JP2008299649A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment capable of efficiently discharging the air discharged from a cooling fan, to the outside. <P>SOLUTION: The electronic equipment includes a cooling device with built-in suction fan provided so as to cover a heating part mounted on an extension board built into the body of the electronic equipment. The cooling device includes a suction part and an exhaust part. The electronic equipment further includes a discharge fan for discharging the air discharged from the exhaust part of the cooling device out of the body, and a guide for guiding the air discharged from the cooling device to the discharge fan, extending from the cooling device to the discharge fan so as to cover the cooling device and the discharge fan. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device incorporating a cooling device.

  2. Description of the Related Art In recent years, the amount of heat generated by arithmetic processing devices has increased with technological progress such as speeding up of arithmetic processing devices such as CPU (Central Processing Unit) and GPU (Graphics Processing Unit). As the heat generation amount of the arithmetic processing unit increases, the cooling capacity of the cooling device that cools the arithmetic processing unit is also increased.

  A personal computer is divided into two regions, a high temperature region and a low temperature region, and a graphics board, chip set, CPU, etc., which are electronic components that generate heat relatively in the high temperature region, are provided. Cooling using an additional fan provided on the opposite side, provide power supply devices, disk drives, etc., which are electronic components that are relatively unlikely to generate heat in the low temperature region, and cool these electronic components using a power supply fan There was a technique to perform (see Patent Document 1).

In addition, by driving the intake fan, air outside the PC is sucked through the flexible duct and L-shaped joint and blown to the heat sink, and the warm air that is dissipated from the heat sink and diffused into the PC is driven to drive the PC There was a technique of discharging outside (Patent Document 2).
JP 2003-108269 A (pages 6 to 8, FIG. 9) Japanese Patent Laying-Open No. 2006-3928 (page 6, FIG. 4)

  However, in the case of the configuration of the above-mentioned Patent Document 1, even if the CPU fan exhausts the air that has become hot by cooling the CPU, the air that has become hot by cooling the CPU remains in the personal computer main body. Will spread.

  In the case of the above-described configuration of Patent Document 2, the warm air dissipated from the heat sink is exhausted outside the personal computer by the exhaust fan, but is diffused into the personal computer before being exhausted outside the personal computer by the exhaust fan.

  Accordingly, an object of the present invention is to provide an electronic device that efficiently discharges air discharged from the cooling device to the outside by driving a fan built in the cooling device.

  In order to achieve the above object, an electronic apparatus according to claim 1 is provided with a main body, a board that is built in the main body and on which the heat generating component is mounted, and is attached to the board so as to cover the heat generating component, A cooling device having a built-in intake section through which air sucked by driving of the intake fan passes, an exhaust section through which air sucked from the intake section and cooled by the heat generating component passes, and air discharged from the exhaust section And a guide provided so as to surround the cooling device and the exhaust fan.

  Furthermore, an electronic apparatus according to claim 5 is provided in the vicinity of one surface of the main body and the inner surface of the main body, and is substantially perpendicular to the first substrate on which the slot is mounted, and the first substrate. A second board mounted on the slot and mounted with a heat-generating component, and mounted on the second board so as to cover the heat-generating component, incorporating an intake fan, and driving the intake fan A cooling device having an air intake section through which the air to be taken in passes, an exhaust section through which air sucked from the air intake section and air that has cooled the heat-generating component passes, and an inner surface of the main body provided near the first substrate A discharge fan attached to one surface and a guide provided from the cooling device to the discharge fan, and is positioned substantially perpendicular to the first substrate and sandwiches the cooling device and the discharge fan. The cooling device and the exhaust fan include a first guide and a second guide provided on the main body, and one surface of the inner surface of the main body which is in contact with the first and second guides and is provided near the first substrate. And a third guide provided so as to sandwich the guide.

  Furthermore, an electronic apparatus according to claim 8 includes a main body, a board that is built in the main body and on which the heat generating component is mounted, and is mounted on the board so as to cover the heat generating component, and includes an intake fan, and the intake fan A cooling device having an air intake portion through which air sucked by driving of the air passes, an exhaust portion through which air sucked from the air intake portion and cooled by the heat generating component passes, and air discharged from the exhaust portion is placed outside the main body. An exhaust fan for discharging and a guide provided from the cooling device to the exhaust fan and provided so as to be in contact with a surface of the cooling device on which the intake portion is formed are provided. .

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the electronic device which discharges the air discharged | emitted from the cooling device outside efficiently by driving the fan incorporated in a cooling device.

  FIG. 1 is a perspective view of an electronic apparatus according to the present invention.

  A desktop computer is considered as an example of this electronic device. The main body 1 of the electronic device is a housing. A substantially rectangular parallelepiped shape can be considered as an example of the shape of the housing.

  The side surface 10 among the surfaces forming the main body 1 is configured to be removable from the main body 1. For example, when replacing a device incorporated in the main body 1, the user removes the side surface 10 from the main body 1.

  FIG. 2 is a diagram illustrating a state in which the side surface 10 is removed from the main body 1.

  An optical disk drive 2 and a power supply unit 3 are provided on the upper portion of the main body 1.

  A substrate 4 is provided in the main body 1. The substrate 4 is provided with an expansion slot 5a. An expansion board is attached to the expansion slot 5a so as to be substantially perpendicular to the substrate 4. An expansion board attached to the expansion slot is formed of a substrate.

  The expansion board 6a is a board attached to the expansion slot. The expansion board 6 a is attached to the expansion slot so as to be substantially perpendicular to the substrate 4.

  A side guide 7a is provided so as to cover an expansion board (not shown; will be described later) positioned above the expansion board 6a in the positive y-axis direction. The side guide 7a will be described in detail later.

  FIG. 3 is a view showing a state in which the side guide 7a is removed from the state shown in FIG.

  The expansion board 6b is an expansion board positioned above the expansion board 6a in the positive y-axis direction, and is a board covered with the side guide 7a described with reference to FIG. The expansion board 6b is attached to the expansion slot so as to be substantially perpendicular to the substrate 4, and is positioned substantially parallel to the expansion board 6a.

  The cooling device 8 is attached to the surface of the expansion board 6b that faces the surface of the expansion board 6a. The cooling device 8 is positioned between the expansion board 6b and the expansion board 6a.

  The cooling device 8 is provided on the expansion board 6b so as to cover the GPU 8e in order to cool a GPU (Graphics Processing Unit) 8e of a heat generating component mounted on the expansion board 6b. The cooling device 8 includes an intake fan 8d.

  When the intake fan 8d built in the cooling device 8 is driven, the cooling device 8 sucks the air around the cooling device 8 through the intake holes provided in the cooling device 8 and cools the GPU 8e. The intake holes provided in the cooling device 8 will be described later with reference to the drawings. The sucked air is discharged from the cooling device 8 through discharge holes 8a and 8b provided on the side surface of the cooling device 8.

  A bottom surface guide 7b is provided so as to be positioned between the cooling device 8 and the expansion board 6a. The bottom surface guide 7b is attached so as to be in contact with the bottom surface of the cooling device 8.

  The upper surface guide 7c is a guide positioned in the positive y-axis direction with respect to the expansion board 6b. The upper surface guide 7c is provided so as to be substantially parallel to the extension board 6a and the extension board 6b. The upper surface guide 7c is a guide covered with the side surface guide 7a described with reference to FIG.

  The fan 9 is built in the main body 1. The fan 9 is a discharge fan provided to discharge the air discharged from the cooling device 8 to the outside of the main body 1.

  The upper surface guide 7c described above is provided so as to extend to a position where the fan 9 is provided while maintaining a position substantially parallel to the expansion board 6b in the positive x-axis direction. The upper surface guide 7 c is positioned above the fan 9 in the positive y-axis direction and is provided so as to cover the fan 9.

  On the other hand, the bottom surface guide 7b is provided so as to extend toward the position where the fan 9 is provided in the positive x-axis direction. The bottom surface guide 7b is provided so as to be positioned below the fan 9 in the negative y-axis direction. The shape of the bottom guide 7b will be described in detail later.

  FIG. 4 is an exploded perspective view showing a component group arranged in the main body 1.

  As described with reference to FIG. 2, the expansion slot 5 a is provided on the substrate 4 that is one of the inner surfaces of the main body 1 and is provided in the vicinity of the side surface 11 that faces the side surface 10. Furthermore, an expansion slot 5b and an expansion slot 5c are provided on the substrate 4 so as to be positioned above the expansion slot 5a in the positive y-axis direction. The expansion slot 5b and the expansion slot 5c are provided on the substrate 4 so as to take a position substantially parallel to the expansion slot 5a.

  As described with reference to FIG. 3, the cooling device 8 is attached to the expansion board 6b, and the bottom surface guide 7b is provided so as to sandwich the cooling device 8 with the expansion board 6b. By inserting the terminal 60 provided on the expansion board 6b into the expansion slot 5c, the expansion board 6b on which the cooling device 8 is mounted is attached to the expansion slot 5c.

  As described with reference to FIG. 3, the upper surface guide 7c is provided so as to be positioned above the expansion board 6b in the positive y-axis direction, and the cooling device 8 is mounted between the upper surface guide 7c and the bottom surface guide 7b. The expansion board 6b is positioned.

  The side guide 7a is provided so as to cover the upper surface guide 7c, the extension board 6b, and the bottom surface guide 7b. As will be described later with reference to the drawings, the side guide 7a is provided so as to take a position substantially perpendicular to the top guide 7c and the bottom guide 7b, and the side guide 7a is provided on the top guide 7c and the bottom guide 7b. It is provided to touch.

  A vent hole 12 is provided on a side surface 11 that faces the side surface 10 of the surface forming the main body 1. The fan 9 described with reference to FIG. 3 is provided so as to cover the ventilation hole 12. When the fan 9 is driven, warm air discharged from the cooling fan 8 is discharged from the vent hole 12.

  FIG. 5 is a perspective view showing the state of the expansion board 6b on which the cooling device 8 is mounted and the bottom guide 7b removed from the cooling device 8. As shown in FIG.

  An intake hole portion 8c through which air sucked by driving the intake fan 8d of the cooling device 8 is provided on the surface of the cooling device 8 that is in contact with the bottom surface guide 7b.

  In addition, a vent hole 71 is provided in the bottom guide 7b in contact with the surface where the intake hole 8c is provided. The vent hole 71 is provided so as to face the intake hole 8c provided in the cooling device 8 when the bottom guide 7b is attached to the cooling device 8. The size of the vent hole 71 provided on the surface of the bottom guide 7b is preferably substantially the same as the size of the intake hole 8c provided in the cooling device 8 or larger than the intake hole 8c.

  The vent hole 71 provided in the bottom guide 7b is provided on the sheet 70 provided in the bottom guide 7b. This sheet 70 is a sheet that can be attached to the bottom surface guide 7b. The relationship between the bottom guide 7b and the sheet 70 will be described in detail later.

  The bottom surface guide 7b includes a first bottom surface guide 7b-1, a second bottom surface guide 7b-2, and a third bottom surface guide 7b-3.

  The first bottom surface guide 7b-1 is a guide to which the sheet 70 on which the vent hole 71 is formed is attached. The first bottom surface guide 7 b-1 is a guide that is positioned substantially parallel to the expansion board 6 b by being attached to the cooling device 8.

  The third bottom surface guide 7b-3 is positioned in the y-axis negative direction and substantially parallel to the first bottom surface guide 7b-1. The third bottom surface guide 7b-3 is positioned in the positive x-axis direction with respect to the first bottom surface guide 7b-1. Considering the size of the discharge fan 9 provided in the positive x-axis direction with respect to the third bottom surface guide 7b-3, the third bottom surface guide 7b-3 is disposed with respect to the first bottom surface guide 7b-1. It is preferable to provide it so as to be positioned in the negative y-axis direction.

  The second bottom surface guide 7b-2 is located between the first bottom surface guide 7b-1 and the third bottom surface guide 7b-3, and the first bottom surface guide 7b-1 and the third bottom surface guide 7b-. 3 is connected. Since the third bottom surface guide 7b-3 is positioned in the negative y-axis direction and substantially parallel to the first bottom surface guide 7b-1, the second bottom surface guide 7b-2 is the first bottom surface guide 7b-2. It is positioned to be inclined with respect to the guide 7b-1 and the third bottom surface guide 7b-3.

  FIG. 6 is a cross-sectional view of the main body 1 with the side guide 7a removed from the state shown in FIG. 2 taken along the xy plane.

  By driving the intake fan 8d built in the cooling device 8, intake air to the cooling device 8 is performed as described below.

  When the intake fan 8d built in the cooling device 8 is driven, air flows from the lower part in the housing 1 toward the bottom guide 7b, and the air is formed by the bottom guide 7b and the expansion board 6a. The air passes through the gap and is sucked into the cooling device 8 through the vent hole 71 and the intake hole 8c.

  Further, in a state in which the fan 9 is driven, air discharged from the cooling device 8 through the discharge hole portions 8a and 8b passes through a gap formed by the bottom surface guide 7b and the top surface guide 7c, and the cooling device 8 Flows in the direction of the fan 9 positioned in the positive x-axis direction.

  As described with reference to FIGS. 4 and 5, the bottom surface guide 7b is provided from the cooling device 8 to the exhaust fan 9 so as to contact the surface of the cooling device 8 with the intake hole 8c, and more than the expansion board 6b. By providing the upper surface guide 7c in the axial direction from the cooling device 8 to the exhaust fan 9, the warm air discharged from the discharge holes 8a and 8b of the cooling device 8 is in the positive x-axis direction with respect to the cooling device 8. Since the air is guided in the direction of the fan 9 positioned, the warm air discharged from the cooling device 8 can be efficiently discharged outside the main body 1 via the fan 9 without diffusing in the positive and negative y-axis directions in the main body 1. It becomes possible.

  Moreover, it becomes possible to prevent the warm air discharged from the cooling device 8 from being sucked into the cooling device 8 again by the bottom surface guide 7b provided so as to be in contact with the surface of the cooling device 8 having the intake hole portion 8c. Compared with the case where the bottom surface guide 7b is not provided so as to contact the surface of the cooling device 8 with the intake hole 8c, the warm air discharged from the cooling device 8 can be discharged to the outside of the main body 1 more efficiently. It becomes.

  FIG. 7 is a cross-sectional view of the main body 1 in the state shown in FIG. 1 cut along a yz plane.

  The expansion board 6b on which the cooling device 8 is mounted is attached to the expansion connector 5c on the substrate 4, and a bottom surface guide 7b is provided so as to be in contact with the surface of the cooling device 8 where the intake hole 8c is provided. It is done. Further, the side surface guide 7a is provided so as to be in contact with each of the upper surface guide 7c and the bottom surface guide 7b and to take a position substantially perpendicular to these guides.

  When the intake fan 8d built in the cooling device 8 is driven, air flows from the vicinity of the side surface 10 side of the surface of the housing 1 through the gap formed by the bottom surface guide 7b and the expansion board 6a. Further, this air is sucked into the cooling device 8 through the vent hole 71 and the intake hole 8c.

  By enclosing the cooling device 8 mounted on the expansion board 6b using the bottom surface guide 7b, the upper surface guide 7c, and the side surface guide 7a, the warm air discharged from the cooling device 8 is prevented from diffusing into the main body 1.

  FIG. 8 is a cross-sectional view of the main body 1 in the state shown in FIG. 1 cut along the xz plane.

  The air sucked through the intake holes 8c provided in the cooling device 8 attached to the expansion board 6b passes through the gaps formed by the bottom surface guide 7b, the top surface guide 7c, and the side surface guide 7a, and the cooling device. 8 flows in the direction of the cooling device 9 positioned in the positive x-axis direction. Furthermore, air that has flowed from the cooling device 8 toward the fan 9 in a state where the fan 9 is driven is discharged to the outside of the main body 1 via the fan 9. By providing the bottom surface guide 7b, the top surface guide 7c, and the side surface guide 7a so as to surround the exhaust fan 9 from the cooling device 8, the warm air discharged from the cooling device 8 does not diffuse into the main body 1, and the x-axis positive direction It becomes possible to guide to the direction of the fan 9 located in the position.

  FIG. 9 is a diagram illustrating a state where the sheet 70 is removed from the bottom surface guide 7b described with reference to FIG.

  A hole 73 is provided in the first bottom surface guide 7b-1 of the bottom surface guide 7b. A sheet 70 is provided on the first bottom surface guide 7b-1 so as to cover the hole 73. The size of the hole 73 provided in the first bottom surface guide 7 b-1 is larger than that of the vent hole 71 provided in the sheet 70.

  FIG. 10 is a view showing an example of the sheet 70 attached to the bottom guide 7b.

  The size of the intake hole 8 c provided in the cooling device 8 varies depending on the cooling device 8. Therefore, in order to provide the seat 70 with the vent hole 71 corresponding to the size of the intake hole 8c of the cooling device 8 to be used, the shape (72a, 72b, 72c) is provided with perforations, for example.

  The user can cut and form a vent hole having a shape corresponding to the size of the intake hole 8c of the cooling device 8 to be used.

  The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

The perspective view of the electronic device which concerns on this invention The figure which shows the state which removed the side surface 10 from the main body 1 The figure which shows the state which removed the side guide 7a from the state shown in FIG. The exploded perspective view which shows the components group arrange | positioned in the main body 1 The perspective view which shows the state of the expansion board 6b in which the cooling device 8 was mounted, and the bottom face guide 7b removed from the cooling device 8. Sectional drawing which cut | disconnected the main body 1 of the state which removed the side guide 7a from the state shown in FIG. 2 by xy plane Sectional drawing which cut | disconnected the main body 1 of the state shown in FIG. 1 by yz plane Sectional drawing which cut | disconnected the main body 1 of the state shown in FIG. 1 by the xz plane The figure which shows the state which removed the sheet | seat 70 from the bottom face guide 7b demonstrated using FIG. The figure which showed an example of the sheet | seat 70 attached to the bottom face guide 7b

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Main body, 2 ... Optical disk drive, 3 ... Power supply unit, 4 ... Board | substrate,
5a, 5b, 5c ... expansion slots, 6a, 6b ... expansion boards,
7a ... bottom guide, 7b ... side guide, 8 ... cooling device,
8a, 8b ... discharge hole, 8c ... intake hole, 9 ... cooling device, 10 ... side face,
11 ... side, 12 ... ventilation hole,

Claims (9)

The body,
A substrate that is built in the main body and on which the heat-generating component is mounted;
An air intake fan that is attached to the substrate so as to cover the heat generating component and has a built-in intake fan through which air sucked by driving the air intake fan passes, and air that is sucked from the air intake portion and cools the heat generating component passes. A cooling device having an exhaust part;
An exhaust fan for exhausting air exhausted from the exhaust part to the outside of the main body;
A guide provided from the cooling device to the exhaust fan, and provided to surround the cooling device and the exhaust fan;
An electronic apparatus comprising: The electronic apparatus according to claim 1, wherein the guide is provided so as to be in contact with a surface on which the intake portion is formed among surfaces of the cooling device. The guide is
A first guide provided so as to be in contact with a surface of the cooling device provided with the intake portion;
A second guide provided in contact with the first guide and substantially orthogonal to the first guide;
The electronic apparatus according to claim 1, further comprising a third guide that is in contact with the second guide and is provided so as to be substantially orthogonal to the second guide. The electronic device according to claim 2, wherein a surface of the guide that is in contact with a surface of the cooling device provided with the intake portion includes a ventilation portion provided so as to face the intake portion. The body,
A first substrate provided in the vicinity of one of the inner surfaces of the main body and on which the slot is mounted;
A second board that is positioned substantially perpendicular to the first board and is mounted in the slot and on which the heat-generating component is mounted;
It is attached to the second substrate so as to cover the heat generating component, and has a built-in intake fan, an intake portion through which air sucked by driving the intake fan passes, and an intake portion that sucks in the air and cools the heat generating component A cooling device having an exhaust through which air passes;
A discharge fan attached to one surface of the inner surface of the main body provided in the vicinity of the first substrate;
A guide provided between the cooling device and the exhaust fan; first and second guides provided substantially perpendicular to the first substrate and sandwiching the cooling device and the exhaust fan; A third guide provided to be in contact with the first and second guides and sandwiching the cooling device and the exhaust fan with one surface of the inner surface of the main body provided in the vicinity of the first substrate; A guide composed of
An electronic device comprising: 6. The electronic apparatus according to claim 5, wherein one of the first and second guides is a guide that comes into contact with a surface on which the air intake portion is formed, of the surfaces of the cooling device. The electronic device according to claim 6, wherein a surface of the guide in contact with a surface on which the air intake portion is formed has a ventilation portion provided to face the air intake portion. The body,
A substrate that is built in the main body and on which the heat-generating component is mounted;
An air intake fan that is attached to the substrate so as to cover the heat generating component and has a built-in intake fan through which air sucked by driving the air intake fan passes, and air that is sucked from the air intake portion and cools the heat generating component passes. A cooling device having an exhaust part;
An exhaust fan for exhausting the air exhausted from the exhaust part to the outside of the main body;
A guide that is provided from the cooling device to the exhaust fan, and that is provided so as to be in contact with a surface on which the intake portion is formed, among the surfaces of the cooling device;
An electronic apparatus comprising: The electronic device according to claim 8, wherein a surface of the guide that is in contact with a surface of the cooling device provided with the air intake portion includes a ventilation portion provided so as to face the air intake portion.

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