JP2009059304A - Method for communicating with chip of information storage device and information storage device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an information storage device having a chip which processes a normal signal obtained through contact or non-contact communication while performing prescribed and more complicated processing that requires excitation of a chip sensor by a CPU, and a plurality of chip sensors. <P>SOLUTION: The information storage device is provided with: a chip (10) for storing information and energy (16) for contact or non-contact inductive communication; and a plurality of chip sensors (12) which can be excited, are integrated into the chip (10), and transfer a signal (26) to the CPU (28) of the chip (10) after being excited (14), and processes the signal (26) by the CPU (28). This invention is characterized in that the excitation (14) of the chip sensors (12) can be adjusted by the chip (10) and can be adapted to processing requirements of the signal (26) by the CPU (28) independently of the storage of the information and energy (16) by the chip (10) in order to additionally store information. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention includes a chip for storing information and energy for contact or non-contact inductive communication, and a plurality of excitable sensors that are integrated in the chip and transmit signals to the chip CPU after excitation. And an information storage device that processes the signal by the CPU.

  The present invention also relates to a method of communicating using a chip integrated with an information storage device, and a plurality of sensors integrated with information and energy for contact or non-contact inductive communication stored in the chip. These chip sensors transmit signals to the CPU for processing.

  An information storage device having a chip, also called a data carrier, is widely known in the art and forms part of a machine-readable passport (MRTD), for example, usually comprising a chip on a semiconductor substrate, This makes it possible to store and process complex (biological measurement) information.

Information storage devices with chips are also used for value certificates and securities such as chip cards, smart cards, personal documents, passports, driver's licenses, checks and banknotes. In particular, chip cards have chip modules integrated into the card body, but they are increasingly used in new fields of daily life, but on the other hand have become a natural part of modern life. Yes. The card body can be made of various materials. Suitable materials include, for example, polyvinyl chloride, polycarbonate, acrylic butadiene styrene, polyethylene terephthalate, (thermoplastic) polyurethane (T) PU, or paper and cardboard, but paper, photo paper or DuPont Tyvek. Also interesting are composites / laminates of synthetic materials with special materials such as (Tyvek). The components of the card are called card elements. Important card elements include, for example, foil and printing color or ink. Card elements such as MLI (Multiple Laser Image), OVI (Optically Variable Ink), UV color or fluorescent color are also important. There are various methods for manufacturing an information storage device, particularly a lamination technique and an injection molding technique. Non-patent document 1, for example, is an extensive description of materials and manufacturing methods for information storage devices.
Y. Hashiri / Th. By Tarantino, “Vom Plasik zur Chipkarte” (“Plastic to IC Card”), Carl Hanser Publishers, Munich, Vienna, 1999, Chapter (2): “Kartenkorper” (“Card Body”) and “Cart” Herstelungsformen fur Kartenkorper (“card body manufacturing method”)

  A normal chip module built in the card body is substantially independent of the type of surrounding material. For the chip, it is not a “problem” whether the target of incorporation is a PVC injection molded card, a PC compound or a PET adhesive label. Communication or data exchange with the chip can be realized either by contact or contactless (RFID technology) in the usual way. In RFID technology, communication is achieved by magnetic or electromagnetic fields.

  The MRTD integrated chip module is enabled / disabled in a normal manner by exchanging data between the chip module and the inspection station. This can also be realized with RFID technology. In this case, the inspection station “certifies” to the chip that it has predetermined secret information. This recognition proves to the chip that the inspection station is authorized to read the contents of the chip, for example. This process is also referred to as conventional authentication.

  Today's chips also have multiple on-chip sensors. These on-chip sensors allow proper operation of the chip by monitoring external environmental parameters such as temperature, energy supply and light incidence.

Such a plurality of on-chip sensors are known from Patent Document 1, for example. This known sensor is an additional component of the chip in a smart card (page 2, column 1, lines 2-8) and is used to detect changes in the product or its environment (page 1, page 1). Column 2, [0013]).
US Patent Application Publication No. 2002/0186145

  Further, as is known from the prior art, the plurality of on-chip sensors can include, for example, an optical sensor, a temperature sensor, a frequency sensor, and additional sensors. When these sensors are energized, they transmit signals to the chip CPU where they are processed. Typically, the sensor communicates with the CPU in one of two ways. One method is to trigger an exception signal and handle the exception signal appropriately by the operating system (and repeat the operation, stop the operation, or verify the operation result in detail, for example). It is a way. Another method is to trigger a warm reset by the sensor, that is, let the CPU completely suspend the program being processed and repeat it again from the beginning. This is a fairly thorough approach and applies to sensors that are usually considered important.

  In this way, a chip having a plurality of on-chip sensors known from the prior art is such that these sensors integrated in the chip mainly detect general changes in external parameters to detect exception signals and warm reset. It can be seen that it is used to communicate with the CPU. Thus, the way in which a chip performs certain specific processing and operations within a CPU that requires a specific composite optical signal, for example, is naturally limited beyond conventional methods based on, for example, RFID technology. Given the current state of the art, conventional RFID signals cannot be processed in-chip along with complex signals that result from specific complex sensor excitations and lead to new complex processes.

  Therefore, the present invention allows the CPU not only to process normal signals obtained from contact or non-contact communication, but also to perform predetermined and more complex processing that requires excitation of the chip sensor. An object of the present invention is to provide an information storage device having a chip and a plurality of chip sensors.

  This object is achieved by the features defined in claim 1.

  The present invention is not configured so that the CPU of the chip is adapted only to reception of a conventional signal generated by contact or non-contact inductive communication and activation by the signal, but by a chip sensor integrated in the chip. It is based on the recognition that it can be adapted to fit signals that are physically supplied independently. In this way, a further communication method with the chip is added to the conventional communication method, and this method is particularly suitable for transmitting a composite signal necessary for a specific excitation to the CPU. The chip's CPU that processes the composite signal can also activate the chip for further processing, eg, beyond the scope of conventional authentication. For example, a signal transmitted by a conventional communication mode and a signal transmitted through a separate physical connection by a chip sensor may be processed together in the CPU to trigger further processing in the chip. it can.

  In addition, the plurality of chip sensors preferably allow excitation to be adjusted specifically, and communicate with a filter material adapted to the signal processing requirements of the CPU, that is, exchange the signals. This allows chemical / physical phenomena depending on a given material to be utilized for a specific excitation. By using filter material that communicates with the chip sensor, a chemical-physical “filtering” that allows only a certain specific excitation of the chip sensor is generated to a certain size, so that the chip is in a “correct” material environment. Can only be able to function. In this way, the material properties are combined with the chip to form one functional unit. The chip functions only in a “correct” material environment. Conversely, in such a controlled material environment, the hardware characteristics of the chip can be verified using a prescribed hardware signature.

  Information storage devices with chips are often used, for example, in chip cards, personal documents and checks, so these materials can be used as filter media. Preferably, the filter material is made of a card material, and the filter material is made of a document material.

  The document material is preferably formed as a material imprint or additional material.

  A further preferred embodiment of the present invention is characterized in that the plurality of chip sensors include optical sensors that detect excitation of the pulsed laser beam. Since this optical sensor detects the excitation of the pulsed laser beam, it generates various optical excitation profiles (signal waveforms). The excitation profile created in this way is suitable for transmitting composite information to the chip.

  It is advantageous for the CPU to perform a synthesis processing operation on a signal of contact or non-contact inductive communication and a signal supplied by a plurality of chip sensors. In such composite communication, the binary code can be divided into two information paths and configured into an actual code in the CPU. Thus, for example, a logic “0” can be sent by triggering a warm reset using a normal information path. A logic “1” is communicated by triggering a photosensor and thus a warm reset (the origin of the photosensor is characterized by a state variable). By repeatedly querying the state variables, the CPU finally assembles the information to be communicated from the individual pieces of information.

  The plurality of chip sensors include optical sensors, and the filter material is not transmissive to light having a wavelength of less than 800 nm and is transmissive to light having a wavelength of 800 to 1100 nm. It is preferable that the UC converter adjacent to the card material and the interference filter laminated body adjacent to the UC converter, and the pulse laser beam first penetrates the card material and then enters the UC converter. According to ISO 7810, normal card materials are only transmissive in the NIR (near infrared) region of wavelengths between 800 and 1100 nm, so a pulsed laser beam in this wavelength region preferably excites the optical sensor, preferably specifically. Thus, various excitation profiles can be generated. As a result, a correspondingly programmed CPU processes the composite signal, which in combination with the “conventional” RFID signal activates the chip for further processing.

  Alternatively, the plurality of chip sensors include optical sensors, the filter material is composed of a card material and a matrix that generates modulated luminescence adjacent to the card material, and the pulse laser beam first penetrates the card material. Then, it is possible to invade the matrix. Such specific pulse excitation is distinct from conventional exception routines and triggers routines that lead complex operations to the CPU.

  Alternatively, the plurality of chip sensors include at least two different optical sensors having the same or different filter materials, the filter materials are made of card materials, and a pulsed laser beam penetrates the filter materials to excite the optical sensors. These optical sensors transmit signals to the CPU separately. This has the advantage that the information can be divided into different light wavelengths. This can be used, for example, to implement ternary logic.

  Further, the plurality of chip sensors include an optical sensor, and the filter material includes an optical converter that shifts the wavelength and a card material adjacent to the optical converter, and the card material is transmissive in a wavelength range of 800 to 1100 nm. In addition, it is preferable that the pulse laser beam penetrates only the optical converter. Such a filter material has an advantage that a composite light excitation profile can be generated although it consists of only two layers of an optical converter and a card material.

  The information storage device according to the present invention is advantageously integrated into a value ticket or a security. This takes into account the fact that information storage is often used for value certificates and securities.

  Furthermore, the information storage device according to the present invention can be used in a method of communicating with a chip integrated in an information storage device as defined in claim 13. Here, information and energy for contact or non-contact inductive communication is stored in the chip, and independently, multiple chip sensors integrated in the chip are excited, and these chip sensors are used for processing signals. Tell the CPU for The excitation is preferably tailored specifically by the chip for further information storage and adapted to the processing requirements in the CPU.

  Also, the chip sensor can be made to communicate with a filter material that preferably adjusts the excitation, preferably specifically, and adapts to the signal processing requirements of the CPU. On the other hand, an optical sensor that detects excitation of a pulsed laser beam is integrated with a plurality of chip sensors.

  These and other aspects of the invention will be apparent from and will be elucidated with reference to the embodiments described hereinafter.

  FIG. 6 shows a plurality of conventional chip sensors 12 that can properly operate the chip 10 by monitoring external environmental parameters such as temperature, power supply voltage, clock frequency and light incidence, for example. Like that. The plurality of chip sensors 12 includes an optical sensor 18, a temperature sensor 20, a frequency sensor 22 and a further sensor 24. When excitation 14 occurs in the chip sensor 12, the chip sensor 12 transmits a signal 26 to the CPU 28 of the chip 10, where the signal 26 is processed. There are essentially two ways to process such a signal 26. In one method, CPU 28 generates an “exception” signal that is further processed by the operating system of chip 10. After introduction into the induced electromagnetic field 50, the operating system of the chip 10 expects a well-defined sequence of various exception signals triggered by the chip sensor 12. Thus, the optical sensor 18 can first trigger an exception signal, and then the temperature sensor 20 can trigger the exception signal. Finally, only after the frequency sensor 22 also triggers an exception signal, the chip 10 can perform conventional authentication via a contact or non-contact interface to perform conventional authentication.

  Another method is a warm reset of the chip triggered by the CPU. After introduction into the induced electromagnetic field 50, the operating system of the chip 10 expects a well-defined sequence of warm reset. The first warm reset triggers the light sensor 18 and the second warm reset triggers the temperature sensor 20. Finally, a third warm reset triggers the frequency sensor 22. After each warm reset, the chip 10 operating system updates the test variables stored in the EEPROM. Only when this variable reaches a predetermined value, conventional communication via a non-contact interface is possible and conventional authentication can be performed.

  An information storage device 100 according to the present invention shown as a chip card in FIG. 1 includes a chip 10, and a plurality of chip sensors 12 includes an optical sensor 18 that detects excitation 14 of a modulated pulsed laser beam 34. The information storage device 100 is made of a card material 36 through which the pulse laser beam 34 can penetrate. Since conventional card materials are transparent in the NIR range of 800-1100 nm, the excitation 14 of the pulsed laser beam 34 can be specifically tuned in this wavelength range and must be adapted to the processing requirements of the signal 26 in the CPU 28. Can do. The predetermined permeability can usually be adjusted by selecting a composite material of the corresponding additive material and the card material 36. When the optical sensor 18 detects the excitation 14 of the pulsed laser beam 34, various optical excitation profiles are generated. Such an excitation profile is suitable for transmitting complex information to the chip 10. The excitation of the light sensor triggers an exception signal and is therefore an input command for the CPU 28. The CPU 28 is programmed to expect an exception signal from the optical sensor 18 in addition to the “conventional” RFID signal, thus additionally activating the chip 10 for further processing. The chip 10 stores information and energy 16, which are coupled within the chip 10 via a conventional antenna 30 and antenna mounting device 32 to generate an RFID signal. It should be noted that this and other embodiments can also be used within the scope of contact techniques, i.e. energy and information can be transmitted via conventional contacts.

  FIG. 2 shows a plurality of chip sensors 12 with optical sensors 18. The card material 36 and the matrix 38 adjacent to the card material 36 constitute a filter material, and the matrix 38 generates modulated luminescence. Here, the pulse laser beam 34 first penetrates the card member 36 and then enters the matrix 38.

  The card member 36 is adjusted so that it completely absorbs light having a wavelength of less than 850 nm and transmits light having a wavelength greater than 850 nm in the NIR region. Energy 16 and information are coupled and stored in chip 10 in a known manner via antenna 30 and antenna mounting device 32 to generate an RFID signal. Regardless, the pulsed laser beam 34 irradiates the matrix 38 with 980 nm radiation, while the UP conversion process produces 800 nm (670, 550 or 430 nm) luminescence. This original generated light (luminescence emission 52) is incident on the photosensor 18 and triggers the signal 26 in the form of an exception signal after the excitation 14. That is, this signal becomes an input command for the CPU 28. The luminescence dynamics of the UP converter should be selected so that the modulated pulsed laser beam 34 can "pass" and the modulated luminescence can reach the optical sensor 18 and combine complex optical information. It is. This means that a simple continuous excitation of the light sensor 18, for example a custom exception routine, deactivates the chip. However, the predetermined pulse excitation triggers another routine that causes the CPU to perform complex operations. The CPU 28 programs not only “conventional” RFID signals, but also predetermined exception signals from the optical sensor 18 so that complex results are obtained during processing operations. In addition, the matrix 38 can be formed of a special material (combination) so that other light conversion processes such as, for example, photoluminescence or invisible Stokes luminescence can be used. The matrix 38 may be attached by known printing techniques such as silk screen printing, gravure printing, flexographic printing, offset printing, letter set printing, inkjet printing, thermal transfer printing, etc. prior to laminating the card composite material, or By incorporating the UC dye when the chip is encased in the epoxy resin material, only the pulsed laser beam 34 is suitable for generating appropriate luminescence, and the intensity of the pulsed “NIR light” It can also be insufficient to generate.

  The chip sensor 12 clearly shown in a large scale in FIG. 3 is adjacent to the card material 36 which is opaque to light with a wavelength of less than 800 nm and is transparent to light with a wavelength of 800 to 1100 nm. Communication is performed with a filter material including the UC converter 40 and the interference filter stack 44 adjacent to the UC converter. Here, the pulse laser beam 34 penetrates the card material 36 and enters the UC converter 40. The UC converter 40 printed on the back surface of the card material 36 is made of, for example, gadolinium oxysulfide doped with ytterbium and holmium as phosphors. The optical sensor 18 is oriented to be used as excitation light. The interference filter laminate 44 has a very sharp absorption edge and absorbs light having a wavelength of 800 to 1100 nm. Due to the phosphor used, the UC converter generates 550 nm radiation. Luminescence can only spread in the direction of the Si photosensor, where it triggers a signal 26 that is transmitted to the CPU 28. However, since the laser beam required for excitation is absorbed by the layers of the filter stack no matter how late, the Si photosensor cannot be activated.

  FIG. 4 shows a filter material comprising an optical converter 46 that includes the Si optical sensor type optical sensor 18 and shifts the wavelength, and a card material 36 adjacent to the optical converter 46 that is transparent in the wavelength range of 800 to 1100 nm. The several chip sensor 12 provided with is shown. Here, the pulsed laser beam 34 enters the optical converter 46. The optical converter 46 is made of yttrium vanadate (yttrium phosphate, yttrium borate) doped with (chromium) lanthanoid, and absorbs red light to generate NIR radiation. Thus, the original excitation light is shifted to a long wave. In the simplest case, the light converter is printed using conventional printing methods or is installed on the front as a foil-like additive. For example, other materials such as yttrium aluminum garnet doped with chromium and neodymium as defined by the general formula YAG: Cr, Nd can also be used as an optical converter. According to ISO 7810, the card material 36 adjacent to the optical converter 46 is transmissive only in the NIR region of 800 to 1100 nm. Since the optical converter 46 absorbs the pulse laser beam 34 of 800 to 1100 nm almost completely, the pulse laser does not reach the optical sensor 18. However, the red laser light (630 to 690 nm) triggers the luminescence 48 of 900 to 1000 nm determined by the design of the optical converter 46, and this luminescence passes through the card material 36 to the optical sensor 18, and the optical sensor 18. It reaches the CPU 28 as a signal 18. For example, depending on the optical clock, exceptions or predetermined warm resets are performed, which are further processed as information by the operating system of the CPU.

  The plurality of chip sensors shown in FIG. 5 includes at least two optical sensors 18 and 18a that are different in filter material made of card materials 36 and 36a. Here, the pulsed laser beams 34, 34a pass through the filter material to excite the optical sensors 18, 18a, which transmit the signal 26 to the CPU 28 separately.

  By varying the configuration / doping of the card material 36, the optical sensors 18, 18a are sensitive to different wavelengths. In this example, the card member 36a is doped with ytterbium phosphate so as to transmit light having a wavelength of less than 800 nm and substantially not transmit light having a wavelength of more than 800 nm. The optical sensor 18a detects the excitation 14 (wavelength 650 nm) of the pulsed laser beam 34a and converts it into a signal 18 for the CPU 28. This signal is then used to enable a second photosensor that can detect the excitation of a pulsed laser beam 34 with a wavelength of 980 nm. In this way, ternary logic can be implemented by dividing the information between the different optical sensors 18, 18a.

1 is a schematic view of a card having a chip and a plurality of chip sensors according to the present invention. FIG. It is the schematic of the several chip sensor which has the filter material provided with the matrix based on this invention. It is the schematic of the several chip sensor which has a filter material provided with the UC converter and the interference filter laminated body based on this invention. It is the schematic of the several chip sensor which has a filter material provided with the optical converter based on this invention. It is the schematic of the several chip sensor which has two optical sensors based on this invention. It is a schematic diagram of a plurality of conventional chip sensors.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Information storage device 10 Chip 12 Plural chip sensors 14 Excitation 16 Energy 18 Optical sensor 18a Optical sensor 20 Temperature sensor 22 Frequency sensor 24 Sensor 26 Signal 28 CPU
DESCRIPTION OF SYMBOLS 30 Antenna 32 Antenna mounting part 34 Pulse laser beam 34a Pulse laser beam 36 Card material 36a Ytterbium phosphate card material 38 Matrix 40 UC converter 42 UC radiation 44 Interference filter laminated body 46 Optical converter 48 Luminescence 50 Electromagnetic field 52 Luminescence radiation

Claims (14)

  A chip for storing information and energy (16) for contact or non-contact inductive communication, and integrated with the chip (10), and after excitation (14), the signal (26) is sent to the CPU of the chip (10). In an information storage device having a plurality of excitable chip sensors (12) to be transmitted to (28) and processing the signal (26) by the CPU (28), information and energy by the chip (10) Regardless of the storage of (16), the excitation (14) can be adjusted by the chip (10) to additionally store information and the signal (26) in the CPU (28). ), The plurality of chip sensors (12) can adjust the excitation (14) and adapt to the processing requirements of the signal (26) at the CPU (28). Information storage apparatus characterized by filter material and exchanging the signals that can.   The information storage device according to claim 1, characterized in that the filter material comprises a card material (36).   The information storage device according to claim 1, wherein the filter material is made of a document material.   The information storage device according to claim 3, wherein the document material is formed as a material imprint.   The information storage device according to claim 3, wherein the document material is formed as an additional material.   The information storage device according to claim 1, characterized in that the plurality of chip sensors (12) includes an optical sensor (18) for detecting excitation (14) of a pulsed laser beam (34).   The CPU (28) executes an operation of combining and processing a signal of contact or non-contact type inductive communication and the signal (26) supplied by the plurality of chip sensors (12). The information storage device according to claim 1.   The plurality of chip sensors (12) includes an optical sensor (18), and the filter material is not transmissive to light having a wavelength of less than 800 nm, and is responsive to light having a wavelength of 800 to 1100 nm. Consists of a card material (36) that is transparent, a UC converter (40) adjacent to the card material (36), and an interference filter laminate (44) adjacent to the UC converter (40). 2. Information storage device according to claim 1, characterized in that the beam (34) first penetrates the card material (36) and then enters the UC converter (40).   The plurality of chip sensors include optical sensors, and the filter material includes a card material (36) and a matrix (38) that generates modulated luminescence adjacent to the card material (36) and has a pulse. 2. Information storage device according to claim 1, characterized in that the laser beam (34) first penetrates the card material (36) and then enters the matrix (38).   The plurality of chip sensors (12) include at least two different optical sensors (18, 18a) that are the same or different from each other, and the filter material includes a card material (36), and a pulse laser beam (34a). , 34b) pass through the filter material to excite the optical sensors (18, 18a), and these optical sensors (18, 18a) transmit the signal (26) separately to the CPU (28), The information storage device according to claim 1.   The plurality of chip sensors (12) include an optical sensor (18), and the filter material includes an optical converter (46) that shifts a wavelength and a card material (36) adjacent to the optical converter (46). 2. Information storage according to claim 1, characterized in that the card material is transparent in the wavelength range from 800 to 1100 nm, while the pulsed laser beam (34) only penetrates the optical converter (46). apparatus.   The information storage device according to any one of claims 1 to 11, wherein the information storage device is integrated into a value ticket or a security.   A method of communicating using a chip integrated with an information storage device, wherein information and energy (16) for contact or non-contact inductive communication are stored in the chip (10), and independently integrated with the chip. Excited chip sensors (12), which in turn transmit signals (26) to the CPU (28) for processing, and the chip sensor excitation (14) To adjust the excitation (14) to the plurality of chip sensors (12), adjusted by the chip (10) and adapted to the processing requirements of the CPU (28). And a method of communicating with a chip of an information storage device, wherein communication with a filter material adapted to the processing requirements of the signal (26) in the CPU (28) is performed.   14. Method according to claim 13, characterized in that an optical sensor (18) for detecting excitation (14) of a pulsed laser beam (34) is integrated into the plurality of chip sensors (12).

Images