JP2009108419A - In-line substrate treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an in-line substrate treatment apparatus suitably used for manufacturing a magnetic recording disk such as a hard disk. <P>SOLUTION: First and second revolving mechanisms for revolving substrate holders 51 and 52 respectively are disposed along first and second endless conveying paths 1 and 2 to which a plurality of vacuum chambers containing a treatment chamber is connected, wherein the substrate holders 51 and 52 hold a substrate and the treatment chamber treats the substrate in vacuum. A conveying system is established so as to remove the substrate from the first substrate holder 51, convey the substrate in vacuum along a third conveying path 3 without sending it into the atmosphere and transfer the substrate to the second substrate holder 52. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The invention of the present application relates to an inline-type substrate processing apparatus.

  As a technical field in which the inline-type substrate processing apparatus is used, there is production of a magnetic recording disk such as a hard disk. The production of magnetic recording disks such as hard disks is roughly divided into the pre-processes from the creation of the base film, the creation of the magnetic film for the recording layer, the creation of the protective film for protecting the recording layer, and the creation of the protective film after the creation of the protective film. The process is divided into post-processes for forming a lubricant layer on the surface of the film. The lubricating layer is provided in consideration of the contact of the magnetic head at the time of recording and reading information.

  The lubricant layer is formed by the following procedure. First, since a thin film for a recording layer or the like is usually formed in a vacuum chamber, the substrate after film formation is taken out to the atmosphere. Then, it is burnished in order to remove the fouling substances adhering to the surface of the substrate during film formation and the protrusions formed on the surface of the substrate. Burnishing is a process in which a tape-shaped polishing tool is rubbed against the surface of a substrate to remove the contaminants along with the protrusions and protrusions. The fouling substance is a general term for gases, ions, fine particles and the like that foul the substrate.

  After performing the burnishing, a lubricating layer is formed. As the lubricant, a fluorine-based lubricant such as perfluoropolyether (PFPE) is used. Such a lubricant is used after being diluted with a solvent for reasons such as improvement of uniformity during coating. As a coating method, a dipping method in which the substrate is immersed in the liquid, a spin coating method in which the liquid is dropped while rotating the substrate, and the like are employed.

In the present specification, “substrate” is used to mean a plate that is the basis of a product disk. In addition, when a film forming process or a layer forming process has already been performed, the surface of the thin film or layer may be referred to as a “substrate surface”.
JP-A-9-97428 JP 11-229150 A JP-A-9-974268 JP-A-62-2227230 Japanese Patent Laid-Open No. 3-71426 JP-A-8-63747

  In recent years, there has been a remarkable improvement in the recording density of a magnetic recording disk. For example, in the case of a hard disk, it is about 20 gigabits per square inch in 2000 and 40 gigabits per square inch in 2001. One of the factors that can improve the recording density is a decrease in spacing. FIG. 19 is a diagram for explaining the spacing.

  FIG. 19 shows a hard disk as an example of a magnetic recording disk. As shown in FIG. 19, the hard disk has a structure in which a recording layer 91 is formed on a substrate 9, a protective film 92 is formed on the recording layer 91, and a lubricating layer 93 is formed on the protective film 92. ing. The magnetic head for recording and reading information is located at a position slightly away from the surface of the hard disk. Spacing is the distance between the recording / reproducing element portion 900 of the magnetic head and the recording layer 91 (indicated by S in FIG. 19). Further, the distance between the recording / reproducing element unit 900 and the lubricating layer 93 is called a head flying height (indicated by d in FIG. 19). In order to improve the recording density, it is important to reduce the spacing S.

  As the spacing S decreases, the demands on the manufacturing process are becoming stricter year by year. In order to reduce the spacing S, it is necessary to reduce the head flying height d (the head flying height is about 10 to 20 nm in a hard disk drive currently on the market), and the protective film 92 and the lubricating layer 93 are made thin. There is a need to continue to. As the thickness of the protective film 92 decreases, it is required to create a denser and harder protective film 92. In addition, as the thickness of the lubricating layer 93 is reduced, demands such as uniformity in the thickness of the lubricating layer 93 and improvement in adhesion strength of the lubricating layer are becoming stricter.

  Against this background, the method for creating the protective film 92 is shifting from the conventional sputtering method to the chemical vapor deposition (CVD) method. A carbon film is usually formed as the protective film 92. However, according to the CVD method, a high-hardness dense carbon film called diamond-like-carbon (DLC) can be formed thinner and stably. is there. However, the surface of the protective film 92 formed by the CVD method is likely to have a fouling substance such as gas or ions attached to it due to the influence of residual gas or the like, or minute protrusions are likely to be formed due to abnormal growth or the like. If the lubricating layer 93 is formed in the presence of a fouling substance or a protrusion, there is a tendency that the adhesion strength of the lubricating layer 93 is reduced or the thickness of the lubricating layer 93 is not uniform.

  The adhesion strength of the lubricating layer 93 is improved when the polymer end groups constituting the lubricant are sufficiently bonded to the carbon of the protective film 92. For higher adhesion strength, it is preferable that one or both terminal groups of the polymer are bonded to carbon on the surface of the protective film 92. On the other hand, for the original purpose of the lubricating layer 93 that prevents the recording / reproducing element portion 900 of the magnetic head from being attracted, it is desirable that the degree of freedom of the polymer be high near the surface of the lubricating layer 93. That is, it is preferable that both terminal groups are unbonded.

  A polymer in which one or both terminal groups are bonded to carbon of the protective film 92 is a bonded lub, a polymer in which both terminal groups are not bonded is a free lub, and the total thickness of the lubricating layer 93 The thickness of the bonded lube against the thickness is called the bonded ratio. The bonded ratio is optimally about 20 to 30%, but the required accuracy of the bonded ratio tends to become stricter as the thickness of the lubricating layer 93 becomes thinner.

  In order to satisfy the required bonded ratio, after the formation of the lubricating layer 93, a process (hereinafter referred to as post-processing) is performed by applying thermal energy, light energy, or the like to the lubricating layer 93 to control terminal group bonding. Is called. However, the surface of the protective film 92 immediately after film formation is chemically active, and when exposed to the atmosphere, a large amount of pollutants such as gases and ions in the atmosphere are adsorbed. As a result, when the lubricating layer 93 is formed, a fouling layer is formed between the lubricating layer 93 and the protective film 92. When this fouling layer is formed, it becomes difficult to sufficiently secure the control accuracy of the bonded ratio in post-processing. In order to prevent such a problem, the present situation is that a great investment is required for the improvement of the manufacturing environment such as facilities for reducing pollutant substances.

  The invention of the present application has been made to solve such problems, and has technical significance to provide an inline-type substrate processing apparatus suitable for use in the manufacture of magnetic recording disks such as hard disks. is there.

In order to solve the above problems, an invention of an inline-type substrate processing apparatus according to claim 1 of the present application includes a processing chamber that is connected along a first endless transfer path and that processes a substrate in a vacuum. A group of vacuum chambers;
A second group of vacuum chambers connected along a second endless transport path and including a processing chamber for processing substrates in a vacuum;
A first rotation mechanism for rotating a substrate holder for holding the substrate along the first endless transfer path;
A second turning mechanism for turning the second substrate holder for holding the substrate along the second transport path;
The substrate is removed from the first substrate holder, and the substrate is transported in vacuum without being taken out to the atmosphere along the third transport path, and is transported to the second substrate holder. It has a configuration.
In order to solve the above-mentioned problem, an invention of an inline-type substrate processing apparatus according to claim 2 is characterized in that, in the configuration of claim 1, the first group of vacuum chambers are hermetically connected to each other on the first transport path. The second group of vacuum chambers are configured to be airtightly connected to each other on the second transport path.
In order to solve the above-mentioned problem, an invention of an inline-type substrate processing apparatus according to claim 3 is the configuration of claim 1 or 2, wherein the first transport path is a square and the second transport path is a square. It has the structure of being.
In order to solve the above-mentioned problems, an invention of an inline-type substrate processing apparatus according to claim 4 is characterized in that, in the configuration of claim 12 or 3, an unprocessed substrate is placed on the first substrate holder on the first transport path. It has a configuration in which a mechanism for mounting and a mechanism for collecting a processed substrate from the second substrate holder on the second transport path are provided.

In order to solve the above-mentioned problem, an invention of an inline-type substrate processing apparatus according to claim 5 is the configuration of claim 4, wherein the first substrate holder is provided in any one of the vacuum chambers of the first group. A mounting robot for mounting the substrate is provided, and a recovery robot for recovering the substrate from the second substrate holder is provided in one of the vacuum chambers of the second group. Have
In order to solve the above-mentioned problem, an invention of an inline-type substrate processing apparatus according to claim 6 is the configuration of claim 5, wherein any one of the vacuum chambers of the first group is attached to the first substrate holder. A load-lock chamber that is opened to the atmosphere when a substrate is mounted, and the mounting robot is provided in the load-lock chamber, and any one of the second group of vacuum chambers is the second substrate The unload lock chamber is opened to the atmosphere when the substrate is recovered from the holder, and the recovery robot is provided in the unload lock chamber.
In order to solve the above-mentioned problem, an invention of an inline-type substrate processing apparatus according to claim 7 is the configuration according to any one of claims 1 to 6, wherein another vacuum chamber is disposed on the third transport path. The another vacuum chamber is configured to be airtightly connected to one of the vacuum chambers of the first group and to be airtightly connected to one of the vacuum chambers of the second group.
In order to solve the above problem, an invention of an inline-type substrate processing apparatus according to an eighth aspect of the present invention is the configuration according to any one of the first to seventh aspects, wherein the first substrate holder is disposed on the third transport path. A transfer robot for removing the substrate and mounting it on the second substrate holder is provided.

  As will be described below, according to the present invention, the substrate removed from the first substrate holder is transported in vacuum along the third transport path without being taken out to the atmosphere, so that the second substrate holder Therefore, a larger number of vacuum chambers can be added without significantly increasing the occupation area of the entire apparatus. For this reason, it becomes very suitable when performing more processes consistently in a vacuum.

  Embodiments of the present invention will be described below. In the following, embodiments of the invention of the magnetic disk manufacturing apparatus will be described, but these embodiments are also embodiments of the inline-type substrate processing apparatus of the present invention. FIG. 1 is a schematic plan view of the magnetic recording disk manufacturing apparatus according to the first embodiment, and is also a schematic plan view of the inline-type substrate processing apparatus according to the embodiment of the present invention. The first major characteristic point of the magnetic recording disk manufacturing apparatus shown in FIG. 1 is that a pre-process such as the formation of a recording layer and a post-process such as the formation of a lubricating layer can be performed with one apparatus. It is. The second major feature of the magnetic recording disk manufacturing apparatus shown in FIG. 1 is that each process including the recording layer forming process to the lubricating layer forming process is consistently performed in a vacuum without taking the substrate 9 into the atmosphere. It is a point that can be done.

  More specifically, first, the apparatus shown in FIG. 1 is an inline-type apparatus in which a plurality of vacuum chambers 10 to 17 and 20 to 29 are arranged along the transport paths 1 and 2 of the substrate 9. Each of the vacuum chambers 10 to 17 and 20 to 29 is an airtight container that is evacuated by a dedicated or dual-purpose exhaust system (not shown in FIG. 1). A gate valve 4 is provided at the boundary between the vacuum chambers 10 to 17 and 20 to 29.

  The plurality of vacuum chambers 10 to 17 and 20 to 29 include a first group 10 to 17 arranged along a first square conveyance path (hereinafter referred to as a first conveyance path) 1 and a second square conveyance. Divided into second groups 20 to 29 arranged along a path (hereinafter referred to as second transport path) 2. And the 3rd conveyance path 3 is set so that the 1st conveyance path 1 and the 2nd conveyance path 2 may be connected, and the one vacuum chamber 31 is provided also on this 3rd conveyance path 3. FIG. . The vacuum chamber 31 on the third transfer path 3 is hermetically connected to one of the first group of vacuum chambers 16 and one of the second group of vacuum chambers 21. The substrate 9 is transported from the first transport path 1 to the second transport path 2 without being taken out to the atmosphere. In the vacuum chamber of the first group, processes from the formation of the base film to the formation of the protective film are mainly performed. Further, in the second group of vacuum chambers, the steps from the formation of the protective film to the formation of the lubricating layer are mainly performed.

  The configuration of the transport system that transports the substrate 9 through the first, second, and third transport paths 1, 2, and 3 will be described below. The transport system includes a first circulation mechanism that circulates the substrate holder 51 that holds the substrate 9 along the first transport path 1, and a substrate holder on the first transport path 1 (hereinafter referred to as a first substrate holder). 51, a mounting robot 61 for mounting the substrate 9 on the substrate 51, a second rotating mechanism for rotating another substrate holder 52 for holding the substrate 9 along the second transport path 2, and substrate holding on the second transport path 2 A recovery robot 62 that recovers the substrate 9 from the tool (hereinafter referred to as second substrate holder) 52, and a transfer robot 63 that removes the substrate 9 from the first substrate holder 51 and mounts it on the second substrate holder 52. It is mainly composed.

  The mounting robot 61, the collection robot 62, and the transfer robot 63 are basically the same configuration, and are robots having a multi-joint arm that holds the substrate 9 at the tip. The first second substrate holders 51 and 52 are members having the same configuration. Also, the first circulator mechanism and the second circulator mechanism are basically mechanisms having the same configuration. Hereinafter, the structure of the 1st board | substrate holder 51 and a 1st rotation mechanism is demonstrated as an example.

  The first circulation mechanism mainly includes a linear movement mechanism that linearly moves the first holder 51 on the first conveyance path 1 and a direction changing mechanism that changes the conveyance direction of the first substrate holder 51. ing. The configurations of the first substrate holder 51 and the linear movement mechanism will be described with reference to FIGS. 2 and 3 are views showing the configuration of the first substrate holder 51 and the linear movement mechanism in the apparatus shown in FIG. 1, FIG. 2 is a schematic front view thereof, and FIG. 3 is a schematic side sectional view thereof.

  The first substrate holder 51 is mainly composed of a plate-like holder body 511 and a holding claw 512 attached to the holder body 511. A total of eight holding claws 512 are provided, and the four holding claws 512 form a set to hold one substrate 9. Therefore, the first substrate holder 51 is configured to hold two substrates 9 at the same time. As shown in FIG. 2, the holder body 511 has two substantially circular openings that are slightly larger than the substrate 9. Each of the four holding claws 12 is provided on both sides of the substantially circular opening, and holds the substrate 9 so as to be sandwiched between the side edges.

  Specifically, another opening extending downward from both sides of the substantially circular opening of the holder body 511 is provided, and a pair of leaf springs 514 are provided in the opening so as to extend substantially vertically. Yes. A claw attachment 515 is fixed to the tip of each leaf spring 514. As shown in FIG. 2, each claw attachment 515 is a substantially trapezoidal plate material, and holding claws 512 are fixed to the upper and lower surfaces by screwing. Note that the tip of each holding claw 512 is V-shaped. And the edge of the board | substrate 9 is dropped into this V-shaped front-end | tip.

  Each of the robots 61, 62, and 63 includes a pair of levers 60 that spread the pair of leaf springs 514 against the elasticity so as to move away from the substantially circular opening of the holder body 511. When the substrate 9 is mounted on the first substrate holder 51, the leaf springs 514 on both sides are pushed and spread by the pair of levers 60, and the substrate 9 is positioned in the substantially circular opening of the holder body 511. Then, the lever 60 is returned to return the leaf spring 514 to its original posture by its elasticity. As a result, the substrate 9 is locked by the four holding claws 512. Similarly, when another substrate 9 is locked by another four holding claws 512, the two substrates 9 are held by the first substrate holder 51. When the substrate 9 is removed from the first substrate holder 51, the operation is completely opposite.

  As shown in FIG. 2, a plurality of small magnets (hereinafter referred to as “holder-side magnets”) 513 are provided at the lower end portion of the first substrate holder 51. Each holder side magnet 513 has magnetic poles on the upper and lower surfaces. As shown in FIG. 2, the holder side magnet 513 has magnetic poles that are alternately reversed in the arrangement direction. A magnetic coupling roller 711 is provided below the first substrate holder 51 with the partition wall 70 interposed therebetween. The magnetic coupling roller 711 is a round bar-like member, and has an elongated magnet (hereinafter referred to as a roller-side magnet) 712 that extends in a spiral shape as shown in FIG. Two roller side magnets 712 are provided with different magnetic poles, and have a double spiral shape.

  The magnetic coupling roller 711 is arranged so that the roller side magnet 712 faces the holder side magnet 513 with the partition wall 70 interposed therebetween. The partition wall 70 is made of a material having high magnetic permeability, and the holder side magnet 513 and the roller side magnet 712 are magnetically coupled through the partition wall 70. The space on the first substrate holder 51 side of the partition wall 70 is on the vacuum side (inside of each vacuum chamber), and the space on the magnetic coupling roller 711 side is on the atmosphere side. Such a magnetic coupling roller 711 is provided along the rectangular first conveyance path 1 shown in FIG.

  As shown in FIG. 3, the first substrate holder 51 is placed on a main pulley 714 that rotates about a horizontal rotation axis. A large number of main pulleys 714 are provided along the moving direction of the first substrate holder 51. In addition, a pair of sub pulleys 715 and 715 that rotate around a vertical rotation axis are in contact with the lower end portion of the first substrate holder 51. The sub pulleys 715 and 715 hold down the lower end portion of the first substrate holder 51 from both sides to prevent the first substrate holder 51 from overturning. A large number of the sub pulleys 715 and 715 are also provided in the moving direction of the first substrate holder 51.

  As shown in FIG. 3, a drive rod 716 is connected to the magnetic coupling roller 711 via a bevel gear. A driving motor 717 is connected to the drive rod 716, and the magnetic coupling roller 711 is rotated around its central axis via the drive rod 716. When the magnetic coupling roller 711 rotates, the double spiral roller side magnet 712 shown in FIG. 2 also rotates. At this time, when the roller-side magnet 712 is rotated, when viewed from the holder-side magnet 513, a plurality of small magnets having alternately different magnetic poles are arranged in a line and linearly move along the direction of the alignment. Is equivalent to. Accordingly, the holder-side magnet 513 coupled to the roller-side magnet 712 moves linearly as the roller-side magnet 712 rotates, and as a result, the first substrate holder 51 moves linearly as a whole. At this time, the main pulley 714 and the sub pulleys 715 and 715 shown in FIG. 3 are driven.

  In the configuration shown in FIG. 1, the vacuum chambers provided at the corners of the first and second transport paths 1 and 2 each include a direction changing chamber 17 including a direction changing mechanism that changes the transport direction of the substrate 9 by 90 degrees. 29. As an example, the configuration of the direction changing mechanism provided in the direction changing chamber 17 will be described with reference to FIG. FIG. 4 is a schematic side view showing the configuration of the direction changing mechanism provided in the direction changing chamber 17 shown in FIG. The direction changing mechanism shown in FIG. 4 includes a holding body 721 that holds a linear movement mechanism including a magnetic coupling roller (not shown in FIG. 4) similar to the above-described configuration, and a straight line by rotating the holding body 721. It is mainly composed of a rotation motor 722 that rotates the entire moving mechanism.

  First, a drive rod 716 is connected to a shaft of a magnetic coupling roller (not shown in FIG. 4) via a motion conversion mechanism such as a bevel gear. As shown in FIG. 4, another bevel gear 723 is provided at the rear end of the drive rod 716. A power transmission rod 724 having a vertical posture is connected to the other bevel gear 723. That is, a bevel gear 725 is provided at the front end of the power transmission rod 724 and is screwed to the bevel gear 723 at the rear end of the drive rod 716. The output shaft of the moving motor 717 is connected to the rear end of the power transmission rod 724.

  On the other hand, the holding body 721 constituting the direction changing mechanism is a columnar or cylindrical member and is arranged with its axial direction vertical. As shown in FIG. 4, the holding body 721 has a long through hole in the vertical direction, and the power transmission rod 724 is arranged in a state of being inserted through the through hole. A bearing 725 is disposed in a gap portion between the inner surface of the through hole and the power transmission rod 724, and the power transmission rod 724 is held in the through hole while allowing the power transmission rod 724 to rotate.

  The holding body 721 is disposed inside a substantially cylindrical holder cover 726 having a larger diameter. The holder cover 726 is attached to the bottom plate portion 727 of the direction changing chambers 17 and 29 in which the holding body 721 is housed and held and the direction changing mechanism is disposed. That is, the bottom plate portion 727 of the direction change chambers 17 and 29 has a circular opening having a size that fits the outer diameter of the holder cover 726, and the holder cover 726 is fitted and fixed to the opening. A sealing material such as an O-ring is provided on the contact surface between the holder cover 726 and the bottom plate portion 727.

  Further, in the gap between the holder cover 726 and the inner holding body 721, a mechanical seal 728 is provided so as to be sandwiched between four bearings 729 arranged vertically and the two upper bearings 729. And are provided. The mechanical seal 728 is for vacuum-sealing the gap between the holding body 721 and the holder cover 726 while allowing the holding body 721 to rotate, and a sealing mechanism using a magnetic fluid can be suitably used. .

  On the other hand, a pulley fixture 730 is provided on the lower surface of the holder 721, and a holder-side pulley 731 is fixed to the lower end of the pulley fixture 730. The holder side pulley 731 is arranged concentrically with the central axis of the holder 721. Further, a motor-side pulley 732 is disposed at the same height as the holder-side pulley 731. The motor-side pulley 732 is connected to an output shaft of a rotation motor 722 that protrudes upward. Further, a belt 733 is stretched so as to connect the motor side pulley 732 and the holder side pulley 731. Specifically, the holder-side pulley 731 and the motor-side pulley 732 are constituted by timing pulleys, and the belt is constituted by a timing belt.

  Further, a holding frame 734 as shown in FIG. 4 is fixed to the upper surface of the holding body 721. The holding frame 734 is for holding the first substrate holder 51, the magnetic coupling roller 711 and the like shown in FIG. 2 as a whole. As shown in FIG. 4, several support columns 735 are arranged at the tip of the lower portion of the holding frame 734, and the main pulley 714 and the pair of sub pulleys 715 and 715 are held by the support columns 681. . The space between the holding frame 734 and the holding body 721 is vacuum-sealed to prevent leakage in the direction change chamber 17 from the inside of the holding frame 734.

  The operation of the direction changing mechanism of the direction changing chamber 17 will be described. First, when the moving motor 717 is driven, the rotational drive is transmitted to the magnetic coupling roller (not shown in FIG. 4) via the power transmission rod 724 and the driving rod 716, and the magnetic coupling roller rotates. As a result, the upper first substrate holder 51 moves linearly.

  When the first substrate holder 51 moves and reaches a predetermined position in the direction changing chamber 17, the rotation motor 722 is driven. The power of the rotation motor 722 is transmitted from the motor-side pulley 732 to the holder-side pulley 731 by the belt 733 and rotates the holder-side pulley 731. As a result, the upper holding body 721 rotates, and the linear movement mechanism held on the holding body 721 rotates as a whole. As a result, the first substrate holder 51 also rotates. When the rotation angle reaches 90 degrees, the rotation motor 722 stops driving, and the rotation of the first substrate holder 51 also stops. As a result, the direction of conveyance of the first substrate holder 51 is bent by 90 degrees.

  Thereafter, after receiving a predetermined control signal, the linear moving mechanism is further driven to move the first substrate holder 51 along the first transport path 1 bent by 90 degrees, and the first substrate to the next vacuum chamber. The holder 51 is conveyed. Therefore, also in the 1st conveyance path 1 after being bent, the plate | board surface of the board | substrate 91 faces the side of a conveyance direction. In the configuration of the direction changing mechanism, the rotation at a predetermined angle such as 90 degrees may be controlled by the control of the motor 722 for rotation, or a sensor mechanism (not shown) that detects that the holding body 721 has rotated a predetermined angle. Etc. may be performed.

  Next, the configuration of the vacuum chambers of the first and second groups will be described. First, the first group of vacuum chambers will be described. The first group of vacuum chambers includes a load lock chamber 11 that is a chamber in which the substrate 9 temporarily stays when the substrate 9 is loaded from the atmosphere side, and a chamber in which the substrate 9 is transferred next to the load lock chamber 11. A preheat chamber 12, a base film forming chamber 13 that is a chamber to which the substrate 9 is transferred next to the preheat chamber 12, and a magnetic film forming chamber that is a chamber to which the substrate 9 is transferred next to the base film forming chamber 13 14, a protective film forming chamber 15 that is a chamber in which the substrate 9 is transferred next to the magnetic film forming chamber 14, and a chamber in which the substrate 9 is temporarily retained when the substrate 9 is transferred to the second transfer path 2. A first relay chamber 16, a direction changing chamber 17, and an auxiliary vacuum chamber 10. That.

  A load robot 61 is provided in the load lock chamber 11. The mounting robot 61 takes out the substrates 9 one by one from the mounting cassette 611 disposed in the load station on the atmosphere side, and mounts the substrates 9 on the first substrate holder 51. The preheat chamber 12 heats the substrate 9 to release the gas on the surface or inside of the substrate 9 in advance. The preheat chamber 12 is configured to heat the substrate 9 to a predetermined temperature by a radiation heating lamp.

  Both the base film forming chamber 13 and the magnetic film forming chamber 14 are designed to form a predetermined thin film by sputtering. As an example, the configuration of the magnetic film creation chamber 14 will be described with reference to FIG. FIG. 5 is a schematic plan view showing the configuration of the magnetic film forming chamber 14 shown in FIG.

  The magnetic film creation chamber 14 includes an exhaust system 141 that exhausts the interior, a gas introduction system 142 that introduces a process gas into the interior, a target 143 that is provided with the surface to be sputtered exposed in the interior space, and a sputter discharge on the target. A sputtering power supply 144 for applying a voltage for the above and a magnet mechanism 145 provided behind the target 143 for performing magnetron sputtering are mainly configured.

  While the process gas is being introduced by the gas introduction system 142, the inside of the magnetic film forming chamber 14 is maintained at a predetermined pressure by the exhaust system 141, and the sputtering power supply 144 is operated in this state. As a result, sputtering discharge occurs, the target 143 is sputtered, the material of the sputtered target 143 reaches the substrate 9, and a predetermined magnetic film is formed on the surface of the substrate 9.

The protective film creation chamber 15 includes plasma forming means 150, and creates a protective film by plasma CVD (chemical vapor deposition). FIG. 6 is a schematic plan view showing the configuration of the protective film forming chamber 15 shown in FIG. The protective film creation chamber 15 includes an exhaust system 151 that exhausts the inside. The plasma forming means 150 includes a process gas introduction system 152 (not shown) that mixes and introduces a hydrocarbon compound gas such as CH ₄ and hydrogen gas, and a high-frequency power source that forms plasma P by applying high-frequency energy to the process gas. 153 and the like. The hydrocarbon compound gas is decomposed in the plasma P, and a carbon thin film is deposited on the surface of the substrate 9. There is a case where a high frequency voltage is applied to the substrate 9 through the substrate holder 51 and a self-bias voltage which is a negative DC component voltage is applied to the substrate 9 by interaction with the plasma P.

  As shown in FIG. 1, in this embodiment, two base film forming chambers 13 and a magnetic film forming chamber 14 are provided, and one base film forming chamber 13 and another base film forming chamber are provided. 13. The substrate 9 is transferred in the order of one magnetic film forming chamber 14 and another magnetic film forming chamber 14. That is, the base film is formed over two layers, and the magnetic film is formed over the two layers thereon. In some cases, a base film with a magnetic film formed thereon is laminated over two layers. For example, a Cr film is formed as the base film, and a CoCrTa film is formed as the magnetic film. In addition, two protective film forming chambers 15 are provided. The first protective film forming chamber 15 forms a half of the required thickness, and the next protective film forming chamber 15 has the remaining half thickness. Film formation is performed.

  Next, the configuration of the second group of vacuum chambers will be described. The second group of vacuum chambers is a second relay chamber 21 in which the substrates 9 transported from the first transport path 1 through the third transport path 3 are temporarily retained in the order in which the substrates 9 are transported. A first cleaning chamber 22 that removes contaminants on the surface of the substrate 9 by plasma ashing; a second cleaning chamber 23 that performs gas blowing to blow off the contaminants on the surface of the substrate 9 by jetting a gas onto the surface of the substrate 9; A burnish chamber 24 for performing burnishing to remove protrusions on the surface, a lubrication layer forming chamber 25 for forming a lubrication layer, a post-treatment chamber 26 for performing post-treatment after formation of the lubrication layer, a cooling chamber 27 for cooling the substrate 9, The auxiliary vacuum chamber 20 is an chamber in which the substrate 9 temporarily stays when the substrate 9 is carried out to the atmosphere side. Over-de-lock chamber 28, and has a direction-altering chamber 29.

  The first cleaning chamber 22 is one of the major features of this embodiment. The configuration of the first cleaning chamber 22 will be described with reference to FIG. FIG. 7 is a schematic plan view showing the configuration of the first cleaning chamber 22 shown in FIG.

  The first cleaning chamber 22 is configured to ash (ash) the pollutant on the surface of the substrate 9 by oxygen plasma. The configuration of the first cleaning chamber 22 is substantially the same as that of the protective film forming chamber 15 shown in FIG. 6 except that the gas introduction system 222 introduces oxygen gas. That is, the first cleaning chamber 22 includes a pair of high-frequency electrodes 223 located on both sides of the substrate 9 and a high-frequency power source 224 that applies a high-frequency voltage to the high-frequency electrodes 223 to form plasma P.

  The high-frequency electrode 223 is hollow inside and has a large number of gas blowing holes on the surface facing the substrate 9. The gas introduction system 222 introduces oxygen gas into the first cleaning chamber 22 via the high frequency electrode 223. The gas introduction system 222 may introduce a buffer gas or a gas for improving discharge characteristics by adding to oxygen.

  A fouling substance made of carbon or hydrocarbon may adhere to the surface of the substrate 9 on the surface of the substrate 9 on which the protective film is formed in the protective film forming chamber 15 described above. This is due to the following causes.

  The adhesion of carbon is mainly caused by floating particles in the protective film forming chamber 15. That is, in the protective film forming chamber 15, a thin film (carbon film) is deposited not only on the surface of the substrate 9 but also on the surface of the structure in the protective film forming chamber 15 and the surface of the first substrate holder 51. When these thin films are deposited to a certain thickness, they peel off due to internal stress or the like. The peeled debris becomes particles and floats in the protective film forming chamber 15. When these floating particles adhere to the surface of the substrate 9, the wettability (contact property) of the lubricant at the adhesion point is deteriorated during the formation of the lubricating layer, or abnormal growth occurs during the production of the protective film. 9 may be formed on the surface of 9.

  Further, the adhesion of the hydrocarbon is influenced by the residual gas in the protective film forming chamber 15. That is, the protective film is formed by utilizing the decomposition of the hydrocarbon compound gas in the plasma, but the undecomposed hydrocarbon compound gas remains in the protective film forming chamber 15, and this residual gas May adhere to the surface of the substrate 9 as molecules or particles of a certain size. If such molecules or particles are adhered, the wettability of the lubricant may be deteriorated or the characteristics of the lubricating layer may be adversely affected.

When the surface of the substrate 9 to which such a fouling substance is attached is exposed to oxygen plasma, oxygen ions generated in the oxygen plasma, monoatomic oxygen molecules (O) which are active species, or active oxygen molecules (O ₂ ^* ) And the like, the carbon and hydrocarbon are rapidly oxidized (burned) and become volatiles such as carbon dioxide and water. These volatiles are exhausted by the exhaust system 221 of the first cleaning chamber 22. By performing such ashing, problems such as deterioration of the adhesion of the lubricating layer and obstruction of reading of the magnetic head by minute protrusions on the surface of the disk are suppressed.

Careful consideration is required for the ashing conditions. This is because, if too much ashing is performed, the protective film (carbon film) on the surface is scraped off. An example of the ashing condition is as follows.
Pressure in the first cleaning chamber 22: 1-2 Pa
Oxygen gas flow rate: 100 SCCM (SCCM is a gas flow rate (cm ³ / min) converted at 1 atm at 0 ° C.)
High frequency power: 13.56MHz, 50W
Substrate 9 size: 3.5 inches in diameter When ashing is performed under the above conditions, the pollutant can be sufficiently removed in about 0.3 to 2.0 seconds, and the problem of protective film scraping occurs. Absent. Note that if ashing is performed at a high frequency power exceeding 50 W or a time exceeding 2.0 seconds, the protective film may be scraped off. Therefore, it is preferable to perform ashing with a high frequency power of 50 W or less and a time of 2.0 seconds or less.

  Next, the second cleaning chamber 23 will be described. FIG. 8 is a schematic plan view showing the configuration of the second cleaning chamber 23 shown in FIG. The second cleaning chamber 23 includes an exhaust system 231 for exhausting the inside, and a gas introduction pipe 233 provided with a nozzle 232 for injecting gas onto the surface of the substrate 9 at the tip. The nozzle 232 has a disk shape provided in parallel with the substrate 9 and is slightly larger than the substrate 9. In addition, the nozzle 232 is provided with a number of gas injection ports for injecting gas toward the front substrate 9 at regular intervals.

Gas is jetted from the nozzle 232 onto the surface of the substrate 9, so that the pollutant material adhering to the surface of the substrate 9 is blown away. The pressure in the second cleaning chamber 23 is about 1 × 10 ⁻⁴ to 1 × 10 ⁻⁵ Pa, and the gas injection pressure on the surface of the substrate 9 is about 100 Pa. As the gas, an inert gas such as argon or nitrogen is used. Further, it is preferable that a filter for removing the pollutant is provided on a pipe (not shown) connected to the gas introduction pipe 232.

  The gas blow cleaning described above can also be performed in the atmosphere. However, when performed in the air, the cleanliness of the atmosphere itself is poorer than in vacuum, so that the risk of fouling substances adhering to the surface of the substrate 9 after cleaning is higher than in vacuum. In addition to the configuration in which the surface of the substrate 9 is cleaned by plasma or gas blow, a configuration in which cleaning is performed by using ultrafine fibers can be employed. That is, cleaning may be performed by rubbing the surface of the substrate 9 with a cloth made of ultrafine fibers of about 0.06 denier, which is commercially available for wiping glasses.

  Next, the burnish chamber 24 will be described. FIG. 9 is a schematic side view showing the configuration of the burnish chamber 24 shown in FIG. As shown in FIG. 9, the burnish chamber 24 includes an exhaust system 241 that exhausts the inside, a rotating mechanism 8 that holds the substrate 9 and rotates the substrate 9 around a rotation axis that is coaxial with the substrate 9, and a rotating mechanism. 8 and a burnish tape 242 pressed against the surface of the substrate 9 rotating.

  Details of the rotation mechanism 8 will be described with reference to FIG. FIG. 10 is a schematic cross-sectional view showing the configuration of the rotation mechanism 8 shown in FIG. As shown in FIG. 10, the rotating mechanism 8 includes a horizontally extending rod-like front and rear drive shaft 81, a cylindrical rotary drive shaft 82 provided coaxially with the front and rear drive shaft 81, and a first drive shaft 81 that drives the front and rear drive shaft 81. It is mainly composed of one front / rear drive source 83, a rotation drive source 84 for driving the rotary drive shaft 82, and a second front / rear drive source 85 for moving the front / rear drive shaft 81 and the rotary drive shaft 82 back and forth as a whole.

  A driving head 86 is provided at the tip of the front / rear driving shaft 81. The drive head 86 is formed of a disk-shaped portion 861 that is slightly smaller than the central opening of the substrate 9 and a tapered portion 862 that forms a conical surface coaxial with the front and rear drive shaft 81. A contact piece 821 is provided at the tip of the rotation drive shaft 82. The contact piece 821 is a member that contacts the edge of the opening of the substrate 9 when holding the substrate 9. FIG. 11 is a front view showing an arrangement position of the contact piece 821 shown in FIG. As shown in FIG. 11, the contact pieces 821 are arranged at three positions 120 degrees apart on a circumference coaxial with the front-rear drive shaft 81. As shown in FIG. 10, each contact piece 821 has a concave or V-shaped cross section formed of a curved surface.

  In addition, as shown in FIG. 10, a driven piece 822 is provided so as to contact the tapered surface of the tapered portion 862. The driven piece 822 and the contact piece 821 are connected by a connecting plate 824. Further, a protrusion is provided on the distal end surface of the rotary drive shaft 82, and the driven piece 822 is fixed to the protrusion via a spring member 823 such as a coil spring. The contact piece 821 is positioned outside the protrusion at the tip of the rotary drive shaft 82 and slides on the tip surface.

  The front / rear drive shaft 81 is connected to the first front / rear motion source 83 via a severable joint mechanism 811. The first front-rear drive source 83 is a linear motion source such as a combination of a servo motor and a ball screw or an air cylinder. The rotation drive source 84 is a motor connected via a gear provided on the peripheral surface of the rotation drive shaft 82. Further, the second front / rear drive source 85 moves the frame 851 holding the front / rear drive shaft 81, the rotary drive shaft 82, the first front / rear drive source 83, the rotary drive source 84, etc., and moves them back and forth integrally. is there. The rotary drive shaft 82 penetrates the wall of the burnish chamber 24 in an airtight manner through a vacuum seal such as a mechanical seal. In the burnish chamber 23, a lever (not shown) that interlocks with the rotating mechanism 8 is provided. The configuration of the lever is the same as the lever 60 provided in each of the robots 61, 62, and 63 described above.

  On the other hand, as shown in FIG. 9, the burnish tape 242 is wound around a winding roller 243 provided in the burnish chamber 24 and is used by being pulled out of the winding roller 243. . In the burnish chamber 24, a take-up roller 244 for taking up the used burnish tape 242 is provided. The take-up roller 244 is rotated by a vacuum motor (a motor that can be used in a vacuum atmosphere) 245 provided in the burnish chamber 24, and takes up used burnish tape 242. By this winding operation, the winding roller 243 is driven to rotate and the unused burnish tape 242 is pulled out.

  Further, a pressing tool 247 that presses the burnish tape 242 against the substrate 9 when the substrate 9 is held and rotated by the rotation mechanism 8 is provided. The pressing tool 247 is provided with a drive mechanism 87 that drives the pressing tool 247. 12 is a schematic side view showing the configuration of the drive mechanism 87 that drives the pressing tool 247 shown in FIG.

  As shown in FIG. 12, the drive mechanism 87 includes a drive shaft 871 with a pressing tool 247 fixed to the tip, a torque motor 872 that pushes the driving shaft 871 forward and presses the pressing tool 247 against the substrate 9, and a drive shaft 871. And a linear drive source 873 that moves the torque motor 872 back and forth as a whole.

  A ball screw 874 is connected to the output shaft of the torque motor 872. A rear end portion of the drive shaft 871 is hollow, and a ball screw 874 is engaged with the drive shaft 871. The drive shaft 871 is not rotated by a rotation restricting portion (not shown). The linear drive source 873 can be a combination of a motor and a ball screw, an air cylinder, or the like. The drive shaft 871 penetrates the wall of the burnish chamber 24 in an airtight manner through a vacuum seal such as a mechanical seal. Further, as can be seen from FIG. 9, the burnish tape 242, the winding roller 243, the take-up roller 244, the vacuum motor 246, the pressing tool 247, and the drive mechanism 87 are disposed on both sides of the position where the substrate 9 is located. Is provided.

  The width of the pressing surface of the pressing tool 247 is approximately equal to the length obtained by subtracting the radius of the central opening from the radius of the substrate 9. However, if the substrate 9 is rotated while moving the substrate 9 in the radial direction relative to the burnish tape 242 and the pressing tool 247, the width may be shorter than the above width.

  The operation of the burnish chamber 24 shown in FIG. 9 will be described below. In a state where the inside of the burnish chamber 24 is evacuated to a predetermined vacuum pressure by the exhaust system 241, the second substrate holder 52 holding the substrate 9 moves into the burnish chamber 24 and stops. The stop position at this time is a position where the center of one substrate 9 coincides with the central axis of the front-rear drive shaft 81 shown in FIGS. At this time, the second front-rear drive source 85 retracts the front-rear drive shaft 81 and the rotary drive shaft 82 so that the front end portions of the front-rear drive shaft 81 and the rotary drive shaft 82 are located on the front side of the substrate 9. .

  Next, the second front / rear drive source 85 is driven, and the front / rear drive shaft 81 and the rotary drive shaft 82 move forward together and stop at a predetermined position. In this position, as shown in FIG. 10, the drive head 86 protrudes from the opening of the substrate 9, and the contact piece 821 is located on the same vertical plane as the substrate 9. In this state, the first front / rear drive source 83 is driven, and the front / rear drive shaft 81 moves backward. Along with the retreat, the driven piece 822 that is in contact with the taper surface of the taper portion 862 moves outward against the elasticity of the spring member 823. As a result, each contact piece 821 also moves outward and contacts the edge of the opening of the substrate 9. The first front / rear drive source 83 applies an appropriate force to the front / rear drive shaft 81 in the direction in which it is retracted. Accordingly, each contact piece 821 is appropriately pressed against the edge of the opening of the substrate 9 by pressure. As a result, the substrate 9 is held. In this state, a lever (not shown) is driven to push and spread a pair of leaf springs (not shown in FIG. 9) of the second substrate holder 52. As a result, the substrate 9 is held only by the rotation mechanism 8.

  Next, the rotation drive source 84 of the rotation mechanism 8 operates to rotate the front / rear drive shaft 81 and the rotation drive shaft 82 together. As a result, the substrate 9 held via each contact piece 821 also rotates together. During this rotation, the joint mechanism 811 disconnects the connection between the front / rear drive shaft 81 and the first front / rear drive source 83.

  And when the board | substrate 9 is rotating, the drive mechanism 87 of the pressing tool 247 of the both sides of the board | substrate 9 is driven. First, in the drive mechanism 87, the linear drive source 873 operates, and the pressing tools 247 on both sides advance to a predetermined advance position. This forward movement position is a position just before the pressing tool 247 presses the burnish tape 242 against the substrate 9. Next, the torque motor 872 operates to move the pressing tool 247 forward a little. As a result, the pressing tool 247 presses the burnish tape 242 against the substrate 9. The torque generated by the torque motor 872 is adjusted, and the pressing pressure of the burnish tape 242 is controlled to a predetermined value.

  By pressing the burnish tape 242, the protrusions present on the surface of the substrate 9 are scraped off. Further, in addition to the removal of the protrusions, if a fouling substance adheres to the surface of the substrate 9, this fouling substance may be removed. As the burnish tape 242, a film in which abrasive grains such as alumina particles or silicon carbide (SiC) particles are supported on a film made of polyethylene terephthalate or polyamide is used. The rotation speed of the substrate 9 may be about 100 to 4000 rpm.

Note that the pressing force of the pressing tool 247 requires careful consideration. When the burnish with the burnish tape 242 is performed in a vacuum, the frictional force between the burnish tape 242 and the surface of the substrate 9 becomes larger than that in the atmosphere. For this reason, if it is pressed with the same force as in the atmosphere, the surface of the substrate 9 is excessively scraped off, and there is a risk that the thickness of the protective film may be reduced as well as the protrusions. For example, in the case of varnish in a vacuum of about 1.0 × 10 ^{−2 to} 100 Pa, the pressing force is preferably about 9.8 to 588 mN.

  In some cases, the burnish tape 242 may be burned by moving (winding) not the substrate 9 while the burnish tape 242 is pressed against the surface of the substrate 9. In some cases, both the rotation of the substrate 9 and the movement of the burnish tape 242 are performed. When the burnish tape 242 is moved in a state where the burnish tape 242 is pressed against the substrate 9, the pressing tool 247 employs a configuration corresponding to a driven roller.

  After such burnishing is performed over the entire surface of both sides of the substrate 9, the drive mechanism 87 moves the pressing tool 247 back to a predetermined retracted position, and the rotation drive source 84 stops rotating. Next, the spread of the leaf spring of the second substrate holder 52 by a lever (not shown) is released, and the substrate 9 is held again by the holding claws. After that, the rotation mechanism 8 connects the first front / rear drive source 83 and the front / rear drive shaft 81 again by the joint mechanism 811 and then operates the first drive source 81 to move the front / rear drive shaft 81 forward by a predetermined distance. As a result, the contact piece 821 moves inward by the elasticity of the spring member 823, and the holding of the substrate 9 is canceled. Then, the second front / rear drive source 85 is operated to cause the front / rear drive shaft 81 and the rotary drive shaft 82 to retract together and return to the original retracted position.

  Next, the second substrate holder 52 is moved and stopped at a position where the center of the other substrate 9 is coaxial with the front-rear drive shaft 81. Then, the same operation as described above is repeated to burnt another substrate 9 as well. As shown in FIG. 1, in this embodiment, two burnish chambers 24 are provided with the lubricating layer forming chamber 25 interposed therebetween. Therefore, burnishing is performed before and after the formation of the lubricating layer.

  Next, the lubricating layer forming chamber 25 will be described. FIG. 13 is a schematic side view showing the configuration of the lubricating layer forming chamber 25 shown in FIG. The lubrication layer forming chamber 25 forms a lubrication layer on the surface of the substrate 9 in a vacuum. Specifically, the lubrication layer forming chamber 25 forms a lubrication layer on the surface of the substrate 9 by a vacuum deposition method. As shown in FIG. 13, the lubrication layer forming chamber 25 includes an exhaust system 251 for exhausting the inside, a pair of crucibles 252 storing the lubricant therein, and a heater 253 for heating and evaporating the lubricant in the crucible 252. And a rotating mechanism 8 for rotating the substrate 9 during vapor deposition to make vapor deposition uniform.

  The lubricant is stored in the crucible 252 without being dissolved in the solvent. The heater 253 is a resistance heating type. Depending on the case, it may be heated by irradiation with an electron beam, or heated by high frequency. Note that a shutter is provided on the upper side of the crucible 252 as necessary. The rotating mechanism 8 is the same as that provided in the burnish chamber 24 shown in FIG. However, two rotation mechanisms 8 shown in FIG. 13 are provided so that each substrate 9 can be held and rotated simultaneously.

  The operation of the lubrication layer forming chamber 25 shown in FIG. 13 will be described below. In a state where the exhaust system 251 is exhausted to a predetermined vacuum pressure, the second substrate holder 52 holding the substrate 9 moves into the lubricating layer forming chamber 25 and stops. Then, the rotating mechanism 8 holds and rotates each substrate 9. In parallel, the heater 253 operates to heat the lubricant in the crucible 252. The lubricant evaporates by heating and adheres to the surface of each substrate 9 to deposit a lubricating film as a lubricating layer. That is, a lubricating film is simultaneously formed on the two substrates 9. As the lubricant, one having PEPE as a main component and having a molecular weight of about 2000 to 4000 can be used. Such lubricants are sold, for example, by AUSMONT as product names ZDOL2000, ZDOL4000, and the like.

The heating temperature by the heater 253 may be about 50 to 310 ° C., and the pressure in the lubricating layer forming chamber 25 may be about 1.0 × 10 ^{−2 to} 100 Pa. When vapor deposition is performed under such conditions, a lubricating film having a thickness of about 1 to 2 nm can be formed in about 3 to 5 seconds. In addition, the rotational speed by the rotation mechanism 8 is lower than that in the case of the varnish described above, and may be about 5 to 500 rpm. After forming the lubricating layer in this way, the operation of the heater 253 and the operation of the rotating mechanism 8 are stopped. After returning the substrate 9 to the second substrate holder 52 and evacuating the lubrication layer forming chamber 25 again, the second substrate holder 52 is moved to the next post-treatment chamber 26.

  Next, the configuration of the post-processing chamber 26 and the cooling chamber 27 will be described. FIG. 14 is a schematic side view showing the configuration of the post-processing chamber 26 shown in FIG. As described above, the optimal bonded ratio is about 20 to 30%. In the present embodiment, the bonded ratio is achieved by heating the substrate in the post-processing chamber 26 and adjusting the heating temperature and time. Specifically, the above bonded ratio can be achieved by maintaining the temperature of the substrate 9 at about 30 to 150 ° C. for about 3 to 5 seconds.

As shown in FIG. 14, infrared lamps 261 are provided in the post-processing chamber 26 so as to be positioned on both sides of the substrate 9 held by the second substrate holder 52. Further, the post-processing chamber 26 is provided with an exhaust system 262 so that the post-processing chamber 26 is evacuated to about 1 × 10 ⁻⁴ to 1 × 10 ⁻⁵ Pa during the post-processing. In addition, since it is a step after the formation of the lubricating layer, it is not an essential condition to perform the post-processing in a vacuum, but the surface of the lubricating layer heated to a high temperature is soiled by performing the post-processing in a vacuum. It is possible to prevent the impurities of the substance from being adsorbed and taken in.

  In this embodiment, post-processing is performed by heating, but post-processing can also be performed by light irradiation. For example, in a lubricant having a photopolymerization action, it is possible to adjust the degree of polymerization by irradiating light such as ultraviolet rays to adjust the adhesion to the substrate 9 and the lubricity of the surface. In this case, an ultraviolet lamp or the like is used instead of the infrared lamp described above.

  Further, the cooling chamber 27 cools the substrate 9 after the post-processing, and facilitates handling by the collecting robot 62 in the unload lock chamber 28 later. The cooling chamber 27 blows a cooling gas such as hydrogen or helium on the surface of the substrate 9 to cool the substrate 9 to 100 ° C. or lower. It is preferable to use the cooling mechanism disclosed in JP-A-11-203734 for this cooling chamber 27. The recovery robot 62 provided in the unload lock chamber 28 removes the substrate 9 from the second substrate holder 52 and transports it to the recovery cassette 621 disposed in the unload station on the atmosphere side.

  Next, the entire operation of the apparatus according to the present embodiment having the above-described configuration will be described below while also serving as an explanation of the embodiment of the method of manufacturing the magnetic recording disk. First, the substrates 9 are loaded one by one into the load lock chamber 11 by the mounting robot 61 from the mounting cassette 611 disposed in the atmospheric load station and mounted on the first substrate holder 51. The first substrate holder 51 moves to the preheat chamber 12 and the substrate 9 is preheated. Thereafter, the first substrate holder 51 sequentially moves to the base film creation chamber 13, the magnetic film creation chamber 14, and the protective film creation chamber 15, and the base film, the magnetic film, and the protective film are laminated on the substrate 9. .

  The substrate 9 is removed from the first substrate holder 51 by the transfer robot 63 in the first relay chamber 16 and mounted on the second substrate holder 52 waiting in the second relay chamber 21. The first substrate holder 51 from which the substrate 9 has been removed returns to the load lock chamber 11 and the next substrate 9 is mounted. And it goes around the 1st conveyance path 1 similarly.

  On the other hand, the second substrate holder 52 on which the substrate 9 is mounted in the second relay chamber 21 sequentially moves to the first cleaning chamber 22, the second cleaning chamber 23, the burnish chamber 24, and the lubricating layer forming chamber 25 for protection. A lubricating layer is formed on the film. Then, the second substrate holder 52 moves in the order of the post-processing chamber 26 and the cooling chamber 27 to perform post-processing and cooling of the substrate 9. The second substrate holder 52 reaches the unload lock chamber 28, the substrate 9 is removed from the second substrate holder 52 by the recovery robot 62, and is carried out to the atmospheric recovery cassette 621. After the substrate 9 is removed, the second substrate holder 52 moves to the second relay chamber 21 and is used again to hold the next substrate 9, and circulates around the second transport path 2. The substrate holders 51 and 52 are located in the respective chambers 10 to 17 and 20 to 29, and are moved to the next chambers 10 to 17 and 20 to 29 every tact time.

  The apparatus of the present embodiment related to the above configuration and operation has the following technical significance. First, since one apparatus can consistently perform the process from the formation of the base film to the formation of the lubricating layer, the cost of production equipment, the cost of labor costs for operating the apparatus, and the like are lower than before. Further, the apparatus can be operated unattended until all the substrates 9 in the mounting cassette 611 are processed and recovered in the recovery cassette 621, and the time for unattended operation becomes longer than before. . For this reason, productivity is also improved.

  And even after the creation of the protective film, the formation of the lubrication layer is consistently performed in vacuum, so that the contamination of the interface between the protection film and the lubrication layer, in the lubrication layer, or on the surface of the lubrication layer, or Adhesion is suppressed. For this reason, according to the present embodiment, problems such as contamination of the recording layer due to fouling substances, deterioration of the adhesion of the lubricating layer, non-uniformity of the thickness of the lubricating layer, and decrease in accuracy of the bonded ratio control of the lubricating layer, etc. A configuration that is extremely suitable for manufacturing a magnetic recording disk in which generation is suppressed and spacing is decreasing is provided.

  In addition, since the fouling substances on the surface of the substrate 9 are removed by plasma ashing and gas blowing before the formation of the lubricating layer, the above effect can be further enhanced in this respect. Plasma ashing is mainly effective for removing organic fouling substances, and gas blowing is effective for removing inorganic fouling substances such as metal and glass. After the cleaning in the first and second cleaning chambers 22 and 23, the substrate 9 is transported to the lubrication layer forming chamber 25 without being exposed to the atmosphere, and a lubrication layer is formed. Therefore, the lubricating layer is formed with a clean surface. For this reason, the said effect is acquired further highly.

  Further, since the burnishing is performed in a vacuum, the pollutant in the atmosphere does not adhere to the substrate 9 during the burnishing. In this respect as well, problems due to fouling substances are further suppressed. After the varnishing, the substrate 9 is transferred to the lubricating layer forming chamber 25 without being exposed to the atmosphere to form a lubricating layer, and this effect can be obtained even higher.

  In addition, since the post-treatment for improving the characteristics of the lubricating layer is performed in a vacuum, the pollutant in the atmosphere does not adhere to the surface of the substrate 9 during the post-treatment. In this respect as well, problems due to fouling substances are further suppressed. Then, after the formation of the lubricating layer, the substrate 9 is transferred to the post-processing chamber 26 without being exposed to the atmosphere, and the lubricating layer is formed, so that this effect can be obtained even higher.

  Moreover, the structure used without dissolving a lubricant in a solvent has the following technical significance. As the solvent for diluting the lubricant, since the lubricant is a fluorine-based solvent, a lot of chlorofluorocarbon has been used before. However, against the problem of ozone layer destruction, chlorofluorocarbon alternative solvents such as perfluorocarbon (PFC) have been used frequently. However, this chlorofluorocarbon alternative solvent is also a causative substance of global warming, and the use of the solvent itself tends to be a problem.

  Another problem with the use of solvents is lubrication layer fouling. As a result of dissolving and applying in a solvent, impurities are mixed in the lubricating layer, which causes corrosion of the magnetic head due to the presence of impurities such as ions, mechanical damage of the magnetic head due to protrusions existing on the surface of the lubricating layer, Problems such as adsorption of the magnetic head to the disk surface due to insufficient lubrication characteristics may occur. In the method and apparatus of this embodiment, since no solvent is used, there is no problem caused by using such a solvent.

  However, practically, a small amount of solvent may be used for the purpose of facilitating the handling of the lubricant. As the solvent, a perfluoroalkyl solvent such as HFE 7300, 7100 (trade name) manufactured by 3M is used. The amount used is 1% by volume or less based on the lubricant.

  Next, a magnetic recording disk manufacturing apparatus according to the second embodiment will be described. FIG. 15 is a diagram showing a main part of the magnetic recording disk manufacturing apparatus according to the second embodiment. The apparatus of the embodiment shown in FIG. 15 is different from the above-described embodiment in that the plasma ashing for cleaning the surface of the substrate 9 is performed. That is, in the embodiment shown in FIG. 15, ashing is performed in the protective film forming chamber 15, and FIG. 15 shows the configuration of the protective film forming chamber 15.

  The protective film forming chamber 15 shown in FIG. 15 is substantially the same as that shown in FIG. 6, but the configuration of the gas introduction system 152 is different. That is, the gas introduction system 152 shown in FIG. 15 can selectively introduce the mixed gas of hydrocarbon compound and hydrogen and oxygen gas into the protective film forming chamber 15 by switching with the valve 154. Yes.

In the configuration shown in FIG. 15, when a protective film is formed, a hydrocarbon compound and hydrogen gas of hydrogen are introduced. After creating the protective film, the first substrate holder 51 is not moved, and the inside of the protective film creating chamber 15 is evacuated to about 5 × 10 ⁻² Pa by the exhaust system 151. Then, the introduced gas is switched to oxygen by opening and closing the valve 154. Then, as in the above-described embodiment, ashing is performed using high-frequency plasma of oxygen.

  In the embodiment shown in FIG. 15, there is a special technical significance that not only the pollutant on the surface of the substrate 9 but also the pollutant adhered to the first substrate holder 51 can be removed. If the fouling substance remains attached to the first substrate holder 51, the fouling substance easily moves and adheres to the substrate 9 when the next substrate 9 is held. According to the apparatus of this embodiment, in addition to the surface of the board | substrate 9, there exists an effect that adhesion of the fouling substance which passed through such a 1st board | substrate holder 51 can also be suppressed. Further, if the conditions are set so that the plasma is more diffused, it is possible to remove the pollutant adhered to the exposed surface of the structure in the protective film forming chamber 15.

  Next, a magnetic recording disk manufacturing apparatus according to the third embodiment will be described. FIG. 16 is a diagram showing a main part of the magnetic recording disk manufacturing apparatus according to the third embodiment. The apparatus according to the third embodiment has a configuration in which a third cleaning chamber 200 for cleaning the surface of the substrate 9 is added to the first embodiment described above. The third cleaning chamber 200 can be provided, for example, between the second cleaning chamber 23 and the burnish chamber 24 in the configuration shown in FIG. FIG. 16 is a schematic side view showing the configuration of the third cleaning chamber 200.

  The third cleaning chamber 200 shown in FIG. 16 is designed to be cleaned by irradiating the surface of the substrate 9 with a laser. That is, the third cleaning chamber 200 includes a laser oscillator 201 and an introduction window 202 for introducing laser light oscillated from the laser oscillator 201 into the inside. The introduction window 202 is provided so as to airtightly close the opening of the third cleaning chamber 200. Cleaning of the surface of the substrate 9 with laser light is mainly performed by an ablation effect. That is, when the contaminating substance attached to the surface of the substrate 9 is irradiated with laser light, the binding of the contaminating substance is released by the energy of the laser light and removed. The third cleaning chamber 200 also has an exhaust system 203, and the above cleaning is performed in a vacuum as well.

An example of cleaning the surface of the substrate 9 with laser light is as follows:
Laser: excimer laser (wavelength 248nm),
Irradiation energy density: 200 mJ / cm ² or less,
Irradiation method: 1-100Hz pulse,
Number of pulses: 100 or less,
And the condition. If it exceeds 200 mJ / cm ² , the protective film on the surface of the substrate 9 may be scraped off. Since cleaning is performed within a range where the protective film is not cut, the irradiation energy density may be lowered, the pulse frequency may be lowered, or the number of pulses may be reduced.

  The laser beam is scanned in the radial direction of the substrate 9 so that the entire surface of the substrate 9 can be irradiated with the laser beam, and the substrate 9 is rotated by the same rotation mechanism as in the above-described embodiment. However, it is preferable to perform laser irradiation.

  Next, a magnetic recording disk manufacturing apparatus according to the fourth embodiment will be described. FIG. 17 is a diagram showing the main part of the magnetic recording disk manufacturing apparatus according to the fourth embodiment. A major feature of the fourth embodiment is that the burnishing and the lubrication layer can be formed in one chamber. That is, instead of the burnish chamber 25 and the lubrication layer forming chamber 26 of the first embodiment, a burnish and lubrication layer forming chamber 210 that performs burnish and lubrication layer formation is provided. FIG. 17 is a schematic side view showing the configuration of the burnish / lubricating layer forming chamber 210.

  The burnish / lubricating layer forming chamber 210 includes an exhaust system 211 that exhausts the inside, a rotation mechanism 8 that holds the substrate 9 and rotates the substrate 9 around a rotation axis that is coaxial with the substrate 9, and is rotated by the rotation mechanism 8. A burnish tape 212 pressed against the surface of the substrate 9 to be pressed, and a lubricant applicator 213 for applying a lubricant to the surface of the substrate 9 simultaneously with the burnish by the burnish tape 212 are provided.

  Since the rotation mechanism 8 and the burnish tape 212 are the same as those in the first embodiment described above, description thereof is omitted. The lubricant applicator 213 sends the lubricant to the syringe 214 through a supply hose 216 from a syringe 214 that discharges the lubricant from the tip, a supply hose 215 connected to the syringe 214, and a container (not shown) that stores the lubricant. It is mainly composed of a delivery pump (not shown). The syringe 214 and the supply hose 215 are provided on both sides of the position where the substrate 9 is located.

  The operation of the burnish / lubricating layer forming chamber 210 shown in FIG. 17 will be described below, which also serves to explain the embodiment of the magnetic recording disk manufacturing method. In the state where the interior of the burnish / lubricating layer forming chamber 210 is evacuated to a predetermined vacuum pressure by the exhaust system 211, the second substrate holder 52 holding the substrate 9 is a bar as in the first embodiment. It moves into the niche and lubricating layer forming chamber 210 and stops at a predetermined position. Then, the rotation mechanism 8 holds and rotates one substrate 9. During this rotation, the pressing tools on both sides of the substrate 9 are displaced toward the substrate 9 by a drive unit (not shown), and the burnish tape 212 is pressed against both surfaces of the substrate 9. As a result, the protrusions present on the surface of the substrate 9 are scraped off.

  In parallel, the lubricant applicator 213 operates. A lubricant is sent to the syringe 214 through the supply hose 215 by a delivery pump (not shown) and discharged from the syringe 214. The discharged lubricant is applied onto the burnish tape 212. The lubricant moves along with the movement of the burnish tape 212, and when the burnish tape 212 where the lubricant is applied is pressed against the surface of the substrate 9, the lubricant is applied between the burnish tape 212 and the substrate 9. It is pressed and thinly stretched and applied to the surface of the substrate 9 together with it. As the lubricant, the above-mentioned PEPE may be used as a main component. As described above, a small amount of solvent may be used. Further, the pressure in the burnish / lubricating layer forming chamber 210 and the pressing pressure by the pressing tool may be the same as those in the above-described embodiment.

  After applying the varnish and the lubricant over the entire surface of both surfaces of the substrate 9, the pressing tool is retracted and the rotation by the rotation mechanism 8 is stopped. The second substrate holder 52 is moved, and the rotation mechanism 8 holds and rotates another substrate 9. Similarly, the varnish and the lubricating layer are formed simultaneously. Note that the operation of the portion other than the burnish / lubricating layer forming chamber 210 is the same as that of the first embodiment described above.

  As can be seen from the above description, the burnish / lubricating layer forming chamber 210 performs the varnish and the application of the lubricant at the same time, so that the productivity is improved as compared with the conventional case. The term “simultaneously” in this case includes a case where the varnish and the application of the lubricant are literally performed at the same time and a case where the operations are not performed at the same time, but are roughly performed at the same time. In this embodiment, the application of the varnish and the lubricant is performed in a vacuum, so that pollutants in the atmosphere are not taken into the lubricant layer, which also contributes to the production of a good quality disk. it can. However, even if these are performed in the atmosphere, the effect of improving productivity can be obtained similarly.

  Further, performing the burnish in a vacuum and performing the burnish and the lubricant application at the same time have a very close relationship. That is, when the varnishing by the varnish tape 212 is performed in a vacuum, it is very effective for reducing the pollutant. However, the frictional force between the varnish tape 212 and the surface of the substrate 9 is larger than that in the atmosphere. There is a risk that the burnish will be excessive due to the increase. Excessive burnish is a situation in which not only the protrusions are cut, but also a protective film formed in advance is cut. On the other hand, the lubricant is very viscous as it is. Therefore, application is easier when dissolved in a solvent. However, the use of a solvent has the problems described above.

  The configuration of the present embodiment has two bird-by-one technical significance for solving such a problem at once. In other words, when a configuration in which the lubricant is applied to the substrate 9 through the burnish tape is adopted, the lubricant enters between the burnish tape and the substrate 9 to prevent excessive burnish, and in addition to the viscosity. Even if it is a high lubricant, the effect that the application | coating to the board | substrate 9 can be performed easily is acquired.

  In the above embodiment, the lubricant layer is formed on the surface of the substrate 9 by applying a lubricant on the burnish tape 212. However, as in the first embodiment, the lubricant layer is formed by a vapor deposition method. Also good. That is, a crucible 252 and a heater 253 as shown in FIG. 13 may be provided in the burnish / lubricating layer forming chamber 210. Further, the lubricating layer may be formed by a spray method. In this case, an injection tool is provided in the burnish / lubricating layer forming chamber 210, and a lubricant dissolved in a solvent is injected from the injection tool.

  Next, a magnetic recording disk manufacturing apparatus according to the fifth embodiment will be described. FIG. 18 is a diagram showing the main part of the magnetic recording disk manufacturing apparatus according to the fifth embodiment. In the fifth embodiment, the configuration of the burnish chamber 24 is different from that of the first embodiment. That is, in this embodiment, prior to the burnish, the cleaning means 88 for cleaning the surface of the burnish tape 242 in a vacuum is provided. The cleaning means 88 is configured to clean the burnish tape 242 in the burnish chamber 24.

  On the surface of the burnish tape 242, as a fouling substance, a molecular film having oxygen ions, sulfate ions or the like, or an organic substance such as dust or fat may be attached. When burnishing is performed in a state where such a fouling substance is attached, the fouling substance moves to the surface of the substrate 9 and is attached. In the present embodiment, in consideration of the above, the surface of the burnish tape is cleaned by the cleaning means 88 prior to the burnish. Specifically, the cleaning unit 88 mainly includes an ion beam source 881 provided in the burnish chamber 24 and a gas supply system 882 that supplies a source gas to the ion beam source 881.

  The gas supply system 882 supplies argon gas or oxygen gas, and the ion beam source 881 irradiates the burnish tape 242 with a beam of argon ions or oxygen ions. The acceleration energy of the ion beam is preferably 250 to 600 eV, and the incident angle to the burnish tape 242 is preferably about 30 to 40 degrees. When damage to the burnished tape 242 by the ion beam becomes a problem, the acceleration energy is reduced or the incident angle is increased. The irradiation pattern of the ion beam is substantially rectangular with a width equal to or slightly larger than the width of the burnish tape 242 and a length of approximately 30 mm. The ion beam source 881 includes a focusing electrode (not shown), and focuses the ion beam so as to obtain a pattern of this level.

  The ion beam applied to the burnish tape 242 removes the fouling substances present on the surface of the burnish tape 242 by ejecting or scraping. As a result, the surface of the burnish tape 242 is cleaned, and the burnish tape with a clean surface is pressed against the surface of the substrate as described above to perform burnish. For this reason, the adhesion of the pollutant to the surface of the substrate 9 via the burnish tape 242 is prevented. In the present embodiment, the surface of the burnish tape 242 is cleaned by an ion beam, but it is also possible to clean it by the action of plasma or laser. In the configuration of the fourth embodiment described above, the surface of the burnish tape 212 can be cleaned.

  Next, a supplementary description will be given of an embodiment of the inline-type substrate processing apparatus. As described above, the magnetic recording disk manufacturing apparatus shown in FIG. 1 is an embodiment of the inline-type substrate processing apparatus. That is, a plurality of vacuum chambers 10 to 17 and 20 to 29 are connected along each of the two endless transfer paths 1 and 2, and along the third transfer path 3 that connects the two transfer paths 1 and 2. A transfer robot 63 is provided for transporting the substrate 9 in a vacuum without taking it out to the atmosphere.

  The configuration in which a plurality of vacuum chambers 10 to 17 are provided along the endless transfer path 1 and the substrate holder 51 is circulated along the transfer path 1 does not take the substrate holder 51 into the atmosphere. There is an advantage that the pollutant in the atmosphere is not brought into the apparatus through the holder 51. However, in such an in-line apparatus, if the number of vacuum chambers 10 to 17 is increased, the entire length of the transport path 1 is increased. As can be inferred from FIG. 1, when the entire length of the transport path 1 is increased, the space surrounded by the transport path 1 is increased. Since this portion of space is a useless space unrelated to the processing of the substrate 9 in particular, an increase in the exclusive area due to the increase in the space of this portion is not significant.

  As in the apparatus of this embodiment, if another unterminated transfer path 2 is set and the vacuum chambers 20 to 29 are added along the transfer path, the occupied area of the entire apparatus is increased so much. More vacuum chambers can be added without doing so. For this reason, it becomes very suitable when performing more processes consistently in a vacuum.

  The concept of such an inline-type substrate processing apparatus is not limited to the above-described magnetic recording disk manufacturing, and can be applied. For example, the present invention can be applied to the production of optical information recording media such as compact discs and the production of display devices such as liquid crystal substrates as long as an inline configuration is employed. Note that the invention of the magnetic recording disk manufacturing apparatus is not limited to the inline apparatus as described above. A cluster tool type apparatus in which a plurality of processing chambers, load lock chambers, and unload lock chambers are arranged around a transfer chamber provided with a transfer robot may be used.

  The name “magnetic recording disk manufacturing apparatus” means an apparatus used for manufacturing a magnetic recording disk. Therefore, it includes the case where all the manufacturing steps are performed by itself and the case where other manufacturing steps are performed in another apparatus. In this specification, “magnetic recording disk” is a generic term for disks on which information is recorded by using magnetic action, and other actions are used in addition to magnetic action, such as a magneto-optical disk. Thus, a wide variety of discs for recording information are also included.

1 is a schematic plan view of a magnetic recording disk manufacturing apparatus according to an embodiment, and is also a schematic plan view of an inline type substrate processing apparatus according to an embodiment of the present invention. It is a front schematic diagram which shows the structure of the 1st board | substrate holder 51 and the linear movement mechanism in the apparatus shown in FIG. FIG. 2 is a schematic side sectional view showing a configuration of a first substrate holder 51 and a linear movement mechanism in the apparatus shown in FIG. 1. FIG. 2 is a schematic side view showing a configuration of a direction changing mechanism provided in the direction changing chamber 17 shown in FIG. 1. FIG. 2 is a schematic plan view showing a configuration of a magnetic film creation chamber 14 shown in FIG. 1. FIG. 2 is a schematic plan view showing a configuration of a protective film creation chamber 15 shown in FIG. 1. FIG. 2 is a schematic plan view showing a configuration of a first cleaning chamber 22 shown in FIG. 1. FIG. 3 is a schematic plan view showing a configuration of a second cleaning chamber 23 shown in FIG. 1. FIG. 2 is a schematic side view showing the configuration of the burnish chamber 24 shown in FIG. 1. FIG. 10 is a schematic cross-sectional view illustrating a configuration of the rotation mechanism 8 illustrated in FIG. 9. It is a front view which shows the arrangement position of the contact piece 821 shown in FIG. FIG. 10 is a schematic side view illustrating a configuration of a drive mechanism 87 that drives the pressing tool 247 illustrated in FIG. 9. FIG. 2 is a schematic side view showing a configuration of a lubricating layer forming chamber 25 shown in FIG. 1. FIG. 2 is a schematic side view illustrating a configuration of a post-processing chamber 26 illustrated in FIG. 1. It is a figure which shows the principal part of the magnetic recording disk manufacturing apparatus of 2nd embodiment. It is a figure which shows the principal part of the magnetic recording disk manufacturing apparatus of 3rd embodiment. It is a figure which shows the principal part of the magnetic recording disk manufacturing apparatus of 4th embodiment. It is a figure which shows the principal part of the magnetic recording disk manufacturing apparatus of 5th embodiment. It is a figure explaining spacing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st conveyance path 11 Load lock chamber 12 Preheating chamber 13 Base film production chamber 14 Magnetic film production chamber 15 Protective film production chamber 150 Plasma formation means 16 First relay chamber 17 Direction change chamber 2 Second conveyance path 21 Second relay chamber 22 First cleaning chamber 23 Second cleaning chamber 24 Burnish chamber 242 Burnish tape 25 Lubricating layer forming chamber 26 Post-processing chamber 27 Cooling chamber 28 Unload lock chamber 29 Direction change chamber 200 Third cleaning chamber 201 Laser oscillator 210 Burnish Cum lubrication layer forming chamber 211 exhaust system 212 burnish tape 213 lubricant applicator 3 third transport path 4 gate valve 51 first substrate holding 52 Second substrate holder 61 mounted robot 62 collecting robot 63 transfer robot 8 rotating mechanism 88 the cleaning means 9 substrate

Claims (8)

A first group of vacuum chambers connected along a first endless transport path and including a processing chamber for processing a substrate in a vacuum;
A second group of vacuum chambers connected along a second endless transport path and including a processing chamber for processing substrates in a vacuum;
A first rotation mechanism for rotating a substrate holder for holding the substrate along the first endless transfer path;
A second turning mechanism for turning the second substrate holder for holding the substrate along the second transport path;
A transport system for removing the substrate from the first substrate holder, transporting the substrate in a vacuum along the third transport path without taking it out to the atmosphere, and transferring it to the second substrate holder An inline-type substrate processing apparatus. The vacuum chambers of the first group are airtightly connected to each other on the first transfer path, and the vacuum chambers of the second group are airtightly connected to each other on the second transfer path. The in-line type substrate processing apparatus according to claim 1. 3. The inline-type substrate processing apparatus according to claim 1, wherein the first transport path is a square, and the second transport path is a square. A mechanism for mounting an unprocessed substrate on the first substrate holder on the first transport path; and a mechanism for recovering a processed substrate from the second substrate holder on the second transport path. The in-line type substrate processing apparatus according to claim 1, 2, or 3. Any one of the vacuum chambers of the first group is provided with a mounting robot for mounting a substrate on the first substrate holder, and any one of the vacuum chambers of the second group includes the above-mentioned 5. The inline-type substrate processing apparatus according to claim 4, further comprising a recovery robot that recovers the substrate from the second substrate holder. One of the vacuum chambers of the first group is a load lock chamber that is opened to the atmosphere when a substrate is mounted on the first substrate holder, and the mounting robot is provided in the load lock chamber. One of the vacuum chambers of the second group is an unload lock chamber that is opened to the atmosphere when the substrate is recovered from the second substrate holder, and the recovery robot is the unloading chamber. 6. The in-line type substrate processing apparatus according to claim 5, wherein the in-line type substrate processing apparatus is provided in a lock chamber. Another vacuum chamber is disposed on the third transfer path, and the other vacuum chamber is hermetically connected to one of the vacuum chambers of the first group and the second group. 7. The in-line type substrate processing apparatus according to claim 1, wherein the in-line type substrate processing apparatus is hermetically connected to any one of the vacuum chambers. The transfer robot for removing the substrate from the first substrate holder and mounting it on the second substrate holder is provided on the third transport path. The inline type substrate processing apparatus according to any one of the above.

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