JP2009081368A - Letterpress for high-definition printing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide high-definition printing letterpress for forming, by a letterpress process, a printing pattern that requires printing accuracy such as organic function layer formation in an organic EL element, for example, in which the printing press can eliminate defective printing in pattern printing such as pattern missing or a pattern accuracy failure, particularly for a high-definition product caused by the lowering of the strength of letter press printing. <P>SOLUTION: A metal projection supporter 102 corresponding to a projection pattern of the printing press is provided on a metal substrate 101 according to a required number or a quantity. A resin pattern 103 is formed in contact with at least an upper part of the metal protrusion supporter 102. Further, the end of the resin pattern 103 formed at least to cover the end of the metal projected supporter 102. The protrusion supporter 102 of printing letterpress 302 comprises metal so that the deformation of the press is suppressed, and the top head of the protrusion comprises resin so that the press demonstrates printing flexibility likewise a general resin press, ensuring printing without damage even for a hard substrate such as a glass substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a relief plate for high-definition printing used in a relief printing method, and a printed material produced using the relief plate for high-definition printing. Examples of the printed material include organic electroluminescent elements, semiconductor devices, color filters, circuit substrates, thin film transistors, microlenses, biochips, and the like as printed materials.

  An organic electroluminescence element (hereinafter referred to as an organic EL element) is an element in which an organic light emitting layer made of an organic light emitting material is formed between two opposing electrodes, and light is emitted by passing a current through the organic light emitting layer. In order to emit light efficiently, the film thickness of the light emitting layer is important, and it is necessary to make it a thin film of about 100 nm. Furthermore, in order to make this a display capable of color display, it is necessary to pattern with high definition.

  Organic light-emitting materials include low-molecular materials and high-molecular materials. Generally, low-molecular materials are formed into a thin film by resistance heating vapor deposition or the like, and then patterned using a fine pattern mask. As the size of the mask increases, the mask is deformed by heat during film formation, and the patterning accuracy is less likely to be obtained.

  Therefore, recently, a method of using a polymer material as an organic light emitting material, dissolving the organic light emitting material in a solvent to form a coating solution, and forming a thin film by a wet coating method has been tried. There are spin coating methods, bar coating methods, protruding coating methods, dip coating methods, printing methods, etc. as wet coating methods for forming a thin film, but for high-definition patterning or separate application to RGB three colors. However, these wet coating methods are difficult. Therefore, it is effective to form a thin film by a printing method that is good at coating patterning.

  Furthermore, among various printing methods, organic EL elements and displays often use a glass substrate as a substrate, so a method using a hard plate such as a metal printing plate is not suitable, such as a gravure printing method, An offset printing method using an elastic rubber plate and a relief printing method using a photosensitive resin plate mainly composed of rubber or other resin are optimal. As attempts of these printing methods, a method by offset printing (Patent Document 1), a method by letterpress printing (Patent Document 2), and the like have been proposed.

The patent documents are as follows.
JP 2001-93668 A JP 2001-155858 A

  Further, the pattern of the organic light emitting layer in the organic EL element has a line width of 100 μm and a pixel pitch of 500 μm in the case of a large display for TV use, for example, a wide display of 40 inches. In the case of a small display such as a cellular phone, for example, in the mainstream QVGA (320 × 240 pixels) with a diagonal of 2 inches, the pixel pitch is 120 μm and the width of each pixel subpixel is 40 μm. As a result, the actual pixel width is about 50 to 60% of the subpixel. When such a high-definition display element is to be formed by the relief printing method, a very high printing pattern accuracy of 5 μm or less is required.

However, for example, in order to manufacture a display having the pixel size of QVGA, lines and spaces having a pitch of about 40 μm are required per sub-pixel. Therefore, if the printing pattern accuracy is poor, the electrode layer and the hole transport layer Or the short circuit by the contact of an electron carrying layer, the adjacent organic light emitting layer mix, and color mixing will generate | occur | produce. Due to such problems, a high-definition print pattern with sufficient quality could not be formed with the conventional resin relief printing plate.

  For example, PET or PE is used as a base material for general resin relief printing. However, since the organic EL display device is manufactured in the atmosphere by the printing method, the base of the resin relief printing plate is used. This is because the material absorbs moisture and swells, so that a high-definition pattern film that requires accuracy of several μm at the time of printing cannot be obtained.

  Furthermore, in order to obtain printing reproducibility, it is desirable that the aspect ratio between the line width and the plate depth of the convex portion of the printing relief printing plate is high, but when the resin relief printing is exposed with a high-definition pattern mask, the mask In the development processing in which the convex portion corresponding to the pattern is developed with an exposure amount that maintains the cross-sectional shape of the convex portion close to a forward taper, a deep concave portion is not obtained and the aspect ratio is lowered. On the other hand, if development is performed excessively in order to increase the aspect ratio, the cross-sectional shape of the convex portion becomes a reverse taper, which causes peeling or chipping. In addition, the line width of the convex portion becomes narrower as the definition becomes higher, but if the aspect ratio becomes higher, the strength of the convex portion formed only with a soft resin is insufficient, resulting in a distorted shape, resulting in pattern omission and pattern accuracy failure. .

  The problem of poor printing due to such a fine plate and outflow of ink is an electronic component that requires fine pattern formation, such as color filters, circuit substrates, thin film transistors, microlenses, biochips, etc. It is the same.

  Accordingly, an object of the present invention is to provide a relief printing plate for high-definition printing for forming a printing pattern that requires printing accuracy, such as the formation of an organic functional layer in an organic EL element, by the relief printing method. Thus, there is a need to eliminate pattern omission and pattern accuracy defect, particularly, high-definition printing defect due to a decrease in the strength of the convex portion.

The high-definition printing relief plate of the present invention is a printing relief plate used when supplying ink to a relief portion of a relief plate, printing the ink on the relief portion, and forming a pattern made of ink on the surface of the printed material,
As shown in FIG. 1, a metal convex support 102 corresponding to the convex pattern of the printing relief plate is provided on a metal substrate 101 according to the number or amount required, and a resin. The pattern 103 is provided in contact with at least the upper part of the metal convex support 102, and the end of the resin pattern 103 is provided so as to cover at least the end of the metal convex support 102. And the area of the surface region of the resin pattern 103 is larger than the surface region of the upper portion of the metal convex support 102, respectively.

In addition, the relief printing plate for high-definition printing according to the present invention is characterized in that the thickness of the metallic substrate 101 is 50 μm or more and 500 μm or less, and the thermal expansion coefficient of the metallic substrate 101 is 50 ×. The high-definition relief printing plate is characterized in that it is 10 ⁻⁷ / ° C. or less, and further the surface average roughness of the metal convex support 102 is 0.1 μm or more.

  In addition, the relief printing plate for high-definition printing according to the present invention is characterized in that the viscosity of the coating solution for forming the resin pattern 103 is 10 mPa · s or more and 10,000 mPa · s or less. It is.

  According to the relief printing plate for high-definition printing according to claim 1 of the present invention, the convex support of the printing relief plate is made of metal, so that deformation of the printing plate is suppressed, and the top of the projection is made of resin. As a result, it is possible to print on a hard substrate such as a glass substrate without damaging it by showing flexibility at the time of printing in the same manner as a general resin relief printing. In addition, since the end portion of the resin pattern is provided so as to cover at least the end portion of the metal convex support, the inflow of ink to the resin / metal interface is prevented, and the metal portion of the interface is rusted. It became possible to prevent metamorphosis.

  According to the relief printing plate for high-definition printing according to claim 2 of the present invention, since the area of the surface area of the resin pattern is larger than the surface area of the upper part of the metal convex support, the edge of the resin pattern during printing The variation in the width and film thickness of the printed pattern, which is caused by the ink extruded from the resin, can be suppressed by correcting the surface shape of the resin pattern end.

In addition, according to the relief printing plate for high-definition printing according to claim 3 of the present invention, when the thickness of the metal substrate is 50 μm or more and 500 μm or less, the substrate can be easily processed, In particular, it has become possible to easily perform affixing work to a plate cylinder of a relief printing press. According to the relief printing plate for high-definition printing according to claim 4 of the present invention, since the thermal expansion coefficient of the metal substrate is 50 × 10 ⁻⁷ / ° C. or less, the substrate processing step / resin pattern formation The expansion of the base material due to heat, which occurs during the process / printing process, is reduced, and the work can be easily performed. Furthermore, according to the relief printing plate for high-definition printing according to claim 5 of the present invention, when the average surface roughness of the metal convex support is 0.1 μm or more, the adhesion of the resin pattern is improved. The printing can be performed stably.

  In addition, according to the relief printing plate for high-definition printing according to claim 6 of the present invention, the viscosity of the coating liquid for forming the resin pattern is 10 mPa · s or more and 10,000 mPa · s or less. The thickness of the film can be controlled on the micro order, and the flatness of the surface region of the resin pattern can be improved during pattern formation.

  An example of the relief printing plate for high-definition printing of the present invention is shown in FIG.

  FIG. 1a is an example of the pattern shape of the plate surface of the relief printing plate for high-definition printing according to the present invention. As the pattern of the printing plate used for manufacturing an organic functional element such as an organic EL element or a display element such as a color filter, a line shape or a dot shape is used. As shown in the figure, the line width or pattern width of the plate surface convex portion is a, and the interval between adjacent convex patterns is b.

  FIG. 1 b is a cross-sectional view of FIG. 1 a taken along the P line. As a material of the metal substrate 101, various metal materials can be used as described in the description of the manufacturing method. Further, as will be described later, by using an electroforming method, a thermal spraying method, an etching method, or the like for the production of a plate, a metal convex support 102 made of the metal base 101 or a metal convex support on the metal base 101 is used. 102 can be formed.

  If the plate depth from the top to the bottom of the convex pattern is d, the aspect ratio a / d between the line width and the plate depth can be kept at 1 or more, so that the ink that has flowed into the recesses can be prevented from overflowing. Is desirable. However, when using a printing relief plate formed only with a conventional photosensitive resin, the line-and-space, which is the sum of the line width a and the pattern interval b, is high-definition printing of 100 μm or less. Since the strength is insufficient, the plate is deformed or damaged, resulting in poor printing.

  Therefore, by forming the metal convex support 102 as described above and covering the metal convex support with the resin pattern 103, the above-described problems can be solved, and further, a glass substrate such as The ink pattern can be transferred onto a hard and easily damaged substrate. Further, when the metal convex support is covered with a resin pattern, a metal / resin at the top of the metal convex support is formed by forming a resin pattern so as to cover the end of the metal convex support. It was possible to prevent the ink from flowing into the interface and to prevent the metal part of the interface from being transformed, such as rust, and to expand the adhesion area and improve the printing durability.

  Next, the manufacturing method of the relief printing plate for high-definition printing of this invention is demonstrated. FIG. 2 is a schematic cross-sectional view showing a manufacturing process of a high-definition relief printing plate according to an embodiment of the present invention.

  As the metal substrate 201 of the relief printing plate for high-definition printing of the present invention, a nickel iron alloy such as stainless steel or invar material, or a nickel cobalt iron alloy plate such as super invar can be used.

In the metal substrate, in order to form a high-definition pattern with high positional accuracy particularly on a large substrate, a substrate having a thermal expansion coefficient of 50 × 10 ⁻⁷ / ° C. or less, more preferably 20 × 10 ⁻⁷ / ° C. or less. It is better to select the material. Furthermore, it is more preferable to have flexibility that can be wound around a printing roll. As an example of such a metal substrate 201, it is preferable to use a metal sheet having a low thermal expansion coefficient such as Invar material or Super Invar material. As the thickness of the metal sheet, it is sufficient that the metal sheet has sufficient flexibility to be wound around a printing plate copper and has a strength that does not deform due to heat or impact, and is preferably 0.5 mm or less, more preferably 0.8 mm. 3 mm or less can be used suitably. However, in order to easily perform the base material processing step described later, it is preferable that the base material has a strength that does not deform due to air pressure such as drying, and 0.05 mm or more can be suitably used.

  First, as shown in FIGS. 2 (1 d) and 2 (2 d), the metal convex support 205 is formed on the metal base 201. The material of the metal convex support is not particularly limited as long as it is a metal, but stainless steel is used to obtain resistance to distortion due to the difference in thermal expansion coefficient between the adhesion to the metal base material and the material. It is preferable to use a plate of nickel iron alloy such as invar material or nickel cobalt iron alloy such as super invar, and more preferably the same material as the metal substrate.

  There are two main methods for forming the metal convex support. The metal substrate itself is shaved by etching or the like, and a metal convex support is formed by forming a recess, or a metal film is deposited on the metal substrate by electroforming or spraying, etc. This is a method of forming a convex support. In addition, known forming methods other than these can be used.

  According to FIG. 2, a process of cutting a metal substrate by etching to produce a recess and forming a metal protrusion support will be described. First, a photosensitive resist layer 202 is laminated on a metal substrate 201 (FIG. 2 (1a)). Next, by using a photolithography method, unnecessary portions are removed to form a plurality of convex patterns 203 (FIG. 2 (1b)). At this time, the convex pattern of the resist to be formed is formed at the same location as the convex pattern of the high-definition printing relief plate to be finally produced. Next, using a wet etching method, a dry etching method, or the like, a portion of the metal base material 201 where the convex pattern 203 of the photosensitive resist layer 202 is not formed is etched to form a metal concave portion 204 ( FIG. 2 (1c)). Subsequently, by removing the convex pattern of the photosensitive resist layer, the metal convex support 205 can be formed (FIG. 2 (1d)).

When a metal film is deposited on a metal substrate by electroforming or spraying to form a metal convex support, a photosensitive resist layer 202 is first laminated on the metal substrate 201 (see FIG. 2 (2a
)). Next, by using a photolithography method, unnecessary portions are removed to form a plurality of convex patterns 203 (FIG. 2 (2b)). At this time, the convex pattern of the resist to be formed is formed at a location reversed from the convex pattern of the high-definition printing relief plate to be finally produced. Next, a metal film 208 is deposited in the gap recesses of the convex pattern 203 of the photosensitive resist layer 202 (FIG. 2 (2c)). Subsequently, the metal convex support 205 can be formed by removing the convex pattern of the photosensitive resist layer (FIG. 2 (2d)).

  The metal convex support preferably has an average surface roughness of the side and top surfaces of 0.1 μm or more. This is because in the resin patterning described later, the adhesive force and durability of the resin film to the metal convex support are improved. However, since the thickness of a preferable resin pattern to be described later is on the micro order, the surface average roughness of the side surface and the upper surface is more preferably 1.0 μm or less.

  Examples of the shape of the metal convex support include a forward tapered shape, a reverse tapered shape, and a vertical shape. The shape is selected according to the required pitch of the print pattern. For example, in a printing pattern with a relatively wide pitch, a forward taper shape that spreads toward the recess and has a wide contact area with the resin and high stability is used. However, in a high-definition print pattern with a narrow pitch, with a forward taper that spreads toward the recess, the taper may overlap at the bottom to reduce the plate depth. The same applies to the reverse tapered shape. In that case, a vertical shape can be suitably used.

  Next, a resin film 206 is formed on the metal convex support (FIGS. 2 (1e) and (2e)). The material of the resin film is not particularly limited, but it is preferable to select one that is resistant to ink at the time of printing, nitrile rubber, silicone rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, chloroprene rubber, butyl rubber, In addition to rubbers such as acrylonitrile rubber, ethylene propylene rubber, urethane rubber, polyethylene, polystyrene, polybutadiene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyamide, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyethersulfone , Polyvinyl alcohol, copolymers thereof, natural polymers such as cellulose, acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins Phenol resins may be selected depending on the application. These can be used alone or in combination of two or more. As a method for forming the resin film, known coating methods such as spin coating, roll coating, spray coating, dip coating, laminating, and printing can be used. The thickness of the resin film is preferably 0.1 μm to 100 μm, but in consideration of the height of the metal convex support and the elasticity required for printing, more preferably 5 μm to 50 μm can be suitably used.

  In addition, in order to obtain the thickness of the resin film described above, the viscosity of the resin material coating solution is preferably 10 mPa · s or more and 10,000 mPa · s or less. If it is less than 10 mPa · s, it is difficult to obtain a thickness of 5 μm to 50 μm, and further, the coating liquid flows due to the influence of the distortion of the base material and the flatness of the resin pattern is lowered. If it exceeds 10,000 mPa · s, it is not possible to easily remove bubbles and foreign matters mixed in the coating solution, and furthermore, the coating solution has a high viscosity, so coating unevenness is likely to occur and the flatness of the resin pattern surface area is reduced. is there. Based on the above-described factors, the viscosity of the resin material is preferably 30 mPa · s or more and 1000 mPa · s or less in order to use a known coating method.

Subsequently, a resin pattern 207 is formed (FIGS. 2 (1f) and (2f)). In the above-described known coating methods, various printing methods can be cited as methods capable of simultaneously forming a film and patterning. In this case, pattern formation such as a photolithography method to be described later can be omitted, so that the number of steps can be reduced. In another coating method, since the resin film is formed so as to cover the metal convex support and the metal substrate, it is necessary to perform patterning.

  As a method for forming the resin pattern, a known coating method such as a photolithography method, a hydrophilic / water-repellent patterning method, a printing method, or the like can be used. In consideration, the photolithography method can be preferably used.

  By the way, when producing the above-described high-definition plate, when transferring the ink from the plate to the printing medium, the strength of the resin convex shape is weak so that the printed pattern after the transfer does not cause a defect. For example, when a pattern having a line width of 30 μm or less is to be formed, it is preferable that a plate depth of 30 μm or more is formed. It is preferable to do. However, it is difficult to produce a plate satisfying this requirement and having little deformation and swelling with a conventional resin plate.

  Therefore, in the present embodiment, an elastic resin layer is formed on the metal convex support in order to form a high-definition printing relief plate having a metal convex support with little deformation, and to disperse the printing pressure during transfer. Filmed. Thereby, a fine pattern of 30 μm or less can be printed without damaging a hard material such as glass or a material susceptible to impact such as plastic.

Specific examples of the relief printing plate for high-definition printing according to the present invention will be described below.
<Preparation of light emitting layer forming coating ink solution>
A polymeric fluorescent substance (or a polymeric fluorescent substance and a binding polymeric resin) is dissolved in xylene so that the coating ink liquid concentration is 1.0% by weight. Prepared. Here, the polymeric fluorescent substance refers to a light emitting material made of a polyparaphenylene vinylene derivative.

<Preparation of printed substrate>
Hole transport using a spin coater on the ITO film surface of a substrate for transparent electrode production, in which an ITO film with a surface resistivity of 15Ω is formed in a circuit pattern on a glass substrate of 150 mm square and 0.4 mm thickness As a layer, poly (3,4) ethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) was formed to a thickness of 100 nm. Next, this printed PEDOT / PSS thin film was dried at 180 ° C. for 1 hour under reduced pressure to prepare a substrate to be printed.

<Production of metal convex support>
In order to remove the oil on the surface of Fe-Ni (Ni 36%), which is 300 mm square and 0.25 mm thick, which is a base material, it is floated and immersed for 10 minutes in an alkaline degreasing agent heated to 70 ° C with a water bath. Wash the hot water with the same setting as above, rinse off the degreasing agent, and then remove the oxide film on the surface of the substrate by floating immersion in a 10% hydrochloric acid aqueous solution for 2 minutes. It was.

  Next, using a spin coater, a positive photosensitive polyimide resin (Nissan Chemical Industry Co., Ltd .: RN-901) is applied to the entire surface, exposed to this photosensitive polyimide resin through a mask, and selectively exposed with ultraviolet rays. did. This mask is designed so that the photosensitive polyimide resin excluding the portion that becomes the print pattern is exposed, and a developer (2.38% tetramethylammonium hydroxide aqueous solution) is used for the exposed portion of the photosensitive polyimide resin. And removed by spin development.

Furthermore, the resist pattern and its surface were etched using a wet etching apparatus. A ferric chloride solution (Kurita Co., Ltd.) was used as an etching solution, and etching was performed so that the resist pattern was not peeled off. Thus, a substrate having an etching depth of 30 μm and a side etching of 15 μm was obtained. The exposed photosensitive polyimide resin was removed by dipping in a removing solution after etching.

<Production of resin pattern>
Using a die coater, SU-8 (manufactured by Kayaku Microchem Co., Ltd.), which is an epoxy negative thick film resin, was applied to the entire surface of the metal substrate. The gap was 150 μm from the concave portion of the substrate, the speed was 40 mm / sec, and coating was performed under these conditions to obtain a uniform and uniform resin film.

  The thick film resist was exposed to the resin film through a mask corresponding to the required pattern, and selectively exposed with ultraviolet rays. The mask was designed such that the opening was widened and the resist was exposed so as to be larger than the surface area of the metal convex support that was the substrate to be printed. The unexposed portion of the resin was removed by paddle development using a developer. After development, the resin pattern was dried to obtain a cured resin pattern.

  Through these steps, a convex support for a high-definition printing according to an example of the present invention in which a convex support was made of metal and a resin pattern was formed on the metal convex support was obtained.

<Printing of coating ink liquid for light emitting layer formation>
First, the relief printing plate 302 for high-definition printing produced in the above process is mounted and fixed on the peripheral surface of the plate cylinder 303 of a pressure-type relief printing machine (see FIG. 3) by the relief printing method, and the printing substrate 301 is printed. It was placed and fixed on a body-fixed surface plate.

  Then, the anilox (ink supply) roll 304 and the plate cylinder 303 are rotated so that the coating ink liquid for forming the light emitting layer is supplied to the peripheral surface of the anilox roll 304 as a uniform film. Ink liquid was supplied to the top surface of the convex portion of the relief printing plate. Thereafter, a pattern-shaped coating ink liquid for forming a light emitting layer was printed on the top surface of the substrate 301 on the ITO film pattern forming surface side of the substrate 301 in alignment with the ITO film pattern.

  After the printing, the substrate 301 to be printed is formed by drying the coating ink liquid at 150 ° C. for 5 hours, and then laminating 7 nm of calcium and 80 nm of aluminum on the light emitting layer by the coating ink liquid. And it was set as the organic EL element which is a light emitting layer board | substrate for cathodes.

<Comparative example>
High-definition printing is performed by applying a solvent-resistant negative photosensitive resin mainly composed of polyamide on the surface of a 200 μm-thick SUS304 metal substrate 201 to a total thickness of 1.4 mm. The photosensitive resin material used as the origin of the letterpress for printing was formed. Next, the resin was exposed through a mask and selectively exposed with ultraviolet rays. The mask was designed so that the resin on the substrate excluding the portion to be the printed pattern was exposed. Next, through the same development, drying, and post-exposure steps as in the example, a comparative high-definition printing relief plate using only a photosensitive resin was obtained.

  Thereafter, the coating ink liquid for forming a light emitting layer was printed using the relief printing plate to obtain an organic EL element which is a light emitting layer substrate for a cathode.

<Comparison result>
When the organic EL element produced by the said Example applied the voltage through the ITO film | membrane and confirmed the light emission state, the film thickness of the light emitting layer was uniform and the light emission nonuniformity was not seen. However, when the organic EL element produced by the comparative example applied voltage through the ITO film and confirmed the light emission state, light emission unevenness due to the non-uniform thickness of the light emitting layer was observed.

It is a cross-sectional schematic diagram of an example of the relief printing plate for high-definition printing according to the present invention. It is the cross-sectional schematic diagram which showed the manufacturing process of the relief printing plate for high-definition printing which concerns on this invention. 1 is a schematic diagram of a printing press of a relief printing plate for high-definition printing according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Metal base material 102 ... Metal convex part support body 103 ... Resin pattern 201 ... Metal base material 202 ... Photosensitive resist layer 203 ... Convex pattern 204 ... Metal concave portion 205 ... Metal convex portion support 206 ... Resin film 207 ... Resin pattern 208 ... Metal film 301 ... Substrate 302 for printing ... High-definition relief 303 ... Plate Cylinder 304 ... Anilox roll 305 ... Ink replenishing device 306 ... Doctor 307 ... Ink 308 ... Ink pattern

Claims (6)

A printing relief plate used for supplying ink to the relief of the relief printing, printing the ink on the relief, and forming a pattern of ink on the surface of the printed material,
According to the required number or amount, a metal convex support 102 corresponding to the convex pattern of the printing relief plate is provided on the metal substrate 101, and the resin pattern 103 is at least the metal It is provided in contact with the upper portion of the convex support 102, and the end of the resin pattern 103 is provided so as to cover at least the end of the metal convex support 102. Letterpress for printing.   2. The relief printing plate for high-definition printing according to claim 1, wherein an area of a surface region of the resin pattern 103 is larger than a surface region of the metal convex support 102.   3. The relief printing plate for high-definition printing according to claim 1, wherein a thickness of the metal substrate 101 is 50 μm or more and 500 μm or less. 4. The relief printing plate for high-definition printing according to claim 1, wherein the metal base material 101 has a thermal expansion coefficient of 50 × 10 ⁻⁷ / ° C. or less. 5.   5. The relief printing plate for high-definition printing according to claim 1, wherein an average surface roughness of the metal convex support 102 is 0.1 μm or more.   The relief printing plate for high-definition printing according to any one of claims 1 to 5, wherein the viscosity of the coating liquid for forming the resin pattern 103 is 10 mPa · s or more and 10,000 mPa · s or less.