JP2009027102A - Stacked coil, vibration sensor using stacked coil, and manufacturing method of the stacked coil - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked coil capable of reducing the electrical resistance of the coil, while increasing the inductance, and of markedly improving the coil characteristics. <P>SOLUTION: This stacked coil 29 is composed by stacking a plurality of spiral coils 3, 4 and 5 formed on the same plane on one another, and the stacked coil is such that each spiral coil is formed in a direction reverse to that of another adjacent spiral coil; and the spiral coils are connected in series to one another, by alternately carrying out connection between central ends 7a of the spiral coils and connection between peripheral ends 7b of the spiral coils. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a laminated coil in which small coils or microcoils are laminated, a vibration sensor including the laminated coil, and a method of manufacturing the laminated coil.

Small coils or even smaller microcoils have a wide range of applications such as microelectronic-related devices such as minimotors, electromagnetic actuators, and microrelays, sensors such as instruments and vibration sensors.
Although the miniaturization of the coil is progressing along with the progress of the micromachine technology, in the conventional technology, a coil is wound around a bobbin, and when this method is used, a small diameter of about 2 mm or less is used. Winding is difficult, and the only way to cope with this is to reduce the winding diameter to 0.1 mm or less, which leads to an increase in electrical resistance. As a result, Q value (Q = Lω / R where L is the inductance of the coil, and R is The electrical resistance of the coil, ω, means the frequency. On the production side, there is a problem of quality variation, and the current situation is that productivity is limited.

  In addition, a vibration sensor, which is one of the applications, is used for continuous monitoring of rotating equipment and is continuously used for vibration displacement at a plurality of locations on a rotating shaft. In such a use environment, the variation range of the environmental temperature is large, and constant electric resistance characteristics as a sensor are required. Therefore, constant electric resistance manganin, silver palladium, or the like is used for the coil material. Since such a material is a special alloy, it is difficult to process it into a coil, and it may be difficult to manufacture by the method using a wound coil as described above.

Therefore, in order to solve such a problem, a method for forming a small coil or a microcoil as a planar coil has already been developed. For example, Patent Document 1 discloses a microcoil manufacturing method in which wiring is formed on a substrate by electrolytic plating as a “microcoil manufacturing method”.
In this manufacturing method, an epoxy containing a photoreactive curing agent is formed on a metal layer on which a catalytic metal layer for forming an electrode for electrolytic plating is formed only on a portion where wiring is to be formed. After applying the resin, unnecessary portions are removed, an electrode for electrolytic plating is formed by electroless plating as a mold for forming the wiring, and wiring is further formed by electrolytic plating.
According to such a microcoil manufacturing method, the aspect ratio expressed as a ratio of the height and width of the winding can be set large by forming the mold higher, and a large magnetic flux density is realized even in a small size. Possible microcoils can be provided.

An invention using such a microcoil as a vibration sensor is also disclosed in, for example, Patent Document 2 as “vibration sensor and method of manufacturing vibration sensor”.
According to the invention disclosed in Patent Document 2, in order to detect the vibration of the measurement object, the substrate is elastically supported so as to be freely displaced at least in the thickness direction in accordance with the vibration of the measurement object. And a detection coil spirally patterned on the surface of the substrate, and a first magnetic field generating means for applying a first magnetic field to the detection coil, and an induced electromotive force generated in the detection coil Is configured to detect the vibration of the object to be measured.

Furthermore, Patent Document 3 discloses an invention relating to a vibration sensor as “a vibration sensor and a ground vibration analysis system including the vibration sensor”.
In addition to the principle of the vibration sensor disclosed in Patent Documents 2 and 3, as a principle of the vibration sensor using a coil, an eddy current is generated in a metal object to be measured, and the coil is generated by a magnetic field generated by the eddy current. The distance between the coil and the object to be measured is measured by measuring the impedance change of the coil due to the influence of the current flowing through the coil.
Japanese Patent Laid-Open No. 2003-197452 JP 2003-66063 A JP 2001-66179 A

However, in the invention disclosed in Patent Document 1, although the aspect ratio is certainly high, the number of turns cannot be increased. Therefore, there is a limit to increasing the magnetic flux density by increasing the inductance.
Also, in Patent Documents 2 and 3, although it is possible to improve the accuracy by securing a sufficient coil length as a coil spirally patterned on the vibration sensor, it is possible to improve the accuracy while reducing the size further. There was a limit to realization.

  The present invention has been made in response to such a conventional situation, and as a result of intensive research conducted by the inventor of the present application, a plurality of spiral coils formed on the same plane are replaced with other adjacent spiral coils. If it is possible to increase the number of turns and the coil length to increase the coil inductance and increase the coil inductance while increasing the coil cross-sectional area by connecting them in series while stacking them in the reverse direction One object is to provide a laminated coil capable of dramatically improving coil characteristics by reducing the electrical resistance of the coil because it is a spiral coil, and a vibration sensor using the laminated coil, It is another object of the present invention to provide a method of manufacturing a laminated coil that can provide a laminated coil having such characteristics, shorten production time, and provide a homogeneous product. The target.

To achieve the above object, the laminated coil according to the first aspect of the present invention is a laminated coil formed by laminating a plurality of helical coils formed on the same plane, and the helical coils are adjacent to each other. The spiral coils are formed in the reverse direction, and the spiral coils are connected in series by alternately connecting the central ends of the spiral coils and the peripheral ends of the spiral coils. It is characterized by this.
In the laminated coil configured as described above, since a plurality of spiral coils formed on the same plane are laminated, the coil is densely formed while eliminating a useless space.
In addition, the spiral coil is formed in the opposite direction to the other adjacent spiral coils to connect the central ends of the spiral coil and the peripheral ends, so that a spiral is formed from the peripheral end to the central end. The other adjacent spiral coils have an effect that a spiral is formed from the central end portion to the peripheral end portion in the same direction as the previous spiral coil. Therefore, the entire laminated coil has an effect that a spiral is formed in the same direction.
Furthermore, since the coils constituting each of the stacked coils are spiral coils formed on the same plane, the cross-sectional shape of the coil can be easily selected, and the direction of the plane forming the spiral or in particular, The plane has the effect that the coil cross-sectional area can be increased because the length in the vertical direction can be increased.

The laminated coil according to claim 2 is a laminated coil in which the laminated coil according to claim 1 is laminated from the first layer to the n-th layer, and the spiral coil is a coil body. And a first electrode formed at the peripheral end of the coil body and a second electrode, and the connection between the peripheral ends of the spiral coil connects the first electrodes. And connecting the second electrodes from the first layer to the n-th layer, respectively, and among the first electrodes formed at the central end or the peripheral end of the spiral coil of the n-th layer, The one not connected to the (n−1) th layer is connected to the second electrode of the nth layer.
In the laminated coil configured as described above, in addition to the operation of the invention described in claim 1, the coil laminated from the first layer to the n-th layer includes an n-layer spiral coil and a coil separately from the n-layer spiral coil. By providing the second electrode connected from the first layer to the n-th layer, the second electrode in the first layer and the first electrode formed at the peripheral edge of the spiral coil or the center of the spiral coil It has the effect | action of functioning as a terminal for connecting either one of edge parts to AC power supply.
Although the second electrodes from the first layer to the n-th layer are connected, they are not connected to the coil body of the spiral coil, so that no circuit is formed as a whole. Therefore, the second electrode and the spiral coil are connected. Since the spiral coil alternately repeats the connection between the central ends and the connection between the first electrodes at the peripheral ends, the (n−1) th layer. There are two possible states for the connection between the n-th layer and the n-th layer. That is, what is to be connected to the second electrode of the nth layer is either the first electrode or the central end of the spiral coil, which is not connected to the (n-1) th layer. It is understood that there is one.
Conversely, the electrode taken out from the first layer as a terminal to be connected to the AC power supply is either the second electrode and the first electrode or the central end of the spiral coil.

The laminated coil according to claim 3 is a laminated coil in which the laminated coil according to claim 1 is laminated from the first layer to the n-th layer, and the helical coil is a coil body. And a first electrode formed at the peripheral end of the coil body and a second electrode, and the connection between the peripheral ends of the spiral coil connects the first electrodes. And connecting the second electrodes from the first layer to the (n-1) th layer, respectively, and at the center end of the spiral coil of the (n-1) th layer and the spiral shape of the nth layer The center end of the coil is connected, and the first electrode of the nth layer is connected to the second electrode of the (n-1) th layer.
In the laminated coil configured as described above, in addition to the operation of the invention described in claim 1, the coil laminated from the first layer to the n-th layer includes an n-layer spiral coil and a coil separately from the n-layer spiral coil. By providing the second electrode connected from the first layer to the (n-1) th layer, the second electrode in the first layer and the first electrode or spiral formed at the peripheral edge of the spiral coil It has the effect | action of functioning as a terminal for connecting either of the center edge parts of a coil-like coil to AC power supply.
In the invention according to claim 3, when the nth layer is stacked on the (n−1) th layer, the second electrode of the (n−1) th layer and the nth layer are not changed. The first electrode is connected. That is, in order to obtain such a stacked layer, unlike the invention according to claim 2, the restriction that the connection between the (n-1) th layer and the nth layer needs to be the connection between the central ends. However, without using the second electrode of the nth layer, the first electrode continuous to the coil body of the nth layer is connected as it is to the second electrode of the (n−1) th layer. The first electrode of the nth layer acts as if it were the second electrode of the nth layer while continuing to the coil body.

A laminated coil according to a fourth aspect of the present invention is the laminated coil according to any one of the first to third aspects, wherein an insulating material is disposed between the helical coil and the adjacent helical coil. It is to be established.
The operation is basically the same as that of the first to third aspects of the invention, but in addition, it is laminated when the spiral coil is a conductor or when the insulation of the spiral coil is weak. It has the effect of ensuring reliable insulation between the helical coils.

A laminated coil according to a fifth aspect of the present invention is the laminated coil according to any one of the first to fourth aspects, wherein the laminated coil is coated with an insulating resin.
In the laminated coil configured as described above, in addition to the operation of the invention according to claims 1 to 4, the entire laminated coil is covered with an insulating resin, thereby improving the insulation characteristics of the laminated coil as a whole. It has the action. Further, the coil itself is hardly damaged when the laminated coil is handled, and the durability is improved.

According to a sixth aspect of the present invention, there is provided a vibration sensor comprising a case in which the laminated coil according to the second aspect is stored at one end close to the vibration measurement object, and a spiral of the first layer of the laminated coil. One of the first electrode of the coil or the central end of the spiral coil that is not connected to the spiral coil of the second layer and the lead wire extending from the second electrode, and the lead wire A detector capable of measuring the impedance of the laminated coil is provided.
In the vibration sensor configured as described above, since the spiral coils are densely laminated, the magnetic flux density of the magnetic field generated by the current of the laminated coil is increased. In addition, the eddy current generated in the object to be measured by the magnetic field is increased, and the magnetic flux density of the generated magnetic field is increased. Further, the detector capable of measuring the impedance has an effect of measuring the impedance of the laminated coil that varies due to the influence of the current in the spiral coil generated by this magnetic field.

A vibration sensor according to a seventh aspect of the present invention is the vibration sensor according to the sixth aspect, comprising a power source capable of supplying an alternating current connected to the lead wire.
In addition to the operation of the invention according to the sixth aspect, the vibration sensor configured as described above has an operation that it is not necessary to separately connect a power source by providing the power source.

The method for manufacturing a laminated coil according to claim 8 is a method of manufacturing a laminated coil by laminating a plurality of helical coils formed on the same plane, wherein one helical coil and this spiral coil are manufactured. The other spiral coils formed in the reverse direction to the spiral coil are arranged adjacent to each other, and the adjacent spiral coils are connected to each other between the central ends of the spiral coils and around the spiral coil. It is the manufacturing method of the laminated coil characterized by connecting in series by performing the connection of edge parts alternately.
In the method of manufacturing a laminated coil configured as described above, since a plurality of spiral coils formed on the same plane are laminated, there is an effect of forming a dense coil by eliminating a useless space.
In addition, in the other adjacent spiral coils, a spiral is formed from the central end to the peripheral end in the same direction as the previous spiral coil, and thus a continuous spiral coil is formed. Has the effect of

The method for manufacturing a laminated coil according to claim 9 is the method for manufacturing a laminated coil according to claim 8, wherein the spiral coil is formed at a coil body and a peripheral end portion of the coil body. The first electrode and the second electrode are formed on a substrate frame via a runner, and the connection between the peripheral ends of the spiral coil connects the first electrodes. Yes, each of the second electrodes from the first layer to the n-th layer is connected to each other, and is connected to the (n-1) -th layer of the central end portion or the peripheral end portion of the spiral coil of the n-th layer. The substrate frame and the runner are cut and removed after connecting the second electrode of the nth layer and the second electrode of the nth layer and laminating from the first layer to the nth layer.
In the method of manufacturing a laminated coil configured as described above, in addition to the operation of the invention according to claim 8, the coil laminated from the first layer to the n-th layer includes an n-layer helical coil, Comprises a second electrode connected separately from the first layer to the n-th layer, so that the second electrode in the first layer and the first electrode or spiral formed at the peripheral end of the spiral coil It has the effect | action of manufacturing the laminated coil which functions either of the center edge parts of a coil-like coil as a terminal for AC power supply connection.

A method for manufacturing a laminated coil according to a tenth aspect of the present invention is the method for manufacturing a laminated coil according to the eighth aspect, wherein the spiral coil is formed at a coil body and a peripheral end of the coil body. The first electrode and the second electrode are formed on a substrate frame via a runner, and the connection between the peripheral ends of the spiral coil connects the first electrodes. Yes, the second electrodes from the first layer to the (n−1) th layer are connected to each other, and the central end portion of the spiral coil of the (n−1) th layer and the spiral coil of the nth layer The substrate frame is connected after connecting the center end, connecting the first electrode of the nth layer to the second electrode of the (n-1) th layer, and laminating from the first layer to the nth layer. And the runner is cut and removed.
In the manufacturing method of the laminated coil configured as described above, the same effect as that of the invention according to claim 9 is obtained, and the continuous coil body is provided without using the second electrode of the nth layer. The first electrode is used as it is and is directly connected to the second electrode of the (n−1) th layer.

The method for manufacturing a laminated coil according to claim 11 is the method for manufacturing a laminated coil according to any one of claims 8 to 10, wherein the spiral coil is adjacent to the adjacent spiral coil. An insulating material is disposed on and laminated.
In the method of manufacturing a laminated coil configured as described above, when the helical coil is a conductor or when the insulating coating of the helical coil is weak, the insulation between the laminated helical coils is firmly ensured. It has the action.

  In the laminated coil according to the first to third aspects of the present invention, while the space efficiency of the laminated coil is increased, the laminated helical coils are connected while being formed in the reverse direction to the adjacent helical coils. Therefore, a long coil is formed in series, and the inductance can be increased. Further, since the coil cross-sectional area can be increased, the electrical resistance value of the coil can be kept low. Therefore, the so-called Q value can be increased, and the coil characteristics can be greatly improved.

  In the laminated coil according to the fourth aspect, in addition to the effects of the inventions according to the first to third aspects, the insulating characteristics can be improved, and the durability of the laminated coil can be improved.

  In the laminated coil according to claim 5, similarly to the invention according to claim 4, by covering the entire laminated coil with an insulating resin, the insulation characteristics of the entire laminated coil can be improved. The durability of the entire coil can be improved.

  In the vibration sensor according to claim 6 and claim 7, since it is possible to increase the induced current generated in the laminated coil, the measurement accuracy of the impedance of the laminated coil can be improved. It is possible to provide a vibration sensor that can measure the distance to the measurement object with high accuracy.

  11. The method for manufacturing a laminated coil according to claim 8, wherein the laminated coil is connected while being formed in a reverse direction to an adjacent helical coil while improving space efficiency. Therefore, it is possible to manufacture a laminated coil in which a long coil is formed in series and inductance can be increased. Moreover, it is possible to make a coil cross-sectional area large, and it is possible to manufacture a laminated coil capable of keeping the electrical resistance value of the coil low. Therefore, a so-called Q value can be increased, and a laminated coil with greatly improved coil characteristics can be manufactured.

  In the laminated coil manufacturing method according to claim 11, in addition to the effects of the inventions according to claims 8 to 10, when the helical coil is a conductor or when the insulating coating of the helical coil is weak. Can produce a laminated coil that can firmly and reliably insulate the laminated spiral coils.

The laminated coil according to the first embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is a conceptual diagram showing a single-coil substrate for manufacturing a spiral coil constituting the laminated coil according to the present embodiment. The helical coil is formed from the substrate frame 2 of the single-coil substrate 1 via the runner portion 6, the coil body 3, the first electrode 4 provided on the peripheral end 7 b, and the coil body 3. Or the 1st electrode 4 is provided with the 2nd electrode 5 provided separately and independently, without contacting on the board | substrate 1 for single coils.
The coil body 3 is formed in a spiral shape on the same plane as the single coil substrate 1 from the first electrode 4 to the central end 7a provided on the peripheral end 7b. In the drawing, the lead line at the central end 7a is drawn with black and white reversed for clarity.
The thickness of the coil body 3 can be formed to be thinner or thicker than this, and the gap between the coil bodies 3 can be set wide and narrow, and is limited to that shown in FIG. It is not a thing. As the material of the coil body 3, for example, copper, an alloy such as copper, a manganese alloy manganin, and silver palladium is used.

FIG. 2 shows a substrate configured to obtain a large number of substrates related to the single helical coil shown in FIG. In FIG. 2, a large number of coil pattern substrates 10 are substrates on which 17 single-coil substrates 1 shown in FIG. 1 can be manufactured simultaneously.
The four positioning holes 11 shown in white in the multiple coil pattern substrates 10 are used for alignment so that the substrate does not shift between the lower layer and the upper layer when the multiple coil pattern substrates 10 are stacked as they are. Is.
A multilayer coil is manufactured by stacking another multiple coil pattern substrate 10 on the multiple coil pattern substrate 10.

Next, a lamination method of the laminated coil according to the present embodiment will be described with reference to FIGS. FIG. 3 is a conceptual diagram showing a laminated state of the laminated coil according to the present embodiment.
In FIG. 3, a laminated coil 29 is one in which two types of coil bodies indicated by reference numerals 3a and 3b are alternately laminated as shown in the figure. The coil main body 3a is a spiral coil that rotates in the reverse direction to the coil main body 3b, but this can be easily configured by making the same coil face down. In addition, in the case of the coil pattern substrate for multi-cavity shown in FIG. 2, it can be easily configured by alternately laminating the front and back of the multiple coil pattern substrate 10 as a whole.
When the plan view of FIG. 3 is described from the right side, the first coil body 3 a (right side) is first connected to the coil body 3 b (left side) via the second insulating sheet 17. The second insulating sheet 17 will be described in detail later, but it is a sheet that insulates the coil bodies 3a and 3b, but the first electrode 4 and the coil provided on the peripheral end 7b of the coil body 3a. In order to connect the first electrodes 4 provided at the peripheral end 7b of the main body 3b, a first electrode hole 18 is formed, and a cream solder 24 is embedded in the hole so that the first electrodes 4 are connected to each other. Continuity is planned.
The coil main body 3a is configured to go clockwise from the central end 7a toward the peripheral end 7b in a plan view of FIG. 3, but the coil main body 3b is configured to rotate in the opposite direction to the coil main body 3a. The coil body 3b is configured to go clockwise from the peripheral end 7b toward the central end 7a. In this way, two adjacent spiral coils are spirally formed in the same direction (clockwise in FIG. 1) while being connected in series.

Furthermore, the second electrodes 5 of the coil bodies 3 a and 3 b, which are expressed as lines in which another second electrode hole 16 b is formed, are connected to the second insulating sheet 17 by cream solder 24.
Further, as shown on the left side in FIG. 3, the connection from the coil body 3b (right side) to the coil body 3a (left side) is the connection from the coil body 3a (right side) to the coil body 3b (left side) described above. And a little different. In the coil body 3b, the coil body 3a disposed on the right side of the coil body 3b is connected to the peripheral end 7b of the coil body 3b. It is necessary to be connected by the part 7a.
Therefore, the central end 7a of the coil main body 3b arranged on the left side and the central end 7a of the coil main body 3b are connected via the first insulating sheet 14. At that time, the first insulating sheet 14 is provided with a coil central hole 15 for connecting the central ends 7a of the coils, and a cream solder 24 is buried in the hole to achieve conduction. . Further, similarly to the second insulating sheet 17, a second electrode hole 16 a for connecting the second electrodes 5 is formed, and conduction is achieved by embedding cream solder 24 in the hole.

As described above, two adjacent coil bodies 3a and 3b formed in opposite directions are alternately connected to each other through the first insulating sheets 14 and the second insulating sheets 17 alternately, and the spiral coils are laminated. The coils 29 are stacked.
A first terminal 8 for connecting an AC power source is provided in the right direction from the second electrode 5 of the spiral coil at the right end in FIG. 3, and AC is also applied in the right direction from the central end 7a of the coil body 3a. A second terminal 9 for power connection is provided. Further, lead wires 12 and 13 are extended from the respective terminals 8 and 9 for connection to an AC power source. Further, by covering the entire laminated spiral coil with the insulating resin 25, the entire insulating property is enhanced, and at the same time, the strength is enhanced to ensure the durability. An example of the insulating resin 25 is an epoxy resin.

FIG. 4 shows the connection state as shown in FIG. 3 more specifically. FIG. 4 is a conceptual diagram specifically showing a state in which spiral coils are laminated. A state in which the coil main body 3a, the first insulating sheet 14, the coil main body 3b, and the second insulating sheet 17 are sequentially stacked from above is shown. 4, the same elements as those in FIG. 3 are denoted by the same reference numerals, and description of the configuration is omitted. The first insulating sheet 14 and the second insulating sheet 17 are formed wider than the respective spiral coils, and the first electrode 4, the coil bodies 3 a and 3 b, and the second electrodes 5 are adjacent to each other from the adjacent spiral coils. It is configured to be insulated. These insulating sheets are unnecessary when the coil bodies 3a and 3b and the electrodes 4 and 5 are each formed of an insulating material, but considering the connection between the electrodes and the central ends of the coil bodies, Insulation coating must not be applied at least at the connection portion, and it is considered that it is difficult to ensure the reliability of the product.
In addition, as this 1st insulating sheet 14 and the 2nd insulating sheet 17, there exists the method of using a dry film resist, for example.

FIGS. 5A and 5B show mask patterns for manufacturing an insulating sheet that can take a large number of the first insulating sheet 14 and the second insulating sheet 17, respectively. In correspondence with the multiple coil pattern substrates 10 shown in FIG. 2, 17 first insulating sheets 14 and second insulating sheets 17 can be manufactured.
In FIG. 5A, the mask pattern 20 for the first insulating sheet is provided with positioning holes 21 at the four corners in the same manner as the many coil pattern substrates 10, and the plurality of coil pattern substrates 10 and the first insulating sheet use. It is possible to stack a plurality of insulating sheets manufactured by the mask pattern 20 together. In FIG. 3, the first insulating sheet 14 is shown as a straight line, but the cream solder 24 is inserted into both the coil center hole 15 and the second electrode hole 16a by being inserted into the coil body 3a and the coil body 3b. By filling in, the central ends 7a of the spiral coils and the second electrodes 5 are connected.
FIG. 5B shows the second insulating sheet mask pattern 22. As shown in FIGS. 3 and 4, the second insulating sheet 17 is also provided with a first electrode hole 18 and a second electrode hole 16b. By embedding cream solder 24 in these holes, the coil body 3a and The second electrodes 5 of the coil body 3b and the first electrodes 4 provided at the peripheral end 7b of the coil body are connected. Positioning holes 23 are also formed in the second insulating sheet mask pattern 22.

FIG. 6 is a cross-sectional view taken along line AA indicated by the reference numeral in FIG. However, in FIG. 4, the coil bodies 3 a and 3 b, the first insulating sheet 14, and the second insulating sheet 17 are illustrated apart from each other in order to clearly show the correspondence of each component, but in FIG. 6, they are laminated. It is shown in a state. In FIG. 6, the same components as those shown in FIG. 4 are denoted by the same reference numerals, and description of the configuration is omitted.
In FIG. 6, the second insulating sheet 17 is provided in the lowermost layer, a spiral coil is laminated on the upper surface side thereof, and the cream solder 24 embedded in the first electrode hole 18 of the second insulating sheet 17. The 1st electrode 4 provided in the peripheral edge part 7b of the coil main body 3b is connected. Further, the central end portion 7a of the coil body 3b is formed of a spiral coil laminated on the upper layer thereof by cream solder 24 embedded in the coil central portion hole 15 of the first insulating sheet 14 laminated on the upper layer. It is connected to the central end 7a.
The second electrode 5 is always connected by cream solder 24 embedded in the second electrode holes 16b and 16a formed in the second insulating sheet 17 and the first insulating sheet 14, respectively.
As can be understood from FIG. 4, the second electrode 5 of the spiral coil is not connected to the coil bodies 3 a and 3 b, and the second electrode holes of the first insulating sheet 14 and the second insulating sheet 17 are independently provided. They are connected via 16a and 16b.

FIG. 7 schematically shows a state in which spiral coils are further laminated from the cross-sectional view shown in FIG. (In particular, it corresponds to claim 2, claim 4, claim 9, and claim 11)
In FIG. 7, the same elements as those shown in FIG. 6 are denoted by the same reference numerals, and the description of the configuration is omitted.
In FIG. 7, not only the state of the laminated coil but also the alignment table 28 relating to the lamination method and the printed circuit board 27 for terminals are shown in the lowermost layer.
The terminal printed circuit board 27 is provided with the first terminal 8 and the second terminal 9 described with reference to FIG. In FIGS. 3 to 6, the description of the jig for laminating is omitted, but the substrate and the insulating sheet for multi-cavity shown in FIGS. 2 and 5 are as shown in FIG. It is stacked on the alignment table 28. In the present embodiment, the alignment shaft of the alignment table 28 is not shown, but the alignment table 28 has four alignment shafts standing upright, and the multiple coil patterns shown in FIG. Through the positioning holes formed in the multi-piece insulating sheet manufactured using the positioning holes 11 of the substrate 10 and the first insulating sheet mask pattern 20 and the second insulating sheet mask pattern 22 shown in FIG. By doing so, positioning can be performed easily. A large number of insulating sheets manufactured using the positioning holes 11, the first insulating sheet mask pattern 20 and the second insulating sheet mask pattern 22 of the large number of coil pattern substrates 10 at the number and positions of the alignment shafts. Although the number and position of the positioning holes formed in the first and second holes coincide with each other, the number and position, or the hole and the shaft cross-sectional shape are not particularly limited.
As shown in FIG. 7, the spiral coils are alternately laminated in the reverse direction via the first insulating sheet 14 and the second insulating sheet 17, but are connected by a conductive wire 26 at the upper end portion thereof. The unit is connected to the first terminal 8 and the second terminal 9 provided on the terminal printed circuit board 27. Note that the stack shown in FIG. 7 is in a state where the connection is the same as that shown in FIG.

Specifically, as described above, the terminal printed circuit board 27 is provided with the first terminal 8 and the second terminal 9, but the first insulating sheet 14 is placed immediately above the first terminal 8; The first terminal 8 is connected to the second electrode 5 via cream solder 24 embedded in the second electrode hole 16a of the first insulating sheet 14, and the second terminal 9 is similarly connected to the first insulating sheet. 14 is connected to the central end portion 7a of the coil body 3a via cream solder 24 embedded in the coil central portion hole 15. Here, although the 1st terminal 8 is always connected to the 2nd electrode 5, the 2nd terminal 9 is not always connected to the center end part 7a of the coil main body 3a. When the coil body 3a in the lowermost layer in FIG. 7 and the rightmost layer in FIG. 3 becomes the coil body 3b, the second terminal 9 is not taken out from the central end portion 7a of the coil body 3b, but the peripheral end portion. If it is not taken out from 7b, the existence significance of the coil body 3b will be lost. This is because the coil body 3a adjacent to the coil body 3b is connected at the center end 7a of the coil body 3a, and if taken out from the center end 7a of the coil body 3b, the coil body 3b does not function at all. It is.
Therefore, the terminal taken out from the lowermost spiral coil in FIG. 7 or the rightmost spiral coil in FIG. 3 is determined by the state of connection with the adjacent spiral coil.

The same thing occurs in the uppermost spiral coil in FIG. 7 or the leftmost spiral coil in FIG. In the spiral coil of the uppermost layer or the leftmost layer, it is necessary to connect the second electrode 5 and the coil body so that the entire laminated coil is a closed circuit, but the connection is made between the second electrode 5 and the center of the coil body. Either the first electrode 4 provided at the end 7a or the peripheral end 7b is connected. 7 and 3, the coil body 3a provided in the uppermost layer and the leftmost layer is connected to the coil body 3b of the spiral coil immediately adjacent to the coil body 3b at the central end 7a. In order for the spiral coil existing in the left layer to function, it is necessary to take out from the peripheral end 7b, that is, from the first electrode 4. Therefore, the second electrode 5 and the first electrode 4 are connected by the conductive wire 26. Although it is desirable that the conductive wire 26 has an insulating coating, when the entire laminated coil is coated with an insulating resin as described above, the conductive wire 26 itself need not be provided with an insulating coating. FIG. 7 does not show the entire laminated coil 29a so as to simplify the description.
When all the layers are laminated, the whole alignment table 28 is introduced into a firing furnace and fired, and then removed from the alignment table 28 to complete the laminated coil 29a.
In FIG. 7, five spiral coils are laminated, but the number is not limited to this number, and the number of laminations can be set based on the accuracy and performance required for the laminated coil 29a. is there. 7 and FIG. 6 or FIG. 8 to be described next is a schematic diagram, and although the number of windings and the winding method of the coil main body 3a and the coil main body 3b are the same in the cross section shown, Needless to say, they do not necessarily match.

Next, FIG. 8 schematically shows a state in which spiral coils are further laminated from the cross-sectional view shown in FIG. 6, and an embodiment different from that shown in FIG. 7 is shown. (In particular, it corresponds to claim 3, claim 4, claim 10, and claim 11)
FIG. 8 shows one less than the number of stacked layers in FIG. 7, and the position of the first terminal 8 on the terminal printed board 27 is the same position as the first terminal 8 in FIG. 9 is connected to the 1st electrode 4 provided in the peripheral edge part 7b of the coil main body 3b. The reason why such a connection may occur is as already described with reference to FIG. A photograph of the terminal printed board 27 shown in FIG. 13 described later is the same as the photograph of the terminal printed board 27 shown in FIG. As apparent from FIG. 13B, the second terminal 9 is provided on the first electrode 4, and the first terminal 8 is disposed on the second electrode 5.
In addition, the second insulating sheet 17 is placed on the upper layer of the terminal printed board 27 shown in the figure, and the first terminal 8 and the second electrode 5 of the coil body 3b are the second insulating sheet. 17 is connected via cream solder 24 embedded in the second electrode hole 16b, and the second electrode 9 and the first electrode 4 provided at the peripheral end 7b of the coil body 3b are the second The insulating sheet 17 is connected via cream solder 24 embedded in the first electrode hole 18.
Furthermore, although it is desirable to provide the first insulating sheet 14 on the terminal printed circuit board 27 described with reference to FIG. 7 and the second insulating sheet 17 on the terminal printed circuit board 27 described with reference to FIG. If the insulation can be sufficiently obtained and the first terminal 8 and the second electrode 5 and the second terminal 9 and the first electrode 4 can be electrically connected, they may be omitted.

Further explanation will be given with reference to FIG.
In FIG. 7, it has been described that the upper end portions of the laminated spiral coils are connected by the conductive wire 26, but the conductive wire 26 is not provided in the embodiment shown in FIG. 8. Instead of the conducting wire 26, it is connected to the lower second electrode 5 via the first electrode 4 provided at the peripheral end 7b of the coil body 3a.
The connection between the uppermost final layer (nth layer) and its lower layer ((n-1) layer) will be described in detail. First, these two layers are the final layer shown in FIG. Similarly, the central end portions 7a are connected to each other through cream solder 24 embedded in the coil central portion hole 15.

Next, the second electrode 5 connected from the lowermost layer (first layer) via the first insulating sheet 14 and the second insulating sheet 17 is not used for connection in the nth layer. Although the direction of rotation of the coil body 3a of the n-th layer is opposite to that of the coil body 3b of the (n-1) -th layer as in FIG. 7, the first electrode 4 is rotated by rotating the position 180 degrees. The second electrode 5 is disposed at a position opposite to the (n-1) th layer, and the first electrode 4 existing at the original position of the second electrode 5 is embedded in the second electrode hole 16a. It is connected to the second electrode 5 of the (n−1) -th layer through the cream solder 24. By connecting in this way, it is possible to form a closed circuit using the structure of the final layer as it is without providing the conductive wire 26 as shown in FIG. At the same time, it contributes to the improvement of the reliability of the laminated coil. The second electrode 5 of the nth layer (final layer) may be left as a dummy or may be removed.
As shown in FIG. 8, the laminated coil 29 shown in FIG. 17B connects the first electrode 4 in the final layer and the second electrode 5 in the lower layer, and is provided with a conducting wire 26. Absent.

Next, a method for manufacturing a laminated coil according to the second embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a flowchart showing the steps of the method for manufacturing a laminated coil according to the present embodiment.
In FIG. 9, step S <b> 1 shows a process of manufacturing a large number of coil pattern substrates. As this manufacturing method, as a conventional method, for example, a large number of coil pattern substrate mask patterns 30 shown in FIG. 10 are prepared, and based on this, a large number of such as shown in FIG. Generally, the coil pattern substrate 10 is manufactured.

The multiple coil pattern substrate mask pattern 30 as shown in FIG. 10 can be easily designed using CAD software or the like. This mask is made by patterning a chromium thin film on glass and is made so as not to transmit light by a chromium metal thin film.
In the present embodiment, the coil pattern shown in FIG. 10 is a 0.4 mm line width coil mask, which is thinner than this, for example, by creating a coil mask having a line width of about 0.3 mm to 0.07 mm. The inventor has confirmed that a helical coil substrate can be manufactured.

  Next, step S2 is a process for manufacturing a large number of insulating sheets. As described above, since there are two types of insulating sheets, the type of the first insulating sheet 14 and the type of the second insulating sheet 17, it is necessary to manufacture two types. These two types of insulating sheets are also manufactured using a mask pattern in the same manner as the multiple coil pattern substrates. First, a mask pattern is designed by using CAD software, and then formed by patterning a chromium thin film on glass as described above. Then, the first insulating sheet 14 and the second insulating sheet 17 as shown in FIGS. 12A and 12B are manufactured by performing an etching process on the dry film resist using the mask pattern. be able to.

Next, as step S3, there is a manufacturing process of a printed circuit board for terminals. The terminal printed board 27 is shown in FIGS. 13A and 13B. FIG. 13A shows the surface of the terminal printed circuit board 27, that is, the portion visible from the outside, and FIG. 13B shows the back surface, that is, the portion on the first layer side of the spiral coil. is there.
The printed circuit board 27 for terminals is made by etching a copper thin film of a printed circuit board plated with copper on a glass epoxy board or the like as shown in the pattern of FIG. , And 17 terminal printed circuit boards 27 that are separable. Further, although not denoted by reference numerals, positioning holes are formed at four locations, and are configured to match the multiple coil pattern substrates 10 and the multiple insulating sheets 14 and 17.

Further, two holes and a metal plate extending around the holes can be confirmed on the surface of the terminal printed board 27 in FIG. 13A, which are the first terminal 8 and the second terminal 9. The hole is formed to extend the lead wires 12 and 13 therefrom. In addition, it is divided into double lattices, but after the lamination is completed and fired, it is divided into individual laminated coils. In this case, an octagon is formed with the double lattices in this way. In this case, the cutting line is used for dividing along the sides of the octagon using a dicer or the like. Originally, it is desirable to cut and divide into a circular shape that is a coil shape, but it is difficult to cut and divide into a circle, so it is difficult to cut and divide into a circle. It is.
On the back surface of the terminal printed board 27 shown in FIG. 13B, the first terminal 8 and the second terminal 9 are seen in the back state, but are connected to the second electrode 5 and the first electrode 4, respectively. Accordingly, the terminal printed circuit board 27 shown in FIGS. 13A and 13B is different from the terminal printed circuit board 27 shown in FIG. 7 in the position of the second terminal 9 and the connection destination. The reason for this is as described with reference to FIG.
The multiple coil pattern boards, the multiple insulating sheets, and the terminal printed boards manufactured in steps S1 to S3 do not have to be manufactured in that order, and may be manufactured simultaneously or in different orders. It is not a thing.

In step S4, the terminal printed circuit board 27 is first placed on the alignment table, and a large number of insulating sheets are placed thereon. In that case, alignment is obtained by passing a positioning hole through an alignment shaft (not shown) on the alignment table 28.
In step S5, cream solder 24 is injected into the holes formed in the large number of insulating sheets.
Next, in step S6, the first layer of the multiple coil pattern substrates 10 is placed on the multiple insulating sheets. At this time, alignment is performed by passing a positioning hole through an alignment shaft (not shown in the present application) on the alignment table 28. The cream solder 24 injected in step S5 includes the first terminal 8 and the second terminal 9 provided on the terminal printed board 27, the second electrode 5 provided on the first layer of the coil pattern board 10 and the second terminals 9 respectively. The first electrode 4 or the second electrode 5 is connected to the central end 7a. The cream solder 24 not only achieves these conductions, but also has the same effect as a multi-layer insulating sheet, but also has an adhesive effect in lamination. When the laminated coils are separated into individual laminated coils by dividing the laminated coils in step S12, which will be described later, an adhesive effect for preventing the laminated coils from being separated between layers is also exhibited.

  In step S <b> 7, a large number of insulating sheets are placed on the large number of coil pattern substrates 10 in the first layer. FIG. 14 shows a state where the insulating sheet is placed in this way. The multiple insulating sheet shown in the figure is the second insulating sheet 17. As shown in FIG. 4, the second insulating sheet 17 has first electrode holes 18 for connecting the first electrodes 4 and second electrode holes 16 b for connecting the second electrodes 5. It is installed. In FIG. 14, the alignment table is not shown.

In step S8, cream solder 24 is injected into the holes formed in the multiple insulating sheets placed as shown in FIG. FIG. 15 shows the injected state. What is reflected in white is cream solder 24. The cream solder 24 is in a liquid state at the time of pouring, and after laminating a large number of insulating sheets and a large number of coil pattern substrates, it is solidified to become a conductive alloy when fired.
By injecting the cream solder 24, the first layer multiple coil pattern substrates 10 existing below the cream solder 24 and the second layer multiple coil pattern substrates 10 placed on the multiple insulating sheets are provided. The first electrode 4 and the second electrode 5 can be connected to each other.

  In step S9, as described above, the second-layer multiple coil pattern substrates 10 are placed on the multiple insulating sheets. Thereafter, the steps S7 to S9 are repeated to the required number of layers, and a large number of coil pattern substrates 10 and a large number of insulating sheets are laminated. In step S7 of FIG. 9, “on the first layer” and “second layer” in step S9 indicate that the ordinal number of each layer is incremented in each repetition up to the nth layer ( Needless to say, increase).

  After stacking up to the last n-th layer, as step S10, the second electrode 5 of the spiral coil and the first electrode 4 or the central end 7a of the coil body are connected, and the entire stacked coil up to the n-th layer To form a closed circuit.

Up to the above step S10 is the manufacturing method in the embodiment described above with reference to FIG. In the case of the different embodiment shown in FIG. 8, in step S9 for the n-th layer, the n-th layer of the multiple coil pattern substrates is placed on the multiple insulating sheet. Although it is placed opposite to the periphery of the n-1) multiple coil pattern substrate, the n-th layer first electrode 4 is connected to the (n-1) -th layer second electrode 5. Put. In this step (process), it is possible to form a closed circuit while the (n-1) th layer and the nth layer are connected via the cream solder 24 of the insulating sheet, so step S10 is omitted. Can do. This is because the conductive wire 26 shown in FIG. 7 uses the coil body 3a having the first electrode 4 at the peripheral end in the embodiment shown in FIG. It is because the function which the conducting wire 26 for can have can be combined.
Since steps S11 and S12 after step S10 is omitted are the same, they will be described below.

  After the laminated coil is formed by the above process, the laminated coil is baked in step S11. By baking, the cream solder 24 is solidified and the connection between the multiple coil pattern substrates is completed.

  The laminated coil that has been fired is divided into pieces in step S12. As shown in the multiple coil pattern substrate 10 of this time, since the 17 pieces of laminated coils were manufactured at the same time, the divided pieces are divided into respective laminated coils.

  FIG. 16 shows a photograph showing a state where a plurality of pieces are divided into pieces using a dicer. As described above, it is cut along the cutting line formed on the front side of the printed circuit board 27 for terminals. By cutting along the cutting line using a dicer, the substrate frame 2 of the multiple coil pattern substrate 10 and the runner portion 6 extending from the substrate frame 2 and holding the helical coil are cut and removed. Is.

Thus, the laminated coil divided | segmented into the piece forms the octagon as shown in FIG. FIG. 17A shows the surface of the laminated coil 29 divided into pieces, and FIG. 17B shows the back side. A scale is shown in the upper part of the figure, and one scale is 1 mm. It can be understood that the diameter of the laminated coil 29 is about 7.5 mm.
As shown in FIG. 17A, on the front surface (upper surface), two first terminals 8 and second terminals 9 can be confirmed, and as shown in FIG. 17B, on the back surface (lower surface), the nth layer. A spiral coil can be confirmed.

As described above, in the method for manufacturing a laminated coil according to the present embodiment, a large number of substrates and insulating sheets are stacked while being aligned on an alignment table, and a large number of laminated coils can be simultaneously accurately and easily performed. Since it can be manufactured, it is possible to provide a method for manufacturing a laminated coil with high manufacturing efficiency and high yield. Moreover, the laminated coil manufactured in this manner is the same as that described in the first embodiment, and is a spiral coil formed on the same plane. The coil can be formed, and the coil thickness in the lamination direction, that is, the axial direction of the lamination coil can be freely selected. Therefore, the helical coil can be easily determined according to the required specifications. Can do. Therefore, it is possible to increase the cross-sectional area of the coil wire. As a result, the increase in inductance due to the high-density coil and the decrease in electrical resistance due to the increase in cross-sectional area combine to reduce the Q value while being small. A high coil can be provided.
By using a coil having a high Q value, it is possible to increase the eddy current induced by the magnetic field generated in the coil in the vibration sensor described as the third embodiment, and the magnetic field generated thereby is also large. Since it is formed, it is possible to measure the vibration measurement object with higher accuracy.

In this embodiment, a multi-piece substrate and an insulating sheet are used. However, the single-coil substrate 1 as shown in FIG. 1 and the first insulation shown in FIGS. 12 (a) and 12 (b). A laminated coil may be manufactured for each of the sheets 14 and the second insulating sheet 17 which are separated. In that case, in the process shown in FIG. 9, a single unit is used for a large number of parts, a single terminal substrate is used, and after firing the laminated coil in step S11, in step S12, individual pieces are used. Although not divided, a laminated coil is obtained by cutting the substrate frame 2 and the runner portion 6.
According to such a manufacturing method, naturally, the efficiency at the time of manufacturing a large number of pieces is lost, but it is possible to form a coil in nectar, and it is possible to provide a small coil with a high Q value. it can.

Hereinafter, a vibration sensor that employs such a laminated coil having excellent characteristics will be described as a third embodiment of the present invention. The vibration sensor according to the present embodiment will be described with reference to FIGS. FIG. 18 is a conceptual diagram showing a vibration sensor according to the present embodiment.
In FIG. 18, the vibration sensor 31 stores the laminated coil described in the first embodiment in the sensor head 32 provided at the end of the case 33. In the case 33, lead wires are extended from the first terminal 8 and the second terminal 9 provided on the surface side of the laminated coil according to the first embodiment, and the connector 34 and the lead wire of the sensor main body 31a. The AC power supply device 36 is connected to the AC power supply device 31b through a power connector 37b.
The sensor body 31 a includes a sensor head 32 provided at the end of the case 33 and a connector 34 provided at the end opposite to the sensor head 32. Further, an impedance measuring device 35 is connected to the lead wire 31b extending through the connector 34, and the inside of the sensor head 32 is determined from the current value flowing through the lead wire 31b and the voltage value applied in the AC power supply device 36. It is possible to measure the impedance of the laminated coil.

The operation principle of the vibration sensor according to the present embodiment will be described with reference to FIG. In the vibration sensor according to the present embodiment, a high-frequency current is passed through the coil to generate a high-frequency magnetic field, so that an eddy current is generated in a direction perpendicular to the passage of magnetic flux on the surface of the metal object by electromagnetic induction. The impedance of the coil is changed by the flow and the action, and the distance between the coil and the metal object to be measured is measured by the change.
As shown in FIG. 19, when the coil main body 3 is arranged without being brought into contact with the surface of the metal object 39 and an alternating current is passed through the AC power supply device 36, the current flowing through the coil main body 3 Generates a magnetic field 40a. Due to this magnetic field 40a, an eddy current 38 is generated on the surface of the object 39 to be measured, and this eddy current 38 generates a magnetic field 40b opposite to the magnetic field 40a. The current induced by the magnetic field 40b flows through the coil body 3, and the change in impedance can be measured by measuring the change in the phase and amplitude of the current, and the distance H shown in the figure is Measure.
In FIG. 18, the distance between the sensor head 32 and the device under test 39 is calculated by measuring the impedance change from the change in the phase and amplitude of the current measured by the impedance measuring device 35. This calculation is executed inside the impedance measuring device 35.
Since the laminated coil described in the first embodiment is used, it is possible to use a coil having a high Q value, and thus it is possible to provide a small and highly accurate vibration sensor 31.

Finally, with reference to FIG. 20, since the inductance of the actually manufactured multilayer coil was measured, the result will be described. As a laminated coil according to the present embodiment, a single spiral coil wound with 4.5 manganin coils was manufactured by laminating four layers.
As shown in FIG. 20, when the number of coils in which the inductance (L) of the laminated coil manufactured in this way was measured as a parameter, a result well matched with the calculated value was obtained, and the small size and high performance were obtained. It has been shown that a laminated coil exhibiting

  As described above, since the invention described in claims 1 to 11 of the present invention is small and exhibits high performance, it is not only a single coil but also a micro motor such as a mini motor, an electromagnetic actuator, or a micro relay. There are wide applications such as electronics-related devices, instruments, sensors such as vibration sensors. Furthermore, it is particularly suitable for use in micromachine actuators and microrelays in the medical field by taking advantage of its small size.

It is a conceptual diagram which shows the board | substrate for single coils for manufacturing the helical coil which comprises the laminated coil which concerns on this Embodiment. It is a conceptual diagram of the board | substrate comprised in order to take many board | substrates regarding the spiral coil single-piece | unit shown by FIG. It is a conceptual diagram which shows the lamination | stacking state of the laminated coil which concerns on this Embodiment. It is a conceptual diagram which shows concretely the state which laminates | stacks a helical coil in the laminated coil which concerns on this Embodiment. (A) is a conceptual diagram which shows the mask pattern for manufacturing the insulating sheet which can take many 1st insulating sheets of the laminated coil which concerns on this Embodiment, (b) is a mask regarding a 2nd insulating sheet similarly. It is a conceptual diagram of a pattern. It is arrow sectional drawing in the AA line shown by a code | symbol in FIG. It is sectional drawing which shows the lamination | stacking state of the laminated coil which concerns on this Embodiment. It is sectional drawing which shows the lamination | stacking state of the other laminated coil which concerns on this Embodiment. It is a flowchart which shows the process of the manufacturing method of the laminated coil which concerns on this Embodiment. It is a photograph which shows the mask pattern for many coil pattern board | substrates used for the manufacturing method of the laminated coil which concerns on this Embodiment. It is a photograph which shows the many coil pattern used for the manufacturing method of the laminated coil which concerns on this Embodiment. (A) is a photograph which shows a 1st insulating sheet among many insulating sheets used for the manufacturing method of the laminated coil which concerns on this Embodiment, (b) is a photograph which similarly shows a 2nd insulating sheet. (A) is a photograph which shows the surface of the printed circuit board for terminals used for the manufacturing method of the laminated coil which concerns on this Embodiment, (b) is a photograph which similarly shows the back surface. 5 is a photograph showing a state in which a large number of insulating sheets are placed on a first layer of a large number of coil pattern substrates in the method for manufacturing a laminated coil according to the present embodiment. It is a photograph which shows the state which inject | poured the cream solder into the insulating sheet for many pieces shown by FIG. In the manufacturing method of the laminated coil which concerns on this Embodiment, it is a photograph which shows the state which divided | segmented the laminated coil into the piece from many pieces using the dicer. In the method for manufacturing a laminated coil according to the present embodiment, (a) shows the surface of the laminated coil divided into pieces, and (b) is a photograph showing the back side. It is a conceptual diagram which shows the vibration sensor which concerns on this Embodiment. It is a conceptual diagram for demonstrating the principle of operation of the vibration sensor which concerns on this Embodiment. It is a graph which shows the result of having measured the inductance using the prototype of the laminated coil which concerns on this Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate for single coils 2 ... Substrate frame 3, 3a, 3b ... Coil body 4 ... 1st electrode 5 ... 2nd electrode 6 ... Runner part 7a ... Central edge part 7b ... Peripheral edge part 8 ... 1st terminal 9 ... 1st 2 terminals 10 ... many coil pattern substrates 11 ... positioning holes 12 ... lead wires 13 ... lead wires 14 ... first insulating sheet 15 ... coil central portion holes 16a, 16b ... second electrode holes 17 ... second insulating sheet DESCRIPTION OF SYMBOLS 18 ... Hole for 1st electrode 20 ... Mask pattern for 1st insulating sheet 21 ... Positioning hole 22 ... Mask pattern for 2nd insulating sheet 23 ... Positioning hole 24 ... Cream solder 25 ... Resin 26 ... Conductor 27 ... Print for terminal Substrate 28 ... Alignment table 29 ... Multilayer coil 30 ... Mask pattern for multiple coil pattern boards 31 ... Sensor 31a ... Sensor body 31b ... Lead wire 32 ... Sensor head 33 ... Case 34 ... Connector 35 ... Impedance measuring instrument 36 ... AC power supply device 37 ... Power connector 38 ... Eddy current 39 ... DUT 40a, 40b ... Magnetic field H ... Distance

Claims (11)

A laminated coil formed by laminating a plurality of spiral coils formed on the same plane,
The spiral coil is formed in the opposite direction to the other adjacent spiral coils,
The spiral coils are connected in series by alternately connecting the central ends of the spiral coils and the peripheral ends of the spiral coils. The laminated coil according to claim 1, wherein the laminated coil is laminated from the first layer to the n-th layer,
The spiral coil has a coil body, a first electrode formed at a peripheral end of the coil body, and a second electrode,
The connection between the peripheral ends of the spiral coil is to connect the first electrodes,
The second electrodes from the first layer to the n-th layer are connected to each other, and among the first electrodes formed at the central end portion or the peripheral end portion of the spiral coil of the n-th layer, the (n− 1) A laminated coil, wherein the one not connected to the layer is connected to the second electrode of the nth layer. The laminated coil according to claim 1, wherein the laminated coil is laminated from the first layer to the n-th layer,
The spiral coil has a coil body, a first electrode formed at a peripheral end of the coil body, and a second electrode,
The connection between the peripheral ends of the spiral coil is to connect the first electrodes,
The second electrodes from the first layer to the (n-1) th layer are connected to each other, and the central end of the spiral coil of the (n-1) th layer and the central end of the spiral coil of the nth layer And the first electrode of the nth layer is connected to the second electrode of the (n−1) th layer.   The laminated coil according to any one of claims 1 to 3, wherein an insulating material is disposed between the spiral coil and the adjacent spiral coil.   The multilayer coil according to claim 1, wherein the multilayer coil is coated with an insulating resin.   A case in which the laminated coil according to claim 2 or 3 is housed in one end close to the body to be measured, and a first electrode of the spiral coil of the first layer of the laminated coil or the spiral Can measure the impedance of the laminated coil provided on this lead wire and the lead wire extending from the second electrode and the one not connected to the spiral coil of the second layer in the central end of the coiled coil A vibration sensor provided with a simple detector.   The vibration sensor according to claim 6, further comprising a power source capable of supplying an alternating current connected to the lead wire. A method of manufacturing a laminated coil by laminating a plurality of spiral coils formed on the same plane,
One spiral coil and another spiral coil formed in the reverse direction of this spiral coil are arranged adjacent to each other,
The adjacent spiral coils are connected in series by alternately connecting the central ends of the spiral coils and connecting the peripheral ends of the spiral coils. Manufacturing method of laminated coil. The spiral coil is formed through a runner on a substrate frame with a coil body, a first electrode formed at a peripheral end of the coil body, and a second electrode,
The connection between the peripheral ends of the spiral coil is to connect the first electrodes,
The second electrodes from the first layer to the n-th layer are connected to each other, and are not connected to the (n-1) -th layer among the central end portion or the peripheral end portion of the spiral coil of the n-th layer. And the second electrode of the nth layer,
9. The method of manufacturing a laminated coil according to claim 8, wherein the substrate frame and the runner are cut and removed after laminating from the first layer to the n-th layer. The spiral coil is formed through a runner on a substrate frame with a coil body, a first electrode formed at a peripheral end of the coil body, and a second electrode,
The connection between the peripheral ends of the spiral coil is to connect the first electrodes,
The second electrodes from the first layer to the (n-1) th layer are connected to each other, and the central end of the spiral coil of the (n-1) th layer and the central end of the spiral coil of the nth layer And connecting the first electrode of the nth layer to the second electrode of the (n-1) th layer,
9. The method of manufacturing a laminated coil according to claim 8, wherein the substrate frame and the runner are cut and removed after laminating from the first layer to the n-th layer. The method for manufacturing a laminated coil according to any one of claims 8 to 10, wherein an insulating material is disposed and laminated between the spiral coil and the adjacent spiral coil.