JP2009224733A - Package of semiconductor, and packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an extremely low-cost semiconductor device that has high heat radiation properties in addition to electrical reliability such as electrical insulation properties, and can be further reduced in size and increased in the number of pins. <P>SOLUTION: A semiconductor element 6 is mounted on a tape carrier, the semiconductor element 6 is sealed by a sealing resin 13 and a metal heat sink 7 is also stuck to the tape carrier by the sealing resin 13 filled into a through-hole 14 of the metal heat sink 7, an anchor effect is achieved by the sealing resin 13 filled into a back counter sink hole 11 in the metal heat sink 7, thermal conductivity to the metal heat sink 7 is improved by containing a heat-radiating filler in the sealing resin 13, and thermal conductivity is further improved while mainlining high insulation properties. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor mounting body and a mounting method, and relates to a structure effective for cost reduction and miniaturization of a tape carrier package frequently used for a display application such as a television.

  Currently, the unit price of many IC components and semiconductor products is very low, and there is a constant demand for cost reduction. Under such circumstances, further cost reduction, product miniaturization, and increase in the number of pins are demanded for packages such as TCP (Tape Carrier Package) and COF (Chip On Film).

  As a result, the amount of heat generated locally on the semiconductor element tends to increase as the product becomes smaller. Since heat generation and heat storage adversely affect the durability of the circuit and the like, the semiconductor mounting body is required to have higher heat dissipation than the conventional one in addition to electrical reliability such as electrical insulation.

  As a heat dissipating method, a method of attaching a metal element having a high thermal conductivity or a metal heat dissipating plate and a semiconductor element in general is common. However, there are many cases where the cost is not met.

  FIG. 6 is a plan view showing a general tape carrier. FIG. 7 is a plan view of a TCP in which a semiconductor element and a metal heat sink are mounted on the tape carrier of FIG. 8 is a cross-sectional view taken along the line CC ′ in FIG.

  As shown in FIGS. 6 to 8, a general tape carrier 101 is obtained by providing a conductor pattern 103 on a film base material 102 such as a polyimide film and covering the conductor pattern 103 with a solder resist 104. The lead 105 is exposed from the solder resist 104. The conductor pattern 103 is exposed from an inner lead (flying lead) 103 a whose one end protrudes inside the device hole 102 a of the film base 102, a pattern lead 104 b extending on the film base 102, and the solder resist 104. It consists of the aforementioned outer lead 105.

  The semiconductor element 106 is disposed in the device hole 102a of the tape carrier 101, the semiconductor element 106 and the inner lead 103a are connected by ILB (Inner Lead Bonding), and an underfill resin is provided in the device hole 102a to protect the inner lead 103a. 113 (or non-conductive paste) is filled, and the semiconductor element 106 is sealed with an underfill resin 113 that fills the gap between the tape carrier 101 and the semiconductor element 106 to form the TCP 108. The underfill resin 113 extends to the surface of the tape carrier 101 around the device hole 102a.

The metal heat radiating plate 107 has a concave portion 107 a at a mounting position corresponding to the semiconductor element 106. The heat radiating grease 112 is applied to the concave portion 107 a and attached to the TCP 108. That is, the film base material 102 and the metal heat dissipation plate 107 are fixed to each other using the adhesive tape 109 while pressing the metal heat dissipation plate 107 against the back surface of the semiconductor element 106 of the TCP 108 via the heat dissipation grease 112. An opening hole 110 is formed in advance in the TCP 108 and the metal heat radiating plate 107, and a fastening member 111 such as a screw is attached from the upper surface side of the TCP 108 in which a land 110 a is formed around the opening hole 110. The metal heat sink 107 is fastened to complete the TCP with the metal heat sink attached.
JP 2006-243733 A

  However, in the conventional configuration described above, when the fastening member 111 such as a screw is inserted into the opening hole 110 from the upper surface of the TCP 108 and the metal heat radiating plate 107 is attached to the TCP 108 with the fastening member 111, the fastening member 111 is too tight. The film base material 102 may be deformed. For this reason, there is a problem that the conductor pattern 103 on the film base material 102 is deformed or disconnected.

  Further, the periphery of the semiconductor element 106 is hollow except for the heat dissipation grease 112 in the recess 107 a of the metal heat dissipation plate 107, and heat generated in the semiconductor element 106 is mainly conducted to the metal heat dissipation plate 107 through the heat dissipation grease 112. For this reason, the contact area between the heat dissipation grease 112 and the metal heat dissipation plate 107 and the contact area between the heat dissipation grease 112 and the semiconductor element 106 are factors that affect heat dissipation.

  However, when the heat radiation grease 112 is applied to the recess 107a of the metal heat radiating plate 107, it is difficult to manage the application amount of the heat radiation grease 112. If the application amount of the heat radiation grease 112 is too small, the contact area is insufficient. There was a problem that the heat dissipation deteriorated.

  In addition, since the opening hole 110 is provided in the film base material 102, the area for routing the wiring of the conductor pattern 103 is reduced due to the presence of the opening hole 110, which is not suitable for downsizing of the package or increasing the number of pins. was there.

  The present invention solves the above-described problems, and can attach a TCP and a metal heat radiating plate without using a fastening member such as a screw, can realize excellent heat dissipation, and further reduce production facilities. Accordingly, an object of the present invention is to provide a semiconductor device that can be reduced in cost, can cope with downsizing of a package and increase in the number of pins, and ensures reliability.

  In order to solve the above-described problems, a semiconductor mounting body according to the present invention includes a flexible base substrate on which conductor wiring is arranged, a semiconductor element mounted in a device hole of the base substrate, and the device hole filled. A sealing resin for sealing the semiconductor element, and a metal heat dissipating plate arranged to face the base substrate, the metal heat dissipating plate having a through hole communicating with the device hole, and the sealing The device hole and the through hole are filled with resin, and the metal heat radiating plate is fixed to the base substrate.

  In the semiconductor package of the present invention, the metal heat radiating plate includes a hole that forms a part of the through hole and has a widened portion wider than the through hole, and the sealing resin fills the widened portion. It is characterized by that.

  Further, in the semiconductor mounting body of the present invention, the metal heat dissipating plate communicates with the through hole on the opposite main surface opposite to the surface facing the base substrate, and is wider than the through hole. A countersunk hole having a portion, wherein the sealing resin fills the widened portion.

  Further, in the semiconductor mounting body of the present invention, the metal heat radiating plate includes a counterbore hole that communicates with the through hole and has a widened portion wider than the through hole on the main surface of the front and back surfaces. Fills the widened portion.

In the semiconductor package of the present invention, the sealing resin has both electrical insulation and heat dissipation.
In the semiconductor package of the present invention, the sealing resin contains a heat radiating filler.

  In the semiconductor mounting method of the present invention, a semiconductor element is disposed in a device hole of a flexible base substrate on which conductor wiring is disposed, a metal heat sink is disposed opposite to the base substrate, and the metal heat sink is front and back. A sealing resin is filled in the through-holes and the device holes formed so as to penetrate the metal holes, and the metal heat radiating plate is fixed to the base substrate with the sealing resin.

  The semiconductor mounting method of the present invention is characterized in that the sealing resin fills a widened portion formed in the through hole of the metal heat radiating plate to form a resin anchor portion.

  As described above, in the semiconductor mounting body of the present invention, the sealing resin seals the semiconductor element, and the base substrate on which the semiconductor element is mounted and the metal heat sink are fixed. In addition, there is no need for a fastening member such as a screw, the phenomenon of deformation of the base substrate, deformation of the conductor pattern on the substrate and disconnection due to the tightening of the screw is eliminated, and the arrangement area of the fastening member such as a screw is eliminated. It is possible to reduce the size and increase the number of pins. Furthermore, no heat radiation grease is required, and cost reduction can be realized.

  The semiconductor element is in contact with the sealing resin at the entire periphery thereof, and the metal heat radiating plate is in contact with the sealing resin at all the inner wall surfaces of the through hole and the widened portion, thereby realizing excellent heat dissipation. Moreover, the heat conductivity to a metal heat sink can be improved by containing the filler with heat dissipation in sealing resin, and heat conductivity can be improved further with having higher insulation.

  Therefore, in addition to electrical reliability such as electrical insulation, the semiconductor device can be provided at extremely low cost because it has higher heat dissipation and can be further reduced in size and increased in pin count.

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
FIG. 1 is a plan view showing a tape carrier according to Embodiment 1 of the present invention. FIG. 2 is a plan view of the metal heat sink in the first embodiment of the present invention. 3 is a cross-sectional view taken along the line AA ′ in FIG. 4 is a plan view showing a TCP in which a metal heat sink is mounted on the tape carrier according to Embodiment 1 of the present invention. FIG. 5 is a cross-sectional view taken along the line BB ′ in FIG.

  1 to 5, 1 is a tape carrier, 2 is a film substrate, 2a is a device hole, 3 is a conductor pattern, 3a is a pattern lead, 4 is a solder resist, 5 is an outer lead, 6 is a semiconductor element, 7 is Metal heat sink, 8 is TCP (Tape Carrier Package), 9 is adhesive tape, 10 is a counterbore hole for mounting a semiconductor element of the metal heat sink, 11 is a counterbore hole on the back surface of the metal heat sink, 12 is an inner lead, 13 is Resin 14 indicates through holes of the metal heat sink.

  As shown in FIGS. 1 to 5, the tape carrier 1 is obtained by providing a conductor pattern 3 on a film substrate 2 such as a polyimide film, and covering the conductor pattern 3 with a solder resist 4. It is exposed from the solder resist 4.

  The conductor pattern 3 is exposed from an inner lead (flying lead) 12 whose one end protrudes inside the device hole 2 a of the film base 2, a pattern lead 3 a extending on the film base 2, and the solder resist 4. It consists of the aforementioned outer lead 5.

  As shown in FIGS. 2 and 3, the metal heat radiating plate 7 has a through hole 14 that penetrates between the main surfaces of the front and back sides, and has a counterbore 10 for mounting a semiconductor element on the main surface facing the tape carrier 1. In addition, a back face counterbore 11 is provided on the main surface opposite to the main surface facing the tape carrier 1.

  The counterbore 10 for mounting the semiconductor element is used to store the semiconductor element 6. The counterbore 10 for forming the semiconductor element is formed as a part of the through hole 14, and a seat 10 a for receiving a resin anchor portion described later is formed in a widened portion wider than the through hole 14. ing. The back face counterbore 11 forms a part of the through hole 14, and a seat 11 a that receives a resin anchor portion described later is formed in a widened portion wider than the through hole 14.

  In the manufacturing process of the TCP 8 shown in FIGS. 4 and 5, first, the semiconductor element 6 is disposed in the device hole 2 a of the tape carrier 1, and the semiconductor element 6 is bonded to the inner lead 12.

  Next, a metal heat dissipating plate 7 is disposed facing the back side of the tape carrier 1, and the semiconductor element 6 mounted on the tape carrier 1 is placed in the metal heat dissipating plate 7 in a counterbore 10 for mounting semiconductor elements. The heat radiating plate 7 is aligned, and the metal heat radiating plate 7 is fixed to the lower part of the tape carrier 1 with the adhesive tape 9.

  Next, the device hole 2a of the tape carrier 1 and the semiconductor element mounting counterbore hole 10, the through hole 14, and the back face counterbore hole 11 of the metal heat radiating plate 7 are filled with a sealing sealing resin 13 for sealing. The gap between the carrier 1 and the metal heat radiating plate 7 and the semiconductor element 6 is filled with a sealing sealing resin 13. The semiconductor element 6 is sealed by curing the sealing sealing resin 13 to form the TCP 8 as a mounting body.

  The sealing and sealing resin 13 extends to the surface of the tape carrier 1 around the device hole 2a to form a resin anchor portion, fills the semiconductor element mounting counterbore 10 and contacts the widened portion seat 10a. The part forms a resin anchor part, and further, the part that fills the back face counterbore 11 and contacts the seat 11a of the widened part functions as an anchor, thereby fastening the tape carrier 1 and the metal heat sink 7.

  Therefore, the semiconductor heat sink 7 is sealed with the sealing sealing resin 13 and the metal heat radiating plate 7 and the tape carrier 1 can be fixed at the same time, and the tape carrier 1 and the metal heat radiating plate 7 are fastened as in the prior art. Therefore, a fastening member such as a screw is not necessary, and an attachment process using a fastening member such as a screw is not necessary.

  For this reason, the deformation | transformation of the film base material 2 resulting from clamping | tightening of fastening members, such as a screw which was a subject conventionally, does not arise, and the phenomenon of the deformation | transformation of the conductor pattern 3 and a disconnection is lose | eliminated. In addition, since it is not necessary to provide the tape carrier 1 with an opening hole for placing a fastening member such as a screw, which has been necessary in the prior art, the area for routing the conductor pattern 3 is widened, and the TCP 8 has multiple pins. It becomes possible to reduce the size.

  In the present embodiment, wide portions wider than the through holes 14 are formed on the front and back surfaces of the metal heat radiating plate 7, and the resin anchor portions of the sealing resin 13 are received by the wide portion seats 10a and 11a. However, the widened portion can be formed at an intermediate position in the axial direction of the through hole 14. Moreover, the shape of the counterbore 10 for mounting a semiconductor element, the through hole 14, and the back face counterbore 11 is not limited to that shown in the present embodiment, and various shapes can be used.

  Conventionally, as shown in FIG. 8, about half of the semiconductor element 106 is exposed from the underfill resin 113 because the heat dissipating grease 112 is used. However, in the present embodiment, the sealing resin 13 having adhesiveness such as a thermosetting resin is filled, and the entire periphery of the semiconductor element 6 can be held and firmly fixed by the sealing resin 13.

  Further, when the heat generated in the semiconductor element 6 is conducted to the heat radiating plate 7 through the sealing resin 13, the space between the periphery of the semiconductor element 6 and the heat radiating plate 7 is filled with the sealing resin 13. And the contact area between the sealing resin 13 and the contact area between the heat dissipation plate 7 and the semiconductor element 6 can be sufficiently secured, and sufficient heat dissipation can be realized.

  Further, the inner wall surfaces of the counterbore 10 for mounting the semiconductor element, the through hole 14 and the back face counterbore 11 of the metal heat radiating plate 7 are roughened by etching or the like, thereby increasing the bonding strength with the sealing resin 13. At the same time, the thermal conductivity at the interface with the sealing resin 13 is improved.

  Moreover, the thermal conductivity to the metal heat sink 7 can be improved by containing the filler with heat dissipation in the sealing resin 13 used here. As this filler, for example, by filling a large amount of a known inorganic filler in JP-A-2005-306718, it is possible to achieve excellent heat dissipation by further improving thermal conductivity while maintaining high insulation.

  In addition, since a conventional attachment process using a fastening member such as a screw is not required, and a heat dissipating grease application process is eliminated, it is possible to create a mounting body at an extremely low cost.

  According to the semiconductor package of the present invention, it is possible to form a TCP having higher heat dissipation in addition to electrical reliability such as electrical insulation, which is useful for display applications such as televisions.

The top view of the tape carrier in Embodiment 1 of this invention The top view of the metal heat sink in Embodiment 1 of this invention AA 'sectional view in FIG. Top view of TCP with metal heat sink in Embodiment 1 of the present invention BB 'sectional view in FIG. Top view of a typical tape carrier Top view of conventional TCP with metal heat sink CC 'sectional view in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,101 Tape carrier 2,102 Film base material 2a, 102a Device hole 3,103 Conductor pattern 3a, 103b Pattern lead 4,104 Solder resist 5,105 Outer lead 6,106 Semiconductor element 7,107 Metal heat sink 8,108 TCP (Tape Carrier Package)
9, 109 Adhesive tape 10 Counterbore hole for mounting semiconductor element on metal heat sink 11 Back counterbore hole on metal heat sink 12, 103a Inner lead 13 Sealing resin 14 Through hole on metal heat sink 107a Recess 110 Open hole 111 Screw etc. Fastening member 112 Radiation grease 113 Underfill resin

Claims (8)

A flexible base substrate in which conductor wiring is arranged; a semiconductor element mounted in a device hole of the base substrate; a sealing resin that fills the device hole and seals the semiconductor element; and A metal heatsink disposed oppositely,
The metal heat radiating plate has a through hole communicating with the device hole, the sealing resin is filled in the device hole and the through hole, and the metal heat radiating plate is fixed to the base substrate. Semiconductor mounting body.   The said metal heat sink has a hole which comprises a part of said through-hole and has a widened part wider than the said through-hole, and the said sealing resin fills the said widened part. Semiconductor mounting body.   The metal heat radiating plate includes a counterbore hole communicating with the through hole and having a widened portion wider than the through hole on a main surface opposite to a surface facing the base substrate. The semiconductor mounting body according to claim 1, wherein a stop resin fills the widened portion.   The metal heat radiating plate includes counterbore holes that communicate with the through-holes and have a widened portion wider than the through-holes on the front and back main surfaces, and the sealing resin fills the widened portion. The semiconductor mounting body according to claim 1.   The semiconductor mounting body according to claim 1, wherein the sealing resin has both electrical insulation and heat dissipation.   The semiconductor packaging body according to claim 5, wherein the sealing resin contains a heat-dissipating filler.   A semiconductor element is disposed in a device hole of a flexible base substrate on which conductor wiring is disposed, a metal heat sink is disposed opposite to the base substrate, and a through hole formed by penetrating the metal heat sink on the front and back sides; A semiconductor mounting method, wherein the device hole is filled with a sealing resin, and the metal heat sink is fixed to the base substrate with the sealing resin.   The semiconductor mounting method according to claim 7, wherein the sealing resin fills a widened portion formed in the through hole of the metal heat radiating plate to form a resin anchor portion.

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