JP2009152321A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain mixed light of sufficiently mixed light rays emitted from respective light-emitting elements nearby a device without tilting mounting surfaces of substrates for light-emitting elements. <P>SOLUTION: A light-emitting device includes a main substrate 2, pluralities of first partition substrates 3 and second partition substrates 4 which are stood on the main substrate 2 to partition the space on a mounting surface of the main substrate 2 into a plurality, first light-emitting elements disposed in mounting spaces S partitioned with the first partition substrates 3 and second partition substrates 4 and mounted on the main substrate 2, and second light-emitting elements 12 disposed in the mounting spaces S and mounted on the first partition substrates 3, light rays emitted by the first light-emitting elements and second light-emitting elements 12 being mixed in the mounting spaces S. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device in which a light emitting element is mounted on a substrate.

Conventionally, a chip-on-board (COB) light-emitting device in which a light-emitting element is directly mounted on a substrate is known as a backlight source of a liquid crystal display device (see, for example, Patent Documents 1 and 2). In the light emitting devices described in Patent Literatures 1 and 2, a plurality of inclined surfaces are formed on a substrate, and LED chips that emit light of different wavelengths are mounted on the inclined surfaces. Thereby, even in the vicinity of the apparatus, the light emitted from each LED chip is sufficiently mixed.
JP 2007-157354 A JP 2007-273559 A

  However, in the light emitting devices described in Patent Documents 1 and 2, since the LED chip is mounted on the inclined surface of the substrate, it is necessary to incline the table that supports the substrate so that the mounting surface is horizontal. Becomes large.

  The present invention has been made in view of the above circumstances, and the object thereof is to sufficiently mix the light emitted from each light emitting element in the vicinity of the apparatus without inclining the mounting surface of the light emitting element on the substrate. Another object of the present invention is to provide a light emitting device capable of obtaining the mixed light.

  In order to achieve the above object, in the present invention, a main board and a plurality of first boards standing on the main board, extending in a first direction, and partitioning a space on the mounting surface of the main board into a plurality in the second direction. A partition board, a plurality of second partition boards that are erected on the main board, extend in the second direction, and divide the space on the mounting surface of the main board into a plurality of parts in the first direction, and are mounted on the main board A plurality of first light emitting elements respectively disposed in a plurality of mounting spaces partitioned in the first direction and the second direction by the plurality of first partition boards and the plurality of second partition boards; There is provided a light emitting device including a plurality of second light emitting elements mounted on a single partition substrate and disposed in the plurality of mounting spaces, respectively.

  The light emitting device preferably includes a plurality of third light emitting elements respectively disposed in the plurality of mounting spaces.

  In the light emitting device, the second light emitting element may be mounted on one surface of the first partition substrate, and the third light emitting element may be mounted on the other surface of the first partition substrate. .

  Moreover, the said light-emitting device WHEREIN: A said 3rd light emitting element can be set as the structure mounted in a said 2nd partition board | substrate.

  In the light emitting device, it is preferable that the first partition substrate and the second partition substrate are orthogonal to each other.

  In the light emitting device, it is preferable that the main substrate, the first partition substrate, and the second partition substrate have the same base member.

  According to the present invention, the light emitted from the first light emitting element and the second light emitting element in the vicinity of the apparatus without tilting the mounting surfaces of the first light emitting element and the second light emitting element on the main substrate and the first partition substrate. A well-mixed mixed light can be obtained.

  1 to 5 show an embodiment of the present invention, and FIG. 1 is a schematic external perspective view of a light emitting device.

  As shown in FIG. 1, the light emitting device 1 includes a main board 2 on which a plurality of blue LED chips 11 (not shown in FIG. 1) are mounted, and a plurality of first partition boards 3 erected on the main board 2. And a plurality of second partition boards 4 erected on the main board 2. Each first partition substrate 3 and each second partition substrate 4 are formed to have the same height from the mounting surface of the main substrate 2. A plurality of green LED chips 12 and a plurality of red LED chips 13 (not shown in FIG. 1) are mounted on the first partition substrate 3, and the main partition is divided into each first partition substrate 3 and each second partition substrate 4. In a plurality of mounting spaces S on the substrate 2, a blue LED chip 11 as a first light emitting element, a green LED chip 12 as a second light emitting element, and a red LED chip 13 as a third light emitting element are arranged one by one. The Each mounting space S is filled with a transparent sealing material 14 that seals the blue LED chip 11, the green LED chip 12, and the red LED chip 13.

FIG. 2 is an exploded perspective view of the light emitting device.
As shown in FIG. 2, on the mounting surface of the main board 2, a plurality of vertical grooves 21 as engaging portions that engage with the first partition boards 3, and engagements that engage with the first partition boards 4. The lateral groove 22 as a part is integrally formed. Each vertical groove 21 and each horizontal groove 22 are formed in a lattice shape as a whole, and each blue LED chip 11 is mounted in a region surrounded by each vertical groove 21 and each horizontal groove 22. That is, the blue LED chips 11 are mounted on the main board 2 side by side in the vertical direction and the horizontal direction. In the present embodiment, four blue LED chips 11 are arranged in the vertical direction and four in the horizontal direction, respectively.

  Each first partition substrate 3 extends in the vertical direction and partitions the space on the mounting surface of the main substrate 2 into a plurality of spaces in the horizontal direction while being received in each vertical groove 21. Each first partition substrate 3 is formed in a flat plate shape and has a plurality of notches 31 as engaging portions that engage with each second partition substrate 4. Each notch 31 is formed to extend downward from the upper end of each first partition substrate 3 and receives each second partition substrate 4.

  Each second partition substrate 4 extends in the horizontal direction and partitions the space on the mounting surface of the main substrate 2 into a plurality of spaces in the vertical direction while being received in each horizontal groove 22. Each second partition substrate 4 is formed in a flat plate shape and has a plurality of notches 41 as engaging portions that engage with each first partition substrate 3. Each notch 41 is formed to extend upward from the lower end of each second partition substrate 4 and receives each first partition substrate 3.

  Each first partition substrate 3 and each second partition substrate 4 are detachable with respect to the main substrate 2 and are not filled with the sealing material 14. Engagement and disengagement can be performed without any problem. In the present embodiment, each first partition substrate 3 and each second partition substrate 4 are applied to the main substrate 2 by applying a force in the vertical direction to each first partition substrate 3 and each second partition substrate 4. Can be removed. Terminals that are electrically connected to the interlayer wiring layers of the main board 2 are formed below the first partition boards 3, and when the first partition boards 3 engage with the main board 2, Electricity can be supplied to each green LED chip 12 and each red LED chip 13 mounted on each first partition substrate 3 through the interlayer wiring layer.

FIG. 3 is a top view of the light emitting device.
As shown in FIG. 3, each first partition substrate 3 on the outer side in the horizontal direction is mounted on one side on which one of the green LED chip 12 and the red LED chip 13 is mounted. Further, each first partition substrate 3 on the lateral center side is a double-sided mounting in which the green LED chip 12 is mounted on one surface and the red LED chip 13 is mounted on the other surface. In the present embodiment, no LED chip is mounted on each second partition substrate 4.

4 is a cross-sectional view taken along a line AA in FIG.
As shown in FIG. 4, the main substrate 2 is a multi-layer FR-4 substrate having a glass epoxy resin as a base material. The main substrate 2 includes a first layer 23, a second layer 24 and a third layer 25 as a base member made of glass epoxy resin, and a solder resist layer 26 formed on the third layer 25. The first layer 23, the second layer 24, the third layer 25, and the solder resist layer 26 are formed in this order from the bottom to the top. In the present embodiment, the solder resist layer 26 is made of, for example, an epoxy resin, is located in the outermost layer, and is colored white by containing a white filler such as titanium oxide, calcium carbonate, wollastonite, or barium sulfate. Yes. The vertical groove 21 and the horizontal groove 22 are formed so as to penetrate the third layer 25 and the solder resist layer 26.

  The main substrate 2 includes an interlayer wiring pattern 27 formed between the first layer 23 and the second layer 24, an electrode wiring pattern 28 formed on the third layer 25, an interlayer wiring pattern 27, and an electrode wiring. And a via wiring pattern 29 for connecting the pattern 28. Each of the wiring patterns 27, 28, 29 is made of a metal such as copper whose surface is covered with gold, for example. The electrode wiring pattern 28 is exposed on the mounting surface of the main substrate 2 and is electrically connected to the electrode of the blue LED chip 11 by the wire 51. The interlayer wiring pattern 27 is formed such that the blue LED chips 11 adjacent in the vertical direction are electrically connected in series.

  The blue LED chip 11 has, for example, a GaN-based light emitting layer and emits blue light. The blue LED chip 11 is bonded to the main substrate 2 with, for example, an epoxy die bond paste. The blue LED chip 11 is disposed at the center of the mounting space S when viewed from above, and the optical axis thereof is in the vertical direction at the center of the mounting space S when viewed from above.

  The second partition substrate 4 includes a glass epoxy layer 42 as a base member made of glass epoxy resin, and a solder resist layer 43 formed on one surface and the other surface of the glass epoxy layer 42. In the present embodiment, each solder resist layer 43 is made of, for example, an epoxy resin, and is colored white by containing a white filler such as titanium oxide, calcium carbonate, wollastonite, barium sulfate or the like.

5 is a cross-sectional view taken along a line BB in FIG.
As shown in FIG. 5, the first partition substrate 3 has a glass epoxy layer 32 as a base member made of glass epoxy resin, and a solder resist layer 33 formed on one surface and the other surface of the glass epoxy layer 32. ing. In the present embodiment, the solder resist layer 33 is made of, for example, an epoxy resin, and is colored white by containing a white filler such as titanium oxide, calcium carbonate, wollastonite, barium sulfate or the like. Further, the first partition substrate 3 has a first wiring pattern 34 formed on one surface of the glass epoxy layer 32 and a second wiring pattern 35 formed on the other surface of the glass epoxy layer 32. . Each of the wiring patterns 34 and 35 is made of a metal such as copper whose surface is covered with gold. The wiring patterns 34 and 35 are exposed on one surface and the other surface of the first partition substrate 3, and the electrodes of the green LED chip 12 and the wiring pattern 34 are connected to the electrodes of the red LED chip 13 and the wiring pattern 35 by wires 52. Are electrically connected by a wire 53. Each of the wiring patterns 34 and 35 is formed so that the green LED chip 12 and the red LED chip 13 adjacent in the horizontal direction are electrically connected in series.

  The green LED chip 12 has, for example, a GaN-based light emitting layer and emits green light. The red LED chip 13 has, for example, a GaAs-based light emitting layer and emits red light. The green LED chip 12 and the red LED chip 13 are bonded to the first partition substrate 3 with, for example, an epoxy die bond paste. The green LED chip 12 and the red LED chip 13 are arranged in the center of the mounting space S when viewed from the front, and the optical axis is in the horizontal direction at the center of the mounting space S when viewed from the front. As a result, the optical axes of the blue LED chip 11, the green LED chip 12 and the red LED chip 13 intersect at a predetermined position in the mounting space S.

  The sealing material 14 is made of a resin such as silicone and seals the blue LED chip 11, the green LED chip 12 and the red LED chip 13. The sealing material 14 is filled in each mounting space S in a state where each first partition substrate 3 and each second partition substrate 4 are assembled to the main substrate 2. The upper surface of the sealing material 14 is formed flush with each first partition substrate 3 and each second partition substrate 4.

  In the light emitting device 1 configured as described above, since the mounting surfaces of the LED chips 11 and 12 of the main board 2 and the first partition board 3 are flat, if the main board 2 and the first partition board 3 are leveled. The LED chips 11 and 12 can be easily and easily mounted. Therefore, unlike the case where the mounting surfaces of the LED chips 11 and 12 are inclined, it is not necessary to incline the table that supports each substrate during manufacturing, and the manufacturing apparatus of the light emitting device 1 does not become large.

  Further, in the light emitting device 1 of the present embodiment, when each LED chip 11, 12, 13 emits light, blue light, green light, and red light are mixed in the mounting space S, so that each LED chip 11, 12 is near the device. , 13 can obtain mixed light in which the light emitted from 13 is sufficiently mixed. In this embodiment, since the optical axes of the LED chips 11, 12, and 13 intersect in the mounting space S, blue light, green light, and red light are efficiently mixed and sealed in the mounting space S. White light with suppressed color unevenness is emitted from the upper surface of the material 14. As a result, in order to sufficiently mix blue light, green light, and red light, it is not necessary to dispose an object to be irradiated with white light at a distance from the apparatus. Therefore, for example, in a display device having a light emitting device 1 and an irradiated body irradiated with white light, the distance between the light emitting device 1 and the irradiated body can be reduced, and the display device can be made thinner than before. Can do.

  In addition, since the green LED chip 12 and the red LED chip 13 are mounted on the main board 2 after being mounted on the first partition board 3, the lighting inspection of the green LED chip 12 and the red LED chip 13 on the first partition board 3 is performed. And the lighting test of the blue LED chip 11 on the main substrate 2 can be performed separately, and the yield of the light emitting device 1 is dramatically improved. In addition, since each first partition board 3 is detachable from the main board 2, a problem occurs when a current state is inspected with each first partition board 3 attached to the main board 2. The one-partition board 3 can be removed and replaced with a non-defective product, which also improves the yield of the light emitting device 1. A surface-mounted light-emitting device in which a plurality of light-emitting elements are directly mounted on a substrate has a problem that even if a defect is discovered after the light-emitting elements are mounted on the substrate, replacement, repair, etc. are extremely difficult. However, the light emitting device 1 of the present embodiment solves this problem by mounting the green LED chip 12 and the red LED chip 13 on a substrate different from the main substrate 2.

  In the light emitting device 1 of the present embodiment, since the main substrate 2, the first partition substrate 3 and the second partition substrate 4 are glass epoxy substrates, respectively, their thermal expansion coefficients are substantially equal, and the LED chips 11, 12 , 13 does not cause excessive stress on the main substrate 2, the first partition substrate 3, and the second partition substrate 4 due to heat generated during light emission.

  In the above-described embodiment, four mounting spaces S are arranged in the vertical direction and four in the horizontal direction. However, the number of the mounting spaces S in the vertical direction and the horizontal direction can be appropriately changed. Needless to say. In addition, as shown in FIG. 6, a large light-emitting device 101 can be configured by arranging a plurality of light-emitting devices 1 of the embodiment in the vertical direction and the horizontal direction.

  Moreover, in the said embodiment, although the 1st partition substrate 3 and the 2nd partition substrate 4 showed what orthogonally crossed, these are not limited to what orthogonally crosses, The 1st partition substrate 3 and the 2nd partition substrate 4 are shown. As long as they extend in different directions.

  Moreover, in the said embodiment, although what showed both the green LED chip 12 and the red LED chip 13 in the 1st partition substrate 3 was shown, for example, as shown in FIG. One of these may be mounted, and the other of these may be mounted on the second partition board 4. In the light emitting device 201 of FIG. 7, the green LED chip 12 is mounted on the first partition substrate 3 on one side, and the red LED chip 13 is mounted on the second partition substrate 4 on one side. As shown in FIG. 8, in the light emitting device 201, the green LED chip 12 is mounted on the first partition substrate 3, and the red LED chip 13 is mounted on the second partition substrate 4, and then attached to the main substrate 2. Therefore, the lighting test of the green LED chip 12 on the first partition board 3, the lighting test of the red LED chip 13 on the second partition board 4, and the lighting test of the blue LED chip 11 on the main board 2 can be performed separately. it can.

  Furthermore, as shown in FIG. 9, the green LED chip 12 may be mounted on both sides of the first partition substrate 3 and the red LED chip 13 may be mounted on both sides of the second partition substrate 4. In the case of double-sided mounting, as in the light emitting device 301 of FIG. 9, the first partition substrate 3 and the second partition substrate 4 are configured so that the LED chips 12 and 13 are arranged every other mounting space S, and adjacent first It is preferable that the mounting positions of the LED chips 12 and 13 on the first partition substrate 3 and the second partition substrate 4 are staggered. In addition, the 1st partition substrate 3 and the 2nd partition substrate 4 which are arrange | positioned on the outer side become single-sided mounting similarly to the said embodiment.

  In the above embodiment, the blue, green, and red LED chips 11, 12, and 13 are arranged one by one in each mounting space S. For example, as shown in FIG. Two chips 12 may be arranged, and the emission wavelength and the number of LED chips arranged in each mounting space S can be appropriately changed. In the light emitting device 401 of FIG. 10, the first partition substrate 3 is mounted on both sides of the green LED chip 12, and the second partition substrate 4 is mounted on one side of the red LED chip 13. Thereby, the emission intensity in the green region with high visibility can be increased, which is extremely advantageous in practical use.

  Moreover, in the said embodiment, although what showed the 1st partition board | substrate 3 and the 2nd partition board | substrate 4 being received by the vertical groove 21 and the horizontal groove 22 which were formed in the main board | substrate 2, the 1st without providing a groove | channel was shown. The partition substrate 3 and the second partition substrate 4 may be attached to the main substrate 2. For example, as shown in FIG. 11, the first partition substrate 3 and the second partition substrate 4 may be fixed to the main substrate 2 using a conductive adhesive such as solder 15, or as shown in FIG. As described above, a board-to-board connector 16 may be provided on the main board 2 as a support portion for supporting the first partition board 3 and the second partition board 4. FIG. 11 is a longitudinal sectional view corresponding to the AA sectional view of FIG. Although not shown in the cross section of FIG. 11, the wiring pattern of the main board 2 and the wiring pattern of the first partition board 3 are electrically connected by solder 15 at a predetermined position. FIG. 12 is a longitudinal sectional view corresponding to the BB sectional view of FIG. As shown in FIG. 12, the connector 16 has a connection terminal 16 a that electrically connects the wiring pattern 2 a of the main board 2 and the wiring pattern 3 a of the first partition board 3.

  Moreover, in the said embodiment, although the flame retardance of FR-4 was shown as the main board | substrate 2, the 1st partition board 3, and the 2nd partition board 4, these may be FR-5, for example. . Furthermore, the base material of the main board | substrate 2, the 1st partition board | substrate 3, and the 2nd partition board | substrate 4 is arbitrary, For example, a ceramic, a metal, etc. can also be used as a base material. In addition, the main substrate 2, the first partition substrate 3, and the second partition substrate 4 can be substrates of different base materials.

  Moreover, although the light-emitting device 1 which emits white light was shown in the said embodiment, if the light which mixed the light from each light emitting element is obtained, it is not limited to white light. Moreover, in the said embodiment, although the thing where three light emitting elements are arrange | positioned in the mounting space S was shown, if two or more light emitting elements are arrange | positioned, the number of light emitting elements is other than three. In short, it is only necessary that the first light emitting element is mounted on the main substrate and the second light emitting element is mounted on the first partition substrate. Further, for example, an LD chip may be used as the light emitting element instead of the LED chip, and it is needless to say that a specific detailed structure can be appropriately changed.

FIG. 1 is a schematic external perspective view of a light-emitting device showing an embodiment of the present invention. FIG. 2 is an exploded perspective view of the light emitting device. FIG. 3 is a top view of the light emitting device. 4 is a cross-sectional view taken along a line AA in FIG. 5 is a cross-sectional view taken along a line BB in FIG. FIG. 6 is a top view of a large light emitting device in which a plurality of light emitting devices of FIG. 3 are arranged. FIG. 7 is a top view of a light emitting device showing a modification. FIG. 8 is an exploded perspective view of a light emitting device showing a modification. FIG. 9 is a top view of a light emitting device showing a modification. FIG. 10 is a top view of a light emitting device showing a modification. FIG. 11 is a partial longitudinal sectional view of a light emitting device showing a modification. FIG. 12 is a partial longitudinal sectional view of a light emitting device showing a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 2 Main board 2a Wiring pattern 3 1st partition board 3a Wiring pattern 4 2nd partition board 11 Blue LED chip 12 Green LED chip 13 Red LED chip 14 Sealing material 15 Solder 16 Connector 16a Connecting terminal 21 Vertical groove 22 Horizontal groove 23 First layer 24 Second layer 25 Third layer 26 Solder resist layer 27 Interlayer wiring pattern 28 Electrode wiring pattern 29 Via pattern 31 Notch 32 Glass epoxy resin layer 33 Solder resist layer 34 First wiring pattern 35 Second wiring pattern 41 Notch 42 glass epoxy resin layer 43 solder resist layer 51 wire 52 wire 53 wire 101 light emitting device 201 light emitting device 301 light emitting device 401 light emitting device

Claims (6)

A main board;
A plurality of first partition boards that are erected on the main board, extend in the first direction, and divide the space on the mounting surface of the main board into a plurality of parts in the second direction;
A plurality of second partition boards that are erected on the main board, extend in the second direction, and divide a space on a mounting surface of the main board into a plurality of parts in the first direction;
A plurality of first light emission mounted on the main substrate and disposed in a plurality of mounting spaces partitioned in the first direction and the second direction by the plurality of first partition substrates and the plurality of second partition substrates, respectively. Elements,
A plurality of second light emitting elements mounted on the first partition substrate and disposed in the plurality of mounting spaces, respectively.   The light emitting device according to claim 1, further comprising a plurality of third light emitting elements respectively disposed in the plurality of mounting spaces. The second light emitting element is mounted on one surface of the first partition substrate,
The light emitting device according to claim 2, wherein the third light emitting element is mounted on the other surface of the first partition substrate.   The light emitting device according to claim 2, wherein the third light emitting element is mounted on the second partition substrate.   The light emitting device according to claim 2, wherein the first partition substrate and the second partition substrate are orthogonal to each other.   The light emitting device according to claim 2, wherein the main substrate, the first partition substrate, and the second partition substrate have the same base member.

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