JP2009048163A - Photosensitive resin composition, and screen printing plate and method for producing screen printing plate using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a screen printing plate capable of producing a printed circuit board having a linewidth of wiring of about 10 μm and a high aspect ratio, to provide a method for producing the screen printing plate, and to provide a photosensitive resin composition used for producing the screen printing plate. <P>SOLUTION: The photosensitive resin composition comprises (1) a methacrylate-based copolymer containing a structural unit represented by formula (I), (2) a photoradical initiator, (3) a photoacid generator capable of generating an acid upon irradiation with light different in wavelength region from light which allows the photoradical generator to generate a radical, and (4) a crosslinking agent which causes a crosslinking reaction under the radical. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a screen printing plate used for manufacturing printed circuit boards, IC packages, chip inductors, filters, antennas, etc., a method for manufacturing the same, and a photosensitive resin composition used therefor, in particular, a high aspect ratio (high wiring ratio). The present invention relates to a screen printing plate for producing a printed circuit board having fine wiring of a value obtained by dividing the thickness by a line width, a method for producing the same, and a photosensitive resin composition used therefor.

  Conventional screen plate making involves coating a resin layer by applying a photosensitive resin, polyvinyl alcohol (hereinafter abbreviated as PVA) -diazo-based photosensitive agent, onto a stainless steel (hereinafter abbreviated as SUS) screen. Then, the resin layer is exposed to a circuit pattern to be crosslinked and cured (in the case of a negative type), and the uncured portion is washed (developed) (see Patent Documents 1, 2, and 3). ).

However, in the method for producing a screen printing plate, the wiring width is 30 μm or less and the fine wiring has a high aspect ratio because the resin layer swells during development and the circuit pattern meanders and deforms. A printed circuit board could not be manufactured.
JP 2005-292780 A JP 2001-133976 A Japanese Patent Laid-Open No. 11-344801

  Therefore, the present invention is a screen printing plate capable of producing a printed circuit board having a fine line width of 10 μm or less and a high aspect ratio, a method for producing the same, and a method for producing the screen printing plate. It is an object to provide a photosensitive resin composition.

  By using a photosensitive resin composition containing a methacrylate copolymer containing a specific structural unit, a photo radical initiator, a photo acid generator, and a crosslinking agent, the inventors can form a fine wiring with a high aspect ratio. Successfully produced a screen plate with.

That is, the photosensitive resin composition according to claim 1 is:
(1) Formula (I)
(2) Photoradical initiator, (3) Light generating radicals in the photoradical initiator generates acid by irradiation with light having a different wavelength range. A photoacid generator that performs (4) a crosslinking agent that undergoes a crosslinking reaction by radicals.

The photosensitive resin composition according to claim 2 is the photosensitive resin composition according to claim 1, wherein the methacrylate copolymer is:
Formula (II)
The structural unit represented by these is included.

The photosensitive resin composition of Claim 3 is the photosensitive resin composition of Claim 1 or Claim 2, Comprising: A methacrylate type copolymer is,
General formula (III)
(In the formula, R represents either H or CH ₃ , and m represents either 1 or 2)
The structural unit represented by these is included.

  The photosensitive resin composition according to claim 4 is the photosensitive resin composition according to any one of claims 1 to 3, wherein the photoacid generator generates an acid by i-line (365 nm). It consists of a compound.

  The photosensitive resin composition of Claim 5 is the photosensitive resin composition in any one of Claims 1-4, Comprising: While suppressing a crosslinking reaction in an exposure process, it crosslinks in a post-exposure process. It contains a polymerization inhibitor that hardly inhibits the reaction.

  A method for producing a screen printing plate according to claim 6 is a resin layer forming step of forming a resin layer by applying and drying the photosensitive resin composition according to any one of claims 1 to 5 on a screen. And an exposure step of exposing the circuit pattern by irradiating the resin layer on the screen with light having a wavelength region different from that of the light generated by the radical radical initiator, and developing and removing the exposed portion of the resin layer A method comprising, in this order, a development step and a post-exposure step of irradiating light containing light having a wavelength at which the photo-radical initiator generates radicals to crosslink portions not removed in the development step of the resin layer. It is.

  A method for producing a screen printing plate according to claim 7 is a method for producing a screen printing plate according to claim 6, wherein a screen surface-treated with a silane coupling agent is used.

  The screen printing plate according to claim 8 is produced by the method for producing a screen printing plate according to claim 6 or 7.

  The photosensitive resin composition according to claim 1 is present in the exposed portion because the acid generated from the photoacid generator decomposes the tetrahydropyranyl group of the methacrylate copolymer and changes its polarity when exposed to light. The methacrylate copolymer is easily dissolved in an aqueous developer. On the other hand, the non-exposed portion maintains hydrophobicity and does not swell with an aqueous developer. Therefore, if this photosensitive resin composition is used for the production of a screen printing plate, the wiring constituting the circuit pattern can be made into a fine wiring having a higher aspect ratio.

  Moreover, after forming a circuit pattern, the intensity | strength of a resin layer can be improved by radically polymerizing a crosslinking agent and a methacrylate type copolymer with a photoradical initiator.

  By the photosensitive resin composition of Claim 2 and Claim 3, the intensity | strength of the resin layer which consists of a photosensitive resin composition, and the adhesive strength of a resin layer and a screen can be raised more, Screen printing plate The service life can be further extended.

  The photosensitive resin composition according to claim 4 is generally used for the production of printed circuit boards, and a high-pressure mercury lamp, which is an inexpensive light source, can be used for the production of screen printing plates.

  The photosensitive resin composition according to claim 5 can inhibit or suppress the cross-linking reaction in the exposure step, thereby suppressing development failure and facilitating the formation of a fine pattern.

  In the method for producing a screen printing plate according to claim 6, after forming a circuit pattern having fine wiring with a high aspect ratio by using a methacrylate copolymer and a photoacid generator, the circuit pattern is formed by using a crosslinking agent and a light. The radical initiator is crosslinked and cured. This makes it possible to manufacture a screen printing plate that can be used for manufacturing a printed circuit board having fine wiring with a high aspect ratio.

  According to the printing plate manufacturing method of the seventh aspect, durability of the screen printing plate, specifically, adhesion between the resin layer and the screen can be improved.

  By using the screen printing plate according to claim 8, a printed board having fine wiring with a high aspect ratio can be formed at low cost.

1. Photosensitive resin composition The photosensitive resin composition according to the present invention is composed of (1) methacrylate copolymer, (2) photoradical initiator, and (3) light that generates radicals in photoradical initiator. It contains a photoacid generator that generates an acid upon irradiation with light in different regions, and (4) a crosslinking agent that undergoes a crosslinking reaction with radicals, and may contain various additives and solvents as necessary. Therefore, these will be described in detail below.

(1) Methacrylate-based copolymer As shown in FIG. 1, the methacrylate-based copolymer contains the formula (I) as a constituent unit. The molecular weight of the methacrylate-based copolymer is preferably 3000 to 100,000, and more preferably 5000 to 20000. This is because if the molecular weight is 3000 or less, the resin strength is remarkably weak, and if it is 100000 or more, it is difficult to dissolve in an aqueous developer.

  In this methacrylate copolymer, an ester leaving group is eliminated by an acid generated from a photoacid generator, and a methacrylic acid monomer unit is generated. The light irradiated portion is dissolved by development with an alkaline aqueous solution or the like to form a positive pattern.

  Further, as shown in FIG. 1, this methacrylate copolymer may contain formula (II) and general formula (III) as constituent units. By containing these as structural units, the adhesion and strength between the photosensitive resin composition and the screen can be improved. In addition, when this methacrylate type copolymer contains a some structural unit, any of a random copolymer, an alternating copolymer, and a block copolymer may be sufficient.

  Furthermore, the methacrylate copolymer may contain a monomer having a hemiacetal ester group as a constituent unit. For example, a monomer having a hemiacetal ester group can be obtained by reaction of a cyclic vinyl ether or alkyl vinyl ether with a carboxyl group. Examples of cyclic vinyl ethers other than 3,4-dihydro-2H-pyran that can be used in the methacrylate monomer (I) include 2,3-dihydrofuran, 3,4-dihydrofuran, 2,3-dihydro-2H-pyran, and 3,4. -Dihydro-2-methoxy-2H-pyran, 3,4-dihydro-4,4-dimethyl-2H-pyran-2-one, 3,4-dihydro-2-ethoxy-2H-pyran and the like. In addition, alkyl vinyl ether or the like can also be used. For example, methyl vinyl ether, ethyl vinyl ether, isopropyl vinyl ether, n-propyl vinyl ether, isobutyl vinyl ether, n-butyl vinyl ether, t-butyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether and the like can be mentioned. By including a monomer having a hemiacetal ester group obtained from an alkyl vinyl ether or cyclic vinyl ether and a carboxyl group, an effect equivalent to that of the methacrylate monomer (I) can be obtained.

  In addition to the structural unit (II), known (meth) acrylic acid esters, ethylenically unsaturated carboxylic acids, and other copolymerizable monomers may be used to enhance adhesion. Specifically, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, phenoxy polyethylene glycol acrylate, phenoxy polyethylene glycol methacrylate, styrene, nonyl phenoxy polyethylene glycol monoacrylate, nonyl phenoxy polyethylene glycol monomethacrylate Nonylphenoxy polypropylene monoacrylate, Nonylphenoxy polypropylene monomethacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-acryloyloxyethyl phthalate, 2-acryloyloxyethyl-2-hydroxyethyl phthalate, 2-methacryloyloxyethyl -2-hydroxy Propyl phthalate, methyl acrylate, ethyl acrylate, methyl methacrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, i-propyl acrylate, i-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, i-butyl acrylate, i-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, 3 -Hydroxypropyl methacrylate, 2-hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, 3-hydroxybutyl acrylate, 3-hydroxybuty Methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, 3-ethylhexyl acrylate, ethylene glycol monoacrylate, ethylene glycol monomethacrylate, glycerol acrylate, glycerol methacrylate, glycerol monoacrylate, glycerol monomethacrylate, dimethylaminoethyl acrylate, dimethyl Aminoethyl methacrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, amides such as methacrylamide and acryloylmorpholine, acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid, Itaconic anhydride, citraconic acid, citraconic anhydride and the like can be mentioned. In addition, you may use a methacrylate type copolymer individually or in mixture of 2 or more types as needed.

  As a method for introducing an ethylenically unsaturated group in the structural unit III, a method of adding an isocyanate having a (meth) acryloyl group to a hydroxyl group in the methacrylate copolymer is preferable. Such compounds include 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, 2- (2-methacryloylethyloxy) ethyl isocyanate, 2- (2-acryloylethyloxy) ethyl isocyanate, dimethyl (Meth) -isopropenylbenzyl isocyanate, 1,1-bis (acryloyloxymethyl) ethyl isocyanate, methacryloyl isocyanate and the like can be mentioned. Of these, 2-methacryloyloxyethyl isocyanate and 2-acryloyloxyethyl isocyanate are preferred. In addition, you may add 2 or more types of these compounds as needed.

  In the case of a copolymer having only the compound of formula (I), formula (II), or general formula (III) as a constituent unit, the ratio of the compound of formula (I), formula (II), or general formula (III) That is, x: y: z in FIG. 1 is preferably such that x is 5 mol% to 95 mol%, y is 4 mol% to 50 mol%, z is 1 mol% to 45 mol%, and x is 15 mol% to 90 mol%, y Is more preferably 10 mol% to 45 mol% and z is 5 mol% to 40 mol%. This is because if the molar ratio of x is too low, it is difficult to dissolve in an aqueous developer, and if the molar ratio of y, z is too low, the adhesion to the screen and the strength are reduced.

(2) Photoradical initiator The photoradical initiator can be used without particular limitation as long as it is a known compound. Specific examples of such compounds include acetophenones such as acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, and p-tert-butylacetophenone. Benzophenones such as benzophenone, 2-chlorobenzophenone, p, p-bisdimethylaminobenzophenone, benzoin ethers such as benzyl, benzoin, benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, Sulfur compounds such as thioxanthene, 2-chlorothioxanthene, 2,4-diethylthioxanthene, 2-methylthioxanthene, 2-isopropylthioxanthene, 2-ethylanthraquinone, octa Anthraquinones such as methyl anthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone, thiol compounds such as 2-mercaptobenzoimidar, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2- (o -Chlorophenyl) -4,5-di (m-methoxyphenyl) -imidazolyl dimer and other imidazolyl compounds, p-methoxytriazine and other triazine compounds, 2,4,6-tris (trichloromethyl) -s- Triazine, 2-methyl-4,6-bis (trichloromethyl) -s-triazine, 2- [2- (5-methylfuran-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s- Triazine, 2- [2- (furan-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (4-diethylamino-2-methylphenyl) ethenyl] -4 , 6-Bis (Trichrome Methyl) -s-triazine, 2- [2- (3,4-dimethoxyphenyl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6- Bis (trichloromethyl) -s-triazine, 2- (4-ethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-n-butoxyphenyl) -4,6-bis ( And triazine compounds having a halomethyl group such as trichloromethyl) -s-triazine and aminoketone compounds such as 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one. In addition, you may use these individually or in mixture of 2 or more types as needed.

  However, (3) In order to use an inexpensive high-pressure mercury lamp as a light source for generating acid in the photoacid generator, the photoradical initiator is preferably a compound that generates radicals with light having a shorter wavelength than i-line. . Moreover, you may use together thermal polymerization initiators other than radical photopolymerization initiator.

  Specific examples of such thermal polymerization initiators include 2,2'-azobis (2-methylbutyronitrile), 2,2'-azobisisobutyronitrile, 2,2'-azobis- (4 Nitrile azo compounds (nitrile azo polymerization initiators) such as -methoxy-2,4-dimethylvaleronitrile); dimethyl 2,2'-azobis (2-methylpropionate), 2,2'-azobis ( Non-nitrile azo compounds (non-nitrile azo polymerization initiators) such as 2,4,4-trimethylpentane); t-hexyl peroxypivalate, tert-butyl peroxypivalate, 3,5,5-trimethylhexanoyl Peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, 1,1,3,3-tetramethylbutylperoxy 2-ethylhexanoate, succinic peroxide, 2,5-dimethyl-2,5-di (2- Tylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, 4-methylbenzoyl peroxide, benzoyl peroxide, 1,1'-bis- And organic peroxides (peroxide-based polymerization initiators) such as (tert-butylperoxy) cyclohexane and hydrogen peroxide. Of these, azo polymerization initiators are preferred.

  The amount of the photoradical initiator used is preferably about 5 to 90% by weight, more preferably about 15 to 50% by weight of the crosslinking agent, although it depends on the type. If it is 5% by weight or less, the radical photopolymerization becomes insufficient and the strength is remarkably deteriorated. This is because the adhesion is remarkably deteriorated.

(3) Photoacid generator The photoacid generator is not particularly limited as long as it is a known compound that generates an acid upon irradiation with light having a wavelength range different from that of light that generates radicals in the photoradical initiator. can do. However, in order to use an inexpensive high-pressure mercury lamp as a light source for generating an acid, the photoacid generator is preferably a compound that generates an acid by i-line. Specific examples of such compounds include triphenylsulfonium triflate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium naphthalenesulfonate, (hydroxyphenyl) benzylmethylsulfonium toluenesulfonate, diphenyliodonium triflate, diphenyliodonium pyrenesulfonate. , Diphenyliodonium dodecylbenzenesulfonate, diphenyliodonium hexafluoroantimonate, p-methylphenyldiphenylsulfonium nonafluorobutanesulfonate, tri (tert-butylphenyl) sulfonium trifluoromethanesulfonate, and the like. In addition, you may use these individually or in mixture of 2 or more types as needed.

  The amount of the photoacid generator added is preferably about 0.1 to 30% by weight, more preferably about 1.0 to 10% by weight, based on 100% by weight of the resin content of the methacrylate copolymer, although it depends on the type. This is because if the amount is less than 0.1% by weight, the polarity-changing group is not sufficiently eliminated and it is difficult to dissolve in an aqueous developer, and if it is more than 30% by weight, the photoacid generator greatly affects the physical properties as an impurity. This is because the strength and the adhesion to the screen are remarkably deteriorated.

(4) Crosslinking agent A crosslinking agent can be used without particular limitation as long as it is a known compound that undergoes radical copolymerization with a methacrylate copolymer by the action of radicals generated by a photoradical initiator and crosslinks. Specific examples of such compounds include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, and polyethylene glycol di (meth) acrylate. , Polypropylene glycol di (meth) acrylate, hexane di (meth) acrylate, neopentyl glycol di (meth) acrylate, ethoxylated bisphenol A di (meth) acrylate, propoxylated bisphenol A di (meth) acrylate, glycerin di (meth) acrylate , Glycerin tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, 1,4-butanediol diacrylate, ethoxylated trimethylol prop Tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate (DPHA) ), Dipentaerythritol penta (meth) acrylate (DPPA), ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate and the like (meth) acrylates. In addition, the polyhydric alcohol may have an ether bond, an ester bond, or a urethane bond in the molecule, and is more preferably a polyfunctional (meth) acrylate.

  Among them, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meta) for reasons of improving solubility in aqueous developers and bendability of the coating film. ) Acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethoxylated bisphenol A di (meth) acrylate, propoxylated bisphenol A di (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, Propoxylated trimethylolpropane tri (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, propoxylated pentaerythritol tetra (meth) acrylate , Ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate are preferable. In addition, you may use these individually or in mixture of 2 or more types as needed.

  The addition amount of the crosslinking agent is preferably about 5 to 90% by weight, more preferably 10 to 50% by weight based on 100% by weight of the resin content of the methacrylate copolymer, although it depends on the type. This is because if it is 5% by weight or less, the strength is remarkably weak, and if it is 90% by weight or more, the crosslinking density becomes higher than necessary and becomes extremely brittle, and cracks are generated in some cases.

(5) Additives and Solvents This photosensitive resin composition is compatible with additives as necessary for the purpose of improving sensitivity, coatability, adhesion, heat resistance, chemical resistance, for example, Additives such as plasticizers, stabilizers, surfactants, thickeners, antifoaming agents, leveling agents, and dispersing agents may be added. In addition, these addition amounts should just be a range which does not impair the effect of the photosensitive resin composition, and should just be determined according to the use.

  Moreover, in order to improve the coating property to a screen, a drying retarder may be added to the photosensitive resin composition as necessary to adjust the appropriate solvent and drying time, and the viscosity is adjusted to adjust the viscosity after dilution. Regulators may be added.

  Specific examples of the solvent include toluene, xylene, ethylbenzene, aromatic petroleum naphtha, tetralin, turpentine oil, Solvesso # 100 (Exxon Chemical Co., Ltd. registered trademark), Solvesso # 150 (Exxon Chemical Co., Ltd. registered trademark), etc. Aromatic hydrocarbons; ethers such as dioxane, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate , Butyl acetate, amyl acetate, methoxybutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol Esters and ether esters such as nomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate; acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl amyl ketone, cyclohexanone, isophorone , Ketones such as mesityl oxide, methyl isoamyl ketone, ethyl n-butyl ketone, ethyl amyl ketone, diisobutyl ketone, diethyl ketone, methyl propyl ketone, diisobutyl ketone; trimethyl phosphate, triethyl phosphate, dimethyl sulfoxide, etc. .

  Among them, due to the storage stability of the photosensitive agent and the drying speed of the coating film, toluene, xylene, ethylbenzene, aromatic petroleum naphtha, tetralin, turpentine oil, Solvesso # 100 (registered trademark of Exxon Chemical Co., Ltd.), Solvesso # 150 Aromatic hydrocarbons such as (Exxon Chemical Co., Ltd. registered trademark), methyl isobutyl ketone, and methyl amyl ketone are preferred.

  Specific examples of dry retarders include 3-methoxybutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol diacetate, ethylene glycol diethyl ether, ethylene glycol diester. Butyl ether, ethylene glycol dimethyl ether, ethylene glycol monophenyl ether acetate, ethylene glycol monohexyl ether acetate, glycerin triacetate, glycerin trilaurate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol Diethyl acetate, diethylene glycol dimethyl ether acetate, diethylene glycol diethyl ether acetate, diethylene glycol dibutyl ether acetate, diethylene glycol dibenzoate, triethylene glycol dimethyl ether, triethylene glycol monomethyl ether acetate, propylene glycol diacetate, propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol dibutyl ether , Propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether acetate, dipropylene glycol diacetate, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene Glycol dibutyl ether, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, ethylene glycol, diethylene glycol, propylene glycol, alcohols such as 3-methoxy-3-methylbutanol, ethylene glycol monomethyl Ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol monomethyl ether, alkyl ethers of polyhydric alcohols such as propylene glycol monoethyl ether, terpineol, dihydroterpineol, methyl isobutyl ketone, acetylacetone, acetophenone, Sophorone, ethyl-N-butyl ketone, diacetone alcohol (4-hydroxy-4-methyl-2-pentanone), diisobutyl ketone, diisopropyl ketone, diethyl ketone, cyclohexanone, di-N-propyl ketone, methyl-N-amyl ketone (amyl) Methyl ketone), methyl cyclohexanone, methyl-N-butyl ketone, methyl-N-propyl ketone, methyl-N-hexyl ketone, methyl-N-heptyl ketone, diethyl adipate, trimethyl acetyl citrate, triethyl acetyl citrate, acetyl citrate Tributyl, methyl acetoacetate, ethyl acetoacetate, butyl acetoacetate, isoamyl benzoate, methyl benzoate, ethyl benzoate, butyl benzoate, propyl benzoate, benzyl benzoate, isoamyl formate, isobutyl formate, ethyl formate, butyl formate , Propyl acid, hexyl formate, benzyl formate, methyl formate, triethyl citrate, tributyl citrate, amyl acetate, allyl acetate, isoamyl acetate, methyl isoamyl acetate, methoxybutyl acetate, isobutyl acetate, isopropyl acetate, ethyl acetate, methyl acetate, acetic acid Secondary hexyl, 2-ethylhexyl acetate, 2-ethylbutyl acetate, cyclohexyl acetate, methyl cyclohexyl acetate, n-butyl acetate, sec-butyl acetate, isopropyl acetate, benzyl acetate, methyl cyclohexyl acetate, diamyl oxalate, oxalic acid Diethyl, diethyl oxalate, dibutyl oxalate, diethyl tartrate, dibutyl tartrate, amyl stearate, methyl stearate, ethyl stearate, butyl stearate, amyl lactate, methyl lactate, ethyl lactate, butyl lactate, phthalate Esters, γ-butyrolactone, isoamyl propionate, methyl propionate, ethyl propionate, butyl propionate, benzyl propionate, diisopropyl malonate, dimethyl malonate, diethyl malonate, dibutyl malonate, isoamyl butyrate, isopropyl butyrate, methyl butyrate And ethyl butyrate and butyl butyrate.

  Of these, 3-methoxybutyl acetate, propylene glycol monomethyl ether acetate and the like are preferable because of the drying speed and uniformity of the coating film. In addition, you may use these solvent and a dry retarder individually or in mixture of 2 or more types as needed.

  Furthermore, in order to prevent the light generated to generate acid in the photoacid generator in the exposure process, radicals are generated, the crosslinking agent undergoes a crosslinking reaction, and development failure occurs, making it difficult to form a fine pattern. While suppressing the crosslinking reaction in the process, a polymerization inhibitor that hardly inhibits the crosslinking reaction may be added in the post-exposure process.

  A radical polymerization inhibitor can be used as such a polymerization inhibitor. Specifically, quinone polymerization inhibitors such as hydroquinone, methoxyhydroquinone, benzoquinone, p-tert-butylcatechol; 2,6-di-tert-butylphenol, 2,4-di-tert-butylphenol, 2-tert- Alkylphenol polymerization inhibitors such as butyl-4,6-dimethylphenol, 2,6-di-tert-butyl-4-methylphenol, 2,4,6-tri-tert-butylphenol; alkylated diphenylamine, N, N Amine polymerization inhibitors such as ´-diphenyl-p-phenylenediamine and phenothiazine; 4-hydroxy-2,2,6,6-tetramethylpiperidine, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine 1,4-dihydroxy-2,2,6,6-tetramethylpiperidine, 1-hydroxy-4-benzoyloxy-2,2,6,6-tetramethylpiperidine, 2,2,6,6-tetramethyl Piperidine-N-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidi Piperidine polymerization is prohibited, such as -N-oxyl, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine-N-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl Agents: copper dithiocarbamate polymerization inhibitors such as copper dimethyldithiocarbamate, copper diethyldithiocarbamate, copper dibutyldithiocarbamate and the like.

  Of these, a piperidine polymerization inhibitor is preferred because it suppresses the crosslinking reaction in the exposure step and hardly inhibits the crosslinking reaction in the post-exposure step. In addition, you may use these polymerization inhibitors individually or in mixture of 2 or more types as needed.

2. Screen printing plate A screen printing plate is formed by applying a photosensitive resin composition of the present invention on a screen or pasting a photosensitive resin composition on a film to form a resin layer. After the circuit pattern is formed, the resin layer is manufactured by crosslinking and curing. Specifically, it is manufactured by the following (1) resin layer forming step, (2) exposure step, (3) development step, and (4) post-exposure step. Therefore, these will be described in detail below.

(1) Resin layer formation process It is the process of apply | coating and drying a photosensitive resin composition to a screen, laminating | stacking by predetermined thickness, and forming a resin layer. The thickness of the resin layer is preferably 2 μm to 200 μm and more preferably 10 μm to 20 μm in order to reduce the line width of the circuit pattern and form a fine wiring with a high aspect ratio.

  The screen can be used without particular limitation as long as it is a known screen printing screen. For example, a stainless steel or polyester screen is stretched on a flat screen mold made of a metal rod-like material such as aluminum in a square or rectangular shape.

  The screen has a surface treatment with a silane coupling agent, a surface roughening treatment with wet blasting, an ultraviolet ray to improve the durability of the screen printing plate (adhesive strength of the resin layer, abrasion resistance, solvent resistance). What processed the surface by the surface treatment by plasma, the surface treatment by plasma, etc. is preferable.

  In addition, as a method for forming the resin layer, a method in which a photosensitive resin composition is directly applied and dried using a bucket (direct method), and a resin in which a photosensitive resin composition is applied and dried on a resin film or the like is used. A known method such as a method of obtaining a film and transferring the resin film onto a screen coated with a photosensitive resin composition (indirect method) can be used without particular limitation.

(2) Exposure step In this step, the circuit pattern is exposed by irradiating the resin layer on the screen with light having a wavelength region different from that of the light generated by the radical photoinitiator through a photomask. Through this process, the tetrahydropyranyl group of the methacrylate copolymer is eliminated and the polarity changes in the portion of the resin layer exposed to light transmitted through the photomask, as shown in FIG. The polarity-change methacrylate copolymer is easily dissolved in the developer.

  Here, the photomask can be used without particular limitation as long as it is a known one such as a film mask or a chrome mask, but the chrome mask is preferable in consideration of the accuracy of the screen printing plate to be produced.

  The light source is a combination of an optical filter and a known light source such as a mercury lamp or a halogen lamp that emits ultraviolet light or visible light, and emits light in a wavelength region that can generate acid in the photoacid generator. It can be generated and does not generate light in the wavelength region that generates radicals in the photoradical initiator. Among them, it is preferable to combine an inexpensive mercury lamp and an optical filter to generate i-line (365 nm) but not to generate light having a wavelength of 254 nm. The exposure time can be freely set according to the used and photosensitive resin composition.

(3) Development process The exposed portion of the resin layer is developed by immersing the screen having the exposed resin layer in a developer, rubbing with a waste cloth, or spraying the developer with a spray to expose the resin layer. This is a step of removing the methacrylate-based copolymer whose polarity has changed in the portion. By this step, a circuit pattern can be formed.

  The developer can be used without particular limitation as long as it is a known water or alkaline aqueous solution, but an aqueous solution of tetramethylammonium hydroxide is preferred for the reason of solubility. The development method and development time can be freely set according to the developer used and the photosensitive resin composition.

(4) Post-exposure step This is a step of irradiating light containing light having a wavelength at which the photo radical initiator generates radicals to crosslink the unexposed portion of the resin layer. The radicals generated in this step cause the methacrylate copolymer and the crosslinking agent to be crosslinked and cured.

  The light source is a combination of a known light source such as a mercury lamp or a halogen lamp that emits ultraviolet light, visible light, or the like and an optical filter, and may generate light in a wavelength region that generates radicals in the photo radical initiator. Specifically, those that generate light including 254 nm are preferable.

  Since this photosensitive resin composition and screen printing plate can be used for drawing fine wiring, in addition to manufacturing printed circuit boards, peripheral circuits for liquid crystal display devices, hybrid ICs, wiring circuits for electronic components It can also be used for formation.

  The present invention will be described below with reference to examples. However, the scope of the claims of the present invention is not limited in any way by the following examples.

1. Preparation and evaluation of methacrylate copolymers
Using 2-tetrahydropyranyl methacrylate (hereinafter abbreviated as M-THP) and 2-hydroxyethyl methacrylate (hereinafter abbreviated as 2-HEMA), three kinds of methacrylate copolymers were converted into organic solvents. It was prepared by a solution polymerization method using

(1) Reagent
M-THP (Product name: NK ester M-THP, Shin-Nakamura Chemical Co., Ltd.), 2-HEMA (Product name: Acryester HO, Mitsubishi Rayon), Photoradical polymerization initiator 2,2'-azobis (2-methylbutyrate) (Ronitrile) (hereinafter abbreviated as AMBM. Product name: V-59, Wako Pure Chemical Industries, Ltd.) and toluene were used as they were purchased.

  In addition, 2-isocyanatoethyl methacrylate (product name: Karenz MOI, Showa Denko), which was subjected to addition reaction with 2-HEMA in the main chain to introduce a double bond in the side chain, dibutyltin, which is a catalyst for the addition reaction Also purchased laurate (product name: STANN-BL, Sankyo Co., Ltd.), polymerization inhibitor 2,6-di-t-butyl-4-methylphenol (abbreviation: BHT, Sumitomo Chemical) Used as is.

(2) Measuring equipment and measuring method _Mn and _Mw of the methacrylate copolymer are pump (JASCO, 880-PU), detector (JASCO, RI-1530,870-UV), degasser (JASCO, DG- 980-53), a thermostat (Chromatoscience, CS-600H), and a column (Showa Denko, KF-805L) were used for measurement using a SEC (size exclusion chromatography) measuring device. Note that THF was used as the eluent, the analysis temperature was set to 40 ° C., and the flow rate was set to 1.0 ml / min. Polystyrene (Tosoh) was used as the molecular weight standard substance.

(3) Preparation of methacrylate copolymer (i) Preparation of HAR-2-1
92.4 parts (90 mol%) of M-THP, 7.6 parts (10 mol%) of 2-HEMA, 150.0 parts of toluene, and 6.0 parts of AMBN were placed in a 500 mL four-necked flask and subjected to radical polymerization at 90 ° C. for 6 hours. The resulting toluene solution (40% by weight) of the methacrylate copolymer was named HAR-2-1. The yield of the methacrylate solution polymerization polymer was 98%. Further, the prepared methacrylate copolymer had an _Mw of 8630 and an _Mw / _Mn of 2.66.

(Ii) Preparation of AP-HAR-200 with a double bond introduced in the side chain
170.1 parts of M-THP, 23.0 parts of 2-HEMA, 301.1 parts of toluene, and 11.6 parts of AMBN were placed in a 1000 mL four-necked flask and subjected to radical polymerization at 90 ° C. for 6 hours. Subsequently, 9.2 parts of Karenz MOI, 0.30 part of BHT, 0.10 part of dibutyltin dilaurate and 11 parts of toluene were placed in the same four-necked flask and reacted at about 70 ° C. for 90 minutes. The resulting toluene solution (40 wt%) of the methacrylate copolymer was named AP-HAR-200. The yield of the methacrylate solution polymerized polymer was 97%. Further, the prepared methacrylate copolymer had Mw of 8680 and Mw / Mn of 2.53.

(Iii) Preparation of AP-HAR-201 with a double bond introduced in the side chain
200.0 parts of M-THP, 51.0 parts of 2-HEMA, 376.5 parts of toluene, and 15.1 parts of AMBN were placed in a 1000 mL four-necked flask and subjected to radical polymerization at 90 ° C. for 6 hours. Next, 36.6 parts of Karenz MOI, 0.43 part of BHT, 0.14 part of dibutyltin dilaurate and 39.0 parts of toluene were placed in the same four-necked flask and reacted at about 70 ° C. for 90 minutes. The resulting toluene solution (40 wt%) of the methacrylate copolymer was named AP-HAR-201. The yield of the methacrylate solution polymerized polymer was 97%. Further, Mw of the prepared methacrylate copolymer was 9250, and Mw / Mn was 2.20.

2. Evaluation of Resin Composition A resin composition not containing a crosslinking agent and a photo radical initiator was prepared, and a screen printing plate using the resin composition was produced, and the resolution was evaluated.

(1) Reagent HAR-2-1 produced in Example 1 was used as the methacrylate copolymer. Further, CPI-100P (49% polypropylene carbonate solution, San Apro Co., Ltd.) was used as the photoacid generator. Furthermore, 3-methoxybutyl acetate (hereinafter abbreviated as Metoace; Shin-Nakamura Chemical Co., Ltd.) is used as a dry retarder, and tetramethylammonium hydroxide pentahydrate (hereinafter abbreviated as TMAH). Co., Ltd.) was used.

(2) Screen The screen was a 500-mesh calendered screen (thickness 20 μm) woven from stainless steel (SUS304) wire having a wire diameter of 16 μm. The bias angle when the screen was stretched on the frame was 23 °.

(3) Exposure apparatus A parallel light ultraviolet exposure apparatus was used for exposure of the circuit pattern. The main wavelength of this light source is 365 nm, and no light with a wavelength of 254 nm is generated.

(4) Production of screen printing plate (i) Formation of resin layer
Add CPI-100P to 5% by weight of HAR-2-1 resin, mix, and let stand to evaporate the solvent, until the solid content is 50% to 60% by weight. Was raised. Methoace was added to adjust the viscosity, and this resin composition was applied to the printed surface of the screen with a bucket so that the thickness was 10 to 12 μm, and dried with hot air in the dark at 40 ° C. for 3 hours or more.

(Ii) Pattern formation First, a photomask was brought into close contact with the screen on which the resin layer was formed, and exposed with a parallel light ultraviolet exposure device (wavelength 365 nm). The amount of the irradiated ultraviolet (main exposure) were prepared with different screens and ^{758J / cm 2, 948J / cm} 2, 1138J / cm 2. The photomask used was Line / Space = 10/10 μm. Next, it was developed by dipping in a 2.38 wt% TMAH aqueous solution for 8 minutes. Finally, the developed screen was washed with water and dried with hot air at 40 ° C.

(5) Evaluation of resin layer The resin layer on the screen was observed with a scanning electron microscope (JSM-6480LV, JEOL, hereinafter abbreviated as SEM). The result is shown in FIG.

  As shown in FIG. 2, a resolution of Line / Space = 10/10 μm could be obtained. It was also found that the edge of the circuit pattern was sharp. Furthermore, there was no significant change in the aperture width even when the exposure amount was changed. In addition, since the thickness of the stainless steel screen is 20 μm and the resist film thickness is 10 μm, the total thickness is 30 μm, so the circuit pattern can be made high in aspect. However, there was a problem with the strength of the resin layer. Then, the improvement of the intensity | strength of the resin layer was tried by adding a crosslinking agent and a photoinitiator and performing post-exposure.

3. Preparation of photosensitive resin composition, production and evaluation of screen printing plate Preparation of photosensitive resin composition, production of screen printing plate using the same, and influence of post-exposure process on resin layer strength evaluated. A circuit pattern was not formed.

(1) Reagents The same methacrylate copolymer, photoacid generator, toluene, dry retarder, and developing reagent as in Example 2 were used. The crosslinking agent used was NK ester A-DPH (hereinafter abbreviated as A-DPH. 6 functional groups, Shin-Nakamura Chemical Co., Ltd.), and the photoradical initiator Darocur 1173 (Ciba Specialty Chemicals Co., Ltd.).

(2) Screen and post-exposure apparatus The screens were obtained by calendering a 500-mesh screen (thickness 20 μm) woven from stainless steel (SUS304) wire having a wire diameter of 16 μm. The bias angle when the screen was stretched on the frame was 23 °. For the post-exposure with the photo radical initiator, an ultraviolet post-exposure device that generates light having a wavelength of 254 nm was used.

(3) Production of screen printing plate (i) Preparation of photosensitive resin composition
The resin component of HAR-2-1 and A-DPH were mixed so that the weight ratio was 4: 1. CPI-100P was added to this so that it might become 5 weight% with respect to the resin content of HAR-2-1. Furthermore, Darocur 1173 was added so that it might become 5 weight% with respect to A-DPH, and the photosensitive resin composition was prepared.

(Ii) Formation of resin layer The photosensitive resin composition was stored at room temperature and in a dark place, thereby evaporating the solvent to some extent to increase the viscosity, and adjusting the viscosity by adding metose. Then, the viscosity-adjusted photosensitive resin composition was applied to the print surface of the screen so as to have a thickness of 10 to 12 μm, and dried at 40 ° C. for 3 hours or more in a dark place.

(iii) Post-exposure The dried screen was post-exposed with an ultraviolet post-exposure device to crosslink the resin layer to produce a screen printing plate. The screen was manufactured by changing the post-exposure time to 0 minutes, 3 minutes, and 10 minutes.

(4) Strength test of resin layer The resin layer of the screen printing plate produced by changing only the post-exposure time was rubbed with a waste cloth containing toluene for 1 minute, and the change in film thickness before and after the friction (reduced film thickness) The strength of the resin layer was evaluated. The film thickness was measured using a digital film thickness meter. The result is shown in FIG.

  As shown in FIG. 3, when the post-exposure time was 0 minutes, the resin layer dissolved in toluene and the film thickness decreased, whereas when the post-exposure time was 3 minutes and 10 minutes, the film thickness was reduced. There was no decrease. From this result, the effect of the crosslinking reaction by post-exposure was confirmed.

4). Production of Screen Printing Plates with Different Crosslinking Agents and Their Evaluation (1) Production of Screen Printing Plates Instead of A-DPH, NK ester 14G (hereinafter abbreviated as 14G. Bifunctional, Shin Nakamura Chemical Co., Ltd.) A screen printing plate was produced using the same method, the same composition and the same materials as in Example 3, except that the company was used.

(2) Resolution test Using a screen printing plate produced without post-exposure, the influence of the ultraviolet light exposure amount (main exposure amount) by a parallel light ultraviolet exposure device on the resolution was investigated. Here we were prepared a screen printing plate by changing the main exposure and ^{711J / cm 2, 1422J / cm} 2 in.

  Note that a photomask was used for exposure, and development was immersed in a 2.38 wt% TMAH aqueous solution for 8 minutes. Thereafter, it was washed with water for 1 minute and dried at 40 ° C. for 10 minutes. The resolution was evaluated by observing the resin layer of the screen printing plate with a digital microscope (VHX-200, Keyence). The result is shown in FIG.

5. Production of Screen Printing Plate and Its Evaluation A photosensitive resin composition was prepared to produce a screen printing plate using the composition, and the resolution, adhesion, and strength of the resin layer were evaluated. In addition, in order to suppress reaction of the radical photopolymerization initiator in the exposure process, a polymerization inhibitor was added.

(1) Reagent As the methacrylate copolymer, HAR-2-1 (40% toluene solution) produced in Example 1 was used. CPI-100P (49% polypropylene carbonate solution, San Apro Co., Ltd.) was used as the photoacid generator. Cross-linking agents are NK Oligo UA-HAR-50 (urethane acrylate), UA-HAR-101 (urethane acrylate), UA-HAR-102 (urethane acrylate), UA-HAR-100 (made by Shin-Nakamura Chemical Co., Ltd.) Urethane methacrylate) was used. Darocur 1173 (Ciba Specialty Chemicals Co., Ltd.) was used as the photoradical polymerization initiator, and 2,2,6,6-tetramethylpiperidine-N-oxyl (Tokyo Chemical Industry Co., Ltd.) was used as the photopolymerization inhibitor.

  Further, tetramethylammonium hydroxide (hereinafter abbreviated as TMAH, Showa Denko KK) was used as a developing reagent. A-174 (GE Toshiba Silicone Co., Ltd.) was used as the silane coupling agent.

(2) Apparatus For the exposure of the circuit pattern, the parallel light ultraviolet exposure apparatus used in Example 2 was used. Moreover, the ultraviolet post-exposure apparatus used in Example 3 was used for the post-exposure with a photo radical initiator.

(3) Screen screen is a 500-mesh screen (thickness 19-20 μm) made of stainless steel (SUS304) wire with a wire diameter of 16 μm and calendered. Surface treatment with a silane coupling agent described later Used. The bias angle when the screen was stretched on the frame was 23 °. A chrome mask (Line / Space = 11.5 μm / 8.5 μm, film thickness: 10 μm) was used as the photomask.

(4) Surface treatment with silane coupling agent A 1 wt% ethyl acetate solution of a silane coupling agent was applied to both sides of the screen and dried at 40 ° C for 10 minutes. The screen was wiped with a waste cloth containing ethyl acetate and dried at 40 ° C. for 2 minutes.

(5) Preparation of photosensitive resin composition A methacrylate resin, a crosslinking agent, a photoacid generator, a radical photopolymerization initiator, and a polymerization inhibitor are mixed to prepare a photosensitive resin composition. did. The mixing ratio of the methacrylate copolymer to the crosslinking agent was 4: 1, 3: 1, 2: 1 (resin weight ratio) of the methacrylate copolymer: crosslinking agent. The photoacid generator was added to the methacrylate copolymer so as to be 5% by weight (resin weight ratio). The photopolymerization initiator and the photopolymerization inhibitor were each added in an amount of 3% by weight based on the crosslinking agent. However, it was added so as to be 1% by weight only when UA-HAR-100 was used.

(6) Production of screen printing plate The solvent was evaporated from the adjusted photosensitive resin composition at room temperature until the resin content was about 50 to 60%. 10 μm of the photosensitive resin composition was applied to a screen treated with a silane coupling agent, and dried at 40 ° C. for 3 hours or more. A photomask was brought into contact with the screen, and a predetermined amount was exposed with an ultraviolet exposure device (main wavelength 365 nm). It was immersed in a 2.5 wt% TMAH aqueous solution for 8 minutes, washed with water for 1 minute, and dried at 40 ° C. for 10 minutes. And post-exposure to a 5000 mJ / cm ² by an ultraviolet after exposure apparatus.

(7) Effect of different cross-linking agents on resolution Resolution of printing plates prepared by mixing various cross-linking agents so that methacrylate copolymer: cross-linking agent = 4: 1 was observed with a digital microscope. As shown in FIG. Among the four types of cross-linking agents, UA-HAR-50 showed the best resolution. The crosslinker other than UA-HAR-50 cracked in the resin layer.

  Next, the cross-linking agent UA-HAR-50, which had excellent resolution, was used, and the mixing ratio with the methacrylate copolymer was examined. As a result, as shown in FIG. 6, the resolution was good even in the case of methacrylate copolymer: crosslinking agent = 3: 1, 2: 1. A lot of resin residue was seen. Further, it has been found that as the mixing amount of the crosslinking agent increases, a larger exposure amount is required. From the above results, it was considered that a smaller amount of crosslinking agent is better in terms of resolution. On the other hand, it was considered that the strength and adhesion of the resin layer were better when the proportion of the crosslinking agent was larger.

  From these viewpoints, comparing the three types of mixing ratios, the ratio of the cross-linking agent is as high as possible and the resolution is good. It was considered.

  Moreover, the observation result by SEM in the case of methacrylate copolymer: crosslinking agent = 3: 1 is shown in FIG. From the planar image and the slope image, it was found that the linearity was good. From the cross-sectional image, it was found that although the edge was slightly rounded, the shape was close to a rectangle.

  Furthermore, the observation result by a laser microscope (VK9500, Keyence) is shown in FIG. From the measurement profile on a straight line drawn in the horizontal direction with respect to Line / Space on the photograph, it was found that the width of the resin layer was about 10 μm (opening width 10 μm) and the height of the resin layer was about 10 μm.

(8) Evaluation of adhesion to the screen and strength of the resin layer For the screen printing plate of methacrylate copolymer: crosslinking agent (UA-HAR-50) = 3: 1, the adhesion between the screen and the resin layer is taped. It investigated by the peeling test and the intensity | strength of the resin layer was investigated by the pencil hardness test. Specifically, it was performed as follows.

  In the tape peeling test, first, a glass plate was laid under the screen, the tape was attached to the resin layer, and then rubbed 20 times with an eraser from above. Next, the tape was peeled off at a stretch in the vertical direction. Finally, the interface peeling and cohesive failure of the screen printing plate were observed with a stereomicroscope (BH-2 Olympus). The tape used was a unipolyester tape (acrylic, Uni Kogyo Co., Ltd.). The pencil hardness test was conducted at a load of 300 g according to the pencil hardness test method (JIS K-5400-8-4).

  As a result, both interface peeling and cohesive failure occurred in the tape peeling test. The result of having observed the state of the resin layer after a tape peeling test with the stereomicroscope is shown in FIG. The pencil hardness was found to be 2H.

6). Effect of compositional change of methacrylate copolymer on resolution, adhesion, and resin layer strength In order to increase the crosslink density by post-exposure and improve the strength of the resin layer, it is doubled on the side chain of the methacrylate copolymer. Attempted to introduce bonds.

(1) Production of screen printing plate Methacrylate copolymer by the method described in Example 5 using AP-HAR-200 and AP-HAR-201 produced in Example 1 as the methacrylate copolymer. : A screen printing plate having a crosslinking agent (UA-HAR-50) of 3: 1 was produced.

(2) Resolution The resolution of the produced screen printing plate was observed with a laser microscope and SEM in the same manner as in Example 5. The results are shown in FIGS. FIG. 10 is a digital microscope image of a screen printing plate. FIG. 11 is an SEM image of a screen printing plate using AP-HAR-200 as a methacrylate copolymer, and FIG. 12 is an observation result of the same screen printing plate by a laser microscope. Further, FIG. 13 is an SEM image of a screen printing plate using AP-HAR-201 as a methacrylate copolymer, and FIG. 14 is an observation result of the same screen printing plate by a laser microscope.

  From the plane image and the slope image of the SEM images shown in FIGS. 11 and 13, the linearity of the screen printing plate can be obtained regardless of which of AP-HAR-200 and AP-HAR-201 is used as the methacrylate copolymer. Was found to be good. Moreover, the roundness of the edge was less than the same cross-sectional image, and it was found that the shape was closer to a rectangle than the screen printing plate using HAR-2-1 described in Example 5 as the methacrylate copolymer. .

  In addition, AP-HAR-200 is used as a methacrylate copolymer from the observation results with the laser microscope shown in FIG. 12, that is, the measurement profile on a straight line drawn in the horizontal direction with respect to Line / Space on this photograph. In this case, the width of the resin layer was about 11 μm (opening width 9 μm), and the height of the resin layer was about 11 μm. Similarly, FIG. 14 shows that when AP-HAR-201 is used as the methacrylate copolymer, the width of the resin layer is about 10 μm (opening width 10 μm) and the resin layer is about 14 μm.

(3) Adhesiveness A tape peeling test was conducted in the same manner as in Example 5 to examine the adhesiveness between the screen and the resin layer. As a result, as shown in FIG. 15, as a result of the tape peeling test, both interface peeling and cohesive failure occurred, but the peeling rate was smaller than that of HAR-2-1. This is thought to be due to the increased adhesion to the stainless steel screen due to the increase in 2-HEMA, and the introduction of the methacryloyl group increases the crosslink density, increases the strength, and reduces cohesive failure. .

(4) Strength of resin layer A pencil hardness test was performed in the same manner as in Example 5 to examine the strength of the resin layer. As a result, the pencil hardness of the screen printing plate using AP-HAR-200 and AP-HAR-201 as the methacrylate copolymer is HB, and HAR-2-1 as the methacrylate copolymer. It was found that the screen printing plates used had a pencil hardness of H and that they were softer than current photosensitizers.

7. Solvent resistance test of printing plate When screen printing is performed, the resin must not dissolve in the solvent contained in the paste or the solvent used to wash the printing plate. Therefore, the resin layer of the screen printing plate produced in Example 5 and Example 6 was rubbed up to 500 times with a waste containing a solvent, and the change in thickness of the resin layer and the presence or absence of tack were examined. The results are shown in FIG.

  As the solvent, butyl carbitol acetate (hereinafter abbreviated as BCA) contained in the silver paste, and a mixed liquid of toluene and cyclohexanone (hereinafter abbreviated as a mixed liquid) used for washing the printing plate are used. used. Moreover, evaluation was performed in the part without a pattern.

  As shown in FIG. 16, even when rubbed with two types of solvents for all three types 500 times, no reduction in the thickness of the resin layer was observed. In addition, when AP-HAR-200 and AP-HAR-201 were used as the methacrylate copolymer, no tack appeared even when the BCA and the mixed solution were rubbed 500 times. On the other hand, when HAR-2-1 was used for the methacrylate copolymer, a slight tack appeared after rubbing 100 times. From the above results, it was considered that printing plates using AP-HAR-200 and AP-HAR-201 can withstand practical use.

8.10 μm Printing Test After producing a screen printing plate using AP-HAR-201 as a methacrylate copolymer, a silver paste was printed on the substrate using this screen printing plate, and the printed matter was evaluated. . The details will be described below.

(1) Screen printing plate The screen printing plate uses a 590 mesh screen (thickness 17 μm) made of stainless steel (SUS304) wire with a wire diameter of 13 μm and a calendered screen. What was manufactured by the method similar to Example 5 and Example 6 was used except having used the thing of the chromium mask (Line / Space = 10micrometer / 10micrometer, film thickness: 10micrometer).

(2) Silver paste Conductive paint CA-2503-4 (Daiken Chemical Co., Ltd.) was used.

(3) Substrate The substrate used was a polyimide film with a porous film (Daicel Chemical Industries, Ltd.), a polyimide film (product name: Kapton 100EN, Toray DuPont Co., Ltd.), and an inkjet film (Seiko Epson Corporation).

(4) Screen printing For printing, squeegee printing was performed using a printer LS-150 (Neurong Seimitsu Kogyo Co., Ltd.) and then baked at 200 ° C for 30 minutes (not baked only when an inkjet film was used) . The printing conditions are squeegee material: urethane rubber, squeegee hardness 70 °, squeegee speed: 30 mm / sec, squeegee drop: free, scraper speed: 30 mm / sec, scraper drop: 0.5 mm, printing pressure: 0.13 MPa, Back pressure: 0.10 MPa, clearance: 1.5 mm.

(5) Evaluation of printed matter The printed matter was evaluated for the presence or absence of pattern shorts and shorts by SEM observation. The results are shown in Table 2.

  As shown in Table 2, when CA-2503-4 was used as the silver paste, printing was possible on the polyimide with a porous film and the inkjet film without disconnection or short circuit.

  From this result, it was found that CA-2503-4 was most suitable for printing with a line width of 10 μm. In addition, regarding the substrate, when Kapton 100EN (untreated polyimide film) was used, a short circuit occurred on the entire surface, indicating that the porous film was effective in preventing paste bleeding.

  The line width and height were also measured by SEM and laser microscope observation. Among them, FIG. 17 shows an SEM image of a screen printing plate in which CA-2503-4 is printed on polyimide with a porous film, and FIG. 18 shows the observation result by a laser microscope. As shown in FIG. 18, when CA-2503-4 is printed on a polyimide film with a porous film (fourth shot), the line width of the obtained printed matter is about 12 μm, which is larger than the opening width of the printing plate. It was found that it was about 2 μm larger. Moreover, it turned out that the height of a pattern is about 3 micrometers.

9. Measurement of Bond Strength and Electrical Resistance Value of Printed Material The bond strength between the substrate and the silver paste and the electrical resistance value of the silver paste portion in the printed material produced by screen printing were measured. Details are shown below.

(1) Silver paste As silver paste, XA-9053 (organic silver-silver oxide system, Fujikura Kasei), CA-2503-4 (submicron silver powder-phenol-acrylic system, Daiken Chemical Industry), CA-2503- 4B (submicron silver powder-phenol-acrylic system, Daiken Chemical Industries) was used. In addition, when XA-9053 was applied, a primer (XB-3058, polyester-block isocyanate type) was applied to the substrate as necessary.

(2) Substrate Kapton 100EN (manufactured by Toray DuPont) and a slide glass were used as the substrate. The polyimide substrate used was a corona-treated one and an untreated one. For corona treatment, a polyimide substrate is attached to the roll part of a wire-to-cylindrical corona discharge treatment device with double-sided tape, discharge output 1 kW or 0.5 kW, treatment speed 1 m / min, electrode gap 3 mm, number of passes through discharge area 1 Performed ~ 10 times.

(3) Screen printing The screen printing plate was subjected to the conditions described in Example 8 using the screen printing plate described in Example 8. When CA-2503-4 and CA-2503-4B were used, the printed material was baked at 200 ° C. for 30 minutes as in Example 8. On the other hand, when XA-9053 is used, preliminary drying (75 ° C to 150 ° C, 10 to 30 minutes), pressure firing (200 ° C, 1.5kPa to 21MPa, 1 to 30 minutes), post-drying (200 ° C) , 10 minutes), and the printed material was baked in various combinations.

(4) Measurement of bonding strength Using a bond tester (dage5000, Dage Arctek Co., LTd), the bonding strength of the silver paste / polyimide substrate was measured at a tool height of 0 μm and a shear rate of 500 μm / s. FIG. 19A shows the measurement results of the bonding strength of the CA-2503-4 / polyimide substrate, and FIG. 19B shows the bonding strength of the CA-2503-4B / polyimide substrate. From this figure, it was found that the strength slightly increased by the corona discharge treatment. FIG. 20 shows the measurement results of the bonding strength of XA-9053 / polyimide substrate (dispenser coating, land diameter 1 to 2 mm). From this figure, it was found that firing at 200 ° C had the highest strength among 150-250 ° C.

(5) Measurement of electric resistance value As shown in FIG. 21, a silver paste was applied to a slide glass masked with a 50 μm-thick cellophane tape on the slide glass, and cured with the same thermal history as in (3). A piece was made. Then, as shown in the figure, the electrical resistance of the test piece was measured by the four-point terminal method.

  FIG. 22 shows the results of measuring the electrical resistance values of CA-2503-4 and CA-2503-4B. From this figure, it was found that the electrical resistance value of both CA-2503-4 and CA-2503-4B decreased as the curing temperature and time increased. In addition, since the electric resistance value of CA-2503-4B is lower than the electric resistance value of CA-2503-4, it was also found that CA-2503-4B is superior in electric characteristics.

  FIG. 23 shows the results of measuring the electrical resistance of XA-9053 by the four-point terminal method. When the firing conditions were the best, that is, when pre-dried at 115 ° C for 20 minutes and then fired under pressure at 200 ° C and 1.5 kPa for 30 minutes, the electrical resistance value is 0.01 Ωm or more. Was also found to be more than six orders of magnitude larger. In addition, after pre-drying at 115 ° C for 20 minutes and pressurizing and baking at 200 ° C and 1.5 kPa for 30 minutes, the surface of the silver paste is freed and dried at 200 ° C for 10 minutes. It was found that the electrical resistance value was good.

It is a figure which shows the structure of a methacrylate type copolymer, and the chemical reaction by a photo-acid generator. It is the photograph which observed the screen in which the resin layer was formed with the resin composition containing a methacrylate type copolymer and a photo-acid generator by SEM. It is a figure which compares the influence which post-exposure time has on the toluene tolerance of the resin layer formed on the screen. It is the photograph which observed the screen printing plate manufactured without post-exposure with the digital microscope. It is the photograph which observed the screen printing plate from which the kind of crosslinking agent contained in the photosensitive resin composition differs with the digital scope. It is the photograph which observed the screen printing plate from which the mixing ratio of the crosslinking agent contained in the photosensitive resin composition differs with the digital scope. It is the photograph which observed the screen printing plate of Fig.6 (a) by SEM. It is an observation result by the laser microscope of the screen printing plate of Fig.6 (a). It is the photograph which observed the state of the resin layer after performing a tape peeling test using the screen printing plate of Drawing 6 (a) with a stereoscopic microscope. It is the photograph which observed the screen printing plate with the digital microscope. It is the photograph which observed the screen printing plate which used AP-HAR-200 which contains a double bond in a side chain as a methacrylate-type copolymer by SEM. It is an observation result by the laser microscope of the same screen printing plate as FIG. It is the photograph which observed the screen printing plate which used AP-HAR-201 which contains a double bond in a side chain as a methacrylate type copolymer by SEM. It is the observation result by the laser microscope of the same screen printing plate as FIG. Resin layer after tape peeling test using AP-HAR-200, AP-HAR-201 with double bond in side chain and HAR-2-1 without double bond as methacrylate copolymer It is the photograph which observed the state of this with the stereomicroscope. It is a graph which shows the result of having rubbed the resin layer of the screen printing plate with the waste containing the solvent, and having investigated the change of the thickness of the resin layer. It is the photograph which observed the printed matter which printed silver paste CA-2503-4 on the polyimide with a porous film by SEM. It is an observation result by the laser microscope of the same printed matter as FIG. It is a graph which shows the result of the joint strength test of the printed matter of silver paste CA-2503-4 and CA-2503-4B / polyimide substrate. It is a graph which shows the result of the joint strength test of the printed matter of silver paste XA-9053 / polyimide substrate. It is the schematic explaining the measurement of the electrical resistance value by a 4-point terminal method. It is a graph which shows the result of having measured the electrical resistance value of CA-2503-4 and CA-2503-4B by the 4-point terminal method of FIG. It is a graph which shows the result of having measured the electrical resistance value of XA-9053 from which baking conditions differ by the 4 point | piece terminal method of FIG.

Claims (8)

(1) Formula (I)
A methacrylate copolymer containing a structural unit represented by:
(2) a photo radical initiator;
(3) a photoacid generator that generates an acid upon irradiation with light having a wavelength range different from that of light that generates radicals in at least the photoradical initiator;
(4) a crosslinking agent that undergoes a crosslinking reaction by radicals;
Containing a photosensitive resin composition. Methacrylate copolymer
Formula (II)
The photosensitive resin composition of Claim 1 containing the structural unit represented by these. Methacrylate copolymer
General formula (III)
(In the formula, R represents either H or CH ₃ , and m represents either 1 or 2)
The photosensitive resin composition of Claim 1 or Claim 2 containing the structural unit represented by these.   The photosensitive resin composition according to any one of claims 1 to 3, wherein the photoacid generator is a compound that generates an acid by i-rays.   The photosensitive resin composition according to any one of claims 1 to 4, comprising a polymerization inhibitor that suppresses the crosslinking reaction in the exposure step and hardly inhibits the crosslinking reaction in the post-exposure step. A resin layer forming step of forming a resin layer by applying and drying the photosensitive resin composition according to any one of claims 1 to 5 on a screen;
An exposure step of exposing the circuit pattern by irradiating the resin layer on the screen with light having a wavelength region different from that of the light generated by the radical radical initiator;
A development step of developing and removing the exposed portion of the resin layer;
A post-exposure step of irradiating light containing light having a wavelength at which the photo-radical initiator generates radicals, and crosslinking a portion not removed in the development step of the resin layer;
A method for producing a plate for screen printing, comprising the above in this order.   The manufacturing method of the screen printing plate of Claim 6 using the screen surface-treated with the silane coupling agent.   A screen printing plate produced by the method for producing a screen printing plate according to claim 6 or 7.