JP2009188713A - Dielectric resonator and stacked filter using the same - Google Patents

Dielectric resonator and stacked filter using the same Download PDF

Info

Publication number
JP2009188713A
JP2009188713A JP2008026174A JP2008026174A JP2009188713A JP 2009188713 A JP2009188713 A JP 2009188713A JP 2008026174 A JP2008026174 A JP 2008026174A JP 2008026174 A JP2008026174 A JP 2008026174A JP 2009188713 A JP2009188713 A JP 2009188713A
Authority
JP
Japan
Prior art keywords
via hole
electrode
dielectric layer
dielectric resonator
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008026174A
Other languages
Japanese (ja)
Inventor
Masaharu Tanaka
正治 田中
Takashi Kitamura
崇 喜多村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2008026174A priority Critical patent/JP2009188713A/en
Publication of JP2009188713A publication Critical patent/JP2009188713A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize a product, regarding a dielectric resonator, and to provide a stacked filter that uses the same. <P>SOLUTION: Regarding a dielectric resonator 2 and a stacked filter 1 using the same, the dielectric resonator 2 comprise: a dielectric layer 3; a ground via hole 4 through the dielectric layer 3; an enclosure electrode 5, with one end open, provided to surround the grounding via hole 4 on the principal surface of the dielectric layer 3; and a connecting electrode 6, connecting one end of this enclosure electrode 5 and the via hole 4. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ストリップラインにより形成される誘電体共振子およびこれを用いた積層フィルタに関する。   The present invention relates to a dielectric resonator formed by a strip line and a multilayer filter using the dielectric resonator.

従来のストリップライン型の誘電体共振子は、誘電体層の主面に伝送線路を設けるとともにこの伝送線路と対向する誘電体層の裏面に接地用電極を設けることで、伝送線路と接地用電極との間隔、伝送線路の幅、誘電体層の誘電率に応じた共振周波数を有する誘電体共振子を構成していた。   A conventional stripline type dielectric resonator is provided with a transmission line on the main surface of the dielectric layer and a grounding electrode on the back surface of the dielectric layer facing the transmission line. And a dielectric resonator having a resonance frequency corresponding to the distance between the transmission line, the width of the transmission line, and the dielectric constant of the dielectric layer.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献1が知られている。
特開平8−78909号公報
As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP-A-8-78909

しかしながら、このような誘電体共振子では、異なる主面に設けられる接地電極と伝送線路とが誘電体層を介して対向せねばならず、接地電極の専有面積の下限が決まってしまうことや、これを用いて積層フィルタを構成しようとした場合接地電極上にて伝送線路を並設しなければならず、誘電体共振子やこれを用いた積層フィルタにおける小型化が困難なものとなっていた。   However, in such a dielectric resonator, the ground electrode and the transmission line provided on different main surfaces must face each other through the dielectric layer, and the lower limit of the area occupied by the ground electrode is determined, When a multilayer filter is configured using this, it is necessary to arrange transmission lines on the ground electrode, which makes it difficult to reduce the size of the dielectric resonator and the multilayer filter using the dielectric resonator. .

そこで、本発明はこのような問題を解決し、誘電体共振子およびこれを用いた積層フィルタを小型化することを目的とする。   Therefore, the present invention aims to solve such problems and to reduce the size of a dielectric resonator and a multilayer filter using the dielectric resonator.

そこで、この目的を達成するため本発明は、誘電体共振子の構成を誘電体層と、この誘電体層を貫通する接地用ビアホールと、誘電体層の主面において接地用ビアホールを囲むように設けられた一端開口の囲み電極と、この囲み電極の一端とビアホールを接続する接続電極により構成したのである。   Therefore, in order to achieve this object, the present invention is configured so that the configuration of the dielectric resonator is such that the dielectric layer, the grounding via hole penetrating the dielectric layer, and the grounding via hole are surrounded on the main surface of the dielectric layer. It is composed of a surrounding electrode provided at one end opening and a connection electrode that connects one end of the surrounding electrode and a via hole.

この構成により、誘電体共振子およびこれを用いた積層フィルタを小型化することが出来るのである。   With this configuration, the dielectric resonator and the multilayer filter using the dielectric resonator can be reduced in size.

以下、本発明の一実施形態について図を用いて説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図1は積層フィルタ1の構造を示したものであり、その基本構造はセラミクスからなる誘電体共振子2を構成する複数の誘電体層3を積み重ねた積層構造体であり、各誘電体層3にはそれぞれ誘電体層3を貫通する接地用のビアホール4と、このビアホール4の端面を囲むように設けた一端開口の囲み電極5と、この囲み電極5の一端とビアホール4を接続する接続電極6が設けられた構成となっている。また、最下層に位置する誘電体層3の下面には外部接続用の入出力電極7と接地電極8が設けられており、接地電極8はビアホール4の下端に接続され、入出力電極7は囲み電極5の開放端に接続された引出用のビアホール9の下端に接続されている。また、最上層にはビアホール4や囲み電極5などの電極が設けられていない誘電体層3を保護層10として設けている。   FIG. 1 shows the structure of a multilayer filter 1, and its basic structure is a multilayer structure in which a plurality of dielectric layers 3 constituting a dielectric resonator 2 made of ceramics are stacked. 1 includes a grounding via hole 4 penetrating through the dielectric layer 3, an enclosing electrode 5 provided at one end so as to surround the end face of the via hole 4, and a connection electrode connecting the one end of the enclosing electrode 5 and the via hole 4. 6 is provided. Further, an input / output electrode 7 and a ground electrode 8 for external connection are provided on the lower surface of the dielectric layer 3 positioned at the lowermost layer. The ground electrode 8 is connected to the lower end of the via hole 4. It is connected to the lower end of the lead-out via hole 9 connected to the open end of the surrounding electrode 5. Further, the dielectric layer 3 provided with no electrode such as the via hole 4 and the surrounding electrode 5 is provided as a protective layer 10 in the uppermost layer.

そして、積層フィルタ1の下面に設けられた接地電極8を外部アースに接続することで、各誘電体層3に設けられた囲み電極5が片端短絡型のストリップラインとして機能し、積層フィルタ1全体としては、片端短絡型の各ストリップラインを構成する囲み電極5を複数結合させたフィルタ回路を構成したものとなっている。   Then, by connecting the ground electrode 8 provided on the lower surface of the multilayer filter 1 to the external ground, the surrounding electrode 5 provided on each dielectric layer 3 functions as a one-end short-circuited strip line, and the entire multilayer filter 1 As described above, a filter circuit is configured in which a plurality of surrounding electrodes 5 constituting each one-end short-circuited strip line are coupled.

すなわち、各誘電体層3に設けられた囲み電極5は、接地電極8によりアース接続されるビアホール4を中心とした同心円状に設けることで、囲み電極5の内周端面がこの積層フィルタ1の基準グランド電位を形成するビアホール4と層間の面内において対峙する構成となり、この囲み電極5の一端を接続電極6でビアホール4に接続することで図2に示されるよう片端短絡型のストリップライン12を構成し、このストリップライン12を構成する囲み電極5を積層方向において対向する領域を形成することで隣接するストリップライン12を容量11で結合させフィルタ回路が構成されるのである。   That is, the surrounding electrode 5 provided in each dielectric layer 3 is provided concentrically around the via hole 4 that is grounded by the ground electrode 8, so that the inner peripheral end face of the surrounding electrode 5 is the surface of the multilayer filter 1. The via hole 4 that forms the reference ground potential is confronted in the plane between the layers, and one end of the surrounding electrode 5 is connected to the via hole 4 by the connection electrode 6, and as shown in FIG. The adjacent strip lines 12 are coupled by a capacitor 11 by forming regions in which the surrounding electrodes 5 constituting the strip line 12 are opposed to each other in the stacking direction, thereby forming a filter circuit.

なお、従来のストリップライン構造では先にも述べたように、誘電体層を挟んで上下主面にて伝送線路と接地電極が対向するように配置されていたのであるが、この一実施形態に示した積層フィルタ1であれば基準グランド電位を構成するビアホール4を一端開口の囲み電極5で囲んだ構成であるため、囲み電極5が設けられた誘電体層3の一主面内にて囲み電極5が基準グランド電位と対向するストリップライン構造が形成されるため誘電体共振子2を従来のストリップライン構造のものに比べ小型なものと出来るのである。   In the conventional strip line structure, as described above, the transmission line and the ground electrode are arranged so as to face each other on the upper and lower main surfaces with the dielectric layer interposed therebetween. In the multilayer filter 1 shown in the drawing, the via hole 4 constituting the reference ground potential is surrounded by the surrounding electrode 5 at one end opening, so that it is enclosed within one main surface of the dielectric layer 3 provided with the surrounding electrode 5. Since the stripline structure in which the electrode 5 is opposed to the reference ground potential is formed, the dielectric resonator 2 can be made smaller than the conventional stripline structure.

また、囲み電極5は中心に位置するビアホール4と層間の面内において対峙する必要から一周回未満の周回形状としている。   Further, the surrounding electrode 5 has a round shape less than one round because it needs to confront the via hole 4 located in the center and in the plane between the layers.

本発明に係る誘電体共振子およびこれを用いた積層フィルタは製品を小型化することができ、主として通信機器等に用いられる高周波回路用途において有用となる。   The dielectric resonator according to the present invention and the multilayer filter using the dielectric resonator can reduce the size of the product, and are useful in high-frequency circuit applications mainly used in communication equipment and the like.

本発明の一実施形態を示す積層フィルタの分解斜視図1 is an exploded perspective view of a multilayer filter showing an embodiment of the present invention. 同積層フィルタの等価回路図Equivalent circuit diagram of the same multilayer filter

符号の説明Explanation of symbols

1 積層フィルタ
2 誘電体共振子
3 誘電体層
4 接地用ビアホール
5 囲み電極
6 接続電極
DESCRIPTION OF SYMBOLS 1 Multilayer filter 2 Dielectric resonator 3 Dielectric layer 4 Grounding via hole 5 Surrounding electrode 6 Connection electrode

Claims (2)

誘電体層と、この誘電体層を貫通する接地用ビアホールと、前記誘電体層の主面において前記接地用ビアホールを囲むように設けられた一端開口の囲み電極と、この囲み電極の一端と前記ビアホールを接続する接続電極からなることを特徴とした誘電体共振子。 A dielectric layer; a grounding via hole penetrating the dielectric layer; an enclosing electrode having one end opening provided to surround the grounding via hole on a main surface of the dielectric layer; an end of the enclosing electrode; A dielectric resonator comprising a connection electrode for connecting a via hole. 誘電体層と、この誘電体層に設けられた接地用ビアホールと、前記誘電体層の主面において前記接地用ビアホールを囲むように設けられた一端開口の囲み電極と、この囲み電極の一端と前記ビアホールを接続する接続電極からなる誘電体共振子を複数有し、前記第1の誘電体共振子と第2の誘電体共振子を前記接地用ビアホールが一直線状に接続するように積層するとともに、前記それぞれの囲み電極が少なくとも部分的に前記誘電体層を介して対向したことを特徴とする積層フィルタ。 A dielectric layer; a grounding via hole provided in the dielectric layer; a surrounding electrode having one end opening provided to surround the grounding via hole in a main surface of the dielectric layer; and one end of the surrounding electrode; A plurality of dielectric resonators each including a connection electrode connecting the via hole, and the first dielectric resonator and the second dielectric resonator are stacked so that the ground via hole is connected in a straight line. The multilayer filter is characterized in that the respective surrounding electrodes are at least partially opposed to each other through the dielectric layer.
JP2008026174A 2008-02-06 2008-02-06 Dielectric resonator and stacked filter using the same Pending JP2009188713A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008026174A JP2009188713A (en) 2008-02-06 2008-02-06 Dielectric resonator and stacked filter using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008026174A JP2009188713A (en) 2008-02-06 2008-02-06 Dielectric resonator and stacked filter using the same

Publications (1)

Publication Number Publication Date
JP2009188713A true JP2009188713A (en) 2009-08-20

Family

ID=41071525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008026174A Pending JP2009188713A (en) 2008-02-06 2008-02-06 Dielectric resonator and stacked filter using the same

Country Status (1)

Country Link
JP (1) JP2009188713A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105144319A (en) * 2013-04-18 2015-12-09 松下知识产权经营株式会社 Resonant coupler

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105144319A (en) * 2013-04-18 2015-12-09 松下知识产权经营株式会社 Resonant coupler
US20160226122A1 (en) * 2013-04-18 2016-08-04 Panasonic Intellectual Property Management Co., Ltd. Resonant coupler
US9698461B2 (en) * 2013-04-18 2017-07-04 Panasonic Intellectual Property Management Co., Ltd. Resonant coupler

Similar Documents

Publication Publication Date Title
TWI505539B (en) Laminated bandpass filter
JP5310768B2 (en) Multilayer bandpass filter
JP2011124880A (en) Laminated balance filter
JP2006094462A (en) Laminated balun transformer
JP2008147581A (en) Feedthrough capacitor array
JP2009182377A (en) Laminated low-pass filter
JP4462194B2 (en) Multilayer feedthrough capacitor array
JP2008236027A (en) Common mode current suppression ebg filter
JP2018125804A (en) Bandpass filter
WO2017056620A1 (en) Laminated band-pass filter
JP2008017243A (en) Electronic component
WO2015059963A1 (en) Composite lc resonator and bandpass filter
JP2010045103A (en) Multilayer capacitor
JP2018078450A (en) Laminate type filter
JP2007104102A (en) Passive component
JP2015109487A (en) Bandpass filter circuit and multilayer bandpass filter
JP2009124211A (en) Electronic component
JP2008278360A (en) Laminate type band pass filter and diplexer using the same
JP2009188713A (en) Dielectric resonator and stacked filter using the same
JP2008042750A (en) Laminated filter
US7782157B2 (en) Resonant circuit, filter circuit, and multilayered substrate
JP2008278361A (en) Laminate type band pass filter and diplexer using the same
JP6317890B2 (en) High frequency filter and high frequency module including the same
JP2010123649A (en) Stacked device
JPWO2005020256A1 (en) Multilayer electronic components