JP2009109422A - Detection sensor, and amplifier body - Google Patents

Detection sensor, and amplifier body Download PDF

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JP2009109422A
JP2009109422A JP2007283989A JP2007283989A JP2009109422A JP 2009109422 A JP2009109422 A JP 2009109422A JP 2007283989 A JP2007283989 A JP 2007283989A JP 2007283989 A JP2007283989 A JP 2007283989A JP 2009109422 A JP2009109422 A JP 2009109422A
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detection
sensor
light
light projecting
distance information
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JP5192775B2 (en
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Kyosuke Oshima
恭輔 大島
Yuji Sakai
雄二 酒井
Masao Shimazaki
政男 嶋崎
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Panasonic Industrial Devices SUNX Co Ltd
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Sunx Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a detection sensor allowing investigation of a failure. <P>SOLUTION: The detection sensor 1 includes a detecting means 15 for performing detecting operation based on the existence of a detection object, a storing means 32 for storing past detection distance information in the detecting operation, and an output means 15 to output the detection distance information stored in the storing means 32 in response to a trigger signal from the outside. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、検出センサ、アンプ本体に関する。   The present invention relates to a detection sensor and an amplifier body.

検出センサの一例として、光ファイバセンサがある(下記特許文献1参照)。これは、投光素子からの光を、光ファイバケーブルを介して検出領域に出射し、当該検出領域からの光を、光ファイバケーブルを介して受光素子に受光させ、この受光素子から出力される受光信号に基づいて検出領域に検出対象物が存在するか否かを検出するものである。
特開2003−14984公報
As an example of the detection sensor, there is an optical fiber sensor (see Patent Document 1 below). The light emitted from the light projecting element is emitted to the detection area via the optical fiber cable, and the light from the detection area is received by the light receiving element via the optical fiber cable and output from the light receiving element. Based on the received light signal, it is detected whether or not a detection target exists in the detection region.
JP 2003-14984 A

ところで、例えばユーザによる上記光ファイバセンサの使用中に不具合が生じたとき、これが、当該光ファイバセンサの製造時点など出荷前から生じていた不具合なのか、それともユーザの使用方法等により新たに生じた不具合なのかを究明する必要がある。しかし、従来の検出センサでは、それを究明するためのすべがなかった。   By the way, for example, when a problem occurs during the use of the optical fiber sensor by the user, this is a problem that occurred before shipment, such as the time of manufacture of the optical fiber sensor, or a new problem occurred due to the user's usage method, etc. It is necessary to investigate whether it is a malfunction. However, the conventional detection sensor has nothing to investigate it.

本発明は上記のような事情に基づいて完成されたものであって、その目的は、不具合の究明が可能な検出センサを提供するところにある。   The present invention has been completed based on the above circumstances, and an object thereof is to provide a detection sensor capable of investigating a problem.

上記の目的を達成するための手段として、第1の発明に係る検出センサは、検出対象物の物理量(例えば検出対象物の有無や距離等の状態による物理量変化)に応じた検出動作を行う検出手段と、前記検出動作における過去の検出距離情報が記憶される記憶手段と、外部からのトリガ信号に応じて前記記憶手段に記憶された前記検出距離情報を出力する出力手段と、を備える。
本発明によれば、過去(例えば製造時)に検出動作を実行したときの検出距離情報を記憶手段に記憶しておけば、その過去の検出距離と現在の検出距離とを対比することで、現在生じている不具合が過去から生じていたのか、それとも現在新たに生じたのかを知ることができ、不具合の究明が可能になる。
As means for achieving the above object, the detection sensor according to the first aspect of the invention is a detection that performs a detection operation in accordance with a physical quantity of a detection target (for example, a change in physical quantity depending on the presence / absence of the detection target or a state such as a distance). Means, storage means for storing past detection distance information in the detection operation, and output means for outputting the detection distance information stored in the storage means in response to an external trigger signal.
According to the present invention, if the detection distance information when the detection operation is executed in the past (for example, at the time of manufacture) is stored in the storage unit, the past detection distance and the current detection distance are compared, It is possible to know whether a malfunction that has occurred has occurred from the past or has newly occurred, and it becomes possible to investigate the malfunction.

第2の発明は、検出ヘッドが着脱可能に設けられる検出センサのアンプ本体であって、前記検出ヘッドからの信号に基づき検出対象物の物理量に応じた検出動作を行う検出手段と、前記検出動作における過去の検出距離情報が記憶される記憶手段と、外部からのトリガ信号に応じて前記記憶手段に記憶された前記検出距離情報を出力する出力手段と、を備える。
本発明によれば、過去(例えば製造時や、ユーザの使用開始時など)に検出ヘッドを取り付けて検出動作を実行したときの検出距離情報を記憶手段に記憶しておけば、その過去の検出距離と現在の検出距離とを対比することで、現在生じている不具合が過去から生じていたのか、それとも現在新たに生じたのかを知ることができ、不具合の究明が可能になる。
According to a second aspect of the present invention, there is provided an amplifier body of a detection sensor in which a detection head is detachably provided, a detection means for performing a detection operation according to a physical quantity of a detection target based on a signal from the detection head, and the detection operation Storage means for storing past detection distance information and output means for outputting the detection distance information stored in the storage means in response to an external trigger signal.
According to the present invention, if the detection distance information when the detection head is attached and the detection operation is executed in the past (for example, at the time of manufacture or when the user starts using) is stored in the storage means, the past detection is performed. By comparing the distance with the current detection distance, it is possible to know whether the presently occurring defect has occurred from the past or newly, and it is possible to investigate the defect.

本発明によれば、検出センサについて不具合の究明が可能になる。   According to the present invention, it is possible to investigate a defect in a detection sensor.

<実施形態1>
本発明の実施形態1を図1〜図3を参照しつつ説明する。
尚、図1において矢印Aの方向を前方、矢印Bの方向を右方向とする。
<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS.
In FIG. 1, the direction of arrow A is the forward direction, and the direction of arrow B is the right direction.

1.センサシステム全体の概要構成
本実施形態のセンサシステムは、同一構造の例えば16台の光ファイバセンサ1(図1及び図2ではそのうちの4台のみ図示。)を備えて構成され、各光ファイバセンサ1は、そこから導出された光ファイバ19の先端を検出領域に向けた状態で互いに隣接配置され、検出領域内における検出対象物の有無に応じた検出動作を行う。そして、センサシステムは、通信ユニット2からの送信された伝送信号に例えば各光ファイバセンサ1での検出結果などを反映させつつ、一端側に位置する光ファイバセンサ1から他端側に位置する光ファイバセンサ1へと順番に受け渡していく、いわゆるバケツリレー方式でデータ伝送(シリアル伝送)を行うようになっている。
1. Schematic Configuration of Entire Sensor System The sensor system of the present embodiment is configured to include, for example, 16 optical fiber sensors 1 (only four of which are shown in FIGS. 1 and 2) having the same structure, and each optical fiber sensor. 1 are arranged adjacent to each other with the leading ends of the optical fibers 19 derived therefrom facing the detection region, and perform a detection operation according to the presence or absence of the detection target in the detection region. Then, the sensor system reflects, for example, the detection result of each optical fiber sensor 1 in the transmission signal transmitted from the communication unit 2, while the light positioned on the other end side from the optical fiber sensor 1 positioned on the one end side. Data transmission (serial transmission) is performed by a so-called bucket relay system that sequentially transfers to the fiber sensor 1.

なお、以下の説明において、光ファイバセンサ1全体を指す場合にはセンサ1と称し、個々の光ファイバセンサ1を指す場合には、左方の光ファイバセンサ1から第1のセンサ1、第2のセンサ1、第3のセンサ1、第4のセンサ1と称する。本実施形態では図2において左方に設けられる第1のセンサ1が親機とされ、その右の第2のセンサ1が子機とされている。なお、これらを親機センサ1A、子機センサ1Bとも称するものとする。   In the following description, when referring to the entire optical fiber sensor 1, it is referred to as a sensor 1, and when referring to individual optical fiber sensors 1, the first optical fiber sensor 1 to the second optical fiber sensor 1 are referred to as the second optical fiber sensor 1. These are referred to as sensor 1, third sensor 1, and fourth sensor 1. In the present embodiment, the first sensor 1 provided on the left side in FIG. 2 is a parent device, and the right second sensor 1 is a child device. These are also referred to as a parent device sensor 1A and a child device sensor 1B.

2.各機器の外部構成
(1)光ファイバセンサ
図1に示すように、各センサ1はアンプ本体40の前面から光ファイバ19が導出された構成になっている。具体的には、アンプ本体40は箱状をなし、前面に設けられたファイバ挿入孔に光ファイバ19の先端が挿入されており、一方、背面には図示しない制御ユニットから連なるケーブルのコネクタCが接続されている。また、センサ1の右側面には出力側カプラに相当する投光素子12が設けられ、左側面には入力側カプラに相当する受光素子11が設けられており、前部下端近傍には左右側面を貫く角型の透孔13が形成されている。また、下面にはセンサ1の並び方向に沿ってアリ溝(底面側よりも開口側の方が幅狭になっている溝)を形成してなる挟持部(図1では終端ユニット4に隠れており図示せず)が設けられている。
2. External Configuration of Each Device (1) Optical Fiber Sensor As shown in FIG. 1, each sensor 1 has a configuration in which an optical fiber 19 is led out from the front surface of the amplifier body 40. Specifically, the amplifier main body 40 has a box shape, and the tip of the optical fiber 19 is inserted into a fiber insertion hole provided on the front surface, while a cable connector C connected to a control unit (not shown) is provided on the rear surface. It is connected. Further, a light projecting element 12 corresponding to the output side coupler is provided on the right side surface of the sensor 1, and a light receiving element 11 corresponding to the input side coupler is provided on the left side surface. A square-shaped through-hole 13 penetrating is formed. Further, a pinching portion (hidden by the terminal unit 4 in FIG. 1) is formed by forming dovetail grooves (grooves whose opening side is narrower than the bottom surface side) along the alignment direction of the sensors 1 on the lower surface. (Not shown) is provided.

センサ1は取付レールに相当する周知のDINレール3の溝内に上記挟持部を通すことによって装着されており、それぞれが密接して相隣接するセンサ1の投光素子12及び受光素子11が対向した状態となっている。投光素子12及び受光素子11はそれぞれ、投光回路16及び受光回路14によって駆動される。また、各センサ1にはメモリ32(図3参照)も設けられている。   The sensor 1 is mounted by passing the clamping portion through a groove of a well-known DIN rail 3 corresponding to a mounting rail, and the light projecting element 12 and the light receiving element 11 of the sensor 1 which are closely adjacent to each other face each other. It has become a state. The light projecting element 12 and the light receiving element 11 are driven by a light projecting circuit 16 and a light receiving circuit 14, respectively. Each sensor 1 is also provided with a memory 32 (see FIG. 3).

(2)通信ユニット及び終端ユニット
第1及び第4のセンサ1の側方には同じく箱状をなす通信ユニット2及び終端ユニット4が配置されている。この通信ユニット2にはセンサ1の挟持部と同一形状の挟持部(図示せず)が設けられ、この挟持部にDINレール3を通して装着されている。また、上下面間を貫通して形成された2つのねじ孔21が設けられ、これに螺合するねじ22が設けられており、ねじ22を締め付けることによって挟持部とねじ22先端とでDINレール3を挟み込み、DINレール3に対して固定可能となっている。終端ユニット4にも同じく挟持部41、ねじ孔42及びねじ43が設けられており、ねじ43を締めることによってDINレール3に対して固定可能となっている。
(2) Communication Unit and Termination Unit A communication unit 2 and a termination unit 4 that are similarly box-shaped are arranged on the sides of the first and fourth sensors 1. The communication unit 2 is provided with a holding part (not shown) having the same shape as the holding part of the sensor 1, and is attached to the holding part through the DIN rail 3. In addition, two screw holes 21 formed so as to penetrate between the upper and lower surfaces are provided, and a screw 22 that is screwed into the screw hole 21 is provided. 3 can be inserted and fixed to the DIN rail 3. The end unit 4 is similarly provided with a clamping part 41, a screw hole 42 and a screw 43, and can be fixed to the DIN rail 3 by tightening the screw 43.

通信ユニット2の右側面に設けられた出力側カプラに相当する投光素子23は第1のセンサ1の受光素子11と対向する位置に配されており、透孔13と対向する位置に入力側カプラに相当する受光素子24が設けられている。また、終端ユニット4の左側面に設けられた中継入力部に相当する受光素子44が第4のセンサ1の投光素子12と対向する位置に配されており、透孔13と対向する位置に中継出力部に相当する投光素子45が設けられている。終端ユニット4の投光素子45と通信ユニット2の受光素子24との間にはセンサ1の透孔13を介して光軸が形成可能となっている。   The light projecting element 23 corresponding to the output side coupler provided on the right side surface of the communication unit 2 is disposed at a position facing the light receiving element 11 of the first sensor 1, and is positioned at the position facing the through hole 13 at the input side. A light receiving element 24 corresponding to a coupler is provided. Further, the light receiving element 44 corresponding to the relay input portion provided on the left side surface of the termination unit 4 is arranged at a position facing the light projecting element 12 of the fourth sensor 1, and at a position facing the through hole 13. A light projecting element 45 corresponding to the relay output unit is provided. An optical axis can be formed between the light projecting element 45 of the termination unit 4 and the light receiving element 24 of the communication unit 2 through the through hole 13 of the sensor 1.

3.各機器の電気的構成
次に、センサシステムの電気的構成について図2を参照して説明する。
(1)通信ユニット
まず、通信ユニット2のハウジングには設定操作部20が設けられており、ここに設けた設定スイッチを操作することによって通信相手のセンサ1を特定するアドレスの入力と、そのセンサ1が実行すべきコマンド(外部からのトリガ信号の一例)を入力することができる。なお、通信ユニット2にパーソナルコンピュータ(図示せず)を接続することにより、このコンピュータでの操作により通信ユニット2を介して、各センサ1へのアドレスやコマンドを入力したり、各センサ1からのデータをコンピュータに取得させたりすることができる。
3. Next, the electrical configuration of the sensor system will be described with reference to FIG.
(1) Communication unit First, a setting operation unit 20 is provided in the housing of the communication unit 2, and an input of an address for specifying the communication partner sensor 1 by operating a setting switch provided therein, and the sensor A command to be executed by 1 (an example of an external trigger signal) can be input. In addition, by connecting a personal computer (not shown) to the communication unit 2, an address and a command to each sensor 1 can be input via the communication unit 2 by an operation on this computer, or from each sensor 1. Data can be acquired by a computer.

この設定スイッチのスイッチ状態はCPU25に取込まれ、ここで伝送信号を生成して、投光素子23と共に通信ユニット側送信手段を構成する投光回路26に与えられる。投光回路26はその伝送信号に基づいて投光素子23に駆動電流を供給して伝送信号を光信号として第1のセンサ1に所定の周期(例えば50μS)で順次送信する。一方、受光素子24に入射した光は通信ユニット側受信手段に相当する受光回路27を介してCPU25に入力されるようになっている。   The switch state of this setting switch is taken into the CPU 25, where a transmission signal is generated and given to the light projecting circuit 26 which constitutes the communication unit side transmitting means together with the light projecting element 23. The light projecting circuit 26 supplies a drive current to the light projecting element 23 based on the transmission signal, and sequentially transmits the transmission signal as an optical signal to the first sensor 1 at a predetermined cycle (for example, 50 μS). On the other hand, the light incident on the light receiving element 24 is input to the CPU 25 via the light receiving circuit 27 corresponding to the communication unit side receiving means.

(2)光ファイバセンサ
各センサ1では、受光素子11で光信号として受けた伝送信号が電気信号に変換され、この受光素子11と共にセンサ間受信手段を構成する受光回路14にてデジタル信号に変換されてCPU15に与えられる。CPU15では、伝送信号に含まれる同期信号に基づいて検出動作や伝送エラー判定等を実行したり、コマンドデータに基づいて各種処理を実行したりする。そして、自己の検出結果を反映した伝送信号を、投光素子12と共にセンサ間送信手段を構成する投光回路16に送出し、投光回路16から駆動電流を投光素子12に供給して投光させる。
(2) Optical fiber sensor In each sensor 1, a transmission signal received as an optical signal by the light receiving element 11 is converted into an electric signal, and converted into a digital signal by a light receiving circuit 14 that constitutes an inter-sensor receiving means together with the light receiving element 11. And given to the CPU 15. The CPU 15 executes detection operation, transmission error determination, and the like based on a synchronization signal included in the transmission signal, and executes various processes based on command data. Then, a transmission signal reflecting its own detection result is sent to the light projecting circuit 16 that constitutes the sensor-to-sensor transmission means together with the light projecting element 12, and a drive current is supplied from the light projecting circuit 16 to the light projecting element 12 for light projection. Light up.

また、図3に示すように、各センサ1には、当該センサ1に電力供給するための電源端子P1及びグランド端子P2が設けられている。また、電源端子P1とグランド端子P2との間にはスイッチ素子50(例えばトランジスタ)及び抵抗51が接続されている。更に、スイッチ素子50と抵抗51との接続点に出力端子P3が接続されている。   As shown in FIG. 3, each sensor 1 is provided with a power supply terminal P <b> 1 and a ground terminal P <b> 2 for supplying power to the sensor 1. A switch element 50 (for example, a transistor) and a resistor 51 are connected between the power supply terminal P1 and the ground terminal P2. Further, an output terminal P3 is connected to a connection point between the switch element 50 and the resistor 51.

CPU15は、上記検出動作時において投受光動作を行う。即ち、投光部17を発光させて光ファイバ19を通じて検出領域に投光し、このときに検出領域からの反射光を光ファイバ19を通じて受光する受光部18での受光量を取得する。そして、この受光量を閾値と大小比較し、その比較結果に応じたオンオフ信号をスイッチ素子50の制御端子(例えばベース)に与える。これにより、スイッチ素子50はオンオフする。このとき、CPU15は検出手段として機能する。なお、各端子P1〜P3は上記コネクタCに設けられている。   The CPU 15 performs a light projecting / receiving operation during the detection operation. In other words, the light projecting unit 17 emits light, and is projected onto the detection region through the optical fiber 19. At this time, the amount of light received by the light receiving unit 18 that receives the reflected light from the detection region through the optical fiber 19 is acquired. Then, the received light amount is compared with a threshold value, and an on / off signal corresponding to the comparison result is given to the control terminal (for example, base) of the switch element 50. Thereby, the switch element 50 is turned on and off. At this time, the CPU 15 functions as detection means. The terminals P1 to P3 are provided on the connector C.

(3)終端ユニット
そして、終端ユニット4の中継入力部に相当する受光素子44に入射した光は受光回路46にてデジタル信号に変換された後、信号増幅機能を持った中継アンプ48を介して投光回路47に送出される。投光回路47では信号に基づいて中継出力部に相当する投光素子45に駆動電流を供給して投光素子45から光を投光させる。これにより各センサ1間を伝送されてきた伝送信号が終端ユニット4から通信ユニット2に返送される。なお、投光素子45の出力はセンサ1の投光素子12よりも強く設定されている。
(3) Termination unit The light incident on the light receiving element 44 corresponding to the relay input section of the termination unit 4 is converted into a digital signal by the light receiving circuit 46 and then passed through a relay amplifier 48 having a signal amplification function. The light is sent to the light projecting circuit 47. Based on the signal, the light projecting circuit 47 supplies a drive current to the light projecting element 45 corresponding to the relay output unit to project light from the light projecting element 45. As a result, the transmission signal transmitted between the sensors 1 is returned from the termination unit 4 to the communication unit 2. The output of the light projecting element 45 is set to be stronger than the light projecting element 12 of the sensor 1.

4.検査結果情報の記憶について
センサ1をユーザが使用するときに不具合が生じることがあり得る。具体的には、検出対象物の有無を判断可能な限界距離である検出距離、センサ1の消費電力、検出感度、出力端子P3の出力レベルなどが、センサ1の仕様(例えばカタログスペック)を満たさない場合がある。そして、このような不具合が、製造時点(製品の出荷前)から生じていたものか、それとも製品出荷後、例えばユーザの使用環境等により新たに生じたものなのかを把握できれば、不具合の究明や今後の対策に役立てることができる。
4). Regarding storage of test result information When the user uses the sensor 1, a malfunction may occur. Specifically, the detection distance that is the limit distance from which the presence or absence of the detection target can be determined, the power consumption of the sensor 1, the detection sensitivity, the output level of the output terminal P3, and the like satisfy the specifications of the sensor 1 (for example, catalog specifications). There may not be. And if you can grasp whether such a defect has occurred from the time of manufacture (before the product is shipped) or a new one after the product has been shipped, for example, depending on the user's usage environment, It can be used for future measures.

そこで、製造段階で各センサ1について各種の検査を行って、その検査結果をメモリ32(記憶手段の一例)に記憶できるようになっている。但し、メモリ32には各種の設定情報等も記憶されるため、そのメモリ32に検査結果情報をあまり多く記憶すべきではない。本実施形態では、製造段階での検出距離情報(過去の検出距離情報の一例)及び消費電力情報に限ってメモリ32に記憶する。これらは不具合が発生する頻度が多い傾向にあり、特に重要な検査項目だからである。   Therefore, various inspections are performed on each sensor 1 at the manufacturing stage, and the inspection results can be stored in the memory 32 (an example of a storage unit). However, since various setting information and the like are also stored in the memory 32, not much test result information should be stored in the memory 32. In the present embodiment, only the detection distance information (an example of past detection distance information) and power consumption information at the manufacturing stage are stored in the memory 32. This is because these tend to occur frequently and are particularly important inspection items.

なお、検出距離の測定方法は、まず検出領域内に検出対象物を配置し、センサ1に上記投受光動作をさせつつ、センサ1と検出対象物との距離を変位させる。上記スイッチ素子のオンオフが切り替わった時点(出力端子P3のレベルが反転した時点)でのセンサ1と検出対象物との距離を測定すれば、上記検出距離を得ることができる。また、消費電力の測定方法は、まず電源端子P1と出力端子P3との間にシャント抵抗(図示せず)を接続し、スイッチ素子をオンさせる。そして、このときの時の電源端子P1とグランド端子P2との間の消費電流をマルチメータ(図示せず)で測定する。   The detection distance is measured by first disposing the detection object in the detection region and displacing the distance between the sensor 1 and the detection object while causing the sensor 1 to perform the light projecting / receiving operation. If the distance between the sensor 1 and the detection object at the time when the on / off of the switch element is switched (when the level of the output terminal P3 is inverted), the detection distance can be obtained. In the method of measuring power consumption, first, a shunt resistor (not shown) is connected between the power supply terminal P1 and the output terminal P3, and the switch element is turned on. The current consumption between the power supply terminal P1 and the ground terminal P2 at this time is measured with a multimeter (not shown).

次に、通信ユニット2及び終端ユニット4による上記シリアル伝送を利用して、各センサ1にそれぞれの検出距離情報及び消費電力情報を伝送し、各メモリ32に記憶させる。これにより、各センサ1には、メモリ32に製造時における検出距離情報及び消費電力情報が記憶されることになる。なお、検出距離情報及び消費電力情報は検出距離データ及び消費電力データそのものである必要は必ずしもなく、例えばコード化や暗号化されてメモリ32に記憶するようにしてもよい。   Next, using the serial transmission by the communication unit 2 and the termination unit 4, the respective detection distance information and power consumption information are transmitted to each sensor 1 and stored in each memory 32. As a result, each sensor 1 stores detection distance information and power consumption information at the time of manufacture in the memory 32. Note that the detection distance information and the power consumption information are not necessarily the detection distance data and the power consumption data themselves, and may be stored in the memory 32 after being encoded or encrypted, for example.

製造者は、上記不具合が生じたとユーザから相談を受けた場合には、次の作業を行う。まず上記測定方法により現在の検出距離や消費電流を測定する。次に、通信ユニット2にてコマンド(トリガ信号の一例)を入力することにより上記シリアル伝送を利用して、メモリ32に記憶された各センサ1の製造時における検出距離情報及び消費電力情報を取り出す。このとき、CPU15、投光素子12及び投光回路16等が出力手段として機能する。   When the manufacturer receives a consultation from the user that the above problem has occurred, the manufacturer performs the following operation. First, the current detection distance and current consumption are measured by the above measuring method. Next, by inputting a command (an example of a trigger signal) in the communication unit 2, the detection distance information and the power consumption information at the time of manufacture of each sensor 1 stored in the memory 32 are extracted using the serial transmission. . At this time, the CPU 15, the light projecting element 12, the light projecting circuit 16, and the like function as output means.

そして、検出距離及び消費電力の値が共に、製造時と現時点とで同じであれば製造時点からの不具合であることが分かり、製造工程や搬送工程の見直し等をすべきことが分かる。一方、検出距離及び消費電力のうち少なくとも一方の値が製造時と現時点とで異なればユーザの使用環境・方法による不具合の可能性があるため、正しい使用環境・方法をユーザに知らせる。   If both the detection distance and the power consumption value are the same at the time of manufacture and the current time, it is understood that the problem has occurred from the time of manufacture, and it is understood that the manufacturing process and the transport process should be reviewed. On the other hand, if the value of at least one of the detection distance and the power consumption differs between the time of manufacture and the current time, there is a possibility of a malfunction due to the user's usage environment / method, so the user is notified of the correct usage environment / method.

なお、例えば現時点での検出距離情報や消費電力情報を上記シリアル伝送により各センサ1のメモリ32に伝送し、各センサ1のCPU15が、検出距離や消費電力について製造時点と現時点とでの値が同じかどうかを判定し、この判定結果に応じた信号を通信ユニット2に返信する構成であってもよい。また、上記判定結果に応じた表示パターンを表示手段38に実行させる構成であってもよい。   For example, the current detection distance information and power consumption information are transmitted to the memory 32 of each sensor 1 by the serial transmission, and the CPU 15 of each sensor 1 determines the values of the detection distance and power consumption at the time of manufacture and the current time. It may be determined whether or not they are the same, and a signal corresponding to the determination result is returned to the communication unit 2. Moreover, the structure which makes the display means 38 perform the display pattern according to the said determination result may be sufficient.

<実施形態2>
図4は実施形態2を示す。前記実施形態1では投光素子および受光素子がアンプ本体40に一体的に設けられた構成であったが、本実施形態の検出センサは、投光素子及び受光素子がアンプ本体から導出された検出ヘッド側に設けられた、いわゆるヘッド分離型の光電センサである。
<Embodiment 2>
FIG. 4 shows a second embodiment. In the first embodiment, the light projecting element and the light receiving element are integrally provided in the amplifier main body 40. However, the detection sensor of the present embodiment is a detection in which the light projecting element and the light receiving element are derived from the amplifier main body. This is a so-called head-separated photoelectric sensor provided on the head side.

本実施形態に係るヘッド分離型の光電センサ(以下、「光電センサ60」という)は、投光素子62(例えば発光ダイオード)を備えて、その投光素子62に連なる信号線Lを包む図示しないケーブルを導出してなる投光ヘッド部61(検出ヘッドの一例)と、受光素子64(例えば、フォトダイオード)を備えて、その受光素子64に連なる信号線Lを導出してなる受光ヘッド部63(検出ヘッドの一例)と、両ヘッド部61,63からの信号線Lがそれぞれ接続される投光用及ぶ受光用の2組の接続端子部66,67を備えたアンプ本体70とから構成されている。   The head-separated photoelectric sensor according to the present embodiment (hereinafter referred to as “photoelectric sensor 60”) includes a light projecting element 62 (for example, a light emitting diode) and encloses a signal line L connected to the light projecting element 62 (not shown). A light projecting head unit 61 (an example of a detection head) formed by deriving a cable and a light receiving element 64 (for example, a photodiode), and a light receiving head unit 63 formed by deriving a signal line L connected to the light receiving element 64. (An example of a detection head) and an amplifier main body 70 including two connection terminal portions 66 and 67 for light projection and light reception to which signal lines L from both head portions 61 and 63 are connected, respectively. ing.

なお、投光ヘッド部61及び受光ヘッド部63は、例えば所定の検出領域に向けて並設され、それらの前方に存在する検出対象物Wでの反射によって変化する受光素子64からの受光信号(検出ヘッドからの信号の一例)レベルに基づいて検出対象物Wの有無を検出する。また、両ヘッド部61,63は、アンプ本体70に対して着脱可能に装着される。   The light projecting head unit 61 and the light receiving head unit 63 are arranged in parallel toward a predetermined detection region, for example, and receive light signals (from the light receiving element 64 that change due to reflection by the detection target W existing in front of them) ( An example of a signal from the detection head) The presence or absence of the detection object W is detected based on the level. Both head portions 61 and 63 are detachably attached to the amplifier main body 70.

アンプ本体70には、検出手段として機能するCPU69が備えられている。前述の投光用接続端子部66のうち、一方の接続端子66Aは、コレクタ側がバイアス用の抵抗を介して直流電源Vccに接続されると共にCPU69からの駆動パルスPを受けてスイッチング動作を行うトランジスタ68のエミッタ側に接続されており、他方の接続端子66Bはグランドラインに接続されている。   The amplifier main body 70 includes a CPU 69 that functions as detection means. Among the above-mentioned light projecting connection terminal portions 66, one connection terminal 66A is a transistor whose collector side is connected to the DC power source Vcc through a biasing resistor and receives a drive pulse P from the CPU 69 to perform a switching operation. 68 is connected to the emitter side, and the other connection terminal 66B is connected to the ground line.

また、受光用接続端子部67のうち、一方の接続端子67Aは、バイアス用の抵抗を介して直流電源Vccに接続されると共にコンデンサ65を介してCPU69に接続されており、他方の接続端子67Bはグランドラインに接続されている。なお、コンデンサ65は直流電圧除去としての役割を果たす。   Of the light receiving connection terminal portion 67, one connection terminal 67A is connected to the DC power source Vcc via a bias resistor and connected to the CPU 69 via a capacitor 65, and the other connection terminal 67B. Is connected to the ground line. Capacitor 65 serves as DC voltage removal.

また、CPU69は、前記トランジスタ68に対して所定のタイミングで駆動パルスPを与える。これにより、投光用接続端子部66に接続された投光ヘッド部61の投光素子62が発光し投光動作を行う。また、CPU69は、上記駆動パルスPの出力タイミングに同期してコンデンサ65との接続点の電位 を読み込んで予め定めた閾値と大小比較する。ここで、閾値は、例えば検出領域に検出対象物Wがないときの上記電位レベルと、検出対象物Wがあるときの上記電位レベルとの中間レベルに設定されている。そして、CPU69は、上記電位レベルが上記閾値を超えたときに例えば図示しない出力回路を介して検出信号を出力する。   Further, the CPU 69 gives a driving pulse P to the transistor 68 at a predetermined timing. Thereby, the light projecting element 62 of the light projecting head portion 61 connected to the light projecting connection terminal portion 66 emits light and performs a light projecting operation. Further, the CPU 69 reads the potential at the connection point with the capacitor 65 in synchronization with the output timing of the drive pulse P and compares it with a predetermined threshold value. Here, the threshold value is set to, for example, an intermediate level between the potential level when the detection target W is not present in the detection region and the potential level when the detection target W is present. Then, the CPU 69 outputs a detection signal via, for example, an output circuit (not shown) when the potential level exceeds the threshold value.

そして、この光電センサ60にも、上記実施形態1と同様、メモリ32、3つの端子P1〜P3、スイッチ素子50及び抵抗51が設けられている。
ところで、前述したように、本実施形態の光電センサ60はヘッド分離型であり、投光ヘッド部61及び受光ヘッド部63が交換可能にアンプ本体70に装着される。従って、光電センサ60の製造時とユーザの使用時とでアンプ本体70に接続される投光ヘッド部61や受光ヘッド部63が異なることがあり得る。
The photoelectric sensor 60 is also provided with a memory 32, three terminals P1 to P3, a switch element 50, and a resistor 51, as in the first embodiment.
By the way, as described above, the photoelectric sensor 60 of the present embodiment is a head separation type, and the light projecting head unit 61 and the light receiving head unit 63 are mounted on the amplifier main body 70 in a replaceable manner. Accordingly, the light projecting head unit 61 and the light receiving head unit 63 that are connected to the amplifier main body 70 may differ between when the photoelectric sensor 60 is manufactured and when it is used by the user.

そこで、例えば製造段階では、検査用の標準ヘッド(投光ヘッド部61、受光ヘッド部63と構成は同一であり、検査用として準備されたもの)をアンプ本体70に接続して、製造段階での検出距離情報(過去の検出距離情報の一例)及び消費電力情報をメモリ32に記憶させる。ユーザ使用時に不具合が生じたときには、そのときの検出距離や消費電流を測定する。   Therefore, for example, at the manufacturing stage, a standard head for inspection (the light projection head unit 61 and the light receiving head unit 63 have the same configuration and are prepared for inspection) is connected to the amplifier main body 70, and at the manufacturing stage, Detection distance information (an example of past detection distance information) and power consumption information are stored in the memory 32. When a problem occurs during user use, the detection distance and current consumption at that time are measured.

但し、この構成では、メモリ32に記憶された検出距離等は上記標準ヘッドが装着されたときのものである一方で、現在測定した検出距離等は上記標準ヘッドでなく、ユーザが実際に使用している投光ヘッド部61及び受光ヘッド部63が装着されたときのものである。   However, in this configuration, the detection distance and the like stored in the memory 32 are those when the standard head is mounted, while the currently measured detection distance and the like are not the standard head but are actually used by the user. The projection head unit 61 and the light receiving head unit 63 are mounted.

そこで、例えばユーザがアンプ本体70に投光ヘッド部61及び受光ヘッド部63を装着した当初に、そのときの検出距離等を測定してメモリ32に記憶させるようにすることが好ましい。そうすれば、その後に不具合が生じたときに、メモリ32に記憶された上記装着当初の検出距離情報(過去の検出距離情報の一例)等と、不具合時に測定した検出距離情報等は同じ投光ヘッド部61及び受光ヘッド部63を装着した状態でのものであるから、精度よく不具合の究明を行うことができる。   Therefore, for example, when the user attaches the light projecting head unit 61 and the light receiving head unit 63 to the amplifier main body 70, it is preferable to measure the detection distance at that time and store it in the memory 32. Then, when a malfunction occurs after that, the detected distance information (an example of past detected distance information) stored in the memory 32 and the detected distance information measured at the time of the malfunction are the same. Since the head portion 61 and the light receiving head portion 63 are mounted, the problem can be investigated with high accuracy.

なお、メモリ32には、検出距離情報等として、製造時のものと装着当初のものの両方を記憶する構成であってもよいし、装着当初の検出距離情報が取り込まれたときにそれを製造時のものに対して書き換え更新する構成であってもよい。   The memory 32 may be configured to store both the information at the time of manufacture and the information at the time of initial mounting as detection distance information or the like, or when the detection distance information at the time of initial mounting is captured, A configuration may be used in which rewriting and updating is performed on the one.

<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
(1)上記実施形態では、検出距離情報及び消費電力情報の両方をメモリ32に記憶させたり、測定したりする構成であったが、これらのいずれか一方のみ記憶・測定するようにしてもよい。
(2)上記実施形態では、検出センサとして反射型の光電センサ、ファイバセンサであったが、これに限らず、透過型であってもよい。また、検出対象物の有無検出が可能であれば、光学式に限らず、磁気式、超音波式、圧力式などのセンサであってもよい。
(3)「過去の検出距離情報」として、上記実施形態では製造時や装着当初のものとしたが、これに限らず、過去に測定した検出距離であれば他の時点であってもよい。
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the above embodiment, both the detection distance information and the power consumption information are stored in the memory 32 or measured, but only one of these may be stored and measured. .
(2) In the above embodiment, the detection sensor is a reflective photoelectric sensor or fiber sensor, but is not limited thereto, and may be a transmission type. Further, as long as the presence / absence of the detection target can be detected, the sensor is not limited to the optical type but may be a magnetic type, ultrasonic type, pressure type or the like.
(3) Although “past detection distance information” is the information at the time of manufacture or at the beginning of mounting in the above-described embodiment, the present invention is not limited to this, and may be another time point as long as it is a detection distance measured in the past.

本発明の実施形態1に係るセンサシステムの外観を示す斜視図The perspective view which shows the external appearance of the sensor system which concerns on Embodiment 1 of this invention. センサシステムの内部構成を示すブロック図Block diagram showing the internal configuration of the sensor system 光ファイバセンサのアンプ本体の内部構成を示すブロック図Block diagram showing the internal configuration of the amplifier body of the optical fiber sensor 実施形態2の光電センサの内部構成を示すブロック図The block diagram which shows the internal structure of the photoelectric sensor of Embodiment 2.

符号の説明Explanation of symbols

1…センサ(検出センサ)
15,23…CPU(検出手段、出力手段)
32…メモリ(記憶手段)
60…光電センサ(検出センサ)
61…投光ヘッド部(検出ヘッド)
63…受光ヘッド部(検出ヘッド)
70…アンプ本体
W…検出対象物
1 ... sensor (detection sensor)
15, 23 ... CPU (detection means, output means)
32 ... Memory (storage means)
60 ... Photoelectric sensor (detection sensor)
61: Light projecting head (detection head)
63. Light receiving head section (detection head)
70 ... Amplifier body W ... Object to be detected

Claims (2)

検出対象物の物理量に応じた検出動作を行う検出手段と、
前記検出動作における過去の検出距離情報が記憶される記憶手段と、
外部からのトリガ信号に応じて前記記憶手段に記憶された前記検出距離情報を出力する出力手段と、を備える検出センサ。
Detection means for performing a detection operation according to the physical quantity of the detection object;
Storage means for storing past detection distance information in the detection operation;
A detection sensor comprising: output means for outputting the detection distance information stored in the storage means in response to an external trigger signal.
検出ヘッドが着脱可能に設けられる検出センサのアンプ本体であって、
前記検出ヘッドからの信号に基づき検出対象物の物理量に応じた検出動作を行う検出手段と、
前記検出動作における過去の検出距離情報が記憶される記憶手段と、
外部からのトリガ信号に応じて前記記憶手段に記憶された前記検出距離情報を出力する出力手段と、を備える検出センサのアンプ本体。
An amplifier body of a detection sensor in which a detection head is detachably provided,
Detection means for performing a detection operation in accordance with a physical quantity of a detection object based on a signal from the detection head;
Storage means for storing past detection distance information in the detection operation;
An amplifier body of a detection sensor, comprising: output means for outputting the detection distance information stored in the storage means in response to an external trigger signal.
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