JP2009048805A - Rotary anticathode x-ray generator and x-ray generating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To restrain consumption of a rotary anticathode caused by electron beam irradiation in an X-ray generator and an X-ray generating method using the rotary anticathode. <P>SOLUTION: An electron beam is irradiated on the rotary anticathode in a direction of centrifugal force caused by rotation of the rotary anticathode in order to generate X rays, and at the same time, gas for forming a film is supplied to the rotary anticathode, and at least, a film for covering at least an irradiating section of the electron beam and for restraining evaporation from the irradiating section of the electron beam of a structural member of the rotary anticathode, is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a rotating anti-cathode X-ray generator and an X-ray generation method capable of realizing ultra-high luminance.

  In X-ray diffraction measurement or the like, it may be necessary to perform measurement by irradiating a sample with as strong X-rays as possible. A rotary anti-cathode X-ray generator is conventionally known as an X-ray generator used in such a case.

  This rotating counter-cathode X-ray generator generates X-rays by irradiating an outer peripheral surface with an electron beam while rotating a cylindrical counter-cathode (target) in which a cooling medium is circulated at high speed. is there. This rotating anti-cathode X generator has an extremely high cooling efficiency because the irradiation position of the electron beam on the target changes from moment to moment as compared with a fixed target type in which the target is fixed. Electron beams can be irradiated, and powerful (high brightness) X-rays can be generated.

  Incidentally, the output of X-rays generally corresponds to the power (current × voltage) applied between the cathode and the counter cathode. On the other hand, since the brightness of the X-ray is (the power) / (the area of the electron beam on the target), the maximum value of the power greatly depends on the area of the electron beam on the target. For example, when the output intensity of an X-ray generator for physics and chemistry using copper as a target is displayed with this power, the conventional rotating anti-cathode X-ray generator described above is a general-purpose device that irradiates a target with an electron beam of 0.1 × 1 mm. In the case of an X-ray generator for physics and chemistry, it was the limit to obtain an output of about 1.2 kW at the maximum, and an output of about 3.5 kW at the maximum even though it was said to be super bright.

  In view of such a problem, Japanese Patent Application Laid-Open No. 2004-172135 discloses a portion of a rotating anti-cathode X-ray generator that irradiates an electron beam to the inside of a cylindrical portion with the center of rotation as the central axis. Attempts have been made to generate high-intensity X-rays by heating to a temperature higher than its melting point. In this case, the irradiation part of the electron beam is heated to the melting point of the rotating counter cathode or higher, so that the irradiation part is at least partially dissolved. However, since the irradiation part is held by the cylindrical part due to the centrifugal force generated with the rotation of the rotating anti-cathode, it suppresses the scattering of the irradiation part to the outside of the melting part. Can do.

However, in the above technique, the rotating anti-cathode is heated to the melting point or higher by electron beam irradiation, and the electron beam irradiation part is partially dissolved. Therefore, the vicinity region including the electron beam irradiation part is compared. High temperature and high vapor pressure. Therefore, there is a problem that the consumption due to electron beam irradiation of the rotating counter cathode becomes remarkable, and the utilization efficiency of the rotating counter cathode is extremely deteriorated.
JP 2004-172135 A

  An object of the present invention is to suppress wear of the rotating counter cathode due to electron beam irradiation in an X-ray generator and X-ray generating method using the rotating counter cathode.

In order to achieve the above object, the present invention provides:
A rotating anti-cathode;
An electron beam source for generating an X-ray by irradiating the rotating counter cathode with an electron beam in the same direction as the centrifugal force caused by the rotation of the rotating counter cathode;
For forming a film for forming a film that is provided so as to cover at least the electron beam irradiation part of the rotating counter cathode and suppresses evaporation of components of the rotating counter cathode from the electron beam irradiation part. A film forming gas supply mechanism for supplying gas;
The present invention relates to a rotating anti-cathode X-ray generator.

The present invention also provides:
Irradiating the rotating anti-cathode with an electron beam in the same direction as the centrifugal force caused by the rotation of the rotating anti-cathode to generate X-rays;
A film forming gas is supplied to the rotating counter cathode, covering at least the electron beam irradiation section, and forming a film that suppresses evaporation of the rotating counter cathode constituent member from the irradiation section of the electron beam. Steps,
The present invention relates to a method for generating X-rays.

  According to the above-mentioned rotating anti-cathode X-ray generator and X-ray generating method, when generating X-rays by irradiating the rotating counter-cathode with an electron beam to generate X-rays, a film forming gas is generated in the apparatus. The film-forming gas is converted into a predetermined film substance, and the electron beam irradiation part is covered with a film formed on the surface of the rotating counter cathode. Therefore, even if the electron beam irradiation part is heated to, for example, a melting point of a member constituting the rotating counter cathode or higher and the vapor pressure thereof is increased, the coating prevents the rotation of the rotating counter cathode from being evaporated. Become. As a result, consumption due to electron beam irradiation of the rotating counter cathode can be suppressed.

  Moreover, according to the said rotation anti-cathode X-ray generator and X-ray generation method, film formation can be performed in parallel with the generation | occurrence | production of the X-ray by electron beam irradiation. That is, the film can be formed simultaneously with the X-ray generation step without previously forming a film on the electron beam irradiation portion of the rotating counter cathode. Accordingly, it is possible to improve the operation efficiency of the rotating anti-cathode X-ray generation apparatus and the X-ray generation method.

  Further, the film formation can be performed during the annealing operation at the initial stage of the operation of the rotating anti-cathode X-ray generator. As a result, during the actual X-ray generation process, the electron beam irradiation portion of the rotating counter-cathode is already covered with the film, so that evaporation of the target in the initial stage of the X-ray generation process can be suppressed.

  In one embodiment of the present invention, the film forming gas introduction mechanism may supply the film forming gas to the vicinity of the irradiation portion of the electron beam of the rotating counter cathode, and the electron beam of the rotating counter cathode. The film forming gas can be converted into the film by heat generated by irradiation. In this case, the film-forming gas is decomposed and / or synthesized by heat, and the target film can be formed in the electron beam irradiation section of the rotating counter-cathode.

  In one embodiment of the present invention, the film forming gas introduction mechanism supplies the film forming gas into the electron beam path, and the film forming gas is applied to the film by irradiation of the electron beam. It can be configured to convert. In this case, the film-forming gas is excited by the electron beam irradiation, and as a result, is decomposed and / or synthesized so that the target film can be formed in the electron beam irradiation section of the rotating counter cathode. .

  The electron beam source controls the beam diameter of the electron beam, irradiates the electron beam to the film forming gas, and irradiates the rotating counter cathode with the electron beam. It can be configured to be larger than the beam diameter at the time. As described above, this is because the electron beam intensity required for decomposing and / or synthesizing the film-forming gas using an electron beam and the electron beam intensity required for generating X-rays. This is due to the difference. That is, when generating high-intensity X-rays, it is required to irradiate a high-intensity electron beam by reducing the beam diameter of the electron beam, but when decomposing and / or synthesizing the film-forming gas. This is because an electron beam with a very high intensity is not required, and the film formation efficiency increases when the beam diameter of the electron beam is increased to increase the irradiation area for the film forming gas. .

The film forming gas introduction mechanism is configured to supply the film forming gas so that the pressure in the rotating cathode X-ray generator is maintained at a pressure of 10 ⁻⁵ Torr or less. It is preferable to do. If the pressure is higher than 10 ⁻⁵ Torr, the cathode may be damaged or a discharge may occur.

Further, as described above, when supplying the film-forming gas so that the pressure in the rotating anti-cathode X-ray generator is maintained at a pressure of 10 ⁻⁵ Torr or less, The gas introduction mechanism is preferably configured to include a film forming gas source and a decompression tank. In this case, since the pressure of the film forming gas supplied into the apparatus can be reduced to a predetermined pressure by the decompression tank, the pressure of the order of 10 ⁻⁵ Torr or less can be simplified. Will be able to be set.

  In addition, it is preferable to comprise the said film | membrane from the material which does not form a solid solution with respect to the said rotation counter-cathode. If the film dissolves in the rotating counter cathode, it does not exist as a film, and the effect of suppressing the evaporation of the target metal may be drastically reduced.

  Further, the coating preferably contains at least one selected from the group consisting of graphite, diamond, alumina, calcium oxide, magnesium oxide, titanium oxide, titanium carbide, boron and boron nitride, and particularly preferably contains graphite. . Since these materials have a relatively small specific gravity and a low vapor pressure even at high temperatures, as described above, a material that does not easily dissolve in a constituent material constituting the rotating counter cathode, such as a material such as Cu or Co, is selected. As a result, the degree of evaporation due to the electron beam irradiation can be reduced. Furthermore, when having a certain degree of conductivity, charge-up can be suppressed when the electron beam is irradiated, and destruction of the coating can be effectively suppressed.

  As described above, according to the present invention, in the X-ray generation apparatus and the X-ray generation method using a rotating counter cathode, it is possible to suppress the consumption of the rotating counter cathode due to electron beam irradiation.

  FIG. 1 is a schematic configuration diagram showing the main part of an example of the rotating anti-cathode X-ray generator of the present invention. FIG. 2 is an enlarged view of the vicinity of the electron beam irradiation unit of the rotating anti-cathode generator shown in FIG. FIG.

  As shown in FIG. 1, the rotating anti-cathode X-ray generator 10 in this embodiment includes a rotating anti-cathode 11 and an electron gun 15 as an electron beam source. The rotating anti-cathode 11 includes a main body portion 111 mechanically connected to the rotating shaft 12 and a cylindrical portion as a side wall portion standing substantially perpendicular to the main body portion 111 at a side end portion of the main body portion 111. 112. The rotating counter cathode 11 has a substantially circular shape, and the cylindrical portion 112 is provided over the entire circumference of the side end portion of the main body portion. The rotating counter cathode 11 is configured to rotate around a rotating shaft 12 attached to the lower part (main body portion 111), for example, in a direction indicated by an arrow.

  The rotating counter cathode 11 and the electron gun 15 are disposed in a predetermined vacuum container 20.

  Further, an electron beam 40 is emitted in a horizontal direction from the electron gun 15, is subjected to a direction change of about 180 degrees by the deflecting electron lens 16, and is applied to the inner wall of the cylindrical portion 112 of the rotating counter cathode 11, thereby The line irradiation unit 11A is formed. The electron beam irradiation unit 11A is excited by electron beam irradiation and generates predetermined X-rays 60.

  A film forming gas supply mechanism 30 is provided outside the vacuum container 20. The film forming gas supply device 30 includes a film forming gas source 31, a valve 32, a decompression tank 33, a flow rate adjusting valve 34, and a nozzle 35. The film forming gas source 31 is filled with a single gas or a plurality of gases serving as a film material covering the electron beam irradiation part 11A of the rotating counter cathode 11. Since the raw material gas is filled in the film forming gas source 31 in a compressed state, when the gas is directly introduced into the vacuum container 20 from the film forming gas source 31, a large amount of the raw material gas is obtained. May be introduced into the vacuum container 20 at once.

From this point of view, the film forming gas supply mechanism 30 includes a decompression tank 33 between the film forming gas source 31 and the vacuum container 20, and the raw material gas from the film forming gas source 31 passes through the valve 32. After that, it is once held in the decompression tank 33. The source gas is held in the decompression tank 33 at a pressure of about 1-2 × 10 ⁻⁵ Torr. Thereafter, the raw material gas is adjusted to a predetermined flow rate by the flow rate adjusting valve 34 and then supplied into the vacuum vessel 20 through the nozzle 35.

  The above-described configuration of the film forming gas supply mechanism 30 is merely an example in the present embodiment, and any configuration can be used as long as the effects of the present invention are achieved.

  In the present embodiment, the source gas is supplied from the nozzle 35 toward the vicinity of the electron beam irradiation unit 11 </ b> A of the rotating counter cathode 11 as indicated by reference numeral 50. Therefore, the source gas 50 is subjected to radiation pyrolysis and / or synthesis from the electron beam irradiation unit 11A, and a target film can be formed around and around the electron beam irradiation unit 11A.

  In the present embodiment, the source gas 50 is also affected by the irradiation of the electron beam 40 constituting the electron beam irradiation unit 11A. That is, the source gas 50 supplied into the vacuum container 20 from the nozzle 35 of the film forming gas supply mechanism 30 passes through the path of the electron beam 40, and the electron beam 40 is irradiated by this. Therefore, the source gas 50 is excited by irradiation with the electron beam 40, and as a result, is decomposed and / or synthesized to form a target film on the electron beam irradiation portion 11A of the rotating counter cathode 11 and the surroundings. Become.

  As described above, in the present embodiment, the source gas 50 is converted into the target film by radiant heat from the electron beam irradiation unit 11A and excitation by irradiation of the electron beam 40. Even when only one of the lines 40 is used, the conversion into the film can be sufficiently performed.

  In the present embodiment, the film formation from the source gas 50 is performed in the process of generating the X-ray 60. However, a separate excitation means is provided, and the source gas 50 is converted into a film by excitation by the excitation means. You can also. However, as shown in the present embodiment, the coating can be efficiently formed by using the energy of the electron beam or the radiant heat in the generation process of the X-ray 60, and the configuration of the entire apparatus is simplified. be able to.

The film forming gas introduction mechanism 30 is preferably configured to supply the source gas 50 so that the pressure in the vacuum vessel 20 is maintained at a pressure of 10 ⁻⁵ Torr or less. When the pressure becomes higher than the order of 10 ⁻⁵ Torr, discharge is likely to occur between the cathode and the anode of the electron gun 15. In addition, the electron emission ability from the cathode is reduced. Furthermore, a part of the coating substance is deposited on the wall of the electron gun 15 and causes a breakdown of the cathode and the anode, and also causes a consumption of the cathode.

In the present embodiment, the film forming gas introduction mechanism 30 is provided with a decompression tank 33, and the raw material gas 50 from the film forming gas source 31 is decompressed to about 1-2 × 10 ⁻⁵ Torr in the decompression tank 33. Yes. Therefore, by supplying the raw material gas 50 under such pressure into the vacuum vessel 20 through the flow rate adjusting valve 34 and the nozzle 35, the pressure of the order of 10 ⁻⁵ Torr or less can be easily realized. Can do.

  Next, the configuration of the electron beam irradiation unit 11A will be described in detail with reference to FIG. As described above, the electron beam irradiation portion 11A is formed on the inner wall portion of the cylindrical portion 112. In this embodiment, as shown in FIG. 2, the inverted trapezoidal groove portion 11B is formed on the inner wall portion of the cylindrical portion 112. And the electron beam irradiation part 11A is positioned in the groove part 11B. In addition, the electron beam irradiation unit 11A is covered with the coating film 17 formed by using the above-described film forming gas introduction mechanism 30 and supplying the source gas 50 under the above-described conditions. The coating 17 is formed in the groove 11B so as to cover the electron beam irradiation part 11A. Further, the back side of the cylindrical portion 112 can be appropriately cooled by an appropriate method.

  The specific constituent material of the coating film 17 will be described in relation to the following X-ray generation method.

  The rising angle α at the end of the groove 11B is set to an angle at which the generated X-ray 60 is incident on the end and is not absorbed, for example, several degrees or less. However, it is not essential to form the groove 11B as described above, and the groove 11B may not be formed.

  Next, an X-ray generation process using the rotating anti-cathode X-ray generator shown in FIGS. 1 and 2 will be described. As shown in FIGS. 1 and 2, the rotating anti-cathode 11 is rotated at a predetermined angular velocity around the rotating shaft 12 by a driving system such as a motor (not shown). Then, the centrifugal force G is generated in the rotating anti-cathode 11 around the rotating shaft 12. Next, after the electron beam 40 is emitted from the electron gun 15 and subjected to a direction change of 180 degrees by the deflecting electron lens 16, the inner wall of the cylindrical portion 112 of the rotating counter cathode 11 is irradiated to form the electron beam irradiation portion 11A. To come.

  In the present embodiment, since the electron beam irradiation unit 11A is formed on the inner wall surface of the cylindrical portion 112, the direction of the centrifugal force G of the rotating cathode 11 and the irradiation direction of the electron beam 40 are the same direction. It is possible to easily form the electron beam irradiation portion 11A that satisfies the above requirements in the rotating counter cathode 11.

  At this time, the electron beam irradiation unit 11 </ b> A is excited by the irradiation of the electron beam 40 and generates a predetermined X-ray 60. As is clear from FIGS. 1 and 2, the direction of the centrifugal force G generated by the rotation of the rotating anti-cathode 11 coincides with the irradiation direction of the electron beam 40. Therefore, even when the intensity of the electron beam 40 is increased so that the rotating anti-cathode 11, that is, the electron beam irradiation part 11A is partially or even melted to a depth of several hundreds of microns, the dissolved part is subjected to the centrifugal force G. By this, it is fixed to the cylindrical portion 112. On the other hand, since the electron beam irradiation unit 11A is irradiated with the electron beam 40 having an increased intensity, the luminance of X-rays generated from the portion is increased.

  In such a case, the electron beam irradiation unit 11 </ b> A and / or a region in the vicinity thereof is heated to a temperature equal to or higher than the melting point of the rotating counter cathode 11 with the above-described dissolution. Therefore, in association with the generation of the X-ray 60 described above, the evaporation of the constituent members of the rotating counter cathode 11 becomes significant when there is no coating.

However, in the present embodiment, simultaneously with the generation of the X-rays 60 described above, the pressure of the raw material gas 50 from the film forming gas supply mechanism 30 is preferably 10 ⁻⁵ Torr or less, and the electron beam Irradiation is performed toward the vicinity of the irradiation unit 11A. Therefore, the source gas 50 is decomposed and / or synthesized by the interaction between the radiant heat from the electron beam irradiation unit 11A and the excitation caused by direct irradiation of the electron beam 40, and is coated so as to cover the electron beam irradiation unit 11A. Since 17 is formed, evaporation of the constituent members of the rotating counter cathode 11 can be suppressed.

  In the present embodiment, the electron beam irradiation unit 11A is configured to be positioned in the inverted trapezoidal groove 11B in the cylindrical portion 112 of the rotating counter cathode 11, and the coating film 17 is formed in the groove 11B. I have to. Since the specific gravity of the coating material is smaller than the specific gravity of the target material, the coating 17 is fixed by the centrifugal force in the groove portion 11B, and the coating 17 is rotated by the electron beam irradiation in the X-ray generation process. The target material that has left or melted away from the target is no longer mixed.

  In addition, it is preferable to comprise the coating film 17 from the material which does not form a solid solution with respect to the rotating cathode 11, ie, the electron beam irradiation part 11A. If the coating film 17 is dissolved in the rotating anti-cathode 11, that is, the electron beam irradiation part 11A, the coating effect may not be expected since it does not exist as a coating film.

  Specifically, the coating 17 preferably contains at least one selected from the group consisting of graphite, diamond, alumina, calcium oxide, magnesium oxide, titanium oxide, titanium carbide, silicon, boron, and boron nitride, and particularly graphite. It is preferable to include. Since these materials have a relatively small specific gravity and a low vapor pressure even at high temperatures, as described above, a material that does not easily dissolve in a constituent material constituting the rotating counter cathode, such as a material such as Cu or Co, is selected. As a result, the degree of evaporation due to the electron beam irradiation can be reduced. Furthermore, when having a certain degree of conductivity, charge-up can be suppressed when the electron beam is irradiated, and destruction of the coating can be effectively suppressed.

  The source gas 50 needs to be appropriately selected according to the constituent material of the coating film 17. For example, when the coating film 17 is made of graphite, a hydrocarbon gas can be used as the raw material gas 50. The hydrocarbon gas may be a gas such as methane, ethane, propane or acetylene, or a vapor such as benzene or naphthalene.

  In the case where the coating film 17 is composed of the other materials described above, a raw material gas used when the coating film 17 is formed using, for example, a general-purpose CVD method can be used. For example, titanium carbide or the like can be formed using titanium tetrachloride, methane, or the like. Further, silicon can be formed using silane gas.

  As mentioned above, although this invention was demonstrated in detail based on the said embodiment, this invention is not limited to the said embodiment, All the deformation | transformation and changes are possible unless it deviates from the category of this invention.

  For example, in the above-described embodiment, the generation of the X-ray 60 and the formation of the coating film 17 are performed at the same time. It can also be implemented. As a result, the electron beam irradiation part 11A of the rotating counter cathode 11 is already covered with the coating 17 during the actual X-ray generation process, so that evaporation of the target in the initial stage of the X-ray generation process can be suppressed. it can.

  Further, the electron gun 15 controls the beam diameter of the electron beam 40 so that the beam diameter when the source gas 50 is irradiated with the electron beam 40 is set to the rotating counter cathode 11 for the purpose of generating high-intensity X-rays. It can be configured to be larger than the beam diameter when the electron beam 40 is irradiated. This is because the strength of the electron beam 40 required when the source gas 50 is decomposed and / or synthesized using the electron beam 40 is different from the strength of the electron beam 40 required when generating X-rays. Due to that. That is, when generating the high-intensity X-ray 60, it is required to irradiate the high-intensity electron beam 40 by narrowing the beam diameter of the electron beam 40. However, the source gas 50 is decomposed and / or synthesized. In this case, the electron beam 40 having such a high intensity is not required, and the formation efficiency of the coating film 17 is increased by increasing the beam diameter of the electron beam 40 to increase the irradiation area of the source gas 50. .

  In this case, when the coating film 17 decreases and disappears in the generation process of the X-ray 60, the beam diameter of the electron beam 40 is temporarily enlarged to compensate for the decrease or disappearance portion of the coating film 17. can do.

  The characteristics of the electron gun 15 described above are particularly effective when the coating film 17 is formed during the annealing operation. That is, during the annealing operation, the source gas 50 is supplied from the film forming gas supply mechanism 30 and the electron beam 40 having a beam diameter larger than that of the electron gun 15 is irradiated toward the rotating counter cathode 11. For example, the coating film 17 can be formed using the startup time of the rotating anti-cathode X-ray generator 10. Therefore, the coating film 17 can be formed from the beginning so as to cover the electron beam irradiation part 11A within a predetermined driving time of the rotating anti-cathode X-ray generator 10.

  Further, the film forming gas supply mechanism 30 can be configured to be detachable in the case where it interferes with the operation when the generated X-ray is used.

  Further, in the above-described embodiment, the cylindrical portion 112 is erected substantially vertically at the side end portion of the main body portion 111, but can be inclined at an angle of several degrees toward the rotating shaft 12. In this case, even if the electron beam irradiation unit 11A is melted, it can be more effectively suppressed that the electron beam irradiation unit 11A is scattered outside the rotating counter cathode 11. Further, the cylindrical portion 112 can be inclined outward from the rotating shaft 12. In this case, the X-ray 60 can be easily taken out.

  Furthermore, in the above embodiment, the electron gun 15 and the rotating counter cathode 11 are placed in the same vacuum container 20, but a partition is provided in the approximate center of the vacuum container 20, so that the electron gun 15 and the rotating counter cathode 11 are practically disposed. It can also be set as the structure arrange | positioned in an independent vacuum vessel. In this case, the room in which the electron gun 15 is disposed and the room in which the rotating counter cathode 11 is disposed can be separately evacuated by differential exhaust (in general, the room in which the electron gun 15 is disposed). The degree of vacuum is increased by about 2 to 3 digits). Moreover, the electron beam 40 irradiates the rotating counter cathode 11 through a slit provided in the partition.

It is a schematic block diagram which shows the principal part in an example of the rotation anti-cathode X-ray generator of this invention. It is a figure which expands and shows the electron beam irradiation part vicinity of the rotation anti-cathode generator shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Rotating anti-cathode X-ray generator 11 Rotating anti-cathode 111 Rotating anti-cathode main body part 112 Rotating anti-cathode cylindrical part 11A Electron beam irradiation part 11B Groove part 12 Rotating shaft 15 Electron gun 16 Deflection electron lens 17 Film 20 Vacuum container 30 Film forming gas supply device 31 Film forming gas source 32 Valve 33 Depressurization tank 34 Flow rate adjusting valve 35 Nozzle 40 Electron beam 50 Raw material gas 60 X-ray G Centrifugal force

Claims (22)

A rotating anti-cathode;
An electron beam source for generating an X-ray by irradiating the rotating counter cathode with an electron beam in the same direction as the centrifugal force caused by the rotation of the rotating counter cathode;
For forming a film for forming a film that is provided so as to cover at least the electron beam irradiation part of the rotating counter cathode and suppresses evaporation of components of the rotating counter cathode from the electron beam irradiation part. A film forming gas supply mechanism for supplying gas;
A rotating anti-cathode X-ray generator.   The film forming gas introduction mechanism supplies the film forming gas to the vicinity of the irradiation portion of the electron beam of the rotating counter cathode, and the film forming gas is heated by the electron beam irradiation of the rotating cathode. The rotating anti-cathode X-ray generator according to claim 1, characterized in that is converted into the film.   The film forming gas introduction mechanism is configured to supply the film forming gas into the electron beam path so that the film forming gas is converted into the film by irradiation with the electron beam. The rotating anti-cathode X-ray generator according to claim 1 or 2, characterized by the above. The film forming gas introduction mechanism is configured to supply the film forming gas so that the pressure in the rotating anti-cathode X-ray generator is maintained at a pressure of 10 ⁻⁵ Torr or less. The rotating anti-cathode X-ray generator according to claim 1, wherein   The rotating anti-cathode X-ray generator according to claim 4, wherein the film forming gas introduction mechanism includes a film forming gas source and a decompression tank.   The rotating anti-cathode X according to any one of claims 1 to 5, wherein the coating does not dissolve in the rotating counter-cathode and is made of a material having a specific gravity smaller than that of the rotating counter-cathode member. Line generator.   The rotating pair according to claim 6, wherein the coating includes at least one selected from the group consisting of graphite, diamond, alumina, calcium oxide, magnesium oxide, titanium oxide, titanium carbide, boron, and boron nitride. Cathode X-ray generator.   The rotating anti-cathode X-ray generator according to claim 7, wherein the coating contains graphite.   The rotating counter-cathode X-ray generator according to claim 8, wherein the film-forming gas contains a hydrocarbon gas.   The rotating counter cathode X-ray generator according to claim 1, wherein at least a part of the rotating counter cathode is melted by the electron beam.   The electron beam source controls the beam diameter of the electron beam, irradiates the electron beam to the film forming gas, and irradiates the rotating counter cathode with the electron beam. The rotating anti-cathode X-ray generator according to any one of claims 3 to 10, characterized in that the diameter is larger than the beam diameter of the rotating X-ray cathode. Irradiating the rotating anti-cathode with an electron beam in the same direction as the centrifugal force caused by the rotation of the rotating anti-cathode to generate X-rays;
A film forming gas is supplied to the rotating counter cathode, covering at least the electron beam irradiation section, and forming a film that suppresses evaporation of the rotating counter cathode constituent member from the irradiation section of the electron beam. Steps,
An X-ray generation method comprising:   Supplying the film-forming gas to the vicinity of the irradiation part of the electron beam of the rotating anti-cathode, and converting the film-forming gas into the film by heat generated by the electron beam irradiation of the rotating counter-cathode. The X-ray generation method according to claim 12, wherein the method is characterized in that:   The X-ray generation according to claim 12 or 13, wherein the film forming gas is supplied into the electron beam path, and the film forming gas is converted into the film by irradiation of the electron beam. Method. The X-ray generation method according to any one of claims 12 to 14, wherein the film forming gas is supplied so that an atmospheric pressure is maintained at a pressure of 10 ^-5 Torr or less.   The X-ray according to any one of claims 12 to 15, wherein the coating film is made of a material having a specific gravity smaller than that of the rotating counter-cathode member without being dissolved in the rotating counter-cathode. How it occurs.   The X-ray according to claim 16, wherein the coating includes at least one selected from the group consisting of graphite, diamond, alumina, calcium oxide, magnesium oxide, titanium oxide, titanium carbide, boron, and boron nitride. How it occurs.   The X-ray generation method according to claim 17, wherein the coating contains graphite.   The X-ray generation method according to claim 18, wherein the film-forming gas contains a hydrocarbon gas.   The X-ray generation method according to claim 12, wherein at least a part of the rotating counter cathode is melted by the electron beam.   The beam diameter of the electron beam is controlled, and the beam diameter when irradiating the electron beam to the film forming gas is larger than the beam diameter when irradiating the electron beam to the rotating cathode. The X-ray generation method according to claim 14, wherein the X-ray generation method is performed.   The X-ray generation method according to claim 21, wherein the coating is formed during the annealing operation in the step of generating the X-rays.

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