.   4. The LC series circuit component according to claim 3, wherein a tip portion of the lead wire is led out from the resin material in an axial direction.   4. The LC series circuit component according to claim 3, wherein the lead wire is bent in an orthogonal direction from a lead-out portion of the capacitor, and the core member is provided in the bent portion.   In the resin material, a through hole for inserting the conductor is formed at a position corresponding to the core member in the resin material, and an inductor is configured by the conductor and the core member. The LC series circuit component according to claim 1.   The tip of the lead wire of the capacitor is extended to a central axis portion of the through hole, and a connection portion with the conductor is provided at the tip of the lead wire. LC series circuit components.   8. The LC series circuit component according to claim 1, wherein the capacitor is a capacitor having a radial lead structure.   The LC series circuit component according to any one of claims 1 to 8, wherein the core member includes a toroidal core or a core with a gap.   9. The LC series circuit component according to claim 1, wherein the core member includes a split core having a middle leg.   11. The LC series circuit component according to claim 1, further comprising a case that accommodates the capacitor and the core member, wherein the LC series circuit component is molded with the resin material.   The LC series circuit component according to claim 11, wherein a mounting portion is formed on the case.

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