JP2009001299A - Packaging body of semiconductive endless rubber belt having release layer on its surface - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging body of a semiconductive endless rubber belt having a releasing layer on its surface capable of preventing any folding habit or rubbing damage in the semiconductive endless rubber belt from being generated, preventing any cracks from being generated in the releasing layer, simplifying the packaging, and reducing the volume of the packaging body. <P>SOLUTION: In the packaging body of the semiconductive endless rubber belts, two semiconductive endless rubber belts are packaged as one packaging body; cylindrical bodies A and B are inserted in both ends on the inner side of one semiconductive endless rubber belt (a); cylindrical bodies C and D are inserted in both ends on the inner side of the other semiconductive endless rubber belt b; the rubber belt (a) is folded and the cylindrical body A and the cylindrical body B are brought into contact with each other via the rubber belts; the cylindrical body C is held in the folded rubber belt (a); the rubber belt b is folded and the cylindrical body C and the cylindrical body D are brought into contact with each other via the rubber belt; the cylindrical body B is held in the folded rubber belt b; and the releasing layer is provided on the surface on which the cylindrical bodies A, B, C, D and the semiconductive endless rubber belts (a) and b are fixed thereto. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a package of a semiconductive endless rubber belt having a release layer on the surface. More specifically, the present invention relates to a semi-conductive endless rubber belt package having a release layer on the surface, and the semi-conductive endless rubber belt does not fold or rub, and can be left in a packaged state for a long time. The present invention relates to a package of a semiconductive endless rubber belt having a release layer on the surface, which does not generate cracks or cracks in the release layer, simplifies packaging, reduces the volume of the package, and reduces packaging costs. .

In the electrostatic image developing type image forming apparatus, an endless belt such as a transfer belt or a conveyance belt is used. A semiconductive endless rubber belt such as a transfer belt is provided with a release layer on the outer peripheral surface in order to facilitate toner cleaning. When this release layer is cracked or cracked during use, it may cause image defects or cleaning problems. Therefore, design, selection, etc. of materials, configuration, thickness, etc. are performed assuming actual use. In other words, a semiconductive endless rubber belt is used by being stretched by a plurality of rollers or coated on a cylindrical drum in a stretched state and brought into contact with a cleaning member such as a photoreceptor, blade, brush, etc. Measures such as softening and thinning of the release layer have been taken to withstand.
However, if the belt is stored for a long period of time before use, the belt is likely to crease, giving a long-term strain that is larger than that applied during use, and causing problems such as cracks and cracks in the release layer. There is. Further, when the outer peripheral surface of the semiconductive endless rubber belt rubs during transportation, a sliding abrasion occurs, which causes a reduction in image quality. For this reason, careful attention has been paid to the packaging of the semiconductive endless rubber belt for the image forming apparatus, and various packaging methods and packages have been developed.
For example, the surface resistivity was set to 10 ⁸ to 10 ¹³ Ω / □ as a packaging method for a semiconductive seamless belt that can reduce transportation costs and prevent rubbing scratches during transportation with a simple packaging operation. A packaging method for a flexible semi-conductive seamless belt, wherein the seamless belt is used as a container or a frame in a state where the closest distance of the inner peripheral surface of the seamless belt is not more than half of the diameter in a cylindrical state. A method for packing a semiconductive seamless belt to be held has been proposed, and a polyimide resin containing carbon black is cited as a preferable constituent material of the seamless belt (Patent Document 1). However, it is difficult to prevent the semiconductive endless rubber belt from being folded by this method.
In addition, there are no irregularities, wrinkles, or scratches on endless belts such as belt-like photographic photoreceptors, intermediate transfer belts, and conveyor belts used in recent high-quality, high-resolution, full-color electrophotographic devices. As a package, the endless belt is wound around a cylindrical body A inserted inside the innermost end of the endless belt and a cylindrical body C positioned outside the belt along with the cylindrical body A. And a cylindrical body B is inserted inside the outermost end of the endless belt, and the maximum height R _max defined by JIS B 0601 on the surface of the three cylindrical bodies is 0. A package of .8 to 150 μm has been proposed, and examples of belt-shaped plastic substrates include polyethylene terephthalate, polybutylene terephthalate, polyimide, and nylon (patent text). 2). According to this method, since the cylindrical body is inserted inside the semiconductive endless rubber belt, it is a suitable method for preventing folding, but in order to regulate the position of the cylindrical body, a buffer with a recess is provided. Since materials have been proposed, it is not sufficient in terms of reduction in volume and simplification, and there is a problem that costs are increased.
Further, the above packing method or package is a method of packaging one semiconductive endless rubber belt, and there is a limit to the rationalization of the package no matter how improvements are made.
JP 2002-225971 A JP 2003-335387 A

  The present invention relates to a semiconductive endless rubber belt package having a release layer on the surface, the semiconductive endless rubber belt does not fold or rub, and can be left in a packaged state for a long time. The present invention provides a semiconductive endless rubber belt packaging body having a release layer on the surface, which is free from cracks and cracks, simplifies packaging, reduces the volume of the packaging body, and reduces packaging costs. It was made as a purpose.

As a result of intensive research to solve the above-mentioned problems, the present inventor has effectively reduced the efficiency by combining two semiconductive endless rubber belts having two cylindrical bodies inserted at both inner ends in a bowl shape. It can be packaged in volume and can be transported safely without rubbing the semiconductive endless rubber belt having a release layer on the surface. It was found that no wrinkles were formed and no cracks or cracks were generated in the release layer, and the present invention was completed based on this finding.
That is, the present invention
(1) In a package of semiconductive endless rubber belts having a release layer on the surface, two semiconductive endless rubber belts are packaged as one package, and are attached to both ends inside one semiconductive endless rubber belt a. Cylindrical body A and cylindrical body B are inserted, cylindrical body C and cylindrical body D are inserted into both ends inside the other semiconductive endless rubber belt b, and semiconductive endless rubber belt a is bent to form cylindrical body A and cylindrical body The body B comes into contact with the semiconductive endless rubber belt, the cylindrical body C is sandwiched between the folded semiconductive endless rubber belt a, and the semiconductive endless rubber belt b is bent to form the cylindrical body C and the cylindrical body D. Are in contact with each other via a semiconductive endless rubber belt, and a cylindrical body B is sandwiched in a folded semiconductive endless rubber belt b, so that a cylindrical body A, a cylindrical body B, a cylindrical body C, a cylindrical body D, a semiconductive body Endless rubber belt a Package of semiconductive endless rubber belt having a release layer on the surface of the semiconductive endless rubber belt b is characterized by comprising fixed,
(2) Cylindrical body A, cylindrical body B, cylindrical body C, cylindrical body D, semiconductive endless rubber belt a and semiconductive endless rubber belt b are fixed by packing with a plastic film on the surface according to (1) A package of a semiconductive endless rubber belt having a release layer;
(3) A semiconductive endless rubber belt a and a semiconductive endless rubber belt b are each formed by covering a plurality of the same shape semiconductive endless rubber belts with the same width, and providing a release layer on the surface according to (1). Having a semiconductive endless rubber belt package,
(4) When the inner circumference of the semiconductive endless rubber belt is L (mm) and the thickness is T (mm), the number of covered semiconductive endless rubber belts is 0.02 (L / T) or less. A package of a semiconductive endless rubber belt having a release layer according to (3), and
(5) When the inner circumference of the semiconductive endless rubber belt is L (mm), the diameter of the cylindrical body is 0.06 L to 0.09 L (mm). Conductive endless rubber belt packaging,
Is to provide.

  Since the packaging body of the semiconductive endless rubber belt having a release layer on the surface of the present invention can store two semiconductive endless rubber belts in one packaging container, the packaging work can be saved. Material can be saved and storage and transportation costs can be reduced. The package body of the semiconductive endless rubber belt of the present invention can hold the semiconductive endless rubber belts fixedly without rubbing each other, so that there is no possibility that the semiconductive endless rubber belts are scratched. The cylindrical body used in the packaging body of the semiconductive endless rubber belt of the present invention does not need to have a highly smooth surface because it does not contact the release layer on the outer peripheral surface of the semiconductive endless rubber belt. Etc. can be used. The package body of the semiconductive endless rubber belt of the present invention has a semiconductive endless surface having a release layer on the surface used as a part of an electrostatic image developing type image forming apparatus that is strictly required to be free from bending creases and surface scratches. It can be used particularly suitably for rubber belt packaging.

The package of a semiconductive endless rubber belt having a release layer on the surface thereof according to the present invention is a package of a semiconductive endless rubber belt having a release layer on the surface, wherein the two semiconductive endless rubber belts are one package. The cylindrical body A and the cylindrical body B are inserted into both ends inside one semiconductive endless rubber belt a, and the cylindrical body C and the cylindrical body D are inserted into both ends inside the other semiconductive endless rubber belt b. The semiconductive endless rubber belt a is bent, the cylindrical body A and the cylindrical body B are in contact with each other via the semiconductive endless rubber belt, and the cylindrical body C is sandwiched in the bent semiconductive endless rubber belt a. The semiconductive endless rubber belt b is bent so that the cylindrical body C and the cylindrical body D are in contact with each other via the semiconductive endless rubber belt, and the cylindrical body B is sandwiched in the bent semiconductive endless rubber belt b. A, The cylindrical body B, and a cylindrical body C, cylinder D, semiconductive endless rubber belt a and semiconductive endless rubber belt b is fixed package.
The semiconductive endless rubber belt used as the package of the present invention is an endless rubber belt having a surface resistivity of 10 ⁶ to 10 ¹³ Ω / □. FIG. 1 is a schematic side view of one embodiment of a package of a semiconductive endless rubber belt having a release layer on the surface of the present invention. Cylindrical body A and cylindrical body B are inserted into both ends inside one semiconductive endless rubber belt a, and cylindrical body C and cylindrical body D are inserted into both ends inside the other semiconductive endless rubber belt b. The semiconductive endless rubber belt a is bent so that the cylindrical body A and the cylindrical body B are in contact with each other via the semiconductive endless rubber belt, and the cylindrical body C is sandwiched in the bent semiconductive endless rubber belt a. Further, the semiconductive endless rubber belt b is bent so that the cylindrical body C and the cylindrical body D come into contact with each other through the semiconductive endless rubber belt, and the cylindrical body B is sandwiched between the bent semiconductive endless rubber belt b. Yes. In this state, by fixing the cylindrical body A, the cylindrical body B, the cylindrical body C, the cylindrical body D, the semiconductive endless rubber belt a, and the semiconductive endless rubber belt b, a stable package can be obtained.

FIG. 2 is an explanatory view of a method for producing a package of a semiconductive endless rubber belt according to the present invention. Cylindrical body A and cylindrical body B are inserted into both ends inside one semiconductive endless rubber belt a. The cylindrical body C and the cylindrical body D are inserted into both ends inside the other semiconductive endless rubber belt b. The cylindrical body C is pressed against the semiconductive endless rubber belt a and bent. The cylindrical body A and the cylindrical body B are joined to the semiconductive endless rubber belt a, the two semiconductive endless rubber belts b, and the semiconductive endless rubber belt a in this order. When the contact is made, the cylindrical body C is sandwiched by the semiconductive endless rubber belt a between the cylindrical body A and the cylindrical body B. Next, the cylindrical body D is folded, the semiconductive endless rubber belt b is bent, and the cylindrical body C and the cylindrical body D are joined to the semiconductive endless rubber belt b, the two semiconductive endless rubber belts a, and the semiconductive endless rubber belt b. Are brought into contact with each other in this order, the cylindrical body B is sandwiched by the semiconductive endless rubber belt b between the cylindrical body C and the cylindrical body D, and the state shown in FIG. 1 is obtained. In this state, the cylindrical body A, the cylindrical body B, the cylindrical body C, the cylindrical body D, the semiconductive endless rubber belt a, and the semiconductive endless rubber belt b are fixed.
There is no particular limitation on the method for fixing the cylindrical body A, the cylindrical body B, the cylindrical body C, the cylindrical body D, the semiconductive endless rubber belt a, and the semiconductive endless rubber belt b. It can be packed and fixed with a packaging material such as plastic film, or can be fixed in a plastic film bag. The packaging material can be prepared in advance according to the volume of the package of the semiconductive endless rubber belt to be packed, or a larger packaging material can be taped. Among these, the method of packing and fixing with a plastic film does not apply stress to the semiconductive endless rubber belt, and can easily cope with semiconductive endless rubber belts having different dimensions. Since the semiconductive endless rubber belt packed in is not likely to be contaminated from the outside, it can be suitably used.

There is no particular limitation on the cylindrical body used for the endless rubber belt packaging body having a release layer on the surface of the present invention, for example, a pipe-shaped cylindrical body with both ends open, and a cylindrical body with both ends closed by a disk. Any of them can be used, and a round bar-like material having no hollow portion inside can also be used as a cylindrical body. There is no restriction | limiting in particular in the material of a cylindrical body, For example, a paper tube, a plastic pipe, a metal tube etc. can be mentioned. In the package of the semiconductive endless rubber belt of the present invention, the cylindrical body does not touch the release layer on the outer peripheral surface of the semiconductive endless rubber belt, so the surface of the cylindrical body does not need to have high smoothness, Since a large force is not applied to the cylindrical body, it is possible to suitably use a paper tube that is commercially available with light weight and various dimensions.
The packaging body of the semiconductive endless rubber belt having a release layer on the surface of the present invention comprises a semiconductive endless rubber belt a and a semiconductive endless rubber belt b, each having a plurality of the same shape semiconductive endless rubber belts having a width. It can be set as the semiconductive endless rubber belt to-be-bonded body put together. In the embodiment shown in FIG. 1, one semiconductive endless rubber belt a and one semiconductive endless rubber belt b are provided, but a plurality of semiconductive endless rubber belts can be put together to form a package in the same manner. it can. When a plurality of semiconductive endless rubber belts are put together, the outermost semiconductive endless rubber belt is stretched to the state shown in FIG. 1, and the inner semiconductive endless rubber belt is slackened. However, as can be seen in FIG. 1, there is a free space corresponding to the central angle of the circle of about 90 degrees around the cylindrical body A, cylindrical body B, cylindrical body C, and cylindrical body D. The slack of the conductive endless rubber belt can be absorbed in this free space.
In the present invention, the number of covered semiconductive endless rubber belts is 0.02 (L / T) or less when the inner circumference of the semiconductive endless rubber belt is L (mm) and the thickness is T (mm). It is preferable that the number is 0.01 (L / T) or less. If the number of covered semi-conductive endless rubber belts exceeds 0.02 (L / T), it becomes difficult to absorb the slack of the inner semi-conductive endless rubber belt in the free space around the cylindrical body. The compressive force of the outer semiconductive endless rubber belt is applied to the semiconductive endless rubber belt, which may cause wrinkles and distortion.

  In the package of the semiconductive endless rubber belt having a release layer on the surface of the present invention, when the inner circumference of the semiconductive endless rubber belt is L (mm), the cylindrical body A, the cylindrical body B, the cylindrical body C, and The diameter of the cylindrical body D is preferably 0.06L to 0.09L (mm), and more preferably 0.075L to 0.085L (mm). FIG. 3 is an explanatory diagram showing the relationship between the inner circumference of the semiconductive endless rubber belt and the diameter of the cylindrical body. Four cylindrical bodies A, B, C, and D having the same diameter are in contact with each other as shown in FIG. 3, and the inner circumference of the hypothetical semiconductive endless rubber belt a is as thin as possible without being L (mm). In the state in which the cylindrical body A and the cylindrical body B are inserted into both ends of the cylindrical body and the cylindrical body C is sandwiched between the semiconductive endless rubber belts a, the diameter of each cylindrical body is 0.0876 L (mm). When the inner circumference of the semiconductive endless rubber belt is L (mm), if the diameters of the cylindrical body A, the cylindrical body B, the cylindrical body C, and the cylindrical body D are less than 0.06 L (mm), four cylinders There is a possibility that the positional relationship between the bodies is shifted and it is difficult to stably fix the body. When the diameters of the cylindrical body A, the cylindrical body B, the cylindrical body C, and the cylindrical body D exceed 0.09 L (mm), the semiconductive endless rubber belt may be tensioned and may be distorted.

The present invention can be suitably applied to the packaging of a semiconductive endless rubber belt having a release layer on the surface having an inner circumference of 120 to 1,200 mm and a thickness of 0.3 to 1.0 mm. A semiconductive endless rubber belt having an inner circumference of less than 120 mm is very small, and it is often preferable to apply an individual packaging form. The semiconductive endless rubber belt having an inner circumference exceeding 1,200 mm may be difficult to assemble into the shape shown in FIG. Since the semiconductive endless rubber belt having a thickness of less than 0.3 mm has low strength, it is often preferable to wrap one by one. A semiconductive endless rubber belt having a thickness exceeding 1.0 mm may be likely to be wrinkled or distorted in the semiconductive endless rubber belt.
In the present invention, the release layer formed on the semiconductive endless rubber belt is not particularly limited, and examples thereof include a polyurethane layer containing polytetrafluoroethylene fine powder, silicone powder, graphite and the like. Among these, the semiconductive endless rubber belt having a polyurethane layer blended with polytetrafluoroethylene fine powder as a release layer, when used as a package of the present invention, is extremely resistant to rubbing during transportation and the like. Since it exhibits excellent release properties when used as a part of a forming apparatus, it can be suitably used.
The package of a semiconductive endless rubber belt having a release layer on the surface of the present invention can be particularly suitably applied to a package of a semiconductive endless rubber belt used in an electrostatic image developing type image forming apparatus. Since the semiconductive endless rubber belt of the electrostatic image developing type image forming apparatus causes extremely small scratches and bending wrinkles to cause a reduction in image quality, it is rational and economical to apply the package of the present invention. An electrostatic image developing type image forming apparatus that can be packaged, transported and give high image quality can be manufactured.

  Since the packaging body of the semiconductive endless rubber belt having a release layer on the surface of the present invention can store two semiconductive endless rubber belts in one packaging container and is extremely simple packaging, Saves time, saves packaging materials, and reduces storage and transportation costs. The package body of the semiconductive endless rubber belt of the present invention can fix and hold the semiconductive endless rubber belt without rubbing each other, so that there is no risk of the semiconductive endless rubber belt being rubbed and the release layer. There is no risk of cracking or cracking. The cylindrical body used for the package of the semiconductive endless rubber belt of the present invention does not need to have a highly smooth surface because it does not contact the release layer on the outer peripheral surface of the semiconductive endless rubber belt. Etc. can be used. The package body of the semiconductive endless rubber belt of the present invention has a semiconductive endless surface having a release layer on the surface used as a part of an electrostatic image developing type image forming apparatus that is strictly required to be free from bending creases and surface scratches. It can be used particularly suitably for rubber belt packaging.

It is a typical side view of one mode of a package of a semiconductive endless rubber belt having a release layer on the surface of the present invention. It is explanatory drawing of the preparation methods of the package body of the semiconductive endless rubber belt of this invention. It is explanatory drawing which shows the relationship between the inner periphery of a semiconductive endless rubber belt, and the diameter of a cylindrical body.

Explanation of symbols

A Cylindrical body B Cylindrical body C Cylindrical body D Cylindrical body a Semi-conductive endless rubber belt b Semi-conductive endless rubber belt

Claims (5)

  In a package of semiconductive endless rubber belts having a release layer on the surface, two semiconductive endless rubber belts are packaged as one package, and cylindrical body A is provided at both ends inside one semiconductive endless rubber belt a. And the cylindrical body B are inserted, the cylindrical body C and the cylindrical body D are inserted into both ends inside the other semiconductive endless rubber belt b, the semiconductive endless rubber belt a is bent, and the cylindrical bodies A and B are formed. The cylindrical body C is sandwiched between the folded semiconductive endless rubber belts a that are in contact with each other through the semiconductive endless rubber belt, and the semiconductive endless rubber belts b are folded so that the cylindrical bodies C and D are semiconductive. The cylindrical body B is sandwiched between the bent semiconductive endless rubber belt b which is in contact with and bent through the conductive endless rubber belt, and the cylindrical body A, cylindrical body B, cylindrical body C, cylindrical body D, and the semiconductive endless rubber belt a And semiconductor Semiconductive endless rubber belt of the packaging body sexual endless rubber belt b has a release layer on a surface characterized by comprising fixed.   The release layer on the surface according to claim 1, wherein the cylindrical body A, the cylindrical body B, the cylindrical body C, the cylindrical body D, the semiconductive endless rubber belt a and the semiconductive endless rubber belt b are fixed by packing with a plastic film. A semiconductive endless rubber belt package.   The semiconductive endless rubber belt a and the semiconductive endless rubber belt b are each formed by covering a plurality of the same shape semiconductive endless rubber belts with the same width and having a release layer on the surface. Wrapping rubber endless rubber belt.   The number of covered semiconductive endless rubber belts is 0.02 (L / T) or less when the inner circumference of the semiconductive endless rubber belt is L (mm) and the thickness is T (mm). A package of a semiconductive endless rubber belt having the release layer according to 3.   The semiconductive endless rubber having a release layer on the surface according to claim 1, wherein the inner diameter of the semiconductive endless rubber belt is L (mm), and the diameter of the cylindrical body is 0.06L to 0.09L (mm). Rubber belt packaging.

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