JP2009004053A - Flexible printed circuit board for hard disk device - Google Patents

Flexible printed circuit board for hard disk device Download PDF

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JP2009004053A
JP2009004053A JP2007166391A JP2007166391A JP2009004053A JP 2009004053 A JP2009004053 A JP 2009004053A JP 2007166391 A JP2007166391 A JP 2007166391A JP 2007166391 A JP2007166391 A JP 2007166391A JP 2009004053 A JP2009004053 A JP 2009004053A
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write
read
circuit board
hard disk
disk device
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Japanese (ja)
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Hiroyuki Ono
裕幸 小野
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International Manufacturing and Engineering Services Co Ltd IMES
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International Manufacturing and Engineering Services Co Ltd IMES
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Priority to JP2007166391A priority Critical patent/JP2009004053A/en
Priority to PCT/JP2008/061221 priority patent/WO2009001748A1/en
Publication of JP2009004053A publication Critical patent/JP2009004053A/en
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4846—Constructional details of the electrical connection between arm and support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Moving Of Heads (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a FPC for a hard disk device, which has flexibility, enables high density packaging and can expand transmittable band width. <P>SOLUTION: This invention relates to a flexible printed circuit board connecting a head and a circuit board in a hard disk device, wherein a writing signal line and a reading signal line, transmitting a writing signal and a reading signal which are input to and output from the head are arranged with the same pitch as an end pitch of the connector in a board contact part connected to a connector of the circuit board, also lines between the head and a connected head contact part are linearly formed in parallel to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ハードディスク装置において、ヘッドに入出力される書き込み・読み出し信号を伝送するフレキシブルプリント基板に関する。   The present invention relates to a flexible printed circuit board for transmitting write / read signals input / output to / from a head in a hard disk device.

ハードディスク装置において、ヘッドに入出力される書き込み・読み出し信号の伝送には、フレキシブルプリント基板（以下「ＦＰＣ」という）が使用されている。これは、アクチュエータによりディスク上にヘッドを位置決めさせるためには配線線路の柔軟性が必要であったためである。一方、従来のＦＰＣは、絶縁層としてポリイミドが使用されていたため温湿度の変化に対する寸法変化が大きく、配線レイアウト自体も急峻な線路の屈曲などを許容していたため、特性インピーダンスが制御されていなかった（特許文献１、２）。
特開２０００-１８３５０６号公報 特開２００４-１７４９０４号公報 In a hard disk device, a flexible printed circuit board (hereinafter referred to as “FPC”) is used to transmit write / read signals to / from the head. This is because the wiring line must be flexible in order to position the head on the disk by the actuator. On the other hand, since the conventional FPC uses polyimide as an insulating layer, the dimensional change with respect to the change of temperature and humidity is large, and the wiring layout itself allows a sharp bend of the line, so the characteristic impedance is not controlled. (Patent Documents 1 and 2).
JP 2000-183506 A JP 2004-174904 A

このため、従来のＦＰＣは、伝送可能な信号の周波数上限は高々１GHz程度であり、今後のハードディスクの高密度化に伴う信号の広帯域化にとって妨げとなっている。また、ＦＰＣ技術としては、柔軟性、高密度実装対応、広帯域化の３つの要素が重要であることは知られている。しかし、例えば高密度かつ広帯域がＦＰＣは多層基板となるため柔軟性にかけるなど、前記３つの要素を全て兼ね備えたハードディスク装置に適したＦＰＣがなかった。   For this reason, in the conventional FPC, the upper limit of the frequency of a signal that can be transmitted is about 1 GHz at most, which hinders the widening of the signal band accompanying the future increase in the density of hard disks. As FPC technology, it is known that three elements of flexibility, compatibility with high-density mounting, and widening of bandwidth are important. However, for example, there is no FPC suitable for a hard disk device having all of the above three elements, such as high-density and wide-band FPC is a multi-layered substrate and thus is flexible.

かかる従来の技術の課題に鑑みて本発明は、柔軟性があり、高密度実装が可能で、伝送可能な帯域幅を広げることができるハードディスク装置のＦＰＣを得ることを目的とする。   In view of the problems of the conventional technology, an object of the present invention is to obtain an FPC of a hard disk device that is flexible, can be mounted at high density, and can widen a transmittable bandwidth.

かかる課題を解決する本発明は、ハードディスク装置において、ヘッドと回路基板とを接続するフレキシブルプリント基板であって、ヘッドに入出力される書き込み・読み出し信号を伝送する書き込み信号線及び読み出し信号線を、回路基板のコネクタと接続する基板コンタクト部において前記コネクタの端子ピッチと同一ピッチで配列し、かつヘッドと接続するヘッドコンタクト部間の線路を互いに平行にかつ直線状に形成したことに特徴を有する。   The present invention that solves such a problem is a flexible printed circuit board that connects a head and a circuit board in a hard disk device, and includes a write signal line and a read signal line that transmit a write / read signal input to and output from the head, The substrate contact portions connected to the connector of the circuit board are arranged at the same pitch as the terminal pitch of the connector, and the lines between the head contact portions connected to the head are formed in parallel and in a straight line.

上記ヘッドコンタクト部にはヘッドアンプが実装されていて、前記書き込み信号線及び読み出し信号線は、前記ヘッドアンプと前記基板コンタクト部の間が前記互いに平行かつ直線となるように形成することが実際的である。   It is practical that a head amplifier is mounted on the head contact portion, and the write signal line and the read signal line are formed so that the head amplifier and the substrate contact portion are parallel and straight to each other. It is.

より実際的には、読み出し信号線をRead+、Read-、書き込み信号線をWrite+、Write-、及びグランドをGNDとすると、３本のグランドGNDの間に、読み出し信号線Read+、Read-のペア及び書き込み信号線Write+、Write-のペアが配列される。読み出し信号線Read+、Read-のペア、及び書き込み信号線Write+、Write-のペアは、３本のグランドGNDの間に順不同に配列され、さらにそれぞれのペア内において順不同に配列される。   More practically, if the read signal line is Read +, Read−, the write signal line is Write +, Write−, and the ground is GND, the pair of read signal lines Read +, Read− and the three ground GNDs A pair of write signal lines Write + and Write- is arranged. The pair of read signal lines Read + and Read− and the pair of write signal lines Write + and Write− are arranged in random order between the three ground GNDs, and are arranged in random order in each pair.

好ましくは、前記読み出し信号線Read+、Read-及び書き込み信号線Write+、Write-は、特性インピーダンスが１００Ω、許容幅が±１０パーセント以下となるように形成される。   Preferably, the read signal lines Read + and Read− and the write signal lines Write + and Write− are formed to have a characteristic impedance of 100Ω and an allowable width of ± 10% or less.

本発明によれば、伝送路の特性インピーダンスが維持され、十分な機械的柔軟性を保ち、伝送可能な帯域幅を広帯域に広げることができるＦＰＣが得られる。   According to the present invention, it is possible to obtain an FPC that maintains the characteristic impedance of a transmission line, maintains sufficient mechanical flexibility, and can widen the transmittable bandwidth.

本発明について、添付図面に示した最良の実施形態に基づいて説明する。先ず、本発明を適用した、ハードディスク装置のＦＰＣの断面構造について、図１を参照して説明する。   The present invention will be described based on the best embodiment shown in the accompanying drawings. First, a cross-sectional structure of an FPC of a hard disk device to which the present invention is applied will be described with reference to FIG.

ＦＰＣ１０の各層は、液晶ポリマーなどの低誘電率、低誘電正接、温湿度変化に対する低い寸法変化という特徴を有する絶縁層１１と、絶縁層１１の上に形成された配線層１３と、配線層１３を覆う、ポリイミドまたは液晶ポリマー等のカバーレイヤー１５からなる。配線層１３に、線路が設けられている。一般にＦＰＣでは、グランドGND配線の強化のために、一部絶縁層の下に導体層を置く場合もあり、一般的なマイクロストリップラインの場合は絶縁層の下に全面ベタGND 層を置くが、ハードディスク装置ではＦＰＣにできる限りの柔軟性が要求される。そこで本実施例では、湾曲、屈曲されるＦＰＣ１０の主要部を一層の配線層１３のみとし、局所的に絶縁層１１の下に配線層１７を配した二層構造とした。配線層１７は、カバーレイヤー１５同様のカバーレイヤー１９で覆われている。以上の構成によりＦＰＣ１０は、柔軟性が保たれる。また、上下の配線層１３、１７を接続するときは、絶縁層１１を貫通するバンプ２１が設けられる。   Each layer of the FPC 10 includes an insulating layer 11 having characteristics such as a low dielectric constant, a low dielectric loss tangent, a low dimensional change with respect to a temperature and humidity change, a wiring layer 13 formed on the insulating layer 11, and a wiring layer 13. And a cover layer 15 made of polyimide or liquid crystal polymer. Lines are provided in the wiring layer 13. In general, in FPC, in order to strengthen ground GND wiring, a conductor layer may be placed partially under the insulation layer. In the case of a general microstrip line, a solid solid GND layer is placed under the insulation layer. In the hard disk device, the FPC needs to be as flexible as possible. Therefore, in this embodiment, the main part of the curved and bent FPC 10 is only one wiring layer 13, and a two-layer structure in which the wiring layer 17 is locally disposed under the insulating layer 11 is adopted. The wiring layer 17 is covered with a cover layer 19 similar to the cover layer 15. With the above configuration, the FPC 10 can maintain flexibility. Further, when the upper and lower wiring layers 13 and 17 are connected, bumps 21 penetrating the insulating layer 11 are provided.

次に、ＦＰＣ１０の全体構造について、図２乃至図４を参照して説明する。図２は、本発明を適用したＦＰＣの実施形態の正面図、図３は同ＦＰＣの基板コンタクト部及びコネクタのコンタクトピン部の拡大図、図４は同ＦＰＣのヘッドコンタクト部の、（Ａ）は拡大正面図、（Ｂ）は拡大背面図である。   Next, the overall structure of the FPC 10 will be described with reference to FIGS. 2 is a front view of an embodiment of an FPC to which the present invention is applied, FIG. 3 is an enlarged view of a substrate contact portion of the FPC and a contact pin portion of a connector, and FIG. 4 is a head contact portion of the FPC. Is an enlarged front view, and (B) is an enlarged rear view.

このＦＰＣ１０には、一方の端部に、回路基板のコネクタに接続するための基板コンタクト部２３が形成され、他方の端部にはヘッド、例えばヘッドジンバルアッセンブリから引き出されたＦＰＣに接続されるヘッドコンタクト部２５が形成されていて、これらのコンタクト部２３、２５間の配線層１３に、中央に線路１４ａ、その上下に線路１４ｂ、１４ｃが設けられている。中央の線路１４ａは、ヘッドに入出力される書き込み・読み出し信号を伝送する読み出し信号Read+、Read-の線路である。これらの線路１４ａ乃至１４ｂは、配線層１３に形成されている。   The FPC 10 has a substrate contact portion 23 for connection to a circuit board connector at one end, and a head connected to a head, for example, an FPC drawn from a head gimbal assembly, at the other end. A contact portion 25 is formed, and a wiring layer 13 between the contact portions 23 and 25 is provided with a line 14a at the center and lines 14b and 14c above and below the line 14a. The central line 14a is a line for read signals Read + and Read− for transmitting write / read signals input / output to / from the head. These lines 14 a to 14 b are formed in the wiring layer 13.

ここで、線路１４ａの寸法（線路幅、隣接線路との間隔）は、絶縁層１１の誘電率、誘電正接に応じて特性インピーダンスが、例えばハードディスク装置の広帯域化に適したとされる１００Ω、許容幅が±１０パーセント以下になるように決定する。そうしてコンタクト部２３、２５間の線路１４ａをから可及的に一直線に引くために、線路幅と隣接線路との間隔をコネクタ４１のコンタクトピン群４３のコンタクトピッチに一致させるように形成する。この構成により、１００Ωの特性インピーダンスを保つことができる。   Here, the dimension of the line 14a (line width, distance between adjacent lines) is 100Ω, which is considered to be suitable for widening the hard disk device, for example, with a characteristic impedance corresponding to the dielectric constant and dielectric loss tangent of the insulating layer 11. Is determined to be ± 10% or less. Thus, in order to draw the line 14a between the contact portions 23, 25 as straight as possible, the line width and the interval between the adjacent lines are formed to match the contact pitch of the contact pin group 43 of the connector 41. . With this configuration, a characteristic impedance of 100Ω can be maintained.

通常の特性インピーダンス１００Ωの差動線路は、GND、信号+、信号-、GND の順に並んだ４つの線路がセットで使用されるが、ハードディスクで特性インピーダンスを制御すべき信号は、読み出し信号Read+、Read-、及び書き込み信号Write+、Write-である。これらの読み出し信号Read+、Read-と書き込み信号Write+、Write-は同時に動作することがない。そこで、本実施形態では、読み出し信号Read系（読み出し信号線Read+、Read-のペア）と書き込み信号Write系（書き込み信号線Write+、Write-のペア）をグランドGNDを挟んで配線することとし、GND、Read+、Read-、GND、Write+、Write-、GND と並べて設けた（図３）。この構成により、読み出し信号Read系と書き込み信号Write系の間のGND 線を一本省くことが可能になった。読み出し信号Read系と書き込み信号Write系の間のGNDは、それぞれの系のGND 線として共用される。なお、読み出し信号Read系（書き込み信号線Write+、Write-のペア）と書き込み信号Write系（書き込み信号線Write+、Write-のペア）の順番、及び読み出し信号Read系内及び書き込み信号Write系内の配線順は図示実施例に限定されず、接続されるプリアンプのリード線位置仕様に依存する。   A normal differential line with a characteristic impedance of 100Ω is a set of four lines arranged in the order of GND, signal +, signal-, and GND. The signal whose characteristic impedance should be controlled by the hard disk is the read signal Read +, Read- and write signals Write + and Write-. These read signals Read +, Read− and write signals Write +, Write− do not operate simultaneously. Therefore, in this embodiment, a read signal Read system (a pair of read signal lines Read + and Read−) and a write signal Write system (a pair of write signal lines Write + and Write−) are wired with the ground GND interposed therebetween. , Read +, Read-, GND, Write +, Write-, and GND (Fig. 3). With this configuration, one GND line between the read signal Read system and the write signal Write system can be omitted. The GND between the read signal Read system and the write signal Write system is shared as the GND line of each system. The order of the read signal Read system (write signal line Write +, Write- pair) and the write signal Write system (write signal line Write +, Write- pair), and the wiring in the read signal Read system and the write signal Write system The order is not limited to the illustrated embodiment, but depends on the lead wire position specifications of the connected preamplifier.

このＦＰＣ１０では、プリアンプ実装部分（フリップチップ実装領域）２５ａからコンタクト部２３まで、インピーダンス制御される線路１４ａの各信号線は等幅、等間隔、かつ一直線である。   In the FPC 10, from the preamplifier mounting portion (flip chip mounting region) 25a to the contact portion 23, each signal line of the line 14a whose impedance is controlled is equal in width, equally spaced, and straight.

ヘッドコンタクト部２５には、ＩＣチップ（プリアンプ）を例えばフリップチップ実装するプリアンプ実装部分２５ａが形成され、ＦＰＣ１０の中央上部には、低周波回路用の配線パターン２７が設けられている。配線層１３に形成された線路１４ａの読み出し信号Read+、Read-、及び書き込み信号Write+、Write-に対応する配線パターンが、プリアンプ実装部分２５ａに実装されたプリアンプの端子と接続される。ヘッドコンタクト部２５にはさらに、ＩＣチップの他の端子と接続される配線パターンの端部には、ヘッドからの配線がボンディングされるパッド１４ｄが形成されている。   In the head contact portion 25, a preamplifier mounting portion 25a for mounting an IC chip (preamplifier), for example, by flip chip is formed, and a wiring pattern 27 for a low frequency circuit is provided at the upper center of the FPC 10. The wiring patterns corresponding to the read signals Read + and Read− and the write signals Write + and Write− of the line 14a formed in the wiring layer 13 are connected to the terminals of the preamplifier mounted on the preamplifier mounting portion 25a. The head contact portion 25 is further provided with a pad 14d to which the wiring from the head is bonded at the end of the wiring pattern connected to the other terminal of the IC chip.

このＦＰＣ１０には、読み出し、書き込み信号用の線路１４ａの他に、プリアンプ制御信号、ボイスコイル駆動信号などを伝送する線路１４ｂ、１４ｃが設けられるが、これらの信号にインピーダンスマッチングを必要とするような高速性は無い。他の信号の線路１４ｂ、１４ｃは、その上下に実装寸法と配線の電流容量を考慮しつつレイアウトすればよい。   The FPC 10 is provided with lines 14b and 14c for transmitting a preamplifier control signal, a voice coil drive signal, and the like in addition to a line 14a for reading and writing signals. However, impedance matching is required for these signals. There is no high speed. The other signal lines 14b and 14c may be laid out in consideration of the mounting dimensions and the wiring current capacity above and below them.

また、ヘッドコンタクト部２５上に小円で示した接続部分１４ｅは、絶縁層１１の背面に配されたベタGND（図４（Ｂ））とスルーホールあるいはバンプにより接続される。これらの３つの接続部分１４ｅが形成されている信号線はGND 線であり、図４の第１層の配線でも互いに接続されているが、第１層における接続だけではインピーダンスが十分に下がらない場合に有効である。   Further, the connection portion 14e indicated by a small circle on the head contact portion 25 is connected to a solid GND (FIG. 4B) disposed on the back surface of the insulating layer 11 by a through hole or a bump. The signal lines on which these three connection portions 14e are formed are GND lines, and are connected to each other even in the first layer wiring of FIG. 4, but the impedance is not sufficiently lowered only by the connection in the first layer. It is effective for.

以上のように、このＦＰＣ１０は、線路１４ａを一直線にすることによりインピーダンスマッチングを取ることができるが、ハードディスク装置に実装をするに際して、接続先の回路基板は、通常、ハードディスク装置底面に搭載されている。そのため、回路基板は、ＦＰＣ１０の基板コンタクト部２３が本来向いている方向とは９０度曲がった位置にある。そこで、以下の構成によってこれらを接続することにより、所期の特性インピーダンス、柔軟性、高密度実装対応及び広帯域化の３つの要素を満足できる。   As described above, the FPC 10 can obtain impedance matching by making the line 14a in a straight line. However, when the FPC 10 is mounted on the hard disk device, the circuit board to be connected is usually mounted on the bottom surface of the hard disk device. Yes. Therefore, the circuit board is at a position bent 90 degrees from the direction in which the substrate contact portion 23 of the FPC 10 originally faces. Therefore, by connecting them with the following configuration, the three elements of desired characteristic impedance, flexibility, high-density mounting, and widening of the band can be satisfied.

図５に示したように、ハードディスク装置の回路基板１０１を立てて配置する。このように回路基板１０１、少なくともＦＰＣ１０の基板コンタクト部２３を接続する部分を立てて配置することにより、ＦＰＣ１０は大きく曲がることなく回路基板１０１に接続される。この構成は、大型ハードディスク、あるいはハードディスクのテストシステムなどに適している。   As shown in FIG. 5, the circuit board 101 of the hard disk device is placed upright. As described above, the FPC 10 is connected to the circuit board 101 without being largely bent by arranging the circuit board 101 and at least a portion for connecting the substrate contact portion 23 of the FPC 10 upright. This configuration is suitable for a large hard disk or a hard disk test system.

しかし、基板を小さく設計する必要があり、２．５インチ以下の薄型ハードディスクへの適用は難しい。そこで、２．５インチ以下の薄型ハードディスクの場合は、ＦＰＣ１０を滑らかに歪曲させて、下面の回路基板１０１に接続する（図６（Ａ）、（Ｂ））。このように歪曲させるために、歪曲させる部分とさせない部分を分けるための中間部の支持機構５１を有する。支持機構５１は、配線パターン２７部分をスイングアーム１０５に支持することが好ましい。この構成は、小型ハードディスクに対して有用である。   However, it is necessary to design the substrate to be small, and it is difficult to apply it to a thin hard disk of 2.5 inches or less. Therefore, in the case of a thin hard disk of 2.5 inches or less, the FPC 10 is smoothly distorted and connected to the circuit board 101 on the lower surface (FIGS. 6A and 6B). In order to be distorted in this way, an intermediate support mechanism 51 is provided for separating a portion to be distorted from a portion not to be distorted. The support mechanism 51 preferably supports the wiring pattern 27 portion on the swing arm 105. This configuration is useful for small hard disks.

本発明を適用したハードディスク装置のＦＰＣの断面構造の実施例を示す断面図である。It is sectional drawing which shows the Example of sectional structure of FPC of the hard disk drive to which this invention is applied. 本発明を適用したＦＰＣの実施形態の正面図である。It is a front view of embodiment of FPC to which this invention is applied. 同ＦＰＣの基板コンタクト部及びコネクタのコンタクトピン部の拡大図である。It is an enlarged view of the substrate contact portion of the FPC and the contact pin portion of the connector. 同ＦＰＣのヘッドコンタクト部の、（Ａ）は拡大正面図、（Ｂ）は拡大背面図である。(A) is an enlarged front view and (B) is an enlarged rear view of the head contact portion of the FPC. ハードディスク装置の回路基板を立てて配置して本発明のＦＰＣを接続する態様を示す斜視図である。It is a perspective view which shows the aspect which arrange | positions the circuit board of a hard-disk device upright and connects FPC of this invention. ハードディスク装置の底部の回路基板に本発明のＦＰＣを接続する態様を示す図であって、（Ａ）は同ハードディスク装置の斜視図、（Ｂ）はＦＰＣの正面図である。It is a figure which shows the aspect which connects FPC of this invention to the circuit board of the bottom part of a hard-disk apparatus, (A) is a perspective view of the hard-disk apparatus, (B) is a front view of FPC.

符号の説明Explanation of symbols

１０ ＦＰＣ
１１ 絶縁層
１３ 配線層
１４ａ １４ｂ １４ｃ 線路
１４ｄ パッド
１４ｅ 接続部分
１５ カバーレイヤー
１７ 配線層
１９ カバーレイヤー
２１ バンプ
２３ 基板コンタクト部
２５ ヘッドコンタクト部 10 FPC
11 Insulating layer 13 Wiring layer 14a 14b 14c Line 14d Pad 14e Connection part 15 Cover layer 17 Wiring layer 19 Cover layer 21 Bump 23 Substrate contact part 25 Head contact part

Claims (5)

ハードディスク装置において、ヘッドと回路基板とを接続するフレキシブルプリント基板であって、
ヘッドに入出力される書き込み・読み出し信号を伝送する書き込み信号線及び読み出し信号線を、回路基板のコネクタと接続する基板コンタクト部において前記コネクタの端子ピッチと同一ピッチで配列し、かつヘッドと接続するヘッドコンタクト部ヘッドコンタクト部間の線路を互いに平行にかつ直線状に形成したことを特徴とするハードディスク装置のフレキシブルプリント基板。 In a hard disk device, a flexible printed circuit board for connecting a head and a circuit board,
A write signal line and a read signal line for transmitting a write / read signal input / output to / from the head are arranged at the same pitch as the terminal pitch of the connector at the board contact portion connected to the connector of the circuit board and connected to the head. Head contact portion A flexible printed circuit board of a hard disk device, wherein lines between head contact portions are formed in parallel and in a straight line. 請求項１記載のハードディスク装置のフレキシブルプリント基板において、前記ヘッドコンタクト部にはヘッドアンプが実装されていて、前記書き込み信号線及び読み出し信号線は、前記ヘッドアンプと前記基板コンタクト部の間が前記互いに平行かつ直線状であるハードディスク装置のフレキシブルプリント基板。 2. The flexible printed circuit board of the hard disk device according to claim 1, wherein a head amplifier is mounted on the head contact portion, and the write signal line and the read signal line are connected to each other between the head amplifier and the substrate contact portion. A flexible printed circuit board for hard disk drives that is parallel and straight. 請求項１または２記載のハードディスク装置のフレキシブルプリント基板において、読み出し信号線をRead+、Read-、書き込み信号線をWrite+、Write-、及びグランドをGNDとすると、３本のグランドGNDの間に、読み出し信号線Read+、Read-のペア及び書き込み信号線Write+、Write-のペアが配列されているハードディスク装置のフレキシブルプリント基板。 3. The flexible printed circuit board of the hard disk device according to claim 1 or 2, wherein the read signal line is Read +, Read-, the write signal line is Write +, Write-, and the ground is GND. A flexible printed circuit board of a hard disk device in which a pair of signal lines Read + and Read− and a pair of write signal lines Write + and Write− are arranged. 請求項３記載のハードディスク装置のフレキシブルプリント基板において、読み出し信号線Read+、Read-のペア、及び書き込み信号線Write+、Write-のペアは、３本のグランドGNDの間に順不同に配列され、さらにそれぞれのペア内において順不同に配列されているハードディスク装置のフレキシブルプリント基板。 4. The flexible printed circuit board of the hard disk device according to claim 3, wherein the pair of read signal lines Read + and Read− and the pair of write signal lines Write + and Write− are arranged in random order between the three ground GNDs, respectively. The flexible printed circuit board of the hard disk device arranged in random order within the pair. 請求項１乃至４のいずれか一項記載のハードディスク装置のフレキシブルプリント基板において、前記読み出し信号線Read+、Read-及び書き込み信号線Write+、Write-は、特性インピーダンスが１００Ω、許容幅が±１０パーセント以下となるように形成されているハードディスク装置のフレキシブルプリント基板。 5. The flexible printed circuit board of the hard disk device according to claim 1, wherein the read signal line Read +, Read− and the write signal line Write +, Write− have a characteristic impedance of 100Ω and an allowable width of ± 10% or less. A flexible printed circuit board of a hard disk device formed to be
JP2007166391A 2007-06-25 2007-06-25 Flexible printed circuit board for hard disk device Pending JP2009004053A (en)

Priority Applications (2)

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JP2007166391A JP2009004053A (en) 2007-06-25 2007-06-25 Flexible printed circuit board for hard disk device
PCT/JP2008/061221 WO2009001748A1 (en) 2007-06-25 2008-06-19 Flexible printed board for hard disc device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8330054B2 (en) 2009-05-01 2012-12-11 Nitto Denko Corporation Printed circuit board and magnetic head driving device including the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188016A (en) * 1986-02-13 1987-08-17 Yokogawa Electric Corp Wiring connection device for magnetic disk
JPH0416696U (en) * 1990-05-31 1992-02-12
JP2004174901A (en) * 2002-11-27 2004-06-24 Toyo Kohan Co Ltd Substrate layer-including laminated material and part using the same
JP2006040414A (en) * 2004-07-27 2006-02-09 Nitto Denko Corp Wiring circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8330054B2 (en) 2009-05-01 2012-12-11 Nitto Denko Corporation Printed circuit board and magnetic head driving device including the same

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