JP2009014525A - Method of quantitatively analyzing mercury in tin or tin alloy plating layer - Google Patents

Method of quantitatively analyzing mercury in tin or tin alloy plating layer Download PDF

Info

Publication number
JP2009014525A
JP2009014525A JP2007177153A JP2007177153A JP2009014525A JP 2009014525 A JP2009014525 A JP 2009014525A JP 2007177153 A JP2007177153 A JP 2007177153A JP 2007177153 A JP2007177153 A JP 2007177153A JP 2009014525 A JP2009014525 A JP 2009014525A
Authority
JP
Japan
Prior art keywords
plating layer
tin
mercury
sample
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2007177153A
Other languages
Japanese (ja)
Inventor
Masumi Kimura
真澄 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP2007177153A priority Critical patent/JP2009014525A/en
Publication of JP2009014525A publication Critical patent/JP2009014525A/en
Abandoned legal-status Critical Current

Links

Images

Landscapes

  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for simply and more accurately quantifying mercury in a tin plating layer with respect to a sample having the tin plating layer. <P>SOLUTION: In this method for quantitatively analyzing mercury in the plating layer consisting of tin or a tin alloy of a sample, which is obtained by forming the plating layer consisting of tin or the tin alloy to a base material consisting of copper or brass, or a sample, which is obtained by forming the plating layer consisting of tin or the tin alloy to a base material made of a metal through a substrate layer consisting of copper or brass, a plating peeling solution containing 18 mass% of nitric acid and 1-10 mass% of ferric nitrate is brought into contact with the sample to dissolve the plating layer and concentrated nitric acid is subsequently added to the peeling solution containing dissolved components to prepare a mixture liquid while mercury is reduced and vaporized from the mixture liquid to be quantified by an atomic absorptiometric method. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

本発明は、銅または黄銅からなる基材に、スズまたはスズ合金からなるめっき層(以下、「スズめっき層」ともいう)を形成してなる試料における前記めっき層中の水銀を定量分析する方法に関する。   The present invention is a method for quantitatively analyzing mercury in the plating layer in a sample formed by forming a plating layer made of tin or a tin alloy (hereinafter also referred to as “tin plating layer”) on a base material made of copper or brass. About.

電気機器や電子機器の電極や端子として銅や黄銅が広く使用されており、耐食性の向上や、接触抵抗の低減、挿入力の低減等の目的でスズめっき層で被覆されることが多い。しかし、スズめっき層には、水銀や鉛、カドミウム、クロム等の環境負荷物質が混入していることがあり、それらの含有量を定量する必要がある。   Copper and brass are widely used as electrodes and terminals of electrical and electronic devices, and are often coated with a tin plating layer for the purpose of improving corrosion resistance, reducing contact resistance, and reducing insertion force. However, environmental impact substances such as mercury, lead, cadmium, and chromium may be mixed in the tin plating layer, and it is necessary to quantify their contents.

従来、スズめっき層中の水銀の定量方法として、スズめっき層を切削し、切削したスズめっき層を適当な酸に溶解し、この溶液を原子吸光光度法等により水銀を定量する方法が行なわれている。しかし、ピン端子等の非常に小さい試料や、複雑な形状の試料では、スズめっき層の切削に困難を伴う。また、基材を切削することもあり、基材に水銀が含まれていると測定誤差にもなる。   Conventionally, as a method for quantifying mercury in a tin plating layer, the tin plating layer is cut, the cut tin plating layer is dissolved in an appropriate acid, and this solution is quantified by atomic absorption spectrometry or the like. ing. However, a very small sample such as a pin terminal or a sample having a complicated shape is difficult to cut the tin plating layer. In addition, the base material may be cut, and if the base material contains mercury, a measurement error also occurs.

また、「JIS K 0102−1998:工場廃水試験方法」に準拠し、試料をめっき剥離液で処理してスズめっき層を溶解した後、前記めっき剥離液に硫酸と塩化第一スズとを加えて水銀イオンを還元して水銀蒸気を発生させ、この水銀蒸気を原子吸光光度装置に導入して水銀を定量する、所謂「還元気化原子吸光光度法」も行われている。尚、この「還元気化原子吸光光度法」を応用した例として、例えば特許文献1を参照することができる。   In addition, in accordance with “JIS K 0102-1998: Factory Wastewater Test Method”, a sample was treated with a plating stripper to dissolve a tin plating layer, and then sulfuric acid and stannous chloride were added to the plating stripper. A so-called “reduction vaporization atomic absorption spectrophotometry” is also performed in which mercury ions are reduced to generate mercury vapor, and this mercury vapor is introduced into an atomic absorption spectrophotometer to quantify mercury. As an example of applying this “reduction vaporization atomic absorption spectrophotometry”, for example, Patent Document 1 can be referred to.

しかし、従来の還元気化原子吸光光度法では、硫酸と塩化第一スズを加えても還元が不十分で、水銀蒸気の発生量が実際よりも少ないことが多く、正確な水銀の定量が行なわれているとは言い難い状況にある。   However, in the conventional reduction vapor atomic absorption spectrophotometry, even if sulfuric acid and stannous chloride are added, the reduction is insufficient, and the amount of mercury vapor generated is often less than actual, and accurate mercury determination is performed. It is difficult to say that it is.

特開平6−241990号公報Japanese Patent Laid-Open No. 6-241990

本発明はこのような状況に鑑みてなされたものであり、スズめっき層を有する試料について、簡便でありながらも、スズめっき層中の水銀をより正確に定量する方法を提供することを目的とする。   The present invention has been made in view of such a situation, and an object of the present invention is to provide a method for more accurately quantifying mercury in a tin plating layer while being simple for a sample having a tin plating layer. To do.

上記課題を解決するために、請求項1に記載された発明は、銅または黄銅からなる基材に、スズまたはスズ合金からなるめっき層を形成してなる試料、もしくは金属製の基材に、銅または黄銅からなる下地層を介して、スズまたはスズ合金からなるめっき層を形成してなる試料における前記めっき層中の水銀を定量分析する方法であって、硝酸を18質量%、硝酸第二鉄を1〜10質量%の割合で含有するめっき剥離液を前記試料に接触させて前記めっき層を溶解した後、溶解分を含有する前記めっき剥離液に濃硝酸を添加して混合液とし、前記混合液から水銀を還元気化し、原子吸光光度法により水銀を定量することを特徴とするめっき層中の水銀の定量分析方法である。   In order to solve the above-mentioned problem, the invention described in claim 1 is directed to a base material made of copper or brass, a sample formed with a plating layer made of tin or a tin alloy, or a metal base material, A method for quantitatively analyzing mercury in a plating layer in a sample formed by forming a plating layer made of tin or a tin alloy through a base layer made of copper or brass, wherein 18% by mass of nitric acid, second nitric acid After contacting the sample with a plating stripping solution containing iron in a proportion of 1 to 10% by mass to dissolve the plating layer, concentrated nitric acid is added to the plating stripping solution containing dissolved components to obtain a mixed solution, It is a quantitative analysis method for mercury in a plating layer, characterized in that mercury is reduced and vaporized from the mixed solution, and mercury is quantified by atomic absorption spectrophotometry.

本発明の定量方法によれば、特定のめっき剥離液を用いることによりスズめっき層を選択的に溶解でき、また、溶解している水銀イオンをこれまでよりも多く還元して気化できることから、スズめっき層中の水銀の定量をより正確に行なうことができる。また、スズめっき層を切削する方法に比べて、簡便でもある。   According to the quantitative method of the present invention, the tin plating layer can be selectively dissolved by using a specific plating stripping solution, and moreover, the dissolved mercury ions can be reduced and vaporized more than before, so that tin Mercury in the plating layer can be quantified more accurately. Moreover, it is also convenient compared with the method of cutting a tin plating layer.

以下、本発明に関して詳細に説明する、   Hereinafter, the present invention will be described in detail.

本発明の定量方法は、基本的には従来の湿式灰化−還元気化原子吸光光度法に従う。先ず、スズめっき層を有する試料を、めっき剥離液に浸漬してスズめっき層を溶解する。このとき、試料のめっき剥離液に浸漬する前と、浸漬してスズめっき層を溶解した後の重量を測定し、めっき層の溶解重量を求めておく。   The quantitative method of the present invention basically follows the conventional wet ashing-reduction vapor atomic absorption spectrophotometry. First, a sample having a tin plating layer is immersed in a plating stripper to dissolve the tin plating layer. At this time, the weight before immersion in the plating stripping solution of the sample and after the immersion and dissolution of the tin plating layer are measured to determine the dissolution weight of the plating layer.

ここで、めっき剥離液は、基材の銅や黄銅を溶解せず、スズめっき層を選択的に溶解する作用を有することが必要であり、本発明では、硝酸を18質量%、硝酸第二鉄を1〜10質量含有するめっき剥離液を使用する。この剥離液には、その他の成分として、例えば、安定剤としてエチレングリコールモノアリルエーテル、エチレングリコールモノブチルエーテル等のグルコールエーテル類等を1〜10質量%の割合で含有してもよい。   Here, the plating stripper solution needs to have an action of selectively dissolving the tin plating layer without dissolving the copper or brass of the base material. In the present invention, 18% by mass of nitric acid and second nitric acid are used. A plating stripper containing 1 to 10 mass of iron is used. This stripper may contain other components such as glycol ethers such as ethylene glycol monoallyl ether and ethylene glycol monobutyl ether in a proportion of 1 to 10% by mass as stabilizers.

尚、測定精度を高めるためにはめっき層の溶出量が多いほど好ましいため、めっき剥離液との接触は、基材が露出するまで行なう。基材の露出は、目視により十分可能である。   In addition, since it is so preferable that there is much elution amount of a plating layer in order to raise a measurement precision, it contacts with a plating stripping solution until a base material is exposed. The substrate can be sufficiently exposed by visual inspection.

次いで、めっき層の溶解分を含有するめっき剥離液をメスフラスコに入れ、そこへ濃硝酸を添加する。濃硝酸は、市販の濃度約60%以上のものを使用する。濃硝酸を添加することにより、めっき剥離液に溶解している水銀イオンが安定化し、後述される塩化第二スズによる還元効率が高まる。これに対し、希硝酸、あるいは他の酸を添加してもこのような効果が得られない。   Next, a plating stripping solution containing the dissolved content of the plating layer is put into a measuring flask, and concentrated nitric acid is added thereto. Concentrated nitric acid has a commercially available concentration of about 60% or more. By adding concentrated nitric acid, mercury ions dissolved in the plating stripping solution are stabilized, and reduction efficiency by stannic chloride described later is increased. On the other hand, even if dilute nitric acid or other acids are added, such an effect cannot be obtained.

濃硝酸の添加量は、めっき剥離液の使用量により異なるが、めっき剥離液量に対し1〜2倍とすることが好ましく、めっき剥離液と同量であることがより好ましい。   The amount of concentrated nitric acid added varies depending on the amount of plating stripping solution used, but is preferably 1 to 2 times the amount of plating stripping solution, and more preferably the same amount as the plating stripping solution.

次いで、スズめっき層の溶解分を含有するめっき剥離液と濃硝酸との混合液をバブラー容器に入れ、還元剤である塩化第1スズを添加する。塩化第一スズは、濃度10%程度の水溶液を添加する。同時に硫酸50%水溶液も添加する。この塩化第一スズ水溶液により、前記混合液中に溶解している水銀イオンが還元され、水銀蒸気として気化する。   Next, a mixed solution of the plating stripping solution containing the dissolved content of the tin plating layer and concentrated nitric acid is put into a bubbler container, and stannous chloride as a reducing agent is added. For stannous chloride, an aqueous solution having a concentration of about 10% is added. At the same time, a 50% aqueous solution of sulfuric acid is also added. The stannous chloride aqueous solution reduces mercury ions dissolved in the mixed solution and vaporizes it as mercury vapor.

バブラー容器には原子吸光分析装置が連結しており、上記で発生した水銀蒸気を原子吸光セルに導入して水銀量を定量する。   An atomic absorption analyzer is connected to the bubbler container, and the mercury vapor generated above is introduced into the atomic absorption cell to quantify the amount of mercury.

(実施例1)
黄銅製基材に銅下地めっき、スズめっき層を形成した試料を、メルテックス株式会社製めっき剥離液「メルストリップTL−3400(硝酸18質量%、硝酸第二鉄1〜10質量、安定剤1〜10質量%、残部純水)」3mlに浸漬した。黄銅製基材が露出した時点で試料を取り出した。浸漬前との重量差から、スズめっき層の溶解重量は45.12mgであった。
Example 1
A sample in which a copper base plating and a tin plating layer were formed on a brass substrate was used as a plating stripping solution “Melstrip TL-3400 (18% by mass of nitric acid, 1 to 10% of ferric nitrate, stabilizer 1) manufactured by Meltex Co., Ltd. 10 mass%, remaining pure water) ”was immersed in 3 ml. The sample was taken out when the brass substrate was exposed. From the weight difference from before immersion, the dissolution weight of the tin plating layer was 45.12 mg.

次いで、スズめっき層を溶解した後のめっき剥離液をメスフラスコに入れ、そこへ濃度約60%の濃硝酸を3ml添加した。   Next, the plating stripping solution after dissolving the tin plating layer was put into a measuring flask, and 3 ml of concentrated nitric acid having a concentration of about 60% was added thereto.

次いで、バブラー容器に10%塩化第一スズ水溶液及び硫酸50%水溶液を滴下し、水銀蒸気を発生させ、原子吸光分析装置に導入して水銀量を定量した。   Next, a 10% stannous chloride aqueous solution and a 50% sulfuric acid aqueous solution were dropped into a bubbler container to generate mercury vapor, which was introduced into an atomic absorption spectrometer and the amount of mercury was quantified.

上記の測定を3回行ったところ、スズめっき層中の水銀量は平均で0.208267ppmであった。   When the above measurement was performed three times, the mercury content in the tin plating layer was 0.208267 ppm on average.

(比較例1)
実施例1と同一の試料を、メルテックス株式会社製めっき剥離液「メルストリップTL−3400」に浸漬した。黄銅製基材が露出した時点で試料を取り出し、浸漬前との重量差を求めたところ、スズめっき層の溶解重量は52.44mgであった。
(Comparative Example 1)
The same sample as Example 1 was immersed in a plating stripper “Melstrip TL-3400” manufactured by Meltex Co., Ltd. When the brass substrate was exposed, the sample was taken out and the weight difference from that before immersion was determined. As a result, the dissolved weight of the tin plating layer was 52.44 mg.

そして、濃硝酸に代えて、濃度約30%の希硝酸3mlを用い、その他は実施例1と同様にして水銀量を定量したところ、スズめっき層中の水銀量は平均で0.131770ppmであった。   Then, instead of concentrated nitric acid, 3 ml of dilute nitric acid having a concentration of about 30% was used, and the amount of mercury was quantified in the same manner as in Example 1. The average amount of mercury in the tin plating layer was 0.131770 ppm. It was.

(比較例2)
実施例1と同一の試料を、メルテックス株式会社製めっき剥離液「メルストリップTL−3400」に浸漬した。黄銅製基材が露出した時点で試料を取り出し、浸漬前との重量差を求めたところ、スズめっき層の溶解重量は48.35mgであった。
(Comparative Example 2)
The same sample as Example 1 was immersed in a plating stripper “Melstrip TL-3400” manufactured by Meltex Co., Ltd. When the brass base material was exposed, the sample was taken out and the weight difference from before immersion was determined. As a result, the dissolution weight of the tin plating layer was 48.35 mg.

そして、スズめっき層を溶解した後のめっき剥離液を原子吸光分析装置にて分析して水銀量を定量したところ、スズめっき層中の水銀量は平均で0.150503ppmであった。   And when the plating stripping solution after melt | dissolving a tin plating layer was analyzed with the atomic absorption spectrometer and the amount of mercury was quantified, the amount of mercury in a tin plating layer was 0.150503 ppm on the average.

(比較例3)
実施例1と同一の試料からスズめっき層を切削した。切削虜は36.58mgであった。
(Comparative Example 3)
A tin plating layer was cut from the same sample as in Example 1. The prisoner of cutting was 36.58 mg.

そして、切削したスズめっき層を硝酸と塩酸との混酸に溶解し、原子吸光分析装置にて分析して水銀量を定量したところ、スズめっき層中の水銀量は平均で0.211900ppmであった。   And the cutting | disconnection tin plating layer was melt | dissolved in the mixed acid of nitric acid and hydrochloric acid, and when the amount of mercury was quantified by analyzing with an atomic absorption analyzer, the amount of mercury in a tin plating layer was 0.211900 ppm on the average .

このように、本発明によれば、めっき層を切削する方法と同等の分析精度が得られる、   Thus, according to the present invention, analysis accuracy equivalent to the method of cutting the plating layer can be obtained.

(参考例1)
実施例1において、濃硝酸の添加量を変えて同様の測定を行なった。結果を図1に示すが、濃硝酸をめっき剥離液の使用量と同じ3ml添加したときに定量値が最大になっているのがわかる。
(Reference Example 1)
In Example 1, the same measurement was performed by changing the amount of concentrated nitric acid added. The results are shown in FIG. 1, and it can be seen that the quantitative value is maximized when 3 ml of concentrated nitric acid is added in the same amount as the plating stripping solution.

濃硝酸の添加量と定量値との関係を示すグラフである。It is a graph which shows the relationship between the addition amount of concentrated nitric acid, and a fixed value.

Claims (1)

銅または黄銅からなる基材に、スズまたはスズ合金からなるめっき層を形成してなる試料、もしくは金属製の基材に、銅または黄銅からなる下地層を介して、スズまたはスズ合金からなるめっき層を形成してなる試料における前記めっき層中の水銀を定量分析する方法であって、
硝酸を18質量%、硝酸第二鉄を1〜10質量%の割合で含有するめっき剥離液を前記試料に接触させて前記めっき層を溶解した後、溶解分を含有する前記めっき剥離液に濃硝酸を添加して混合液とし、前記混合液から水銀を還元気化し、原子吸光光度法により水銀を定量することを特徴とするめっき層中の水銀の定量分析方法。
Sample made by forming a plating layer made of tin or tin alloy on a substrate made of copper or brass, or plating made of tin or tin alloy on a metal substrate through an underlayer made of copper or brass A method of quantitatively analyzing mercury in the plating layer in a sample formed with a layer,
A plating stripping solution containing 18% by mass of nitric acid and ferric nitrate in a proportion of 1 to 10% by mass is brought into contact with the sample to dissolve the plating layer, and then concentrated in the plating stripping solution containing dissolved components. A method for quantitative analysis of mercury in a plating layer, wherein nitric acid is added to form a mixed solution, mercury is reduced and vaporized from the mixed solution, and mercury is quantified by atomic absorption spectrophotometry.
JP2007177153A 2007-07-05 2007-07-05 Method of quantitatively analyzing mercury in tin or tin alloy plating layer Abandoned JP2009014525A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007177153A JP2009014525A (en) 2007-07-05 2007-07-05 Method of quantitatively analyzing mercury in tin or tin alloy plating layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007177153A JP2009014525A (en) 2007-07-05 2007-07-05 Method of quantitatively analyzing mercury in tin or tin alloy plating layer

Publications (1)

Publication Number Publication Date
JP2009014525A true JP2009014525A (en) 2009-01-22

Family

ID=40355608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007177153A Abandoned JP2009014525A (en) 2007-07-05 2007-07-05 Method of quantitatively analyzing mercury in tin or tin alloy plating layer

Country Status (1)

Country Link
JP (1) JP2009014525A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0610162A (en) * 1992-03-04 1994-01-18 Macdermid Inc Composition and method for peeling tin or tin-lead alloy from copper surface
JPH06241990A (en) * 1993-02-19 1994-09-02 Sansou Seisakusho:Kk Method and device for measuring small amount of mercury
JP2002082110A (en) * 2000-09-08 2002-03-22 Central Res Inst Of Electric Power Ind Method and device for continuously fractionating and analyzing metallic mercury, and water-soluble mercury in gas
JP2002207032A (en) * 2001-01-10 2002-07-26 Ebara Corp Method for determining optimum ratio of addition of heavy metal elution inhibitor to burned fly ash and method for treating burned fly ash
JP2005134141A (en) * 2003-10-28 2005-05-26 Jfe Steel Kk Method for quantifying mercury in steel sheet coated with zinc-based material and pretreatment apparatus used for quantification
JP2005283508A (en) * 2004-03-30 2005-10-13 Miyagi Prefecture Pretreatment method for organic substance analysis, method for analyzing heavy metal in organic substance, reaction vessel and batch-type hydrothermal decomposition system
JP2006098400A (en) * 2004-08-31 2006-04-13 Nippon Instrument Kk Reduced evaporated mercury measuring device with automatic pretreatment mechanism
JP2006165196A (en) * 2004-12-06 2006-06-22 Internatl Business Mach Corp <Ibm> Laminated wiring board and its manufacturing method
JP2008286672A (en) * 2007-05-18 2008-11-27 Yazaki Corp Quantitative analytical method for tin or tin alloy plated layer

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0610162A (en) * 1992-03-04 1994-01-18 Macdermid Inc Composition and method for peeling tin or tin-lead alloy from copper surface
JPH06241990A (en) * 1993-02-19 1994-09-02 Sansou Seisakusho:Kk Method and device for measuring small amount of mercury
JP2002082110A (en) * 2000-09-08 2002-03-22 Central Res Inst Of Electric Power Ind Method and device for continuously fractionating and analyzing metallic mercury, and water-soluble mercury in gas
JP2002207032A (en) * 2001-01-10 2002-07-26 Ebara Corp Method for determining optimum ratio of addition of heavy metal elution inhibitor to burned fly ash and method for treating burned fly ash
JP2005134141A (en) * 2003-10-28 2005-05-26 Jfe Steel Kk Method for quantifying mercury in steel sheet coated with zinc-based material and pretreatment apparatus used for quantification
JP2005283508A (en) * 2004-03-30 2005-10-13 Miyagi Prefecture Pretreatment method for organic substance analysis, method for analyzing heavy metal in organic substance, reaction vessel and batch-type hydrothermal decomposition system
JP2006098400A (en) * 2004-08-31 2006-04-13 Nippon Instrument Kk Reduced evaporated mercury measuring device with automatic pretreatment mechanism
JP2006165196A (en) * 2004-12-06 2006-06-22 Internatl Business Mach Corp <Ibm> Laminated wiring board and its manufacturing method
JP2008286672A (en) * 2007-05-18 2008-11-27 Yazaki Corp Quantitative analytical method for tin or tin alloy plated layer

Similar Documents

Publication Publication Date Title
Rossrucker et al. The pH dependence of magnesium dissolution and hydrogen evolution during anodic polarization
Mohadesi et al. Stripping voltammetric determination of silver (I) at carbon paste electrode modified with 3-amino-2-mercapto quinazolin-4 (3H)-one
Romih et al. Bismuth film electrode for anodic stripping voltammetric measurement of silver nanoparticle dissolution
JP5305498B2 (en) Quantitative analysis method for nickel or nickel alloy plating layer
JP6416807B2 (en) Silicon quantitative analysis method
Kim et al. Effects of the functional groups of complexing agents and Cu oxide formation on Cu dissolution behaviors in Cu CMP process
Chiu et al. Sensitivity enhancement for quantitative electrochemical determination of a trace amount of accelerator in copper plating solutions
Jaklova Dytrtova et al. Electrochemical and spectrometric detection of low-molecular-weight organic acids and their complexes with metals
Volov et al. Interaction between SPS and MPS in the presence of ferrous and ferric ions
JP4773399B2 (en) Quantitative analysis method for tin or tin alloy plating layer
Jotanović et al. Comparison of x-ray fluorescent analysis and cupellation method for determination of gold in gold jewellery alloy
Tashdjian et al. Preparation of Silver Nanoparticles‐Based Sensors for the Electrochemical Detection of Thiourea in Leaching Solutions of Waste Electrical and Electronic Equipment
JP4185066B2 (en) Sample pretreatment method and method for measuring mercury content in sample
JP2009014525A (en) Method of quantitatively analyzing mercury in tin or tin alloy plating layer
JP4358172B2 (en) Solder material analysis method
JP4200151B2 (en) Defect detection method for electrolytic solution and inspection object
JP2010256215A (en) Stripper and quantitative analysis method for tin or tin alloy plated layer
JP2008224423A (en) Plating film separation method and analysis method of plating film separated thereby
JP2007240451A (en) Quantification method of iron
JP7056498B2 (en) Method for quantifying amide sulfuric acid
CN103308654A (en) Solution and testing method for testing moisture content in photoresistance peeling liquid
Pérez‐Ràfols et al. Mercury Films on Commercial Carbon Screen‐Printed Devices for the Analysis of Heavy Metal Ions: a Critical Evaluation
JP4424831B2 (en) Sample concentration method for measuring trace metals in liquids
KR102218457B1 (en) Liquefaction reagent composition for plating layer of nickel plated steel sheet, and analyzing method of plating layer of nickel plated steel sheet using thereof
Finšgar Tandem GCIB-ToF-SIMS and GCIB-XPS analyses of the 2-mercaptobenzothiazole on brass

Legal Events

Date Code Title Description
A621 Written request for application examination

Effective date: 20100531

Free format text: JAPANESE INTERMEDIATE CODE: A621

A977 Report on retrieval

Effective date: 20111124

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111129

A762 Written abandonment of application

Effective date: 20111213

Free format text: JAPANESE INTERMEDIATE CODE: A762

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111206

A072 Dismissal of procedure

Effective date: 20120522

Free format text: JAPANESE INTERMEDIATE CODE: A072