JP2009027056A - Metalized film capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metalized film capacitor capable of reducing inductance in a simple structure and being miniaturized and made light in weight as well further. <P>SOLUTION: The metalized film capacitor relating to this invention comprises: a plurality of capacitor elements 6 wound around a winding core part and provided with a first end face and a second end face facing it; a first metalicon part 7a formed on the first end face; a second metalicon part 7b formed on the second end face; an electrode member 9 passing through the winding core part and connected to the first metalicon part 7a at one end; a first wire connection board 12a for mutually connecting the other end of the electrode member 9; and a second wire connection board 12b arranged between the first wire connection board 12a and the second metalicon part 7b and insulated from the first wire connection board 12, for mutually connecting the second metalicon part 7b. The preferable electrode member 9 is pipe-like tinned copper, and flanges 10 and 11 are formed at one and the other ends of it. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a metallized film capacitor formed by winding a metallized film, and more particularly, to a metallized film capacitor in which inductance is reduced.

  A conventional metalized film capacitor is a capacitor in which a metal electrode such as aluminum is deposited on at least one surface of a dielectric film to form a deposited electrode, and a metallicon part is formed on an end surface of a wound body formed by winding this film. An element is manufactured, and a plurality of the elements are housed in a case, and after the metallicon portions of the capacitor elements are connected to each other with a lead wire or a connection plate, the case is filled with resin and cured.

Of such metallized film capacitors, those applied to high frequency circuits are strongly required to have low inductance.
Therefore, for example, in the metallized film capacitor unit 30 described in Patent Document 1 shown in FIG. 4, the connection plate 32 a connected to one metallicon part 31 a formed on the end surface of the capacitor element 33 is stretched to connect this connection. The plate 32a and the connection plate 32b connected to the other metallicon part 31b are arranged close to each other in parallel to reduce inductance (see FIG. 4).

JP 2000-277378 A

However, in the conventional metallized film capacitor unit 30 shown in FIG. 4, it is necessary to extend one of the connection plates 32a long in order to make the connection plates close to each other in parallel, and the structure is complicated.
Moreover, in order to prevent the connection board 32a extended long and other members from short-circuiting, it is necessary to provide a large number of insulators or insulating spaces, and there is a limit to miniaturization and weight reduction of the capacitor.

  In view of the above problems, it is an object of the present invention to provide a metallized film capacitor that can reduce inductance with a simple structure, and can also be reduced in size and weight.

  In order to solve the above problems, a metallized film capacitor according to the present invention includes a case, a plurality of capacitor elements formed by winding the metallized film and housed in the case, and a case housing the capacitor element 1) a capacitor element having a first end face and a second end face facing the first end face, and 2) a metallized film capacitor made of resin or insulating oil filled in A first metallicon part formed on the first end face of the capacitor element; 3) a second metallicon part formed on the second end face of the capacitor element; and 4) penetrating the core part of the capacitor element, An electrode member having one end connected to the first metallicon part, 5) a first connection plate connecting the other ends of the plurality of electrode members to each other, and 6) the first connection plate and the second metallicon part. A second connection plate disposed between the first connection plate and the second connection plate; and 7) sandwiched between the first connection plate and the second connection plate, and the first connection plate and the second connection plate. And an insulating material.

  The electrode member is preferably a pipe-like tin-plated copper, and a ridge is formed at one end and the other end thereof.

  More preferably, the second metallicon part, the second connection plate, and the electrode member are formed by an insulating sheet provided on a portion of the outer surface of the electrode member facing the second metallicon part and the second connection plate. And are insulated.

  According to the present invention, it is possible to provide a metallized film capacitor that can reduce inductance with a simple structure and that can also be reduced in size and weight.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a front view (a) and a sectional view (b) of a metallized film capacitor unit according to the present invention. 2 and 3 are views showing an example of a member used in the metallized film capacitor according to the present invention. FIG. 2 (a) is a metallized polypropylene film (hereinafter, metallized film), and FIG. 2 (b). 3 is a capacitor element, FIG. 3A is an electrode member, and FIGS. 3B and 3C are connection boards.

[Example]
First, the capacitor element used in the example will be described with reference to FIG. In FIG. 2A, 1a is a metallized film having a thickness of 7 μm according to the embodiment, 2a is a vapor deposition electrode region where aluminum is vapor-deposited on one side of the metallized film 1a, and 3a is a margin portion where no electrode is formed. The vapor deposition electrode region 2a is divided into a plurality of vapor deposition electrodes 4a, which are connected in parallel via the fuse portion 5a.

  The capacitor element 6 shown in FIG. 2 (b) has a metal core 1a shown in FIG. 2 (a) and an upside down structure after the core 8 is formed of an insulating film made of polyethylene terephthalate or polypropylene. The metallized film 1b on which the electrode is deposited is overlapped and wound around the core part 8, and the first metallicon part 7a and the second metallicon part 7b are formed on both end faces (first and second end faces). is there. Since the metallized films 1a and 1b are provided with margin portions 3a and 3b, respectively, the first metallicon portion 7a is connected only to the vapor deposition electrode region 2a, and the second metallicon portion 7b is connected only to the vapor deposition electrode region 2b. Is done.

  Next, with reference to FIG. 3, the electrode member and the connection board used in the example will be described. The electrode member 9 shown in FIG. 3A is a pipe-shaped member made of tin-plated copper, and its diameter φ1 is substantially equal to the inner diameter of the core 8 of the capacitor element 6. At one end of the electrode member 9, a flange 10 having a diameter of φ2 is formed. The collar 11 attached to the other end of the electrode member 9 will be described later.

  An insulating sheet 14 made of polyethylene terephthalate or polypropylene is wound around the other end of the electrode member 9. The insulating sheet 14 is a member that is so thin as to be negligible with respect to the diameter φ1 of the electrode member 9.

  FIG. 3B shows a first connection plate 12a for connecting the first metallicon portions 7a of the capacitor element 6 to each other, and four holes having a diameter of φ3 are formed. φ3 is slightly larger than the diameter φ1 of the electrode member 9 and smaller than the diameter φ2 of the flange 10. FIG. 3C shows a second connection plate 12b that connects the second metallicon parts 7b of the capacitor element 6 to each other, and a semicircular cutout having a diameter of φ4 is formed. φ4 is larger than the diameter φ1 of the electrode member 9. The first and second connection plates 12a and 12b are both made of tin-plated copper, and are formed with four holes or notches. Therefore, the first and second connection plates 12a and 12b can be applied to a metallized film capacitor having four capacitor elements. It is.

  Subsequently, the metallized film capacitor unit according to the example is assembled using the capacitor element 6, the electrode member 9, the first and second connection plates 12a and 12b. As shown in FIG. 1A, in the embodiment, four capacitor elements 6 and electrode members 9 are used.

FIG.1 (b) is sectional drawing which cut | disconnected the metallized film capacitor | condenser unit 20 shown to Fig.1 (a) by line XX. The metallized film capacitor unit 20 is assembled by first passing through the electrode member 9 on which the flange 11 is not yet formed through the core 8 covered with an insulating film (not shown), and the first metallicon 7a and The flange 10 of the electrode member 9 is connected by soldering.
Next, the second wiring plate 12b is attached to the second metallicon portion 7b side to connect the plurality of second metallicon portions 7b to each other, and the insulating material 13 made of polyethylene terephthalate or polypropylene, and the first wiring plate 12a are sequentially connected. Install. At this time, the diameter (= φ4) of the hole formed in the second connection plate 12b is larger than the diameter (= φ1) of the electrode member 9, and the insulating sheet 14 is wound around the electrode member 9. Therefore, the second connection plate 12b and the second metallicon part 7b do not come into contact with the electrode member 9.

Thereafter, a hook 11 having substantially the same shape as the hook 10 is attached to the electrode member 9 and soldered, and the hook 11 and the first wiring board 12a are soldered and connected.
After the metallized film capacitor unit 20 was assembled as described above, it was housed in a case, filled with epoxy resin, and cured to produce a metallized film capacitor according to the example.

  That is, in the metallized film capacitor according to the present invention, the second metallicon portion 7b of each capacitor element 6 is connected to each other by the second connection plate 12b, and the first metallicon portion 7a is an electrode penetrating each capacitor element 6. It is pulled out by the member 9 to the second metallicon part 7b side and is connected to each other by the first connection plate 12a. Further, the first connection plate 12a and the second connection plate 12b are arranged close to each other in parallel via the insulating material 13.

(Comparative example)
As a comparative example, a metallized film capacitor having a conventional structure shown in FIG. 4 was produced. The metallized film capacitor unit 30 constituting this capacitor includes four capacitor elements 33, a connection plate 32a for connecting the metallicon portion 31a formed thereon, and a connection plate 32b for connecting the metallicon portion 31b to each other. . The capacitor element 33 has the same structure as the capacitor element 6 (see FIG. 2) used in the example. The connection plates 32a and 32b are made of tin-plated copper as in the embodiment.

  The metallized film capacitor unit 30 was housed in a case, filled with epoxy resin, and cured to produce a metallized film capacitor according to a comparative example.

[Performance comparison test]
Five metallized film capacitors each having a rated voltage of 2000 V and a capacitance of 1000 μF according to Examples and Comparative Examples were produced, and inductance, volume, and mass were measured. The results are shown in Table 1. The inductance was measured based on “Japan Electrical Manufacturers Association Standard“ Capacitor for Power Semiconductor Conversion Device ”(JEM1419: 2000) Annex 3 (normative) resonance frequency measurement method (example)”.

  As is clear from the results shown in Table 1, the inductance of the metallized film capacitor according to the example having the same capacity as that of the metallized film capacitor according to the comparative example was reduced by about 40%. This is because, for example, when the current applied from the second metallicon part 7b flows through the capacitor element 6 to the first metallicon part 7a side, the inside of the electrode member 9 is directed from the flange 10 side toward the flange 11 side. This is because the inductance is canceled when the same amount of current flows in the opposite direction.

  Furthermore, in the metallized film capacitor according to the example, a reduction in size of about 25% and a reduction in weight of about 25% were realized compared to the metallized film capacitor according to the comparative example. This is because a long-stretched wiring board and many insulators and insulating spaces for insulating it are not necessary.

  The specific configuration of the present invention has been described above, but the present invention is not limited to the above configuration.

  For example, although the pipe-shaped electrode member 9 shown in FIG. 3A is used in the embodiment, a rod-shaped (not hollow) electrode member may be used instead. Further, the first and second connection plates 12a and 12b shown in FIGS. 3B and 3C may have other shapes, and of course, the first connection plate 12a and the second connection plate 12b can have the same shape. . However, when these shapes are changed, the relationship between the hole diameter φ3 of the first connection plate 12a and the diameter φ2 of the flange 11, and the notch diameter φ4 of the second connection plate 12b and the diameter φ1 of the electrode member 9, Needless to say, it is produced so as to maintain the above-described magnitude relationship.

  Further, in the embodiment, the insulation is performed by arranging the insulating material 13 between the first connection plate 12a and the second connection plate 12b. However, another insulating member is arranged instead of the insulation material 13. May be. The insulating sheet 14 is formed by winding an insulating film, but may be formed by applying an insulating resin.

  Furthermore, the resin filled in the case may be replaced with urethane resin or the like, or insulating oil may be used instead of the resin.

  In addition, various capacitor elements other than the capacitor elements used in the examples can be applied to the present invention. For example, the vapor deposition electrode region 2a may be formed on both surfaces of the metallized film 1a shown in FIG. 2A, and the entire vapor deposition electrode region 2a excluding the margin portion 3a may be used as one large vapor deposition electrode 4a. . In this case, the fuse portion 5a is not formed. Moreover, you may form the capacitor | condenser element 6 shown in FIG.2 (b) by winding two types of metallized films 1a from which the shape of the vapor deposition electrode 4a differs.

  Furthermore, the number of capacitor elements 6 accommodated in the case is four. However, the number of capacitor elements 6 is not limited to four, and may be one, two, or more. In that case, the connection plates 12a and 12b Needless to say, the shape is appropriately changed to a shape corresponding to each number.

  Further, in the embodiment, the electrode member 9 and the connection plate 12a are connected by attaching the flange 11 having the same shape as the flange 10 to the other end of the electrode member 9, but the portion corresponding to the flange 11 of the electrode member 9 is formed in a strip shape. In addition, the electrode member 9 and the connection plate 12a may be connected by bending the strip-shaped portion outward after the connection plate 12a is attached.

  The metallized film capacitor according to the present invention can be widely used as a filter capacitor for an inverter circuit for driving a motor of an industrial device or a hybrid vehicle, or an energy storage capacitor.

It is a figure which shows the metallized film capacitor | condenser unit based on this invention, Comprising: (a) is a front view, (b) is sectional drawing in line XX. It is an example of the member applied to the metallized film capacitor which concerns on this invention, Comprising: (a) is a top view of a metallized film, (b) is a perspective view of a capacitor | condenser element. It is an example of the member applied to the metallized film capacitor which concerns on this invention, Comprising: (a) is a perspective view of an electrode member, (b) (c) is a top view of a connection board. It is a side view of the conventional metallized film capacitor unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a, b Metallized film 2a, b Evaporation electrode area | region 3a, b Margin part 4a, b Evaporation electrode 5a, b Fuse part 6 Capacitor element 7a First metallicon part 7b Second metallicon part 8 Core part 9 Electrode members 10, 11鍔 12a First connection plate 12b Second connection plate 13 Insulation material 14 Insulation sheet (between the electrode member and the second metallicon part)
20 Metallized film capacitor unit

Claims (4)

A metallized film capacitor comprising a case, a plurality of capacitor elements formed by winding a metallized film and housed in the case, and a resin or insulating oil filled in the case housing the capacitor element, ,
A capacitor element wound around a core portion and having a first end face and a second end face facing the first end face;
A first metallicon part formed on the first end face of the capacitor element;
A second metallicon part formed on the second end face of the capacitor element;
An electrode member penetrating through the core portion of the capacitor element and having one end connected to the first metallicon portion;
A first connection plate for connecting the other ends of the plurality of electrode members to each other;
A second connection plate disposed between the first connection plate and the second metallicon unit, and connecting the plurality of second metallicon units to each other;
An insulating material sandwiched between the first connection plate and the second connection plate, and insulating the first connection plate and the second connection plate;
A metallized film capacitor comprising:   The metallized film capacitor according to claim 1, wherein the electrode member is a pipe-shaped tin-plated copper.   The metallized film capacitor according to claim 1, wherein ridges are formed at one end and the other end of the electrode member.   Of the outer surface of the electrode member, the second metallicon part, the second connection plate, and the electrode member are insulated from each other by an insulating sheet provided in a portion facing the second metallicon part and the second connection plate. The metal film capacitor according to claim 1, wherein the metal film capacitor is provided.

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