JP2009115678A - Semiconductor testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor testing apparatus for using effectively merits of a fixed-type connector and a floating connector, as to the connectors used in a mother board portion. <P>SOLUTION: This semiconductor testing apparatus, provided with a measuring module substrate connector-connected to the connector provided in the mother board, is provided with the mother board provided with the fixed-type connectors of prescribed number, a prescribed number of attaching panels provided respectively with the floating connectors; a plate-like template provided between the mother board and the attaching panels, the first positioning means provided in the template and the mother board; the second positioning means provided in the template and the attaching panels; and the third positioning means provided in the template and the measuring module substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a universal slot type semiconductor test apparatus capable of mounting an optimal measurement module board in an arbitrary slot for each application to be measured.
More specifically, the present invention relates to a semiconductor test apparatus that can effectively use the advantages of a fixed connector and a floating connector attached to a connector used in a mother board portion.

  Prior art documents related to semiconductor test equipment include the following.

Japanese Patent Application Laid-Open No. 08-062288

FIG. 5 is an explanatory perspective view of the main part of a conventional example that is generally used.
In the figure, a fixed connector 2 a on the measurement module substrate side is attached to the measurement module substrate 1.
A fixed connector 2b on the motherboard side is attached to the motherboard 3.
The fixed connector unit 2 is constituted by the fixed connector 2a on the measurement module substrate side and the fixed connector 2b on the motherboard side.

In the above configuration, the fixed connector 2a is connected to the fixed connector 2b.
The fixed connector 2 mounted on the printed circuit board 3 is suitable for a bus line common to each measurement module for flowing control signals, high-speed synchronous clock signals, and digitized measurement data because of its cost and mass productivity. is there.

FIG. 5 is a perspective view showing the construction of the main part of another conventional example that is generally used.
In the figure, a floating connector 4 a on the measurement module substrate side is attached to the measurement module substrate 1.
A panel-side floating connector 4 b is attached to the connector attachment panel 5.

The floating connector unit 4 is constituted by the floating connector 4a on the measurement module substrate side and the floating connector 4b on the connector mounting panel side.
The floating connector 4 is a connector that can be fixed and movable (floating operation) by being fixed to the panel 5 by a holding part having a backlash.

In the above configuration, the floating connector 4a is connected to the floating connector 4b.
Due to the high density mounting, it is difficult to control the thickness of the board when it is required to mount narrow pitch connectors on both sides of the board.

Therefore, when a narrow pitch connector is mounted on both sides, the relative mounting position accuracy of the front and back connectors may exceed the amount of guaranteed connector fitting.
For this purpose, the floating connector 4 having a floating mechanism is advantageous.

Such an apparatus has the following problems.
It is expensive to mix a fixed connector suitable for a bus line for mounting connectors for a plurality of slots on one motherboard and a floating connector suitable for double-side mounting of a measurement module board on one measurement module board. .

  A floating mechanism may be assembled on the motherboard, but it is not realistic in a universal slot specification semiconductor test device for the purpose of frequently changing modules, and a mechanism for mounting a connector on an independent panel for each slot is desirable. If an independent panel is used, this time, the configuration of the mother board having the bus line becomes complicated, and the cost for realizing the bus line becomes high.

The object of the present invention is to solve the above problems.
In a universal slot specification semiconductor test equipment, a fixed bus connector common bus line and an independent panel using a floating connector are provided, and attached to the connector used on the motherboard, and fixed. It is an object of the present invention to provide a semiconductor test apparatus that can effectively use the advantages of the connector and the floating connector.

In order to achieve such a problem, in the present invention, in the semiconductor test apparatus of claim 1,
In a semiconductor test apparatus comprising a measurement module substrate connected to a connector provided on a motherboard, a mother board provided with a predetermined number of fixed connectors, a predetermined number of mounting panels each provided with a floating connector, A plate-shaped template provided between the mother board and the mounting panel, first positioning means provided on the template and the mother board, and a second template provided on the template and the mounting panel. It is characterized by comprising positioning means, and third positioning means provided on the template and the measurement module substrate.

In the semiconductor test apparatus according to claim 2 of the present invention, in the semiconductor test apparatus according to claim 1,
The first positioning means includes a first positioning pin provided in the template and a first positioning hole provided in the motherboard and into which the first positioning pin is inserted. Features.

In the semiconductor test apparatus according to claim 3 of the present invention, in the semiconductor test apparatus according to claim 1 or 2,
The second positioning means includes a second positioning pin provided in the template, and a second positioning hole provided in the mounting panel and into which the second positioning pin is inserted. It is characterized by.

In a semiconductor test apparatus according to a fourth aspect of the present invention, in the semiconductor test apparatus according to any one of the first to third aspects,
The third positioning means includes a pilot pin provided on the template and a pilot pin socket provided on the measurement module board and into which the pilot pin is inserted.

In a semiconductor test apparatus according to a fifth aspect of the present invention, in the semiconductor test apparatus according to any one of the first to fourth aspects,
The template is characterized in that the mother board is arranged in a central portion and configured in a ring shape.

According to claim 1 of the present invention, there are the following effects.
A semiconductor test apparatus capable of effectively utilizing the advantages of the fixed connector and the floating connector is obtained by using the fixed connector and the floating connector separately for the connector used for the mother board portion.

  Since the second positioning means for positioning each independent mounting panel is prepared in the template and the mounting panel, the position of the reference point (or center point) of the floating operation of the floating connector can be accurately determined, A semiconductor test apparatus capable of effectively using the limited floating amount of the floating connector is obtained.

  In general, the greater the number of parts interposed between parts away from the overall reference position, the worse the positional accuracy due to the accumulation of tolerances. Since the means is provided, a semiconductor test apparatus that can reduce the accumulation of tolerances can be obtained.

  Since the third positioning means is provided on the measurement module substrate and the template serving as a reference for overall positioning, a semiconductor test apparatus capable of improving positioning accuracy on the mother board side and the measurement module substrate side is obtained.

According to claim 2 of the present invention, there are the following effects.
The first positioning means is provided with a first positioning pin provided in the template and a first positioning hole provided in the mother board and into which the first positioning pin is inserted. A simple and inexpensive semiconductor test apparatus can be obtained.

According to claim 3 of the present invention, there are the following effects.
The second positioning means includes a second positioning pin provided in the template and a second positioning hole provided in the mounting panel and into which the second positioning pin is inserted. Therefore, an inexpensive semiconductor test apparatus can be obtained.

According to claim 4 of the present invention, there are the following effects.
The third positioning means is provided with a pilot pin provided on the template and a pilot pin socket provided on the measurement module substrate and into which the pilot pin is inserted, so that the distance interval until positioning is fixed is long. And a semiconductor test apparatus capable of reliably positioning the measurement module substrate.

According to claim 5 of the present invention, there are the following effects.
Since the motherboard has a ring shape with the mother board arranged at the center, a semiconductor test apparatus capable of arranging a large number of mounting panels around the mother board is obtained.

Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory view of the main part configuration of one embodiment of the present invention, and FIG. 2 is a side view of the main part of FIG.
In the figure, configurations with the same symbols as in FIGS. 5 and 6 represent the same functions.
Only the differences from FIGS. 5 and 6 will be described below.

1 and 2, the measurement module substrate 11 is connected to a connector provided on the mother board 12.
The motherboard 12 is provided with a predetermined number of fixed connectors 131 on the motherboard side.
Each of the predetermined number of mounting panels 14 is provided with one floating connector 151 on the side of the mounting panel.

The measurement module board 11 is provided with a fixed connector 132 and a floating connector 152 on the measurement module board side.
One fixed connector unit 13 is formed by the fixed connector 131 on the motherboard side and the fixed connector 132 on the measurement module substrate side.

One floating connector unit 15 is formed by the floating connector 151 on the panel side and the floating connector 152 on the measurement module substrate side.
The plate-shaped template 16 is provided between the mother board 12 and the mounting panel 14.

The first positioning means 17 is provided on the template 16 and the mother board 12.
In this case, the first positioning means 17 includes a first positioning pin 171 provided on the template 16 and a first positioning pin 171 provided on the mother board 12 into which the first positioning pin 171 is inserted. Hole 172.

The second positioning means 18 is provided on the template 16 and the mounting panel 14.
In this case, the second positioning means 18 includes a second positioning pin 181 provided on the template 16 and a second position provided on the mounting panel 14 and into which the second positioning pin 181 is inserted. And an outlet hole 182.

The third positioning means 19 is provided on the template 16 and the measurement module substrate 11.
In this case, the third positioning means 19 has a pilot pin 191 provided on the template 16 and a pilot pin socket 192 provided on the measurement module substrate 11 and into which the pilot pin 191 is inserted.

  In the above configuration, as shown in FIG. 2, the measurement module substrate 11 inserts and removes the connector connection with respect to the mother board 12 in the arrow A direction.

  As a result, there is obtained a semiconductor test apparatus that can effectively use the advantages of the fixed connector 13 and the floating connector 15 by using the fixed connector 13 and the floating connector 15 separately on the connector used for the mother board 12 portion. It is done.

  Since the second positioning means 18 for positioning the independent mounting panels 14 is prepared in the template 16 and the mounting panel 14, the position of the reference point (or center point) of the floating operation of the floating connector 15 is accurate. A semiconductor test apparatus that can be determined well and can effectively use the limited floating amount of the floating connector 15 is obtained.

  In general, the greater the number of parts interposed between parts away from the overall reference position, the worse the positional accuracy due to the accumulation of tolerances. Since the means 17 is provided, a semiconductor test apparatus capable of reducing the accumulation of tolerances can be obtained.

  Since the third positioning means 19 is provided on the measurement module substrate 11 and the template 16 serving as a reference for the entire positioning, a semiconductor test capable of improving positioning accuracy on the mother board 12 side and the measurement module substrate 11 side. A device is obtained.

  The first positioning means 17 includes a first positioning pin 171 provided in the template 16 and a first positioning hole 172 provided in the mother board 12 and into which the first positioning pin 171 is inserted. Since it is provided, the configuration can be simplified and an inexpensive semiconductor test apparatus can be obtained.

  The second positioning means 18 includes a second positioning pin 181 provided in the template 16, a second positioning hole 182 provided in the mounting panel 14 and into which the second positioning pin 181 is inserted. Therefore, the configuration can be simplified and an inexpensive semiconductor test apparatus can be obtained.

  The third positioning means 19 is provided with a pilot pin 191 provided on the template 16 and a pilot pin socket 192 into which the pilot pin 191 is inserted. A semiconductor test apparatus capable of reliably positioning the template 16 and the measurement module substrate 11 is obtained.

FIG. 3 is an explanatory view showing the structure of the main part of another embodiment of the present invention, and FIG. 4 is a side view of the main part of FIG.
3 and 4, the template 31 is configured in a ring shape with the mother board 12 disposed in the center.

  As a result, the template 31 has a ring shape with the mother board 12 arranged at the center, so that a semiconductor test apparatus capable of arranging a large number of mounting panels 14 around the mother board 12 is obtained.

  3 and 4 show examples in which the measurement module substrate 11 is opposed to the left and right two directions in the figure, but the measurement module substrate 11 may be arranged in four directions (up, down, left and right) or radially. Of course.

  When mounting the measurement module substrate 11, a guide rail that holds the edge of the measurement module substrate 11 is generally provided. However, the guide rail positioning mechanism can also be mounted on the templates 16 and 31. Further, the positional relationship with the casing covering the entire system can be determined by the templates 16 and 31.

The above description merely shows a specific preferred embodiment for the purpose of explanation and illustration of the present invention.
Therefore, the present invention is not limited to the above-described embodiments, and includes many changes and modifications without departing from the essence thereof.

It is principal part structure explanatory drawing of one Example of this invention. It is a principal part side view of FIG. It is principal part structure explanatory drawing of the other Example of this invention. It is a principal part side view of FIG. It is structure explanatory drawing of the prior art example generally used conventionally. It is composition explanatory drawing of the other conventional example generally used conventionally.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Measurement module board 2 Fixed connector unit 2a Fixed connector on the measurement module board side 2b Fixed connector on the motherboard side 3 Motherboard 4 Floating connector unit 4a Floating connector on the measurement module board side 4b Floating connector on the panel side 5 Connector mounting panel 11 Measurement module board 12 Motherboard 13 Fixed connector unit 131 Fixed connector on the motherboard side 132 Fixed connector on the measurement module board side 14 Mounting panel 15 Floating connector unit 151 Floating connector on the panel side 152 Floating connector on the measurement module board side 16 Template 17 First positioning means 171 First positioning pin 172 First positioning hole 8 second positioning means 181 second positioning pin 182 second positioning holes 19 a third positioning means 191 pilot pin 192 pilot pin socket 31 Template A arrow

Claims (5)

In a semiconductor test apparatus comprising a measurement module substrate connected to a connector provided on a motherboard,
A motherboard provided with a predetermined number of fixed connectors;
A predetermined number of mounting panels each provided with a floating connector;
A plate-like template provided between the motherboard and the mounting panel;
First positioning means provided on the template and the motherboard;
Second positioning means provided on the template and the mounting panel;
A semiconductor test apparatus comprising: a third positioning unit provided on the template and the measurement module substrate. The first positioning means includes a first positioning pin provided on the template;
The semiconductor testing apparatus according to claim 1, further comprising: a first positioning hole provided in the motherboard and into which the first positioning pin is inserted. The second positioning means includes a second positioning pin provided in the template;
The semiconductor test apparatus according to claim 1, further comprising: a second positioning hole provided in the mounting panel and into which the second positioning pin is inserted. The third positioning means includes a pilot pin provided on the template;
4. The semiconductor test apparatus according to claim 1, further comprising: a pilot pin socket provided on the measurement module substrate and into which the pilot pin is inserted. The semiconductor test apparatus according to claim 1, wherein the template is configured in a ring shape with the mother board disposed in a central portion.

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