JP2009017962A - Main control board, and board case for housing main control board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the fraudulence of the exchange or the like of a microcomputer 22. <P>SOLUTION: An upper board case 23 is designed such that the height of the partial area of other electronic components including the microcomputer 22 is so low that the microcomputer 22 can not be detached from a socket 26 and the partial area is flat to one end part of the upper board case 23. On the main control board 16, the other electronic components higher than the height of the microcomputer 22 mounted on the socket 26 are mounted and arranged outside the partial area of the upper board case 23. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a main control board on which a microcomputer used for controlling a gaming machine such as a slot machine or a pachinko machine is mounted, and a board case that houses the main control board.

In gaming machines such as slot machines and pachinko machines, game progress is controlled by a control board called a main control board. The main control board includes a microcomputer with a built-in ROM that stores a game control program. , Resistors, capacitors, coils, LSIs, transistors, LEDs, etc. are mounted. The main control board is housed in a board case consisting of an upper board case and a lower board case made of transparent or translucent plastic, and the upper board case and the lower board case are crimped with push pins and cannot be opened easily. It has become.

However, the upper substrate case that covers the surface side of the conventional main control board was manufactured at a height that accommodates all the electronic components, so a hole was made in the side of the upper substrate case, from which the microcomputer and its socket The problem was caused by the illegal act of inserting a device between the two and replacing it with an illegal microcomputer. Therefore, as a technique for preventing such an unauthorized replacement of the microcomputer, a recess is provided in a portion corresponding to the microcomputer portion of the upper substrate case that covers the surface side of the main control board, and a gap between the upper substrate case and the microcomputer is provided. Is known to narrow (see, for example, Patent Document 1).
JP 2000-317109 A

However, although the above method is effective in illegally exchanging the microcomputer from the side of the upper substrate case, the mold design of the upper substrate case covering the surface side of the main control board becomes complicated, and the main Each time the layout position of the microcomputer of the control board is changed, there is a disadvantage that the mold needs to be changed and it is impossible to respond quickly.

According to the main control board and the board case storing the main control board according to claim 1, the main control board on which the microcomputer for executing the game control program is mounted on the socket and the other electronic components are mounted and arranged on the board; In a substrate case composed of an upper substrate case and a lower substrate case for housing the main control board, a partial area of the other electronic component including the microcomputer of the upper substrate case covering the surface side of the main control board The height is so low that the microcomputer cannot be removed from the socket, and the partial area is flat up to one end of the upper substrate case, and the main control board is the upper substrate case The other electronic component higher than the microcomputer mounted in the socket outside the partial area of Wherein the mounting is disposed a. Here, the height of a part of other electronic parts including the microcomputer is so low that the microcomputer cannot be removed from the socket from the upper surface of the microcomputer to the lower surface of the upper substrate case covering the microcomputer. Is about 3 mm or less, which is the depth at which the pins of the microcomputer are mounted on the socket, and preferably 1 mm or more in consideration of heat dissipation. As an example, the gap from the main control board to the lower surface of the upper board case is usually 30 mm, but the upper surface of the microcomputer mounted in the socket is 9 mm from the main control board, so that some areas including the microcomputer It is preferable to lower the height so as to correspond to a gap of 10 mm to 12 mm from the main control substrate surface to the lower surface of the upper substrate case.

According to the first aspect of the present invention, the main control board on which the microcomputer for executing the game control program is mounted on the socket and the other electronic components are mounted on the board, and the upper board case for storing the main control board, In the board case composed of the lower board case, the upper board case has a height of a part of other electronic components including the microcomputer so that the microcomputer cannot be removed from the socket. It is impossible to remove the microcomputer even if a hole is made in the side of the upper substrate case and an instrument is inserted between the hole and the socket. Further, since the partial area is flat to one end of the upper substrate case, the mold design is simplified and the visibility from the outside of the microcomputer is improved. In addition, the main control board has the other electronic components higher in height than the microcomputer mounted in the socket mounted outside the partial area of the upper substrate case. There is also an effect that the main control board on which is mounted does not interfere.

According to the main control board and the board case storing the main control board according to claim 2, the main control board on which the microcomputer for executing the game control program is mounted on the socket and the other electronic components are mounted and arranged on the board; In a substrate case composed of an upper substrate case and a lower substrate case for housing the main control board, a partial area of the other electronic component including the microcomputer of the upper substrate case covering the surface side of the main control board The height is so low that the microcomputer cannot be removed from the socket, and the partial area is flat up to one end of the upper substrate case, and the main control board is the upper substrate case The other electronic part higher than the microcomputer mounted in the socket around the partial area of Characterized in that arranged preferentially implemented.

According to the second aspect of the present invention, the main control board is further limited to the height of the microcomputer mounted in the socket around the partial area of the upper board case. Since the other electronic components higher than the above are preferentially mounted and arranged, even if a hole is made in the side of the upper substrate case outside a part of the area and the microcomputer is accessed from there, it is preferential. Since tall parts are arranged around some areas, they become a hindrance and make it even more difficult to access, not only to remove the microcomputer, but also to help prevent fraud. .

According to the main control board and the board case storing the main control board according to claim 3, in addition to the configuration of claim 1 or 2, the height of a part of the other electronic component including the microcomputer is increased. Is flat from one end of the upper substrate case to the other opposite end.

According to the third aspect of the present invention, since a part of other electronic components including the microcomputer is flat from one end of the upper substrate case to the other opposite end, the mold design is further improved. In addition, it becomes easy to mount and arrange other electronic components higher than the height of the microcomputer mounted in the socket on the main control board.

According to the invention of the slot machine provided with the main control board according to claim 4 and the board case for storing the main control board, the housing and the front door pivotally attached to the one axis side of the housing, A microcomputer for executing a game control program is mounted in a socket inside the housing, and other electronic components are mounted and arranged on the board, and an upper board case and a lower board case for housing the main control board. In the slot machine provided with the substrate case, the height of a part of the other electronic component including the microcomputer of the upper substrate case is lowered so that the microcomputer cannot be removed from the socket. And the partial area is flat up to one end of the upper substrate case and is closer to the open end of the front door, and the main control board is Outside the partial area of the partial board case, a part of the other electronic component higher than the height of the microcomputer mounted on the socket is mounted and arranged from one axis side of the housing. To do.

According to the fourth aspect of the present invention, a casing and a front door that is rotatably attached to one axis side of the casing are mounted, and a microcomputer that executes a game control program is mounted in the socket. In the slot machine comprising a board case comprising a main control board on which other electronic components are mounted and arranged, an upper board case for housing the main control board, and a lower board case, the microcomputer of the upper board case Since the height of some areas of the other electronic components including the above-mentioned is low so that the microcomputer cannot be removed from the socket, a hole is made in the side of the upper substrate case, and the microcomputer and It is impossible to remove the microcomputer even if an instrument is inserted between the sockets. Further, the partial area is flat up to one end of the upper substrate case and is located on the open end side of the front door, and the main control board is located outside the partial area of the upper substrate case, Since a part of the other electronic components that are higher than the microcomputer mounted in the socket is mounted and arranged from one axis side of the housing, the side that opens the front door includes the microcomputer. An area in which fraud is more difficult is arranged such that the height of a part of other electronic components is lowered so that the microcomputer cannot be removed from the socket. In addition, some of the other electronic components that are higher than the microcomputer mounted in the socket are located on the uniaxial side that cannot be accessed unless the front door is opened wide. This is effective for fraudulent attempts to replace the ROM.

According to the main control board and the board case storing the main control board according to claim 5, in addition to the configuration of claim 1 or 4, one of the other electronic components including the microcomputer of the upper board case. A transparent heat-resistant member is disposed inside the upper substrate case corresponding to the region of the part.

According to a fifth aspect of the invention, in addition to the configuration of the first or fourth aspect, a transparent portion is formed inside the upper substrate case in correspondence with a partial region of the other electronic component including the microcomputer. Since the heat-resistant member is disposed, the upper substrate case covering the microcomputer is thermally melted by a heating means such as a soldering iron, so that it is possible to cope with a rough unauthorized means of replacing the unauthorized microcomputer with an unauthorized microcomputer. . If the flat end of the substrate case is flat, the transparent heat-resistant member can be supported from three directions without being supported from the four directions. If flat from the one end to the other end of the substrate case is possible. The transparent heat-resistant member can be further supported from two directions, and the number of man-hours can be reduced.

Conventionally, only the upper substrate case of the substrate case has been used to prevent fraud such as replacement of the microcomputer, so that countermeasures have been insufficient. According to the present invention, the microcomputer that executes the game control program is connected to the socket. A board case comprising a main control board mounted on the board and other electronic components mounted on the board, an upper board case for housing the main control board, and a lower board case. The upper board case includes the microcomputer. The height of some areas of the electronic components is so low that the microcomputer cannot be removed from the socket, and some areas are designed to be flat up to one end of the upper board case. Also on the control board, outside of a part of the upper board case, the height of the microcomputer mounted in the socket Since implementing disposed higher other electronic components, spread design freedom, also exhibits an excellent effect of more conventional relative fraud.

Hereinafter, a case where the embodiment of the present invention is applied to a slot machine will be described.

As shown in FIG. 1, the slot machine 1 includes a housing 2 and a front door 3. The front door 3 is pivotally attached to the housing 2 on one axis side, and the engagement with the housing 2 is released by the door key 4 so that the front door 3 is opened around the left hinge shaft. Can do. On the front side of the front door 3, a game medal slot 5 for a player to insert a game medal, a bet button 6 for betting the inserted medal, and start levers 8, 3 for starting three reels 7a, 7b, 7c. Stop buttons 9a, 9b, and 9c for stopping the reels, and a settlement button 10 for settlement of inserted medals and credited medals are provided. A transparent reel display window 12, a payout number display unit 13, and a credit number display unit 14 are configured to display each number of 7-segment data on the middle panel 11 at the center of the front door 3. A receiving tray 15 for storing the paid-out medals is provided at the lower part of the front door 3.

FIG. 2 is a drawing showing the internal structure of the housing 2 of the slot machine 1 as viewed from the front. A board case 17 that houses the main control board 16 is attached to the inner surface of the side wall of the casing 2 via a mounting plate 18 on the upper back surface of the casing 2. A reel unit 19 containing three reels 7 a, 7 b, 7 c is attached to a reel mounting plate 20 at the center of the housing 2. A hopper 21 is accommodated below the reel mounting plate 20. The hopper 21 stores the game medals inserted from the game medal slot 5 and detected by a medal selector (not shown), and pays out medals according to the number of coins to be paid out when winning a prize. Have a role.

FIG. 3 shows the configuration of a conventional main control board 16, board case 17, and mounting plate 18. As shown in FIG. First, the rectangular metal mounting plate 18 is fixed to the inner surface of the side wall of the housing 2 through a screw hole with a screw or the like. Electronic components including a microcomputer 22 are mounted on the front side of the main control board 16 (only the microcomputer 22 is shown). Since the rear surface side of the main control board 16 has no electronic parts and only a solder surface, the height does not change due to fluctuations in the parts.

The board case 17 that houses the main control board 16 covers the upper board case 23 that covers the front side of the main control board 16 and the back side of the main control board 16, and supports the main control board 16 from below by protruding pieces on the side walls. The lower substrate case 24 is configured. After being accommodated in the lower substrate case 24, the main control board 16 is covered with the upper substrate case 23, and the upper substrate case 23 is engaged with the lower substrate case 24 by sliding in the longitudinal direction. Further, in order to prevent the engagement from being released, the upper substrate case 23 is sealed by caulking with a one-way screw 25 or the like via a cylindrical connecting member at the corner of the upper substrate case 23. Furthermore, the substrate case 17 sealed in this way is engaged by inserting the protruding portion of the substrate case 17 into the notch portion of the mounting plate 18 and engaging the upper substrate case 23 on the opposite side. One of the members is engaged with the engaging portion by a one-way screw 25 or the like. Therefore, in order to remove the substrate case 17 from the mounting plate 18, it is necessary to separate the cylindrical connecting member from the upper substrate case 23, and the released trace remains.

FIG. 4 illustrates the functional arrangement of the electronic components on the surface side of the conventional main control board 16 from the front. The main control board 16 is provided with four connector terminals, ie, a signal input / output connector, a signal output connector, a sub board output connector and a power connector, and an upper board case 23 corresponding to these terminals is provided with an opening. Connector terminals protrude from the upper substrate case 23 and are connected to external connectors. To the signal input / output connector, a selector input sensor output signal, a bet button output signal, a start lever output signal, and the like are input as input signals to display 7-segment data of the payout number display unit 13 and the credit number display unit 14. An output signal is being output. An external signal output, a reel excitation signal output, a hopper drive signal, and the like are output to the signal output connector. Also, DC5V, DC12V, and DC24V are supplied to the power connector from the power supply board. DC5V is a voltage of main electronic components including the microcomputer 22 of the main control board 16, and DC12V is an output voltage of 7 segments of the display. DC24V is the power MOS of the reel excitation signal circuit
It is used for a power MOS FET array of a FET array and a selector drive signal, and a power MOS FET of a hopper drive power source of a hopper drive circuit.

Electronic components including the microcomputer 22 other than the four connectors are covered with the upper substrate case 23 with a gap of about 30 mm from the main control board 16 to the lower surface of the upper substrate case 23.

The microcomputer 22 of the main control board 16 is provided above the signal output connector, and visibility from the front is ensured when the front door 3 of the slot machine 1 is opened. A terminal of about 3 mm in length of the microcomputer 22 is inserted into a socket 26 attached to the main control board 16. The reason why the microcomputer 22 is mounted directly on the board via the socket 26 is that the microcomputer 22 can be easily replaced for each model, and the terminals of the microcomputer 22 are directly soldered to the board. This is to avoid the influence of heat on the microcomputer 22. The height to the upper surface of the microcomputer 22 including the socket 26 is about 9 mm from the main control board, and about 21 mm has room to the lower surface of the upper board case 23, so that the regular microcomputer 22 is lifted by about 3 mm to raise the socket 26. There is a risk that it will be removed from the computer and replaced with an unauthorized microcomputer 22.

The DC5V supplied from the power connector is supplied to main electronic components including the microcomputer 22 as a more stable voltage VCC by a 5V smoothing circuit that reduces high frequency noise including a coil and a capacitor. DC24V supplied from the power connector is a stable voltage by a 24V smoothing circuit consisting of a high-capacitance capacitor to reduce noise.
Supplied to the FET array. The coils and capacitors used in these smoothing circuits are higher in height than the microcomputer 22 mounted on the socket 26.

The display device signal output circuit is composed of a transistor array IC, a flip-flop CMOS, and the like, and is mounted at a lower height than the microcomputer 22 mounted on the socket 26.

The selector drive circuit section is composed of a transistor array IC, a flip-flop CMOS, a power MOS FET array, and the like. The former two are mounted at a lower height than the microcomputer 22 mounted on the socket 26. Power MOS
The FET array is not a surface mounting type but an insertion mounting type, and is mounted with a height higher than that of the microcomputer 22 mounted on the socket 26.

The sub-board output circuit is composed of a transistor array IC, a latch CMOS, and the like, and is mounted at a lower height than the microcomputer 22 mounted on the socket 26.

The input / output signal shaping circuit includes a Schmitt trigger, a bus buffer, a decoder CMOS, and the like, and is mounted at a lower height than the microcomputer 22 mounted on the socket 26.

The random number counter generation circuit includes a counter IC, a crystal oscillator, and the like, and is mounted at a lower height than the microcomputer 22 mounted on the socket 26.

The LED array section is composed of an operation confirmation LED and a bus buffer CMOS, and the corresponding LED is lit when energized by the operation. The LED array unit is mounted with a height lower than that of the microcomputer 22 mounted on the socket 26.

The external signal output circuit is composed of a transistor array IC, a flip-flop CMOS, and the like, and is mounted at a lower height than the microcomputer 22 mounted on the socket 26.

The reel excitation signal circuit consists of latch and flip-flop CMOS and power MOS.
It consists of an FET array, etc. The former two are mounted at a lower height than the microcomputer 22 mounted on the socket 26, but the power MOS with heat generation
The FET array is not a surface mounting type but an insertion mounting type, and is mounted with a height higher than that of the microcomputer 22 mounted on the socket 26.

The hopper drive circuit consists of a transistor array IC for drive control, a CMOS circuit such as a flip-flop, and a power MOS for drive power supply.
It is composed of FETs, and the former two are mounted at a lower height than the microcomputer 22 mounted on the socket 26, but are power MOSs that generate heat.
The FET is an insertion mounting type instead of a surface mounting type, and is mounted higher than the microcomputer 22 mounted on the socket 26.

As described above, on the conventional main control board 16, the circuit mounted higher than the microcomputer 22 mounted on the socket 26 is a 5V smoothing circuit for reducing high frequency noise including a capacitor and a coil, and a capacitor having a large capacity. 24V smoothing circuit including power MOS
A selector circuit including FET parts, a reel excitation signal circuit, a hopper drive circuit, and the like. These are obstacles when the height of the upper substrate case 23 is uniformly lowered to prevent unauthorized replacement of the microcomputer 22. It was to become. Other electronic components used in the circuit include a resistor, a diode, a small transistor, and the like, but these are small and do not obstruct the lowering of the height of the upper substrate case 23, and thus are omitted from the description.

FIG. 5A shows the functional arrangement of the electronic components on the surface side of the main control board 16 and the shape of the board case 17 in the first example of the embodiment of the present invention. The height of the upper substrate case 23 of the substrate case 17 is designed to be different between the region A and the region B. The area A covers the entire electronic parts of the microcomputer 22, the external signal output circuit, the sub-board output circuit, the display signal output circuit, the input / output signal shaping circuit, and the electronic parts of the random number counter generation circuit. The height is designed to be low so that the gap between the main control board 16 and the lower surface of the upper board case 23 where the microcomputer 22 cannot be removed from the socket 26 corresponds to about 12 mm, for example. Area B is a part of the electronic components of the reel excitation signal circuit, hopper drive circuit, selector drive circuit, 5V smoothing circuit, 24V smoothing circuit, display signal output circuit, input / output signal shaping circuit, and random number counter generation circuit. The height is higher than the area A, and the gap between the main control board 16 and the lower surface of the upper board case 23 is designed to correspond to, for example, about 30 mm as in the prior art, and is mounted on the socket 26. Therefore, it is possible to deal with an electronic component that requires heat dissipating and disposing electronic components higher than the height of the microcomputer 22.

FIG. 5B is a cross-sectional view taken along the line I-I in FIG. The microcomputer 22 mounted on the socket 26 and some electronic components of the random number counter generation circuit are in the cross section of the region A, and the remaining electronic components of the random number counter generation circuit and the electrons of the LED array unit are in the cross section of the region B. The part is in the cross section of region B.

FIG. 6A shows the functional arrangement of the electronic components on the surface side of the main control board 16 and the shape of the board case 17 in the second example of the embodiment of the present invention. The height of the upper substrate case 23 of the substrate case 17 is designed to be different between the region C and the region D. The area C covers the entire electronic components of the microcomputer 22 and the external signal output circuit, and the height thereof is the lower surface of the main control board 16 and the upper board case 23 where the microcomputer 22 cannot be removed from the socket 26. Is designed to be low so as to correspond to, for example, about 12 mm. The remaining area D covers the area other than the microcomputer 22 and the electronic components of the external signal output circuit, the height is higher than the area C, and the gap between the main control board 16 and the lower surface of the upper board case 23 is conventional. It is designed to correspond to, for example, about 30 mm, and can cope with electronic components and heat dissipation higher than the height of the microcomputer 22 mounted on the socket 26. Particularly in the second embodiment, a hopper drive circuit, a reel excitation signal circuit, and a selector drive circuit are arranged around the area C, and the power is higher than that of the microcomputer 22 mounted on the socket 26 of these circuits. MOS
The FET parts are preferentially arranged. As a result, even if a hole is made in the side wall of the region D and the microcomputer 22 is accessed from there by an instrument, the tall parts are preferentially arranged around the region C, which is obstructive. In addition to removing the microcomputer 22, it is even more difficult to access, and this has the effect of preventing fraud.

FIG. 6B is a cross-sectional view taken along the line II-II in FIG. The microcomputer 22 mounted on the socket 26 and the electronic components of the external signal output circuit are in an area where the gap between the main control board 16 and the lower surface of the upper board case 23 is narrow, and the area is flat up to one end of the upper board case 23. It is. As a result, the mold design of the upper substrate case 23 can be simplified and the visibility from the outside of the microcomputer 22 can be improved. In the cross section of region D, there are a reel excitation signal circuit and an LED array part, but the power MOS of the reel excitation signal circuit.
Tall electronic parts such as FET parts are preferentially mounted and arranged around the area C to prevent fraud.

FIG. 7A shows the functional arrangement of the electronic components on the surface side of the main control board 16 and the shape of the board case 17 in the third example of the embodiment of the present invention. FIG. 7B is a cross-sectional view taken along line III-III in FIG. The height of the upper substrate case 23 of the substrate case 17 is designed to be different between the region E and the two regions F divided by the region E. The area E covers the entire electronic components of the microcomputer 22, the external signal output circuit, the random number counter generation circuit, and the two LED array units, and the height thereof is such that the microcomputer 22 cannot be removed from the socket 26. The gap between the main control board 16 and the lower surface of the upper board case 23 is designed to be low, for example, corresponding to about 12 mm. In the area F on the right side of the area E, electronic components such as a hopper drive circuit and a reel excitation signal circuit are arranged. In the area F on the left side of the area E, a selector drive circuit, a sub-board output circuit, an input / output signal shaping circuit, A display signal output circuit, a 5V smoothing circuit, and a 24V smoothing circuit are arranged. The height of the two regions F is higher than that of the region E, and the gap between the main control board 16 and the lower surface of the upper substrate case 23 is designed to correspond to, for example, about 30 mm, which is equivalent to the conventional one. In particular, in the third embodiment, the height of the region E, which is a partial region of other electronic components including the microcomputer 22, is the other end facing the one end (upper end) of the upper substrate case 23. It is flat to (lower end part).
For this reason, the design of the mold is further simplified, and it is also easy to mount and arrange other electronic components higher than the height of the microcomputer 22 mounted on the socket 26 on the main control board 16 outside the region E. In the third embodiment, since a hopper drive circuit, a reel excitation signal circuit, a selector drive circuit, and the like are arranged at the boundary between the region E and the region F, the microcomputer 22 mounted on the socket 26 of these circuits is used. High power MOS
If the FET parts are preferentially arranged around the area E, even if a hole is made in the side wall of the area F and the microcomputer 22 is accessed by an instrument from there, the tall parts are preferentially separated from the boundary with the area E. Since these are arranged in the vicinity of each other, it becomes an obstacle to remove the microcomputer 22 as well as to make it more difficult to access, and this has the effect of preventing fraud.

FIG. 8 is a perspective view of the substrate case 17 in the fourth example of the embodiment of the present invention. In the present embodiment, a setting change section area G including setting keys for setting change and setting change buttons is further mounted on the main control board 16. The main control board 16 is so low that the setting change area G and the microcomputer 22 cannot be removed from the socket 26 from the open end side on the front door 3 side of the slot machine 1 than the uniaxial side of the slot machine housing. A part H of other electronic components including the microcomputer 22 and a region I including other electronic parts higher than the height of the microcomputer 22 mounted in the socket 26 are formed. The height of a part of other electronic components including the microcomputer 22 is so low that the microcomputer 22 cannot be removed from the socket 26, and the part of the part is an end of the upper substrate case 23. It is formed evenly. Therefore, the side where the front door 3 is opened becomes more difficult to access, and the area including other electronic components higher than the height of the microcomputer 22 mounted on the socket 26 is not accessible unless the front door 3 is opened largely. Therefore, it is effective for preventing fraud. Although the setting change area G is mounted on the main control board 16 in this embodiment, it can also be housed in the board case 17 together with the main control board 16 as a separate board.

Further, FIG. 9 shows an example of the arrangement of each circuit. In the main control board 16, other electronic devices higher than the height of the microcomputer 22 mounted on the socket 26 around the partial area of the upper board case 23. If a hopper driving circuit including components, a reel excitation signal circuit, a selector driving circuit, a 5V smoothing circuit, a 24V smoothing circuit, etc. are preferentially mounted and arranged, a hole is formed in the side of the upper substrate case 23 outside a part of the area. Even if it tries to access the microcomputer 22 with an instrument from there, the tall parts are preferentially arranged around a part of the area. Even the access becomes more difficult, which has the effect of further preventing fraud.

 In FIG. 10A, a transparent heat-resistant member 27 is disposed on the inner side of the upper substrate case 23 so as to correspond to a partial region of other electronic components including the microcomputer 22 of the upper substrate case 23. 5 is an example. The transparent heat-resistant member 27 may be a transparent member that does not melt at, for example, 250 ° C., and glass or heat-resistant engineering plastic is preferable. Further, even if the heat-resistant member 27 is supported by the heat-resistant member press 28 as shown in FIG. 10B in the sectional view taken along the line IV-IV, the upper substrate as shown in FIG. It may be a laminated type inserted between the plastic resins as the material of the case 23.

According to the present embodiment, since the transparent heat-resistant member 27 is disposed inside the upper substrate case 23 in correspondence with a part of other electronic components including the microcomputer 22, the microcomputer 22 is The covering upper substrate case 23 is melted by a heating means such as a soldering iron, so that it is possible to cope with a rough illegal means of replacing the illegal microcomputer 22 with a rough illegal means.

A sixth embodiment is shown in FIG. 11B, which is a cross-sectional view taken along the line V-V in FIGS. 11A and 11A. In the present embodiment, a transparent heat-resistant member 27 is disposed on the inner side of the upper substrate case 23 corresponding to a partial region of other electronic components including the microcomputer 22 of the upper substrate case 23, The height of the region is flat from one end of the upper substrate case 23 to the other opposite end, and from the open end side on the front door 3 side of the slot machine 1 from the uniaxial side of the casing 2 of the slot machine 1. In addition, the height of the upper substrate case 23 is gradually increased. According to the present embodiment, a part of other electronic components including the microcomputer 22 is flat from one end portion of the upper substrate case 23 to the other end portion opposed thereto, thereby further simplifying the mold design. In addition, it is easy to mount and arrange other electronic components higher than the height of the microcomputer 22 mounted on the socket 26 on the main control board 16 outside the area. Further, if the upper substrate case 23 is flat from one end portion (upper end portion) to the other end portion (lower end portion) which is opposed, the transparent heat resistant member 27 can be supported by the heat resistant member presser 28 from two directions. Man-hours can also be reduced. Further, the gap from the main control board 16 to the upper board case 23 of the circuit of the main control board 16 on the open end side on the front door 3 side of the slot machine 1 is smaller than the uniaxial side of the housing 2 of the slot machine 1. Unauthorized access becomes more difficult and effective in preventing fraud.

The perspective view of the slot machine which is an example of a game machine. The internal structure figure of the housing | casing of a slot machine. The block diagram of a main control board, a board case, and a mounting plate. The functional arrangement block diagram of the electronic component of the conventional main control board. The figure of functional arrangement | positioning of the electronic component of the surface side of the main control board in 1st Example of this embodiment, and the shape of a board | substrate case. Drawing of functional arrangement | positioning of the electronic component of the surface side of the main control board in 2nd Example of this embodiment, and the shape of a board | substrate case. Drawing of functional arrangement | positioning of the electronic component of the surface side of the main control board in 3rd Example of this embodiment, and the shape of a board | substrate case. The perspective view of the substrate case of 4th Example of this embodiment. Drawing of functional arrangement | positioning of the electronic component of the surface side of the main control board in 4th Example of this embodiment. Drawing of shape of a substrate case of the 5th example of this embodiment. Drawing of shape of a substrate case of the 6th example of this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Slot machine 2; Housing | casing 3; Front door 16; Main control board 17; Substrate case 22; Microcomputer 23; Upper board case 24; Lower board case 26;

Claims (5)

In a board case comprising a main control board on which a microcomputer for executing a game control program is mounted in a socket and other electronic components are mounted on the board, an upper board case for housing the main control board, and a lower board case, The height of a part of the other electronic components including the microcomputer of the upper substrate case covering the surface side of the main control board is set low so that the microcomputer cannot be removed from the socket; The partial area is flat up to one end of the upper substrate case, and the main control board is mounted on the socket mounted on the socket outside the partial area of the upper substrate case. A main control board and a board for storing the main control board, wherein the other electronic components higher than the above are mounted and arranged Over the nest. In a board case comprising a main control board on which a microcomputer for executing a game control program is mounted in a socket and other electronic components are mounted on the board, an upper board case for housing the main control board, and a lower board case, The height of a part of the other electronic components including the microcomputer of the upper substrate case covering the surface side of the main control board is set low so that the microcomputer cannot be removed from the socket; The partial area is flat up to one end of the upper substrate case, and the main control board is located around the partial area of the upper substrate case, and the height of the microcomputer mounted on the socket is high. The main control board and the main control board are characterized by preferentially mounting and arranging the other electronic components higher than the above-mentioned height. Board case to be. 3. The height of a partial area of the other electronic component including the microcomputer is flat from one end portion of the upper substrate case to the other opposite end portion. A main control board and a board case for storing the main control board. A chassis and a front door that is pivotably attached to one axis of the chassis, a microcomputer that executes a game control program is mounted in the socket, and other electronic components are mounted on the board Part of the other electronic components including the microcomputer of the upper substrate case in a slot machine comprising a substrate case composed of a main control substrate to be placed, an upper substrate case for housing the main control substrate, and a lower substrate case The height of the area is low so that the microcomputer cannot be removed from the socket, and the partial area is flat up to one end of the upper substrate case and is closer to the open end side of the front door. And the main control board has a height of the microcomputer mounted in the socket outside the partial area of the upper board case. Slot machine with a substrate case for housing the high the main control board and the main control board, characterized in that a part of the other electronic components mounted disposed from the single side of the housing. 2. A transparent heat-resistant member is disposed inside the upper substrate case so as to correspond to a partial region of the other electronic component including the microcomputer of the upper substrate case. To 4. The main control board according to any one of 4 to 4, and a board case for storing the main control board.

Images