JP2009224650A - Surface roughing apparatus for roughing build-up substrate insulating layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface roughing apparatus for roughing a build-up substrate insulating layer which surface roughing apparatus simultaneously and uniformly roughs insulating layers formed on both surfaces of a substrate at low cost in carrying out a dipping surface roughing process on the insulating layer. <P>SOLUTION: The surface roughing apparatus leads a processed etching solution 1 in a processing tank 2 into an electrolytic regenerating tank 6 to regenerate the etching solution 1, and transfers the regenerated etching solution 1 back into the processing tank 2, thus carries out a roughing process while circulating the etching solution 1. The processing tank 2 has a plurality of discharge ports 41 and 42, one or more supply ports 8, and a valve 9 disposed on a pipeline for selecting a circulating path for the etching solution 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to surface roughening of a large-sized semiconductor package substrate. In particular, the present invention relates to a build-up substrate insulating layer that can be suitably used for performing uniform roughening with no bias in the etching amount of the insulating layer. The present invention relates to a surface roughening apparatus.

  In general, a substrate for a semiconductor package for high integration and high frequency applications such as a BGA substrate is coated with a resin serving as an insulating layer on the surface of a core material, and then directly plated and patterned to form a printed circuit board. The build-up method to be formed is adopted. In this build-up method, in order to improve the adhesion between the insulating layer and the plating, it is necessary to perform a roughening process for roughening the surface of the insulating layer before the plating process. As the method, roughening by dip etching, in which the substrate is immersed in a processing tank filled with an etching solution, is mainly employed.

  In the dip type method, in order to maintain the reaction effect of the etching solution, the treated etching solution is circulated while being regenerated in the electrolytic regeneration tank. Therefore, the substrate is not immersed in a stationary etchant, but in a constantly flowing etchant. At this time, if the flow of the etching solution near the substrate is uniform, a uniform etching rate can be obtained. However, in the conventional dip type treatment tank, the etchant stays in the treatment tank, and a difference occurs in the fatigue distribution of the etchant. Therefore, there is a problem that the etching rate varies.

Various proposals have been made to reduce the variation in the etching rate.
For example, as shown in Patent Document 1, the variation of the etching rate is reduced and the etching of the substrate is made uniform by vibrating the frame on which the substrate (object to be processed) is mounted in the processing tank and stirring the etching solution. A surface roughening apparatus has been proposed. Further, Patent Document 2 proposes a surface roughening device that reduces variation in etching speed and makes substrate etching uniform by rotating a cassette equipped with a substrate in a processing tank and stirring the etching solution. ing.
JP-A-8-41659 JP 2006-32609 A

  However, in the case of a large substrate, the method of Patent Document 1 has a problem that the etching rate is relatively slow and the etching is not sufficiently uniformed because the etching solution in the central portion of the substrate is less agitated than the edge portion of the substrate. There is. Moreover, in the method of Patent Document 2, in addition to insufficient stirring of the etching solution at the center of the substrate, the size of the processing tank necessary for rotating the substrate must be ensured. In addition, it is necessary to increase the amount of the etching solution to be circulated along with the increase in the processing tank, which leads to an increase in cost by improving the performance of the supply pump that supplies the etching solution and increasing the energy consumption for driving.

As a method other than the dip method, there is a spray method in which an etching solution is sprayed onto a substrate with a spray nozzle to perform etching. However, in this spray type, it is difficult to uniformly apply the etching solution to the substrate, so that there are problems such as variations in the etching rate, and problems such as a non-uniform shape at the bottom of the etched portion due to the spray pressure. To do.
As another method, a method of etching by a plasma method is also known, but it is difficult to uniformly etch both surfaces of a substrate having an area of A3 size or more at the same time.

  The present invention has been made to solve the above problems, and in the surface roughening of the insulating layer by the dip method, the insulating layers formed on both surfaces of the substrate having a large area of A3 size or more can be made uniform at the same time. Another object of the present invention is to provide a build-up substrate insulating layer surface roughening apparatus capable of performing roughening treatment at low cost.

  The present invention regenerates a processed etching solution in which the surface of the insulating layer of the substrate is roughened in the processing tank through the conduit through the conduit into the electrolytic regeneration tank, and supplies the regenerated etching solution through the conduit. In the surface roughening apparatus that returns to the inside of the processing tank from the mouth and performs the roughening process while circulating the etching solution, the processing tank has a plurality of discharge ports and one or more supply ports, and the etching solution circulation path A surface roughening device for a build-up substrate insulating layer, characterized in that a valve for selecting is provided in a pipe line.

Further, the present invention is the build-up substrate insulating layer surface roughening apparatus according to the above invention, wherein the treatment tank is 1) substantially rectangular parallelepiped shape, a supply port is provided in the center of the bottom,
2) a) A first discharge port is provided on one side surface corresponding to a position perpendicular to the substrate surface when etching is performed in the processing tank, and a second discharge port is provided at a position opposite to the first discharge port on the other side surface. Provided,
b) A discharge valve for selecting a circulation path of the etching solution is provided at a location where the first discharge pipe from the first discharge port and the second discharge pipe from the second discharge port merge with the discharge pipe. This is a surface roughening device for a build-up substrate insulating layer.

Further, the present invention is the build-up substrate insulating layer surface roughening apparatus according to the above invention, wherein the treatment tank is 1) a substantially rectangular parallelepiped shape,
2) a) A first discharge port is provided on one side surface corresponding to a position perpendicular to the substrate surface when etching is performed in the processing tank, and a second discharge port is provided at a position opposite to the first discharge port on the other side surface. Provided,
b) A discharge valve for selecting a circulation path of the etching solution is provided at a location where the first discharge pipe from the first discharge port and the second discharge pipe from the second discharge port merge with the discharge pipe. And
3) a) A first supply port is provided in the vicinity of the second discharge port on the other side surface, and a second supply port is provided on the one side surface at a position facing the first supply port.
b) A build characterized in that a supply valve for selecting a circulation path for the etching solution is provided at a location where the supply line from the electrolytic regeneration tank branches into the first supply line and the second supply line. It is the surface roughening apparatus of an up board | substrate insulating layer.

  Further, according to the present invention, in the build-up substrate insulating layer surface roughening apparatus according to the above-described invention, the valve switching time interval for selecting the etching solution circulation path is 1/4 of the time required for the roughening treatment. A surface roughening device for a build-up substrate insulating layer, characterized in that:

  Further, the present invention is the build-up substrate insulating layer surface roughening apparatus according to the above invention, wherein the amount of the etching solution supplied to the processing bath is at least four times the processing bath volume per roughening processing time. This is a surface roughening device for a build-up substrate insulating layer.

The present invention can change the flow of the etching liquid in the processing tank by switching the valve for selecting the circulation path of the etching liquid, thereby preventing steady stagnation and varying the etching rate of the substrate. Can be reduced. By switching the valves, the etching solution supplied from the bottom of the processing tank can be discharged from the opposite side surfaces, so that steady stagnation can be prevented and variations in the etching rate of the substrate can be reduced.
Further, by supplying the etchant from the side surface of the treatment tank and discharging it from the side surface facing, a uniform flow is easily generated, and variations in the etching rate of the substrate are reduced. Furthermore, since the flow in the processing tank can be reversed by switching the valve, the variation in the etching amount caused by the difference between the upstream and downstream positions of the flow can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic configuration diagram showing a cross-sectional view of a first embodiment of a surface roughening apparatus for a build-up substrate insulating layer according to the present invention. As shown in FIG. 1, the surface roughening apparatus is a substantially rectangular parallelepiped treatment tank 2 having a height (H) of 1 m, a width of 20 cm, and a length (L) of 1.2 m that fills the etching solution 1, and the insulating layer surface of the substrate 3. The first discharge port 41 and the second discharge port 42 for discharging the processed etching solution roughened, respectively, the first discharge pipe 51, the second discharge pipe 52, the discharge pipe 5, the valve 9, and the electrolysis It comprises a regeneration tank 6, a supply pipe line 7 for supplying the regenerated etching solution, a circulation pump 10, a supply port 8 at the bottom of the treatment tank 2, and a punching metal 12.

  A valve 9 is provided at a location where the first discharge pipe 51 and the second discharge pipe 52 are joined and connected to the discharge pipe 5. By operating the valve 9, the first discharge pipe 51 and the second discharge pipe 52 are connected to the first discharge pipe 51. One of the second discharge pipes 52 can be selected for use. Further, the etching solution is sent by a circulation pump 10 installed in the supply pipe line 7 and circulates between the treatment tank 2 and the electrolytic regeneration tank 6. The substrate 3 is suspended by the substrate support folder 11 and immersed in the processing tank 2. Moreover, the punching metal 12 is installed in the bottom face and side surface of the processing tank 2 so that the supply and discharge of the etching solution can be performed uniformly.

  A roughening process of the substrate 3 using the surface roughening apparatus configured as described above will be described. The substrate 2 is a build-up substrate having a length (a) of 60 cm and a width (b) of 80 cm, and is in a state where an epoxy resin is applied. The substrate 3 was immersed in a treatment tank 2 filled with a potassium permanganate solution as an etching solution 1 for 20 minutes for roughening treatment.

At that time, the supply amount of the etching solution was 90 L per minute, the valve 9 was switched every 5 minutes, and the first discharge port 41 and the second discharge port 42 were alternately used and discharged. The flow of the etching solution in the treatment tank at that time is schematically shown in FIGS. FIG. 2 shows a flow when the first discharge port 41 is selected, and FIG. 3 shows a flow when the second discharge port 42 is selected.
In both cases, vortices are generated and retention occurs, but by discharging alternately, a uniform roughened surface was obtained without steady retention.

In the present invention, it is preferable that the interval of the valve switching time for selecting the etching solution circulation path is ¼ or less of the time required for the roughening treatment.
As a result, steady retention of the etching solution in the processing tank is unlikely to occur, and the variation in the etching rate of the substrate is favorably reduced.
Moreover, it is preferable that the liquid quantity of the etching liquid supplied to a processing tank is 4 times or more of a processing tank volume per roughening process time. As a result, the circulation amount of the etching solution in the processing tank increases, and the steady retention of the etching solution hardly occurs, and the variation in the etching rate of the substrate is favorably reduced.

(Second Embodiment)
FIG. 4 is a schematic configuration diagram showing a cross-sectional view of a second embodiment of the surface roughening apparatus for a build-up substrate insulating layer according to the present invention. As shown in FIG. 4, the surface roughening apparatus is a substantially rectangular parallelepiped treatment tank 2 having a height (H) of 1 m, a width of 20 cm, and a length (L) of 1.2 m that fills the etching solution 1, and the insulating layer surface of the substrate 3. The first discharge port 41 and the second discharge port 42 for discharging the processed etching solution roughened, the first discharge pipe 51, the second discharge pipe 52, and the discharge pipe 5, the discharge valve 91, respectively, Electrolytic regeneration tank 6, supply line 7 for supplying the regenerated etching solution, first supply line 71, second supply line 72, supply valve 92, first supply provided facing the side surface of the treatment tank 2 It consists of a port 81, a second supply port 82, a circulation pump 10, and a punching metal 12.

  The first supply port 81 and the second discharge port 42 are provided on the same side surface, and the second supply port 82 and the first discharge port 41 are provided on the same side surface. The first discharge pipe 51 and the second discharge pipe 52 are joined to the discharge pipe 5, and a discharge valve 91 is provided at the joining point. By operating the discharge valve 91, either the first discharge pipe 51 or the second discharge pipe 52 can be selected.

  The first supply pipeline 71 and the second supply pipeline 72 are branched from the supply pipeline 7, and a supply valve 92 is provided at this branching location. By operating the supply valve 92, one of the first supply pipe 71 and the second supply pipe 72 can be selected. Further, the etching solution is sent by a circulation pump 10 installed in the supply pipe line 7 and circulates between the treatment tank 2 and the electrolytic regeneration tank 6. The substrate 3 is suspended by the substrate support folder 11 and immersed in the processing tank 2. In addition, a punching metal 12 is installed on the side surface of the processing tank 2 so that the supply and discharge of the etching solution are performed uniformly.

  A roughening process of the substrate 3 using the surface roughening apparatus configured as described above will be described. The substrate 2 is a build-up substrate having a length (a) of 60 cm and a width (b) of 80 cm, and is in a state where an epoxy resin is applied. The substrate 3 was immersed in a treatment tank 2 filled with a potassium permanganate solution as an etching solution 1 for 20 minutes for roughening treatment.

  At that time, the supply amount of the etching solution is 90 L per minute, the discharge valve 91 and the supply valve 92 are switched every 5 minutes, and the first supply port 81, the first discharge port 41, the second supply port 82 and the second supply port are switched. The discharge ports 42 were alternately used and circulated. The flow of the etching solution in the treatment tank 2 at that time is schematically shown in FIGS. FIG. 5 shows the flow when the first supply port 81 and the first discharge port 41 are selected, and FIG. 6 shows the flow when the second supply port 82 and the second discharge port 42 are selected. In both cases, vortices are generated and retention occurs, but by alternately circulating, a uniform roughened surface is obtained without steady retention.

1 is a cross-sectional view of a configuration of a first embodiment of a surface roughening apparatus according to the present invention. It is explanatory drawing which shows the flow of the etching liquid in the processing tank at the time of selecting the 1st discharge port of 1st Embodiment. It is explanatory drawing which shows the flow of the etching liquid in the processing tank at the time of selecting the 2nd discharge port of 1st Embodiment. It is sectional drawing of the structure of 2nd Embodiment of the surface roughening apparatus by this invention. It is explanatory drawing which shows the flow of the etching liquid in a processing tank at the time of selecting the 1st supply port and 1st discharge port of 2nd Embodiment. It is explanatory drawing which shows the flow of the etching liquid in the processing tank at the time of selecting the 2nd supply port and 2nd discharge port of 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Etching liquid 2 ... Processing tank 3 ... Substrate 5 ... Discharge conduit 6 ... Electrolytic regeneration tank 7 ... Supply conduit 8 ... Supply port 9 ... Valve 10 ... Circulating pump 11 ... Substrate support folder 12 ... Punching metal 41, 42 ... First discharge port, second discharge port 51, 52 ... First discharge line, Second discharge line 71, 72: first supply pipe, second supply pipe 81, 82: first supply port, second supply port 91, 92: discharge valve, supply valve

Claims (5)

  The treated etchant with the surface of the insulating layer of the substrate roughened in the treatment tank is regenerated by introducing it into the electrolytic regeneration tank through the conduit from the discharge port, and the treated etchant is regenerated from the supply port through the conduit. In the surface roughening apparatus which returns to the inside of the tank and performs the roughening process while circulating the etching solution, the processing tank has a plurality of discharge ports and one or more supply ports, and selects a circulation path of the etching solution. An apparatus for roughening the surface of a build-up substrate insulating layer, characterized in that: The treatment tank is 1) substantially in the shape of a rectangular parallelepiped, and a supply port is provided at the center of the bottom,
2) a) A first discharge port is provided on one side surface corresponding to a position perpendicular to the substrate surface when etching is performed in the processing tank, and a second discharge port is provided at a position opposite to the first discharge port on the other side surface. Provided,
b) A discharge valve for selecting a circulation path of the etching solution is provided at a location where the first discharge pipe from the first discharge port and the second discharge pipe from the second discharge port merge with the discharge pipe. The surface roughening device for a build-up substrate insulating layer according to claim 1, wherein The treatment tank has 1) a substantially rectangular parallelepiped shape,
2) a) A first discharge port is provided on one side surface corresponding to a position perpendicular to the substrate surface when etching is performed in the processing tank, and a second discharge port is provided at a position opposite to the first discharge port on the other side surface. Provided,
b) A discharge valve for selecting a circulation path of the etching solution is provided at a location where the first discharge pipe from the first discharge port and the second discharge pipe from the second discharge port merge with the discharge pipe. And
3) a) A first supply port is provided in the vicinity of the second discharge port on the other side surface, and a second supply port is provided on the one side surface at a position facing the first supply port.
b) A supply valve for selecting a circulation path of the etching solution is provided at a location where the supply line from the electrolytic regeneration tank branches into the first supply line and the second supply line. Item 1. A surface roughening apparatus for a build-up board insulating layer according to Item 1.   4. The build-up according to claim 1, wherein an interval of a valve switching time for selecting a circulation path of the etching solution is ¼ or less of a time required for the roughening process. Surface roughening device for substrate insulation layer.   The build-up substrate according to claim 1, 2, 3, or 4, wherein the amount of the etching solution supplied to the processing tank is four times or more the processing tank volume per roughening processing time. Insulating layer surface roughening device.

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