JP2008297520A5 - - Google Patents

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Publication number
JP2008297520A5
JP2008297520A5 JP2007147973A JP2007147973A JP2008297520A5 JP 2008297520 A5 JP2008297520 A5 JP 2008297520A5 JP 2007147973 A JP2007147973 A JP 2007147973A JP 2007147973 A JP2007147973 A JP 2007147973A JP 2008297520 A5 JP2008297520 A5 JP 2008297520A5
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JP
Japan
Prior art keywords
metal carbonate
epoxy resin
resin adhesive
adhesive composition
curable epoxy
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Application number
JP2007147973A
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Japanese (ja)
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JP2008297520A (en
JP4629069B2 (en
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Priority to JP2007147973A priority Critical patent/JP4629069B2/en
Priority claimed from JP2007147973A external-priority patent/JP4629069B2/en
Publication of JP2008297520A publication Critical patent/JP2008297520A/en
Publication of JP2008297520A5 publication Critical patent/JP2008297520A5/ja
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Publication of JP4629069B2 publication Critical patent/JP4629069B2/en
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Description

請求項１の発明は、剥離用エポキシ樹脂接着剤であって、金属炭酸塩を含み、酸水溶液による剥離が可能なことを特徴とする硬化性エポキシ樹脂接着剤組成物であり、酸による接着剤の剥離が可能となる。 The invention of claim 1, a peeling epoxy resin adhesive, seen containing a metal carbonate, a curable epoxy resin adhesive composition characterized by capable of removal by an aqueous acid solution, adhesion with acid The agent can be peeled off.

請求項２の発明は、前記 金属炭酸塩がアルカリ金属炭酸塩或いはアルカリ土類金属炭酸塩であることを特徴とする請求項１に記載の硬化性エポキシ樹脂接着剤組成物であり、弱酸水溶液での接着剤の剥離が可能となる。
The invention of claim 2 is the curable epoxy resin adhesive composition according to claim 1, wherein the metal carbonate is an alkali metal carbonate or an alkaline earth metal carbonate. The adhesive can be peeled off.

Claims (2)

剥離用エポキシ樹脂接着剤であって、金属炭酸塩を含み、酸水溶液による剥離が可能なことを特徴とする硬化性エポキシ樹脂接着剤組成物 A peeling epoxy resin adhesive, seen containing a metal carbonate, a curable epoxy resin adhesive composition characterized by capable of removal by an aqueous acid solution 前記 金属炭酸塩がアルカリ金属炭酸塩或いはアルカリ土類金属炭酸塩であることを特徴とする請求項１に記載の硬化性エポキシ樹脂接着剤組成物 2. The curable epoxy resin adhesive composition according to claim 1, wherein the metal carbonate is an alkali metal carbonate or an alkaline earth metal carbonate.
JP2007147973A 2007-06-04 2007-06-04 Acid release epoxy resin adhesive composition Active JP4629069B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007147973A JP4629069B2 (en) 2007-06-04 2007-06-04 Acid release epoxy resin adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007147973A JP4629069B2 (en) 2007-06-04 2007-06-04 Acid release epoxy resin adhesive composition

Publications (3)

Publication Number Publication Date
JP2008297520A JP2008297520A (en) 2008-12-11
JP2008297520A5 true JP2008297520A5 (en) 2010-04-30
JP4629069B2 JP4629069B2 (en) 2011-02-09

Family

ID=40171323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007147973A Active JP4629069B2 (en) 2007-06-04 2007-06-04 Acid release epoxy resin adhesive composition

Country Status (1)

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JP (1) JP4629069B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101083101B1 (en) * 2009-05-13 2011-11-16 한경덕 Solvent free composition for polysilicon ingot adhesion
CN103184022B (en) * 2011-12-30 2017-09-19 汉高股份有限及两合公司 Temporary bonding adhesive composition in being prepared for silicon chip

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823002B2 (en) * 1985-12-27 1996-03-06 松下電器産業株式会社 Thermosetting adhesive
JPH0711450A (en) * 1993-06-23 1995-01-13 Daiabondo Kogyo Kk Adhesive composition for plating
JP2002309215A (en) * 2001-04-11 2002-10-23 Three Bond Co Ltd Adhesive composition
JP2003286464A (en) * 2002-03-28 2003-10-10 Mitsui Chemicals Inc Epoxy adhesive composition
JP4199151B2 (en) * 2004-03-29 2008-12-17 イビデン株式会社 Adhesive and adhesive layer for printed wiring board

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