JP2009094639A - Optical filter for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical filter for plasma display panels, capable of reducing the manufacture cost using a comparatively inexpensive conductive material. <P>SOLUTION: An optical filter 1 for plasma display panels (PDP) according to the present invention includes a transparent base 7, an electromagnetic wave shield layer 4 prepared at the PDP 2 side of the transparent base 7, and a metal frame 5. The metal frame 5 surrounds and holds the transparent base 7 the electromagnetic wave shield layer 4 from outside, and has an earth portion 5a prepared at the front face side. In addition, a through hole 13 penetrating the transparent base 7 and the electromagnetic wave shield layer 4 is formed at the transparent base 7 and the electromagnetic wave shield layer 4. In of the through hole 13, a conductive portion 10 is formed. The conductive portion 10 connects the electromagnetic wave shield layer 4 to the earth portion 5a of the metal frame 5, and is filled up with a conductive material 10d. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical filter for a plasma display panel disposed on the front surface of a plasma display panel. In particular, a conductive material is filled in a through-hole penetrating a base material and an electromagnetic wave shielding layer, thereby reducing manufacturing costs. The present invention relates to an optical filter for a plasma display panel.

  In recent years, electromagnetic noise interference from electronic devices and the body has been a problem due to electromagnetic waves generated from various video display devices. Among these, a plasma display panel (PDP) generates a large amount of electromagnetic waves when operated. For this reason, an electromagnetic wave shielding layer including a conductive layer formed in a mesh shape (lattice shape) is provided on the front surface of the PDP. In the conductive layer of the electromagnetic wave shielding layer, the electromagnetic wave generated from the PDP is converted into electric charge, and the electromagnetic wave is shielded (see, for example, Patent Document 1).

The electromagnetic wave shielding layer is connected to a metal frame that is electrically grounded via a conductive tape. In general, the conductive tape includes a conductive bonding material containing conductive particles and the like and having conductivity therein and a conductive material. In this case, the charge accumulated in the electromagnetic wave shielding layer flows to the conductive material through the conductive bonding material of the conductive tape, and then flows to the metal frame connected to the conductive tape. In this way, the electromagnetic wave is shielded by the electromagnetic wave shielding layer.
JP 2002-251144 A

  However, the conductive bonding material of the conductive tape is generally expensive. For this reason, it is difficult to reduce the manufacturing cost of the optical filter for PDP.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide an optical filter for PDP that can reduce the manufacturing cost by using a relatively inexpensive conductive material.

  The present invention provides an optical filter for a plasma display panel disposed on the front surface of a plasma display panel, comprising: a base material; an electromagnetic wave shielding layer provided on the plasma display panel side of the base material; a base material; and an electromagnetic wave shielding layer. A metal frame having a grounding portion provided on the front side while being enclosed and held from the outside, and a through hole penetrating the base material and the electromagnetic wave shielding layer is formed in the base material and the electromagnetic wave shielding layer, An optical filter for a plasma display panel, wherein a conductive portion filled with a conductive material that connects an electromagnetic wave shielding layer and a ground portion of a metal frame is formed in a through hole.

  In the present invention, the conductive portion includes a first conductive paste layer formed in the through hole from the front side of the substrate, and a second conductive paste formed in the through hole from the plasma display panel side of the electromagnetic wave shielding layer. An optical filter for a plasma display panel comprising a layer.

  The present invention is the optical filter for a plasma display panel, wherein a plating layer is formed on the upper surface of the first conductive paste layer by electrolytic plating.

  In the present invention, the conductive portion is disposed on the front surface side of the substrate, and is disposed on the plasma display panel side of the electromagnetic shielding layer, the first conductive tape filled in the through hole from the front surface side of the substrate, and the electromagnetic wave An optical filter for a plasma display panel, comprising: a second conductive tape filled in a through hole from the plasma display panel side of the shield layer.

  According to the present invention, the first conductive tape and the second conductive tape are filled with an ultrasonic bonding machine from the front surface side of the substrate and the plasma display panel side of the electromagnetic wave shielding layer, respectively. It is an optical filter for panels.

  According to the present invention, the first conductive tape and the second conductive tape are filled with a heat roll from the front surface side of the substrate and the plasma display panel side of the electromagnetic wave shielding layer, respectively. It is an optical filter.

  The present invention is the optical filter for a plasma display panel, wherein the conductive portion is connected to the ground portion of the metal frame via a conductive gasket.

  The present invention is the optical filter for a plasma display panel, wherein a plurality of through holes are formed over the entire circumference of the substrate and the electromagnetic wave shielding layer.

  The present invention is the optical filter for a plasma display panel, wherein the gap between the through holes is shorter than the wavelength of the electromagnetic wave generated from the plasma display panel.

  According to the present invention, an electromagnetic wave shielding layer is provided on the plasma display panel side of the base material, and the base material and the electromagnetic wave shielding layer are enclosed and held from the outside by the metal frame having the grounding portion provided on the front side. . Further, a through hole penetrating the base material and the electromagnetic wave shielding layer is formed in the base material and the electromagnetic wave shielding layer, and a conductive part is formed by filling the through hole with a conductive material. The electromagnetic wave shielding layer and the metal frame Further, the conductive material is made of a material that is relatively cheaper than a conductive tape having a conductive bonding material. Thus, the electromagnetic wave shielding layer can be reliably electrically connected to the grounding part of the metal frame via the conductive part, and the electromagnetic wave shielding layer can be grounded. For this reason, the electromagnetic wave generated from the plasma display panel can be reliably shielded, and the manufacturing cost of the optical filter for the plasma display panel can be reduced.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment Hereinafter, an embodiment of the invention will be described with reference to the drawings. 1 to 4 are diagrams showing an optical filter for a plasma display panel (PDP) according to the first embodiment of the present invention. Among these, FIG. 1 is a diagram showing a configuration of an optical filter for PDP in the first embodiment of the present invention, and FIG. 2A is an optical filter for PDP in the first embodiment of the present invention. FIG. 2B is a plan view showing a state in which a conductive portion is provided in the external light antireflection film, and FIG. It is a top view which shows the state in which the part was provided. FIG. 3 is a partially enlarged view showing a state in which a through hole is formed in the optical filter for PDP in the first embodiment of the present invention, and is a view in which a metal frame is removed for convenience. 4 is a partially enlarged view showing the configuration of the optical filter for PDP in the first embodiment of the present invention, in which a metal frame is removed for convenience, and FIG. 5 is for PDP as a comparative example. It is the elements on larger scale which show the structure of an optical filter, Comprising: It is the figure which removed the metal frame for convenience.

  First, the PDP optical filter 1 according to the present embodiment will be described with reference to FIG. Here, the PDP optical filter 1 is installed in front of the PDP 2 to improve the visibility of the PDP 2.

  As shown in FIG. 1, such an optical filter 1 for PDP includes a transparent base material 7, an electromagnetic wave shielding layer 4 provided on the PDP 2 side of the transparent base material 7, and a near infrared ray on the front side of the transparent base material 7. / The UV cut film 9 provided via the neon cut adhesive material layer 8 and the external light antireflection film 11 provided on the front side of the UV cut film 9 are provided. Moreover, the transparent base material 7, the near infrared / neon cut adhesive material layer 8, the UV cut film 9, the external light antireflection film 11, and the electromagnetic wave shielding layer 4 are provided with a grounding portion 5a provided on the front side. The metal frame 5 is held and held from the outside.

  Among these, the optical filter laminate 3 is formed by the transparent substrate 7, the near infrared / neon cut adhesive layer 8, the UV cut film 9, the external light antireflection film 11, and the electromagnetic wave shield layer 4 as described later. Is configured. The electromagnetic wave shielding layer 4 effectively shields electromagnetic waves harmful to the human body emitted from the PDP 2, and is made of, for example, a copper mesh having an opening 4a.

  In general, a grounded metal mesh is used as the electromagnetic wave shielding layer 4, but a synthetic resin or metal fiber mesh coated with metal can also be used. As a metal material constituting the electromagnetic wave shielding layer 4, any metal can be used as long as it is a metal having excellent electrical conductivity and high workability, such as copper, chromium, nickel, silver, molybdenum, tungsten, and aluminum.

  As shown in FIG. 3, a through hole 13 that penetrates the optical filter laminate 3 is formed in the optical filter laminate 3. As shown in FIGS. 2A and 2B, the through hole 13 has a quadrangular shape, and a plurality of through holes 13 are formed over the entire circumference of the optical filter laminate 3. Furthermore, the gap (dimension g) between one through hole 13 and the adjacent through hole 13 is shorter than the wavelength of the electromagnetic wave generated from the PDP 2.

  Further, as shown in FIGS. 1 and 4, conductive portions 10 filled with a conductive material 10 d that connects the electromagnetic wave shielding layer 4 and the ground portion 5 a of the metal frame 5 are formed in the respective through holes 13. ing. The conductive portion 10 includes a first conductive paste layer 10a formed by applying a conductive paste into each through hole 13 from the front side of the external light antireflection film 11 constituting the optical filter laminate 3, It consists of the 2nd conductive paste layer 10b formed by apply | coating a conductive paste in each through-hole 13 from the PDP2 side of the electromagnetic wave shield layer 4 which comprises the optical filter laminated body 3. FIG. These first conductive paste layers 10a are filled in the respective through holes 13 and extend over the entire circumference of the surface of the external light antireflection film 11 as shown in FIG. The two conductive paste layers 10b are filled in the through holes 13 and extend over the entire circumference of the surface of the electromagnetic wave shield layer 4 as shown in FIG. 2 (b).

  A plating layer 10c is formed on the upper surface of the first conductive paste layer 10a by electrolytic plating. The plating layer 10c is formed by, for example, copper plating.

By the way, the conductive paste for forming the first conductive paste layer 10a and the second conductive paste layer 10b is obtained by dispersing a conductive metal in a resin, and the specific resistance value of the conductive metal is as follows. It is preferably 0.5 × 10 ⁻⁵ Ω · cm or less.

  Examples of the conductive metal used for the first conductive paste layer 10a and the second conductive paste layer 10b include metals such as silver, copper, nickel, aluminum, gold stainless steel, tungsten, chromium, and titanium, or two kinds thereof. Although an alloy or the like combining the above can be used, silver, copper, and nickel are suitable from the viewpoint of conductivity, ease of resin dispersion, and cost.

  In the first conductive paste layer 10a and the second conductive paste layer 10b, the resin for dispersing the conductive metal may be a rubber resin, a polyether resin, a polyester resin, or poly (meth) acrylic acid. An ester resin or a copolymer thermoplastic resin can be used. In addition to these, polymerizable monomers such as acrylic monomers, epoxy acrylates, urethane acrylates, polyether acrylates, and polyester acrylates can also be used. These polymerizable monomers can be used in combination with the thermoplastic resin. Furthermore, these resins can be dissolved in a general-purpose solvent, or can be used by stirring and mixing with a metal dispersant or the like without using any solvent.

  In addition, it is also possible to add thermosetting resins, such as a phenol resin, a melamine resin, an epoxy resin, and a xylene resin, to these polymerizable monomers. Two or more kinds of these polymers may be copolymerized or blended as necessary. These can be used usually by dissolving in a general-purpose solvent or stirring and mixing together with a metal dispersing agent or the like without using any solvent.

  In addition, as shown in FIG. 1, a conductive gasket 6 is provided between the ground portion 5 a of the metal frame 5 and the conductive portion 10. The conductive gasket 6 includes, for example, a core material made of polyurethane formed in a sponge shape or a rubber shape, and a conductive material such as a copper-nickel plated polyester woven fabric or a metal mesh covering the outside of the core material. It has become. As a result, the first conductive paste layer 10a and the second conductive paste layer 10b constituting the conductive portion 10 are connected to the ground portion 5a of the metal frame 5 via the plating layer 10c and the conductive gasket 6. ing.

  Next, the material of each component will be described. First, as the transparent substrate 7, a plastic film such as a polyethylene terephthalate (PET) film or an acrylic film, tempered glass, or semi-tempered glass can be used.

  The plastic film constituting the transparent substrate 7 desirably has high transparency and heat resistance, and a polymer molded product and a laminate of the polymer molded product can be used. Regarding transparency, it is advantageous that the visible light transmittance is 80% or more, and regarding heat resistance, it is desirable that the glass transition temperature is 50 ° C. or more. Among them, polyethylene terephthalate (PET), polysulfone (PS), polyethersulfone (PES), polystyrene, polyethylene naphthalate, polyallylate, polyetheretherketone (PEEK), polycarbonate (PC), polypropylene (PP), polyimide, Examples thereof include triacetyl cellulose (TAC) and polymethyl methacrylate (PMMA). Among these, it is desirable to use a film made of PET.

  The near-infrared / neon-cut adhesive layer 8 has both the near-infrared cut function and the neon-cut function, but may have either the near-infrared cut function or the neon-cut function. Good.

  The near-infrared / neon-cut adhesive material layer 8 has an adhesive acrylic resin and a NIR absorbing dye and a Ne absorbing dye contained in the acrylic resin. As a resin constituting the near-infrared / neon-cut adhesive layer 8, an acrylic resin, an acrylic, an ester, a urethane, a fluorine, a polyimide, an epoxy, a polyurethane ester, or the like, or Examples thereof include a resin formed by an acrylic pressure-sensitive adhesive containing methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate or the like as a main component. “(Meth) acrylate” means both acrylate and methacrylate. In forming the bonding agent layer, an isocyanate-based, polythiol-based, or imide-based curing agent can be included in the raw material as necessary. The NIR absorbing dye cuts light having a wavelength of 800 to 1100 nm, and the Ne absorbing dye cuts light having a wavelength of 570 to 600 nm. The near infrared / neon cut pressure-sensitive adhesive layer 8 is for bonding the UV cut film 9 to the front side of the transparent substrate 7.

  The UV cut film 9 is obtained, for example, by coating a paint containing fine particles of zinc oxide or titanium oxide that shields, scatters, or diffuses ultraviolet rays.

  The external light antireflection film 11 prevents reflection due to a difference in refractive index between air and the PDP optical filter 1 and also prevents reflection on the surface of the PDP 2. This external light antireflection film is formed by laminating optical thin films.

  Further, as shown in FIG. 1, a colored adhesive material layer 12 is provided on the PDP 2 side of the electromagnetic wave shielding layer 4. The colored adhesive material layer 12 is for adhering the PDP optical filter 1 to the front surface of the PDP 2, and an adhesive acrylic resin or the like can be used.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the optical filter 1 for PDP will be described.

  First, as shown in FIG. 1 and FIG. 4, the electromagnetic wave shielding layer 4 is formed on one surface (PDP 2 side) of the transparent substrate 7, and then close to the other surface (front side) of the transparent substrate 7. A UV cut film 9 and an external light antireflection film 11 are sequentially formed through the infrared / neon cut adhesive layer 8. In this way, an optical filter laminate 3 comprising the transparent substrate 7, the near infrared / neon cut adhesive layer 8, the UV cut film 9, the external light antireflection film 11, and the electromagnetic wave shielding layer 4 is obtained. .

  Next, as shown in FIG. 3, a plurality of through holes 13 penetrating the optical filter laminate 3 are formed in the optical filter laminate 3. In this case, as shown in FIGS. 2 (a) and 2 (b), each through hole 13 has a quadrangular shape, and a plurality of through holes 13 are formed over the entire circumference of the optical filter laminate 3. A gap (dimension g) between the adjacent through hole 13 is formed to be shorter than the wavelength of the electromagnetic wave generated from the PDP 2. Thus, electromagnetic waves generated from the PDP 2 can be prevented from leaking through the gaps between the through holes 13.

  Next, as shown in FIG. 1 and FIG. 4, the conductive portion 10 filled in each through hole 13 and made of a conductive material 10 d for connecting the electromagnetic wave shield layer 4 and the ground portion 5 a of the metal frame 5. Is formed as follows. First, a conductive paste as a conductive material 10d is applied from the front side of the external light antireflection film 11 constituting the optical filter laminate 3 into each through hole 13 and cured or dried to obtain a first conductive material. A paste layer 10a is formed. At the same time, a conductive paste as a conductive material 10d is applied and cured or dried from the PDP 2 side of the electromagnetic wave shielding layer 4 constituting the optical filter laminate 3 into each through hole 13, and then the second conductive paste layer. 10b is formed. In this case, the first conductive paste layer 10 a and the second conductive paste layer 10 b are joined to each other in each through hole 13. Further, the first conductive paste layer 10a is filled in each through hole 13, and is formed to extend over the entire circumference of the surface of the external light antireflection film 11 as shown in FIG. 2 (a). The second conductive paste layer 10b is filled in each through hole 13 and is formed to extend over the entire circumference of the surface of the electromagnetic wave shield layer 4 as shown in FIG. 2 (b). Yes.

  Next, electrolytic plating is performed on the upper surface of the first conductive paste layer 10a to form a plated layer 10c. In this way, the conductive portion 10 including the first conductive paste layer 10a, the second conductive paste layer 10b, and the plating layer 10c is obtained. By forming the plating layer 10c on the upper surface of the first conductive paste layer 10a, the plating layer 10c is connected to the conductive gasket 6 (described later), and therefore the conductive gasket 6 and the first conductive paste layer 10a. The resistance value between the two can be improved.

  Next, the colored adhesive material layer 12 is provided on the PDP 2 side of the electromagnetic wave shielding layer 4, and the optical filter laminate 3 is bonded to the front surface of the PDP 2 through the colored adhesive material layer 12. Next, the conductive gasket 6 is brought into contact with the conductive portion 10 on the front side of the external light antireflection film 11. Thereafter, the metal frame 5 is mounted so as to surround and hold the optical filter laminate 3 from the outside. In this case, the grounding part 5 a provided on the front side of the metal frame 5 is in contact with the conductive gasket 6, and the electromagnetic wave shielding layer 4 is connected to the grounding part of the metal frame 5 via the conductive part 10 and the conductive gasket 6. Connected to 5a. In this manner, the PDP optical filter 1 according to the present embodiment is obtained.

  As described above, according to the present embodiment, the electromagnetic shielding layer 4 is provided on the PDP 2 side of the transparent substrate 7, the transparent substrate 7 constituting the optical filter laminate 3, and the near infrared / neon cut adhesive layer 8. The UV cut film 9, the external light antireflection film 11, and the electromagnetic wave shielding layer 4 are enclosed and held from the outside by the metal frame 5 having the grounding portion 5a provided on the front surface side. Further, a through hole 13 penetrating the optical filter laminate 3 is formed in the optical filter laminate 3, and the conductive portion 10 is formed by filling the through hole 13 with a conductive paste as a conductive material 10d. The That is, the conductive portion 10 includes a first conductive paste layer 10a, a second conductive paste layer 10b, and a plating layer 10c. Thereby, the conductive part 10 can be reliably electrically connected to the electromagnetic wave shielding layer 4. Furthermore, a plurality of through-holes 13 are formed over the entire circumference of the optical filter laminate 3, and the conductive portion 10 is filled in each through-hole 13, and electromagnetic waves are formed over the entire circumference of the optical filter laminate 3. It extends between the shield layer 4 and the ground part 5 a of the metal frame 5, and is connected to the ground part 5 a of the metal frame 5 via a conductive gasket 6. For this reason, the electromagnetic wave shielding layer 4 is reliably grounded, and the electromagnetic waves generated from the PDP 2 can be reliably shielded, and the manufacturing cost of the PDP optical filter 1 can be reduced.

  That is, in the optical filter 30 for PDP shown in FIG. 5 as a comparative example, the conductive tape 31 includes a conductive bonding material 31a and a conductive material 31b, and the conductive tape 31 is disposed on the PDP 2 side of the electromagnetic wave shielding layer 4. The conductive bonding material 31 a is disposed so that the conductive tape 31 is bonded to the electromagnetic wave shielding layer 4. Thus, the electromagnetic wave shielding layer 4 can be electrically connected to the conductive material 31 b of the conductive tape 31 via the conductive bonding material 31 a of the conductive tape 31. However, since the conductive bonding material 31a is relatively expensive, it is difficult to reduce the manufacturing cost of the optical filter 30 for PDP.

  On the other hand, as shown in FIGS. 1 and 4, according to the present invention, the conductive portion 10 is composed of the first conductive paste layer 10a, the second conductive paste layer 10b, and the plating layer 10c. Therefore, it is relatively cheaper than the conductive tape 31 having the conductive bonding material 30a. The conductive portion 10 is filled in each through-hole 13 that penetrates the optical filter laminate 3 and connects the electromagnetic wave shielding layer 4 and the ground portion 5 a of the metal frame 5. Thus, the electromagnetic wave shielding layer 4 is reliably electrically connected to the metal frame 5 through the conductive portion 10. As described above, since the relatively inexpensive conductive portion 10 including the first conductive paste layer 10a, the second conductive paste layer 10b, and the plating layer 10c is used, the manufacturing cost of the optical filter 1 for PDP can be reduced. Can be reduced.

Second Embodiment Next, an optical filter for PDP in the second embodiment of the present invention will be described with reference to FIGS. 6 and 7A and 7B. Here, FIG. 6 is a view showing a state in which a conductive tape is affixed in the optical filter for PDP in the second embodiment of the present invention, and is a view in which a metal frame is removed for convenience. FIG. 7A is a diagram showing a state in which conductive tapes are bonded to each other by an ultrasonic bonding machine in the optical filter for PDP according to the second embodiment of the present invention. FIG. 7B is a diagram showing a state in which the conductive tape is bonded to the electromagnetic wave shielding layer by the ultrasonic bonding machine in the optical filter for PDP in the second embodiment of the present invention. However, it is the figure which removed the metal frame for convenience.

  In the second embodiment shown in FIGS. 6 and 7A and 7B, in the optical filter 1 for PDP, the first conductive tape 15 and the second conductive tape 16 constituting the conductive portion 10 are used. Is different from the first embodiment shown in FIG. 1 to FIG. 4 in other respects except that the through holes 13 are filled by the ultrasonic bonding machine 20 and are joined to each other. Are the same. 6 and FIGS. 7A and 7B, the same parts as those of the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof is omitted.

  According to the present embodiment, as shown in FIG. 6 and FIGS. 7A and 7B, the conductive portion 10 is disposed on the front side of the external light antireflection film 11 constituting the optical filter laminate 3. The first conductive tape 15 filled in each through hole 13 from the front side of the external light antireflection film 11 and the PDP 2 side of the electromagnetic wave shielding layer 4 constituting the optical filter laminate 3, The second conductive tape 16 is filled from the PDP 2 side of the layer 4 into each through hole 13.

  The first conductive tape 15 includes a first insulating bonding material 15a and a first conductive material 15b as shown in FIG. 6 and FIGS. 7A and 7B. The conductive tape 16 includes a second insulating bonding material 16a and a second conductive material 16b. Among these, the first conductive material 15b and the second conductive material 16b are made of, for example, aluminum foil or copper foil, and the first insulating bonding material 15a and the second insulating bonding material 16a are, for example, acrylic. It is made of a series adhesive material or adhesive sheet, or a thermoplastic adhesive material.

  6 and 7A and 7B, the first conductive tape 15 is disposed with the first insulating bonding material 15a facing the front side of the external light antireflection film 11. At the same time, the first conductive material 15 b is arranged facing the grounding portion 5 a of the metal frame 5. The second conductive tape 16 is disposed with the second insulating bonding material 16 a facing the PDP 2 side of the electromagnetic wave shielding layer 4.

  In addition, as shown in FIG. 7A, in each through hole 13, the first conductive tape 15 and the second conductive tape 16 are connected to each other by an ultrasonic bonding machine 20. The first conductive material 15b made of aluminum or the like and the second conductive material 16b made of aluminum or the like of the second conductive tape 16 are joined in a welded state. In this case, the first conductive tape 15 and the second conductive tape 16 are ultrasonically vibrated in the lateral direction by the ultrasonic bonding machine 20, and the first conductive material 15b and the second conductive material 16b are The first insulating bonding material 15a and the second insulating bonding material 16a interposed therebetween are excluded from between the first conductive material 15b and the second conductive material 16b, and the first conductive material The material 15b and the second conductive material 16b are welded to each other by ultrasonic vibration in the lateral direction. Thus, the first conductive tape 15 and the second conductive tape 16 are joined in a state where they are welded to each other.

  Further, as shown in FIG. 7B, the second conductive tape 16 is placed on the PDP 2 side surface of the electromagnetic wave shielding layer 4 between the through holes 13 by the ultrasonic bonding machine 20 with the second conductive material 16 b. Is bonded to the electromagnetic wave shielding layer 4 while being welded to the electromagnetic wave shielding layer 4. In this case, the second conductive tape 16 is ultrasonically vibrated in the lateral direction by the ultrasonic bonding machine 20, and the second insulating tape 16 is interposed between the second conductive material 16 b and the electromagnetic wave shielding layer 4. The bonding material 16 a is excluded from between the second conductive material 16 b and the electromagnetic wave shielding layer 4, and the second conductive material 16 b is ultrasonically vibrated in the lateral direction and welded to the electromagnetic wave shielding layer 4. Thus, the second conductive tape 16 is bonded to the electromagnetic wave shielding layer 4 in a state where it is welded to the electromagnetic wave shielding layer 4 between the through holes 13.

  Specifically, when the first conductive tape 15 and the second conductive tape 16 are bonded to each other by the ultrasonic bonding machine 20, first, over the entire circumference on the front surface side of the external light antireflection film 11, The 1st conductive tape 15 is affixed (refer Fig.2 (a)). In this case, the first insulating bonding material 15 a of the first conductive tape 15 is directed and attached to the front surface side of the external light antireflection film 11. Similarly, the 2nd electroconductive tape 16 is affixed over the perimeter of the PDP2 side of the electromagnetic wave shield layer 4 (refer FIG.2 (b)). In this case, the second insulating bonding material 16 a of the second conductive tape 16 is directed and attached to the PDP 2 side of the electromagnetic wave shielding layer 4.

  Next, as shown in FIG. 7A, in each through-hole 13, the first conductive tape 15 and the second conductive tape 16 are connected by the ultrasonic bonding machine 20 to the first conductive material 15b. And the second conductive material 16b are bonded together. In this case, first, the optical filter laminate 3 is fixed, for example, with the external light antireflection film 11 facing upward. Next, the first rotary head 20 a of the ultrasonic bonding machine 20 is brought into contact with the first conductive tape 15, and the second of the ultrasonic bonding machine 20 is set on the second conductive tape 16. The rotary head 20b is brought into contact. Next, the first rotary head 20a is finely vibrated in a direction orthogonal to the moving direction of the first rotary head 20a by the ultrasonic waves generated in the ultrasonic bonding machine 20, and the first The first rotary head 20 a moves on the conductive tape 15. At the same time, the second rotary head 20b is finely vibrated in a direction orthogonal to the moving direction of the second rotary head 20b, and the second rotary head 20b moves on the second conductive tape 16. I will do it.

  During this time, first, the first conductive tape 15 and the second conductive tape 16 are filled into the through hole 13 by the first rotary head 20a and the second rotary head 20b being brought into contact with each other. . Next, the first insulating bonding material 15a and the second insulating bonding material 16a are brought into contact with each other. Next, the first insulating bonding material 15a and the second insulating bonding material 16a interposed between the first conductive material 15b and the second conductive material 16b are combined with the first conductive material 15b. It is excluded from the space between the second conductive material 16b. At the same time, friction is generated on the contact surface between the first conductive material 15b and the second conductive material 16b, and the first conductive material 15b and the second conductive material 16b are welded together.

  Thus, the 1st conductive tape 15 and the 2nd conductive tape 16 are joined in the state welded mutually over the perimeter of the optical filter laminated body 3 (FIG. 2 (a), (See (b)).

  During this time, as shown in FIG. 7B, the second conductive material is within the range where the second rotary head 20 b is in contact with the PDP 2 side surface of the electromagnetic wave shielding layer 4 between the through holes 13. The second insulating bonding material 16 a interposed between 16 b and the electromagnetic wave shielding layer 4 is excluded from between the second conductive material 16 b and the electromagnetic wave shielding layer 4. At the same time, friction occurs on the contact surface between the second conductive material 16 b and the electromagnetic wave shield layer 4, and the second conductive material 16 b is welded to the electromagnetic wave shield layer 4. In this way, the second conductive tape 16 is joined to the electromagnetic wave shielding layer 4 while being welded to the electromagnetic wave shielding layer 4 over the entire circumference of the electromagnetic wave shielding layer 4 between the through holes 13 (see FIG. 2 (b)).

  As described above, according to the present embodiment, a plurality of through holes 13 penetrating the optical filter laminate 3 are formed in the optical filter laminate 3, and the first conductive tape 15 and the first conductive tape 10 constituting the conductive portion 10 are formed. The two conductive tapes 16 are filled into the respective through holes 13 by the ultrasonic bonding machine 20, and the first conductive material 15b and the second conductive material 16b are bonded together. The second conductive tape 16 is bonded by the ultrasonic bonding machine 20 in a state where the second conductive material 16 b is welded to the electromagnetic wave shielding layer 4 between the through holes 13. Thereby, the conductive part 10 can be reliably electrically connected to the electromagnetic wave shielding layer 4. The conductive portion 10 includes the first conductive tape 15 including the first insulating bonding material 15a and the second conductive tape 16 including the second insulating bonding material 16a. It is relatively cheaper than the conductive tape 30 (see FIG. 5) having the conductive bonding material 31a. For this reason, the manufacturing cost of the optical filter 1 for PDP can be reduced.

Third Embodiment Next, an optical filter for PDP in the third embodiment of the present invention will be described with reference to FIGS. 8 (a) and 8 (b). Here, FIG. 8A is a diagram showing a state in which the conductive tapes are bonded to each other by a heat roll in the PDP optical filter according to the third embodiment of the present invention. FIG. 8B is a diagram showing a state where the conductive tape is bonded to the electromagnetic wave shielding layer by a heat roll in the optical filter for PDP in the third embodiment of the present invention. For convenience, the metal frame is removed.

  In the third embodiment shown in FIGS. 8A and 8B, in the optical filter 1 for PDP, the first conductive tape 15 and the second conductive tape 16 constituting the conductive portion 10 are: The only difference is that each through-hole 13 is filled by the heat roll 21 and joined to each other, and the other configuration is the second embodiment shown in FIGS. 6 and 7A and 7B. Is substantially the same. 8 (a) and 8 (b), the same parts as those of the second embodiment shown in FIG. 6 and FIGS. 7 (a) and 7 (b) are denoted by the same reference numerals and detailed description thereof is omitted. .

  According to the present embodiment, as shown in FIG. 8A, in each through hole 13, the first conductive tape 15 and the second conductive tape 16 constituting the conductive portion 10 are heated. The first insulating bonding material 15a of the first conductive tape 15 and the second insulating bonding material 16a of the second conductive tape 16 are bonded to each other by the roll 21 while being bonded to each other. . In this case, the first insulating bonding material 15a and the second insulating material 15b interposed between the first conductive material 15b of the first conductive tape 15 and the second conductive material 16b of the second conductive tape 16 are used. The second insulating bonding material 16a is excluded from between the first conductive material 15b and the second conductive material 16b, and the first conductive material 15b and the second conductive material 16b are in contact with each other. Yes. As a result, the first conductive tape 15 and the second conductive tape 16 are joined in a state of being bonded to each other.

  Further, as shown in FIG. 8B, the second conductive tape 16 is bonded to the second insulating bonding material 16 a by the heat roll 21 on the surface on the PDP 2 side of the electromagnetic wave shielding layer 4 between the through holes 13. Is bonded to the electromagnetic wave shielding layer 4 in a state of being bonded to the electromagnetic wave shielding layer 4. In this case, the second insulating bonding material 16a interposed between the second conductive material 16b and the electromagnetic wave shielding layer 4 is excluded from between the second conductive material 16b and the electromagnetic wave shielding layer 4, In addition, the second conductive material 16 b is in contact with the electromagnetic wave shielding layer 4. Thus, the second conductive tape 16 is bonded to the electromagnetic wave shielding layer 4 in a state where it is adhered to the electromagnetic wave shielding layer 4 between the through holes 13.

  Specifically, as shown in FIG. 8A, in the case where the first conductive tape 15 and the second conductive tape 16 are joined to each other by the heat roll 21 in each through hole 13, first, for example, The optical filter laminate 3 is fixed with the external light antireflection film 11 facing upward. Next, the first knurled head 21a of the heat roll 21 formed with the convex portions is heated and brought into contact with the first conductive tape 15, and the convex portions are formed on the second conductive tape 16. The second knurled head 21b of the heat roll 21 formed with the portion is heated and brought into contact therewith. Here, the convex portions are respectively formed on the surfaces of the first knurled head 21a and the second knurled head 21b of the heat roll 21 so as to extend in a strip shape in the axial direction. Next, the first knurled head 21 a moves on the first conductive tape 15, and the second knurled head 21 b moves on the second conductive tape 16.

  During this time, first, the first conductive tape 15 and the second conductive tape 16 are filled in each through-hole 13 by contacting the first knurled head 21a and the second knurled head 21b. Is done. Next, the first insulating bonding material 15a and the second insulating bonding material 16a are brought into contact with each other. Further, the first insulating bonding material 15a and the second insulating bonding material 16a with which the first knurling head 21a and the second knurling head 21b are in contact with each other are heated, and the first insulating bonding material 15a is heated. And the viscosity of the 2nd insulating joining material 16a falls, respectively. For this reason, the range in which the convex part of the outer peripheral surface of the first knurled head 21 a is in contact with the first conductive tape 15 and the outer peripheral surface of the second knurled head 22 b of the second conductive tape 16. The first insulative bonding material 15a and the second insulative bonding material 16a interposed between the first conductive material 15b and the second conductive material 16b in a range where the convex portions of the first and second conductive materials 16b are in contact. Is excluded from between the first conductive material 15b and the second conductive material 16b. At the same time, the first conductive material 15b and the second conductive material 16b are brought into contact with each other.

  Thereafter, when the first knurling head 21a and the second knurling head 21b are separated, the first insulating bonding material 15a and the second insulating material 15b excluded from between the first conductive material 15b and the second conductive material 16b. The insulating bonding material 16a is cooled and solidified. Thus, the 1st conductive tape 15 and the 2nd conductive tape 16 are joined in the state where it was mutually adhered over the perimeter of optical filter layered product 3 (Drawing 2 (a), (See (b)).

  During this time, as shown in FIG. 8B, in the range where the convex portion of the outer peripheral surface of the second knurled head 21b is in contact with the PDP2 side surface of the electromagnetic wave shielding layer 4 between the through holes 13. The second insulating bonding material 16a interposed between the second conductive material 16b and the electromagnetic wave shielding layer 4 is excluded from between the second conductive material 16b and the electromagnetic wave shielding layer 4, and the second The conductive material 16b is brought into contact with the electromagnetic wave shielding layer 4. In this way, the second conductive tape 16 is bonded to the electromagnetic wave shielding layer 4 while being adhered to the electromagnetic wave shielding layer 4 over the entire circumference of the electromagnetic wave shielding layer 4 between the through holes 13 (see FIG. 2 (b)).

  As described above, according to the present embodiment, a plurality of through holes 13 penetrating the optical filter laminate 3 are formed in the optical filter laminate 3, and the first conductive tape 15 and the first conductive tape 10 constituting the conductive portion 10 are formed. The two conductive tapes 16 are filled in the respective through holes 13 by the heat rolls 21, the first conductive material 15b and the second conductive material 16b are brought into contact with each other, and the first insulating bonding is performed. The material 15a and the second insulating bonding material 16a are bonded in a state where they are adhered to each other. In addition, the second conductive tape 16 is in contact with the electromagnetic wave shielding layer 4 between the through holes 13 by the heat roll 21, and the second insulating bonding material 16 a It joins in the state adhere | attached on the electromagnetic wave shield layer 4. FIG. Thereby, the conductive part 10 can be reliably electrically connected to the electromagnetic wave shielding layer 4. The conductive portion 10 includes the first conductive tape 15 including the first insulating bonding material 15a and the second conductive tape 16 including the second insulating bonding material 16a. It is relatively cheaper than the conductive tape 30 (see FIG. 5) having the conductive bonding material 31a. For this reason, the manufacturing cost of the optical filter 1 for PDP can be reduced.

FIG. 1 is a diagram showing a configuration of an optical filter for PDP in the first embodiment of the present invention. FIG. 2A is a plan view showing a state in which a conductive portion is provided in the external light antireflection film in the optical filter for PDP in the first embodiment of the present invention, and FIG. In the optical filter for PDP in the 1st Embodiment of this invention, it is a top view which shows the state by which the electroconductive part was provided in the electromagnetic wave shield layer. FIG. 3 is a partially enlarged view showing a state in which a through hole is formed in the PDP optical filter according to the first embodiment of the present invention, and is a view in which a metal frame is removed for convenience. FIG. 4 is a partially enlarged view showing the configuration of the optical filter for PDP in the first embodiment of the present invention, and is a view in which a metal frame is removed for convenience. FIG. 5 is a partially enlarged view showing a configuration of an optical filter for PDP as a comparative example, in which a metal frame is removed for convenience. FIG. 6 is a diagram showing a state in which a conductive tape is affixed in the PDP optical filter according to the second embodiment of the present invention, and is a diagram in which a metal frame is removed for convenience. FIG. 7A is a diagram showing a state in which conductive tapes are bonded to each other by an ultrasonic bonding machine in the PDP optical filter according to the second embodiment of the present invention. FIG. 7B is a diagram illustrating a state where the conductive tape is bonded to the electromagnetic wave shielding layer by the ultrasonic bonding machine in the optical filter for PDP in the second embodiment of the present invention. FIG. 3 is a diagram in which a metal frame is removed for convenience. FIG. 8A is a diagram showing a state in which conductive tapes are bonded to each other by a heat roll in the optical filter for PDP according to the third embodiment of the present invention, and the metal frame is removed for convenience. FIG. 8B is a diagram showing a state in which the conductive tape is bonded to the electromagnetic wave shielding layer by the heat roll in the PDP optical filter according to the third embodiment of the present invention. It is the figure which removed the metal frame specifically.

Explanation of symbols

1 PDP optical filter 2 PDP
DESCRIPTION OF SYMBOLS 3 Optical filter laminated body 4 Electromagnetic wave shield layer 4a Opening 5 Metal frame 5a Grounding part 6 Conductive gasket 7 Transparent base material 8 Near infrared / neon cut adhesive material layer 9 UV cut film 10 Conductive part 10a First conductive paste layer 10b Second conductive paste layer 10c Plating layer 10d Conductive material 11 External light antireflection film 12 Colored adhesive layer 13 Through hole 15 First conductive tape 15a First insulating bonding material 15b First conductive material 16 Second conductive tape 16a Second insulating bonding material 16b Second conductive material 20 Ultrasonic bonding machine 20a First rotary head 20b Second rotary head 21 Heat roll 21a First knurled head 21b Second Knurled head 30 Optical filter 31 for PDP Conductive tape 31a Conductive bonding material 31b Conductive material

Claims (9)

In an optical filter for a plasma display panel disposed in front of the plasma display panel,
A substrate;
An electromagnetic wave shielding layer provided on the plasma display panel side of the substrate;
A substrate and a metal frame that surrounds and holds the electromagnetic wave shielding layer from the outside, and has a ground frame provided on the front side, and
A through hole penetrating the base material and the electromagnetic wave shielding layer is formed in the base material and the electromagnetic wave shielding layer,
An optical filter for a plasma display panel, wherein a conductive portion filled with a conductive material that connects an electromagnetic wave shielding layer and a ground portion of a metal frame is formed in the through hole.   The conductive portion includes a first conductive paste layer formed in the through hole from the front side of the base material and a second conductive paste layer formed in the through hole from the plasma display panel side of the electromagnetic wave shielding layer. The optical filter for a plasma display panel according to claim 1.   The optical filter for a plasma display panel according to claim 1, wherein a plating layer is formed on the upper surface of the first conductive paste layer by electrolytic plating.   The conductive portion is disposed on the front surface side of the base material, and is disposed on the plasma display panel side of the electromagnetic wave shielding layer with the first conductive tape filled in the through hole from the front surface side of the base material, and the plasma of the electromagnetic wave shielding layer. The optical filter for a plasma display panel according to claim 1, comprising a second conductive tape filled in the through hole from the display panel side.   The first conductive tape and the second conductive tape are respectively filled by an ultrasonic bonding machine from the front surface side of the base material and the plasma display panel side of the electromagnetic wave shielding layer. Optical filter for plasma display panel.   5. The plasma display according to claim 4, wherein the first conductive tape and the second conductive tape are respectively filled with a heat roll from the front surface side of the substrate and the plasma display panel side of the electromagnetic wave shielding layer. Optical filter for panels.   The plasma display panel optical filter according to claim 1, wherein the conductive portion is connected to a ground portion of the metal frame via a conductive gasket.   The optical filter for a plasma display panel according to any one of claims 1 to 7, wherein a plurality of through holes are formed over the entire circumference of the substrate and the electromagnetic wave shielding layer.   The optical filter for a plasma display panel according to any one of claims 1 to 8, wherein a gap between each through hole is shorter than a wavelength of an electromagnetic wave generated from the plasma display panel.

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