JP2009224744A - Soldering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve problems that a rotary blade is rotated at a high speed since a conventional melted-solder bath is of an impeller jet flow type, an oxide by an eddy current or the like is generated, and a jetting amount becomes instable by a pulsating flow by the eddy current or the like. <P>SOLUTION: In a solder bath body 1, a solder recovery tub 2, a sealed solder chamber 4, and a liquid feed cylinder 8 with a jetting port 3 which passes through the upper surface of the solder chamber 4 and is opened to the atmosphere at the tip are provided. Surplus melted solder which is the solder jetted from the jetting port 3 and not used for soldering flows on an inclined plate and accumulated in the solder recovery tub 2. On the lower surface of the solder recovery tub 2, a liquid supply cylinder 7 to which a check valve 9 is attached, and which communicates with the solder chamber 4 is provided. On the lower surface of the solder recovery tub 2, a replenishing cylinder 10 to which the check valve 9 is attached, and which communicates with the liquid supply cylinder 7 is provided. By injecting the solder in the solder recovery tub 2 through the liquid supply cylinder 7 to the solder chamber by a piston 11 which is a liquid feed means, the melted solder is made to pass through the liquid feed cylinder 8 and jetted from the jetting port 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a soldering apparatus for soldering a printed circuit board or the like.

  As shown in FIG. 6, a conventional impeller jet solder tank used for soldering a printed circuit board or the like has a motor a23 in the upper part of the solder tank, and a rotating blade in a casing 19 provided in the solder tank. 21, the motor a 23 and the rotating blade 21 are connected via a belt and a drive shaft 20. The rotating blade 21 (impeller) is rotated at a high speed, and the solder is sucked from the suction port 26 on the lower surface of the casing 19. Solder is ejected from a nozzle 24 (jet port) provided on the upper surface of the casing 19 by dynamic pressure, and the solder is supplied to the printed circuit board. (See Reference 1)

In recent years, lead-free solder has been obliged due to environmental problems, and alloys such as tin, silver, and copper have been used as solder.
Lead-free solder has a high tin content, a high melting temperature, and a problem of corrosion of the sliding portion as compared with conventional solder.
In the conventional impeller jet solder bath, it is necessary to replace components such as an impeller in a short period of less than one year.
In addition, lead-free solder is high in cost, resulting in a decrease in solder due to the generation of oxide due to high-speed rotation of the impeller, and a serious problem of increasing the cost due to solder consumption.

In general, many impeller jet solder baths are used, but other piston jet solder baths have been proposed. (Refer to Document 2)
This piston jet solder bath has a cylinder installed in the jet solder bath.
The lower part of the cylinder is connected to the lower part of the jet nozzle by a duct, and when the piston in the cylinder is pushed down, molten solder existing in the cylinder is pushed into the duct and jetted from the jet nozzle.
Compared to the impeller jet solder bath, the sliding portion is less corroded and oxides are generated, and the piston is pushed down at a constant speed, so that the pulsation is reduced.
Further, a piston jet type with improved productivity has been proposed. (See Reference 3)

  JP 2003-290916 A   JP-A-49-70849   JP 2002-43732 A

  The conventional impeller jet solder bath rotates the rotating blade 21 by the motor a23, sucks the solder from the suction port 26 on the lower surface of the casing 19, and secures a certain distance in the casing 19 in the flow direction by strong dynamic pressure. The configuration is such that solder is ejected from the raised nozzle 24.

In order to generate a strong dynamic pressure, the rotating blade 21 rotates at a high speed, and there is a problem in that oxides are generated due to vortex or the like and solder is reduced.
Further, there is an example in which troubles such as the rotation of the rotating blades 21 due to adhesion of foreign particles such as sludge adhere to the contact portion between the rotating blades 21 and the suction port 26 on the lower surface of the casing 19 occur.

  Further, in the impeller jet type, the molten solder is sucked by rotating the rotating blade 21, but the next blade sucks in the molten solder after one blade sucks in the molten solder. There is no suction between the wings and it becomes a pulsating flow. Due to the generation of the pulsating flow, the ejection amount becomes unstable, the ejection height from the nozzle 24 fluctuates, and the solder amount of soldering varies.

  In addition, as a countermeasure against corrosion, ceramic coating or the like is performed, but the coating material is peeled off due to the impact force at the high speed rotation of the rotating blade 21 or the wear of the sliding portion, etc., and corrosion is caused, and parts must be replaced. .

By the way, the piston-jet solder bath has an excellent feature that is not available in the impeller jet-type, in which the piston is pushed down at a constant speed, so that the pulsation is small.
However, in the piston jet solder bath, after the piston is pushed down and the molten solder is jetted from the nozzle, it takes time to raise the piston and fill the cylinder with molten solder, and wait until the next soldering is performed. There is a problem that productivity is poor due to long time, and it is not used much.
As a measure for improvement, a piston with an openable / closable valve has been proposed as in Document 3, but the piston mechanism is complicated and impractical, and the waiting time is slightly shortened. is there.
In addition, there are many problems such as a large piston due to the mechanism, a large amount of extrusion, and restriction of speed.
In addition, the lower part of the cylinder is connected to the lower part of the jet nozzle by a duct, and when the piston rises, the lower part of the cylinder becomes negative pressure and reverse flow occurs, sucking molten solder on the jet nozzle side and disturbing the nozzle height. is there.
Therefore, it is necessary to further reduce the vertical speed of the piston, and productivity is not improved.

  In addition, both the piston jet solder bath and the impeller jet bath have a problem in that the nozzle portion has a distance from the solder bath, so that the temperature is lowered by the outside air and the temperature of the solder discharged from the nozzle is oxidized.

  The present invention has been made to solve the above-mentioned problems, and prevents the generation of solder oxides, stabilizes the height and amount of ejection from the nozzle (ejection port), and eliminates corrosion troubles such as sliding parts. An object of the present invention is to provide a soldering apparatus which has good productivity and prevents oxidation of the solder surface discharged from the nozzle.

The soldering apparatus according to the present invention is as described in claim 1,
A hermetically sealed solder chamber filled with molten solder; a liquid feed pipe that penetrates the wall surface of the solder chamber and is connected to a jet outlet at the tip; and a solder collection tank that collects the molten solder ejected from the jet outlet A liquid supply cylinder that communicates with the solder recovery tank and the solder chamber and is provided with a check valve; and for supplying solder from the solder recovery tank to the liquid supply cylinder. A refill cylinder and a solder bath comprising
A piston is provided in the liquid supply cylinder as a liquid feeding means, and the piston reciprocates to inject solder from the solder recovery tank into the solder chamber.
The molten solder is ejected from the ejection port through the liquid feeding cylinder.

Moreover, as described in claim 2,
A hermetically sealed solder chamber filled with molten solder; a liquid feed pipe that penetrates the wall surface of the solder chamber and is connected to a jet outlet at the tip; and a solder collection tank that collects the molten solder ejected from the jet outlet A solder tank comprising two sets of liquid supply cylinders having a liquid suction port which communicates with the solder recovery tank and the solder chamber and has a check valve attached thereto,
As a liquid feeding means, a piston is provided inside each of the liquid supply cylinders, and the piston reciprocates in the opposite directions in the two liquid supply cylinders to inject the molten solder into the solder chamber. It is ejected from the ejection port through the liquid feeding cylinder.

Further, as described in claim 3,
A hermetically sealed solder chamber filled with molten solder; a liquid feed pipe that penetrates the wall surface of the solder chamber and is connected to a jet outlet at the tip; and a solder collection tank that collects the molten solder ejected from the jet outlet A liquid supply cylinder that communicates with the solder recovery tank and the solder chamber and is provided with a check valve; and for supplying solder from the solder recovery tank to the liquid supply cylinder. A refill cylinder and a solder bath comprising
As the liquid feeding means, the screw provided in the liquid supply cylinder, a rotating shaft of the screw, and a motor connected to the rotating shaft of the screw are provided, and the screw is rotated by the motor, thereby being in the solder recovery tank. Molten solder passes through the liquid supply cylinder and is supplied to the solder chamber via a check valve.

Further, as described in claim 4,
An ultrasonic vibrator is provided in the solder chamber, a high ultrasonic wave is applied to the molten solder in the solder chamber to add cavitation, and the molten solder is ejected from the ejection port through the liquid feeding tube.

Further, as described in claim 5,
A plurality of the liquid feeding cylinders are provided, and a height-adjustable cap is attached to the ejection port side of the liquid feeding cylinder so that the height at which the molten solder is ejected from the ejection port can be adjusted.

The effects of the inventions according to claims 1 and 2 will be described.
By filling the solder chamber by injecting the solder into the solder chamber by a liquid feeding means by moving the piston or the like, the molten solder passes through the liquid feeding cylinder and is ejected from a jet port open to the atmosphere.
Compared with a conventional method using a high-speed rotating jet such as an impeller jet impeller, there is no generation of oxides due to eddy currents and the like, and the decrease in solder is reduced, which is economical.
In addition, there is no trouble that the rotation of the rotary blade 21 stops due to powder such as scum (dross) and sludge adhering to the contact portion between the rotary blade and the suction port on the lower surface of the casing as in the prior art.

By filling the solder chamber by injecting the solder from the solder recovery tank by the liquid feeding means, the molten solder passes through the liquid feeding cylinder and is ejected from the air outlet.
The amount of the solder supplied by the liquid feeding means may be only the amount discharged from the ejection port, and small-scale driving is sufficient. Further, since the amount of inflow from the liquid supply cylinder is small compared to the solder volume of the solder chamber, there is almost no influence of disturbance.
Since a strong dynamic pressure is required, there is less pulsating flow compared to the impeller jet type that rotates at high speed, and the jet height at the jet port does not fluctuate, so the amount of soldering is stabilized.

Further, since there is no impact force due to the high-speed rotation of the conventional rotating blades and there is little wear on the sliding parts, the ceramics and the like are not peeled off and corrosion is unlikely to occur.
The frequency of parts replacement due to corrosion is low.
Maintenance of the solder bath is easy.

A liquid supply cylinder that communicates with the solder recovery tank and the solder chamber and has a check valve attached in the middle, and for supplying solder to the liquid supply cylinder from the solder recovery tank. An attached refilling cylinder is provided, and a piston moves up and down in the liquid supply cylinder to inject molten solder in the liquid supply cylinder into the solder chamber.
When the piston descends, the molten solder in the liquid supply cylinder is poured into the solder chamber through the check valve.
Since the check valve on the supply cylinder side is attached so as to prevent the flow from the liquid supply cylinder to the supply cylinder, it does not flow from the liquid supply cylinder to the solder recovery tank via the supply cylinder.
When the piston rises, the liquid supply cylinder becomes negative pressure, and the molten solder in the solder recovery tank passes through the supply cylinder via the check valve and is supplied to the liquid supply cylinder.
The check valve between the liquid supply cylinder and the solder chamber is installed so as to prevent the flow from the solder chamber to the liquid supply cylinder. Does not flow backwards.
Since the backflow does not occur when the piston moves up as in the conventional piston jet solder bath, the nozzle height is not disturbed, so the piston speed is not limited.
In addition, since a replenishment cylinder with a check valve attached in the middle is provided separately to replenish solder to the liquid supply cylinder, an openable / closable valve is provided on the piston for replenishment as in the conventional improvement example. Will be larger and will not be limited by speed.
Since the vertical speed of the piston can be increased, it takes time when the molten solder is jetted from the nozzle by pushing down the conventional piston and then the piston is lifted to fill the cylinder with molten solder. There is no problem of poor productivity due to long waiting time.

The effect of the invention according to claim 2 will be described.
After the piston is pushed down into the liquid supply cylinder and molten solder is injected from the collection tank into the solder chamber and filled, the piston is raised and the molten solder is filled into the liquid supply cylinder while filling the molten solder into the solder chamber. The injection stops.
By alternately injecting solder from two sets of liquid supply cylinders into the solder chamber and filling, one piston rises and the other piston descends while filling the molten liquid into the liquid supply cylinder. Is injected into the solder chamber.
The molten solder can be continuously poured from the collection tank into the solder chamber and filled.
The conventional piston jet solder bath takes a long time to push the piston down and jet the molten solder from the nozzle, then lift the piston and fill the cylinder with molten solder, until the next soldering There was a problem that the waiting time was long and productivity was low, but this problem is solved.
The liquid supply cylinder has a liquid suction port to which a check valve is attached, and can be supplied from the liquid suction port even if the piston speed is high.

The effect of the invention according to claim 3 will be described.
By rotating the screw, the molten solder in the solder recovery tank passes through the liquid supply tube and flows into the solder chamber through the check valve, and then the molten solder passes through the liquid supply tube and is released to the atmosphere. It is ejected from the spout.
The amount of the solder supplied by the liquid feeding means may be only the discharge amount from the ejection port, and a small-scale axial flow is sufficient, so high-speed rotation is not required.
Further, since the amount of inflow from the liquid supply cylinder is small compared to the solder volume of the solder chamber, there is almost no influence of disturbance.
Since a strong dynamic pressure is required, there is less pulsating flow compared to the impeller jet type that rotates at high speed, and the jet height at the jet port does not fluctuate, so the amount of soldering is stabilized.

A screw rotates in a liquid supply cylinder that communicates with the solder recovery tank and the solder chamber, and a check valve is attached midway, and continuously injects the molten solder in the liquid supply cylinder into the solder chamber.
As in the conventional piston jet solder bath, there is no occurrence of reverse flow when the piston is raised, and the nozzle height is not disturbed.

The effect of the invention according to claim 4 will be described.
An ultrasonic vibrator is provided in the solder chamber, and high ultrasonic waves are applied to the molten solder in the solder chamber to generate cavitation, destroying the oxide film by the cavitation effect, removing bubbles in the molten solder, and promoting wettability. .
The molten solder discharged from the nozzle (nozzle) does not have an oxide film and is well soldered so that high quality soldering can always be performed.
In addition, since cavitation can also promote diffusion and penetration, it can be used to solder molten solder onto glass parts, ceramic parts, etc., and to adhere paints, coating materials, etc. to metals, glass parts, ceramic parts, etc. Is also applicable.

When soldering a printed circuit board or the like, if a plurality of board terminals can be soldered at the same time, the efficiency will increase.
In such a case, it is possible to provide a plurality of liquid feeding cylinders. However, when the outflow speed from the jet outlet becomes slow, a difference in surface tension occurs due to the cross-sectional size of the liquid feeding cylinder, and the ejection height differs.
The height at which the molten solder is ejected from the ejection port can be adjusted by adopting a structure capable of adjusting the height on the ejection port side of the liquid feeding cylinder.

Hereinafter, each embodiment of the present invention will be described with reference to drawings of a soldering apparatus.
In each figure, the same or equivalent members and parts will be described with the same reference numerals.

FIG. 1 is an explanatory view of a plan view of the soldering apparatus 100, and FIG. 2 is an explanatory view of a cross section AA from the AA direction of FIG.
In the solder tank housing 1, there is a solder collection tank 2, a sealed solder chamber 4, and a liquid feeding cylinder 8 having a jet port 3 penetrating the upper surface of the solder chamber 4 and having a tip opened to the atmosphere.
The excessive molten solder that is not used for soldering by the solder ejected from the ejection port 3 flows through the inclined plate and accumulates in the solder recovery tank 2.
There are heaters 5 in the solder recovery tank 2 and the solder chamber 4, which are heated to about 300 ° C. to melt the solder.
Further, a heater 5 is also provided around the ejection port 3 so as to prevent a temperature drop of the molten solder during ejection.
A heat sensor 6 is incorporated in the solder recovery tank 2 and the solder chamber 4 to manage the temperature of the molten solder.
Since the solder is fixed at about 220 ° C. or less, the heater adjuster 15 energizes the electric wire 17 while measuring the temperature from the thermal sensor 6 and heats the solder to about 300 ° by the heater 5 to melt the solder.

On the lower surface of the solder recovery tank 2, there is provided a liquid supply cylinder 7 attached with a check valve 9 and communicating with the solder chamber 4.
The check valve 9 is attached so as to prevent the molten solder from flowing out of the solder chamber 4. The valve is closed by a spring to seal the solder chamber 4.
In addition, a replenishment cylinder 10 is provided on the lower surface of the solder recovery tank 2 and a check valve 9 is attached to communicate with the liquid supply cylinder 7.
The check valve 9 is attached so as to prevent the molten solder from flowing out from the liquid supply cylinder 7 to the solder recovery tank 2, and the valve is closed by a spring.
By injecting the solder in the solder recovery tank 2 into the solder chamber via the liquid supply cylinder 7 by the liquid supply means, the molten solder is discharged from the jet nozzle 3 through the liquid supply cylinder 8.

As liquid feeding means, a piston 11 and a shaft of the piston 11 and a solenoid 12 as a driving device for moving the piston up and down are provided.
A piston 11 that moves up and down in the liquid supply cylinder 7 is connected to a solenoid 12 that is a driving device via a shaft.
The solenoid 12 is provided with a spring 13.
The solenoid 12 employs a push type, and a plunger of a moving part inside the solenoid (not shown) is connected to the shaft and depresses the shaft when energized.
After being pushed down, the plunger becomes free and is returned to the origin by the spring 13.
By repeating this, the piston 11 connected to the shaft reciprocates up and down.
The molten solder in the solder recovery tank 2 is supplied to the solder chamber through the check tube 9 by the vertical movement of the piston 11 through the check valve 9.
The check valve 9 is attached so as to prevent outflow from the solder chamber 4, and the valve is closed by a spring to seal the solder chamber 4, but the flow from the liquid supply cylinder 7 by the piston 11 to the solder chamber 4 is closed. Is stronger than the sum of the spring force of the check valve 9 and the water head pressure in the solder chamber, so that the molten solder flows into the solder chamber 4.

The piston 11 sends out the molten solder inside the liquid supply cylinder 7 in the descending process.
In the ascending process, there is no backflow from the solder chamber 4, so that the inside of the liquid supply cylinder 7 becomes negative pressure.
On the lower surface of the solder recovery tank 2, a replenishing cylinder 10 is provided that is attached with a check valve 9 and communicates with the liquid supply cylinder 7.
The check valve 9 is attached so as to prevent inflow from the liquid supply cylinder 7 to the solder recovery tank 2, but flows from the solder recovery tank 2 to the liquid supply cylinder 7.
When the inside of the liquid supply cylinder 7 becomes negative pressure, the molten solder is supplied from the solder recovery tank 2 to the liquid supply cylinder 7 through the supply cylinder 10.

Thus, in Example 1,
This is a static pressure type in which molten solder is caused to flow into the solder chamber 4 by a piston motion, and the molten solder is caused to flow from the pilot hole of the liquid feeding tube 8 to be discharged from the ejection port 3. Different from the jet method.
There is no generation of oxides due to eddy currents, etc. and there is little decrease in solder, which is economical.
Further, since no vortex or cavitation occurs, no pulsating flow occurs, and the ejection height from the ejection port 3 does not fluctuate, so that the amount of soldering is stabilized.
Further, there are few problems due to wear of sliding parts such as impellers, and since coating materials such as ceramics are not peeled off due to wear of the sliding parts, corrosion hardly occurs and the frequency of parts replacement is low.

Further, since the check valve 9 between the liquid supply cylinder 7 and the solder chamber 4 is attached so as to prevent the flow from the solder chamber 4 to the liquid supply cylinder 7, it does not flow backward to the liquid supply cylinder.
The piston speed can be increased because a reverse flow does not occur and the nozzle height is not disturbed when the piston 11 ascends as in a conventional piston jet solder bath.
Further, in order to replenish solder to the liquid supply cylinder 7, a replenishment cylinder 10 having a check valve 9 attached in the middle thereof is separately provided. 11 becomes larger and is not subject to speed restrictions.
Since the vertical speed of the piston 11 can be increased, it takes time to fill the molten solder into the liquid supply cylinder 7 by raising the piston 11 after the piston 11 is pushed down and the molten solder is jetted from the nozzle as in the prior art. The problem that the waiting time until the next soldering is long and the productivity is low does not occur.
Although the solenoid 12 is used as the driving device for moving the piston 11 up and down, a combination of an air cylinder, a motor and a ball screw, a rack and pinion, and other gears such as a worm gear and a worm wheel may be used.

3 is an explanatory diagram of a plan view of the soldering apparatus 100 according to the second embodiment, and FIG. 4 is an explanatory diagram of a cross section BB from the BB direction of FIG.
Inside the solder recovery tank 2,
A liquid supply cylinder 8 having a sealed solder chamber 4, a jet port 3 penetrating the upper surface of the solder chamber 4 and having a tip opened to the atmosphere, a liquid suction port 14, and a check valve 9 are attached. Two sets of liquid supply cylinders 7 communicating with the solder chamber 4 are provided.
The solder in the solder recovery tank 2 is sucked from the liquid suction port 14 by the liquid feeding means and injected into the solder chamber 4 through the liquid supply cylinder 7, so that the molten solder is ejected from the jet outlet 3 through the liquid feeding cylinder 8. The
Further, excess molten solder that is not used for soldering by the solder ejected from the ejection port 3 is recovered in the solder recovery tank 2.

As a liquid feeding means, a motor 30 and a shaft connected to the shaft of the motor 30 and two cams 32 attached to the shaft are provided.
The two cams 32 having the same shape are eccentric with respect to the shaft, and are attached to each other at positions where the major diameter portions are shifted by 180 °.
The cam 32 is also rotated by the rotation of the motor 30, and the piston 11 descends inside the liquid supply cylinder 7 by hitting the head 33 of the shaft of the piston 11.
The molten solder in the liquid supply cylinder 7 is supplied to the solder chamber 4 by the lowering of the piston 11.
Since the cam 32 is eccentric and the distance from the rotation axis changes due to the rotation, the head 33 is returned to its original position by the spring 13 after being hit.
The piston 11 sends out the molten solder inside the liquid supply cylinder 7 in the descending process.
In the ascending process, the check valve 9 prevents the solder in the solder chamber 4 from flowing back, so the inside of the liquid supply cylinder 7 becomes negative pressure.
The solder recovery tank 2 communicates with the liquid supply cylinder 7 to which the liquid suction port 14 and the check valve 9 are attached.
The check valve 9 is attached so as to prevent inflow from the liquid supply cylinder 7 to the solder recovery tank 2, but flows from the solder recovery tank 2 to the liquid supply cylinder 7.
When the inside of the liquid supply cylinder 7 becomes a negative pressure, the molten solder in the solder recovery tank 2 is supplied to the liquid supply cylinder 7 from the liquid suction port 14.

There are two combinations of the piston 11 and the cam 32, and the two eccentric cams 32 have a long diameter portion that is shifted from the center of the shaft by 180 °.
When one piston 11 descends and reaches the lower limit, another piston 11 moves in the opposite direction to rise and reach the upper limit.
When one of the pistons descends and then rises after supplying the solder chamber 4, another piston 11 begins to descend and feeds the solder chamber 4.
One of the pistons 11 always feeds the solder chamber 4 by the rotation of the motor 30.
Since the rotation speed of the motor 30 can be adjusted, it is possible to discharge the solder from the ejection port 3 by changing the ejection speed.

Incidentally, a vibration box 34 provided with a vibrator is provided on the bottom surface of the solder chamber 4.
When a high voltage is applied to the vibrator by the oscillator 35, ultrasonic vibration is generated.
By applying a high ultrasonic wave to the molten solder in the solder chamber to add cavitation and ejecting the molten solder from the ejection port 3, the generation of the oxide film on the surface can be prevented.
In addition, it is known that soldering by applying ultrasonic vibration to molten solder has an effect of improving wettability, and soldering is improved and quality is improved.

Thus, in Example 2,
Two sets of cams 32 and pistons 11 that are shifted by 180 ° from the center of the shaft are provided, and the solder in the collection tank 2 can be continuously injected into the solder chamber through the liquid supply cylinder 7 by the rotation of the motor 30. .
After the conventional piston 11 is pushed down and molten solder is jetted from the nozzle, it takes time to raise the piston 11 and fill the cylinder with molten solder, and the waiting time until the next soldering is increased. Problems such as poor productivity do not occur.
Further, by providing the liquid supply cylinder 7, the solder chamber 4 and the like inside the solder recovery tank 2 and heating them integrally with the heater 5, the thermal efficiency can be increased.
The number of heaters can be reduced, power consumption can be reduced, and costs can be reduced.
Further, the handle 16 can be provided in the solder chamber 4 so that the internal device can be taken out in a lump, thereby improving the maintainability.
Moreover, an oxide film on the solder surface can be removed by applying ultrasonic waves.
In addition, by applying cavitation by ultrasonic waves, the effect of breaking oxide film, defoaming, promoting diffusion, and promoting penetration can be obtained.
It can be applied not only to soldering molten solder to glass parts and ceramic parts, but also to adhesion to iron such as paints and coating materials, glass parts and ceramic parts.
Although the drive device for moving the piston 11 up and down is a combination of the motor 30 and the cam 32, a combination of the motor 30 and a link mechanism, an air cylinder, a combination of a motor and a ball screw, or the like may be used.

FIG. 5 is an explanatory diagram of a cross section of the soldering apparatus 100 according to the third embodiment.
A screw 29, a rotating shaft of the screw 29, and a motor 30 connected to the rotating shaft are provided inside the liquid supply cylinder 7 as liquid feeding means.
By rotating the screw 29 via the rotating shaft by the motor 30, the molten solder in the solder recovery tank 2 is supplied to the solder chamber 4 through the liquid supply cylinder 7 and the check valve 9.
While increasing the internal pressure of the solder chamber 4 and causing the molten solder to flow out of the ejection port 3, excess molten solder accumulates in the solder recovery tank 2, and flows into the liquid supply cylinder 7 from the solder recovery tank 2 by the rotation of the screw 29. The liquid is forcibly supplied to the solder chamber 4.

A cap 31 is attached to the tops of the two liquid feeding cylinders 8 having different sizes.
The cap 31 can be moved up and down with a screw (not shown).
When the outflow speed from the jet port becomes slow, the surface tension differs depending on the cross-sectional size of the liquid feeding cylinder 8 and the jet height is different.
When the cap 31 is rotated, the height of the ejection port can be adjusted, and the height at which the molten solder is ejected from the ejection port can be adjusted.

  It is explanatory drawing of the top view of the soldering apparatus 100 in Embodiment 1 of this invention.   It is explanatory drawing in the cross section AA from the AA direction of FIG.   It is explanatory drawing of the cross section of the soldering apparatus 100 in Example 2. FIG.   It is explanatory drawing in the cross section BB from the BB direction of FIG.   It is explanatory drawing of the cross section of the soldering apparatus 100 in Example 3. FIG.   It is explanatory drawing of the cross section of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder tank housing 2 Solder collection tank 3 Spout 4 Solder chamber 5 Heater 6 Heat sensor 7 Liquid supply cylinder 8 Liquid supply cylinder 9 Check valve 10 Supply cylinder 11 Piston 12 Solenoid 13 Spring 14 Liquid inlet 15 Heater adjuster 16 Handle 17 Electric wire 18 Thermal controller 19 Casing 20 Drive shaft 21 Rotating blade 22 Air shut-off box 23 Motor a
24 Nozzle 25 Heat-resistant Seal Material 26 Suction Port 27 Molten Solder 28 Holding Member 29 Screw 30 Motor 31 Cap 32 Cam 33 Head 34 Vibration Box 35 Oscillator

Claims (5)

A hermetically sealed solder chamber filled with molten solder; a liquid feed pipe that penetrates the wall surface of the solder chamber and is connected to a jet outlet at the tip; and a solder collection tank that collects the molten solder ejected from the jet outlet A liquid supply cylinder that communicates with the solder recovery tank and the solder chamber and is provided with a check valve; and for supplying solder from the solder recovery tank to the liquid supply cylinder. A refill cylinder and a solder bath comprising
As a liquid feeding means, a piston is provided in the liquid supply cylinder, and when the piston reciprocates and molten solder is injected from the solder recovery tank into the solder chamber, the molten solder is ejected from the ejection port through the liquid feeding cylinder. A soldering apparatus characterized by that. A hermetically sealed solder chamber filled with molten solder; a liquid feed pipe that penetrates the wall surface of the solder chamber and is connected to a jet outlet at the tip; and a solder collection tank that collects the molten solder ejected from the jet outlet A solder tank comprising two sets of liquid supply cylinders having a liquid suction port which communicates with the solder recovery tank and the solder chamber and has a check valve attached thereto,
As a liquid feeding means, a piston is provided inside each of the liquid supply cylinders, and the piston reciprocates in the opposite directions in the two liquid supply cylinders to inject the molten solder into the solder chamber. A soldering apparatus, wherein the soldering apparatus is ejected from an ejection port through the liquid feeding cylinder. A hermetically sealed solder chamber filled with molten solder; a liquid feed pipe that penetrates the wall surface of the solder chamber and is connected to a jet outlet at the tip; and a solder collection tank that collects the molten solder ejected from the jet outlet A liquid supply cylinder that communicates with the solder recovery tank and the solder chamber and is provided with a check valve; and for supplying solder from the solder recovery tank to the liquid supply cylinder. A refill cylinder and a solder bath comprising
As the liquid feeding means, the screw provided in the liquid supply cylinder, a rotating shaft of the screw, and a motor connected to the rotating shaft of the screw are provided, and the screw is rotated by the motor, thereby being in the solder recovery tank. A soldering apparatus, wherein molten solder passes through a liquid supply tube and is supplied to the solder chamber through a check valve.   2. An ultrasonic vibrator is provided in the solder chamber, a high ultrasonic wave is applied to the molten solder in the solder chamber to add cavitation, and the molten solder is ejected from the ejection port through the liquid feeding tube. 4. The soldering apparatus according to any one of items 3 to 3.   The flow rate adjusting means is provided inside the liquid feeding cylinder, and a height at which the height of the molten solder is ejected from the ejection port can be adjusted by attaching a height-adjustable cap to the ejection port side of the liquid feeding cylinder. The soldering apparatus according to any one of 1 to 5.

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