JP2008310388A - Digital io unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a digital IO unit whose development can be completed in a short period of time by reducing the total number of items to be designed, and, even if new functions are added, reducing the number of items to be developed that are required by the addition. <P>SOLUTION: The digital IO unit has a circuit board and a case for housing the circuit board. The circuit board is formed by separately designing three modules, i.e., a communication unit board 21, an IO circuit unit board 22, and a base unit board 23, and combining and connecting the modules together. The case is formed by separately designing two modules, i.e., a communication unit casing 10 and an IO unit casing 11, and connecting them together. The communication unit board has a communication connector 21a for a network to be connected and a communication circuit for the network. The base unit board has an IO connector 23a for connecting IO equipment. The IO circuit unit board has the function of sending and receiving IO data to and from the IO equipment and other additional functions. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a digital IO unit to which IO devices are connected and which communicates IO data with a control device via a network.

  In a network system in FA (Factory Automation), one or a plurality of PLCs (programmable controllers) that control production facilities and devices whose operations are controlled by the PLCs are connected to a control system network. These PLCs and devices communicate with each other cyclically via the network of the control system, thereby transmitting / receiving IO data and controlling production facilities.

  The PLC connects a CPU unit that executes calculations based on a control program, an input device such as a sensor or a switch and inputs an on / off signal as an input signal, and an output device such as an actuator or a relay. Output units that send output signals to them, communication units that send and receive data to and from other devices connected to the network, master units for master-slave communication, power supply units that supply power to each unit, etc. It is configured by combining a plurality of units.

  The master unit is connected to a field network, and performs master-slave communication with a digital IO unit (remote IO unit) connected to the field network. In the digital IO unit, IO devices such as input devices and output devices are wired and input / output IO data with the IO devices. As for input, voltage changes due to opening / closing of internal contacts of an input device (IN device) or ON / OFF of an internal transistor among IO devices are taken in via wiring (not network communication). Regarding output, a voltage signal is output via wiring to an output device (OUT device) among IO devices (not network communication). Also, IO data is transmitted and received by network communication with the master unit (PLC) via the network. As for transmission, each of the on / off signals taken from a plurality of input devices (IN devices) among the IO devices is subjected to parallel-serial conversion, and the serial signals are transmitted to the master unit by network communication. Regarding reception, each on / off signal based on the calculation result of the PLC is received from the master unit by network communication, serial-parallel conversion is performed in the digital IO unit, and an on / off signal to be output to each output device is obtained. . Here, the digital of the digital IO unit means an ON / OFF binary signal, and IO means IN (input) and OUT (output).

  This type of digital IO unit is configured by housing a circuit board on which an external interface such as a communication connector or an IO connector (terminal block) is mounted in a case. The case is generally composed of a housing base having an upper surface that opens the circuit board and a housing lid that closes the upper surface opening of the housing base. The substrate housed in the case is configured to be divided into one sheet or a plurality of sheets (usually two sheets as required).

In the field of this type of digital IO unit, for example, the technology disclosed in Patent Document 1 discloses a technique for housing the communication control unit and the IO circuit unit in separate and independent cases. There is.
JP 11-135958 A

  By the way, since the number of IO devices connected by wiring differs depending on the application, for example, 8 points, 16 points, 32 points, 64 points, etc., it is desirable to prepare a plurality of types of digital IO units. Also, since the connection method with the IO device differs from, for example, a terminal block, a MIL connector, or the like depending on the application, it is desirable to prepare a plurality of types. When there are 8 types of IO devices and 4 types of connections, the development of cases and boards for digital IO units is performed for each situation and specification. In other words, an optimum design is made for 32 types, which are all combinations of the above 8 types and 4 types. Therefore, the number to be designed becomes very large and complicated.

  For example, when a new digital IO unit corresponding to one communication protocol is designed, it is necessary to newly create a case and a board for the communication protocol. Therefore, if there are 8 types of IO devices, 4 types of connections, and 4 types of communication protocols, it is necessary to design 128 types of digital IO units that are all combinations. Is not only cumbersome but also takes time to develop. This is not limited to the addition of a communication protocol, but the same can be said for adding another function.

  In addition, if the number of design objects increases due to differences in IO device points, input / output ratios, connection methods, communication protocols, output transistor NPN type, PNP type, etc. -The number of types of storage will increase, inventory management will become complicated, and costs will increase.

  The present invention provides a digital I / O unit that can reduce the total number of designs and reduce the number of development targets required in accordance with the addition of new functions, and can complete development in a short period of time. Will do.

  Other objects and operational effects of the present invention will be easily understood by those skilled in the art by referring to the following description of the specification.

  In order to achieve the above object, a digital IO unit according to the present invention is a digital IO unit that is connected to an IO device and communicates IO data with a control device via a network. A case for storing a circuit board, and the circuit board is configured by combining and connecting components designed in three modules of a communication unit board, an IO circuit board, and a base board, The communication unit board includes an external interface for a network to be connected and a communication circuit for the network, and the base unit board includes an external interface for an IO device for connecting the IO device, The IO circuit board is provided with a function of transmitting / receiving IO data to / from an IO device.

  The circuit board is divided into three modules and each module is developed, and the target circuit board is configured by combining the modules appropriately selected according to the required usage. The communication unit board and the base board each equipped with external interfaces are configured on separate boards, and the functions of the digital IO unit (input / output / input / output, power supply monitor, disconnection detection, short circuit detection function) A circuit for realizing a service function such as the above is configured by an IO circuit board. Therefore, if each module is designed according to the communication protocol, the number of input / output points, the difference in the structure of the external interface, etc., the “type of communication board” x “type of IO board” x “type of base board” Minute digital IO unit can be configured. Therefore, as the number of types of modules increases, the number of designs can be reduced as much as possible as compared to the conventional one in which all combinations are individually designed. Further, since each module can be appropriately combined to constitute each digital IO unit, when viewed from each digital IO unit, the parts can be shared and storage management becomes easy.

  Further, for example, in the case of supporting different communication protocols, the development of the circuit board is completed only by developing the communication unit board for the communication protocol, so that the development can be completed in a short period of time.

  Conventionally, even if the substrate is divided, the purpose is to efficiently use the installation space and reduce the overall size, and the idea is different.

  (2) Each of the communication unit board, the IO circuit unit board, and the base unit board constituting the circuit board is provided with a connection connector for connecting to at least one other board, and the installation position of the connection connector is When each board is mounted in the case, it is preferable that the connection target connection connectors are set to face each other at a position where they can be directly connected.

  (3) Each of the communication unit board, the IO circuit unit board, and the base unit board constituting the circuit board is provided with a connection connector for connecting to at least one other board, and at least one set of connection targets is connected. It is recommended that the connectors be connected using a flexible cable. In this way, the degree of freedom of the layout of the connection connectors is increased as compared with the invention of (2), and as a result, the substrate can be reduced in size.

  (4) The case is configured by connecting two modules each designed as a communication unit housing and an IO unit housing, and three modules constituting a circuit board are included in the case. The communication unit housing is set in accordance with the size and shape of the external interface for the network, and the size and shape of the communication unit substrate around the external interface, and the IO unit The casing may be set in accordance with the dimensional shape of the base portion substrate. By making the case modular in this way, the design effort of the case can be suppressed as much as possible.

  (5) The IO unit casing is configured by an IO unit casing base having an upper surface that constitutes the casing body, and an IO unit casing lid that closes the upper surface opening of the IO unit casing base, The IO unit housing lid includes a window hole set in accordance with the size and shape of the external interface for the IO device, and the external interface for the IO device is inserted into the window hole and exposed to the outside. It may be configured as follows.

  (6) The communication unit casing is configured by a communication unit casing base having an upper surface that is open on the casing main body, and a communication unit casing lid that closes the upper surface opening of the communication unit casing base. The communication unit housing cover includes a window hole set in accordance with the size and shape of the external interface for the communication device, and the external interface for the communication device is provided in the window hole of the communication unit housing cover. It is good to comprise so that it may be inserted and exposed outside.

  According to the present invention, a digital IO unit is realized by a combination of modules, so that it is possible to cope with many types using a small number of types of modules.

  1 and 2 are diagrams for explaining an example of each module constituting the digital IO unit according to the present invention. FIG. 3 is an example of a digital IO unit constructed by combining these modules. An exploded perspective view is shown.

  The digital IO unit 1 is also referred to as a remote IO unit. In this digital IO unit, IO devices such as output devices and input devices are electrically connected by wiring, and are connected to the PLC via a network to transmit / receive IO data and the like by network communication. That is, when the IO device connected to the digital IO unit 1 is an input device such as a sensor, the digital IO unit takes in the IN data from the input device, performs parallel-serial conversion on the IN data, and converts it to the PLC via the network. Send by serial transmission. Also, when the IO device is an output device such as an actuator, the digital IO unit is received from the master unit of the PLC by serial transmission via the network, serial-parallel converted, and OUT data corresponding to each output device is connected. Output to output device.

  The digital IO unit 1 includes a case and a substrate. The board is an electric circuit board for performing various signal processing, and is mounted with a connector for connecting a network cable, a terminal block for connecting an IO device, and the like. The case stores the above-described substrate and is made of a plastic casing. As described above, since the substrate is housed in the case, the external appearance of the digital IO unit 1 is substantially rectangular. An opening is provided in a part of the case, and an interface portion connected to the outside such as a connector or a terminal block mounted on the board is exposed through the opening.

  The digital IO unit 1 can be broadly divided into a communication unit and an IO unit when focusing on functions. The communication unit is connected to a network, and transmits / receives IO data to / from the PLC via the network. The IO unit transmits / receives IO data to / from the connected IO device.

  There are various communication protocols such as device nets, componets, and profibus networks. Usually, the size and structure of connectors connected to network cables differ for each communication protocol, and circuits such as communication interfaces for each communication protocol. The configuration is also different. Therefore, the communication unit needs to deal with these differences. The IO unit needs to cope with a difference in the number of IO points, a difference in interface with the IO device, and the like. That is, the shape and size of the terminal block differ depending on the number of points, and a connector may be mounted instead of the terminal block depending on the connection method. As for the board, if the specifications of the communication unit are different, the wiring pattern of the board and the mounted parts are different, and the shape and size of the board are different.

  On the other hand, if the communication protocol is the same even if the number of IO points is different, such as a digital IO unit compatible with a device net for 8 points and a digital IO unit compatible with a device net for 16 points, the configuration of the IO unit is Although the configuration differs depending on the number of IO points, the configuration of the communication units is the same and can be shared.

  Conversely, even with the same 8-point digital IO unit, if the communication protocol of the network to be connected is different, the configuration of the IO unit can be shared, but the configuration of the communication unit needs to correspond to each communication protocol There is.

  Therefore, in this embodiment, the case 10 is divided into two parts, an IO unit and a communication unit, and each is modularized. The basic configuration is that a plastic IO unit housing 11 serving as an IO unit closes an IO unit housing base 13 having an upper surface that constitutes a housing body and an upper surface opening of the IO unit housing base 13. It is comprised from IO part housing | casing cover part 14. FIG. Similarly, a plastic communication unit housing 12 serving as a communication unit includes a communication unit housing base 15 constituting a housing main body having an upper surface opened, and a communication unit closing the upper surface opening of the communication unit housing base 15. And a housing lid 16.

  As shown in FIG. 1, the IO unit housing base 13 has an opening on the left side in the longitudinal direction, and the communication unit housing base 15 has an opening on the right side. And in the state which these opening parts faced each other, both base parts 13 and 15 are mutually connected and integrated using the snap fit connection structure combined with 1 action which makes mutually approach.

  The snap-fit coupling structure includes an IO unit side first locking portion 13a provided on the bottom surface of the IO unit housing base 13, a communication unit side first locking portion 15a provided on the bottom surface of the communication unit housing base 15, And the IO part side second locking part 13b provided on the side wall surface of the IO part housing base part 13, the communication part side second locking part 15b provided on the side wall surface of the communication part housing base part 15, It is comprised by connecting.

  In addition, the coupling between the IO unit casing base 13 and the IO unit casing lid 14 and the coupling between the communication unit casing base 15 and the communication unit casing lid 16 are also made using a snap-fit coupling structure. Done. In addition, although the coupling | bonding of both base parts and the coupling | bonding of the cover part corresponding to each base part were made to use a snap-fit coupling | bonding structure in this embodiment, this invention is not limited to this, Various types A bond structure can be used.

  A shaft portion 13c for positioning the substrate is provided at a predetermined position on the bottom surface of the IO unit housing base 13. A substrate positioning recess 13 d is provided at a predetermined position on the upper end of the side wall of the IO unit base 13. In addition, a window hole 14 a is formed on the top surface of the IO unit housing lid 14. An interface portion with the outside such as a terminal block for an IO device mounted on the board enters the window hole 14, and the interface portion is exposed to the outside.

  A locking hole 15 c for fixing the substrate is provided at a predetermined position above the side wall surface of the communication unit housing base 15. Further, a window hole 16 a is formed on the top surface of the communication unit housing cover 16. An interface portion with the outside such as a connector for connecting a network cable mounted on the board enters the window hole 16a, and the interface portion is exposed to the outside.

  A substrate is mounted in a single casing formed by combining the IO section casing 11 and the communication section casing 12. The substrate to be mounted has three boards, that is, a communication control unit substrate 21, an IO circuit unit substrate 22, and a base unit substrate 23.

  The communication control unit substrate 21 is a substrate on which a circuit for realizing a function as a communication unit is formed, and an interface with the outside such as the communication connector 21a is also mounted on the communication control unit substrate 21. Further, the communication control unit board 21 includes a power supply terminal 21b, a communication physical layer 21c, a power supply circuit 21d, a clock oscillator 21e, a reset circuit 21f, an EEPROM 21g, an address setting switch 21h, a communication LED 21i, and main components such as an ASIC and a CPU. 21j and the like are included. A communication interface is configured by the communication connector 21a and the physical layer 21c. The communication LED 21i is also referred to as an operation LED, and blinks or lights in a predetermined color when communication is executed. The power supply terminal 21b is, for example, a terminal for connecting an external power supply. A voltage supplied from the external power supply is converted into a desired voltage by the power supply circuit 21d and supplied to the IO device.

  The IO part was divided into a part related to the case dimensional shape and a part not related to the case so as to correspond to various cases. The part related to the case is the “base part” (base part substrate 23), the part not related to the case (IO data transmission / reception function with IO devices, service functions such as power monitor, disconnection detection, short circuit detection function, etc. A part that realizes various functions) is referred to as an “IO circuit unit” (IO circuit unit substrate 22).

  The base part substrate 23 includes an IO connector (terminal block) 23a for connecting the IO device, an IO LED 23b indicating the operation state of the IO device, and the like. The IO LED 23b may be installed on the side of the IO circuit board 22 from the viewpoint of function, but by arranging it near the IO connector 23a, the operation of each IO device connected to the IO connector 23a is performed. Since there is an advantage that the situation can be understood immediately, in this embodiment, it is installed on the base part substrate 23 side.

  The I / O circuit unit board 22 electrically connects the I / O unit 22a for transmitting / receiving I / O data to / from the I / O connector, the status 22b such as the I / O power supply monitor, the circuit on the communication control unit board 21 side, and the I / O device. An insulating photocoupler 22c and the like are included.

  The parts constituting each of the above boards are changed in shape or the like in accordance with functions or the like realized by the respective boards, and may be appropriately increased or decreased. As shown in FIGS. 3 and 4, the communication control unit substrate 21, the IO circuit unit substrate 22, and the base unit substrate 23 are accommodated in a three-tiered state. A locking piece (protrusion) 21k is formed on the side edge of the communication control unit substrate 21 so as to protrude outward, and the locking piece 21k is provided on the communication unit housing base 15. The communication control unit substrate 21 is positioned and fixed with respect to the communication unit housing base 15 by fitting in the fixing holes 15 c for fixing. A positioning hole 23d is formed at a predetermined position in the base substrate 23, and a shaft 13c formed on the bottom surface of the IO housing base 13 is inserted into the positioning hole 23d. The base portion substrate 23 is positioned with respect to the IO portion housing base 13 in the horizontal direction (a direction parallel to the base portion substrate 23). Further, a locking piece 23e is provided on the predetermined peripheral plate of the base portion substrate 23, and this locking piece 23e is aligned with the positioning recess 13e formed at the upper end of the side wall of the IO unit housing base 13. The base part substrate 23 is prevented from further moving downward, and the base part substrate 23 is positioned in the vertical direction with respect to the IO unit housing base 13.

  FIG. 4 shows the positional relationship between each circuit board and the housing that houses it. As shown in the figure, in order to make the entire housing compact, the three substrates 21, 22, and 23 have a three-stage stacked structure in which a part of them is overlapped. Connection connectors 21m are provided at predetermined positions on the front and back surfaces of the communication control unit board 21. Further, connection connectors 22e and 23f are provided at predetermined positions on the upper surface of the IO circuit board 22 and at predetermined positions on the lower surface of the base board 23, respectively. Electrical connection between the circuit boards is performed by appropriately connecting the connection connectors.

  In a state where the substrates 21, 22, and 23 are arranged in the connected chassis bases 13 and 15, the corresponding chassis lid parts 14 and 16 are joined from above the chassis bases 13 and 15, respectively. A digital IO unit 10 is configured. Of course, the substrates are integrated by connecting the connection connectors.

  Further, in a state in which the IO unit casing lid 14 is joined to the IO unit casing base 13 with the substrate stored, the interface such as the IO connector (terminal block) 23a is located in the window hole 14a and exposed to the outside. To do. Similarly, in a state in which the communication unit housing cover 16 is joined to the communication unit housing base 15 with the substrate stored, the interface such as the communication connector 21a is located in the window hole 16a and exposed to the outside. Since each interface is exposed (projected) through the window holes 14a and 16a in this way, a network cable and an IO device can be easily connected.

  As described above, the case 10 is divided into the communication unit housing 11 and the IO unit housing 12, and the substrate (circuit board) is divided into the communication control unit substrate 21, the IO circuit unit substrate 22, and the base unit substrate 23. The digital IO unit 1 is configured by dividing into three and combining a total of five modules. The communication unit housing 11 and the IO unit housing 12 are each composed of two parts in the base and the lid in the example shown in the figure, but as shown in FIG. Some configurations do not.

  Each module is designed in accordance with the required functions and specifications, and each module is selected in any combination and connected and assembled. These structures are the same or compatible. That is, in the case, the IO part side first locking part 13a and the IO part side second locking part 13b of the IO part case base 13 and the communication part side first engagement of the communication part case base 15 are provided. The shape and the formation position of the stop part 15a and the communication part side second locking part 15b are set to be the same (see FIGS. 5 and 6). In addition, since the corresponding latching parts should just be able to perform a snap-fit coupling | bonding, of course, even if an external appearance shape etc. differ a little. Further, the end surface shapes of the joint surfaces of the IO unit housing base 13 and the communication unit housing base 15 are also made equal. As a result, when the housing bases 13 and 15 are combined and integrated, there is no gap or step between the joints of the housing bases 13 and 15, and the appearance is beautiful as one case. The strength is also increased.

  In addition, since the shapes of the end surfaces to which the two casing bases 13 and 15 are joined are matched, the two casing bases 13 and 15 and the widths of the two casing lid parts 14 and 16 connected thereto are also equal. Along with this, the maximum width of each of the substrates 21, 22, and 23 to be stored is limited by the width of the casing bases 13 and 15. Therefore, when the number of IO points is large and the area of the substrate to be stored is increased, this is dealt with by increasing the length of the substrate and the housing. As for the case, for example, as shown in FIGS. 6A, 6B, and 6C, the length differs depending on the number of IO points.

  In addition, the installation positions, shapes, and structures of the connection connectors 21m, 22e, and 23f for connecting the boards to each other are unified for each board, and the corresponding connection connectors are positioned so as to face each other in any combination. To be able to connect.

  The window holes 14 a and 16 a formed in the housing lid portions 14 and 16 are external interfaces such as an IO connector 23 a mounted on the base portion substrate 23, and external interfaces such as a communication connector 21 a provided on the communication control portion substrate 21. The opening is made larger than necessary to prevent the inside from being exposed (the shapes of the window holes 14a and 16a in FIGS. 3, 5 and 6 are different).

  In the above-described example, an example of appropriately designing the external dimensions of each module has been described. However, the circuit configuration (wiring pattern + mounted component) of each board is also designed according to each specification. .

  The following are examples of specifications to consider when designing each module. For example, there are various types of communication protocols of the field network to which the digital IO unit 10 is connected, such as a device net (DeviceNet: trademark), a componet (CompoNet / IP: trademark), and a profibus (profibus: trademark). To do. Therefore, the communication control unit board 21 is designed according to each communication protocol, or the communication unit housing 12 is designed. Focusing on the terminal shape of an IO connector for connecting an IO device, there are still many types such as a screw terminal, a connector, and a screwless clamp terminal. Therefore, the size (length) of the base portion substrate 23 on which the IO connector 23a is mounted is designed according to the terminal shape and size), the size (length) of the IO portion housing lid portion 15 and the window. The shape of the hole 15a is designed. There are three types of input / output types: input, output, and mixed input / output. Therefore, the circuit configuration of the IO circuit board is designed according to the input / output type. The number of IO points ranges widely from 4 points, 8 points, 16 points, and 32 points. As the number of points increases, the dimensional shape of the base portion substrate 23 and the IO portion housing 11 on which the IO connector 23a is mainly mounted becomes larger (longer). In addition to simple ON / OFF functions for input / output, service functions such as a power supply monitor, disconnection detection, and short circuit detection function may be added. Therefore, the circuit configuration of the IO circuit board 22 is designed according to these additional functions, or alarm means for notifying the user of the detection result is mounted on the base board 23. In order to cope with such types, it is most suitable to pay attention to each function of the digital IO unit 10 and to divide the communication control part board, the IO circuit part board, and the base part board into three as to the design circumstances regarding the board. It can be said. In the conventional design, for example, the number of “communication protocol types” × “IO connection types” × “input / output types”, that is, the number of products of the number of types that are all combinations, is at least required. However, in this embodiment, the number of “communication protocol types” + “types of IO connections” + “types of input / output”, that is, the total number of parts that is the number of types of divided parts is designed in advance. It can be dealt with by combining them together.

  If the case of the design situation regarding the board is divided into four parts, the number of parts increases. Considering the case where the board A combined with the communication control and IO circuit and the base board B are divided into two, the board A has the number of components of the number of communication types × the number of IO types (or the number of input / output types). The board B has the number of IO-type parts, and the total number of parts may be less than three divisions. However, in order to newly increase the communication type, it is necessary to redesign the entire board A. If the communication control unit board and the IO circuit unit board are divided as in this embodiment, the IO circuit board can be shared and used, so there is no need to redesign the entire board A. Since it is only necessary to newly design the range of the communication control unit board, the efficiency of the entire design action can be increased. Considering the case where the communication control unit board C and the IO circuit board and base board D are divided into two parts, the number of parts may be reduced as compared to the three parts, but the number of types of IO terminal blocks is newly increased. In that case, it is necessary to redesign the entire substrate D. In the case of the three-division design in which the IO circuit board and the base board are divided as in this embodiment, the IO circuit board can be shared and used, so there is no need to redesign the entire board D. Since it is only necessary to newly design the range of the base board on which the base is mounted, the efficiency of the entire design action can be increased.

  As described above, by realizing the digital IO unit 10 by a combination of modules, it is possible to cope with many models while reducing the types of modules to be designed. Furthermore, for example, when one type of new communication protocol is added, in the conventional one, it is necessary to design a board or housing for each type of digital IO unit corresponding to the communication protocol. In the embodiment, the communication control unit board 21 corresponding to the newly added communication protocol and the communication unit housing 12 can be designed. The same can be said for other parts such as an increase in the number of input points and an increase in new IO connectors. Therefore, it is possible to shorten the period from technology development for new communication / IO connection to actual product release, and to reduce the number of product development man-hours.

  Further, in the above-described embodiment, the connection between the boards is made by directly connecting the connection connectors, but the present invention is not limited to this. For example, as shown in FIG. It is good to use. By connecting both ends of the flexible cable 25 to a connection connector provided on each board, the installation position of the connection connector may be shifted, and the range of design is expanded. For example, an IO connector (terminal block) is mounted on the base board, and the shape of the IO connector is various and is affected by the IO connector. Therefore, in order to make the connector position constant, it is necessary to set the connection connector installation area with a margin so as not to be affected by the components to be mounted and the board shape becomes large. On the other hand, if it is joining by the flexible cable 25, since it can join, without determining the position of a connection connector, it becomes possible to make the dimension shape of a board | substrate and a dimension shape of a housing | casing small.

It is a figure for demonstrating an example of each module which comprises the digital IO unit which concerns on this invention. It is a figure for demonstrating an example of each module which comprises the digital IO unit which concerns on this invention. It is a disassembled perspective view of an example of the digital IO unit comprised by combining each module. It is sectional drawing of a digital IO unit. It is a figure which shows an example of a communication part housing | casing. It is a figure which shows an example of IO section housing | casing. It is another form of the connection connector for connecting substrates.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Digital IO unit 11 IO part housing | casing 12 Communication part housing | casing 13 IO part housing | casing base part 14 IO part housing | casing cover part 14a Window hole 15 Communication part housing | casing base part 16 Communication part housing | casing cover part 16a Window hole 20 Circuit board 21 Communication board 21a Communication connector (external interface)
22 IO circuit board 23 Base board 23a IO connector (external interface)

Claims (6)

A digital IO unit that is connected to IO devices and communicates IO data with a control device via a network.
A circuit board and a case for storing the circuit board;
The circuit board is configured by combining and connecting each of the designed modules divided into three modules, a communication unit board, an IO circuit unit board, and a base unit board,
The communication unit board includes an external interface for a network to be connected, and a communication circuit for the network,
The base unit board includes an external interface for an IO device for connecting the IO device,
The IO circuit board has a function of transmitting / receiving IO data to / from an IO device,
Digital IO unit characterized by that. The communication board, the IO circuit board and the base board constituting the circuit board are each provided with a connection connector for connecting to at least one other board,
The installation position of the connection connector is set so as to face a position where the connection connectors to be connected can be directly connected to each other when each board is mounted in the case. Digital IO unit. The communication board, the IO circuit board and the base board constituting the circuit board are each provided with a connection connector for connecting to at least one other board,
The digital IO unit according to claim 1, wherein at least one set of connection connectors to be connected is connected using a flexible cable. The case is configured by connecting two modules each designed as a communication unit housing and an IO unit housing,
In the case, the three modules constituting the circuit board are stored so as to overlap vertically,
The communication unit housing is set according to the size and shape of the external interface for the network, as well as the size and shape of the communication unit substrate around the external interface,
The digital IO unit according to any one of claims 1 to 3, wherein the IO unit casing is set in accordance with a size and shape of the base unit substrate. The IO unit casing is composed of an IO unit casing base whose upper surface constituting the casing main body is opened, and an IO unit casing lid that closes the upper surface opening of the IO unit casing base.
The IO unit housing lid includes a window hole set in accordance with the size and shape of the external interface for the IO device,
5. The digital IO unit according to claim 1, wherein the external interface for the IO device is configured to be inserted into the window hole and exposed to the outside. 6. The communication unit case is composed of a communication unit case base having an upper surface that forms the case main body, and a communication unit case cover that closes the upper surface opening of the communication unit case base.
The communication unit housing lid includes a window hole set in accordance with the size and shape of the external interface for the communication device,
The external interface for the communication device is configured to be inserted into a window hole of the communication unit housing lid and exposed to the outside. 6. Digital IO unit.

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