JP2009134570A - Ic tag with rubber cover - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag with a rubber cover such that an IC tag and a rubber cover can be integrated together regardless of the heatproof temperature of the IC tag used and that there are no such problems as limitations on molding method, adhesion reliability, high costs, as in conventional cases. <P>SOLUTION: The IC tag 10 with a rubber cover comprises an IC tag 1 and a rubber cover 2 for covering the IC tag 1. A porous element 3 is positioned between the IC tag 1 and the rubber cover 2. The IC tag with the rubber cover is obtained by vulcanizing the IC tag 1 held between two or more unvulcanized rubber sheets via the porous element 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC tag with a rubber cover, and more particularly to an IC tag with a rubber cover that can be suitably applied for the purpose of managing various products.

  Since an IC tag has a larger amount of information than a magnetic sheet or bar code, in recent years, its application has been extended to various scenes such as product logistics management, manufacturing management, quality management, etc. by utilizing its advantages. The IC tag is used by being attached to a product, for example, coated with a plastic film or covered with plastic or ceramic.

  Further, one of the characteristics of the IC tag is that it has excellent heat resistance. The heat resistance temperature of the IC tag has been achieved up to about 120 ° C. at present, though it is a precision instrument. Therefore, when the product and the IC tag are integrated, the integration process is performed within the range of the heat resistant temperature.

As an improved technique related to a rubber composition having good adhesiveness with an IC tag, for example, Patent Document 1 discloses a bonding layer capable of reacting with sulfur on a base material layer, and a high-sulfur compounded rubber. In obtaining a rubber-based composite material as a laminate in which a composition layer and a low sulfur compounded rubber composition layer are laminated, the compositions of the high sulfur compounded rubber composition layer and the low sulfur compounded rubber composition layer are specified respectively. Thus, a method for producing a rubber-based composite material capable of obtaining good adhesion even to a base material layer such as an IC tag is disclosed.
JP 2007-38556 A (Claims etc.)

  However, although the conventional IC tag coated with a plastic film has flexibility, it is inferior in water resistance and environmental resistance, so the usage environment is limited, and it is protected by a plastic cover and a ceramic cover. Although the IC tag is excellent in water resistance and environmental resistance due to its robustness, it has a problem that it is inferior in flexibility in terms of material.

  On the other hand, an IC tag using rubber has been studied as a cover material that is flexible and excellent in water resistance and environmental resistance. As a method for producing such an IC tag with a rubber cover, the IC tag is embedded in an unvulcanized rubber and vulcanized, or the IC tag is put in a pre-cured rubber cover and bonded, or at room temperature. A method of making a cover using a curable rubber is employed.

  However, in the method of embedding an IC tag in rubber, when a general rubber vulcanization temperature and pressure during vulcanization are used, the IC tag embedded in the rubber may be destroyed. That is, the vulcanization temperature is higher than the heat resistance temperature of the IC tag, or the vulcanization pressure is a high pressure as in tire vulcanization. Moreover, in the method of bonding vulcanized rubber, the bonding method and the bonding reliability during long-term use are problems. In addition, room temperature curable rubbers also have difficulties in actual use such as the material base is high and the pot life before molding of the material is short, so there are significant restrictions on the molding method. Met.

  As described above, in the conventional technology, it cannot be said that a sufficient IC tag with a rubber cover can be obtained, and the realization of an IC tag with a rubber cover that can withstand actual use has been required. In this regard, according to the technique described in Patent Document 1, it is possible to secure adhesion between the IC tag and the product (adhered body), but regarding the problem of integration between the IC tag and the rubber cover itself, It could not be solved sufficiently.

  Therefore, an object of the present invention is to solve the above problems and to integrate the IC tag and the rubber cover regardless of the heat resistant temperature of the IC tag to be used. The object is to provide an IC tag with a rubber cover, which is free from problems such as high performance and high cost.

  As a result of intensive studies to solve the above problems, the present inventor can integrate the IC tag and the rubber cover regardless of the heat resistant temperature of the IC tag to be used by adopting the following configuration. As a result, the present invention has been completed.

That is, the IC tag with a rubber cover of the present invention is an IC tag with a rubber cover having an IC tag and a rubber cover that covers the IC tag,
A porous body is disposed between the IC tag and the rubber cover.

  The IC tag with a rubber cover of the present invention can be suitably obtained by vulcanizing the IC tag with the porous body sandwiched between two or more unvulcanized rubber sheets. In the IC tag with a rubber cover of the present invention, the porous body preferably has closed cells, and more preferably, the porous body is foamed rubber. Furthermore, as the foamed rubber, ethylene propylene diene rubber or acrylic rubber can be suitably used.

  According to the present invention, the above configuration allows the IC tag and the rubber cover to be integrated regardless of the heat resistant temperature of the IC tag to be used. Thus, it is possible to realize an IC tag with a rubber cover that is free from problems such as high costs.

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a schematic cross-sectional view of one configuration example of an IC tag 10 with a rubber cover according to the present invention. The IC tag 10 with a rubber cover shown includes an IC tag 1 and a rubber cover 2 covering the IC tag 1, and the porous body 3 is disposed between the IC tag 1 and the rubber cover 2. It has the characteristics.

  By disposing the porous body 3 between the IC tag 1 and the rubber cover 2, the porous body 3 functions as a heat insulating material, and heat during vulcanization when the IC tag 1 and the rubber cover 2 are integrated. However, it is possible to prevent transmission to the IC tag. Therefore, it becomes possible to perform vulcanization at a temperature higher than the heat resistant temperature of the IC tag to be used. Also, the porous body plays a role in protecting the IC tag against pressure during vulcanization, and as a result, the IC tag and the rubber cover can be integrated without adversely affecting the IC tag. It is. In addition, since a general-purpose rubber type can be appropriately used for the rubber cover, there are no problems such as limitations on the conventional molding method and high costs. Furthermore, since the rubber cover component enters the porous portion of the porous body 3 during vulcanization, it is possible to integrate more firmly.

  As the porous body 3 used in the present invention, those having closed cells are preferable from the viewpoint of excellent heat insulation. Specifically, foamed rubber can be suitably used. As the rubber type, ethylene propylene diene rubber (EPDM) or acrylic rubber, for example, acrylic rubber, ethylene-acrylic rubber, a blend thereof, or the like is preferable. Can be used. Further, a material based on natural rubber may be used. In addition, when using ethylene-acrylic rubber or its blend, the one where ethylene content is smaller has the effect which suppresses foaming.

  Further, the IC tag 1 used in the present invention may be any commonly used one, and there is no limitation on the heat resistant temperature.

  Moreover, as a rubber composition which comprises the rubber cover 2, it does not restrict | limit in particular about the specific mixing | blending content. For example, as the type of rubber, one or more kinds can be appropriately selected and used from conventionally used natural rubber and various synthetic rubbers depending on the application. Specific examples of the synthetic rubber include nitrile rubber (NBR), butadiene rubber (BR), isoprene rubber (IR), styrene butadiene rubber (SBR), butyl rubber (IIR), halogenated IIR, ethylene propylene diene rubber ( EPDM), chloroprene rubber (CR), ethylene propylene rubber, acrylonitrile butadiene rubber and the like. Among them, it is preferable to use NBR when oil resistance is required, and EPDM for water resistance.

  As the crosslinking agent to be blended in the rubber composition, any crosslinking agent that is usually used for crosslinking a rubber composition can be used. For example, sulfur, organic peroxide, organic sulfur compound, etc. Is mentioned. The compounding amount of the crosslinking agent is usually 0.1 to 20 parts by weight, preferably 1 to 10 parts by weight with respect to 100 parts by weight of the rubber component.

  In the rubber composition, various rubber chemicals such as a vulcanization accelerator, a filler, an oil, an anti-aging agent and the like that are usually used in the rubber industry can be appropriately blended depending on applications. Examples of the vulcanization accelerator include stearic acid, N-cyclohexyl-2-benzothiazylsulfenamide (CZ), N, N′-dicyclohexyl-2-benzothiazolylsulfenamide (DZ), and di-2. -A benzothiazolyl disulfide (DM) etc. can be mentioned. These may be used alone or in combination of two or more. The compounding amount of the vulcanization accelerator can be usually 0.1 to 10 parts by weight, preferably 1 to 3 parts by weight with respect to 100 parts by weight of the rubber component.

  Examples of the filler include carbon black, silica, calcium carbonate, calcium sulfate, talc, clay, mica, zinc white, barium sulfate, titanium oxide and the like. These may be used alone or in combination of two. The above can be used together. Among these, it is preferable to use silica. The blending amount of the filler is usually 10 to 200 parts by weight, and preferably 30 to 150 parts by weight with respect to 100 parts by weight of the rubber component.

  The oil is not particularly limited. For example, paraffinic, naphthenic, aromatic process oil, ethylene-α-olefin co-oligomer, paraffin wax, liquid paraffin or other mineral oil, castor oil, cottonseed oil, linseed oil, Oils such as rapeseed oil, soybean oil, palm oil, palm oil, peanut oil and other vegetable oils can be used. These can be used alone or in combination of two or more. The blending amount of the oil is usually 0.1 to 100 parts by weight, preferably 1 to 50 parts by weight with respect to 100 parts by weight of the rubber component.

  There is no restriction | limiting in particular as anti-aging agent, For example, naphthylamine type | system | groups, such as phenyl-alpha-naphthylamine; Diphenylamine type | system | groups, such as octyl diphenylamine; -Dimethylbutyl) -N′-phenyl-p-phenylenediamine, p-phenylenediamine type such as N, N′-di-2-naphthyl-p-phenylenediamine; 2,2,4-trimethyl-1,2- Quinoline series such as dihydroquinoline polymer; 2,6-di-t-butyl-4-methylphenol, styrenated phenol, tetrakis- [methylene-3- (3 ′, 5′-di-t-butyl-4 '-Hydroxyphenyl) propionate] and phenolic anti-aging agents such as methane. The blending amount of the anti-aging agent is usually 0.1 to 20 parts by weight, preferably 0.5 to 10 parts by weight with respect to 100 parts by weight of the rubber component.

  The IC tag with a rubber cover according to the present invention can be easily obtained by vulcanizing the IC tag 1 with the porous body 3 sandwiched between two or more unvulcanized rubber sheets constituting the rubber cover 3. Obtainable. That is, the porous body 3 is disposed so as to surround the IC tag 1, and the outside is sandwiched between unvulcanized rubber sheets, and then vulcanization is performed. Specifically, for example, the IC tag 1 is embedded by making a cut in the porous body 3 or the IC tag 1 is sandwiched between two or more porous bodies 3 to place the IC tag 1 in the porous body 3. After being buried, it is sandwiched between two or more unvulcanized rubber sheets to form a laminate of the IC tag 1, the porous body 3 and the unvulcanized rubber sheet 2.

  The number of unvulcanized rubber sheets constituting the rubber cover in this case is two in the illustrated example, but may be three or more as desired, and is not particularly limited. The shape of the unvulcanized rubber sheet can also be appropriately determined according to the shape of the target IC tag with a rubber cover and the dimensions and shapes of the IC tag and the porous body, and is not particularly limited. An unvulcanized rubber sheet having a desired shape and size can be easily obtained by rolling the rubber composition with a roll or the like into a sheet shape and cutting it into a predetermined shape and size.

  Moreover, you may provide suitably the recessed part according to the dimension, shape, etc. of the IC tag and porous body to pinch | interpose in an unvulcanized rubber sheet. Such a recess may be provided in one of the two unvulcanized rubber sheets, and each of the two unvulcanized rubber sheets is provided with a recess to form a predetermined recess as a whole. Also good. Alternatively, three or more unvulcanized rubber sheets may be used to make a hole corresponding to a predetermined recess in one or more unvulcanized rubber sheets and sandwiched between two or more rubber sheets. Furthermore, these methods can be combined to form a predetermined recess. Such a recess can be easily formed by pressing an unvulcanized rubber sheet.

  Further, in the present invention, after the IC tag is sandwiched between two or more unvulcanized rubber sheets, before the vulcanization of the unvulcanized rubber sheet, the IC tags of these two or more unvulcanized rubber sheets are attached. It is preferable to crimp the surrounding part. The two unvulcanized rubber sheets 2A and 2B are pressure-bonded by a press or the like, and the adhesion between the laminated rubbers is sufficiently adhered before vulcanization, thereby improving the adhesiveness after vulcanization and the IC tag Is completely covered with a rubber sheet, so that the IC tag can be more reliably protected from deterioration input in the use environment.

  The vulcanization in the present invention can be performed by hot air vulcanization or steam vulcanization using a gear oven or the like. In this case, a mold may be used, but preferably vulcanization is performed without using a mold such as a mold. The IC tag with a rubber cover of the present invention may be manufactured by molding and vulcanizing one by one, or molding and vulcanizing a plurality at a time and using a processing machine such as a punching machine after vulcanization. Individual tags with rubber covers can also be used.

  In the present invention, the temperature and pressure during vulcanization of the unvulcanized rubber sheet are not particularly limited and can be appropriately determined as desired. In the present invention, since the porous body is disposed around the IC tag, the IC tag is not adversely affected even under high temperature and high pressure vulcanization conditions. Suitably, for example, vulcanization can be performed under conditions of a temperature of 120 to 160 ° C. and a pressure of 0.1 to 1.0 MPa.

  The IC tag with a rubber cover of the present invention can be applied to various products by adhesion or the like, and can be formed integrally with the rubber product itself, and its use is particularly limited. is not.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely using an Example, this invention is not limited at all by the following description.

  An IC tag with a rubber cover was manufactured according to the following using an IC tag having a size of 10 mm × 30 mm × 2 mm (thickness) and a heat resistant temperature of 130 ° C. The composition of the rubber composition used for the rubber cover is as shown in Table 1 below.

  The unvulcanized rubber composition obtained by kneading the above blend was formed into a sheet shape to obtain two unvulcanized rubber sheets of 25 mm × 50 mm × 5 mm thickness. A recess having a size of 20 mm × 40 mm × 3 mm (depth) was formed on each rubber sheet using a press. Next, as a porous body for protecting the IC tag, an EPDM rubber sponge having a thickness of 3 mm was prepared, and two pieces were processed into a size of 20 mm × 40 mm, and the IC tag was wrapped between the rubber sponges. Next, an IC tag wrapped with a rubber sponge was placed in the recess of one rubber sheet, and the other rubber sheet was stacked thereon to sandwich the IC tag between two unvulcanized rubber sheets. .

  Next, in order to adhere the rubber sheets to each other, pre-pressing was performed with a press machine formed in a shape capable of crimping the peripheral portion surrounding the IC tag. Thereafter, vulcanization was carried out at a pressure of 0.5 MPa at 150 ° C. for 5 minutes to produce an IC tag with a rubber cover comprising an IC tag and a rubber cover covering the IC tag. At this time, the IC tag was not damaged by heat and pressure during vulcanization due to the heat insulation and cushioning effect of the rubber sponge layer.

It is a schematic sectional drawing which shows one structural example of the IC tag with a rubber cover of this invention.

Explanation of symbols

1 IC tag 2 Rubber cover (unvulcanized rubber sheet)
3 Porous body 10 IC tag with rubber cover

Claims (5)

An IC tag with a rubber cover having an IC tag and a rubber cover that covers the IC tag,
An IC tag with a rubber cover, wherein a porous body is disposed between the IC tag and the rubber cover.   The IC tag with a rubber cover according to claim 1, wherein the IC tag is obtained by vulcanizing the IC tag with the porous body sandwiched between two or more unvulcanized rubber sheets.   The IC tag with a rubber cover according to claim 1 or 2, wherein the porous body has closed cells.   The IC tag with a rubber cover according to any one of claims 1 to 3, wherein the porous body is foamed rubber.   The IC tag with a rubber cover according to any one of claims 1 to 4, wherein the foamed rubber is ethylene propylene diene rubber or acrylic rubber.

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