JP2009105234A - Led module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that, in a conventional LED module, a silicon resin has been coated on the surface for imparting a waterproofing property, but when the silicon resin is coated, a heat dissipation property is spoiled, which leads to a functional deterioration or trouble due to heat and further leading to an ignition accident occasionally. <P>SOLUTION: A parylene resin film is formed on the entire surface of the LED module. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an LED module, and more particularly to an LED module that is excellent in waterproofness and heat dissipation.

Light-emitting diodes, that is, LEDs, do not use filaments like incandescent bulbs, so they are small, strong against vibration, long life, few failures, and simple structure, so that they can be mass-produced and are inexpensive. Due to its characteristics, it is highly expected as a new light emitter to replace incandescent bulbs and fluorescent lamps.
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  Although an LED is an extremely energy efficient light emitter, it is inevitable that heat is generated during light emission, and the need for some heat dissipation measure is no different from other light emitters such as an incandescent light bulb. In particular, in the case of a high-power LED with high power consumption such as for illumination, if it is not properly dissipated, it may not only significantly reduce the life and performance, but may lead to dangerous accidents such as ignition and smoke.

  On the other hand, the LED element is composed of a transparent resin portion in which the light emitting part is sealed and a terminal extending from the LED element. The LED element itself has water-tightness and does not require special waterproofing treatment. In a so-called LED module in which one or a plurality of elements are mounted on a desired substrate or casing, it is necessary to perform an appropriate waterproofing treatment in order to prevent water from entering the module.

  Conventionally, the waterproofing of the LED module is usually performed by covering the entire surface of the LED module with a silicone resin. However, when the entire surface of the LED module is covered with silicone resin, it is certainly waterproof, but the heat generated from the LED elements, lead wires, and other line elements in the module is trapped in the LED module. As a result, there is a problem that heat radiation is not sufficiently performed.

  In other words, in the past, it was difficult to achieve both waterproofness and heat dissipation, and this resulted in a dilemma that heat dissipation would be impaired if the waterproofness was increased.

  As a result of conducting research to solve the above problems in the LED module, the present inventor succeeded in completing a new LED module that can satisfy both waterproofness and heat dissipation, which had been difficult to achieve in the past, It is proposed here as the present invention.

  The above problem was solved by forming a parylene resin film on the entire surface of the LED module.

  Since the surface is formed with a parylene resin film, it maintains perfect waterproofness, has excellent heat dissipation, does not cause functional deterioration or failure due to heat, and is mounted with a high-power LED element such as for lighting This is particularly effective for modules and the like. In addition, since the parylene resin film is simply formed on the surface, the operation is not so complicated and it is very cost effective.

  A feature resides in that a parylene resin film is formed on the entire surface of the LED module.

  FIG. 1 is a perspective view of Embodiment 1 of an LED module according to the present invention. In the figure, reference numeral 1 denotes a substrate of the LED module. Necessary elements such as an LED element 2 and a chip resistor 3 are mounted at predetermined positions on the substrate 1, and a circuit is formed by a conductor formed on the substrate 1. ing. And the electric wire 5 is connected to this LED module via the connector 4, and it can supply the electric current now and can make the LED element 2 light-emit. In addition, the said structure is completely the same as the conventional LED module.

  In the first embodiment, the entire surface of the LED module is coated with the parylene resin, and the parylene resin film 6 is formed. Note that parylene is a general term for paraxylylene resins, and a polymerized polymer film is a parylene resin film. The parylene resin film 6 is formed not only on the mounting portion of the LED element 2 but also on the entire LED module including the connector 4. In other words, the LED module is entirely covered with the parylene resin film 6. become. The formation of the parylene resin film 6 is performed by vaporizing the parylene resin to form a monomer, which is adhesively polymerized on the surface of the LED module in the vapor deposition chamber.

  This LED module supplies current as in the conventional LED module to cause the LED element 2 to emit light. However, since the parylene resin film 6 is formed on the surface, the penetration of water into the module is prevented. Blocked and perfect waterproofness is maintained. On the other hand, the heat generated with the light emission of the LED element 2 is smoothly released to the outside through the parylene resin film 6, and the heat does not accumulate inside the LED module, and the LED module is kept at an appropriate temperature. It is. In addition, it is thought that this LED module is excellent in heat dissipation compared with the case where the conventional silicone resin film is formed because the fine structure of the parylene resin film contributes.

  As described above, the LED module according to the present invention has the parelin resin film 6 formed on the surface thereof, so that while maintaining perfect waterproofness, the heat dissipation is excellent, and there is no risk of functional deterioration or failure due to heat. In particular, it has a great effect in an LED module mounted with a high-power LED element such as for illumination. In addition, since the parylene resin film is simply formed on the surface, the operation is not so complicated, and it is very cost effective.

  It can be used for all LED modules regardless of applications such as illumination, display, and decoration.

The perspective view of Example 1 of the LED module which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 LED element 3 Chip resistance 4 Connector 5 Electric wire 6 Palerin resin film

Claims (1)

An LED module, wherein a parylene resin film is formed on the entire surface.

Images