JP2009224541A - Method of manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To form electronic parts by temporarily bonding a resin film to a plurality of areas of a substrate at a time and dividing them into individual pieces in an individual piece making process, and to efficiently manufacture an excellent mounting structure by mounting a resin layer on the electronic parts. <P>SOLUTION: In a method of manufacturing the mounting structure, a mounting substrate and the electronic parts are provided and the electronic parts are mounted on the mounting substrate via a resin layer. The method includes a formation step of forming components of electronic parts including bumps 130 in each of a plurality of regions of the substrate 100A for formation of the electronic parts; a temporary bonding step of temporarily bonding the resin film 200 over the plurality of regions of the substrate 100A for formation at a time thereafter; an individual piece making step of dividing the substrate 100A for formation into individual pieces to form the electronic parts and also dividing the resin film 220 into individual pieces to form resin layers; and a fixing step of fixing the electronic parts to the mounting substrate with the resin layer interposed. In the temporary bonding step, the resin film 220 is arranged having a recess 240 directed to a surface as an active surface 120 of the electronic component, and then the resin film 220 is fused to fill the recess 240 with a fused resin material and to temporarily bond the resin film 2209 to the active surface 120. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a semiconductor device.

  In the field of electronic equipment, a technique for mounting an electronic component such as a semiconductor device (bare chip) on a mounting substrate is used, and a mounting structure that can be mounted easily at high density is expected. A flip-chip method is known as a method for mounting at a high density. The flip chip method is a method in which bumps are formed on an electronic component, an adhesive made of a resin material or the like is supplied between the electronic component and a mounting substrate, and these are bonded together. The terminal of the electronic component and the electrode of the mounting substrate are brought into contact with each other through the bump formed on the electronic component to obtain an electrical connection, and the space between the electronic component and the mounting substrate is sealed by the cured adhesive. It has become.

  As a method of supplying the adhesive, a method of arranging the adhesive in a predetermined region of the electronic component or the mounting substrate is known. In recent years, electronic components have been miniaturized along with miniaturization of electronic components, and it has become difficult to arrange a miniaturized resin film (adhesive) at a predetermined position. As a solution, a method of arranging a resin film at the manufacturing stage of an electronic component has been proposed (for example, Patent Document 1).

  In Patent Document 1, after a semiconductor element or the like is formed on a silicon wafer or the like, a resin film is temporarily bonded to the entire surface of the silicon wafer. Then, by dicing (dividing into pieces) the silicon wafer, an electronic component in a state where an adhesive is disposed can be obtained. When such a technique is used, an atmospheric gas such as air may be caught between the silicon wafer and the resin film. This is because protrusions such as bumps are formed on the silicon wafer, and it is difficult to fit the resin film along the protrusions and the irregularities around the protrusions.

When air is involved, the bumps and adhesives, the sealing material with which they are cured, and the like are deteriorated with time, and the mechanical or electrical connection reliability may be lowered. Further, the alignment mark provided on the silicon wafer overlaps with the entrained air and cannot be seen, and the alignment accuracy may be impaired. Therefore, in Patent Document 1, a resin film is temporarily bonded in a reduced pressure state to reduce entrainment of air or the like.
JP 2001-237268 A

  If the technique of Patent Document 1 is used, it is considered that the process of arranging an adhesive on each electronic component is facilitated and air entrainment can be prevented, but there are also improvements from the viewpoint of improving productivity. is there. In Patent Document 1, since a resin film is temporarily bonded in a reduced pressure state, it is necessary to work by accommodating a silicon wafer in a vacuum chamber or the like. Then, it becomes difficult to process a plurality of silicon wafers continuously, and workability is deteriorated as compared with the case of performing in an atmospheric pressure atmosphere. Further, if it is attempted to improve productivity by processing a plurality of substrates at once, a large vacuum chamber is required, resulting in an increase in apparatus cost.

  This invention is made | formed in view of the said situation, Comprising: It aims at providing the manufacturing method which can manufacture a favorable mounting structure efficiently.

The mounting structure manufacturing method of the present invention includes a mounting substrate and an electronic component having a bump electrically connected to the mounting substrate side on an active surface, and the electronic component is placed on the mounting substrate via a resin layer. A method of manufacturing a mounted mounting structure, the forming step of forming a component of the electronic component including the bumps in each of a plurality of regions in the substrate for forming the electronic component;
After the forming step, a temporary bonding step in which a resin film is temporarily bonded over the plurality of regions of the forming substrate, and after the temporary bonding step, the forming substrate is separated into individual pieces. Forming and separating the resin film into pieces to form the resin layer, and a fixing step of fixing the electronic component to the mounting substrate via the resin layer, the temporary bonding In the step, the resin film having a groove-shaped recess is disposed with the recess facing the active surface of the electronic component, and then the resin film is melted to fill the recess with the molten resin material. A resin film is temporarily bonded to the active surface.

  In this way, the resin film is temporarily bonded to a plurality of regions of the forming substrate in the temporary bonding process, and separated into individual pieces in the singulation process, so that an electronic component is formed and a resin layer is mounted thereon. can do. Therefore, alignment between the electronic component and the resin layer can be omitted as compared with the case where the resin layer is formed after the electronic component is separated. Therefore, the resin layer can be efficiently mounted on the electronic component, and the mounting structure can be manufactured efficiently. Further, since a margin for alignment between the electronic component and the resin layer is not required, the electronic component and the resin layer can be reduced in size, and the electronic component can be mounted at a high density.

On the other hand, since electronic parts have bumps and other irregularities, the conventional method entraps atmospheric gas such as air between the forming substrate and the resin layer, particularly around the bumps, which may remain. .
However, in the present invention, since the resin film having the groove-like recesses is disposed in the temporary bonding step and then melted and filled with the molten resin material, the entrained air is discharged through the recesses and the resin film. Air remaining between the forming substrate and the substrate is prevented. Therefore, when the electronic component is fixed to the mounting substrate through the resin layer in the fixing process, the resin layer provides a good seal between the mounting substrate and the electronic component. Therefore, the adhesion reliability is improved and the deterioration of the bump due to the intrusion of gas is prevented, so that a good mounting structure is obtained. Further, compared with the case where the resin film is temporarily bonded in a reduced-pressure atmosphere, the operation in the reduced-pressure atmosphere is not required, so that the apparatus cost can be reduced and the workability can be improved. As described above, according to the present invention, it is possible to efficiently manufacture a good mounting structure.

  In addition, the resin film has a cutting portion that is supported by the support film and linearly provided along the surface direction, and the temporary bonding step is performed on the support film at the cutting portion in the surface direction. Preferably, the resin film is disposed in a state where the tensile force in the orthogonal direction is applied to form the cut portion as the concave portion. In this case, the surface to be the active surface of the electronic component is directed vertically upward. It is preferable to peel the support film from the resin film after the resin film is heated and melted in a state.

  In this way, when a tensile force in a direction perpendicular to the cut portion is applied in the surface direction of the support film, an elongation corresponding to the tensile force is generated in a portion of the support film corresponding to the cut portion. Therefore, a recess having a width corresponding to the amount of elongation is formed, and the width of the recess can be easily controlled. Further, for example, the resin film can be easily obtained by forming a resin material on the support film and then cutting only this film with a cutter or the like (half-cut). Therefore, a resin film having a recess can be formed much more easily than in the case where a film made of a resin material is patterned by exposure / development or the like.

  Further, when the resin film is heated and melted in a state where the active surface of the electronic component is directed vertically upward in the temporary bonding process, the melted resin material flows toward the formation substrate due to gravity. Therefore, the resin material can be filled on the formation substrate side in the recess, and since the bumps are arranged on the formation substrate, the air around the bumps can be discharged well. Further, when the molten resin material flows toward the forming substrate, the contact area between the forming substrate and the resin film becomes larger than the contact area between the support film and the resin film. Therefore, when the support film is peeled off, the adhesion force between the forming substrate and the resin film becomes larger than the peeling force, and the resin film is prevented from peeling from the forming substrate.

  Further, the electronic component has a plurality of the bumps arranged in a row, and in the temporary bonding step, the resin film is brought into contact with a surface to be an active surface of the electronic component, and the interval between the bumps It is preferable that the resin film is disposed by pressing the resin film with a roller having a protruding elastic body having a narrower width. In this case, a roller whose height of the elastic body is equal to or higher than the height of the bump is used as the roller, or the resin film is pressed by moving the roller along the groove-shaped recess. In addition, it is preferable that the resin film is pressed by rolling and moving the roller along a direction orthogonal to the arrangement of the bumps.

  If the resin film is placed by pressing the resin film with a roller having a protruding elastic body that is narrower than the bump spacing, the resin film between the bumps is pressed against the forming substrate by the repulsive force of the protruding elastic body. It is done. As a result, air between the resin film and the forming substrate is discharged through the recess, and no air remains outside the recess. Further, since the air inside the recess is discharged by melting the resin film and filling the recess, the remaining of the air is surely prevented.

Further, if a roller having a height of the elastic body equal to or higher than the height of the bump is used, the force with which the elastic body presses the resin film against the forming substrate between the bumps becomes strong, so that air can be discharged well. .
If the roller is rolled and moved along the groove-shaped recess to press the resin film, the rear recess becomes narrower due to the deformation of the resin film as the roller advances. Therefore, it becomes difficult for the air to flow backward to the back of the roller, and the air can be discharged well in the traveling direction of the roller. In addition, the resin film can be prevented from being broken as compared with the case of rubbing the resin film with a roller.
Between the bumps, the bumps are arranged on both sides thereof, so that it is considered that air is likely to be caught. If the roller is rolled and moved along the direction perpendicular to the arrangement of the bumps to press the resin film, an elastic body easily enters between the bumps, so that the air between the bumps can be discharged well.

In the temporary bonding step, it is preferable to use a resin film having a plurality of recesses extending in parallel to each other as the resin film, wherein the interval between the recesses is narrower than the interval between the bumps.
In this way, since at least one recess is disposed between the bumps, air between the resin film and the formation substrate between the bumps can be discharged through the recess.

  Hereinafter, although one embodiment of the present invention is described, the technical scope of the present invention is not limited to the following embodiment. In the following description, various structures are illustrated using drawings, but in order to show the characteristic parts of the structures in an easy-to-understand manner, the structures in the drawings are shown in different sizes and scales from the actual structures. There is.

  FIGS. 1A to 1C are process diagrams schematically showing the formation process of the present embodiment. FIG. 1A is a schematic plan view, and FIG. The enlarged view of the chip | tip formation area corresponding to one is shown, and FIG.1 (c) shows the AA arrow sectional drawing in FIG.1 (b), respectively.

  First, as shown in FIG. 1A, components of electronic components are collectively formed in a plurality of chip formation regions (regions) 110 in the formation substrate 100A. The forming substrate 100A is, for example, a silicon wafer made of single crystal silicon. Each of the chip formation regions 110 in which the components of the electronic component are formed is a region that becomes one electronic component after singulation, and is hereinafter referred to as an electronic component intermediate 100B. In addition, a surface that is an active surface in the manufactured electronic component may be referred to as an active surface in the intermediate body 100B. As shown in FIG. 1B, the intermediate body 100B of the present embodiment has a substantially rectangular shape in plan view, and a plurality of bumps 130 are formed on the periphery along the long side (Y direction) of the active surface 120. The

  Specifically, as shown in FIG. 1C, a semiconductor circuit layer 140 including a transistor, a memory element, a passivation film covering these, an internal terminal, and the like is formed on the formation substrate 100A. Then, on the semiconductor circuit layer 140, the internal wiring electrically connected to the internal terminal, the passivation film covering the internal wiring, the land electrically connected to the internal wiring and exposed to a predetermined region of the passivation film, etc. A wiring layer 150 is formed. Then, bumps 130 electrically connected to the lands are formed on the wiring layer 150. The transistor and the memory element function as a drive system, a control system, or a part thereof, for example, in a device on which electronic components are mounted. The bump 130 is a portion that becomes an electrical connection portion between the electronic components after they are mounted on the mounting substrate.

  2 (a) to 2 (c) and FIGS. 3 (a) to 3 (c) are process diagrams showing a temporary bonding process of the present embodiment. Prior to the temporary bonding step, a film 200 having a resin film 220 on a support film 210 is prepared as shown in FIG. The film 200 of the present embodiment has substantially the same shape and dimensions as the forming substrate 100A.

  The resin film 220 is made of a resin material such as a polyimide resin, an epoxy resin, or a phenol resin. When the resin film 220 is heated to, for example, about 60 to 80 ° C., a part thereof is melted to increase fluidity, and when the temperature is further increased, the resin film 220 is cured by a chemical reaction such as polymerization and exhibits adhesiveness. It has become. A plurality of cutting portions 230 are formed in the resin film 220 at a predetermined interval by a cutter or the like. The cutting part 230 of the present embodiment is formed along one direction and also in the orthogonal direction. That is, the cutting part 230 is formed in a lattice shape.

  Next, as shown in FIG. 2 (b), a tensile force F in a direction orthogonal to the cut portion 230 is applied to the support film 210 of the film 200. As a result, the support film 210 is stretched in accordance with the tensile force F in a direction perpendicular to the cut portion 230, and the cut portion 230 is expanded in width according to the amount of elongation to become a groove-like recess 240. In this way, the width of the recess 240 can be controlled by the tensile force F. Further, the recess 240 can be formed more easily than removing the resin film partially and making the removed portion a recess.

  Here, the peripheral edge of the film 200 is fixed to a frame-shaped support member (not shown) in a state in which the film 200 is pulled in two directions perpendicular to each other. As a result, the lattice-shaped cutting portions 230 become lattice-shaped concave portions 240 with a predetermined interval. If it fixes to a frame-shaped support member, since the film 200 is hold | maintained in the state which the tensile force F acted, workability | operativity will become high.

  Next, as shown in FIG. 2C, the resin film 220 of the film 200 is brought into contact with the active surface 120 side of the intermediate body 100 </ b> B and pressed by the roller 300. As described above, the recesses 240 extend in a lattice shape, that is, in two directions orthogonal to each other. Here, the film 200 is arranged so that these two directions coincide with the long side direction (Y direction) and the short side direction (X direction) of the intermediate body 100B shown in FIG. The roller 300 is as follows.

  FIG. 5A is a schematic perspective view showing the roller 300, and FIG. 5B is a perspective view showing a pressing method by the roller 300. As shown in FIG. 5A, the roller 300 of this embodiment has a circular cross-sectional shape that is orthogonal to the axis. The radius changes at predetermined intervals in the axial direction, and a portion with a large radius is an elastic body 310 that protrudes outward. The elastic body 310 is made of a flexible material such as silicon rubber. The width of the elastic body 310 is narrower than the interval between the bumps 130 in the long side direction of the active surface 120 shown in FIG. Further, the height of the elastic body 310, that is, the difference in radius between the small diameter portion and the large diameter portion is higher than that of the bump 130 (see FIG. 1C).

  In the present embodiment, as shown in FIG. 5B, the roller 300 is moved in the direction along the bumps 130 in the intermediate body 100B (Y direction) and in the direction orthogonal to the direction (X direction), respectively. Press the membrane 220. The elastic body 310 is deformed by the pressing, and the resin film 220 is pressed against the intermediate body 100 </ b> B on the bump 130 and between the bumps 130 by the repulsive force. Thereby, the atmospheric gas (air) between the resin film 220 and the intermediate body 100 </ b> B can be driven out to the recess 240.

  In this embodiment, while being pressed by the roller 300, as shown in FIG. 3A, the forming substrate 100A is heated from the vertically lower side. Then, the resin film 220 is melted and the melted resin material flows toward the intermediate body 100B of the recess 240. The resin film 220 is easily deformed by being heated. When the resin film 220 is pressed by the roller 300, the resin film 220 is deformed toward the inside of the recess 240. Then, the volume inside the recess 240 is reduced, and the air here is discharged through the recess 240. In this way, the recess 240 is filled with the molten resin material.

Next, as shown in FIG. 3B, the support film 210 of the film 200 is peeled off. Since the resin film 220 is filled with the molten resin material on the intermediate body 100B side of the recess 240, the contact area with the support film 210 side is smaller than the contact area with the intermediate body 100B side. Accordingly, the adhesion force between the resin film 220 and the support film 210 side is smaller than the adhesion force between the resin film 220 and the intermediate body 100B, and therefore the resin film 220 and the intermediate body 100B are separated by the separation of the support film 210. Is prevented.
Next, as shown in FIG. 3C, the resin film 220 is heated and melted, and the recess 240 is further filled with the melted resin material, and the resin film 220 is flattened.

  Next, the forming substrate 100A and the resin film 220 are collectively diced (divided into individual pieces). Thereby, the electronic component 100 as shown to Fig.4 (a) is obtained. The electronic component 100 is provided with a resin layer 250 that is an individual resin film 220. In this way, a large number of electronic components 100 can be manufactured together, and the resin layer 250 can be mounted on each electronic component 100 collectively. In this way, the positional deviation between the resin layer 250 and the electronic component 100 is prevented, and the resin layer 250 or the electronic component 250 can be downsized as compared with the case where a margin is provided in consideration of the positional deviation.

  Next, as shown in FIG. 4B, the electronic component 100 is mounted on the mounting substrate 400. This step can be performed using a known method. For example, the electronic component 100 is arranged by aligning the terminal 410 electrically connected to the wiring or the like and the bump 130. Then, the electronic component 100 and the mounting substrate 400 are pressed together in a state where the resin layer 250 is melted by a pressure heating body such as a pulse heat bonding tool or a constant heat tool. Thereby, the resin layer 250 between the bump 130 and the terminal 410 is discharged, and the bump 130 and the terminal 410 are brought into conductive contact. In this state, the resin layer 250 is thermally cured, so that the electronic component 100 and the mounting substrate 400 are fixed (mainly bonded), and the space between them is sealed. In this way, the mounting structure 1 is obtained.

  According to the mounting structure manufacturing method of the present invention as described above, a large number of electronic components 100 each having the resin layer 250 disposed thereon can be manufactured in a lump, and process efficiency can be improved. Further, since the resin film 220 having the groove-shaped recess 240 is temporarily bonded to the intermediate body 100B of the electronic component 100, the atmospheric gas (air) between the resin film 220 and the intermediate body 100B is discharged through the recess 240. The Therefore, deterioration of the terminals 410, the bumps 130, the resin layer 250, and the like due to residual air, and a decrease in the adhesive strength between the electronic component 100 and the mounting substrate 400 due to a decrease in contact area are prevented, and a good mounting structure 1 is obtained. . Thus, according to the present invention, a good mounting structure can be efficiently manufactured.

  In the embodiment, the bumps 130 are arranged along the long side of the periphery of the electronic component. However, the bumps 130 may be arranged along the four sides of the long side and the short side. In addition to the peripheral arrangement in which the bumps 130 are arranged only on the periphery as described above, an area arrangement in which bumps are distributed over the entire active surface, a center pad arrangement in the center of the active surface, or the like may be employed.

Further, as the resin film, any of an insulating film (NCF), a conductive film, a film containing conductive particles, and the like may be used. When NCF is used, the width of the recess may be wider than the width of the bump, and alignment may be performed so that the bump is disposed inside the recess. In this way, since the resin film is not disposed on the bump, when the electronic component is fixed to the mounting substrate, it is possible to prevent an electrical connection failure due to a defective discharge of the resin material on the bump. Moreover, since a part of recessed part is arrange | positioned around a bump, the air around a bump can be discharged | emitted favorably.
Moreover, although the roller 300 of the said embodiment had an unevenness | corrugation along an axial direction, you may use what has an unevenness | corrugation (protrusion) also in the circumferential direction.

(A)-(c) is process drawing which shows the manufacturing method of the mounting structure of this invention. (A)-(c) is process drawing which continues from FIG.1 (c). (A)-(c) is process drawing which continues from FIG.2 (c). (A), (b) is process drawing which continues from FIG.3 (c). (A) is a perspective view of a roller, (b) is a top view which shows the usage method of a roller.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mounting structure, 100 ... Electronic component, 100A ... Substrate for formation, 100B ... Intermediate body of electronic component, 120 ... Active surface, 130 ... Bump, 200 ... Film 210 210 support film 220 resin film 230 cutting part 240 recess 250 resin layer 300 roller 310 elastic body 400 ... Mounting substrate, 410 ... Terminal, F ... Tensile force

Claims (8)

A manufacturing method of a mounting structure, comprising: a mounting substrate; and an electronic component having an active surface with a bump electrically connected to the mounting substrate side, wherein the electronic component is mounted on the mounting substrate via a resin layer. And
Forming a component of the electronic component including the bump in each of a plurality of regions in the substrate for forming the electronic component; and
After the forming step, a temporary bonding step of collectively bonding the resin film over the plurality of regions of the forming substrate;
After the temporary bonding step, the forming substrate is separated into pieces to form the electronic component and the resin film is separated into pieces to form the resin layer; and
A fixing step of fixing the electronic component to the mounting substrate via the resin layer,
In the temporary bonding step, the resin film having a groove-shaped recess is disposed with the recess facing the active surface of the electronic component, and then the resin film is melted to fill the recess with the molten resin material. And a method for manufacturing a mounting structure, wherein the resin film is temporarily bonded to the active surface.   The resin film has a cutting portion that is supported by the support film and is linearly provided along the surface direction, and the temporary bonding step is orthogonal to the cutting portion in the surface direction in the support film. The mounting structure according to claim 1, wherein the resin film is disposed in a state in which a tensile force in a direction is applied to form the cut portion as the concave portion.   In the temporary bonding step, the support film is peeled from the resin film after the resin film is heated and melted in a state in which a surface to be an active surface of the electronic component is vertically upward. Item 3. A method for manufacturing a mounting structure according to Item 2. The electronic component has a plurality of the bumps arranged in a row,
In the temporary bonding step, the resin film is brought into contact with a surface to be an active surface of the electronic component, and the resin film is pressed with a roller having a protruding elastic body whose width is narrower than the interval between the bumps, The mounting structure according to claim 1, wherein the resin film is disposed.   5. The method for manufacturing a mounting structure according to claim 4, wherein a roller whose height of the elastic body is equal to or higher than a height of the bump is used as the roller in the temporary bonding step.   6. The method for manufacturing a mounting structure according to claim 4, wherein, in the temporary bonding step, the resin film is pressed by rolling and moving the roller along the groove-shaped recess.   The mounting structure according to any one of claims 4 to 6, wherein, in the temporary bonding step, the resin film is pressed by rolling and moving the roller along a direction orthogonal to the arrangement of the bumps. Manufacturing method.   8. The resin film according to claim 1, wherein in the temporary bonding step, a resin film having a plurality of recesses extending in parallel to each other and having an interval between the recesses smaller than an interval between the bumps is used as the resin film. A method for manufacturing a mounting structure according to one item.

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