JP2009201941A - Special prize - Google Patents

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JP2009201941A
JP2009201941A JP2008050215A JP2008050215A JP2009201941A JP 2009201941 A JP2009201941 A JP 2009201941A JP 2008050215 A JP2008050215 A JP 2008050215A JP 2008050215 A JP2008050215 A JP 2008050215A JP 2009201941 A JP2009201941 A JP 2009201941A
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chip
special prize
valuable material
substrate
circuit
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JP2008050215A
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JP5067943B2 (en
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Shinji Hoshi
真二 星
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NISSHO BUSSAN KK
Rhythm Watch Co Ltd
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NISSHO BUSSAN KK
Rhythm Watch Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a special prize rationally constituted in preventing forgery. <P>SOLUTION: The special prize includes a valuable object 200 and a contactless IC circuit 300 inside a case 100. The contactless IC circuit 300 is obtained by mounting an IC chip 320 and an antenna 330 on a board 310. The IC chip 320 is made to adhere to the valuable object 200. When the valuable object 200 is separated from the board 310, the IC chip 320 is separated from the board 310 together with the valuable object 200, and then, the contactless IC circuit 300 is broken. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、貴金属等の有価物を設けてなる特殊景品に関し、パチンコやスロットマシンで獲得した遊戯媒体に応じて交換される景品として利用されるものである。   The present invention relates to a special prize provided with valuables such as precious metals, and is used as a prize that is exchanged according to a play medium acquired by a pachinko or a slot machine.

一般に、特殊景品としては、カード型のケースの内部に有価物及び非接触式ＩＣ回路を設け、非接触式ＩＣ回路に景品としての価値をはじめとする各種情報を記憶させたものが知られている。特許文献１乃至５には、この種の特殊景品が開示されている。
特開平５−１６５８０号公報 特開平９−１８５６９２号公報 特開２００４−２１９７７号公報 特開２００６−２０９２２６号公報 実用新案登録第３１２４５１９号公報 In general, as a special prize, a valuable material and a non-contact IC circuit are provided inside a card-type case, and various information including values as prizes are stored in the non-contact IC circuit. Yes. Patent Documents 1 to 5 disclose this type of special prize.
Japanese Patent Laid-Open No. 5-16580 JP-A-9-185692 Japanese Patent Laid-Open No. 2004-21977 JP 2006-209226 A Utility Model Registration No. 3124519

さて、非接触式ＩＣ回路を設けてなる特殊景品は、その記録情報に基づいて流通されるため、有価物のみを偽物に置き換えるなどの偽造を防止する構成が重要とされる。   Now, since the special prize provided with the non-contact type IC circuit is distributed based on the recorded information, a configuration for preventing forgery such as replacing only valuables with counterfeits is important.

例えば、内部に設けられた有価物を取り出す場合は、特殊景品のケースを割って破壊することが通常であり、これを復元することは不可能である。しかし、偽造をしようと試みる者は、特殊景品の構成部材を分離し、有価物を取り出した後に復元しようとする。そこで、有価物を取り出すと非接触式ＩＣ回路の機能が損なわれる構成が必要であると考えられる。   For example, when taking out valuables provided inside, it is normal to break a special prize case and destroy it, and it is impossible to restore it. However, those who attempt to counterfeit will attempt to restore the components after separating the components of the special prize and taking out the valuables. Therefore, it is considered that a configuration in which the function of the non-contact IC circuit is impaired when a valuable material is taken out is necessary.

本発明は、かかる事情に鑑みてなされたものであり、その目的は、偽造を防止するという点でより合理的に構成された特殊景品を提供することである。   This invention is made | formed in view of this situation, The objective is to provide the special prize comprised more rationally at the point of preventing forgery.

本願第１請求項に記載した発明は、ケースの内部に有価物及び非接触式ＩＣ回路を設けてなる特殊景品において、前記非接触式ＩＣ回路は、基板にＩＣチップ及びアンテナを搭載してなるものであり、前記ＩＣチップは、前記有価物に接着し、前記有価物を前記基板から分離すると、前記有価物とともに前記ＩＣチップが前記基板から分離して、前記非接触式ＩＣ回路が破壊されるようにした構成の特殊景品である。   The invention described in claim 1 of the present application is a special prize in which a valuable material and a non-contact type IC circuit are provided inside a case. The non-contact type IC circuit includes an IC chip and an antenna mounted on a substrate. The IC chip is bonded to the valuable material, and when the valuable material is separated from the substrate, the IC chip is separated from the substrate together with the valuable material, and the non-contact IC circuit is destroyed. It is a special prize with a structure that is made up.

本願第２請求項に記載した発明は、請求項１において、前記ケースは、孔部を設けた中板を備え、前記有価物及び前記基板は、前記中板に対し、前記孔部を挟んで対向する位置に位置決めするともに、前記ＩＣチップは、前記孔部を通じて前記有価物に接着した構成の特殊景品である。   The invention described in claim 2 of the present application is that, in claim 1, the case includes an intermediate plate provided with a hole, and the valuables and the substrate sandwich the hole with respect to the intermediate plate. The IC chip is a special prize having a configuration in which the IC chip is bonded to the valuable material through the hole while being positioned at a position facing each other.

本願第３請求項に記載した発明は、請求項２において、前記中板には、前記孔部を囲むホログラムを設けた構成の特殊景品である。   The invention described in claim 3 of the present application is the special prize according to claim 2, wherein the intermediate plate is provided with a hologram surrounding the hole.

本発明によれば、偽造を防止するという点でより合理的に構成された特殊景品を得ることができる。   According to the present invention, it is possible to obtain a special prize structured more rationally in terms of preventing forgery.

以下に、本発明の実施例を図面に基づいて説明する。図１乃至図５に示す本例の特殊景品１は、ケース１００の内部に有価物２００及び非接触式ＩＣ回路３００を設けてなるものである。有価物２００としては、金又は銀といった貴金属の小型プレートを採用している。   Embodiments of the present invention will be described below with reference to the drawings. The special prize 1 of this example shown in FIGS. 1 to 5 is configured by providing a valuable material 200 and a non-contact type IC circuit 300 inside a case 100. As the valuable material 200, a small plate of noble metal such as gold or silver is adopted.

非接触式ＩＣ回路３００は、絶縁性の基板３１０にＩＣチップ３２０及びアンテナ３３０を搭載してなるものである。ＩＣチップ３２０は、基板３１０の所定の部位に搭載されるとともに、基板３１０に設けられた端子にワイヤで接続されている。アンテナ３３０は、基板３１０の表面にプリント成形されている。また、アンテナ３３０の表面には絶縁性の保護膜３４０が形成されており、ＩＣチップ３２０は絶縁性の封止材３５０で覆われている。   The non-contact type IC circuit 300 is obtained by mounting an IC chip 320 and an antenna 330 on an insulating substrate 310. The IC chip 320 is mounted on a predetermined part of the substrate 310 and is connected to a terminal provided on the substrate 310 with a wire. The antenna 330 is printed on the surface of the substrate 310. Further, an insulating protective film 340 is formed on the surface of the antenna 330, and the IC chip 320 is covered with an insulating sealing material 350.

ケース１００は、正面側ケース部材１１０、背面側ケース部材１２０、及びそれらの間に組み込まれる中板１３０とを備えた箱型又はカード型のものである。正面側ケース部材１１０、背面側ケース部材１２０、及び中板１３０は、それぞれ所定の形状に射出成形された合成樹脂製の部材であり、正面側ケース１１０と中板１３０との間に有価物２００を配置するとともに、背面側ケース１２０と中板１３０との間に非接触式ＩＣ回路３００を配置した状態で互いに接着されている。背面側ケース部材１２０の要所には、非接触式ＩＣ回路３００の基板３１０を嵌め込む基板装着部１２１が設けられており、中板１３０の要所には、有価物２００を嵌め込む有価物装着部１３１が設けられている。基板３１０は、その背面を基板装着部１２１に接着されている。   The case 100 is of a box type or a card type including a front side case member 110, a back side case member 120, and an intermediate plate 130 incorporated therebetween. The front-side case member 110, the back-side case member 120, and the intermediate plate 130 are synthetic resin members that are each injection-molded into a predetermined shape, and the valuable material 200 is interposed between the front-side case 110 and the intermediate plate 130. And the non-contact type IC circuit 300 is adhered to each other in a state where the non-contact type IC circuit 300 is disposed between the back side case 120 and the intermediate plate 130. A board mounting portion 121 for fitting the board 310 of the non-contact type IC circuit 300 is provided at the important point of the back side case member 120, and a valuable thing for fitting the valuable substance 200 at the important point of the intermediate plate 130. A mounting portion 131 is provided. The back surface of the substrate 310 is bonded to the substrate mounting portion 121.

本例の場合、有価物装着部１３１には、ＩＣチップ３２０の位置に対応する孔部１３２が設けられている。有価物２００及び基板３１０は、中板１３０に対し、孔部１３２を挟んで対向する位置に位置決めするともに、ＩＣチップ３２０は、孔部１３２を通じて有価物２００に接着している。具体的には、背面側ケース部材１２０の基板装着部１２１に基板３１０を装着し、その背面側ケース部材１２０に中板１３０を組み付け、ここでＩＣチップ３２０を覆う封止材３５０の表面に適量の接着剤３６０を塗布し、有価物２００を中板１３０の有価物装着部１３１に嵌め込んでいる。正面側ケース部材１１０は、その後に組み付ける。   In the case of this example, the valuable material mounting portion 131 is provided with a hole 132 corresponding to the position of the IC chip 320. The valuable material 200 and the substrate 310 are positioned at positions facing the intermediate plate 130 with the hole 132 therebetween, and the IC chip 320 is bonded to the valuable material 200 through the hole 132. Specifically, the substrate 310 is mounted on the substrate mounting portion 121 of the back side case member 120, and the intermediate plate 130 is assembled to the back side case member 120. Here, an appropriate amount is applied to the surface of the sealing material 350 that covers the IC chip 320. The adhesive 360 is applied, and the valuable material 200 is fitted in the valuable material mounting portion 131 of the intermediate plate 130. The front case member 110 is assembled thereafter.

また、中板１３０には、有価物装着部１３１及び孔部１３２を囲むホログラム１３３が設けられている。正面側ケース部材１１０、背面側ケース部材１２０、及び中板１３０のうち、少なくとも正面側ケース部材１１０は、その一部又は全部が透明又は半透明となっており、ケース１００の正面側から有価物２００及びホログラム１３３を目視することができるように構成されている。   In addition, the intermediate plate 130 is provided with a hologram 133 surrounding the valuable material mounting portion 131 and the hole portion 132. Among the front side case member 110, the back side case member 120, and the intermediate plate 130, at least the front side case member 110 is partly or entirely transparent or translucent, and is valuable from the front side of the case 100. 200 and the hologram 133 can be visually observed.

このような構成によると、有価物２００を基板３１０から分離すると、有価物２００とともにＩＣチップ３２０が基板３１０から分離して、非接触式ＩＣ回路３００が破壊される。すなわち、封止材３５０及び接着剤３６０を介して接着された有価物２００とＩＣチップ３２０との接着力が、基板３１０に対するＩＣチップ３２０の支持力よりも強力なものとなっており、有価物２００を中板１３０の有価物装着部１３１から取り出す際は、ＩＣチップ３２０が強制的に破壊分離される構成となっている。従って、有価物２００を偽物に置き換えて復元するという行為をより確実に防止することが可能である。更に、中板１３０には有価物装着部１３１及び孔部１３２を囲むホログラム１３３が設けられているので、ホログラム１３３を破損せずに有価物２００及びＩＣチップ３２０を中板１３０から分離することも不可能であり、かかる構成が偽造をより困難なものとしている。   According to such a configuration, when the valuable material 200 is separated from the substrate 310, the IC chip 320 is separated from the substrate 310 together with the valuable material 200, and the non-contact IC circuit 300 is destroyed. That is, the adhesive force between the valuable material 200 bonded through the sealing material 350 and the adhesive 360 and the IC chip 320 is stronger than the supporting force of the IC chip 320 with respect to the substrate 310, When the 200 is taken out from the valuable material mounting portion 131 of the intermediate plate 130, the IC chip 320 is forcibly broken and separated. Therefore, it is possible to more reliably prevent the act of replacing the valuable material 200 with a fake and restoring it. Further, since the intermediate plate 130 is provided with the hologram 133 surrounding the valuable material mounting portion 131 and the hole portion 132, the valuable material 200 and the IC chip 320 may be separated from the intermediate plate 130 without damaging the hologram 133. It is not possible and such a configuration makes counterfeiting more difficult.

尚、ケース１００を割って内部の有価物２００を取り出す通常の方法としては、様々な構成が考えられる。図５には、その一例を示しておく。このケース１００の場合、正面側ケース部材１１０と背面側ケース部材１２０との間には、コインや工具を刺し込むための溝部１０１が設けられており、この溝部１０１に力を加えることにより、正面側ケース部材１１０及び背面側ケース部材１２０が、それらの要所にそれぞれ設けられた切り込み１０２，１０３を起点にして割れる構成となっている。特に、背面側ケース部材１２０の切り込み１０３は、基板装着部１２１に設けられており、背面側ケース部材１２０が割れると、それに伴い基板３１０がアンテナ３３０もろとも割れる構成となっている。   In addition, various structures can be considered as a normal method of taking out the valuable material 200 by breaking the case 100. An example is shown in FIG. In the case 100, a groove portion 101 for inserting a coin or a tool is provided between the front side case member 110 and the back side case member 120. The side case member 110 and the back side case member 120 are configured to be cracked starting from the notches 102 and 103 provided at their respective points. In particular, the notch 103 of the back side case member 120 is provided in the board mounting part 121, and when the back side case member 120 is cracked, the board 310 is broken along with the antenna 330.

以上説明したように、本例の特殊景品１は、偽造を防止するという点で極めて信頼性の高いものである。尚、本例における各部の構成は、特許請求の範囲に記載した技術的範囲において適宜に設計変更が可能であり、図例説明したものに限定されないことは勿論である。例えば、本例では封止材３５０及び接着剤３６０を介して有価物２００をＩＣチップ３２０に接着したが、ＩＣチップ３２０を封止すると同時に有価物２００を封止材３５０に接着すれば、封止材３５０のみにて有価物２００を接着することも可能である。   As described above, the special prize 1 of this example is extremely reliable in terms of preventing forgery. In addition, it is needless to say that the configuration of each part in the present example can be appropriately changed in design within the technical scope described in the claims, and is not limited to that illustrated in the drawings. For example, in this example, the valuable material 200 is bonded to the IC chip 320 via the sealing material 350 and the adhesive 360. However, if the valuable material 200 is bonded to the sealing material 350 at the same time as the IC chip 320 is sealed, the sealing is performed. It is also possible to bond the valuable material 200 using only the stopper 350.

本発明の特殊景品は、パチンコやスロットマシンで獲得した遊戯媒体に応じて交換される景品として好適に利用することが可能である。   The special prize of the present invention can be suitably used as a prize that is exchanged according to a game medium acquired by a pachinko or slot machine.

本発明の実施例に係り、（ａ）は特殊景品を示す正面図、（ｂ）は（ａ）のＸ−Ｘ断面図である。(A) is a front view which shows a special prize, (b) is XX sectional drawing of (a) concerning the Example of this invention. 本発明の実施例に係り、特殊景品の分解断面図である。It is an exploded sectional view of a special prize according to an embodiment of the present invention. 本発明の実施例に係り、非接触式ＩＣ回路の正面図である。1 is a front view of a non-contact IC circuit according to an embodiment of the present invention. 本発明の実施例に係り、特殊景品の要部を示す断面図である。It is sectional drawing which concerns on the Example of this invention and shows the principal part of a special prize. 本発明の実施例に係り、特殊景品から有価物を取り出す方法を示す断面説明図である。It is sectional explanatory drawing which shows the method of taking out valuables from a special prize according to the Example of this invention.

符号の説明Explanation of symbols

１ 特殊景品
１００ ケース
１０１ 溝部
１０２ 切り込み
１０３ 切り込み
１１０ 正面側ケース部材
１２０ 背面側ケース部材
１２１ 基板装着部
１３０ 中板
１３１ 有価物装着部
１３２ 孔部
１３３ ホログラム
２００ 有価物
３００ 非接触式ＩＣ回路
３１０ 基板
３２０ ＩＣチップ
３３０ アンテナ
３４０ 保護膜
３５０ 封止材
３６０ 接着剤 DESCRIPTION OF SYMBOLS 1 Special prize 100 Case 101 Groove part 102 Notch 103 Notch 110 Front side case member 120 Back side case member 121 Substrate mounting part 130 Middle plate 131 Valuable material mounting part 132 Hole part 133 Hologram 200 Valuable object 300 Non-contact IC circuit 310 Substrate 320 IC chip 330 Antenna 340 Protective film 350 Sealing material 360 Adhesive

Claims (3)

ケースの内部に有価物及び非接触式ＩＣ回路を設けてなる特殊景品において、
前記非接触式ＩＣ回路は、基板にＩＣチップ及びアンテナを搭載してなるものであり、
前記ＩＣチップは、前記有価物に接着し、
前記有価物を前記基板から分離すると、前記有価物とともに前記ＩＣチップが前記基板から分離して、前記非接触式ＩＣ回路が破壊されるようにしたことを特徴とする特殊景品。 In special prizes where valuables and non-contact IC circuits are provided inside the case,
The non-contact IC circuit is formed by mounting an IC chip and an antenna on a substrate,
The IC chip is bonded to the valuable material,
A special prize characterized in that when the valuable material is separated from the substrate, the IC chip is separated from the substrate together with the valuable material, and the non-contact IC circuit is destroyed. 前記ケースは、孔部を設けた中板を備え、
前記有価物及び前記基板は、前記中板に対し、前記孔部を挟んで対向する位置に位置決めするともに、前記ＩＣチップは、前記孔部を通じて前記有価物に接着したことを特徴とする請求項１記載の特殊景品。 The case includes an intermediate plate provided with a hole,
2. The valuable material and the substrate are positioned at positions facing the intermediate plate with the hole interposed therebetween, and the IC chip is bonded to the valuable material through the hole. 1 special prize. 前記中板には、前記孔部を囲むホログラムを設けたことを特徴とする請求項２記載の特殊景品。   The special prize according to claim 2, wherein a hologram surrounding the hole is provided on the intermediate plate.
JP2008050215A 2008-02-29 2008-02-29 Special prize Active JP5067943B2 (en)

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JP2012187151A (en) * 2011-03-08 2012-10-04 Global:Kk Free gift card for game

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JPH04307085A (en) * 1991-04-01 1992-10-29 Nippon Signal Co Ltd:The Card self-containing merchandise
JP2002193366A (en) * 2000-12-28 2002-07-10 Tokyo Union Circulation Kk Noble metal storing case
JP2006209226A (en) * 2005-01-25 2006-08-10 Primotech:Kk Contactless ic card product
JP2007209673A (en) * 2006-02-13 2007-08-23 Nec Tokin Corp Individual authentication medium and premium for game facility
JP2008114040A (en) * 2006-10-10 2008-05-22 Matsushita Electric Works Ltd Discrete type prize
JP2008188169A (en) * 2007-02-02 2008-08-21 Matsushita Electric Works Ltd Premium issuance content using system
JP2008188171A (en) * 2007-02-02 2008-08-21 Matsushita Electric Works Ltd Premium issuance system
JP2008188170A (en) * 2007-02-02 2008-08-21 Matsushita Electric Works Ltd Premium issuance-purchase system
JP2009153567A (en) * 2007-12-25 2009-07-16 Esuko:Kk Game premium

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012187151A (en) * 2011-03-08 2012-10-04 Global:Kk Free gift card for game

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