JP2009041586A - Sealing device - Google Patents

Sealing device Download PDF

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Publication number
JP2009041586A
JP2009041586A JP2007204240A JP2007204240A JP2009041586A JP 2009041586 A JP2009041586 A JP 2009041586A JP 2007204240 A JP2007204240 A JP 2007204240A JP 2007204240 A JP2007204240 A JP 2007204240A JP 2009041586 A JP2009041586 A JP 2009041586A
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Prior art keywords
ring
sealing device
peripheral surface
lid member
outer peripheral
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JP2009041586A5 (en
Inventor
Hidekazu Kanegae
英和 金ヶ江
Daihachi Shojima
大八 庄島
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Nok Corp
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Nok Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing device which can be easily handled, eliminate a risk that an O-ring bites in between a cover member and a housing, and keep favorable sealing performance between two members. <P>SOLUTION: The sealing device comprises the O-ring formed of a rubber elastic material disposed in an annular groove formed on the outer peripheral surface of the cover member of an electronic device, and a housing receiving the cover member and having an annular inner peripheral surface which seals the O-ring and contacts therewith. In the sealing device, the outer peripheral surface is rectangular, and the O-ring is installed in the groove while an inner diameter extension rate is set to be in a range of 10 to 30%. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、密封装置に関する。
また、本発明は、二部材間を密封する箇所に用いて有用な密封装置に関する。
The present invention relates to a sealing device.
The present invention also relates to a sealing device that is useful for use in a place where two members are sealed.

更に、本発明は、開閉する蓋部材からの漏洩を防止する密封装置に関する。
更にまた、本発明は、デジタルカメラ等の電子機器用密封装置として有効に用いられる。
Furthermore, the present invention relates to a sealing device that prevents leakage from a lid member that opens and closes.
Furthermore, the present invention is effectively used as a sealing device for electronic equipment such as a digital camera.

特に、本発明は、樹脂製筐体間の隙間をシールする密封装置に関する。
好ましくは、本発明は、デジタルカメラの樹脂材製筐体の蓋部材に効果的に用いられる。
In particular, the present invention relates to a sealing device that seals a gap between resin casings.
Preferably, the present invention is effectively used for a lid member of a resin material casing of a digital camera.

従来、電子機器の蓋部材、例えば、デジタルカメラの接続端子部や電池収納部に使用されている蓋部材には防水を目的として密封装置が設けられる。
一般に、この様な密封装置は、ハウジング側との密着性や追随性に優れた低硬度のシリコーンゴムが使用される。
そして、密封装置に用いられるOリングの蓋部材への取付は、Oリングを蓋部材の外周面に設けた環状の溝部内に配置する構成としている。
Conventionally, a lid member of an electronic device, for example, a lid member used for a connection terminal portion of a digital camera or a battery storage portion is provided with a sealing device for the purpose of waterproofing.
In general, such a sealing device uses a low-hardness silicone rubber having excellent adhesion to the housing side and following performance.
The O-ring used in the sealing device is attached to the lid member by placing the O-ring in an annular groove provided on the outer peripheral surface of the lid member.

しかしながら、低硬度のシリコーンゴムからなる防水ガスケットは、伸びやすく、かつ、捻じれやすい傾向にあり、特に矩形の外周面に設けた溝部に配置した場合は、長手方向の中間位置で、溝部に追随できないたるみが発生した。
具体的には、図3に示す様に、蓋部材1の外周面11に設けた溝部12からOリング2が浮き上がった状態が招来する。
However, waterproof gaskets made of low-hardness silicone rubber tend to stretch and twist easily, especially when placed in a groove provided on the outer peripheral surface of a rectangle, following the groove at an intermediate position in the longitudinal direction. Unsatisfactory sagging occurred.
Specifically, as shown in FIG. 3, a state in which the O-ring 2 is lifted from the groove portion 12 provided on the outer peripheral surface 11 of the lid member 1 is invited.

この結果、この様な状態で、図1の蓋部材1をハウジング3に向って閉じると、蓋部材1とハウジング3との間で、Oリング2を噛み込んでしまう問題を惹起した。
この傾向は、Oリングの線形が0.4mm〜1.6mmという非常に細い線形のものにおいて顕著であった。
As a result, in such a state, when the lid member 1 of FIG. 1 is closed toward the housing 3, there is a problem that the O-ring 2 is caught between the lid member 1 and the housing 3.
This tendency was prominent when the O-ring linearity was very thin, 0.4 mm to 1.6 mm.

特開平7−297895号公報JP-A-7-297895

本発明は、このような課題に鑑みてなされたものであり、取り扱いが容易で、蓋部材とハウジングとの間で、Oリングを噛み込む心配がなく、二部材間の良好なシール性能を維持出来る密封装置を提供することを目的とする。   The present invention has been made in view of such problems, is easy to handle, has no fear of biting the O-ring between the lid member and the housing, and maintains good sealing performance between the two members. It aims at providing the sealing device which can be performed.

本発明の密封装置は、電子装置の蓋部材の外周面に設けた環状の溝部内に配置されたゴム状弾製材製のOリングと、前記蓋部材を受け入れ、前記Oリングと密封接触する環状内周面を備えるハウジングとからなる密封装置において、前記外周面が矩形状であると共に、前記Oリングが内径伸張率を10〜30%の範囲に設定して前記溝部に装着されていることを特徴とする。   The sealing device according to the present invention includes an O-ring made of rubber-like elastic material disposed in an annular groove provided on an outer peripheral surface of a lid member of an electronic device, and an annular shape that receives the lid member and seals and contacts the O-ring. In a sealing device including a housing having an inner peripheral surface, the outer peripheral surface is rectangular, and the O-ring is mounted in the groove portion with an inner diameter extension rate set in a range of 10 to 30%. Features.

本発明は、以下に記載されるような効果を奏する。
請求項1記載の密封装置によれば、蓋部材とハウジングとの間で、Oリングを噛み込む心配がなく、二部材間の良好なシール性能を維持出来る。
また、請求項2記載の密封装置によれば、線形が0.4mm〜1.6mmという非常に細い線形のOリングにおいて効果が顕著である。
The present invention has the following effects.
According to the sealing device of the first aspect, there is no fear of biting the O-ring between the lid member and the housing, and good sealing performance between the two members can be maintained.
Further, according to the sealing device of the second aspect, the effect is remarkable in a very thin linear O-ring having a linearity of 0.4 mm to 1.6 mm.

更に、請求項3記載の密封装置によれば、良好なる密封性能を発揮出来る。   Furthermore, according to the sealing device of the third aspect, good sealing performance can be exhibited.

また、請求項4記載の密封装置によれば、蓋部材開閉時の摺動抵抗を下げ、Oリングの捩れを防止できる。
更に、請求項5記載の密封装置によれば、Oリングのゴムの官能基と表面処理剤との間に化学結合が多く形成され、表面の耐久性、非粘着性が十分発揮出来る。
また、請求項6記載の密封装置によれば、摺動抵抗が低く抑えられるため、蓋の開閉が円滑である。
According to the sealing device of the fourth aspect, the sliding resistance when the lid member is opened and closed can be lowered, and the twisting of the O-ring can be prevented.
Furthermore, according to the sealing device of the fifth aspect, many chemical bonds are formed between the functional group of the rubber of the O-ring and the surface treatment agent, and the surface durability and non-adhesiveness can be sufficiently exhibited.
Further, according to the sealing device of the sixth aspect, since the sliding resistance is kept low, the lid can be opened and closed smoothly.

更に、請求項7記載の密封装置によれば、従来品(圧縮率25%)に比べ、蓋の開閉時の摺動抵抗を低く抑えることが出来る。このため、人の手による開閉が行われる箇所においては特に好ましい。
更に、請求項8記載の発明の密封装置によれば、Oリングのはみ出しを低く抑えることが出来る。
Furthermore, according to the sealing device of the seventh aspect, compared with the conventional product (compression rate 25%), the sliding resistance when the lid is opened and closed can be kept low. For this reason, it is particularly preferable in a place where opening and closing by a human hand is performed.
Furthermore, according to the sealing device of the invention described in claim 8, the protrusion of the O-ring can be kept low.

以下、本発明を実施するための最良の形態について説明する。
図1及び図2に基づき発明を実施するための最良の形態について説明する。
図2は図1のA−A断面図である。
Hereinafter, the best mode for carrying out the present invention will be described.
The best mode for carrying out the invention will be described with reference to FIGS.
2 is a cross-sectional view taken along the line AA in FIG.

電子装置の蓋部材に設ける密封装置は、電子装置の蓋部材1の外周面11に設けた環状の溝部12内に配置されたゴム状弾製材製のOリング2と、この蓋部材1を受け入れ、Oリング2と密封接触する環状内周面31を備えるハウジング3とから構成されている。
この環状の溝部12は、蓋部材1の閉じる側の側面に設けた矩形の凸状部13の外周面に設ける態様としているが、凸状部13を設けず、蓋部材1の外周面に直接設ける態様でも良い。
The sealing device provided on the lid member of the electronic device receives the O-ring 2 made of rubber-like elastic material disposed in the annular groove 12 provided on the outer peripheral surface 11 of the lid member 1 of the electronic device, and the lid member 1. The housing 3 is provided with an annular inner peripheral surface 31 in sealing contact with the O-ring 2.
The annular groove portion 12 is provided on the outer peripheral surface of the rectangular convex portion 13 provided on the side surface on the closing side of the lid member 1, but is not provided with the convex portion 13 and directly on the outer peripheral surface of the lid member 1. It may be provided.

また、外周面11は、矩形状であると共に、Oリング2を内径伸張率が10〜30%の範囲に設定して、外周面11に設けた溝部12に装着している。
この矩形状とは、長方形状の意味であるが、その角部は円弧形状であってもよく、また、各辺が全体的に湾曲する形状であってもよい。
ここで、内径伸張率とは、溝部12の底径Dから、Oリング2が装着する前の自由状態における内径dを引いた値を、内径dで除した値である。
また、ここで使用されるOリング2の線径は、0.4mm〜1.6mmの範囲のものが使用される。
そして、この様な細い線形のOリング2は、溝部12に装着される際、その馴染み性から、部分的にたるみが生ずる可能性が特に大きかった。
また、このたるみが生ずる可能性は、矩形外周面に設けた溝部12の長手方向の中間部において顕著である。
The outer peripheral surface 11 has a rectangular shape, and the O-ring 2 is set in a range where the inner diameter extension rate is 10 to 30% and is mounted in the groove portion 12 provided on the outer peripheral surface 11.
The rectangular shape means a rectangular shape, but the corner portion may be an arc shape or a shape in which each side is entirely curved.
Here, the inner diameter extension rate is a value obtained by dividing the value obtained by subtracting the inner diameter d in the free state before the O-ring 2 is mounted from the bottom diameter D of the groove 12 by the inner diameter d.
The wire diameter of the O-ring 2 used here is in the range of 0.4 mm to 1.6 mm.
And when such a thin linear O-ring 2 was attached to the groove 12, the possibility of partial sagging was particularly great due to its familiarity.
In addition, the possibility of this sagging is remarkable in the middle portion in the longitudinal direction of the groove 12 provided on the rectangular outer peripheral surface.

また、Oリング2は、硬度がJISA50〜70°の範囲のもので、シリコーンゴム、フッ素ゴム、NBR,水素化NBR、EPDM,SBR、アクリルゴム等の合成ゴム、天然ゴム、熱可塑性エラストマー、等から適宜選択して用いられる。   The O-ring 2 has a hardness in the range of JISA 50 to 70 °, and is made of synthetic rubber such as silicone rubber, fluorine rubber, NBR, hydrogenated NBR, EPDM, SBR, acrylic rubber, natural rubber, thermoplastic elastomer, etc. Are appropriately selected and used.

更に、Oリング2の表面は、反応性表面処理剤で処理されるか、梨地処理されている。
このことにより、Oリング2は、溝部12に装着される際、蓋部材開閉時の摺動抵抗を下げ、Oリングの捩れを防止できる。
また、その馴染み性が改善されることから、たるみが生ずる危険性を効果的に回避出来る。
この反応性表面処理剤としては、Si−NCO基を有するシリルイソシアネート化合物が採用される。
Furthermore, the surface of the O-ring 2 is treated with a reactive surface treatment agent or treated with a satin finish.
As a result, when the O-ring 2 is mounted in the groove 12, the sliding resistance when the lid member is opened and closed can be lowered, and the O-ring can be prevented from being twisted.
Moreover, since the familiarity is improved, the risk of sagging can be effectively avoided.
As this reactive surface treating agent, a silyl isocyanate compound having a Si-NCO group is employed.

この種化合物としては、1個のNCO基がケイ素原子に結合した、
トリエチルシリルイソシアネート
[(C2H5)3SiNCO]
3個のNCO基がケイ素原子に結合した、
ブトキシシラントリイソシアネート
[C4H9OSi(NCO)3]
等が単独若しくは組み合わせて使用できる。
As this kind of compound, one NCO group is bonded to a silicon atom,
Triethylsilyl isocyanate
[(C2H5) 3SiNCO]
3 NCO groups bonded to the silicon atom,
Butoxysilane triisocyanate
[C4H9OSi (NCO) 3]
Etc. can be used alone or in combination.

特に、以下の組み合わせからなる反応性表面処理剤が好適に用いられる。
(1)末端水酸基を含有するポリシロキサンとシリルイソシアネ−トとの反応生成物、
(2)イソシアネート基と反応性を有する官能基を含有するオリゴマーとシリルイソシアネートとの反応生成物、
(3)一般式

Figure 2009041586
(ここで、Rはアルキル基、アリール基またはイソシアネート基であり、nは1以上の整数である)で表わされるシリルイソシアネートオリゴマーおよび(4)有機溶媒可溶性ゴムよりなる反応性表面処理剤。 In particular, a reactive surface treatment agent comprising the following combinations is preferably used.
(1) a reaction product of a polysiloxane containing a terminal hydroxyl group and a silyl isocyanate,
(2) a reaction product of an oligomer containing a functional group having reactivity with an isocyanate group and silyl isocyanate,
(3) General formula
Figure 2009041586
(Wherein R is an alkyl group, an aryl group or an isocyanate group, and n is an integer of 1 or more) and (4) a reactive surface treating agent comprising an organic solvent-soluble rubber.

(1)成分の反応生成物を形成する末端水酸基を含有するポリシロキサンとしては、分子中に少くとも1個の末端水酸基を有するポリシロキサン、例えばα,ω-ジヒドロキシポリジメチルシロキサン、α,ω-ジヒドロキシポリジフェニルシロキサン等が用いられ、これらのポリシロキサンは、約100〜100,000cst、好ましくは約100〜10,000cstの粘度(室温)のものが用いられる。   The polysiloxane containing a terminal hydroxyl group that forms the reaction product of component (1) is a polysiloxane having at least one terminal hydroxyl group in the molecule, such as α, ω-dihydroxypolydimethylsiloxane, α, ω- Dihydroxypolydiphenylsiloxane or the like is used, and those polysiloxanes having a viscosity (room temperature) of about 100 to 100,000 cst, preferably about 100 to 10,000 cst are used.

また、(2)成分の反応生成物を形成するオリゴマーとしては、水酸基、カルボキシル基、アミノ基、チオール等のイソシアネート基と反応性を有する官能基を有する、分子量が約10,000以下、好ましくは約1000〜7000のオリゴマーが用いられ、例えばこれらの官能基を有するオリゴマ−状のポリエステル樹脂、ブチラール樹脂、アクリル樹脂、フッ素樹脂、ニトロセルロース等が用いられ、好ましくは水酸基含有ポリエステル樹脂、水酸基含有フッ素樹脂、ブチラール樹脂、ニトロセルロース等が用いられる。   The oligomer that forms the reaction product of component (2) includes a functional group having reactivity with an isocyanate group such as a hydroxyl group, a carboxyl group, an amino group, and a thiol, and a molecular weight of about 10,000 or less, preferably about 1000. ~ 7000 oligomers are used, for example, oligomeric polyester resins having these functional groups, butyral resins, acrylic resins, fluororesins, nitrocellulose, etc., preferably hydroxyl group-containing polyester resins, hydroxyl group-containing fluororesins, Butyral resin, nitrocellulose and the like are used.

これらの官能基を有するポリシロキサンおよびオリゴマーは、予め当量以上、一般には1〜100倍当量、好ましくは1〜50当量のシリルイソシアネートと反応させた上で用いられる。シリルイソシアネートとしては例えばメチルトリイソシアネートシラン、エチルトリイソシアネートシラン、イソプロピルトリイソシアネートシラン、ブチルトリイソシアネートシラン、フェニルトリイソシアネートシラン、ジメチルジイソシアネートシラン、ジエチルジイソシアネートシラン、テトライソシアネートシラン等が用いられる。   The polysiloxane and oligomer having these functional groups are used after reacting with silyl isocyanate in an equivalent amount or more, generally 1 to 100 times equivalent, preferably 1 to 50 equivalents in advance. Examples of the silyl isocyanate include methyl triisocyanate silane, ethyl triisocyanate silane, isopropyl triisocyanate silane, butyl triisocyanate silane, phenyl triisocyanate silane, dimethyl diisocyanate silane, diethyl diisocyanate silane, and tetraisocyanate silane.

反応性官能基を有するポリシロキサンまたはオリゴマーとシリルイソシアネートとの間の反応は、ポリシロキサンまたはオリゴマーの有機溶媒溶液中に、シリルイソシアネートを滴下することによって行われ、ポリシロキサンとオリゴマーとは一般に別個に反応させるが、同時に反応させることも可能である。反応は、室温乃至約150℃、好ましくは室温乃至約100℃で行われる。   The reaction between the polysiloxane or oligomer having a reactive functional group and the silyl isocyanate is carried out by dropping silyl isocyanate into an organic solvent solution of the polysiloxane or oligomer, and the polysiloxane and the oligomer are generally separated from each other. Although it is made to react, it is also possible to react simultaneously. The reaction is carried out at room temperature to about 150 ° C, preferably room temperature to about 100 ° C.

反応溶媒として用いられる有機溶媒としては、ポリシロキサンまたはオリゴマーを溶解させかつイソシアネート基と反応しないものであれば任意のものを用いることができ、例えば酢酸エチル、酢酸ブチル、プロピレングリコールモノメチルアセテート、エチルセロソルブアセテート等のエステル類、ジブチルエーテル、エチレングリコールジメチルエーテル、エチレングリコールジブチルエーテル、テトラヒドロフラン等のエーテル類、トルエン、キシレン等の芳香族炭化水素類、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン等のケトン類、ジメチルホルムアミド、ジメチルアセトアミド、ジメチルスルホキシド、N-メチル-2-ピロリドン等のプロトン性極性溶媒などが、単独であるいは組合せて用いられる。   As the organic solvent used as the reaction solvent, any solvent can be used as long as it dissolves polysiloxane or oligomer and does not react with isocyanate groups. For example, ethyl acetate, butyl acetate, propylene glycol monomethyl acetate, ethyl cellosolve Esters such as acetate, ethers such as dibutyl ether, ethylene glycol dimethyl ether, ethylene glycol dibutyl ether and tetrahydrofuran, aromatic hydrocarbons such as toluene and xylene, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, dimethyl Protic polar solvents such as formamide, dimethylacetamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, etc. are used alone or in combination

(3)成分のシリルイソシアネートオリゴマーとしては、前記一般式で表わされるものが用いられ、ここでRはメチル基、エチル基、イソプロピル基、ブチル基等のアルキル基、フェニル基によって代表されるアリール基またはイソシアネート基であり、nは好ましくは1〜4である。   As the silyl isocyanate oligomer of component (3), those represented by the above general formula are used, wherein R is an aryl group represented by an alkyl group such as a methyl group, an ethyl group, an isopropyl group, or a butyl group, or a phenyl group. Or it is an isocyanate group, and n is preferably 1-4.

更に、(4)成分の有機溶媒可溶性ゴムとしては、前記の如き各種有機溶媒に可溶性のNBR、SBR、イソプレンゴム、ブタジエンゴム、クロロプレンゴム、ブチルゴム、EPDM、ウレタンゴム、フッ素ゴム、アクリルゴム、エピクロロヒドリンゴム、塩素化ポリエチレン、クロロスルホン化ポリエチレン等の合成ゴムまたは天然ゴムであって、好ましくはNBR、特に好ましくはカルボキシル基または水酸基含有NBR、カルボキシル基またはアミノ基変性ブタジエン-アクリロニトリル共重合体等が用いられる。   Further, the organic solvent-soluble rubber of component (4) includes NBR, SBR, isoprene rubber, butadiene rubber, chloroprene rubber, butyl rubber, EPDM, urethane rubber, fluoro rubber, acrylic rubber, epi rubber, which are soluble in various organic solvents as described above. Synthetic rubber or natural rubber such as chlorohydrin rubber, chlorinated polyethylene, chlorosulfonated polyethylene, etc., preferably NBR, particularly preferably carboxyl group or hydroxyl group-containing NBR, carboxyl group or amino group modified butadiene-acrylonitrile copolymer, etc. Is used.

以上の各成分は、(1)成分が約1〜50重量%、好ましくは約1〜10重量%、(2)成分が約1〜50重量%、好ましくは約1〜10重量%、(3)成分が約3〜50重量%、好ましくは約3〜20重量%、また(4)成分が約0.01〜10重量%、好ましくは約0.05〜5重量%の割合でそれぞれ用いられ、残部は有機溶媒よりなる。   In each of the above components, the component (1) is about 1 to 50% by weight, preferably about 1 to 10% by weight, the component (2) is about 1 to 50% by weight, preferably about 1 to 10% by weight, (3 ) Component is used in an amount of about 3 to 50% by weight, preferably about 3 to 20% by weight, and (4) component is used in a proportion of about 0.01 to 10% by weight, preferably about 0.05 to 5% by weight, with the remainder being organic It consists of a solvent.

これらの各成分の混合割合において、これ以下の使用割合では、(1)成分では非粘着性が低下するようになり、(2)成分、(3)成分、(4)成分では密着性が低下するようになる。一方、これ以上の割合で用いられると、(1)成分ではその成分の脱落が生ずるようになり、(2)成分、(4)成分では非粘着性が低下し、また(3)成分ではポットライフが短かくなる。   In the mixing ratio of each of these components, the non-adhesiveness decreases with the (1) component, and the adhesiveness decreases with the (2) component, (3) component, and (4) component. Will come to do. On the other hand, if it is used in a proportion higher than this, the component (1) will come off, the (2) component, the (4) component will be non-tacky, and the (3) component will be a pot. Life is shortened.

以上の各成分を必須成分とする表面処理剤は、一旦約5〜20重量%程度の固形分濃度を有する有機溶媒溶液として調製された後、塗布厚みや塗布方法に応じて更に有機溶媒で希釈されて用いられる。   The surface treatment agent containing the above components as essential components is once prepared as an organic solvent solution having a solid content concentration of about 5 to 20% by weight, and further diluted with an organic solvent according to the coating thickness and coating method. To be used.

その塗布厚みは、通常約1〜20μm、好ましくは約2〜10μmであり、これ以下の塗布厚みでは処理表面すべてを覆うことができず、非粘着性が損われるばかりではなく、シール材に適用した場合にシール性が損われるようになる。一方、塗布厚みがこれよりも厚いと、シール材表面の剛性が高くなり、シール性や柔軟性が損われることもあり得るようになる。その塗布方法も任意であり、一般には浸漬法、スプレー法、ロールコーター法、フローコーター法等が用いられ、塗布後約80〜250℃、好ましくは約120〜200℃での加熱処理が約3分間乃至1時間程度行われる。   The coating thickness is usually about 1 to 20 μm, preferably about 2 to 10 μm. If the coating thickness is less than this, not all of the treatment surface can be covered, and not only the non-adhesiveness is impaired, but also applied to the sealing material. If this happens, the sealing performance will be impaired. On the other hand, if the coating thickness is thicker than this, the rigidity of the sealing material surface becomes high, and the sealing performance and flexibility may be impaired. The application method is also arbitrary, and generally a dipping method, a spray method, a roll coater method, a flow coater method or the like is used. After the application, heat treatment at about 80 to 250 ° C., preferably about 120 to 200 ° C. is performed for about 3 It takes about 1 to 1 hour.

また、Oリング2表面の梨地処理は、Oリング2の成形金型面を、ショットブラスト等により梨地処理する事により形成するか、成形後、Oリング2表面に直接梨地処理を施す事により形成される。
また、Oリング2の圧縮率は、良好なシール性を確保するために、5〜20%であることが好ましい。
これは、従来品(圧縮率25%)に比べ、圧縮率を低く抑えているため、蓋の開閉時摺動抵抗を低く抑えることが出来る。
このため、力の弱い、お年よりや子供の手によっても、容易に蓋の開閉を行える。
また、圧縮率が5%以下になると、十分なシール性能が発揮できない。
尚、矩形の周面11には、円弧形状部111が存在する態様であっても良い。
In addition, the surface of the O-ring 2 is formed by subjecting the molding surface of the O-ring 2 to a matte finish by shot blasting or the like, or by directly applying a matte finish to the surface of the O-ring 2 after molding. Is done.
Further, the compression rate of the O-ring 2 is preferably 5 to 20% in order to ensure good sealing performance.
Since the compression rate is kept low compared to the conventional product (compression rate 25%), the sliding resistance when the lid is opened and closed can be kept low.
For this reason, the lid can be easily opened and closed even by the hand of a younger person or a child with weak power.
Further, when the compression rate is 5% or less, sufficient sealing performance cannot be exhibited.
The rectangular peripheral surface 11 may have an arc-shaped portion 111.

また、本発明は上述の発明を実施するための最良の形態に限らず本発明の要旨を逸脱することなくその他種々の構成を採り得ることはもちろんである。   Further, the present invention is not limited to the best mode for carrying out the invention described above, and various other configurations can be adopted without departing from the gist of the present invention.

密封装置にかかる発明の実施の形態を示す斜視図である。It is a perspective view which shows embodiment of the invention concerning a sealing device. 図1のA−A半断面図である。It is AA half sectional drawing of FIG. 従来技術に係る密封装置の部分断面図である。It is a fragmentary sectional view of the sealing device concerning a prior art.

符号の説明Explanation of symbols

1 蓋部材
2 Oリング
3 ハウジング
11 円弧形状部
12 溝部
13 凸状部
1 Lid member 2 O-ring 3 Housing 11 Arc-shaped portion 12 Groove portion 13 Convex portion

Claims (8)

電子装置の蓋部材(1)の外周面(11)に設けた環状の溝部(12)内に配置されたゴム状弾製材製のOリング(2)と、前記蓋部材(1)を受け入れ、前記Oリング(2)と密封接触する環状内周面(31)を備えるハウジング(3)とからなる密封装置において、前記外周面(11)が矩形状であると共に、前記Oリング(2)が内径伸張率を10〜30%の範囲に設定して前記溝部(12)に装着されていることを特徴とする密封装置。   Receiving the O-ring (2) made of rubber-like elastic material disposed in the annular groove (12) provided on the outer peripheral surface (11) of the lid member (1) of the electronic device, and the lid member (1); In a sealing device comprising a housing (3) having an annular inner peripheral surface (31) in sealing contact with the O-ring (2), the outer peripheral surface (11) is rectangular and the O-ring (2) is A sealing device characterized in that the inner diameter elongation rate is set in a range of 10 to 30% and is mounted in the groove (12). 前記Oリング(2)の線径が0.4mm〜1.6mmであることを特徴とする請求項1記載の密封装置。   The sealing device according to claim 1, wherein the O-ring (2) has a wire diameter of 0.4 mm to 1.6 mm. 前記Oリング(2)の硬度がJISA50〜70°であることを特徴とする請求項1または2記載の密封装置。   The sealing device according to claim 1 or 2, wherein the hardness of the O-ring (2) is JIS A 50 to 70 °. 前記Oリング(2)の表面がコーティング処理されていることを特徴とする請求項1〜3いずれか一項に記載の密封装置。   The sealing device according to any one of claims 1 to 3, wherein the surface of the O-ring (2) is coated. 前記コーティング処理が反応性表面処理剤で処理されていることを特徴とする請求項4記載の密封装置。   The sealing device according to claim 4, wherein the coating treatment is treated with a reactive surface treatment agent. 前記Oリング(2)の表面が梨地処理されていることを特徴とする請求項1〜3いずれか一項に記載の密封装置。   The sealing device according to any one of claims 1 to 3, wherein a surface of the O-ring (2) is treated with a satin finish. 前記Oリング(2)の圧縮率が5〜20%であることを特徴とする請求項1〜6いずれか一項に記載の密封装置。   The sealing device according to any one of claims 1 to 6, wherein a compression rate of the O-ring (2) is 5 to 20%. 前記周面(11)が円弧形状部(111)を有することを特徴とする請求項1〜7いずれか一項に記載の密封装置。   The sealing device according to any one of claims 1 to 7, wherein the peripheral surface (11) has an arcuate portion (111).
JP2007204240A 2007-08-06 2007-08-06 Sealing device Pending JP2009041586A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011256946A (en) * 2010-06-09 2011-12-22 Tohoku Univ Pressure-reducible processing apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001227649A (en) * 2000-02-14 2001-08-24 Nok Corp Sealing material
JP2002054747A (en) * 2000-08-08 2002-02-20 Citizen Watch Co Ltd Waterproof structure for compact portable equipment and wristwatch
JP2002139184A (en) * 2000-10-31 2002-05-17 Kyocera Corp Connection pipe and solar heat collection device using the same
JP2004146284A (en) * 2002-10-28 2004-05-20 Toshiba Corp Sealed electric equipment case
JP2006283865A (en) * 2005-03-31 2006-10-19 Sekisui Chem Co Ltd Pipe joint

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001227649A (en) * 2000-02-14 2001-08-24 Nok Corp Sealing material
JP2002054747A (en) * 2000-08-08 2002-02-20 Citizen Watch Co Ltd Waterproof structure for compact portable equipment and wristwatch
JP2002139184A (en) * 2000-10-31 2002-05-17 Kyocera Corp Connection pipe and solar heat collection device using the same
JP2004146284A (en) * 2002-10-28 2004-05-20 Toshiba Corp Sealed electric equipment case
JP2006283865A (en) * 2005-03-31 2006-10-19 Sekisui Chem Co Ltd Pipe joint

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011256946A (en) * 2010-06-09 2011-12-22 Tohoku Univ Pressure-reducible processing apparatus

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