JP2009214484A - Method for manufacturing card, and card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a card manufacturing method which enables cards easily to be stacked and integrated and stably fed with an issuing machine by absorbing ununiformity in their thickness without carrying out an operation of insertion and removal of an interleaving paper at each process to avoid damages to a card surface and can prevent the cards from generating scratches and unevenness caused by friction between cards during packing, transportation and storage, and to provide a card. <P>SOLUTION: The card manufacturing method includes the process for laminating and pressing an over-sheet on at least one surface of a center core sheet to obtain a card base 30 with a plurality of card shaped parts multi-faced, and the process for punching the card base into a card shape to obtain a card. After the process for obtaining the card base and before the process for punching the card base, a plurality of discontinuous projected parts having a thickness of 0.01 to 0.02 mm are formed on either the front or rear surface of the card shaped part of the card base. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a magnetic card such as a credit card or a cash card, an ID card such as an IC card or an employee card, and a card based on the manufacturing method.

  Currently popular cards include general cards such as magnetic cards such as credit cards, contact IC cards, and non-contact IC cards used for commuter passes and the like recently for transportation. These cards are generally made of a sheet substrate made of a thermoplastic resin such as hard vinyl chloride. Normally, offset printing or screen printing is performed on the front and back of the center core sheet made of white vinyl chloride, and transparent hard vinyl chloride sheets (oversheets) are pasted on the front and back, and then melt laminated by a hot press method. At this time, the magnetic tape is embedded at a specified position. For example, in the case of a non-contact IC card, a center core sheet sandwiched with an inlet made of an antenna sheet containing an IC chip is sandwiched between outer printed sheets on the front and back sides, melt laminated and integrated. ing.

  In general cards such as magnetic cards, the difference in the thickness of the printed (printed design display) part becomes a problem, and in the case of a contact type IC card, the difference in height when the IC module is thicker than the card substrate surface becomes a problem. It was. In particular, in a contact type and a non-contact type IC card, there is a case where an inclination occurs when the cards are stacked and integrated due to a difference in thickness between the IC module unit and the non-IC module unit. In this case, handling mistakes are likely to occur during the card issuance process, and thus it is necessary to make the thickness of the cards uniform and reduce the inclination when stacked and integrated.

  In order to eliminate the thickness of the IC module part, Patent Document 1 discloses that an IC chip is positioned at a position corresponding to the IC chip of the center core sheet layer sandwiched between the vinyl chloride printed core sheet layers of the same thickness on both sides. There is disclosed an IC card having an IC chip placement portion on which a chip is placed, and the IC chip placement portion is a hole. Further, a manufacturing method is disclosed in which a vinyl chloride core sheet, a transparent oversheet, and the like are heated to the fusion temperature of vinyl chloride and all the sheets are pressure-bonded and laminated at once.

  In addition to the above problems, there is a problem that the card surface is rubbed when a foreign object or dust is caught in the card, and the card is easily damaged. In particular, a card with a premium credit function called a premium card or a membership card with a face photo that identifies a good customer is required to have no defects in appearance quality along with the security function. There are an increasing number of high-gloss blacks and gold-colored scratches that tend to stand out.

Various techniques are provided for the surface protection of these cards. For example, Patent Document 2 discloses a high-quality, high mechanical strength, highly falsification-preventing material that has an image-receiving layer, a hologram, and a UV-curable resin surface protective layer on a support. A method of obtaining an ID card and such a card is disclosed. Patent Document 3 discloses an ID card creation (issuance) device that can form a high-quality, durable image intermediate protective layer on an image formed on an ID card by thermal transfer, and further form an ultraviolet curable resin layer. Is disclosed. Further, Patent Document 4 discloses a card in which an overcoat layer having heat resistance and wear resistance is formed on an outer peripheral edge portion having no print recording area on one side of the card.
JP 2002-197433 A JP 2003-266974 A Japanese Patent Laid-Open No. 2003-1976 JP-A-5-155193

  However, the IC card disclosed in Patent Document 1 has a problem in that, instead of eliminating the bulge in the vicinity of the IC module, the vicinity of the IC module has a concave shape and distortion occurs on the card surface. In addition, the techniques disclosed in Patent Documents 2 and 3 are effective for protecting the surface of a card that is completed and used, but cannot deal with scratches or defective factors that occur in the card manufacturing process. In other words, the card base in the card manufacturing process is punched to the card size after the lamination and pressing in the state where the multi-faceted card shape has been applied. Furthermore, in hybrid cards and dual interface cards, counterbore (milling) and IC assembly processing are performed. It is necessary to take measures against scratches in the card manufacturing process from inspection to 0th issuance. Furthermore, due to scratches during packaging or transportation or storage for personal issuance by customers, the printed image is missing in the second issuance. The current situation is that a large loss has occurred. Further, in the card disclosed in Patent Document 4, since the overcoat layer having heat resistance and wear resistance formed on the outer peripheral edge is hard, there is a problem that it is easy to cause damage to the counterpart card when stacked. When stacked and accumulated, the portion surrounded by the overcoat layer is depressurized to cause an adsorption phenomenon, which makes it difficult to handle and causes a feed failure in the issuing machine.

  In order to avoid the above-mentioned problems, for example, a slip sheet is inserted between the card base and the card base or between the cards, and the slip sheet is removed before each process work. It took a lot of work, such as inserting slip sheets for each sheet, and it was practically difficult to implement. For this reason, inefficient items such as adding a lot of spares have been required for items with strict external quality requirements.

  The present invention solves such problems of the prior art, and the object of the present invention is to eliminate the need to remove and insert slip sheets in each process in order to avoid scratching the card face, and to reduce the thickness of the card. Card manufacturing method that can be easily stacked and integrated by absorbing water, can be stably fed by an issuing machine, and can prevent scratches and unevenness due to rubbing between cards during packing, transportation, and storage, and the like It is to provide a card obtained by.

  The invention according to claim 1 of the present invention comprises a step of laminating and pressing an oversheet on at least one surface of a center core sheet to obtain a card base having a plurality of card-shaped portions, and the card base is formed into a card shape. In the method of manufacturing a card having a step of obtaining a punched card, on the front or back surface of the card shape portion of the card base after the step of obtaining the card base and before the step of punching the card base, A card manufacturing method comprising a step of forming a plurality of discontinuous convex portions having a thickness of 0.01 to 0.02 mm.

  The invention according to claim 2 of the present invention is characterized in that the convex portion formed on the card-shaped portion is formed at a corner or an outer peripheral portion of the card-shaped portion. Card manufacturing method.

The invention according to claim 3 of the present invention is characterized in that the convex portion formed in the card-shaped portion is formed in a region other than the print recording region of the card-shaped portion. The card manufacturing method according to any one of the above.

  Next, the invention according to claim 4 of the present invention is characterized in that a plurality of discontinuous convex portions having a thickness of 0.01 to 0.02 mm are formed on either the front or back surface of the card-shaped portion. Card.

  The invention according to claim 5 of the present invention is the card according to claim 4, wherein the convex portion is formed at a corner or an outer peripheral portion of the card-shaped portion.

  The invention according to claim 6 of the present invention is characterized in that the convex portion is formed in an area other than the print recording area of the card-shaped part. Card.

  Next, the invention according to claim 7 of the present invention is characterized in that the convex portion is formed of a transparent resin having a pencil hardness of 2B or less, according to any one of claims 4 to 6. Card.

  According to the card manufacturing method of the present invention, after the step of obtaining the card base, and before the step of punching out the card base, the thickness of 0.01 on the front or back surface of the card shape portion of the card base Since it has a process of forming a plurality of non-continuous convex portions of ~ 0.02 mm, there is a portion to be protected on the card face, which is particularly sensitive to scratching, or a portion which becomes a source of scratches when the cards are stacked. By not making contact, it is not necessary to remove or put in paper in each process. In addition, since the thickness of the card is absorbed, it can be stacked and integrated in an aligned state, so that it can be fed as it is by a machine. In addition, it is possible to prevent scratches and unevenness due to rubbing between cards during packing, transportation, and storage.

  Further, according to the card of the present invention, the surface between the stacked cards does not rub against each other in various handlings, and thus the card can be made hard to be damaged. Further, by making the convex side contact with the mating member during conveyance or handling, the card and the mating material can be hardly damaged. In general, even when cards having a hardness of about HB are laminated, the protrusions do not scratch the card, and deterioration in appearance quality can be prevented. As a result, an extra spare card is not required, and the cost reduction effect is great.

  The card manufacturing method of the present invention will be described below based on an embodiment.

  FIG. 1 is a schematic diagram for explaining a part of the steps of the card manufacturing method of the present invention. FIG. 2 is a schematic diagram for explaining an embodiment of the card obtained by the card manufacturing method of the present invention. (A) is a schematic view of one side of the card as viewed from an oblique direction, and (b) is one side. It is the schematic diagram seen from right above. FIG. 3 is a schematic view for explaining a convex formation region in an embodiment of the card manufacturing method of the present invention. FIG. 4 is a flowchart for explaining a simplified manufacturing process in an embodiment of the card manufacturing method of the present invention. FIG. 5 is a schematic diagram for explaining in cross section the configuration of an embodiment of the card obtained by the card manufacturing method of the present invention. FIG. 5 (a) shows a configuration example of a conventional non-contact type IC card. b) is a schematic view showing a configuration of a non-contact type IC card obtained by the card manufacturing method of the present invention in which a convex portion is formed on one side where the IC module side is slightly swollen.

Cards are used for various purposes such as credit cards, cash cards, identification cards, and membership cards. Recently, the use of IC cards in which IC chips are embedded is increasing from conventional magnetic cards. Generally, it consists of 3-4 layers using a hard vinyl chloride (PVC) sheet. Usually, offset printing or screen printing is performed on the front and back sides of a white vinyl chloride sheet (core sheet) by multi-sided attachment, and a transparent hard vinyl chloride sheet (oversheet) is further attached to the front and back sides, and then melt laminated by a hot press method. At this time, the magnetic tape is embedded at a designated position. For example, in the case of a non-contact IC card, a core sheet sandwiched with an inlet is sandwiched between outer printed sheets on the front and back sides, respectively, and melt-laminated to form a card base.

  As described above, as the core sheet, an electrically insulating thermoplastic resin sheet can be used. Generally, a hard vinyl chloride (PVC) sheet is used. However, as an alternative to PVC that generates toxic gas during incineration, an amorphous material is used. (For example, Eastsr PET-G manufactured by Eastman Chemical Co., Inc .: terephthalic acid, glycol, 1,4 cyclohexanedimethanol copolymer) and the like can be preferably used. In this case, the surface sheet is preferably made of PET (biaxially stretched polyethylene terephthalate) as a material, and may have a rewrite layer as the outermost layer.

  In the heat press system, the core sheet and the oversheet on the front and back are sandwiched between large mirror plates, and then the card material is integrated by pressing while heating and melting. As the mirror plate used at this time, a nickel-chromium plated copper plate, a stainless steel plate having a polished surface, an aluminum plate having a polished surface, or the like can be used. Conventionally, after laminating and pressing, the card base is peeled off from the mirror plate and punched into a card shape as it is. However, the surface of the card to which the surface of the mirror surface plate is transferred is highly glossy, and is easily scratched by foreign matter biting or rubbing, and scratches are easily noticeable.

  In the card manufacturing method of the present invention, the card base is not punched into a card shape immediately after laminating and pressing, and is sent to the post-processing step, but after the step of obtaining the card base as shown in FIG. After a step of forming a plurality of discontinuous convex portions 2 having a thickness of 0.01 to 0.02 mm on either the front or back surface of the card-shaped portion 20 of the card base 30 before the step of punching The card 1 is obtained by punching the card-shaped portion 20 in the punching process. As for the formation of the convex portion, screen printing, inkjet printing (IJP), etc., in the card base state, on the front or back side of each card-shaped portion (card ticket surface) where there is no print recording area or on the outer periphery of the card Thus, a discontinuous convex part having a thickness of 0.01 to 0.02 mm is formed. As shown in FIG. 3, the convex portions are formed at, for example, the four corners where there is no print recording area of each card. When the card dimensions are 53.92 to 54.03 mm on the top and bottom and 85.47 to 85.72 mm on the left and right, and the convex portion is formed on the surface of the card, the top and bottom of the card are 6. In the range within 4 mm (JIS X6302-2), in consideration of the stability at the time of card lamination, convex portions are formed in the range of 1.0 mm or more inside from both the left and right ends. Note that the protrusions do not necessarily have to be arranged at the four corners, and it is also possible to arrange, for example, three points without a backlash in a triangular shape when stacked as a card.

  Regarding the height of the convex portion, the card layer thickness is 0.68 to 0.84 mm (JIS X6301) according to the standard of the contact type IC card, and the level difference between the terminal surface of the IC module and the card surface is −0.10. Since it is +0.05 mm (JIS X6303), there is a possibility that convex portions can be printed and formed within a height range of 0.01 to 0.05 mm. However, in the case of an IC card, it is better to increase the thickness of the card. Since manufacture is easy and it is preferable to make the height of a convex part low, it is preferable to set it as 0.01-0.02 mm. At this time, the size of the convex portion is preferably about ψ0.5 to 3.0 mm so as not to impair the commercial value of the appearance while fulfilling the function of preventing scratches, but the shape is not limited to a circle.

As a method for forming the convex portion, there are a printing method and a transfer method from the correlation with the processing pattern of the card shape portion (card ticket surface), but an appropriate thickness is not applied to the card ticket surface without applying excessive heat or solvent. As a method that can be ensured, a screen printing method or an ink jet printing method using a solvent-free ultraviolet curable transparent ink is recommended. Here, by using the transparent ink, the irregularities of the card can be absorbed and the inclination at the time of stacking can be prevented without impairing the design aesthetics of the card print.

  Also, since the normal card surface has a pencil hardness of about HB, the resin material constituting the convex portion is preferably one having a high elasticity with a pencil hardness of 2B or less. By using this transparent ink, it is possible to prevent scratches on the cards that are in contact during lamination. At this time, by further adding 1 to 10% by weight of an additive such as dimethyl silicone oil to the ink, the friction coefficient of the convex portion can be reduced, and the blocking property and wear of the convex portion can be suppressed. In addition, this addition stabilizes the wetting of the convex portion forming ink with respect to the card base in which silicone is generally added to the overprint layer itself, and it is possible to improve the convexity formation suitability.

  As described above, the thickness of 0.01 to 0.01 mm by screen printing or ink jet printing (IJP) or the like on the corner or card outer periphery of each card-shaped portion (card ticket surface) where there is no print recording area on either front or back side. The card base formed with a 0.02 mm non-continuous convex portion is then punched into the card by punching with a single-edged or male / female mold. Each card is subjected to various optional processing such as sign panel, hologram, and rewrite function as before. In the case of a contact type IC card, after cutting a predetermined position of the completed card, an IC chip can be attached with an adhesive. In these processing steps, the continuously stacked cards are automatically fed to the processing section by the machine. However, the card of the present invention can be fed without the need to remove / insert like slip sheets, and can be easily I can work.

  The cards in the cut state produced as described above are usually packed, transported and shipped to the customer in a state of being overlaid. Finally, individual information is put on the surface of the card together with magnetic encoding and IC encoding as secondary issuance (personalization) using an issuing machine according to the card specifications. Processing contents in a card issuing machine generally include embossing, monochrome printing (UG), color printing (photo CP), overcoat, tipping, indent processing, laser processing, and the like. In order to avoid the influence on the non-contact IC chip, the credit card mounted with the non-contact IC chip may be replaced by monochrome printing or color printing of a facial photograph instead of embossing. Since the card of the present invention is in a position that does not affect the CP printing area for printing a facial photograph and the UG (ultra graphic) printing area for monochrome printing at the time of the secondary issue, there is no influence on the issuing operation.

  The card obtained by the card manufacturing method of the present invention does not rub against the front and back of the ticket until the second issuance. Appearance quality with gloss maintained can be obtained. By adopting the card manufacturing method of the present invention described above, it is possible to provide a scratch-resistant card with extremely excellent appearance quality.

The schematic diagram explaining a part of process of the manufacturing method of the card | curd of this invention. The schematic diagram explaining one Embodiment of the card | curd obtained with the manufacturing method of the card | curd of this invention. Schematic explaining the formation area of the convex part in one Embodiment of the card | curd of this invention. The flowchart which simplifies and demonstrates the manufacturing process in one Embodiment of the manufacturing method of the card | curd of this invention. Schematic explaining the structure of one Embodiment of the non-contact IC card obtained with the manufacturing method of the card | curd of this invention in a cross section.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Card 2 ... Convex part 3 ... Magnetic stripe (tape)
DESCRIPTION OF SYMBOLS 4 ... IC module 5 ... Design printing surface 6 ... Antenna sheet 7 ... Core sheet 8 ... Intermediate sheet 9 ... Exterior sheet 10 ... Swelling part 11 ... Card surface 20 ... Card shape part 30 ... Card base

Claims (7)

A card comprising: a step of obtaining a card base in which a plurality of card-shaped portions are laminated on at least one surface of a center core sheet to obtain a card base; and a step of punching the card base into a card shape to obtain a card. In the manufacturing method of
After the step of obtaining the card base, before the step of punching out the card base, a discontinuous convex portion having a thickness of 0.01 to 0.02 mm is formed on either front or back surface of the card shape portion of the card base. A card manufacturing method comprising a plurality of steps of forming.   2. The card manufacturing method according to claim 1, wherein the convex portion formed on the card shape portion is formed at a corner portion or an outer peripheral portion of the card shape portion.   The card manufacturing method according to claim 1, wherein the convex portion formed in the card shape portion is formed in an area other than a print recording area of the card shape portion.   A card comprising a plurality of non-continuous convex portions having a thickness of 0.01 to 0.02 mm formed on either the front or back surface of the card-shaped portion.   The card according to claim 4, wherein the convex portion is formed at a corner portion or an outer peripheral portion of the card shape portion.   The card according to claim 4, wherein the convex portion is formed in a region that is not a print recording region of the card-shaped portion.   The card according to claim 4, wherein the convex portion is formed of a transparent resin having a pencil hardness of 2B or less.