JP2009064930A - Metallized film capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem, wherein the adhesiveness of a dielectric layer formed between a dielectric film and a metal vapor deposition electrode to the dielectric film and the metal vapor deposition electrode deteriorates, and thereby the characteristics as a capacitor deteriorate. <P>SOLUTION: A metallized film 10 that includes: the dielectric layer 12 formed on the dielectric film 11 and made of a resin monomer; and a metal vapor deposition electrode 13 formed so that an insulating margin 11a is provided at one end on the dielectric layer 12. In a metallized film capacitor, the pair of metallized films 10 are configured so that the metal vapor deposition electrode 13 is made to oppose, via the dielectric film 11 so that the insulating margins 11a are located on mutually opposite sides. The dielectric layer 12 is a film formed by performing polymerization reaction on a resin monomer, and the resin monomer has two different polymerization-reactive functional groups within the same molecule. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a metallized film capacitor.

  Conventionally, a resin film has been used as a dielectric film used for a capacitor or the like. As shown in Patent Document 1, Patent Document 2, and Patent Document 3, such a dielectric film is formed by irradiating a resin monomer deposited on a substrate with an electron beam or ultraviolet rays and curing the resin monomer. ing.

  As a resin monomer for forming the dielectric film, for example, bis (vinylbenzyl) methyl represented by the following chemical formula (A) has been used.

Japanese Examined Patent Publication No. 63-32929 JP 11-147272 A US Pat. No. 5,125,138

  However, an electronic component using a dielectric film formed of the resin monomer of the chemical formula (A), which is the resin monomer, has a problem of low polymerizability. When the polymerizability is low, the adhesion between the dielectric film and the metal vapor deposition electrode formed on the dielectric film is lowered, and the characteristics as a capacitor may be lowered.

  Therefore, in order to solve the problem of a decrease in adhesion to the dielectric film, an object of the present invention is to provide a compound that easily undergoes a polymerization reaction and to provide an electronic component having good characteristics.

  In order to solve the above problems, an electronic component of the present invention is a metallized film capacitor including a dielectric film formed on a dielectric film, wherein the dielectric film includes a thin film containing at least one resin monomer. A film formed by polymerizing a resin monomer in a thin film after being formed, and the resin monomer is characterized in that a vinyl group and an ester group are bonded via an aromatic ring or an aliphatic chain. To do. According to the above compound, a metallized film capacitor that is easily polymerized and has good characteristics can be obtained.

  According to the metallized film capacitor of the present invention, the adhesion between the dielectric film and the metal vapor-deposited electrode is improved. A capacitor is obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of a metallized film according to Embodiment 1 of the present invention.

In FIG. 1, a metallized film 10 is formed by forming a dielectric film 12 made by polymerizing a resin monomer (not shown) on a dielectric film 11 made of polyethylene terephthalate, polypropylene, or the like. A metal deposition electrode 13 made of aluminum or the like is formed thereon. This resin monomer is represented by the following general formula (1) having two different functional groups having polymerization reactivity in the same molecule.
General formula (1)
A-X-B
A is a vinyl group.
B is an acrylate group or a methacrylate group.
X represents an aliphatic chain, an alkylene oxide chain, an aromatic (polynuclear) ring, or an aromatic heterocyclic ring.

  FIG. 2 is a perspective view of the metallized film capacitor element.

  In FIG. 2, a capacitor element 14 is a dielectric film 10 having a dielectric film 11 formed with an insulation margin 11a on which one of the metal deposition electrodes 13 is not deposited on one end of the dielectric film 11 so that the insulation margins 11a are opposite to each other. It is wound so that the metal vapor deposition electrode 13 faces through the film 11.

  A lead electrode is provided by, for example, injecting molten metal from both end faces of the capacitor element 14 thus configured, and a metallized film capacitor is produced as an external terminal using a lead wire or a bus bar.

  Here, the point that the dielectric film 12 represented by the general formula (1) is formed between the dielectric film 11 and the metal vapor deposition electrode 13 is one of the technical features of the present invention. Thus, conventionally, depending on the structure of the resin monomer contained in the dielectric film, it does not have a functional group that contributes to adhesion, and adhesion to either the dielectric film or the metal deposition electrode is reduced. On the other hand, according to the present invention, since unpaired electrons present in the oxygen atom of the ethylene oxide chain of the resin monomer in the dielectric film 12 cause intermolecular bonding force, the dielectric film 11 and metal deposition With respect to each of the electrodes 13, the dielectric film 12 can generate adhesion due to intermolecular bonding force.

  In particular, according to the present invention, since the resin monomer has an ester in addition to the ethylene oxide chain, the adhesion effect becomes more prominent.

  According to the present invention, the unpaired electrons present in the oxygen atom of the carbonyl group of the resin monomer in the dielectric film 12 cause an intermolecular bonding force. The dielectric film 12 can generate adhesion due to intermolecular bonding force.

  As described above, when the dielectric film 11 and the metal vapor deposition electrode 13 are improved in adhesion by the dielectric film 12, peeling between the dielectric film and the metal vapor deposition electrode is suppressed even under an environment of high humidity and high temperature. Therefore, there is an effect of preventing characteristic deterioration due to capacity reduction.

  In the embodiment of the present invention, the metallized film 10 is formed by single-sided vapor deposition. However, this may be a double-sided vapor-deposited one or a dielectric film, and the capacitor element 14 is wound. However, it may be a laminated type.

(Embodiment 2)
FIG. 3 is a cross-sectional view of the metallized film according to Embodiment 2 of the present invention.

  The same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In FIG. 3, the difference from the first embodiment is that a dielectric film 15 is further formed on the metal vapor deposition electrode 13.

The dielectric film 15 is obtained by polymerizing a resin monomer, and the resin monomer is represented by the following general formula (1).
General formula (1)
A-X-B
A is a vinyl group.
B is an acrylate group or a methacrylate group.
X represents an aliphatic chain, an alkylene oxide chain, an aromatic (polynuclear) ring, or an aromatic heterocyclic ring.

  Here, the resin monomer of the dielectric film 15 may be the same as the resin monomer of the dielectric film 12. By making it the same, it is possible to make it the same as the production | generation process of the dielectric material film 12, and it becomes possible to hold down manufacturing cost compared with the case where it makes different.

  By forming the dielectric film 15 in this way, when the metallized film 16 is wound as shown in FIG. 2, the dielectric film 11 is positioned above the metal vapor deposition electrode 13. Thus, unpaired electrons existing in oxygen atoms of the carbonyl group of the resin monomer in the dielectric film 15 cause intermolecular bonding force, and the dielectric film 15 and the metal vapor deposition electrode 13 are respectively applied to the dielectric film 15. It is possible to generate adhesion due to intermolecular bonding force.

  In particular, according to the present invention, since the ester is contained as the carbonyl group of the resin monomer, the adhesion effect becomes more prominent.

  As described above, when the dielectric film 11 and the metal vapor deposition electrode 13 are improved in adhesion by the dielectric film 15, the peeling between the dielectric film and the metal vapor deposition electrode is further suppressed even in an environment of high humidity and high temperature. Therefore, the effect of preventing characteristic deterioration due to a decrease in capacity is further exhibited.

  In the embodiment of the present invention, the metallized film 16 is formed by single-sided vapor deposition, but this may be double-sided vapor-deposited or dielectric film, and the capacitor element 14 is wound. However, it may be a laminated type.

  EXAMPLES Hereinafter, although the synthesis | combining method of this invention is further demonstrated in detail according to an Example, this invention is not limited to this Example.

Example 1
First, a method for synthesizing a compound represented by the following chemical formula (a1) will be described.

  Here, the starting materials are 15.6 g (0.10 mol) of the compound represented by the chemical formula (b1) and 6.2 g (0.1 mol) of acrylic acid represented by the chemical formula (c1).

  Therefore, first, in addition to the above raw materials, 0.2 g of p-toluenesulfonic acid and 200 ml of toluene are put into a 250 ml flask equipped with a stirring blade and reacted at 110 ° C. for 24 hours with stirring.

  Next, after completion | finish of reaction, sodium sulfate aqueous solution is added, aqueous solution is isolate | separated with a separatory funnel, and p-toluenesulfonic acid is removed.

  After this, toluene is distilled off and the reaction mixture is dissolved in hexane and cooled to 0 ° C. to remove unreacted succinic acid.

  Furthermore, hexane is distilled off, the reaction mixture is washed with methanol, and the unreacted chemical formula (b1) is removed to obtain a compound represented by the chemical formula (a1) free from starting materials and by-products. it can.

  This compound (a1) can be confirmed to be the target compound by IR, GPC and FD-MS.

By infrared spectrum specific to this compound, respectively, the IR absorption peak of the absorption peak and alcohol 3330Cm ^-1 of 1705 cm ^-1 of the carboxylic acid disappeared, the absorption peak of 1760 cm ^-1 of the ester appears In GPC, neither chemical formula (b1) nor acrylic acid is detected, and in FD-MS, it can be confirmed by having a main peak at m / e 200.

  In place of acrylic acid, the compound represented by the chemical formula (c2) may be used to produce the compound represented by the chemical formula (a2) by the same method as the compound represented by the chemical formula (a1). Is possible.

  Similarly, using the compound represented by the chemical formula (c3), the compound represented by the chemical formula (a3) is transformed into the chemical formula (a4) using the compounds represented by the chemical formula (b4) and the chemical formula (c4). The compounds shown can be made.

  As a method of forming a dielectric film using the chemical formulas (a1) to (a4) obtained as described above as a resin monomer, the resin monomer is first vaporized under a reduced pressure to form a uniform film on the dielectric film. .

  Next, a method was used in which a dielectric film was formed by curing polymerization by applying heat to the formed resin monomer or by irradiating ultraviolet rays or electron beams.

(Example 2)
Resin monomers (a1) to (a3) represented by chemical formulas (a1) to (a3) obtained in Example 1 are used as dielectric film 12 as shown in FIG. 1 on dielectric film 11 made of polypropylene. A peel test in the direction of 90 ° by peeling using an adhesive tape was performed on the aluminum vapor-deposited electrode 13 formed on the substrate. It shows that adhesiveness is so high that the peel strength (g / cm) at the time of peeling is large.

  As a comparative example, an acrylate dielectric film 12 was used.

  First, the peel strength between the metal vapor deposition electrode 13 and the dielectric film 12 is shown in (Table 1).

  Here, as a comparative example, a dielectric film 11 having a metal vapor deposition electrode 13 directly formed thereon without using the dielectric film 12 was used.

  In Table 1, in the resin monomers (a1) to (a3) and the acrylate, no metal peeling was observed on the tape side, but those without the dielectric film 12 showed some metal peeling on the tape side. .

  Next, Table 2 shows the peel strength between the dielectric film 12 and the dielectric film 11.

  In Table 2, the peel strength was not changed in all cases, but when the acrylate of the comparative example was used for the dielectric film 12, the dielectric film 12 was partially peeled off, and the dielectric film made of acrylate This shows that the adhesiveness to the 12 dielectric films 11 is low.

  As described above, according to the dielectric film made of the resin monomer according to the embodiment of the present invention, the adhesion is improved. Therefore, according to the metallized film capacitor using the dielectric film capacitor, the environment under high humidity or high temperature is used. Can also be obtained which has good characteristics and high reliability.

  Since the electronic component according to the present invention has high adhesion to the dielectric film and the metal vapor deposition electrode in the dielectric film, and the reliability is improved, when the capacitor is used in an environment of high humidity and high temperature, the It is effective.

Sectional drawing of the metallized film in Embodiment 1 of this invention Perspective view of the metallized film capacitor element Sectional drawing of the metallized film in Embodiment 2 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 16 Metallized film 11 Dielectric film 11a Insulation margin 12, 15 Dielectric film 13 Metal vapor deposition electrode 14 Capacitor element

Claims (2)

In a metallized film comprising a dielectric film made of a resin monomer formed on a dielectric film and a metal vapor-deposited electrode formed so as to provide an insulating margin at one end on the dielectric film, A metallized film capacitor in which the metallized film capacitor is opposed to the metallized film through the dielectric film so that the insulation margins are opposite to each other, wherein the dielectric film is formed of the resin monomer. Wherein the resin monomer is a compound having two different functional groups having polymerization reactivity in the same molecule represented by the chemical formula (1). Film capacitor.
Formula (1) AX-B
A is a vinyl group.
B is an acrylate group or a methacrylate group.
X represents an aliphatic chain, an alkylene oxide chain, an aromatic (polynuclear) ring, or an aromatic heterocyclic ring. A dielectric film made of a resin monomer formed on a dielectric film, a metal vapor deposition electrode formed so as to provide an insulation margin at one end of the dielectric film, and further formed on the metal vapor deposition electrode A metallized film comprising the dielectric film, wherein the metal vapor deposition electrodes face each other through the dielectric film so that the insulation margins are opposite to each other. The dielectric film is a film formed by polymerizing the resin monomer, and the resin monomer has two different functional groups having polymerization reactivity in the same molecule. A metallized film capacitor characterized by being a compound.
Formula (1) AX-B
A is a vinyl group.
B is an acrylate group or a methacrylate group.
X is an aliphatic chain, an alkylene oxide chain, an aromatic (polynuclear) ring, or an aromatic heterocyclic ring.

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