JP2009049910A - Electronic imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic imaging apparatus capable of effectively preventing contamination or foreign matters from adhering to an optical member, provided to the optical path that extends from a lens to an imaging element. <P>SOLUTION: The electronic imaging apparatus includes an optical member on an optical path extending from a lens to an imaging element. The optical member includes from the lens side a water-repellent or water-repellent and oil-repellent film, an infrared cut film, an optical low-pass filter, an adhesion layer, an infrared cut filter, and a reflection preventing film, in this order. Furthermore, the apparatus includes a low surface resistance film made of a conductor or a semiconductor, containing a metal oxide between the water-repellent or water-repellent oil-repellent film and the optical low-pass filter. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic imaging apparatus having an optical member that prevents adhesion of foreign matters such as dust and dirt.

  In an electronic optical device, particularly an electronic imaging device that converts an optical image of a subject into an electrical signal and outputs it, the image captured when foreign matter such as dust or dirt adheres to an optical member provided on the optical path to the imaging element surface There is a problem that foreign objects appear in the screen. A material with high translucency is often a dielectric, so that it is easily charged and attracts foreign matter that has entered from the inside and foreign matter that has occurred inside. In particular, there is a problem that the optical low-pass filter becomes dusty or gets hit with a finger or the like when the lens is exchanged or the image pickup device is cleaned.

  In order to prevent these foreign substances from adhering to optical members, a dust-proof structure that seals the optical path from the light incident surface to the imaging element surface, and a dust removal device that mechanically removes foreign substances using a wiper or vibration unit are installed inside the electronic imaging device. It has been proposed to be attached to.

  These dustproof structures and dust removal devices are not only expensive, but they also have the drawback of increasing the overall weight of the electronic imaging device. Further, foreign substances chemically bonded to the image sensor cannot be removed using a dust removing device. Although a method of removing foreign matters such as dust by blowing air from the outside is also conceivable, it may result in raising the internal foreign matter and conversely increasing the amount of foreign matter attached.

In JP 2001-339055 (Patent Document 1), as shown in FIG. 13, a solid-state imaging device 51 is provided in a casing 50, and an optical low-pass filter 52 and an infrared cut filter 53 are provided in an opening of the casing 50. A transparent plate-like cover member 54 is attached, and a conductive film 55 is formed on the surface of the cover member 54 on the side opposite to the solid-state imaging device 51, so that the cover member 54 is shielded from the outside air. A solid-state electronic imaging device in which a gap between the peripheral edge portion and the casing 50 is sealed is disclosed. As a result, even if foreign matter such as dust or dust enters the inside of the solid-state electronic image pickup device by exchanging the lens or wear debris is generated from the photographing mechanism such as the shutter mechanism, the surface of the cover member 54 is electrically conductive. Since it is covered with 55, charging can be prevented and foreign matter can be prevented from adhering. However, since the solid-state electronic imaging device has an integral structure in which the solid-state imaging element 51 and the optical low-pass filter 52 are fixed to each other by the casing 50, the range of use is limited. Furthermore, since the distance between the solid-state imaging device 51 and the optical low-pass filter 52 is fixed, there is a problem that the degree of freedom in design is low.
JP 2001-339055

  Accordingly, an object of the present invention is to provide an electronic image pickup apparatus that effectively prevents dirt and foreign matter from adhering to an optical member provided on an optical path from a lens to an image pickup device.

  As a result of diligent research in view of the above object, the present inventors provided a film having water repellency or water / oil repellency on the surface of the optical member provided on the optical path from the lens to the image sensor in the electronic imaging device, Furthermore, the inventors have found that by reducing the surface resistance of the optical member, it is possible to effectively prevent the adhesion of dirt such as oil and fat and the adsorption of foreign matters such as dust due to charging, and the present inventors have reached the present invention.

  That is, the electronic imaging device of the present invention is an electronic imaging device having an optical member on the optical path from the lens to the imaging device, and the optical member is a film having water repellency or water / oil repellency from the lens side, red An outer cut film, an optical low-pass filter, an adhesive layer, an infrared cut filter, and an antireflection film are provided in this order, and a metal oxide is included between the water-repellent or water- and oil-repellent film and the optical low-pass filter. A low surface resistance film made of a conductor or a semiconductor is formed.

  Preferably, the optical member is incorporated in a vibration mechanism, and the vibration mechanism also functions as a camera shake correction function.

  The optical member preferably further has a film having water repellency or water / oil repellency on the surface on the image pickup element side.

  The water repellency or water / oil repellency preferably contains fluorine, and the thickness of the film is preferably 0.4 to 100 nm.

  It is preferable that the outermost surface layer of the infrared cut film in contact with the film having water repellency or water / oil repellency is made of silicon dioxide.

  It is preferable that a second low surface resistance film made of a conductor or a semiconductor containing a metal oxide is formed between the infrared cut filter and the antireflection film.

  It is preferable that a conductive material containing a metal oxide is mixed with the adhesive constituting the adhesive layer to give an antistatic effect.

The surface resistance of the low surface resistance film is preferably 1 × 10 ⁴ Ω / □ to 1 × 10 ¹³ Ω / □.

The surface resistance on the lens side surface of the optical member is preferably 1 × 10 ¹⁴ Ω / □ or less.

  The metal oxide is preferably at least one selected from the group consisting of antimony oxide, indium tin oxide and antimony-doped tin oxide.

  In the electronic image pickup apparatus of the present invention, a mechanism for preventing the adhesion of dirt and the adsorption of foreign substances is provided on the optical member provided on the optical path from the lens to the image pickup element. Even during cleaning, dust does not adhere to the optical member, and fingerprints do not adhere even if a finger hits the optical member.

[1] Electronic Imaging Device FIG. 1 shows an electronic imaging device 1 according to an embodiment of the present invention. The electronic imaging device 1 includes a stage device 8 having a first support plate 8a, a stage plate 8b, and a second support plate 8c arranged in order from the light incident side, and an optical member 100 fixed to the stage plate 8b by a support portion 81b. And the imaging device 2 and a plurality of lenses 3a, 3b,... 3n provided on the optical path L leading to the imaging device 2. The optical member 100 includes a film 11 having water repellency or water / oil repellency (hereinafter also simply referred to as a water / oil repellency film), an infrared cut film 7 and a low surface resistance film 9 in this order from the lens side. An optical low-pass filter 4 and an infrared cut filter 5 having an antireflection film 10 on the imaging element 2 side are bonded and integrated through an adhesive layer 6, and are held together with the imaging element 2 by a support portion 81b. . A gap is provided between the optical member 100 and the image sensor 2.

  As shown in FIG. 2, the first support plate 8a has a rectangular shape and is provided with rectangular protrusions 80a and 80a on both sides of the upper portion. (I) The image pickup device 2 fixed to the stage plate 8b. And a rectangular opening 81a for accommodating the optical member 100, (ii) rectangular magnets 82a, 82a, (iii) arranged symmetrically on both sides of the opening 81a on the rear surface and extending vertically. Rectangular magnets 83a, 83a that are symmetrically disposed at the lower part on the rear surface and extend in the left-right direction, (iv) Position sensors 84a, 84a provided on the lower part of the projecting pieces 80a, 80a on the rear surface, and ( v) It has holes 85a, 85a, 85a provided at the bottom center and upper portions of the projecting pieces 80a, 80a.

  The magnets 82a and 82a are arranged so that the S pole and the N pole are aligned in the left-right direction. The magnets 83a and 83a are arranged so that the S pole and the N pole are aligned in the vertical direction. The hole 85a has a large diameter portion 85a ′ and a small diameter portion 85a ″ from the light incident side. The first support plate 8a is preferably made of a soft magnetic material.

  As shown in FIG. 3, the stage plate 8b has a rectangular shape and is provided with rectangular protrusions 80b and 80b on both sides of the upper portion. (I) In order to fix the imaging device 2 and the optical member 100 Support part 81b provided in the central part, (ii) Left and right direction driving coils 82b, 82b provided on both sides of the support part 81b at positions facing the magnets 82a, 82a of the first support plate 8a, (iii) In the lower part, vertical drive coils 83b, 83b provided at positions facing the magnets 83a, 83a of the first support plate 8a, and (iv) a position sensor 84a of the first support plate 8a at the lower part of the projecting pieces 80b, 80b. , 84b, position sensors 84b, 84b provided at positions opposed to 84a, (v) rectangular holes 85b, 85b, 85b provided at the lower center portion and upper portions of the projecting pieces 80b, 80b, and (vi) lower center Rotating members 86b, 86b provided at the center part (between the position sensor 84b and the hole 85b) and the central part (between the position sensor 84b and the hole 85b) 86b. The stage plate 8b is preferably made of a nonmagnetic material.

  The left and right direction driving coils 82b and 82b and the vertical direction driving coils 83b and 83b are planar coils parallel to the stage plate 8b. The left and right direction driving coils 82b and 82b have a spiral shape, and a right side 82b 'and a left side 82b' 'extend in the vertical direction. The vertical driving coils 83b and 83b have a spiral shape, and an upper side 83b ′ and a lower side 83b ″ extend in the left-right direction. In FIG. 3, for the sake of convenience, the left and right direction driving coils 82b and 82b and the up and down direction driving coils 83b and 83b are shown as being wound several times, but in reality, they are wound several tens of times.

  The rotating member 86b is attached to the rear surface of the stage plate 8b so as to rotate in contact with the recess 86c of the second support plate 8c. By using the rotating member 86b, the friction between the stage plate 8b and the second support plate 8c is reduced, and the stage plate 8b can be vibrated smoothly. The number of rotating members 86b is not particularly limited as long as it is an integer of 3 or more.

  As shown in FIG. 4, the rotating member 86b includes a support 860b having a cylindrical hole 861b, an adjustment member 862b screwed into the cylindrical hole 861b, and a ball 863b. The end of the cylindrical hole 861b is slightly curved inward, and the ball 863b is loosely fitted. A compression coil spring 864b having one end abutting on the ball 863b and the other end abutting on the adjustment member 862b is disposed in the recess of the adjustment member 862b. The ball 863b is biased by the compression coil spring 864b.

  As shown in FIG. 5, the second support plate 8c has a concave shape and is provided with rectangular protrusions 80c, 80c on both sides of the upper portion. (I) Each rotating member 86b of the stage plate 8b Concave portions 86c, 86c, 86c provided at opposite positions, and (ii) cylindrical protrusions 85c, 85c, 85c protruding at positions opposed to the respective holes 85a of the first support plate 8a. The protrusion 85c has a tip end portion 850c that is in close contact with the small diameter portion 85a '' of the hole 85a of the first support plate 8a, and a female screw hole 851c for screwing the screw 85 therein. The second support plate 8c is preferably made of a soft magnetic material.

  As shown in FIG. 6, the stage apparatus 8 has a stage plate 8b sandwiched between first and second support plates 8a and 8c. In the first and second support plates 8a and 8c, the tip portions 850c of the projections 85c of the second support plate 8c are engaged with the small diameter portions 85a '' of the holes 85a of the first support plate 8a, and the second support plates 8a and 8c The screws 85 are fixed by being screwed into the holes 851c of the projections 85c of the plate 8c. The protrusion 85c functions as a spacer that provides a gap between the first and second support plates 8a and 8c. The stage plate 8b is sandwiched between the first and second support plates 8a and 8c in a state where the projections 85c are passed through the holes 85b. Since the side length of the rectangular hole 85b of the stage plate 8b is larger than the diameter of the protrusion 85c, the stage plate 8b can move relative to the first and second support plates 8a and 8c. However, the movement of the hole 85b is restricted when the edge of the hole 85b contacts the protrusion 85c. That is, the protrusion 85c also functions as a stopper that restricts the movement of the stage plate 8b.

  A left-right driving magnetic circuit is formed between the magnets 82a, 82a of the first support plate 8a and the facing portion of the second support plate 8c. A vertical drive magnetic circuit is formed between the magnets 83b and 83b of the first support plate 8a and the opposing portions of the second support plate 8c. That is, the first and second support plates 8a and 8c function as yokes. The stage plate 8b is driven in the left-right direction by the left-right direction driving coils 82b, 82b and the left-right direction driving magnetic circuit, and is driven in the vertical direction by the up-down direction driving coils 83b, 83b and the up-down direction driving magnetic circuit.

  Due to the function of the protrusion 85c as a stopper, the right side 82b 'of the left and right direction driving coil 82b and the N pole of the magnet 82a always face each other, and the left side 82b' 'and the S pole of the magnet 82a always face each other. ing. The upper side 83b ′ of the vertical driving coil 83b and the N pole of the magnet 83a are always opposed to each other, and the lower side 83b ″ and the S pole of the magnet 83a are always opposed to each other.

  As shown in FIG. 7, when a current in the direction indicated by the arrow is passed through each vertical driving coil 83b, an electromagnetic force is generated in the direction indicated by the arrow F (upward). Accordingly, the stage plate 8b moves upward from the initial position shown in FIG. 8 with respect to the first and second support plates 8a and 8c as shown in FIG. On the other hand, when a current in the direction opposite to the arrow in FIG. 7 is passed through each vertical driving coil 83b, an electromagnetic force is generated in the downward direction. Accordingly, the stage plate 8b moves downward with respect to the first and second support plates 8a and 8c as shown in FIG. Therefore, the stage plate 8b can be vibrated in the vertical direction by applying an AC voltage to each of the vertical driving coils 83b. Since the stage plate 8b vibrates and collides with the protrusion 85c, dust attached to the optical member 100 can be removed by the impact.

  When an AC voltage is applied to each of the left and right direction driving coils 82b in the same manner as described above, the stage plate 8b can be vibrated in the left and right direction and collide with the protrusion 85c. Can be removed.

  By controlling the AC voltage and frequency applied to the vertical driving coils 83b and 83b and the horizontal driving coils 82b and 82b, the impact force, the vibration direction, the vibration cycle, and the like can be controlled. For example, a sequence in which vibrations in the vertical direction and vibrations in the horizontal direction are sequentially generated, or a combination thereof is repeated. From the viewpoint that an impact due to gravity can also be used, it is preferable to vibrate the stage plate 8b so that vibrations in the vertical direction are dominant.

  Since the deviation from the initial position of the stage plate 8b (see FIG. 8) is detected by the two pairs of position sensors 84a and 84b, each coil 82b is set so that the stage plate 8b returns to the initial position after the dust removal is completed. , 83b may be set so that a current flows. Examples of the position sensors 84a and 84b include an optical position sensor including a light emitting element and a light receiving element, a Hall element sensor using a magnetic field, and the like. In order to drive the stage device 8, in addition to various circuits (power supply circuit, CPU that controls the entire camera, image signal processing circuit, display circuit, etc.) generally used in conventional cameras, a stage is used. A circuit for driving the device 8 may be provided, and the circuit configuration itself is not particularly limited. For example, a circuit configuration in which a dust removal switch is provided and the stage device 8 is driven when the switch is pressed, or a circuit configuration in which the stage device 8 is driven when the camera is turned on can be used.

  These vibration mechanisms preferably also serve as a camera shake correction function.

[2] Optical Member As shown in FIG. 1 (c), the optical member 100 includes a film 11 having water repellency or water / oil repellency, an infrared cut film 7 and a low surface resistance film 9 from the lens side. The optical low-pass filter 4 and the infrared cut filter 5 having the antireflection film 10 on the image pickup device 2 side are bonded and integrated through the adhesive layer 6 and are held together with the image pickup device 2 by the support portion 81b. ing. A gap is provided between the optical member 100 and the image sensor 2.

(1) Low surface resistance film The low surface resistance film 9 is made of a conductor or a semiconductor containing a metal oxide. By forming the low surface resistance film 9 on the light incident side of the optical low-pass filter 4, the surface resistance of the optical low-pass filter 4 is reduced and charging is prevented. For this reason, adsorption of foreign matters such as dust due to charging is prevented, and even if it adheres, it can be easily removed. The metal oxide forming the low surface resistance film 9 is not particularly limited as long as it is a conductive oxide having transparency, but antimony pentoxide (Sb ₂ O ₅ ), indium tin oxide (ITO), or antimony-doped oxide. Tin (ATO) or a combination thereof is preferred.

The film thickness of the low surface resistance film 9 is preferably 1 to 5000 nm, and more preferably 10 to 3000 nm. If the film thickness is less than 1 nm, the antistatic function cannot be fully exhibited, and if the film thickness exceeds 5000 nm, the film thickness of the low surface resistance film 9 becomes non-uniform and the transparency is impaired. . The surface resistance of the low surface resistance film 9 is preferably 1 × 10 ⁴ to 1 × 10 ¹³ Ω / □, and more preferably 1 × 10 ⁵ to 1 × 10 ¹² Ω / □. When the surface resistance is less than 1 × 10 ⁴ Ω / □, the transparency of the low surface resistance film 9 is poor, and when it exceeds 1 × 10 ¹³ Ω / □, it takes time for the low surface resistance film 9 to discharge static electricity. The dust prevention function by the antistatic is not effective.

  When the low surface resistance film 9 is made only of a conductor or semiconductor containing the above metal oxide, a physical vapor deposition method such as a vacuum vapor deposition method, a sputtering method, an ion plating method, thermal CVD, plasma CVD, photo CVD, etc. It can be formed by chemical vapor deposition or the like. Of these, vacuum deposition is preferred from the viewpoint of economy. In the case of a conductor or a composite of a semiconductor and a binder, it can be formed by a film forming method such as a wet method such as a sol-gel method.

  In the example shown in FIG. 1, the low surface resistance film 9 is formed between the infrared cut film 7 and the optical low-pass filter 4, but the present invention is not limited to this, and the order and location of installation are necessary. It can be changed as appropriate according to the situation. For example, as shown in FIG. 12, it may be provided between the water / oil repellent film 11 and the infrared cut film 7. Further, it may be provided between the infrared cut filter 5 and the antireflection film 10. If the number of places where the low surface resistance film 9 is formed increases, the dust-proof effect of the electronic imaging device 1 increases, but the transparency decreases, so the total film thickness of the low surface resistance film 9 is within the above-mentioned film thickness range. Is preferable.

(2) Antireflection film The material for forming the antireflection film 10 is not particularly limited, and SiO ₂ , TiO ₂ , MgF ₂ , SiN, CeO ₂ , ZrO _2, or the like can be used. When the antireflection film 10 has a multilayer structure, it may be a multilayer film made of the same material or a multilayer film made of different materials. For example, it is possible to further improve the antireflection efficiency by appropriately combining a plurality of films having different refractive indexes. The antireflection film 10 is preferably formed by physical vapor deposition such as the above vacuum vapor deposition.

(3) Water repellent or water / oil repellent film Water repellent or water / oil repellent film 11 (hereinafter simply referred to as water / oil repellent film) is provided on the outermost surface to chemically inactivate the film surface. It is possible to prevent chemical bonding of dirt such as cigarette smoke and rainwater and adhesion of oil. The water / oil repellent film 11 also functions as a protective film for the low surface resistance film 9 and the antireflection film 10. The water / oil repellent film 11 is preferably made of a fluorine resin. The fluororesin has a small surface frictional resistance, and it is possible to wipe off the dirt without damaging the surface by simply rubbing the surface. The fluororesin is preferably amorphous. The layer made of the non-crystalline fluororesin has excellent transparency, reduces the adhesive force due to the liquid crosslinking force, and can easily remove the adhered particles. Specific examples of the non-crystalline fluororesin include silicone fluororesins, fluoroolefin copolymers, polymers having a fluorinated alicyclic structure, and fluorinated acrylate copolymers. .

  The film thickness of the water / oil repellent film 11 is preferably 0.4 to 100 nm, and more preferably 10 to 80 nm. If the film thickness is less than 0.4 nm, the functions of water repellency or water / oil repellency cannot be fully exhibited, and the sustainability of the effect is not sufficient. If the film thickness exceeds 50 nm, the transparency and conductivity of the first optical low-pass filter 4 are impaired, and the optical characteristics of the antireflection film are changed. The water / oil repellent film 11 may be formed by a wet film forming method such as a sol-gel method, a physical vapor deposition method such as a vacuum vapor deposition method or an ion plating method, a chemical vapor deposition method such as thermal CVD or plasma CVD, or the like. it can.

(4) Infrared cut film The material for forming the infrared cut film 7 is not particularly limited. AlF ₃ , NaF, CaF ₂ , LiF, SiO ₂ , MgF ₂ , HfO ₂ , ZrO ₂ , CeO ₂ , Ta ₂ O ₅ , Nb ₂ O ₅ , ZnS, TiO _{2 and the} like can be used. The infrared cut film 7 preferably has a multilayer structure of two or more different materials. For example, the infrared cut efficiency can be further increased by appropriately combining a plurality of films having different refractive indexes. The outermost surface layer of the infrared cut film is preferably silicon dioxide. Thereby, it is possible to strengthen the bond with the water / oil repellent film 11 which is particularly a fluorosilicate compound. The infrared cut film 7 can be formed by a wet film formation method such as a sol-gel method, a physical vapor deposition method such as a vacuum vapor deposition method, a chemical vapor deposition method, or the like, but is formed by a physical vapor deposition method or a chemical vapor deposition method. preferable.

(5) Optical low-pass filter The optical low-pass filter 4 is not particularly limited as long as it has a function as an optical low-pass filter, but is preferably a translucent member having birefringence. A bait or the like is preferable.

(6) Infrared cut filter The infrared cut filter 5 may be made of known infrared absorbing glass, infrared absorbing resin, or the like, but is preferably made of infrared absorbing glass. By providing the anti-reflection film 10 on the infrared cut filter 5, the reflectance of the infrared cut filter 5 can be reduced. As shown in FIG. 11, a water / oil repellent film 11 may be further provided on the antireflection film 10.

(7) Adhesive layer The adhesive layer 6 is formed of a known adhesive. Examples thereof include a thermosetting resin adhesive and an ultraviolet curable resin adhesive. Furthermore, it is preferable that the adhesive is mixed with a conductor containing a metal oxide to have an antistatic effect.

  The present invention will be described in more detail by the following examples, but the present invention is not limited thereto.

Example 1
MgF ₂ layer (thickness 67 nm) and SiO ₂ layer (thickness) on the surface of the infrared absorption glass side of the substrate where optical low-pass filter made of quartz and infrared absorption glass are bonded using thermosetting resin adhesive 17 nm) was laminated in this order by a vacuum deposition method to form an antireflection film. On the other hand, on the surface on the optical low-pass filter side, ITO was deposited by vacuum deposition to form a low surface resistance film. On this low surface resistance film, eight layers of TiO ₂ layers and SiO ₂ layers were alternately formed by vacuum deposition to form an infrared cut film. The uppermost layer of the infrared cut film was a SiO ₂ layer. In addition, a fluorine-based water repellent (“OF-110” manufactured by Canon Optron Co., Ltd.) was deposited on this infrared cut film by a vacuum deposition method to a thickness of 10 nm, thereby producing an optical component. .

Example 2
An optical component was fabricated in the same manner as in Example 1 except that ATO was used instead of ITO as the low surface resistance film.

Example 3
An optical component was fabricated in the same manner as in Example 1 except that an optical low-pass filter made of lithium niobate was used.

Example 4
An optical component was produced in the same manner as in Example 2 except that an optical low-pass filter made of lithium niobate was used.

Example 5
Except that a fluorine-based water repellent (“OF-110” manufactured by Canon Optron Co., Ltd.) was formed to a thickness of 10 nm on the surface of the antireflection film 10 in the same manner as in Example 1, The optical component shown in FIG. 11 was produced.

Comparative Example 1
An optical component was fabricated in the same manner as in Example 1 except that the low surface resistance film 6 was not formed.

  Surface resistance of the optical parts obtained in Examples 1 to 5 and Comparative Example 1, the degree of ash adhesion when cigarette ash is brought into contact with the surface on the lens side, the contact angle with respect to water, the total transmittance, the finger Table 1 shows how fingerprints are attached when touched with.

  As is clear from Table 1, it was found that the optical parts of Examples 1 to 5 having a low surface resistance film and a water / oil repellent film had an excellent dustproof effect and were hardly attached with fingerprints.

  When the optical components obtained in Examples 1 to 5 and Comparative Example 1 were incorporated in the electronic imaging apparatus shown in FIG. 1 and used in a normal manner, the optical components in Examples 1 to 5 of the present invention were used as a filter. In the electronic image pickup apparatus, the image was not reflected due to the attachment of foreign matter or fingerprints to the filter.

An example of the electronic imaging device of the present invention is shown, (a) is a partial sectional view, (b) is a plan view showing the stage device of FIG. 1 (a), and (c) is a plan view of FIG. 1 (b). It is an expanded sectional view which shows an optical component. The 1st support plate of the stage apparatus of FIG. 1 is shown, (a) is a front view, (b) is a top view. The stage board of the stage apparatus of FIG. 1 is shown, (a) is a front view, (b) is a top view. It is an expanded sectional view of the stage board of FIG. The 2nd support plate of the stage apparatus of FIG. 1 is shown, (a) is a front view, (b) is a top view. The stage apparatus of FIG. 1 is shown, (a) is a top view which shows the state before an assembly, (b) is a top view which shows the state after an assembly. It is an enlarged front view which shows the direction of the electromagnetic force F which arises by electricity supply of the stage apparatus of FIG. It is a front view which shows the initial state of the stage apparatus of FIG. It is a front view which shows the state which the stage board of the stage apparatus of FIG. 1 moved up. It is a front view which shows the state which the stage board of the stage apparatus of FIG. 1 moved below. It is sectional drawing which shows an example of an optical component. It is sectional drawing which shows another example of an optical component. It is a schematic sectional drawing which shows the conventional electronic imaging device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic imaging device 2 ... Imaging element
3a, 3b ... 3n ... Lens 4 ... Optical low pass filter 5 ... Infrared filter
50 ... Casing
51 ・ ・ ・ Solid-state imaging device
52 ... Optical low-pass filter
53 ・ ・ ・ Infrared cut filter
54 ・ ・ ・ Cover member
55 ... conductive film 6 ... adhesive layer 7 ... infrared cut film 8 ... stage apparatus
8a ・ ・ ・ First support plate
80a ・ ・ ・ Projection
81a ・ ・ ・ Opening
82a ・ ・ ・ Magnet
83a ・ ・ ・ Magnet
84a ・ ・ ・ Position sensor
85a ... hole
85a '・ ・ ・ large diameter part
85a '' ・ ・ ・ small diameter part
8b ・ ・ ・ Stage plate
80b ・ ・ ・ Projection
81b ・ ・ ・ Supporting part
82b ・ ・ ・ Left and right direction driving coil
82b '・ ・ ・ Right side
82b '' ・ ・ ・ Left side
83b ・ ・ ・ Up-down direction drive coil
83b '・ ・ ・ Upper side
83b '' ・ ・ ・ bottom side
84b Position sensor
85b ... hole
86b ・ ・ ・ Rotating member
860b ・ ・ ・ Support
861b ・ ・ ・ Cylindrical hole
862b ・ ・ ・ Adjustment member
863b ・ ・ ・ Ball
864b ・ ・ ・ Compression coil spring
8c ・ ・ ・ Second support plate
80c ・ ・ ・ Protrusions
85c ・ ・ ・ Cylindrical protrusion
850c ・ ・ ・ tip
851c ・ ・ ・ Female thread hole
86c ・ ・ ・ Recess 9 ・ ・ ・ Low surface resistance film
10 ... Anti-reflective coating
11 ... Water and oil repellent film
100 ・ ・ ・ Optical member
L ... Optical path

Claims (10)

An electronic imaging apparatus having an optical member on an optical path from a lens to an imaging device, wherein the optical member is a film having water repellency or water / oil repellency from the lens side, an infrared cut film, an optical low-pass filter, and an adhesive layer A low surface comprising a conductor or semi-conductor having an infrared cut filter and an antireflection film in this order, and further comprising a metal oxide between the water-repellent or water- and oil-repellent film and the optical low-pass filter. An electronic imaging apparatus, wherein a resistance film is formed. The electronic imaging apparatus according to claim 1, wherein the optical member is incorporated in a vibration mechanism, and the vibration mechanism also functions as a camera shake correction function. 3. The electronic imaging apparatus according to claim 1, wherein the optical member further includes a film having water repellency or water / oil repellency on the surface on the imaging element side. 4. 4. The electronic imaging device according to claim 1, wherein the water repellency or water / oil repellency contains fluorine, and the thickness of the film is 0.4 to 100 nm. . 5. The electronic imaging device according to claim 1, wherein an outermost surface layer of the infrared cut film in contact with the water-repellent or water- and oil-repellent film is made of silicon dioxide. apparatus. 6. The electronic imaging device according to claim 1, wherein a second low surface resistance film made of a conductor or a semiconductor containing a metal oxide is formed between the infrared cut filter and the antireflection film. An electronic imaging apparatus characterized by being configured. 7. The electronic imaging apparatus according to claim 1, wherein a conductive material containing a metal oxide is mixed with an adhesive constituting the adhesive layer to provide an antistatic effect. . 8. The electronic imaging apparatus according to claim 1, wherein a surface resistance of the low surface resistance film is 1 × 10 ⁴ Ω / □ to 1 × 10 ¹³ Ω / □. . 9. The electronic imaging apparatus according to claim 1, wherein a surface resistance of a lens side surface of the optical member is 1 × 10 ¹⁴ Ω / □ or less. The electronic imaging device according to claim 1, wherein the metal oxide is at least one selected from the group consisting of antimony oxide, indium tin oxide, and antimony-doped tin oxide. Imaging device.

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