JP2009069071A - Manufacturing method of pointer board and manufacturing method of display panel for pointer board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance sealability of an organic EL element in the case that an organic EL display panel is used for a pointer board. <P>SOLUTION: Pixel electrodes 3 are formed on one surface of a transparent substrate 2 and a resist 8 is formed in an area where a pointer driving shaft is to be formed, of the surface on which the pixel electrodes 3 are formed, and a frame-shaped mask 9 is put on the circumference of the resist. In the state wherein the resist 8 and the mast 9 are provided, an organic EL layer 10 and an opposite electrode 12 are deposited on the pixel electrodes 3 sequentially. After the resist 8 and the mask 9 are removed, a center seal 15 is formed in the place where the resist 8 has been present, while a frame-shaped seal 16 is formed in the place where the mask 9 has been present, and a cover 17 is put from above on the center seal 15 and the frame-shaped seal 16. The transparent substrate 2 and the cover 17 are bored in portions where they are superposed on the center seal 15. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a pointer panel and a method for manufacturing a display panel for a pointer panel, and more particularly to a method for manufacturing a pointer panel with a display function and a method for manufacturing a display panel used for the pointer panel.

  In a needle type wristwatch, a needle type wall clock, a needle type clock, a needle type measuring instrument, etc., the time, measured value, etc. are represented by the position of the hand. A pointer board is provided on the back side of the needle, and a scale or the like is provided on the pointer board. A pointer drive unit is attached to the back of the pointer board, and a region where the pointer of the pointer board is formed is perforated, and a drive shaft of the pointer drive unit is passed through the hole, and a needle is provided on the front side of the pointer board. Is attached to the drive shaft.

In addition, pointer boards with various display functions are also used. For example, a liquid crystal display panel is provided on the front side of the pointer board, and various displays are performed on the liquid crystal display panel.
JP-A-11-202059

  By the way, there is a demand for not only a liquid crystal display but also a display panel using an organic EL (EL: Electro-Luminescence) element array for a pointer board. However, when outside air comes into contact with the organic EL element of the display panel, there is a problem that the organic EL element is likely to deteriorate, and it is necessary to seal the organic EL element in order to prevent such deterioration. As a sealing method, there is a method in which a frame-like seal is formed around the organic EL element array formed on the substrate and a cover is placed on the seal.

However, when an organic EL display panel is used for the pointer board, it is necessary to penetrate a hole for passing the drive shaft of the needle through the center of the display panel. For this purpose, a hole is formed in the center of the organic EL element array or the center of the cover, a seal is provided around the hole, and the seal is sandwiched between the organic EL element array and the cover around the hole. There is a need to. However, since the adhesion between the organic EL element array and the seal is not high, the sealability is not high. Furthermore, since the cross section of the organic EL element array exists on the wall surface of the hole, the organic EL element comes into contact with the outside air.
Therefore, an object of the present application is to improve the sealing performance.

In order to solve the above problems, according to the invention according to claim 1,
Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
With the resist remaining, an organic EL layer and a counter electrode are sequentially formed on the pixel electrode,
After removing the resist, forming a center seal where the resist was,
A method for manufacturing a pointer board is provided, wherein the substrate is perforated at a portion overlapping the center seal.

According to the invention of claim 2,
2. The pointer board according to claim 1, wherein a cover is placed on the center seal before drilling the substrate, and the cover is also drilled at a portion overlapping the center seal when the substrate is drilled. A method is provided.

According to the invention of claim 3,
Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
A frame-shaped mask is superimposed on the periphery of the surface on which the pixel electrode is formed,
An organic EL layer and a counter electrode are sequentially formed on the pixel electrode with the resist remaining and the mask being overlaid,
After removing the resist and the mask, forming a center seal where the resist was, forming a frame-shaped seal where the mask was,
A method for manufacturing a pointer board is provided, wherein the substrate is perforated at a portion overlapping the center seal.

According to the invention of claim 4,
4. The cover according to claim 3, wherein a cover is placed on the center seal and the frame-shaped seal before the substrate is drilled, and the cover is also drilled at a portion overlapping the center seal when the substrate is drilled. A method for manufacturing the pointer board is provided.

According to the invention of claim 5,
When forming the center seal, the center seal is formed in a ring shape,
5. The method for manufacturing a pointer board according to claim 1, wherein, when the substrate is drilled, the substrate is drilled in a portion overlapping a hole in a center portion of the center seal. The

According to the invention of claim 6,
Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
An organic EL layer and a counter electrode are sequentially formed on the pixel electrode in a state where the resist is left, and a method for manufacturing a display panel for a pointer board is provided.

According to the invention of claim 7,
Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
A frame-shaped mask is superimposed on the periphery of the surface on which the pixel electrode is formed,
An organic EL layer and a counter electrode are sequentially formed on the pixel electrode in a state where the resist is left and the mask is overlaid, and a method for manufacturing a pointer panel display panel is provided.

According to the present invention, the organic EL layer and the counter electrode are stacked on the pixel electrode in a state where the resist remains in the region where the pointer drive shaft is formed and the mask is overlaid. No organic EL layer or counter electrode is formed. And since the center seal | sticker was formed in the location with a resist and the frame-shaped seal was formed in the location with a mask, the adhesiveness of a center seal or a frame-shaped seal is high. Therefore, the sealing performance can be increased.
The resist provided in an island shape in the region where the pointer drive shaft is formed is separated from the surrounding mask. However, since the resist is a resist, the resist is not easily displaced when the organic EL layer or the counter electrode is formed. Therefore, it is possible to reliably prevent the organic EL layer and the counter electrode from being formed in the determined central portion.
Moreover, although the part which overlaps with a center seal is perforated, since the organic EL layer and the counter electrode are not formed in that part, the organic EL layer and the counter electrode are not exposed on the wall surface of the hole. Therefore, it is possible to prevent the organic EL layer and the counter electrode from contacting the outside air.

  Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. However, although various technically preferable limitations for implementing the present invention are given to the embodiments described below, the scope of the invention is not limited to the following embodiments and illustrated examples.

  When manufacturing a pointer board with a matrix display function, first, a transparent substrate 2 made of glass or plastic is prepared as shown in FIGS. Although the transparent substrate 2 is used as the substrate, a transparent flexible sheet may be used as the substrate.

A transparent conductive film is formed on one surface of the transparent substrate 2 by a vapor deposition method (for example, sputtering method, vapor deposition method, etc.), and the conductive film is formed into a plurality of pixels by a photolithography method and an etching method. Shape the electrode 3. When the pixel electrodes 3 are formed, the pixel electrodes 3 are arranged in a two-dimensional array. The pixel electrode 3 is made of, for example, tin-doped indium oxide (ITO), zinc-doped indium oxide, indium oxide (In ₂ O ₃ ), tin oxide (SnO ₂ ), zinc oxide (ZnO), or cadmium-tin oxide (CTO). It consists of Note that the pixel electrode 3 becomes an anode electrode of the organic EL element.

  Subsequently, the transistor layer 4 is formed on one surface of the transparent substrate 2 by appropriately performing a vapor deposition method, a photolithography method, an etching method, and a resist removing process on one surface of the transparent substrate 2. The transistor layer 4 constitutes an active matrix driving circuit. The active matrix driving circuit includes a plurality of signal lines, a plurality of scanning lines orthogonal to the signal lines in plan view, and intersections of the signal lines and the scanning lines. The thin film transistor 5 and the like disposed in the. The active matrix driving circuit may have any circuit configuration, and the number of thin film transistors 5 provided per pixel does not limit the present invention.

  In forming the transistor layer 4, an overcoat layer 6 is formed, and the thin film transistor 5 is covered with the overcoat layer 6. Further, the overcoat layer 6 is patterned to form openings 7 at locations corresponding to the respective pixel electrodes 3. Thereby, the pixel electrode 3 is exposed.

  A plurality of pixel electrodes 3 may be formed on the overcoat layer 6 after forming the transistor layer 4.

  Next, a negative resist film is formed on the surface on which these transistor layers 4 are formed, and the central portion of the negative resist film is exposed in a circular shape. When exposing, it is preferable to reduce the amount of light. When the resist film is developed with a developer, the unexposed part is removed and the exposed part 8 remains as shown in FIGS. Here, when the amount of light at the time of exposure is lowered, the shape of the remaining resist 8 becomes a truncated cone shape whose diameter decreases toward the transparent substrate 2 side. Thus, since the photoresist method is used, the residual resist 8 can be formed in an island shape in the region where the pointer drive shaft is formed, and the residual resist 8 is not easily displaced. The resist may be a positive type, but in that case, the exposed portion and the unexposed portion are reversed with respect to the negative type.

Next, the frame-shaped mask 9 is overlaid on the transparent substrate 2 along the edge portion of the transparent substrate 2. In addition, although it is preferable to overlap this mask 9, it is not necessary to overlap this mask 9. FIG.
Next, as shown in FIG. 5, the organic EL layer 10 is formed by vapor deposition. Then, in the portion where the residual resist 8 and the mask 9 do not overlap, the organic EL layer 10 is laminated on the plurality of pixel electrodes 3, and the same material as the organic EL layer 10 is formed on the residual resist 8 and the mask 9. Layer 11 is formed. Here, when forming the organic EL layer 10, only the light emitting layer may be formed and the light emitting layer may be used as the organic EL layer 10, or the hole transport layer and the light emitting layer are sequentially laminated to form the laminate. The organic EL layer 10 may be used, the light emitting layer and the electron transport layer may be stacked in order, and the laminate may be used as the organic EL layer 10, or the hole transport layer, the light emitting layer, and the electron transport layer may be stacked in order. The laminate may be the organic EL layer 10. Note that the organic EL layer 10 may be formed by another vapor deposition method, or the organic EL layer 10 may be formed by a coating method. In addition, the organic EL layer 10 may be formed for each pixel by a printing method instead of forming the organic EL layer 10 on one side so as to be common to a plurality of pixels.

Next, the counter electrode 12 is formed by vapor deposition (evaporation, sputtering, etc.). Then, the counter electrode 12 is laminated on the organic EL layer 10 in the portion where the residual resist 8 and the mask 9 do not overlap, and the layer 13 of the same material as the counter electrode 12 is formed on the residual resist 8 and the mask 9. It is formed. The counter electrode 12 thus formed serves as a cathode electrode of the organic EL element. The display panel 40 for the pointer board is obtained through the above steps. The organic EL layer 10 and the counter electrode 12 may be sequentially formed without overlapping the mask 9.
Next, the mask 9 is removed and the residual resist 8 is removed with a removing solution.

Next, as shown in FIG. 6, a protective metal film 14 is formed in a region where the pointer driving shaft is formed in the central portion where the organic EL layer 10 and the counter electrode 12 are not formed (where the residual resist 8 is present). Film.
Next, as shown in FIGS. 6 to 7, a ring-shaped center is formed in a region where the organic EL layer 10 and the counter electrode 12 are not formed and where the pointer drive shaft is formed (where the residual resist 8 is present). While printing the seal | sticker 15, the frame-shaped seal | sticker 16 is printed in the surrounding part (location | part with the mask 9) in which the organic EL layer 10 and the counter electrode 12 are not formed. The seal 15 may be circular instead of ring-shaped, but when the seal 15 is ring-shaped, the seal 15 does not get tangled with the drill. In addition, when the organic EL layer 10 and the counter electrode 12 are formed without overlapping the mask 9, the frame-shaped seal 16 is printed on the counter electrode 12 and in the periphery thereof.

  Next, as shown in FIG. 8, the surface on which the organic EL layer 10 and the counter electrode 12 are formed is covered with a glass cover 17 from above the seals 15 and 16, and the cover 17 is joined to the seals 15 and 16. Note that a hole may be formed in advance in the center of the cover 17, and in this case, the peripheral portion of the seal 15 overlaps the edge portion of the hole of the cover 17.

Next, as shown in FIG. 9, the center portion of the transparent substrate 2 and the cover 17 is drilled with a drill, and a center hole 18 having a diameter smaller than the diameter of the residual resist 8 is formed in the center portion. Thus, the transparent substrate 2, the cover 17, the overcoat layer 6, and the protective metal film 14 can be drilled simultaneously. Here, the portion to be perforated is a portion that overlaps the hole 19 at the center of the seal 15. Thus, the pointer board 1 is completed.
In addition, when the seal | sticker 15 is not ring shape but circular shape, the center part of the seal | sticker 15 is also drilled with a drill. When a hole is formed in advance in the center of the cover 17, a center hole 18 is formed in the transparent substrate 2, and the hole formed in the cover 17 and the center hole 18 are connected.

  Next, as shown to FIGS. 10-11, the translucent decorative board 20 is affixed with respect to the obtained pointer board 1. FIG. Specifically, a translucent decorative board 20 having a hole in the center is attached to the surface opposite to the surface on which the transistor layer 4 is formed.

  Next, the pointer drive unit 21 is attached to the cover 17 by passing the drive shaft 22 of the pointer drive unit 21 through the center hole 18. Next, the pointer 23 is attached to the drive shaft 22. The pointer driving unit 21 rotates the pointer 23.

  The pointer board 1 is used for timepieces, measurements, and the like. The number of hands 23, the operation of the pointer driving unit 21, the display of the translucent decorative board 20, and the like are in accordance with the use of the pointer board 1. . In this pointer board 1, the transparent substrate 2 serves as a display surface. The cover 17 may be a display surface. In this case, the transparent substrate 2 and the pixel electrode 3 may not be transparent, but the cover 17 and the counter electrode 12 need to be transparent.

  As described above, according to the present embodiment, since the organic EL layer 10 and the counter electrode 12 are stacked on the pixel electrode 3 with the resist 8 remaining in the center and the mask 9 overlapped, the organic EL layer Even after laminating 10 and the counter electrode 12, the organic EL layer and the counter electrode are not formed in the portion overlapping the resist 8 and the mask 9, and the overcoat layer 6 is exposed. And since the center seal | sticker 15 was formed in the location with the resist 8, and the frame-shaped seal | sticker 16 was formed in the location with the mask 9, the adhesiveness of the center seal | sticker 15 and the frame-shaped seal | sticker 16 is high. Therefore, the sealing performance can be increased.

  In addition, the transparent substrate 2 and the cover 17 are perforated in a portion overlapping the center seal 15, but the organic EL layer 10 and the counter electrode 12 are not formed in the portion, so that the organic EL is formed on the wall surface of the center hole 18. The layer 10 and the counter electrode 12 are not exposed. Therefore, the organic EL layer 10 and the counter electrode 12 can be prevented from contacting the outside air.

  In addition, since the cover 17, the center seal 15 and the frame-shaped seal 16 are provided before the formation of the center hole 18, chips during drilling do not adhere to the counter electrode 12. Therefore, the counter electrode 12 can be protected.

In addition, this invention is not limited to the said embodiment, What changed various design with respect to the said embodiment is also contained in the scope of the present invention.
In the above embodiment, the cover 17 is overlapped and joined before the center hole 18 is formed, but the center hole 18 may be formed by a drill without overlapping the cover 17. In that case, it is more preferable to overlap the cover 17 after the center hole 18 is formed. A hole is formed in advance in the center of the cover 17 to be overlapped after the formation of the center hole 18, and the hole of the cover 17 overlaps the center hole 18 when the cover 17 is overlapped and joined.

FIG. 1 is a plan view showing a state in which pixel electrodes are formed in a method for manufacturing a pointer board. 2 is a cross-sectional view taken along the line II-II in FIG. FIG. 3 is a plan view showing a state where a resist and a mask are applied in the method of manufacturing the pointer board. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. FIG. 5 is a cross-sectional view showing a state in which the organic EL layer and the counter electrode are formed in the method for manufacturing the pointer board. FIG. 6 is a cross-sectional view showing a state in which a seal is applied in the method of manufacturing the pointer board. FIG. 7 is a plan view showing a state in which a seal is applied in the method of manufacturing the pointer board. FIG. 8 is a cross-sectional view showing a state in which a cover is applied in the method for manufacturing the pointer board. FIG. 9 is a cross-sectional view showing a state in which a hole is provided in the method for manufacturing the pointer board. FIG. 10 is a plan view showing a state in which a pointer or the like is attached to the pointer board. 11 is a cross-sectional view taken along the line XI-XI in FIG.

Explanation of symbols

2 transparent substrate 3 pixel electrode 8 resist 9 mask 10 organic EL layer 12 counter electrode 15 center seal 16 frame-shaped seal 17 cover 18 center hole 19 hole 40 display panel

Claims (7)

Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
With the resist remaining, an organic EL layer and a counter electrode are sequentially formed on the pixel electrode,
After removing the resist, forming a center seal where the resist was,
A method for manufacturing a pointer board, wherein the substrate is perforated at a portion overlapping the center seal.   2. The pointer board according to claim 1, wherein a cover is placed on the center seal before drilling the substrate, and the cover is also drilled at a portion overlapping the center seal when the substrate is drilled. Method. Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
A frame-shaped mask is superimposed on the periphery of the surface on which the pixel electrode is formed,
An organic EL layer and a counter electrode are sequentially formed on the pixel electrode with the resist remaining and the mask being overlaid,
After removing the resist and the mask, forming a center seal where the resist was, forming a frame-shaped seal where the mask was,
A method for manufacturing a pointer board, wherein the substrate is perforated at a portion overlapping the center seal.   4. The cover according to claim 3, wherein a cover is placed on the center seal and the frame-shaped seal before the substrate is drilled, and the cover is also drilled at a portion overlapping the center seal when the substrate is drilled. Method of manufacturing the pointer board. When forming the center seal, the center seal is formed in a ring shape,
5. The method for manufacturing a pointer board according to claim 1, wherein, when the substrate is drilled, the substrate is drilled in a portion overlapping with a hole in a center portion of the center seal. Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
An organic EL layer and a counter electrode are sequentially formed on the pixel electrode in a state where the resist is left. A method for manufacturing a display panel for a pointer board, comprising: Forming a pixel electrode on one side of the substrate;
Forming a resist in a region where the pointer drive shaft is formed on the surface on which the pixel electrode is formed;
A frame-shaped mask is superimposed on the periphery of the surface on which the pixel electrode is formed,
A method for manufacturing a display panel for a pointer board, wherein an organic EL layer and a counter electrode are sequentially formed on the pixel electrode in a state where the resist is left and the mask is overlaid.

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