JP2009033903A - Connector unit, housing of rotating electrical machine, and rotating electrical machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector unit, a housing provided with the same, and a rotating electrical machine, for surely reducing temperature rise of a semiconductor device. <P>SOLUTION: A connector unit provided to a housing 60 of a motor 3 comprises a power conversion part 10 including a semiconductor device 11 for conversion between DC power and three-phase AC power, and a heatsink 21 for dissipating heat from the semiconductor device. Between the power conversion part and the housing, a heat conduction connecting part 55 is provided for heat conduction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a connector unit, a housing for a rotating electrical machine, and a rotating electrical machine. More specifically, the present invention relates to a connector unit provided in the rotating electrical machine, a housing of the rotating electrical machine provided with the connector unit, and the rotating electrical machine.

Electric vehicles and hybrid electric vehicles (HEVs) are attracting attention against the background of soaring fossil fuels and regulations on CO ₂ emissions to prevent global warming. In HEV, an electric motor is AC driven by switching DC power using a power conversion unit or power module having an inverter circuit composed of a plurality of semiconductor devices. ON / OFF of the semiconductor device in the power conversion unit is controlled by a control circuit.

  One problem with HEV power converters or power modules is the generation of heat due to the power loss of the semiconductor device. A large thermal stress is generated in the heat dissipation path due to the difference in coefficient of thermal expansion of each member of the heat dissipation path where heat from the semiconductor device flows and is dissipated. The thermal stress warps or peels in the heat dissipation path and interrupts the heat dissipation path, so it must be reliably prevented. Many heat dissipation structures using DBA (Direct Brazed Aluminum) substrate composed of Al wiring / AlN insulating substrate / Al plate to reconcile the difference in thermal expansion coefficient of the material of heat dissipation path and relieve thermal stress It has been disclosed (for example, Patent Documents 1 and 2).

  FIG. 20 is a block circuit diagram showing an example of a conventional HEV electrical system. As shown in the figure, an engine 501, an engine radiator 502, a vehicle driving motor 503, and a power source for generating a three-phase AC power source for driving the motor 503 are included in a conventional HEV vehicle body 500. A generation unit 510 is provided. The power generation unit 510 includes an inverter 505 that supplies three-phase AC power for driving the motor 503, a battery 506 that supplies DC power to the inverter 505, and a converter 507 that converts the voltage of the DC power. Are arranged.

In the power generation unit 510 illustrated in FIG. 20, the power stored in the battery 506 is converted into a desired voltage by the converter 507, and DC power is supplied to the inverter 505. The inverter 505 is formed by a part of a power conversion unit incorporating a power device such as an IGBT, and the inverter 505 generates a three-phase AC power source from the DC power source. Thus, the three-phase AC power generated by the power generation unit 510 is sent to the motor 508 via the three-phase AC power line 508. Then, the motor 503 is rotated by the three-phase AC power source, and the engine 501 is driven. Converter 505, inverter 505, and battery 506 are housed in individual cases and are electrically connected by external wiring. As described above, electric wiring is often used in an automobile equipped with a motor. Electrical wiring is usually performed by a wire harness called a combination wiring, but the specific gravity of copper used as a raw material is high, and this manufacturing cost tends to increase.
JP 2004-296493 A JP 2005-328087 A

  The problem of heat in the power conversion unit of the HEV becomes serious as the capacity of the device is increased, the size is reduced, the processing speed is increased, and the above-described DBA substrate is used to cope with the problem. The amount of use increases, leading to an increase in cost. Further, as can be seen from the above-described HEV wiring system diagram, the cost of electrical wiring is also increased regardless of the heat radiation path formation.

  An object of the present invention is to provide a connector unit, a housing provided with the connector unit, and a rotating electrical machine that can more reliably reduce the temperature rise of a semiconductor device without causing an increase in cost.

  The connector unit of the present invention is a connector unit provided in a housing of a rotating electrical machine. This connector unit includes a power conversion unit having a semiconductor device for converting DC power and three-phase AC power, and a heat sink that dissipates heat from the semiconductor device, and between the heat sink and the housing, It is characterized by comprising a heat conduction connecting part for ensuring conduction.

  As described above, by combining the power conversion unit into the connector unit, disposing the connector unit in the housing, and the heat conducting connection unit, heat dissipation from the heat sink (natural air cooling, forced air cooling, or liquid cooling) In addition, the heat dissipation effect of the housing can be obtained. Thereby, the temperature rise of the semiconductor device can be more reliably suppressed. As a result, the heat dissipation burden of the heat sink can be reduced, and the space utilization efficiency around the rotating electrical machine can be increased by reducing the shape of the fins of the heat sink. Here, the heat sink may or may not have fins. Moreover, it is not necessary to use a long three-phase AC power wire harness from a power conversion unit located at a distant place, and the material cost of the wire harness can be reduced even if the DC wire harness is taken into consideration. In addition, electromagnetic noise that causes other electronic devices to malfunction can be prevented from being emitted from a long three-phase AC power wire harness. Note that the connector unit may be provided in any manner. For example, the connector unit may be attached using attachment parts, or may be integrated in a material or metal phase.

Here, the power conversion portion, in particular, the heat conduction connecting portion for ensuring heat conduction between the heat sink and the housing refers to a portion where the heat sink and the housing are in the following state.
(A1) A portion in surface contact with a thermally conductive material layer interposed. For example, the part which has arrange | positioned the uneven | corrugated filling heat conductive material layer for preventing the generation | occurrence | production of the gap | interval between the members (components) between a heat sink and a housing, and the gap | interval resulting from a fine unevenness | corrugation. The uneven filling heat conductive material can fill in fine unevenness and increase the thermal conductivity. The uneven filling heat conductive material includes heat conductive grease, various solders, and the like.
(A2) A portion in which the heat sink and the housing are directly and in close contact with each other without any intervening therebetween. In this case, the contact area between the heat sink and the housing is preferably polished so that there are no fine irregularities.
(A3) A portion where the heat sink and the housing are cross-linked by a heat conductive material (for example, a copper plate) or a heat conductive device (for example, a heat pipe). These heat conductive materials or heat conductive devices may be arranged in series between the heat sink and the housing, or may be arranged in a bypass or parallel manner.
(A4) A dissimilar metal joint part in which the heat sink and the housing are made of metal even if there is no dissimilar material interface between the heat sink and the housing, and they are metallicly joined.
(A5) In addition, a part having a structure similar to any of the above (A1) to (A4).
In the case of the above (A1) and (A2), a connecting means such as a screw for connecting the heat sink and the housing is used to exert a force to reduce the distance between the two surfaces so as to increase the surface pressure between them. can do. Further, the heat conduction connecting part for ensuring heat conduction between the heat sink and the housing may be a part for ensuring heat conduction, arranged in parallel with other mechanical connection parts, It may have a structure that ensures the above-described heat conduction while also serving as a mechanical connection (fixation), and may have a configuration in which there is no other mechanical connection (fixation) mechanism. Not only the above (A1) to (A5) alone, but also a combination of two or more thereof may be used.

  In addition, when the heat sink and the housing are provided with a heat conduction connecting portion, a heat sink that can be easily processed is processed to correspond to the above arrangement, and the heat conduction connection. The structure of the part can be easily formed.

  The above heat sink can face the outside of the housing, and can be configured so that the semiconductor device is positioned on the main body side of the rotating electrical machine from the heat sink. Accordingly, since the heat sink faces the outside of the housing, it is easy to perform natural cooling, forced air cooling, or liquid cooling on the heat sink in terms of space or ambient environment. Providing fins on the outer side of the heat sink also facilitates space. Further, since the rotating electrical machine main body is housed in the housing and the semiconductor device is located on the near side, the wiring length can be reduced.

  The housing is provided with an opening, and the connector unit can have a structure in which the semiconductor device is located in the housing and the heat sink is attached to the outside of the housing. . According to this configuration, since the heat sink faces the outside of the housing, it is easy to perform natural cooling, forced air cooling, or liquid cooling on the heat sink in terms of space or ambient environment. Providing fins on the outer side of the heat sink also facilitates space. In addition, since the rotating electrical machine main body is housed in the housing and the semiconductor device faces the inside at the opening, the wiring length can be shortened and the wiring path structure can be simplified because of the opening. Wiring of AC power to the main body can be easily performed. Furthermore, by adopting a structure in which the connector unit is fitted into the opening, the protruding portion of the connector unit from the housing can be suppressed and the miniaturization can be facilitated.

  The power conversion unit can include a wiring member electrically connected to the electrode of the semiconductor device and an insulating adhesive layer that fixes the wiring member and the heat sink between the heat sink and the heat sink. As a result, the heat dissipation path from the semiconductor device to the heat sink can be formed with a simple structure, and the number of parts can be reduced and the cost can be reduced. Moreover, heat dissipation can also be improved by reducing the length of the heat dissipation path and the number of dissimilar material interfaces.

  The semiconductor device described above is a vertical device, has a back electrode, the wiring member has a plate shape, and can be configured to be surface-connected to the back electrode via a conductive metal layer. As a result, since the cross section of the heat dissipation path becomes large, conduction of heat from the semiconductor device to the heat sink is not hindered, and heat dissipation can be improved. In addition, the generation of heat due to a large current can be suppressed by reducing the electrical resistance at the interface. The vertical device refers to a device in which current flows in the thickness direction of the semiconductor device, and includes a front surface electrode, a back surface electrode, and a control electrode (usually disposed on the surface).

  The housing of the present invention is characterized in that any one of the connector units described above is provided, and a heat conduction connecting portion is formed between the housing and the power conversion portion. Thereby, the operational effects of the respective heat sinks can be obtained.

  By providing fins for heat dissipation in the housing, the heat dissipation effect of the housing can be further enhanced. The housing may be provided with a cooling path through which the coolant flows. This also greatly improves the heat dissipation effect of the liquid-cooled housing. As a result, the heat dissipation burden of the heat sink can be reduced, and the space utilization efficiency around the rotating electrical machine can be improved by reducing the size of the fins of the heat sink.

  A heat sink is integrated with the housing, and the heat conduction connecting portion can be formed at an integrated portion of the heat sink and the housing. Thereby, it is not necessary to manufacture a heat sink separately, and cost reduction can be obtained. In addition, heat can be radiated to the housing, and further, miniaturization or space utilization efficiency can be improved by using both the heat sink and the housing.

  A rotating electrical machine of the present invention includes any one of the housings described above and a rotating electrical machine main body housed in the housing. Thereby, the effect of each housing described above can be obtained.

  According to the connector unit, the housing, and the rotating electrical machine of the present invention, it is possible to cause the housing to exhibit a heat radiation action without increasing the cost, and to more reliably suppress the temperature rise of the semiconductor device.

(Embodiment 1)
1. Electric system in which connector unit of this embodiment is used FIG. 1 is a block diagram schematically showing a configuration of an electric system inside a hybrid vehicle or HEV body according to the first embodiment. As shown in the figure, an HEV vehicle body 9 includes an engine 1, an engine radiator 2, a motor 3 for driving the engine, and an inverter that generates a three-phase AC power source for driving the motor 3. A connector unit 5 to be connected, a battery 6 for supplying DC power to an inverter in the connector unit 5, and a converter 7 for converting the voltage of the DC power supply are arranged. Here, in the present embodiment, the connector unit 5 incorporating the inverter is provided in the motor housing of the motor 3, and the connector unit 5 and the converter 7 are connected by the DC power supply wiring 8. Yes. In the present invention, the connector unit is provided in the motor housing in a case where a part of the connector unit is fixed to the housing and a case where a part of the connector unit is formed integrally with the housing of the rotating electrical machine. And shall be included.

  In the present embodiment, power stored in battery 6 is converted to a desired voltage by converter 7, and DC power is supplied to an inverter in connector unit 5. As will be described later, a power conversion unit incorporating a power device such as an IGBT is disposed in the inverter, and three-phase AC power is generated from DC power by the power conversion unit. The motor 3 is rotated by the three-phase AC power to drive the vehicle.

  In the present embodiment, the battery 6 and the converter 7 are disposed in the trunk, and the connector unit 5 is disposed in the engine room. Therefore, the connector unit 5 is connected from the converter 7 via a pair of DC power supply wires 8. DC power is supplied to the inverter inside. Therefore, a long three-phase AC power supply wiring (three-phase AC wiring harness) as in the conventional configuration shown in FIG. 20 is not necessary, thereby reducing the amount of thick wiring used to supply large power. Thus, the manufacturing cost can be reduced.

  FIG. 2 is an electric circuit diagram showing a circuit configuration from the battery 6 to the motor 3. In the figure, illustration of members such as a converter and a capacitor is omitted. As will be described later, the connector unit 5 is provided with a socket 28 to which the DC power supply wiring 8 is connected, and the connector unit 5 is provided with DC power supply metal wirings 23 a and 23 b extending from the socket 28. DC power is supplied.

  Although not shown in FIG. 1, the motor control unit 80 shown in FIG. 2 is arranged in the HEV vehicle body 9, and a control signal wiring 81 extends from the motor control unit 80. On the other hand, the connector unit 5 is provided with a socket 29 to which a control signal wiring 81 is connected, and a control signal is supplied into the connector unit 5 through a control signal wiring 83 extending from the socket 29. .

  As shown in FIG. 2, in the connector unit 5, a power conversion unit 10 including a total of six switching circuits including IGBTs and diodes arranged in parallel is arranged. In the connector unit 5, a device driving circuit 16 for controlling the operation of each switching circuit in the connector unit is disposed. The device drive circuit 16 receives an input signal from the control signal wiring 83 extending from the socket 29, and outputs a control signal to each switching circuit via the control signal wiring 17.

  In the connector unit 5, each switching circuit is supplied with DC power via the DC power supply metal wires 23 a and 23 b, and the switching circuit is driven according to the control signal of the device driving circuit 16, so that the three-phase (U (Phase, V phase, W phase) power signals are generated, and the power signals are output to the motor 3 from the three-phase AC power supply metal wires 23u, 23v, 23w.

  The motor 3 is driven by three-phase (U-phase, V-phase, W-phase) AC, and the stator of the motor 3 is provided with bus bars 63u, 63v, 63w connected to the coil 3a. . Each bus bar 63u, 63v, 63w is connected to the three-phase AC power supply wirings 23u, 23v, 23w of the connector unit 5, respectively, and the motor 3 according to the three-phase AC power input to the bus bars 63u, 63v, 63w. The inner rotor rotates, thereby driving the vehicle.

2. Part of Motor Housing to which Connector Unit is Mounted FIG. 3 is a perspective view showing a part of the motor 3 in a cutaway manner. FIG. 4 is a cross-sectional view of a part of the motor and the connector unit. However, the rotor is not shown in FIG. As shown in FIGS. 3 and 4, the motor housing body 60 is provided with a stator 61 and a rotor 65 that is rotationally driven in accordance with a current flowing through a coil of the stator 61. The stator 61 includes a core portion 62 formed by assembling a split core around which a coil is wound in a ring shape, and a ring portion 64 for fastening and fixing the split core assembled in a ring shape. And along the ring part 64 and the inner peripheral part of the core part 62, the three-phase bus-bars 63 and 66 connected to the coil wound around each division | segmentation core are arrange | positioned. Each bus bar 63, 66 is connected to each coil wound around each divided core. However, in FIGS. 3 and 4, the connection structure between each bus bar 63, 66 and each coil is not shown. Yes. In FIG. 4, the bus bar 63 on the outer peripheral side is enlarged and displayed without the insulating coating layer.

  The motor housing body 60 is provided with an opening 60 a, and the connector unit 5 is fixed to the edge or upper end surface 60 b of the side tube 60 c surrounding the opening 60 a by the mounting screw 31. The attachment portion of the connector unit includes the opening 60a, the side tube 60c, the edge portion 60b, and a female screw portion to which the attachment screw 31 is screwed. The outer peripheral bus bar 63 (63u, 63v, 63w) includes ring portions 63u1, 63v1, 63w1, and motor side terminals 63u2, 63v2, protruding from the ring portions 63u1, 63v1, 63w1 so as to be close to the opening 60a. 63w2.

  On the other hand, the connector unit 5 includes, as will be described later, DC power supply terminals 23a2 and 23b2 protruding toward the outside of the motor housing, and three-phase AC power supply terminals 23u2 and 23v2 protruding toward the inside of the motor housing. 23w2. In the present embodiment, when the connector unit 5 is mounted on the motor housing body 60, the three-phase AC power terminals 23u2, 23v2, 23w2 of the connector unit 5 and the motor side terminals 63u2, 63v2, 63w2 is fixed with a bolt or the like in a direct contact state.

3. Thermal conduction connecting portion formed between heat sink and housing FIG. 5 is a cross-sectional view of the connector unit according to the first embodiment (a cross-sectional view taken along line VV in FIG. 10 described later). is there.). FIG. 6 is an enlarged view of a portion A in FIG. The present embodiment is characterized in that the heat conductive grease 55 is arranged at the connecting portion that connects the heat sink 21 to the cylindrical portion 60 c of the housing 60. That is, the portion where the heat conductive grease 55 a is disposed is the heat conductive connection portion 55. As shown in FIG. 6, the thread crest and trough of the mounting screw 31 are not in close contact with the crest and trough of the female screw 60 j provided in the cylindrical portion of the housing 60, but are linear or band-like. It is in contact with (spiral) and has many voids. By using the thermal conductive grease, this gap can be filled and the thermal conductivity between the mounting screw 31 and the cylindrical portion 60c of the housing 60 can be secured.

  An object having not only a screw but also an approximately shape has a finite processing accuracy, and it is inevitable that a gap is generated between the members. The gap between the members becomes a major obstacle to heat conduction. The heat conduction grease 55a can fill the gap and form the heat conduction connecting portion 55 even in the gap between such members (parts). Further, the metal-processed surfaces have fine irregularities, and when the surfaces having fine irregularities are brought into contact with each other, minute voids are also generated between the surfaces, thereby hindering heat conduction. In addition, although an important part of the metal processed surface is protected by an oil-based coating to prevent rusting, it is not preferable from the viewpoint of ensuring thermal conductivity. By interposing the thermal conductive grease 55a between the contact surface of the housing 60 or the edge 60b of the cylindrical portion and the contact surface 21p of the heat sink 21 for preventing rusting and ensuring thermal conductivity, The heat conductivity between the two can be improved, and the housing 60 can contribute to the heat dissipation of the heat generated in the semiconductor chip 11. Further, it is preferable to dispose the thermal conductive grease 55 a between the surface of the lower part of the head of the mounting screw 31 and the wall surface of the screw hole 21 h of the heat sink 21. The thermal grease 55a can be easily arranged in fine parts, can be easily arranged in a small heat conduction path from the heat sink 21 to the housing 60, and the integration of small heat conduction paths with improved thermal conductivity allows An effect that cannot be ignored can be obtained. The same applies to a solder layer and a heat conductive sheet described later.

The heat conductive grease 55a constituting the heat conductive connecting portion 55 in the present embodiment corresponds to (A1) among the heat conductive connecting portions listed below.
(A1) A portion in surface contact with a thermally conductive material layer interposed. For example, the part which has arrange | positioned the uneven | corrugated filling heat conductive material layer for preventing the generation | occurrence | production of the gap | interval between the members (components) between a heat sink and a housing, and the gap | interval resulting from a fine unevenness | corrugation. The uneven filling heat conductive material can fill in fine unevenness and increase the thermal conductivity. The uneven filling heat conductive material includes heat conductive grease, various solders, and the like.
(A2) A portion in which the heat sink and the housing are directly and in close contact with each other without any intervening therebetween. In this case, the contact area between the heat sink and the housing is preferably polished so that there are no fine irregularities.
(A3) A portion where the heat sink and the housing are cross-linked by a heat conductive material (for example, a copper plate) or a heat conductive device (for example, a heat pipe). These heat conductive materials or heat conductive devices may be arranged in series between the heat sink and the housing, or may be arranged in a bypass or parallel manner.
(A4) A dissimilar metal joint part in which the heat sink and the housing are made of metal even if there is no dissimilar material interface between the heat sink and the housing, and they are metallicly joined.
(A5) In addition, a part having a structure similar to any of the above (A1) to (A4).
Not only the above (A1) to (A5) alone, but also a combination of two or more thereof may be used. Conventionally, there is no example in which any of the above (A1) to (A4) is used for connection between the heat sink 21 and the housing 60 (is it OK?).

  The power conversion unit 10 includes a semiconductor chip 11 that displays the IGBT chip 11a and the diode chip 11b together, and a wiring layer for electrically connecting a semiconductor element (vertical semiconductor device) in the semiconductor chip 11 and an external member. (23a2, 23b2, 23u1, 23v1, 23w1, etc.). In the cross section shown in FIG. 5 of the wiring layer, the flat plate portions 23a1 and 23a2 of the DC power supply metal wires 23a and 23b and the flat plate portion 23w1 of the three-phase AC power supply metal wire 23w appear. Also, a solder layer 14 containing Pb-free solder for joining the respective flat plate portions 23a1, 23a2, 23w1 of the wiring layer and the semiconductor chip 11, a heat sink 21 for releasing heat generated in the semiconductor chip 11 to the outside, An insulating adhesive layer 26 for fixing the flat plate portions 23a1, 23a2, and 23w1 of the wiring layer to the heat sink 21 is provided. Although not shown, the upper surface and the lower surface of the semiconductor chip 11 are respectively provided with an upper surface electrode and a back surface electrode connected to the active region of the IGBT and the diode. Each wiring layer is joined in a conductive state. A flat plate portion 23a1 or 23w1 of the DC power supply wiring or AC power supply wiring forming the wiring member is a portion in the wiring layer.

  Further, the upper surface electrode of the semiconductor chip 11 (the upper surface electrode of the IGBT chip or the upper surface electrode of the diode chip) and the flat plate portions of the wiring layer (23w2 and 23b1 in the cross section shown in FIG. 5) are the large current wiring 18. Are electrically connected. Further, in the semiconductor chip 11, the upper surface electrode of the IGBT chip and the upper surface electrode of the diode chip are also electrically connected by the large current wiring 18.

  The heat sink 21 includes a flat plate portion 21a and a fin portion 21b protruding from the back surface side of the flat plate portion 21a. The flat plate portion 21 a is attached to the edge portion 60 b of the side tube 60 c of the opening portion 60 a of the motor housing body 60 by the mounting screw 31. The flat plate portion 21 a of the heat sink 21 functions as a support member that supports the wiring layer and the semiconductor chip 11. The heat sink 21 functions as a heat radiator and also functions as a part of the motor housing. That is, it can be considered that the heat sink 21 constitutes a part of the motor housing, and the motor housing is constituted by the motor housing body 60 a and the heat sink 21. In addition, although the case where the fin part 21b was provided in the heat sink 21 was illustrated, you may comprise only the flat plate part 21a without the fin part 21b.

  In the present embodiment, the heat sink 21 is naturally air-cooled. However, a container 50 (see the broken line display) surrounding the fin portion 21b is separately provided, and air or liquid is forcibly circulated to forcibly cool. Also good. However, the fin part 21b is not necessarily required, and other heat radiating members may be provided instead of the fin part 21b.

  Further, a socket 28 is provided in the first opening 21 a of the heat sink 21, and a DC power supply terminal 23 a 2 bent from the flat plate portion 23 a 1 of the DC power supply metal wiring 23 a extends to the socket 28. Although not shown in the cross section shown in FIG. 5, a DC power supply terminal 23b2 bent substantially at a right angle from the flat plate portion 23b1 of one of the DC power supply metal wires 23b also extends to the socket 28 (see FIG. 11). That is, each DC power supply terminal 23 a 2, 23 b 2 extends to the external space of the motor housing body 60.

  Further, in a cross section other than the cross section shown in FIG. 5, the three-phase AC power supply terminal 23 w 2 bent almost at right angles from the flat plate portion 23 w 1 of the three-phase AC power supply metal wiring 23 w extends into the motor housing body 60. Yes. The three-phase AC power supply terminal 23w2 is fixed by the attachment member 37 in a state of being in direct contact with the motor side terminal 63w2. Although not shown in FIG. 5, the three-phase AC power supply terminals 23u2 and 23v2 bent substantially at right angles from the flat plate portions 23u1 and 23v1 of the other three-phase AC power supply metal wires 23u and 23v have the same configuration. ing. The three-phase AC power supply terminals 23u2, 23v2, 23w2 and the motor side terminal 63w2 may be covered with an insulating resin together with the mounting member 37.

  Further, a printed wiring board 33 is laminated above the wiring layer via an insulating plate 35, and the device driving circuit 16 is disposed on the printed wiring board 33. A signal wiring 17 for supplying a control signal is electrically connected between a signal wiring (not shown) extending on the printed wiring board 33 and a control electrode (not shown) of the semiconductor chip 11. It is connected to the.

  Although not shown in FIG. 5, on the upper surface side of the heat sink 21, the semiconductor chip 11, the control signal wiring 17, the high current wiring 18, the printed wiring board 33, the insulating board 35, the wiring layer, the solder layer 14, Members such as the insulating resin layer 26 are sealed with a resin such as an epoxy resin except for their terminals.

  In the present embodiment, sintered aluminum (sintered Al) is used as the material of the heat sink 21. However, it is not limited to this. For example, using other metals such as Al, Al alloy, Cu, Cu alloy, ceramics such as AlN, SiN, BN, SiC, WC, or composite materials such as Al—SiC, Cu—W, Cu—Mo. Also good.

  In the present embodiment, Cu or Cu alloy is used as the material of the metal wiring 23 (23a, 23b, 23u, 23v, 23w), but is not limited thereto. For example, a composite material such as Al, Al alloy, Al—SiC, Cu—W, or Cu—Mo may be used.

  In the present embodiment, the wiring layers (each flat plate portion 23a1, 23b1, 23u1, 23v1, 23w1) and terminals to external devices (DC power supply terminals 23a2, 23b2 and three-phase AC power supply terminals 23u2, 23v2, 23w2) Are configured by a single metal plate (in this embodiment, a Cu plate or a Cu metal plate), but a wiring layer and a terminal may be provided separately and connected between each other by a bus bar or the like. .

  As described above, the power conversion unit 10 of the present embodiment includes the solder layer 14 made of Pb-free solder and the insulating adhesive layer 26. In general, Pb-free solder includes the following. For example, Sn (liquid phase point 232 ° C.), Sn-3.5% Ag (liquid phase point 221 ° C.), Sn-3.0% Ag (liquid phase point 222 ° C.), Sn-3.5% Ag−0.55% Cu (liquid phase point) 220 ° C.), Sn-3.0% Ag-0.5% Cu (liquid phase point 220 ° C.), Sn-1.5% Ag-0.85% Cu-2.0 Bi (liquid phase point 223 ° C.), Sn-2.5% Ag-0.5% Cu -1.0Bi (liquid phase point 219 ° C), Sn-5.8Bi (liquid phase point 138 ° C), Sn-0.55% Cu (liquid phase point 226 ° C), Sn-0.55% Cu-others (liquid phase point 226 ° C) , Sn-0.55% Cu-0.3% Ag (liquid phase point 226 ° C), Sn-5.0% Cu (liquid phase point 358 ° C), Sn-3.0% Cu-0.3% Ag (liquid phase point 312 ° C), Sn- 3.5% Ag-0.5% Bi-3.0In (liquid phase point 216 ° C), Sn-3.5% Ag-0.5% Bi-4.0In (liquid phase point 211 ° C), Sn-3.5% Ag-0.5% Bi-8.0In (Liquid phase point 208 ° C), Sn-8.0% Zn 3.0% Bi (liquidus point 197 ° C.), and the like. In this embodiment, a low-melting point Pb-free solder having a liquidus point of 250 ° C. or lower, for example, Sn-3.0% Ag-0.5% Cu (liquidus point 220 ° C.) is used. It is not a thing. However, high melting point Pb-free solder such as Sn-5.0% Cu (liquid phase point 358 ° C), Sn-3.0% Cu-0.3% Ag (liquid phase point 312 ° C) (liquid phase point exceeding 250 ° C) Shall be excluded.

  In the present embodiment, an epoxy resin containing a metal or ceramic filler is used for the insulating adhesive layer 26. Although the usable temperature of the epoxy resin varies depending on the type, it is easy to select a temperature exceeding 250 ° C. In this embodiment, a temperature higher than the liquid phase point of Pb-free solder is used. Therefore, it becomes possible to perform a reflow process of Pb-free solder after the insulating adhesive layer 26 is formed in the assembly process of the power conversion unit described later. For example, an epoxy resin filled with alumina, silica, aluminum, aluminum nitride, or the like can be used, and the thermal conductivity is preferably 3.0 (W / m · K) or more, and 5.0 ( W / m · K) or more is more preferable.

  The thickness of the insulating adhesive layer 26 is preferably 0.4 mm or less, and more preferably 0.2 mm or less. The thermal resistance of the insulating adhesive layer 26 is determined depending on the thermal conductivity and thickness, but the thermal resistance decreases as the thickness decreases. Therefore, heat dissipation performance will become high because thickness is 0.4 mm or less.

  According to the present embodiment, a power converter that functions as an inverter for converting DC power into three-phase AC power between DC power terminals 23a2, 23b2 and three-phase AC power terminals 23u2, 23v2, 23w2. 10 is provided, and a part of the connector unit 5 (in this embodiment, the heat sink 21) is connected to the motor housing body 60. Between the power converter 10 and the power converter 10 may be provided with a DC power supply wiring instead of a three-phase AC power supply wiring. Reduction can be achieved.

  In addition, since the power conversion unit 10 is disposed in the motor housing, the space in the motor housing can be used effectively, and as a result, the members inside the vehicle can be made compact. In particular, the heat sink 21 is attached in contact with the motor housing body 60 (see FIG. 5), and the heat sink 21 is used as a part of the motor housing. Heat dissipation performance is also improved through the motor housing body 60.

Moreover, since the printed wiring board 33 which mounts the device drive circuit 16 which is a control circuit for controlling the operation | movement of a power device is integrated in the power converter 10, compactization of the member inside a vehicle can be achieved. . In addition, the flat plate portions 23a1 and 23b1 of the DC power supply wires 23a and 23b and the DC power supply terminals 23a2 and 23b2 in the wiring layer are formed of a common metal plate, thereby reducing the manufacturing cost and the connector unit 5. Can be reduced in size. Further, among the wiring layers, flat plate portions 23u1, 23v1, 23w1 of the three-phase AC power supply metal wires 23u, 23v, 23w,
Even when the three-phase AC power terminals 23u2, 23v2, and 23w2 are made of a common metal plate, the manufacturing cost can be reduced and the size of the connector unit 5 can be reduced.

  In this embodiment, since one solder layer 14 and the insulating resin layer 26 made of a resin adhesive are used in place of the two solder layers that have been conventionally used, depending on the process before and after the process. It is not necessary to use a low melting point Pb-free solder and a high melting point Pb free solder, and only a low melting point Pb free solder is required. Currently, Pb-free solder having a relatively high Cu composition ratio (for example, Sn-5.0% Cu, Sn-3.0% Cu-0.3% Ag having a liquidus point of 300 ° C. or higher) has been developed as a Pb-free solder. It is difficult to obtain a high melting point Pb-free solder having reliable connection reliability. On the other hand, as the low melting point Pb-free solder, for example, a solder having high connection reliability such as Sn-3.0% Ag-0.5% Cu (JEITA recommended alloy) having a liquidus point of 220 ° C. has been obtained. As the resin adhesive, an epoxy resin having a usable temperature exceeding 250 ° C. can easily be obtained that can withstand a higher temperature than the liquid phase point of the low melting point Pb-free solder. Therefore, according to the present embodiment, the solder layer 14 can be made Pb-free and Pb-free can be achieved while ensuring connection reliability.

4. Heat Dissipation from Housing As shown in FIGS. 5 and 6, the heat generated in the vertical semiconductor device 11 is (back electrode / solder layer 14 / insulating adhesive layer 26 / heat sink 21 / heat conduction connecting portion 55). Then, it is also conducted to the housing 60. As a result, heat is radiated from the housing 60. In this case, as shown in FIG. 7, heat dissipation can be improved by providing fins 60 f on the outer peripheral surface of the housing 60. When the fin 60f is a standing wall-shaped fin, it may be a standing wall-shaped fin extending along the outer periphery as illustrated in FIG. 7, or may be a standing wall-shaped fin extending parallel to the axis. As described above, in the widest range, the heat sink 21 in the connector unit 5 may or may not be provided with the fins 21b, but is usually provided. Although not shown in FIG. 7, when the fins 21 b of the heat sink 21 are provided, the fins 21 b of the heat sink 21 are formed so as to face the outside of the housing 60 like the fins 60 f of the housing 60.

5. Electrical component connection structure of connector unit Next, an electrical component connection structure of the connector unit will be described. FIG. 8 is a perspective view of the connector unit 5 as viewed from the main surface side, and FIG. 9 is a perspective view of the connector unit 5 as viewed from the back surface side, and FIG. The reversed state is displayed.

  As shown in FIG. 8, each member of the connector unit 5 is mounted on the heat sink 21. A printed wiring board 33 on which a device drive circuit or the like is mounted is provided on the top, and all members except for external terminals are sealed with epoxy resin or the like (not shown) on the printed wiring board 33. Yes. The printed wiring board 33 is provided with a first opening 33a, a slit 33b, and a second opening 33c. An IGBT chip 11a on which an IGBT that is a power device is formed and a diode chip 11b on which a diode that is a power device is formed are disposed in the first opening 33c. A control signal wiring 83 is disposed in the second opening 33c. Also, three-phase AC power supply terminals 23u2, 23v2, and 23w2 protrude through the slit portion 33b.

  On the other hand, as shown in FIG. 9, when viewed from the back side of the heat sink 21, the heat sink 21 has a flat plate portion 21a and a fin portion in which a large number of fins (not shown) projecting outward from the flat plate portion 21a are formed. 21b and first and second openings 21c and 21d surrounded by sockets 28 and 29, respectively. Then, DC power supply terminals 23a2 and 23b2 are arranged in the first opening 21c, and a terminal part of the control signal wiring 83 is arranged in the second opening 21d.

  Next, the structure of each member laminated on the heat sink of the connector unit 5 will be described. FIG. 10 is a perspective view showing each layer other than the wiring layer on the heat sink 21 as seen through. FIG. 11 is a perspective view showing the layers on the heat sink 21 separately. As shown in FIGS. 10 and 11, a resin insulating layer 26, a metal wiring 23, and an insulating plate 35 are stacked in order from below between the heat sink 21 and the printed wiring board 33. The metal wiring 23 includes DC power supply metal wirings 23a and 23b for supplying DC power, and three-phase AC power supply metal wirings 23u, 23v and 23w for supplying three-phase AC power.

  The DC power supply metal wirings 23a and 23b have flat plate portions 23a1 and 23b1 extending in the horizontal direction and DC power supply terminals 23a2 and 23b2 which are bent from the flat plate portions 23a1 and 23b1 and extend downward in the drawing. Yes. Further, the three-phase AC power supply metal wirings 23u, 23v, 23w are formed of flat plate portions 23u1, 23v1, 23w1 extending in the horizontal direction and three phases extending upward in the drawing by being bent from the flat plate portions 23u1, 23v1, 23w1. AC power supply terminals 23u2, 23v2, and 23w2 are provided.

  Each of the flat plate portions 23a2, 23b2, 23u1, 23v1, and 23w1 constitutes the wiring layer of the present invention. In the present embodiment, the flat plate portions 23a1 and 23b1 which are the first portions of the wiring layer are respectively a common metal plate with the DC power supply terminals 23a2 and 23b2 (in this embodiment, a Cu plate or a Cu alloy plate). ). Further, the flat plate portions 23u1, 23v1, 23w1 which are the second portions of the wiring layer are metal plates common to the three-phase AC power supply terminals 23u2, 23v2, 23w2, respectively (in this embodiment, a Cu plate or a Cu alloy plate). ).

  The DC power supply terminals 23a2 and 23b2 extend through the first opening 26a of the resin insulating layer 26 to the first opening 21c of the heat sink 21 (see FIG. 9). Further, the three-phase AC power supply terminals 23u2, 23v2, and 23w2 project through the slit portion 35b of the insulating plate 35 and the slit portion 33b of the printed wiring board 33 and protrude above the printed wiring board 33 (see FIG. 8). ). Further, the end portion of the control signal wiring 83 is bent downward and extends through the second opening 26 b of the resin insulating layer 26 to the second opening 21 d of the heat sink 21.

6. Modification of the present embodiment FIG. 12 is a cross-sectional view showing a connector unit according to a modification of the first embodiment.
In this modification, the position of the heat conduction connecting portion 55 is the same as that of the heat conduction connecting portion 55 in the first embodiment shown in FIG. 5, but the mounting structure for attaching the heat sink 21 to the housing 60 is different. As shown in the figure, in this modification, a solder layer 55b (55) is formed between the contact surface 21p of the heat sink 21 and the contact surface of the housing 60 or the edge 60b of the cylindrical portion. The solder layer 55b is in a molten state at the time of formation, and even if there are fine irregularities inevitably present on both contact surfaces 21p and 60b, the irregularities are buried to eliminate the cause of hindrance to heat conduction. Can do. Both contact surfaces 21p and 60b have as large an area as possible within a design-acceptable range, but are desirable for improving the conductance of heat conduction.

  The heat conduction connecting portion 55 formed by the solder layer 55b corresponds to (A1) or (A4) of the heat conduction connecting portions described above. As shown in FIG. 12, a heat conductive sheet etc. can be mentioned as what provides a heat conductive connection part intervening in both contact surfaces. As the thermal conductive sheet, a resin sheet having a high thermal conductivity or a sheet having an increased thermal conductivity by dispersing carbon or metal powder regardless of the thermal conductivity can be used. The heat conductive sheet is desirably plastic enough to fill the fine irregularities on the surface. This heat conductive sheet forms a heat conductive connection of the type (A1) described above. Further, although additional notes may not be required, the thermal conductive grease 55a may naturally be used instead of the solder layer 55b in FIG. In short, the overlapping portion where the heat sink 21 and the housing 60 are in contact with each other is made as wide as possible, and the heat conduction grease ((A1) type), solder layer ((A1) or (A4) type) or heat conduction sheet is interposed between them. ((A1) type) is preferably arranged to form the heat conduction connection.

(Embodiment 2)
FIG. 13 is an enlarged cross-sectional view of the power conversion unit according to the second embodiment. FIG. 13 shows a structure of a portion corresponding to FIG. 5 in the first embodiment. In FIG. 13, the metal component 55c is arranged in parallel with the heat conductive connecting portion of the heat conductive grease 55a shown in FIG. 5, and forms a heat conductive path in a bypass manner. In other words, the present embodiment is characterized in that, in addition to the thermal conductive grease 55a, the metal component 55c forms the thermal conductive connection portion 55. The metal part 55c corresponds to (A3) of the above-described heat conduction connecting portions. Although the metal part 55c may be used alone, the heat conduction grease 55a is usually used together in order to remove the heat conduction hindrance due to the fine irregularities on the surface. That is, the heat conductive grease 55a is interposed between the metal part 55c and the portion where the heat sink 21 and the housing 60 are in contact.

  For the metal component 55c, it is preferable to use an inexpensive material having high thermal conductivity such as copper or aluminum. In the case of the present embodiment, the metal part 55c described above additionally provides a heat dissipation path in addition to the heat dissipation connection portion 55 shown in FIG. At this time, by disposing the heat conductive grease 55a between the metal part 55c, the heat sink 21, and the housing 60, the heat dissipation path of the metal part 55c is integrated with the heat dissipation path in FIG. Among them, heat flows to the side where heat conduction is likely to occur, and a more efficient heat conduction path can be formed. The metal part 55c can increase the heat dissipation by the housing 60 by increasing the cross-sectional area of the heat dissipation path.

  FIG. 14 is a diagram showing a modification of the connector unit in the second embodiment shown in FIG. In FIG. 14, the connector unit 5 is attached to the outer peripheral surface of the housing 60, and the three-phase AC power terminals are introduced into the housing through the through holes 60 h of the housing 60. Such a through hole 60h is not one of the structures for connecting the connector unit 5, and even if there is a through hole 60h, unlike the case of the opening 60a, the semiconductor device faces the inside of the housing. That's not true. The structure of the heat conduction connecting portion 55 is the same as that shown in FIG. 13, and the same operational effects as described above can be obtained.

(Embodiment 3)
FIG. 15 is a cross-sectional view showing a connector unit according to Embodiment 3 of the present invention. FIG. 15 corresponds to FIG. 5 in the first embodiment. In the third embodiment, the heat sink 21 is integrated with the motor housing body 60 and functions as a part of the motor housing. In this case, depending on the viewpoint, it can also be seen that the power converter is formed in the motor housing.

  Here, the term “integrated” means that the housing and the heat sink may be manufactured by various integral molding methods. At that time, the housing and the heat sink may be made of different materials or the same material. Moreover, what was joined by joining methods, such as welding, may be used. In short, it is only necessary to be integrated without using mounting parts.

  The heat conduction connecting portion 55 for ensuring heat conduction between the heat sink 21 of the connector unit 5 of the present embodiment and the housing 60 is formed by a welded portion 55d. The heat conduction connecting portion 55 by the welded portion 55d corresponds to (A4) in the above-mentioned heat conduction connecting portion, as can be seen from the above definition of integration. Due to the integration described above, the heat sink 21 and the housing 60 are connected in material or are usually formed of metal, so that metal bonding is performed, the heat conduction path is shortened, and the dissimilar material interface does not pass. As a result, with respect to the heat from the semiconductor device 11, in addition to the heat radiation by the fin portion 21b of the heat sink 21, heat radiation by the housing into which a large heat flow enters can be obtained. As a result, the heat radiation load of the heat sink 21 can be reduced, and the space utilization efficiency around the rotating electrical machine can be increased by downsizing the shape of the heat sink 21 and the like.

  The welding part 55d used as the heat conduction connecting part 55 shown in FIG. 15 connects the flat plate part 21a of the heat sink 21 and the housing 60 so as to be flush with each other. However, the welded part 55d is not limited to the form shown in FIG. 15, and may have a form as shown in FIG. 16, that is, a step between the flat plate part 21 a of the heat sink 21 and the housing 60. The effect (A4) described above can also be obtained by the welded portion 55d shown in FIG.

  As shown in FIG. 17, the heat conduction connecting portion 55 in the category of (A4) described above includes the integration of the heat sink 21 and the housing 60 of the same material (the integrally molded product of the heat sink 21 and the housing 60). . In this case, it may be difficult to specify a specific location of the heat conduction connecting portion 55 (55n). However, as an approximate specification method, “the heat sink 21 and the housing 60 made of the same metal are used. It is possible to specify “near the boundary of 55n” (see FIG. 17). Originally the term heat conduction connection is not familiar with identifying a specific location, it corresponds to a certain degree of "this neighborhood", and it is possible to identify the heat conduction connection . In short, it suffices if a connection portion for ensuring heat conduction between members having different functions such as the heat sink 21 and the housing 60 exists. In the case of dissimilar metals, since welding and soldering are involved, it is not necessary to consider the range of surrounding members when specifying the location as described above.

(Embodiment 4-Enhanced cooling of housing-)
FIG. 18 is a perspective view showing a housing 60 according to Embodiment 4 of the present invention. The present embodiment is characterized in that enhanced cooling is performed on the portion of the housing 60 close to the place where the connector unit 5 is disposed. The fin portion of the heat sink 21 is not shown, but the fin portion of the heat sink 21 may not be provided. In FIG. 18, a heat exchanging part 71 that exchanges heat with the housing part is attached to the housing 60, and a refrigerant inlet path 71a and a refrigerant outlet path 71b are provided in the heat exchanging part 71 to circulate the refrigerant.

  In the case of liquid cooling as cooling enhancement, water, fluorinate, an ethylene glycol aqueous solution or the like is preferably used as the liquid cooling, that is, the cooling liquid. In the case of a gas, it may be a gas such as helium, argon, nitrogen or air. Further, when the evaporator of the refrigerator can be used, low-pressure refrigerant gas may be used. When the engine coolant is used, the engine is usually cooled with an ethylene glycol aqueous solution, so that the ethylene glycol aqueous solution from the engine can be introduced from the refrigerant inlet 71a.

  With the above cooling enhancement, the heat dissipation from the housing is improved, and the heat sink 21 of the connector unit 5 can be downsized. For example, the fin height of the fin portion 21 can be lowered and almost eliminated in a predetermined case. As a result, the space utilization efficiency around the rotating electrical machine can be increased.

  Further, when cooling the motor, as shown in FIG. 19, the cooling medium outlet 73 for the motor can be connected to the refrigerant inlet 71 a of the housing heat exchanging portion 71 to enhance the cooling of the housing 60. . According to the cooling method shown in FIG. 19, after cooling the motor 3, the cooling enhancement of the housing 60 can be promoted for heat dissipation from the power conversion unit.

(Other embodiments)
1. In the above embodiment, the connector unit, the housing, and the rotating electric machine of the present invention have been described with respect to a HEV drive motor. However, the connector unit, the housing, and the rotary electric machine are not limited to automobile motors, and are used for non-automobile motors and generators. be able to. Further, in the case of an automobile, the present invention can be used not only for HEV but also for driving motors of various electric vehicles and the like, and not only for driving motors but also for motors for automobile coolers.
2. The semiconductor element disposed in the power conversion unit of the present invention may be a power device using a wide band gap semiconductor (SiC, GaN, etc.) or a power device using Si.
3. In the above embodiment, the power conversion unit is an inverter combining an IGBT and a diode, but the power conversion unit of the present invention may be an inverter combining a MOSFET and a diode or an inverter composed only of a MOSFET. Good.

  Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  The connector unit, the housing, and the rotating electrical machine of the present invention can be used for HEVs, electric vehicles, motors such as compressors for refrigeration apparatuses, and generators.

It is a block diagram which shows roughly the structure of the electric system inside the vehicle body of HEV which concerns on Embodiment 1 of this invention. It is an electric circuit diagram which shows the circuit structure from the battery in Embodiment 1 of this invention to a motor. It is a perspective view which fractures | ruptures and shows a part of motor. It is sectional drawing of a part of motor and a connector unit. It is sectional drawing of the connector unit which concerns on Embodiment 1 of this invention. It is the A section enlarged view of FIG. It is a figure which shows the fin provided in the housing in Embodiment 1 of this invention. It is the perspective view which looked at the connector unit from the main surface side. It is the perspective view which looked at the connector unit from the back side. It is a perspective view which sees and shows each layer other than the wiring layer on a heat sink. It is a perspective view which isolate | separates and displays each layer on a heat sink. It is a figure which shows the modification of the connector unit of Embodiment 1 of this invention. It is sectional drawing which shows the connector unit which concerns on Embodiment 2 of this invention. It is a figure which shows the modification of the connector unit which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the connector unit which concerns on Embodiment 3 of this invention. It is sectional drawing which shows the connector unit of the modification based on Embodiment 3 of this invention. It is sectional drawing which shows the connector unit of another modification based on Embodiment 3 of this invention. It is a perspective view which shows the housing which concerns on Embodiment 4 of this invention. It is a figure which shows the modification of the housing which concerns on Embodiment 4 of this invention. It is a block circuit diagram which shows the example of the electric system of the conventional HEV.

Explanation of symbols

  1 Engine, 2 Radiator, 3 Motor, 5 Connector unit, 6 Battery, 7 Converter, 8 DC power supply wiring, 10 Power converter, 11a IGBT chip, 11b Diode chip, 14 Solder layer, 16 Device drive circuit, 17 Control signal Wiring, 18 large current wiring, 21 heat sink, 21a flat plate portion, 21b fin portion, 21c first opening portion, 21d second opening portion, 21p contact surface, 23a, 23b DC power supply metal wiring, 23a1, 23b1 flat plate 23a2, 23b2 DC power supply terminal, 23u, 23v, 23w Three-phase AC power supply metal wiring, 23u1, 23v1, 23w1 Flat plate part, 23u2, 23v2, 23w2 Three-phase AC power supply terminal, 26 Insulating adhesive layer, 26a 1 opening, 26b 2nd opening, 26h screw hole, 28 socket, 29 socket, DESCRIPTION OF SYMBOLS 1 Mounting screw, 33 Printed wiring board, 33a 1st opening part, 33b Slit part, 33c 2nd opening part, 35 Insulating plate, 35a 1st opening part, 35b Slit part, 35c 2nd opening part, 37 Mounting member, 50 Container, 55 Thermal conduction connection, 55a Thermal conduction grease, 55b Solder layer, 55c Metal part, 55d Welding part, 55n Integration location (thermal conduction connection), 60 Motor housing body, 60a Opening, 60b Side cylinder edge (Contact surface), 60c side cylinder, 60h through hole, 63u, 63v, 63w bus bar, 63u1, 63v1, 63w1 ring part, 63u2, 63v2, 63w2 motor side terminal, 71 heat exchange part, 71a refrigerant inlet, 71b refrigerant Outlet, 73 Motor refrigerant outlet, 80 Motor control unit, 81 Control signal wiring, 83 Control signal wiring

Claims (10)

A connector unit provided in a housing of a rotating electrical machine,
A power conversion unit including a semiconductor device for converting DC power and three-phase AC power, and a heat sink that dissipates heat from the semiconductor device,
A connector unit comprising a heat conduction connecting portion for ensuring heat conduction between the power conversion portion and the housing.   2. The connector unit according to claim 1, wherein the heat sink faces the outside of the housing, and is provided so that the semiconductor device is positioned on the main body side of the rotating electrical machine from the heat sink.   The housing is provided with an opening, and the connector unit is attached at the opening so that the semiconductor device is located inside the housing and the heat sink faces the outside of the housing. The connector unit according to claim 1 or 2.   The power conversion unit includes a wiring member electrically connected to the electrode of the semiconductor device and an insulating adhesive layer that fixes the wiring member and the heat sink between the heat sink and the heat sink. The connector unit according to claim 1.   The semiconductor device is a vertical device, has a back electrode, the wiring member has a plate shape, and is surface-connected to the back electrode through a conductive metal layer, The connector unit according to claim 4.   A housing for a rotating electrical machine, wherein the connector unit according to any one of claims 1 to 5 is provided, and a heat conduction connecting portion is formed between the connector unit and the power conversion portion.   The rotary electric machine housing according to claim 6, wherein fins for heat dissipation are provided.   The housing for a rotating electric machine according to claim 6 or 7, wherein a cooling path through which the cooling liquid passes is provided.   9. The rotating electrical machine according to claim 6, wherein the heat sink is integrated, and the heat conduction connecting portion is formed at an integrated portion of the heat sink and the housing. housing. A rotating electrical machine comprising: the rotating electrical machine housing according to any one of claims 6 to 9; and a rotating electrical machine main body housed in the housing.

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