JP2009130248A - Heat dissipation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation device which is less likely to have a space to be generated between a substrate on which electronic components are mounted and a heat absorbing member. <P>SOLUTION: On the substrate 44, electronic components 26 which generate heat are mounted. The heat absorbing member 45 is provided on the rear surface 44b of the substrate 44 to absorb heat generated from the electronic components 26. First screw members 51 and second screw members 52 are used to assembling the heat absorbing member 45 into the substrate 44. The heat absorbing member 45 has first holes 45c with female screws into which the first screw members 51 are to be screwed and second through-holes 45d through which the second screw members 52 are to be passed. The substrate 44 has: first through-holes 44c through which the first screw members 51 are to be passed; and second holes 44d which have female screws 44d into which the second screw members 52 are to be screwed and which are formed in the rear surface 44b of the substrate 44. The heat absorbing member 45 has a plurality of heat dissipation fins 45b. The second screw members 52 are inserted into the through-holes 45d of the heat absorbing member 45 from between the heat dissipation fins 45b. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat dissipation device that absorbs heat generated by an electronic component such as a light emitting element.

Conventionally, various heat radiating devices that absorb heat generated by a light emitting element have been proposed, and for example, disclosed in Patent Document 1. In the heat dissipation device, the light emitting element 11 is mounted on the front surface 12a of the substrate 12, and the heat sink 13 is disposed on the rear surface 12b of the substrate 12 (see FIG. 5). A plurality of heat radiating fins 13a are formed on the heat sink 13, and heat is released from the heat radiating fins 13a.
JP 2007-36007 A

  A through hole 12c is formed in the substrate 12. A screw 14 is inserted into the through hole 12c, and the screw 14 is screwed into a hole 13c having a female screw formed on the front surface 13b side of the heat sink 13. The substrate 12 on which the light emitting element 11 is mounted is assembled to the front surface 13 b of the heat sink 13. The heat generated by the light emitting element 11 is transmitted to the heat sink 13 through the substrate 12 and is radiated from the radiation fins 13 a of the heat sink 13.

However, the heat generation of the light emitting element 11 may cause the substrate 12 to bend, and a gap G is generated between the rear surface 12 b of the substrate 12 and the front surface 13 b of the heat sink 13, making it difficult to transfer heat to the heat sink 13. Had. In particular, when there is a gap G immediately below the light emitting element 11, the heat generated by the light emitting element 11 is not transmitted to the heat sink 3, and the temperature of the light emitting element 11 is excessively increased and the light emitting element 11 may be damaged. .
The present invention has been made in view of this problem, and provides a heat dissipation device that is less likely to cause a gap between a substrate on which electronic components are mounted and a heat absorbing member.

  According to the present invention, the electronic component 26 that generates heat, the substrate 44 on which the electronic component 26 is mounted, and the heat generated by the electronic component 44 provided on the rear surface 44b of the substrate 44 are provided. A heat dissipation device comprising a heat absorbing member 45 that absorbs and a screwing member 52 that assembles the heat absorbing member 45 to the substrate 44, wherein the heat absorbing member 45 has a through hole 45d through which the screwing member 52 passes. The substrate 44 has a female screw into which the screwing member 52 is screwed, and has a hole 44d formed on the rear surface 44b side.

  Further, according to the present invention, as described in claim 2, the heat absorbing member 45 includes a plurality of heat radiating fins 45b, and the screwing member 52 extends from between the heat radiating fins 45b to the through hole of the heat absorbing member 45. It is inserted through 45d.

  Further, according to the present invention, the electronic component 26 that generates heat, the substrate 44 on which the electronic component 26 is mounted, and the rear surface 44b of the substrate 44 are emitted from the electronic component 26. A heat dissipation device comprising a heat absorbing member 45 that absorbs heat, and a first screw member 51 and a second screw member 52 that assemble the heat absorber member 45 to the substrate 44, wherein the heat absorber member 45 is A first hole 45c having a female screw into which the first screwing member 51 is screwed, and a second through hole 45d through which the second screwing member 52 passes, and The substrate 44 has a first through hole 44c through which the first screwing member 51 passes and a female screw into which the second screwing member 52 is screwed, and is formed on the rear surface 44b side. A second hole 44d.

  Further, according to the present invention, as described in claim 4, the heat absorbing member 45 includes a plurality of heat radiation fins 45b, and the second screwing member 52 extends between the heat radiation fins 45b. It is inserted through the through hole 45d.

  The screw member can be screwed in the hole formed on the rear surface side of the substrate, and the heat absorbing member can be assembled to the substrate, and there is a possibility that a gap is generated between the substrate on which the electronic component is mounted and the heat absorbing member. Less heat and good heat dissipation.

  Hereinafter, an embodiment in which the present invention is applied to a vehicle head-up display device 21 that projects a display light L onto a windshield 20 of a vehicle and displays a virtual image V will be described with reference to the accompanying drawings.

  The vehicle head-up display device 21 has a liquid crystal display 22 and a reflector 23 accommodated in a housing 24. The liquid crystal display 22 includes a liquid crystal display element 25, a light emitting element 26, and a case body 27. The liquid crystal display element 25 is obtained by attaching a front polarizing member 31 and a rear polarizing member 32 to the front and rear surfaces of the TFT liquid crystal cell 30, and is supported by a case body 27. The light emitting element 26 is formed of a white light emitting diode that generates heat, and is disposed behind the liquid crystal display element 25 to transmit and illuminate the liquid crystal display element 25.

  The reflector 23 includes a reflection mirror 36, a holding member 37, and a stepping motor 38. The reflection mirror 36 is formed by depositing a metal (for example, aluminum) on a resin (for example, polycarbonate) to form a reflection surface 36a. The reflecting surface 36a is a concave surface so that a virtual image is enlarged and displayed. The reflection mirror 36 is bonded to the holding member 37 with a double-sided adhesive tape. The holding member 37 is made of resin (for example, ABS), and the gear portion 40 and the shaft portion 41 are integrally formed. The shaft portion 41 is pivotally supported by the housing 24.

  A gear 42 is attached to the rotating shaft of the stepping motor 38, and the gear 42 is meshed with the gear portion 40 of the holding member 37. The reflection mirror 36 is supported in a rotatable state together with the holding member 37, and the reflection mirror 36 can be rotated by the stepping motor 38 to adjust the projection direction of the display light L. The user operates a push button switch (not shown) to adjust the angular position of the reflection mirror 36 so that the display light L is reflected at the position of the user's eyes (that is, the virtual image can be visually recognized).

  Reference numeral 44 denotes a substrate, and a plurality of light emitting elements 26 are mounted on the front surface 44 a of the substrate 44. The substrate 44 is made of a metal such as aluminum (Al) and has a flat plate shape. Reference numeral 45 denotes a heat sink made of a metal such as aluminum (Al). The heat sink 45 is provided on the rear surface 44 b of the substrate 44 and is disposed in the opening 24 a of the housing 24. The heat sink 45 is fixed to the housing 24 by a flange portion 45a with a screw (not shown). The heat sink 45 has a plurality of heat radiation fins 45b. A packing member 46 closes the space between the heat sink 45 and the opening 24 a of the housing 24 to prevent dust from entering the housing 24.

  The housing 24 accommodates the liquid crystal display 22, the reflector 23, and the like. The housing 24 is formed with a window 24b through which the display light L is emitted, and a translucent cover 48 is disposed on the window 24b. The translucent cover 48 is made of a translucent resin (for example, acrylic) and has a curved shape. The housing 24 is provided with light shielding walls 24c and 24d. The light shielding wall 24c is formed so as to hang obliquely from the upper part of the housing 24, and prevents a phenomenon (washout) in which external light such as sunlight enters the liquid crystal display 22 and makes it difficult to see a virtual image. . The light shielding wall 24 d is erected at the lower part of the housing 24.

Next, the substrate 44 and the heat sink 45 will be described in detail with reference to FIGS.
A heat sink 45 is assembled with screws 51 and 52 on the rear surface 44b of the substrate 44 on which the light emitting element 26 is mounted. A through hole 44c is formed in the substrate 44, and a screw 51 passes through the through hole 44c. Further, on the rear surface 44b side of the substrate 44, a hole 44d having a female screw into which the male screw 52a of the screw 52 is screwed is formed.

  The heat sink 45 has a hole 45c having a female screw into which the male screw 51a of the screw 51 is screwed. Further, a through hole 45d through which the screw 52 passes is formed on the front surface 45e side of the heat sink 45. The screws 52 are inserted into the through holes 45 d from between the heat radiation fins 45 b of the heat sink 45 and screwed into the holes 44 d of the substrate 44.

  According to the present embodiment, the heat sink 45 can be assembled to the substrate 44 by screwing the screws 52 through the holes 44d that do not penetrate the substrate 44, and the substrate 44 on which the light emitting element 26 is mounted and the heat sink 45 There is little possibility that a gap will be generated between them, and the heat generated by the light emitting element 26 can be released well.

  In the present embodiment, female screws are not formed in the through holes 44c formed in the substrate 44 and the through holes 45d formed in the heat sink 45, but female screws are formed in the through holes 44c and 45d. Alternatively, the same effect as in the present embodiment can be obtained. In the present embodiment, the light emitting element 26 is mounted on the substrate 44, but it goes without saying that it may be, for example, a power amplifier.

1 is an overview diagram showing an embodiment of the present invention. Sectional drawing which shows embodiment same as the above. The principal part expanded sectional view which shows embodiment same as the above. The exploded sectional view showing an embodiment same as the above. Sectional drawing which shows a prior art example.

Explanation of symbols

26 Light-emitting elements (electronic components)
44 Substrate 44c First through hole 44d Second hole 45 Heat sink (heat absorbing member)
45b Radiation fin 45c First hole 45d Second through hole 51 Screw (first screw member)
52 Screw (second screw member)

Claims (4)

An electronic component that generates heat; a substrate on which the electronic component is mounted; a heat-absorbing member that is provided on a rear surface of the substrate and absorbs heat generated by the electronic component; and a screwing member that assembles the heat-absorbing member to the substrate. A heat dissipation device comprising:
The heat absorbing member has a through hole through which the screwing member passes, and the substrate has a female screw into which the screwing member is screwed and a hole formed on the rear surface side. A heat dissipation device.   2. The heat radiating device according to claim 1, wherein the heat absorbing member has a plurality of heat radiating fins, and the screwing member is inserted into the through hole of the heat absorbing member from between the heat radiating fins. An electronic component that generates heat, a substrate on which the electronic component is mounted, a heat absorbing member that is provided on the rear surface of the substrate and absorbs heat generated by the electronic component, and a first screw that attaches the heat absorbing member to the substrate A heat dissipating device comprising a wearing member and a second screwing member,
The heat absorbing member has a first hole portion having a female screw into which the first screwing member is screwed, and a second through hole through which the second screwing member passes,
The substrate has a first through hole through which the first screwing member passes and a female screw into which the second screwing member is screwed, and a second hole formed on the rear surface side. And a heat dissipating device.   4. The heat dissipation device according to claim 3, wherein the heat absorption member has a plurality of heat radiation fins, and the second screwing member is inserted into the through hole of the heat absorption member from between the heat radiation fins. .

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