JP2009192426A - Sensor element and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sensor element with improved precision in a finished size, and to provide a manufacturing method of the sensor element. <P>SOLUTION: The sensor element comprises drive electrode sections 51-1, 51-5 provided at the left side of a symmetry axis Y of a substrate 10 and drive electrode sections 51-3, 51-7 provided at the right side of the symmetry axis Y; while the drive electrode sections 51-1, 51-5 and the drive electrode sections 51-3, 51-7 have mutually identical layer structures. The sensor element has dummy layers 57e3, 57f3 formed, while they are not electrically connected to other wires, adjacent to the drive electrode sections 51-3, 51-7 at the same spacing distance as that among the drive electrode sections 51-1, 51-5, a wiring section 51c5, a wiring section 52c1, and a wiring section 52c3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sensor element provided with first and second members having the same layer structure on the surface of a substrate, and a method for manufacturing the same.

  Conventionally, a vibrator supported on a substrate in a displaceable manner, a movable electrode connected to the vibrator and displaced integrally with the vibrator on the substrate, and fixed on the substrate so as to face the movable electrode A sensor element for detecting a physical quantity such as an angular velocity, comprising a plurality of electrode portions composed of fixed electrodes, and a plurality of wirings provided on the substrate and connected to each of the movable electrodes and the fixed electrodes, respectively, to pass electrical signals. And the sensor apparatus containing the sensor element is known well (for example, refer patent document 1).

  FIG. 4 is a schematic plan view of an angular velocity detection element made of a semiconductor and incorporated in the sensor device disclosed in Patent Document 1. In this angular velocity detection element, drive electrode portions 51-1 to 51-4 for driving the main frames 30-1 and 30-2 with respect to the substrate 10 in the X-axis direction are provided on the main frames 30-1 and 30-2. The terminal portions 32-1 to 32-4 are arranged at positions outside the X-axis direction so as to face each other in the X-axis direction. Then, alternating current components having opposite phases to each other are input to “the left drive electrode portions 51-1 and 51-3 in FIG. 4” and “the right drive electrode portions 51-2 and 51-4 in FIG. 4”. As a result, the main frames 30-1 and 30-2 are vibrated in the X-axis direction with respect to the substrate 10. In this state, when an angular velocity acts around the Z-axis orthogonal to the substrate 10, the vibrator 20 starts to vibrate in the Y-axis direction perpendicular to the X-axis and the Z-axis with an amplitude proportional to the angular velocity due to the Coriolis force.

  As disclosed in paragraph [0043] of Patent Document 1, various electrode portions 51-1 to 51-4, 52-1 to 52-4, 53-1 to 53-4, and 54-1 to 54 are provided. -4, 55-1 to 55-4, and 56-1 to 56-4, not only each fixed electrode and each movable electrode, but also each wiring part is provided symmetrically in four directions with respect to the element center. Good detection accuracy can be obtained. In particular, by making the length, width, and thickness of each wiring portion in the same type of electrode portion the same, the electrical characteristics such as the capacitance and resistance value of each wiring portion are matched. Further, as disclosed in paragraph [0045, 0046] of Patent Document 1, various beams 33-1 to 33-4, 42a to 42d, 43a to 43d, 44a to 44d, and 45a to 45d are By equalizing the distance to the beams on both sides with respect to the beam, the beam itself can be formed symmetrically with respect to its axial direction, and the influence on the element characteristics can be eliminated.

  On the other hand, unlike the angular velocity detection element of FIG. 4 having a symmetric structure with respect to the X-axis direction and the Y-axis direction, some structures may be formed asymmetrically. FIG. 5 is a schematic plan view of a semiconductor angular velocity detection element built in the sensor device disclosed in Patent Document 2, characterized in that a part of the structure of the element is asymmetrical. It is shown. In this angular velocity detection element, the drive electrode portions 51-1 and 51-2 are arranged at the X-axis direction outer positions of the protrusions 36 a and 36 b at the outer end portions in the X-axis direction of the main frames 30-1 and 30-2. The drive electrode portions 51-3 and 51-4 are disposed at the X-axis direction inner side positions of the projecting portions 36c and 36d at the outer end portions in the X-axis direction of the main frames 30-3 and 30-4. Then, voltages having alternating current components of opposite phases are input to “the left drive electrode portions 51-1 and 51-2 in FIG. 5” and “the right drive electrode portions 51-3 and 51-4 in FIG. 5”. Accordingly, the main frames 30-1 to 30-4 are vibrated in the X-axis direction with respect to the substrate 10. In this state, when an angular velocity acts around the Z-axis, the vibrators 20-1 and 20-2 start to vibrate in the Y-axis direction with an amplitude proportional to the angular velocity due to the Coriolis force.

  As disclosed in paragraph [0093] of Patent Document 2, the drive electrode portions 51-1 to 51-4 and the drive monitor electrode portions 52-1 to 52-4 are arranged asymmetrically in the X-axis direction (Y (Asymmetric structure with respect to the axial direction), a charge amplifier (amplifying a signal output from the electrode pad 23c and outputting it to a drive circuit for supplying a drive signal to each of the electrode pads 51e1 to 51e4) The drive voltage can be increased while avoiding saturation (not shown in FIG. 5).

On the other hand, as a sensor having a symmetrical structure, Patent Document 3 discloses a mechanical quantity sensor in which the arrangement of electrode pads and dummy pads is symmetric with respect to the center of the detection unit.
Japanese Patent No. 3525862 Japanese Patent No. 351004 JP 2003-14777 A

  However, as shown in FIG. 5, if there is an asymmetrical shape portion on the surface of the substrate, even if the shape portions are designed to have the same dimensions, the etching aperture ratio (entire element) The ratio of the etching area to the area) and the etching space tend to cause a difference in the finished dimensions of the shape portion. As a result, for example, an offset (sensitivity, zero point, etc.) of detection characteristics of the sensor may occur.

  In this regard, Patent Document 3 discloses that the pattern shape of the dummy pad and the dummy wiring portion is the same as the pattern shape of the electrode pad and the wiring portion, but the shape is mutually the same. No means for disclosing is disclosed.

  In view of the above, an object of the present invention is to provide a sensor element with improved accuracy of finished dimensions and a manufacturing method thereof.

In order to achieve the above object, a sensor element according to the present invention comprises:
First and second members having the same layer structure are provided on the surface of the substrate,
The first member is provided on a first side in a direction orthogonal to the reference direction with respect to a reference direction parallel to the surface, and the second member is provided on a second side in a direction orthogonal to the reference direction. A sensor element provided with a member,
A dummy member electrically disconnected from the member provided on the surface, and a positional relationship between the first member and a third member provided on the surface adjacent to the first member; It is provided adjacent to the second member in an equal positional relationship.

  Here, in the reference direction or the orthogonal direction, it is preferable that the adjacent interval between the dummy member and the second member and the adjacent interval between the first member and the third member are equal to each other. Further, the third member may be a member that is not electrically connected to a member provided on the surface. The first member and the second member are preferably an electrode part or a wiring part electrically connected to the electrode part. For example, the electrode part is more preferably a drive electrode part. It is.

In order to achieve the above object, a method for manufacturing a sensor element according to the present invention includes:
First and second members having the same layer structure are provided on the surface of the substrate,
The first member is provided on a first side in a direction orthogonal to the reference direction with respect to a reference direction parallel to the surface, and the second member is provided on a second side in a direction orthogonal to the reference direction. A method of manufacturing a sensor element, wherein a member is provided,
A dummy member electrically disconnected from a member provided on the surface, and a positional relationship between the first member and a third member provided on the surface adjacent to the first member; It is characterized by being provided adjacent to the second member in an equal positional relationship.

  According to the present invention, the accuracy of finished dimensions can be improved.

  The best mode for carrying out the present invention will be described below with reference to the drawings. FIG. 1 is a schematic plan view of an angular velocity detection element made of a semiconductor according to the first embodiment. FIG. 2 is a schematic plan view of an angular velocity detecting element made of a semiconductor according to the second embodiment.

  As shown in FIG. 3, in order to manufacture the element, first, a single crystal silicon layer (for example, film thickness) is formed on the upper surface of the single crystal silicon layer via a silicon oxide film (for example, film thickness: 4.5 μm). An SOI (Silicon On Insulator) substrate having a thickness of 40 μm is prepared, and the single crystal silicon layer is doped with impurities such as phosphorus and boron to reduce the resistance of the upper surface portion of the single crystal silicon layer, that is, the conductive band layer B. . Then, using the lowermost single crystal silicon layer as the substrate 10, the silicon oxide film (insulating layer A) as the intermediate layer and the conductive band layer as the uppermost layer are removed by reactive etching or the like, and a hydrofluoric acid aqueous solution or the like is used. Various functional components are formed on the substrate 10 by removing only the silicon oxide film (insulating layer A) while leaving the uppermost conductive band layer by etching.

  In FIGS. 1 and 2, the pattern is different between a member having no gap between the upper surface of the substrate 10 and a member having a gap, and the former insulating layer (intermediate layer) and conductive band layer (uppermost layer) are shown. The part from which both are removed is shown in white, and the part from which only the latter insulating layer (intermediate layer) is removed is shown as a dot pattern. In the following description, this dot pattern portion will be described as a portion floating from the substrate 10. A portion where both the insulating layer (intermediate layer) and the conductive band layer (uppermost layer) are left on the substrate 10 is shown by a net pattern, and this net pattern portion will be described as a portion fixed to the substrate 10 below.

  In order to describe the embodiment of the present invention based on the mechanical quantity detection device disclosed in Patent Document 2, in the configuration of FIGS. 1 and 2, the same part as the configuration disclosed in Patent Document 2 is the same as that. The description is omitted or simplified.

  In FIG. 1, the substrate 10 has two sides extending in parallel to the X-axis direction parallel to the substrate 10 and two sides extending in parallel to the Y-axis direction in a direction orthogonal to the substrate 10 and the X-axis. It is formed in a square shape. On the substrate 10, a pair of vibrators 20-1, 20-2 is floated from the substrate 10 and disposed at a symmetrical position in the X-axis direction. Long and wide main frames 30-1 and 30-2 are arranged on both outer sides of the vibrator 20-1 in the Y-axis direction so as to float from the substrate 10 and extend in the X-axis direction. Long and wide main frames 30-3 and 30-4 are also floated from the substrate 10 and extended in the X-axis direction on both outer sides in the Y-axis direction of the vibrator 20-2.

  The vibrator 20-1 has long and wide arm portions 21a and 21b that are integrally extended to the outside in the X-axis direction at both ends in the Y-axis direction. The arm portions 21a and 21b are connected to both ends in the X-axis direction of the main frames 30-1 and 30-2 via a pair of long and narrow detection beams 31a and 31b at both ends in the X-axis direction, respectively. Thus, the detection beams 31a and 31b support the vibrator 20-1 with respect to the main frames 30-1 and 30-2 that are difficult to displace in the X-axis direction and easy to displace in the Y-axis direction. The detection beams 31a and 31b are formed integrally with the arm portions 21a and 21b and the main frames 30-1 and 30-2 so as to float from the substrate 10 and extend in the X-axis direction.

  The vibrator 20-2 also has arm portions 21c and 21d similar to the arm portions 21a and 21b, and the arm portions 21c and 21d pass through detection beams 31c and 31d similar to the detection beams 31a and 31b. The main frames 30-3 and 30-4 are connected to both ends in the X-axis direction. These detection beams 31c and 31d also support the vibrator 20-2 with respect to the main frames 30-3 and 30-4, which are difficult to displace in the X-axis direction and easy to displace in the Y-axis direction.

  Long and wide sub-frames 32-1 and 32-2 are suspended from the substrate 10 and extend in the X-axis direction outside the main frame 30-1 in the Y-axis direction. The subframe 32-1 is connected to the main frame 30-1 via a plurality of long and narrow driving beams 33a, and is fixed to the substrate 10 via a plurality of long and narrow driving beams 34a. Are connected to the plurality of anchors 35a. The driving beams 33a and 34a are formed integrally with the main frame 30-1 and the subframe 32-1 so as to float from the substrate 10 and extend in the Y-axis direction. On the other hand, it is supported to be easily displaced in the X-axis direction and difficult to be displaced in the Y-axis direction.

  Subframes 32-2, 32-3, and 32-4 are also provided outside the main frames 30-2, 30-3, and 30-4 in the Y-axis direction, as in the case of the main frame 30-1. It has been. Each of the main frames 30-2, 30-3, and 30-4 also includes a plurality of driving beams 33b to 33d, subframes 32-2, 32-3, and 32-4, and a plurality of driving beams 34b to 33d. 34d and the plurality of anchors 35b to 35d are supported by the substrate 10 so as to be easily displaced in the X-axis direction and difficult to be displaced in the Y-axis direction.

  The main frame 30-1 and the main frame 30-3 are connected to each other through a plurality of long and narrow link beams 41a and 41c and a long and wide link 42a. The link beams 41a and 41c are integrally formed with the main frames 30-1 and 30-3 so as to be floated from the substrate 10, and are connected to the main frames 30-1 and 30-3 at one end, respectively, and in the Y-axis direction. And connected to the link 42a at each other end. The link 42a is also formed integrally with the main frames 30-1 and 30-3 so as to float from the substrate 10, and extends in the X-axis direction.

  Similarly to the main frames 30-1 and 30-3, the main frame 30-2 and the main frame 30-4 also have a plurality of long and narrow link beams 41b and 41d and long and wide links. It is connected via 42b.

  The links 42a and 42b are connected to each other through a plurality of long and narrow sub-link beams 43a and 43b and a long and wide sub-link 44a at each end. The sub-link beams 43a and 43b are formed so as to float from the substrate 10 integrally with the links 42a and 42b, are connected to the links 42a and 42b at one end, and extend in the X-axis direction. Are connected to the sub-links 44a. The sub link 44a is also formed so as to be lifted from the substrate 10 integrally with the links 42a and 42b, and extends in the Y-axis direction. In addition, these links 42a and 42b are connected to the other end via a plurality of long and narrow sub-link beams 43c and 43d and a long and wide sub-link 44b similar to the case of the one end. It is connected.

  Further, on the substrate 10, drive electrode portions 51-1 to 51-4 for driving the main frames 30-1 to 30-4 with respect to the substrate 10 in the X-axis direction, and the main frames 30-1 to 30-4. Drive monitor electrode units 52-1 to 52-4 for monitoring vibration in the X-axis direction with respect to the substrate 10 of 30-4, and vibration in the Y-axis direction with respect to the substrate 10 of the vibrators 20-1 and 20-2 are detected. Detection electrode portions 53-1 to 53-4 for adjusting the frequency, the adjusting electrode portions 54-1 to 54-4 for adjusting the resonance frequency in the Y-axis direction of the vibrators 20-1 and 20-2, and the vibrator Servo electrode portions 55-1 to 55-4 for suppressing vibration in the Y-axis direction of 20-1 and 20-2 are provided.

  The drive electrode portions 51-1 and 51-2 are projecting portions 36 a that extend from the substrate 10 integrally with the outer ends of the main frames 30-1 and 30-2 on the outer side in the Y-axis direction. 36b is provided on the outer side in the X-axis direction. These drive electrode portions 51-1 and 51-2 are comb-like movable electrode fingers 51 a 1 and 51 a 2 extending in the X-axis direction, and a comb-like fixed electrode finger 51 b 1 extending in the X-axis direction. , 51b2 respectively.

  The movable electrode fingers 51a1 and 51a2 are formed so as to float from the substrate 10 and integrally extend outward from the protrusions 36a and 36b in the X-axis direction, and enter the central positions in the Y-axis direction between the fixed electrode fingers 51b1 and 51b2. Then, it faces the adjacent fixed electrode fingers 51b1 and 51b2. The fixed electrode fingers 51b1 and 51b2 are connected to pad portions 51d1 and 51d2 integrally fixed on the substrate 10 through wiring portions 51c1 and 51c2 integrally fixed on the substrate 10, respectively. Electrode pads 51e1 and 51e2 made of a conductive metal (for example, aluminum) are provided on the upper surfaces of the pad portions 51d1 and 51d2, respectively.

  The drive electrode portions 51-3 and 51-4 are projecting portions 36c that are floated and extended from the substrate 10 to the outside in the Y-axis direction integrally at the outer ends in the X-axis direction of the main frames 30-3 and 30-4. 36d is provided on the inner side in the X-axis direction. These drive electrode portions 51-3 and 51-4 are comb-shaped movable electrode fingers 51a3 and 51a4 extending in the X-axis direction, and comb-shaped fixed electrode fingers 51b3 extending in the X-axis direction. , 51b4, respectively.

  The movable electrode fingers 51a3 and 51a4 are formed so as to float from the substrate 10 and extend integrally from the protrusions 36c and 36d to the inside in the X-axis direction, and enter the center positions in the Y-axis direction of the fixed electrode fingers 51b3 and 51b4. Opposite to the adjacent fixed electrode fingers 51b3 and 51b4. The fixed electrode fingers 51b3 and 51b4 are connected to pad portions 51d3 and 51d4 integrally fixed on the substrate 10 via wiring portions 51c3 and 51c4 integrally fixed on the substrate 10, respectively. Electrode pads 51e3 and 51e4 made of conductive metal (for example, aluminum) are provided on the upper surfaces of the pad portions 51d3 and 51d4, respectively.

  The drive monitor electrode portions 52-1 and 52-2 are provided on the inner side in the X-axis direction of the projecting portions 36a and 36b (on the opposite side to the drive electrode portions 51-1 and 51-2 in the X-axis direction), respectively. These drive monitor electrode portions 52-1 and 52-2 are comb-shaped movable electrode fingers 52a1 and 52a2 extending in the X-axis direction, and comb-shaped fixed electrode fingers extending in the X-axis direction. 52b1 and 52b2 respectively.

  The movable electrode fingers 52a1 and 52a2 are formed so as to float from the substrate 10 and extend integrally from the protrusions 36a and 36b to the inside in the X-axis direction, and enter each central position in the Y-axis direction between the fixed electrode fingers 52b1 and 52b2. Then, it faces the adjacent fixed electrode fingers 52b1 and 52b2. The fixed electrode fingers 52b1 and 52b2 are connected to pad portions 52d1 and 52d2 that are integrally fixed on the substrate 10 via wiring portions 52c1 and 52c2 that are integrally fixed on the substrate 10, respectively. Electrode pads 52e1 and 52e2 made of a conductive metal (for example, aluminum) are provided on the upper surfaces of the pad portions 52d1 and 52d2, respectively.

  The drive monitor electrode portions 52-3 and 52-4 are provided on the outer side in the X-axis direction of the projecting portions 36c and 36d (on the opposite side to the drive electrode portions 51-3 and 51-4 in the X-axis direction), respectively. These drive monitor electrode portions 52-3 and 52-4 are comb-shaped movable electrode fingers 52a3 and 52a4 extending in the X-axis direction, and comb-shaped fixed electrode fingers extending in the X-axis direction. 52b3 and 52b4, respectively.

  The movable electrode fingers 52a3 and 52a4 are formed so as to float from the substrate 10 and integrally extend outward from the projecting portions 36c and 36d in the X-axis direction, and enter the central positions in the Y-axis direction between the fixed electrode fingers 52b3 and 52b4. Then, it faces the adjacent fixed electrode fingers 52b3 and 52b4. The fixed electrode fingers 52b3 and 52b4 are connected to pad portions 52d3 and 52d4 integrally fixed on the substrate 10 through wiring portions 52c3 and 52c4 integrally fixed on the substrate 10, respectively. Electrode pads 52e3 and 52e4 made of conductive metal (for example, aluminum) are provided on the upper surfaces of the pad portions 52d3 and 52d4, respectively.

  Further, on the substrate 10, the vibrators 20-1 and 20-2 and the main frames 30-1 to 30-4 are provided with driving beams 33 b and 34 b, a subframe 32-2, detection beams 31 a to 31 d, and links. Pad portions 23b connected through beams 41a to 41d, links 42a and 42b, sub link beams 43a to 43d, sub links 44a and 44b, wiring portions 23a, and the like are provided. Both the wiring part 23 a and the pad part 23 b are fixed to the upper surface of the substrate 10. An electrode pad 23c made of a conductive metal (for example, aluminum) is provided on the upper surface of the pad portion 23b.

  By the way, since the wiring part 51c1 related to the drive electrode part 51-1 and the wiring part 51c3 related to the drive electrode part 51-3 are parts through which the same or the same kind of electric signal (drive signal) passes, the wiring parts 51c1 and 51c3 In order to eliminate the difference in the electrical characteristics, the shapes of the wiring portions 51c1 and 51c3 or a part of those shapes are designed to be identical to each other. In the case of FIG. 1, the wiring portions 51c1 and 51c3 have at least the same linear portions, and their wiring areas are the same. For example, the wiring length q1 and the wiring width v1 of the wiring part 51c1 connecting the pad part 51d1 and the drive electrode part 51-1 are the wiring length (q31 + q32) of the wiring part 51c3 connecting the pad part 51d3 and the driving electrode part 51-3. And the wiring width v3 are designed to be the same. The same applies to the wiring part 51c2 related to the drive electrode part 51-2 and the wiring part 51c4 related to the drive electrode part 51-4.

  However, when members such as these wiring portions are formed by an etching apparatus using an SOI wafer, a space between the wiring portion and a member formed on the surface of the substrate 10 adjacent to the wiring portion (see FIG. 3). (L1, L2, L3, etc. shown) are different on both sides of the symmetry axis Y in the Y-axis direction of the substrate 10, so that members having the same shape or portions of the shape on both sides of the symmetry axis Y are designed. However, the wiring width of the wiring part to be formed changes, and the electrical characteristics of the wiring part fluctuate. In the case of a symmetric structure with respect to the symmetry axis Y in the Y-axis direction of the substrate 10, such a difference in space does not occur. However, in the case of an asymmetric structure with respect to the symmetry axis Y of the substrate 10 as shown in FIG. Such a space difference occurs. For this reason, when the asymmetric structure portion is compared, there is a difference in the processed dimensions after etching, which is easily affected by fluctuations in electrical characteristics.

  As shown in FIG. 3, the “member” is a portion having no gap between the substrate 10 and a portion having a two-layer structure of an insulating layer A and a conductive band layer B (for example, a wiring portion). And a part having a single-layer structure having only a conductive band B (for example, a beam, a frame, a protruding part, a movable electrode finger, etc.) It is.

  Therefore, dummy wirings 57a1, 57b1, 57c3, 57a2, 57b2, and 57c4 are fixedly formed on the upper surface of the substrate 10 in order to suppress the occurrence of a difference in electrical characteristics between wiring portions designed in the same shape. Is done. These dummy wirings are portions where both the insulating layer (intermediate layer) and the conductive band layer (uppermost layer) are left on the substrate 10 and are not electrically connected to other conductive band layers. is there. By not being electrically connected to other conductive band layers, generation of parasitic capacitance due to provision of dummy wirings can be suppressed.

  The dummy wiring 57a1 on the outer side in the Y-axis direction of the wiring part 51c1 is a gap distance w1 between the dummy wiring 57a1 and the wiring part 51c1, the wiring part 51c3, and the drive monitor electrode part 52-3 (or driving electrode) adjacent thereto in the Y-axis direction. It is arranged and designed at a position where the gap distance w3 with the portion 51-3) coincides. The dummy wiring 57b1 inside the Y-axis direction of the wiring part 51c1 and the dummy wiring 57c3 outside the Y-axis direction of the wiring part 51c3 are the gap distance u1 between the dummy wiring 57b1 and the wiring part 51c1, the dummy wiring 57c3, and the wiring part 51c3. Is designed so as to coincide with the gap distance u3.

  Similarly, the dummy wiring 57a2 on the outer side in the Y-axis direction of the wiring portion 51c2 is the gap distance w2 between the dummy wiring 57a2 and the wiring portion 51c2, the wiring portion 51c4, and the drive monitor electrode portion 52-4 adjacent thereto (or the driving electrode portion). 51-4) is arranged at a position where the gap distance w4 matches. The dummy wiring 57b2 on the inner side in the Y-axis direction of the wiring part 51c2 and the dummy wiring 57c4 on the outer side in the Y-axis direction of the wiring part 51c4 are the gap distance u2 between the dummy wiring 57b2 and the wiring part 51c2, the dummy wiring 57c4, and the wiring part 51c4. Is designed so as to coincide with the gap distance u4.

  Therefore, by setting the dummy wirings 57a1, 57b1, 57c3, 57a2, 57b2, and 57c4 at such positions, the width v1 of the wiring part 51c1 and the wiring part 51c3 having the same area shape even when etching is performed. The finished dimensions of the width v3 and the width v4 of the wiring part 51c4 and the finished part of the wiring part 51c4 can be exactly matched, as well as the finished dimensions of the width v3 and the wiring part 51c2 having the same area.

  On the other hand, the movable parts of the subframe 32-2 and the subframe 32-4 are parts through which the same or similar electrical signals (drive signals) pass, so that the difference in electrical characteristics between the two movable parts is eliminated. The shapes of the movable parts are designed to be the same. However, the pad portion 23b is connected to the subframe 32-2 only through the wiring portion 23a.

  In order to suppress the difference in electrical characteristics between the movable parts designed in the same shape, the dummy wiring 57d6 is electrically connected to other conductive band layers in the same form as the above-described dummy wiring 57a1. Instead, it is fixedly formed on the upper surface of the substrate 10.

  The dummy wiring 57d6 on the outer side in the Y-axis direction of the subframe 32-4 has a gap distance u6 between the dummy wiring 57d6 and the subframe 32-4, a gap between the wiring portion 23a and the subframe 32-2 adjacent thereto in the Y-axis direction. It is arranged and designed at a position where the distance u5 coincides.

  Therefore, by setting the dummy wiring 57d6 at such a position, the finished dimensions of the subframes 32-2 and 32-4 having the same shape can be made to coincide with each other even if etching is performed.

  Here, as long as the wiring width in the Y-axis direction of the dummy wirings 57a1, 57b1, 57c3, 57a2, 57b2, 57c4, and 57d6 satisfies the positional relationship with the wiring portions 51c1 to 51c4 and the subframe 32-4, any appropriate arbitrary Value is acceptable. Further, the length of the parallel running portion in the X-axis direction between the dummy wiring and the wiring portions 51c1 to 51c4 and the subframe 32-4 is the same as the length in the X-axis direction of the wiring portions 51c1 to 51c4 and the subframe 32-4. Or longer than that is desirable for improving the processing accuracy, but it may be shorter than that for reasons such as room for wiring.

  In FIG. 2, the drive electrode portions 51-1, 51-2, 51-5, and 51-6 are integrally outward in the Y-axis direction at the X-axis direction outer ends of the main frames 30-1 and 30-2. The protrusions 36 a and 36 b that are floated and extended from the substrate 10 are provided on both sides in the X-axis direction. The fixed electrode fingers 51b1, 51b2, 51b5, 51b6 are respectively connected to pad portions 51d1, 51d2, which are integrally fixed on the substrate 10 via wiring portions 51c1, 51c2, 51c5, 51c6 which are integrally fixed on the substrate 10. 51d5 and 51d6 are connected. Electrode pads 51e1, 51e2, 51e5, 51e6 made of conductive metal (for example, aluminum) are provided on the upper surfaces of the pad portions 51d1, 51d2, 51d5, 51d6, respectively.

  The drive electrode portions 51-3, 51-4, 51-7, and 51-8 are integrally floated from the substrate 10 outward in the Y-axis direction at the outer ends in the X-axis direction of the main frames 30-3 and 30-4. The projecting portions 36c and 36d extending in the X-axis direction are provided on both sides in the X-axis direction. The fixed electrode fingers 51b3, 51b4, 51b7, 51b8 are respectively connected to pad portions 51d3, 51d4 fixed integrally on the substrate 10 via wiring portions 51c3, 51c4, 51c7, 51c8 fixed integrally on the substrate 10. 51d7 and 51d8 are connected. Electrode pads 51e3, 51e4, 51e7, 51e8 made of conductive metal (for example, aluminum) are provided on the upper surfaces of the pad portions 51d3, 51d4, 51d7, 51d8, respectively.

  The drive monitor electrode portions 52-1 to 52-4 are integrally protruded and extended from the substrate 10 to the outer side in the Y-axis direction at the inner end portions in the X-axis direction of the main frames 30-1 to 30-4. To 36h on one side in the X-axis direction (in the case of FIG. 2, the right side in the figure). The fixed electrode fingers 52b1, 52b2, 52b3, 52b4 are respectively connected to pad portions 52d1, 52d2, which are integrally fixed on the substrate 10 via wiring portions 52c1, 52c2, 52c3, 52c4 which are integrally fixed on the substrate 10. 52d3 and 52d4. Electrode pads 52e1, 52e2, 52e3, 52e4 made of conductive metal (for example, aluminum) are provided on the upper surfaces of the pad portions 52d1, 52d2, 52d3, 52d4, respectively.

  By the way, the drive electrode portions 51-1 and 51-5 and the drive electrode portions 51-3 and 51-7 are designed to have the same shape. Therefore, the left and right drive electrode portions with respect to the central axis of the substrate 10 after etching. In order to suppress the difference in the finished dimensions, dummy wirings 57e3 and 57f3 that are not electrically connected to other conductive band layers are provided outside the drive electrode portions 51-3 and 51-7 in the Y-axis direction. Is set.

  In particular, the dummy wiring 57e3 includes a gap distance lc between the dummy wiring 57e3 and the other end in the Y-axis direction of the driving electrode portions 51-3 and 51-7, and the wiring portion 51c5 and the driving electrode portions 51-1 and 51-5. It is arranged and designed at a position where the gap distance la with the other outer end in the Y-axis direction matches. Similarly, as apparent from FIG. 2, the gap distance (mc, nc) between the two conductive band layers adjacent to the dummy wiring 57f3 in the Y-axis direction and the two conductive bands adjacent to the wiring section 52c1 in the Y-axis direction. The dummy wiring 57f3 is arranged and designed so that the gap distance (ma, na) with the layer matches.

  Therefore, by setting the dummy wirings 57e3 and 57f3 at such positions, the drive electrode portions 51-3 and 51-7 and the drive electrode portions 51-1 and 51 having the same shape as each other even if etching is performed. It is possible to accurately match the finished dimension with -5 (particularly, the finished dimension in the X-axis direction). Further, since the gap distance between the wiring portions is also the same, the finished dimensions after etching can be made to coincide accurately with respect to the wiring width of the wiring portion.

  As described above, according to the above-described embodiment, an angular velocity detecting element can be obtained in which the difference between the left and right finished dimensions of the conductive band layer that is designed to be the same in shape on the left and right or a part thereof is suppressed.

  With the recent diversification of detection characteristics (for example, simultaneous detection of triaxial acceleration, simultaneous detection of angular velocity and acceleration, etc.), while the wiring and miniaturization of detection elements have been advanced, Because there are constraints such as the position of the pad part to be connected fixed, dummy wiring should be provided in the above positional relationship even when designing a left-right asymmetric shape with a different distance from the central axis. Thus, the finished dimensions after etching of the portions designed to be the same on the left and right can be made the same on the left and right. And since the offset of a detection characteristic does not arise, the improvement of a non-defective product rate can be aimed at.

  In particular, the drive signal for driving the angular velocity detecting element input to the drive electrode unit is more important than other signals necessary for detecting the angular velocity, so that an error such as a phase delay does not occur. It is necessary to. Therefore, by providing the above-described dummy wiring adjacent to the driving electrode portion and the wiring portion (for example, 51c1 to 51c8) electrically connected to the driving electrode portion, the driving electrode portion And the finished dimensions of the connecting wiring portion can be set to the target values.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added.

1 is a schematic plan view of an angular velocity detection element made of a semiconductor according to a first embodiment. It is a schematic plan view of the angular velocity detection element comprised by the semiconductor which is 2nd Embodiment. It is a schematic sectional drawing of an angular velocity detection element. It is a schematic plan view of the angular velocity detection element comprised by the semiconductor incorporated in the sensor apparatus disclosed by patent document 1. FIG. 6 is a schematic plan view of an angular velocity detecting element configured by a semiconductor incorporated in the sensor device disclosed in Patent Document 2, and shows a characteristic of a part of the element structure being asymmetric. is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 20,20-1,20-2 Vibrator 23a, 51c1-51c8 Wiring part 30-1-30-4 Main frame 32-1-1-32-4 Sub-frame, termination | terminus part 36a-36h Protrusion part 51-1 51-16 Drive electrode portion 52-1 to 52-8 Drive monitor electrode portion 57a1, 57b1, 57c3, 57a2, 57b2, 57c4, 57d6, 57e3, 57f3 Dummy wiring A Insulating layer B Conductive band layer X, Y Symmetry of substrate 10 axis

Claims (6)

First and second members having the same layer structure are provided on the surface of the substrate,
The first member is provided on a first side in a direction orthogonal to the reference direction with respect to a reference direction parallel to the surface, and the second member is provided on a second side in a direction orthogonal to the reference direction. A sensor element provided with a member,
A dummy member electrically disconnected from the member provided on the surface, and a positional relationship between the first member and a third member provided on the surface adjacent to the first member; A sensor element provided adjacent to the second member in an equal positional relationship.   2. The sensor according to claim 1, wherein in the reference direction or the orthogonal direction, an adjacent interval between the dummy member and the second member and an adjacent interval between the first member and the third member are equal to each other. element.   The sensor element according to claim 1, wherein the third member is a member that is not electrically connected to a member provided on the surface.   4. The sensor element according to claim 1, wherein the first member and the second member are an electrode part or a wiring part electrically connected to the electrode part. 5.   The sensor element according to claim 4, wherein the electrode part is a drive electrode part. First and second members having the same layer structure are provided on the surface of the substrate,
The first member is provided on a first side in a direction orthogonal to the reference direction with respect to a reference direction parallel to the surface, and the second member is provided on a second side in a direction orthogonal to the reference direction. A method of manufacturing a sensor element, wherein a member is provided,
A dummy member electrically disconnected from a member provided on the surface, and a positional relationship between the first member and a third member provided on the surface adjacent to the first member; A method of manufacturing a sensor element, wherein the sensor element is provided adjacent to the second member in an equal positional relationship.