JP2009009683A - Optical head device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical head device satisfactorily performing the heat dissipation from a holder to a frame and preventing a residual stress from being generated between the holder and the frame, and to provide a manufacturing method thereof. <P>SOLUTION: The optical head device comprises a metallic holder 15 to which a laser light source device 22 is fixed, and a device frame 11 mounted with the holder 15 and optical elements disposed in the light path from the laser light source device 22 to an optical recording disc or in the light path from the optical recording disc to a light receiving element for detecting a signal. The device frame 11 is made of metal, and the device frame 11 and the holder 15 are fixed to each other through an anaerobic adhesive 60. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical head device that performs at least one of reproduction and recording of an optical recording medium such as a CD (Compact Disk) or a DVD (Digital Versatile Disk), and a method of manufacturing the same.

Conventionally, there is known an optical head device in which a metal holder to which a laser diode is fixed is mounted on a metal frame. In the conventional optical head device, the holder is two-dimensionally adjusted in the plane direction on the frame and then fixed (see, for example, Patent Document 1). The plane direction is a direction orthogonal to the direction in which the holder faces the frame.
JP 2006-302415 A

  As described above, there is an optical head device in which reproduction or recording is not performed as designed in the optical head device in which the holder is slid on the frame to perform the two-dimensional adjustment. When the optical head device that was not reproduced or recorded as designed was re-inspected, it was found that the optical axis was displaced in the plane direction regardless of the two-dimensional adjustment in the plane direction. If the frame and holder are adjusted three-dimensionally, the optical axis shifts due to the temperature change due to the linear expansion of the adhesive interposed between the frame and the holder, and reproduction or recording is not performed as designed. However, in this case, no adhesive is interposed between the holder and the frame, and the influence of the linear expansion of the adhesive due to temperature is not considered. Therefore, the inventors of the present application have further clarified the cause, and the cause of the deviation of the optical axis despite the two-dimensional adjustment is that the holder and the holder are used to dissipate the heat generated from the laser diode to the frame. I found out that the frame was made of metal. That is, when the holder and the frame are made of metal, residual stress is generated when the holder is slid on the frame for two-dimensional adjustment, and the residual stress is caused when the holder and the frame are made of resin. Since it is comparatively large, after the holder is fixed to the frame, the fixing positions of both are shifted, and as a result, the optical axis shifts.

  Accordingly, the present invention provides an optical head device that can sufficiently radiate heat from the holder to the frame and that can also prevent residual stress from being generated between the holder and the frame, and a method for manufacturing the same. With the goal.

  An optical head device according to the present invention includes a metal holder to which a light emitting element or a light receiving element for signal detection is fixed, an optical path on which the holder is mounted and from the light emitting element to the optical recording disk, or from the optical recording disk An optical head device having an apparatus frame on which an optical element disposed in an optical path toward a signal detection light-receiving element is mounted. The apparatus frame is made of metal, and the apparatus frame and the holder are anaerobic. It is fixed through an adhesive.

  With this configuration, in the optical head device of the present invention, the gap between the holder and the apparatus frame is a gap that allows an anaerobic adhesive to intervene, and is sufficient to radiate heat from the holder to the apparatus frame. Therefore, heat can be sufficiently radiated from the holder to the device frame. In the optical head device of the present invention, there is a gap that allows an anaerobic adhesive to intervene between the holder and the apparatus frame, and a sufficient gap is not generated between the holder and the apparatus frame. Therefore, it is possible to prevent the residual stress from being generated between the holder and the apparatus frame.

  The light emitting element is preferably fixed to the metal holder of the optical head device of the present invention.

  Since the light emitting element generates a large amount of heat, it is important that the holder and the apparatus frame are made of metal from the viewpoint of heat dissipation.

  Moreover, it is preferable that the separation distance between the device frame and the holder fixed via the anaerobic adhesive of the optical head device of the present invention is 100 μm or less.

  In the method of manufacturing an optical head device according to the present invention, the device frame and the holder are held by a jig while being separated by a gap for applying the anaerobic adhesive, and are relatively moved in a plane direction. After the position is adjusted by this, the anaerobic adhesive is applied to the gap.

  With this configuration, the manufacturing method of the optical head device of the present invention applies the anaerobic adhesive to the gap after adjusting the position of the device frame and the holder. Unlike the case of adjusting the position of the device, the anaerobic adhesive dripped during the adjustment of the position of the device frame and the holder and the optical element is soiled, and the anaerobic adhesive during the adjustment of the position of the device frame and the holder It is possible to prevent a problem that the position is not adjusted due to curing.

  The method of manufacturing an optical head device according to the present invention is characterized in that the position of the device frame and the holder is adjusted by relatively moving the device frame and the holder in a planar direction in a state where the anaerobic adhesive is applied. To do.

  With this configuration, the manufacturing method of the optical head device of the present invention adjusts the position of the apparatus frame and the holder after applying the anaerobic adhesive, so that the gap is anaerobic after the adjustment of the position of the apparatus frame and the holder. Unlike the case where the adhesive is applied, the application of the anaerobic adhesive can be facilitated.

  According to the present invention, it is possible to provide an optical head device that can sufficiently radiate heat from the holder to the frame, and that can prevent residual stress from being generated between the holder and the frame, and a method for manufacturing the same. Can do.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  First, the configuration of the optical head device according to the present embodiment will be described.

  FIG. 1 is a perspective view of an optical head device 10 according to the present embodiment. FIG. 2 is an exploded perspective view of the optical head device 10. FIG. 3 is a perspective view of the optical head device 10 with some components removed.

  As shown in FIGS. 1 to 3, the optical head device 10 according to the present embodiment is illustrated using a DVD laser beam having a wavelength of 650 nm and a CD laser beam having a wavelength of 780 nm. This is a two-wavelength optical head device capable of recording and reproducing information with respect to an optical recording disk such as a CD disk or a DVD disk not shown.

  The optical head device 10 includes a metal device frame 11 made of a die-cast product such as magnesium or zinc, metal covers 12 and 13 covering various components mounted on the device frame 11, and laser light having a wavelength of 650 nm. A laser light source device 21 as a light emitting element including an emitting AlGaInP semiconductor laser, a laser light source device 22 as a light emitting element including an AlGaAs semiconductor laser emitting a laser beam having a wavelength of 780 nm, and a laser light source A light receiving element for monitoring 23 for receiving the laser light emitted by the device 21 and the laser light source device 22, and a light receiving element for signal detection (PDIC) for receiving the laser light reflected by the recording surface of the optical recording disk. 24 and a driving IC (Integre) for driving the laser light source device 21 and the laser light source device 22. and an optical system 30 having an objective lens 31 for converging the laser light emitted by the laser light source device 21 and the laser light source device 22 onto the recording surface of the optical recording disk, and an apparatus frame. 11, an objective lens driving mechanism 40 for servo-controlling the position of the objective lens 31 in the tracking direction and the focusing direction, a laser light source device 21, a laser light source device 22, a monitor light receiving element 23, and a signal detecting light receiving element 24, a driving circuit 25 and a flexible circuit board 50 as a circuit board electrically connected to the objective lens driving mechanism 40.

  The apparatus frame 11 includes a bearing 11a and a bearing 11b that engage with a guide shaft and a feed screw shaft (not shown) for driving an optical recording disk, a positioning projection 11c for the metal cover 12, and a metal cover 12. And a claw 11d for fastening the head.

  The metal cover 12 includes a hole 12 a that fits into the protrusion 11 c of the device frame 11 and a groove 12 b that engages with the claw 11 d of the device frame 11.

  The metal cover 13 has a hole 13 a through which the laser light emitted from the objective lens 31 passes and covers the objective lens driving mechanism 40.

  The laser light source device 21, the laser light source device 22, the monitor light receiving element 23 and the signal detecting light receiving element 24 are mounted on the apparatus frame 11 and covered with a metal cover 12.

  The laser light source device 21 is fixed to a metal holder 14 made of zinc die cast, and the holder 14 is mounted on the device frame 11.

  The laser light source device 22 is fixed to a metal holder 15 made of zinc die cast, and the holder 15 is mounted on the device frame 11.

  The signal detection light-receiving element 24 is fixed to a metal holder 16 made of aluminum, and the holder 16 is mounted on the apparatus frame 11.

  The driving IC 25 is mounted on the flexible circuit board 50.

  FIG. 4 is a perspective view of the vicinity of the laser light source device 22 of the optical head device 10.

  As shown in FIG. 4, the apparatus frame 11 and the holder 15 are separated by a gap 15a, and are fixed via an ultraviolet curing imparting anaerobic adhesive 60 applied to the gap 15a. In addition, since the anaerobic adhesive 60 functions, the gap 15a has a size up to about 100 μm, preferably up to about 50 μm. In addition, although the apparatus frame 11 and the holder 15 were demonstrated, the clearance gap is similarly provided between the apparatus frame 11 and the holder 14, and between the apparatus frame 11 and the holder 16, and an ultraviolet curing provision type anaerobic type is also provided. It is fixed with adhesive.

  As shown in FIGS. 1 to 3, the optical system 30 includes an optical path combining polarizing prism 32 that transmits the laser light emitted from the laser light source device 21 and reflects the laser light emitted from the laser light source device 22. The diffraction element 33 is disposed between the laser light source device 21 and the polarizing prism 32 and the half-wave plate is integrally formed, and the diffraction element 34 and the relay are disposed between the laser light source device 22 and the polarizing prism 32. The lens 35 is disposed between the monitor light receiving element 23 and the polarizing prism 32 and partially reflects the laser light emitted from the polarizing prism 32, and between the signal detecting light receiving element 24 and the half mirror 36. A sensor lens (not shown) for providing astigmatism to the laser light that is arranged and incident on the signal detection light-receiving element 24; A quarter-wave plate 37 that produces a quarter-wave phase difference in the laser light that is emitted and reflected by the half mirror 36, and a collimator lens 38 that collimates the laser light transmitted through the quarter-wave plate 37. And a raising mirror 39 that raises the laser beam made parallel by the collimating lens 38 toward the optical recording disk.

  The polarizing prism 32, the diffractive element 33, the diffractive element 34, the relay lens 35, the half mirror 36, the sensor lens, the ¼ wavelength plate 37, the collimating lens 38 and the rising mirror 39 are mounted on the apparatus frame 11. The polarizing prism 32, the diffraction element 33, the diffraction element 34, the relay lens 35, the half mirror 36, and the quarter wavelength plate 37 are covered with the metal cover 12. The collimating lens 38 and the raising mirror 39 are covered with an objective lens driving mechanism 40.

  The objective lens drive mechanism 40 includes a yoke 41 fixed to the apparatus frame 11, a drive magnet 42 attached to the yoke 41, a lens holder 43 that holds the objective lens 31, and a drive magnet 42 attached to the lens holder 43. And a drive coil (not shown) constituting the magnetic drive circuit, a plurality of wires 44 connected to the lens holder 43, and the lens holder 43 fixed to the yoke 41 via the wires 44 in the tracking direction and the focusing direction. And a holder support 45 that is movably supported. Note that the objective lens driving mechanism 40 can also perform tilt control for adjusting the tilt of the objective lens 31 in the jitter direction.

  FIG. 5 is a top view of the main board 52 of the flexible circuit board 50 of the optical head device 10 before being three-dimensionalized. FIG. 6A is a perspective view of a part of the flexible circuit board 50 of the optical head device 10 as viewed from the upper surface side. FIG. 6B is a perspective view of a part of the flexible circuit board 50 of the optical head device 10 as viewed from the bottom surface side.

  5 and 6, the flexible circuit board 50 is electrically connected to the laser light source device 21 (see FIG. 2), the end 50a, and the laser light source device 22 (see FIG. 2). End 50b connected electrically, end 50c electrically connected to monitor light receiving element 23 (see FIG. 2), and electrically connected to signal detecting light receiving element 24 (see FIG. 2). And an end 50f (see FIG. 2) electrically connected to the objective lens driving mechanism 40 (see FIG. 2). It is partially bent and mounted three-dimensionally on the apparatus frame 11 (see FIG. 2) and covered with a metal cover 12 (see FIG. 2). The flexible circuit board 50 includes a sub-board 51 that is a flexible circuit board having end portions 50a and 50b, an end portion 50c, an end portion 50d, and a mounting portion 50e, and is electrically connected to the sub-board 51. A main board 52 which is a flexible circuit board, and a sub board 53 (see FIG. 2) which is a flexible circuit board having an end portion 50f and electrically connected to the main board 52.

  Next, a method of fixing the device frame 11 and the various holders 14, 15, 16 will be described.

  First, the holder 14 to which the laser light source device 21 is fixed is adhered and fixed to the device frame 11 with an anaerobic adhesive while confirming the optical axis and light amount distribution of the DVD laser light source device 21 with a CCD camera (step S101). .

  Next, the holder 16 and the apparatus frame 11 are each supported by a jig in a state where the holder 16 and the apparatus frame 11 are separated by a gap for applying anaerobic adhesive, for example, 50 μm, and the laser light source apparatus 21 fixed to the apparatus frame 11 is supported. Then, the position of the holder 16 for the signal detection light receiving element 24 in the plane direction is adjusted (step S111). Then, an ultraviolet curable adhesive is applied only to both ends in the direction perpendicular to the thickness direction of the device frame 11 in the planar direction, outside the gap between the holder 16 and the device frame 11, and the ultraviolet rays are irradiated to irradiate the ultraviolet rays. The curable adhesive is cured (step S112). After the ultraviolet curable adhesive is cured, the jig for fixing the holder 16 and the apparatus frame 11 is removed (step S113). Then, after applying an ultraviolet curing imparting type anaerobic adhesive to the gap between the holder 16 and the apparatus frame 11, the process waits until the anaerobic adhesive is cured by irradiating ultraviolet rays (step S114).

  Next, the holder 15 and the apparatus frame 11 are supported by jigs in a state where the holder 15 and the apparatus frame 11 are separated by a gap 15 a for applying the anaerobic adhesive 60, for example, 50 μm, and are fixed to the holder 16 fixed to the apparatus frame 11. The position of the holder 15 to which the laser light source device 22 for CD is fixed in the plane direction is adjusted (step S121). Then, as shown in FIG. 4, an ultraviolet curable adhesive 61 is applied only to both ends in the plane direction outside the gap 15 a between the holder 15 and the apparatus frame 11, and ultraviolet rays are irradiated to irradiate the ultraviolet curable adhesive. The agent 61 is cured (step S122). After the ultraviolet curable adhesive 61 is cured, the jig that fixes the holder 15 and the apparatus frame 11 is removed (step S123). And after apply | coating the ultraviolet curing provision type anaerobic adhesive 60 to the clearance gap 15a of the holder 15 and the apparatus flame | frame 11, it waits until anaerobic adhesive 60 hardens | cures by irradiating an ultraviolet-ray (step S124).

  Finally, an annealing process is performed at 60 ° C. for 1 hour (step S131).

  The fixing method of the apparatus frame 11 and the holder 14 may be the same fixing method as the fixing method of the apparatus frame 11 and the holder 15 or the fixing method of the apparatus frame 11 and the holder 16.

  The anaerobic adhesive used in this embodiment is an ultraviolet curing imparting type, and a portion near the boundary is cured by irradiation with ultraviolet rays, so that the inside of the boundary is shielded from oxygen. The curing time can be shortened compared to an anaerobic adhesive that is not an ultraviolet curing imparting type. In addition, the anaerobic adhesive used in the present embodiment is an ultraviolet curing imparting type, and a portion near the boundary is cured by irradiation with ultraviolet rays, so the viscosity of the anaerobic adhesive before curing is Even if it is low, it is possible to prevent the anaerobic adhesive from leaking out of the gap between the holder and the apparatus frame 11. Of course, the anaerobic adhesive used in the present embodiment may not be an ultraviolet curing imparting type.

(Experimental result)
First, the experimental procedure will be described.

  The experimental procedure is the same as the procedure from step S101 to step S131 described above. In addition, an experiment in which the gap between the holder 16 and the apparatus frame 11 in step S111 and the gap 15a between the holder 15 and the apparatus frame 11 in step S121 are both approximately 0 μm, and the gap between the holder 16 and the apparatus frame 11 in step S111, Two types of experiments were conducted, including an experiment in which the gap 15a between the holder 15 and the apparatus frame 11 in step S121 is 100 μm.

  FIGS. 7A and 7B are graphs showing changes in the optical axis of the DVD laser light source device 21 when the clearance between the holder 16 and the device frame 11 is approximately 0 μm for 10 products. 4 is a graph showing the optical axis change in the thickness direction of the device frame 11 and in the direction orthogonal to the thickness direction, respectively. FIGS. 8A and 8B are graphs showing changes in the optical axis of the laser light source device 21 for DVD when the gap between the holder 16 and the device frame 11 is 100 μm for five products. 3 is a graph showing changes in the optical axis in the thickness direction of the device frame 11 and in the direction orthogonal to the thickness direction.

  Changes in the optical axis of the laser light source device 21 shown in FIGS. 7 and 8 are detected by the light receiving element 24 for signal detection. Specifically, FIGS. 7 and 8 are graphs showing changes in the position of the holder 16 with respect to the apparatus frame 11 as changes in the optical axis of the laser light source device 21 by causing the laser light source device 21 to emit light.

  FIG. 9 is an explanatory diagram of PX and PY shown in FIG. 7 and FIG.

PX is a value indicating the position of the optical axis in the thickness direction of the apparatus frame 11 in the plane direction. PY is a value indicating the position of the optical axis in the direction perpendicular to the thickness direction of the apparatus frame 11 in the planar direction. As shown in FIG. 9, the light receiving region 91 of the signal detecting light receiving element 24 is divided into four regions 91a, 91b, 91c, and 91d, and the lasers detected by the regions 91a, 91b, 91c, and 91d are detected. Assuming that the light quantity of the light 92 is a light quantity A, a light quantity B, a light quantity C, and a light quantity D, respectively, PX and PY are represented by the following “Equation 1” and “Equation 2”.

  Each process in FIGS. 7 and 8 corresponds to step S111, step S113, and step S114 described above. That is, step S111 corresponds to a process after jig fixing, step S113 corresponds to a process after jig removal, and step 114 corresponds to a process after anaerobic adhesive curing. When the gap between the holder 16 shown in FIG. 8 and the apparatus frame 11 is 100 μm, compared to the case where the gap between the holder 16 shown in FIG. 7 and the apparatus frame 11 is approximately 0 μm, There is little change in the optical axis of the laser light source device 21 from the state in which the device frame 11 is fixed with a jig until the anaerobic adhesive is cured, that is, the change in the position of the holder 16 with respect to the device frame 11, and variations among products. There are few. In particular, there is little change in the position of the holder 16 relative to the apparatus frame 11 when the jig that fixes the holder 16 and the apparatus frame 11 is removed after the UV curable adhesive is cured, and there is also variation between products. Few.

  FIGS. 10A and 10B are graphs showing changes in the optical axis of the CD laser light source device 22 when the clearance 15a between the holder 15 and the device frame 11 is approximately 0 μm for 10 products. 6 is a graph showing changes in the optical axis in the thickness direction of the device frame 11 and in the direction orthogonal to the thickness direction. FIGS. 11A and 11B are graphs showing changes in the optical axis of the CD laser light source device 22 when the gap 15a between the holder 15 and the device frame 11 is 100 μm for five products. 4 is a graph showing changes in the optical axis in the thickness direction of the device frame 11 and in the direction orthogonal to the thickness direction, respectively.

  Changes in the optical axis of the laser light source device 22 shown in FIGS. 10 and 11 are detected by the signal detection light receiving element 24. More specifically, FIGS. 10 and 11 are graphs showing changes in the position of the holder 15 relative to the apparatus frame 11 as changes in the optical axis of the laser light source device 22 by causing the laser light source device 22 to emit light.

  Each step in FIGS. 10 and 11 corresponds to step S121, step S123, step S124, and step S131 described above. That is, step S121 corresponds to the process after jig fixing, step S123 corresponds to the process after jig removal, step 124 corresponds to the process after anaerobic adhesive curing, and step S131 is the process after annealing. It corresponds to. When the gap 15a between the holder 15 shown in FIG. 11 and the apparatus frame 11 is 100 μm, the holder 15 is compared with the case where the gap 15a between the holder 15 shown in FIG. 10 and the apparatus frame 11 is approximately 0 μm. And the change of the optical axis of the laser light source device 22 from the state in which the apparatus frame 11 is fixed by the jig to the end of the annealing process, that is, the change of the position of the holder 15 with respect to the apparatus frame 11 is small, and the variation among products. There are few. In particular, after the UV curable adhesive 61 is cured, there is little change in the position of the holder 15 with respect to the apparatus frame 11 when the jig for fixing the holder 15 and the apparatus frame 11 is removed, and the variation among products. There are few.

  The ultraviolet curable adhesive described above is an acrylic adhesive having a viscosity of 10,000 mPa · S or more, and the same adhesive is used in all experiments. Similarly, the above-mentioned anaerobic adhesive is an acrylic adhesive having a viscosity of 1,000 mPa · S or less, and the same adhesive is used in all experiments.

  As described above, in the optical head device 10, the gap 15 a between the holder 15 and the apparatus frame 11 is the gap 15 a to which the anaerobic adhesive 60 can be interposed, and heat is radiated from the holder 15 to the apparatus frame 11. For this purpose, the gap 15a is sufficient, so that the heat radiation from the holder 15 to the apparatus frame 11 can be sufficiently performed. Further, since the optical head device 10 has a gap 15a between the holder 15 and the device frame 11 so that the anaerobic adhesive 60 can be interposed therebetween, no residual stress is generated between the holder 15 and the device frame 11. Since the gap 15a is sufficient, it is possible to prevent a residual stress from being generated between the holder 15 and the apparatus frame 11. Although the device frame 11 and the holder 15 have been described, the same applies to the space between the device frame 11 and the holder 14 and between the device frame 11 and the holder 16.

  Since the laser light source device 21 and the laser light source device 22 generate a large amount of heat, it is important that the holders 14 and 15 and the device frame 11 are metal from the viewpoint of heat dissipation. Of course, since the light receiving element 24 for signal detection also generates heat, it is effective that the holder 16 is made of metal.

  Further, since the optical head device 10 applies the anaerobic adhesive 60 to the gap 15 a after adjusting the position of the device frame 11 and the holder 15, the device frame 11, the holder 15, and the anaerobic adhesive 60 are applied. Unlike the case where the position of the apparatus frame 11 is adjusted, there is a problem that the anaerobic adhesive 60 hangs down during the adjustment of the position of the apparatus frame 11 and the holder 15, and the optical element is soiled, or the position of the apparatus frame 11 and the holder 15 is being adjusted. In addition, it is possible to prevent a problem that the anaerobic adhesive 60 is cured and the position cannot be adjusted. Of course, the optical head device 10 may be manufactured by adjusting the positions of the device frame 11 and the holder 15 after applying the anaerobic adhesive 60. When the optical head device 10 adjusts the position of the apparatus frame 11 and the holder 15 after applying the anaerobic adhesive 60, the anaerobic adhesive 60 is placed in the gap 15 a after adjusting the position of the apparatus frame 11 and the holder 15. Unlike the case of applying the adhesive, the application of the anaerobic adhesive 60 can be facilitated. Although the fixing method of the apparatus frame 11 and the holder 15 was demonstrated, the fixing method of the apparatus frame 11 and the holder 14 and the fixing method of the apparatus frame 11 and the holder 16 are also the same.

1 is a perspective view of an optical head device according to an embodiment of the present invention. It is a disassembled perspective view of the optical head apparatus shown in FIG. FIG. 2 is a perspective view of the optical head device shown in FIG. 1 with some components removed. It is a perspective view of the vicinity of the laser light source apparatus of the optical head apparatus shown in FIG. It is a top view of the main board | substrate of the flexible circuit board of the optical head apparatus shown in FIG. 1, Comprising: It is the figure before making it three-dimensional. (A) It is the one part perspective view of the flexible circuit board of the optical head apparatus shown in FIG. 1, Comprising: It is the figure seen from the upper surface side. (B) It is the perspective view of a part of flexible circuit board of the optical head apparatus shown in FIG. 1, Comprising: It is the figure seen from the bottom face side. (A) A graph showing a change in the optical axis of a laser light source device for DVD when the gap between the holder and the device frame is approximately 0 μm for the 10 products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the thickness direction. (B) A graph showing a change in the optical axis of a laser light source device for DVD when the gap between the holder and the device frame is approximately 0 μm for the 10 products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the direction orthogonal to the thickness direction. (A) A graph showing the change in the optical axis of a laser light source device for DVD when the gap between the holder and the device frame is 100 μm for the five products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the thickness direction. (B) A graph showing changes in the optical axis of the laser light source device for DVD when the gap between the holder and the device frame is 100 μm for the five products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the direction orthogonal to the thickness direction. It is explanatory drawing of PX and PY shown in FIG. 7 and FIG. (A) A graph showing changes in the optical axis of a laser light source device for CD when the gap between the holder and the device frame is approximately 0 μm for the 10 products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the thickness direction. (B) A graph showing changes in the optical axis of the laser light source device for CD when the gap 15a between the holder and the device frame is approximately 0 μm for the 10 products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the direction orthogonal to the thickness direction of a flame | frame. (A) A graph showing changes in the optical axis of the laser light source device for CD when the gap between the holder and the device frame is 100 μm for the five products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the thickness direction. (B) A graph showing changes in the optical axis of the laser light source device for CD when the gap between the holder and the device frame is 100 μm for the five products of the optical head device shown in FIG. It is a graph which shows the optical axis change in the direction orthogonal to the thickness direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Optical head apparatus 11 Apparatus frame 14, 15, 16 Holder 15a Crevice 21, 22 Laser light source apparatus (light emitting element)
24 Light Detection Element for Signal Detection 60 Anaerobic Adhesive

Claims (5)

A metal holder to which a light emitting element or a signal detecting light receiving element is fixed, and an optical path on which the holder is mounted and from the light emitting element to the optical recording disk or from the optical recording disk to the signal detecting light receiving element In an optical head device having an apparatus frame on which an optical element disposed on is mounted,
The apparatus head is made of metal, and the apparatus frame and the holder are fixed via an anaerobic adhesive.   The optical head device according to claim 1, wherein the light emitting element is fixed to the metal holder.   2. The optical head device according to claim 1, wherein a separation distance between the device frame and the holder fixed via the anaerobic adhesive is 100 μm or less.   The device frame and the holder are each held by a jig in a state of being separated by a gap for applying the anaerobic adhesive, and after adjusting the position by moving relatively in the plane direction, 4. The method of manufacturing an optical head device according to claim 1, wherein the anaerobic adhesive is applied to the gap.   4. The apparatus according to claim 1, wherein the position of the device frame and the holder is adjusted by moving the device frame and the holder relative to each other in a planar direction in a state where the anaerobic adhesive is applied. A method for manufacturing the optical head device according to claim 1.

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