JP2008294293A - Vibration-wave motor, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vibration-wave motor having a vibrating body in which a piezoelectric-body material film, composed of a uniform composition of about 10-100 μm having a withstand voltage required as a vibration-wave motor, is formed in few processes that allow stable mass-production of the piezoelectric-body material film. <P>SOLUTION: The vibration-wave motor excites vibration in each metal elastic body 101 while applying a frequency voltage to a piezoelectric body (a piezoelectric-body material film 102) in order to relatively move a contact body in contact with a vibrating body 100 made of a piezoelectric body and each elastic body 101. The piezoelectric-body material film 102 generated by aerosolizing fine powder of a piezoelectric-body material is sprayed onto the end face of each elastic body 101 so as to directly film-form the piezoelectric body on each elastic body. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a vibration wave motor that applies a frequency voltage to a piezoelectric element to excite vibration in a vibrating body and relatively moves a contact body that contacts the vibrating body, and a method for manufacturing the same.

  Conventionally, a vibration wave motor that is generally used in practice has, for example, a ring-shaped or disk-shaped vibrating body as disclosed in Patent Document 1, and this vibrating body is a metal elastic body. The piezoelectric element is joined.

  When high-frequency voltages with different phases are applied to the two-phase electrode group formed on the piezoelectric element, two standing wave vibrations are excited in the elastic body by the vibration of the piezoelectric element, and these two standing wave vibrations are excited. Are combined into a traveling wave, and the surface of the elastic body moves elliptically. When the contact body is brought into pressure contact with the surface of the elastic body, the vibrating body and the moving body can be relatively driven.

  As the piezoelectric body of the above-described piezoelectric element, as shown in Patent Document 2, a powder of PZT (lead zirconate titanate) and an organic binder are mixed and formed into a desired shape by extrusion after extrusion, Thereafter, a bulk material that is fired at about 1200 ° C. has been put into practical use.

  Then, cutting or polishing machining is performed to obtain dimensional accuracy after firing, and then the electrode group described above is arranged to perform polarization. Then, as disclosed in Patent Document 3, the bulk material and the elastic body described above are bonded and integrated using an epoxy-based or acrylic thermosetting adhesive, and this is used as a vibrating body. .

In general, the relationship between the frequency voltage V and the displacement amount S of the piezoelectric element with respect to the voltage is as follows.
S = K · V / d (1)
It is expressed by the following formula. K is a proportionality constant. As shown in Expression (1), when the thickness d of the piezoelectric element is reduced, the predetermined displacement amount S can be obtained with a small frequency voltage. However, the bulk material piezoelectric element that is generally used as described above has a limitation in thin processing, and at present, a thickness of 0.1 mm is regarded as a processing limit.

  On the other hand, Patent Document 4, Patent Document 5 and Patent Document 6 propose a vibration wave motor in which a piezoelectric body having a thickness of less than 0.1 mm is formed on an elastic body by a screen printing method and a sputtering method. .

The technique disclosed in the above-mentioned patent document not only enables a thickness of less than 0.1 mm, but also uses an adhesive for fixing to an elastic body, which is essential in a bulk material that has been practically used in the past. Not. Therefore, it is possible to solve the problem that vibration transmission from the piezoelectric element to the elastic body is absorbed and degraded by the adhesive.
Japanese Patent Publication No. 1-17354 Japanese Patent Laid-Open No. 11-187777 Japanese Patent Laid-Open No. 05-095687 Japanese Unexamined Patent Publication No. Sho 63-31480 JP-A 63-186572 Japanese Patent Application Laid-Open No. 11-343569

  However, a vibration wave motor in which a piezoelectric body is formed on an elastic body by the above-described printing method and sputtering method has not yet been put into practical use. As shown by the above-described equation (1), theoretically, when the thickness d of the piezoelectric element is reduced, the predetermined displacement amount S can be obtained with a small frequency voltage. There is a limit to the thinness.

  That is, in the case of a vibration wave motor, a torque for rotating the contact body that contacts the vibration body is required, but the displacement amount S for obtaining the torque is a piezoelectric element such as an inkjet head other than the vibration wave motor. Compared with device application products, it is required at a level several steps higher.

  In order to give the displacement amount S to the piezoelectric element, it is necessary to apply a voltage equal to or higher than a corresponding predetermined frequency voltage to the piezoelectric element. For this purpose, the piezoelectric element must have a withstand voltage that can withstand it. Don't be. In order to have the withstand voltage, a piezoelectric element having a corresponding thickness is required.

  However, it is difficult to obtain a required withstand voltage in a piezoelectric element formed with a thickness of about several μm, and a piezoelectric element having a thickness of about 10 μm or more is required.

  In Patent Document 4, data indicating the relationship between the driving voltage and the film thickness of the piezoelectric element when the motor is driven by rotating the contact body is described, but only data with a film thickness of 10 μm or more is described. No data is shown for film thicknesses below that. The optimum film pressure is about 10 to 50 μm.

  However, in the printing method, since the formation of a film thickness of about 0.5 μm in one step is a limit, a printing process of 20 times or more is required to obtain a film thickness of 10 μm or more. Furthermore, since the next printed film cannot be formed unless heat treatment is performed after each printing step, the same number of heat treatment steps as the number of times of printing are required.

  Due to the problems described above, mass production of vibration wave motors by the printing method is extremely difficult from the viewpoint of the total number of processes, the total process time, and the resulting cost.

  On the other hand, the sputtering method can form a film thickness of 10 μm or more in one step, and there is no multi-step problem pointed out in the description of the printing method film formation.

  However, when a PZT film is formed by sputtering, the lead component of the PZT film has a higher sputtering rate than the titanium and zirconium components, so that lead is selectively etched and lead in the film is desired. There is a tendency to become less than the amount (Patent Document 6). Therefore, composition control is very difficult.

  Furthermore, these components may be unevenly distributed, and it is difficult to form a film with a uniform composition. Due to these problems, there is a problem that desired characteristics cannot be stably obtained, and mass production is still difficult.

  An object of the present invention is to provide a vibration having a vibrating body formed by a small number of steps capable of stably mass-producing a piezoelectric raw material film having a uniform composition of about 10 to 100 μm having a withstand voltage necessary for a vibration wave motor. It is to provide a wave motor.

  In order to achieve the above object, a method of manufacturing a vibration wave motor according to claim 1 applies a frequency voltage to a piezoelectric body to excite vibrations in a metal elastic body, thereby vibrating the piezoelectric body and the elastic body. In a vibration wave motor for relatively moving a contact body in contact with a body, a piezoelectric raw material film obtained by aerosolizing the piezoelectric raw material fine powder is sprayed on an end surface of the elastic body, and the piezoelectric body is applied to the elastic body. The film is formed directly.

  The vibration wave motor according to claim 12 applies a frequency voltage to the piezoelectric body to excite vibration in the metal elastic body, and relatively moves the contact body contacting the vibration body made of the piezoelectric body and the elastic body. In the manufacturing method of the vibration wave motor, the piezoelectric raw material film obtained by aerosolizing the piezoelectric raw material fine powder is sprayed on the end face of the elastic body, and the piezoelectric body is directly formed on the elastic body. Features.

  The vibration wave motor of the present invention applies a frequency voltage to a piezoelectric body to excite vibration in a metal elastic body, and relatively moves a contact body in contact with the vibration body made of the piezoelectric body and the elastic body. Then, a piezoelectric raw material film obtained by aerosolizing a piezoelectric raw material fine powder is sprayed onto the end face of the elastic body to form the piezoelectric body directly on the elastic body.

  With this configuration, a vibration wave motor having a vibration body in which a piezoelectric raw material film having a uniform composition of about 10 to 100 μm having a withstand voltage required as a vibration wave motor is formed in a small number of steps that can be stably mass-produced. Can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, a ceramic structure manufacturing method and a ceramic structure manufacturing apparatus using an aerosol deposition method in which a fine powder of a piezoelectric material is aerosolized and sprayed will be briefly described.

  FIG. 1 is a schematic diagram of an apparatus for producing a ceramic structure by an aerosol deposition method.

  As shown in FIG. 1, the ceramic structure manufacturing apparatus 1 includes a film forming unit 2 and an aerosol generating unit 3.

  Then, the film forming unit 2 and the aerosol generating unit 3 are connected by an aerosol transport pipe 4 that transports the aerosol in which the raw powder of the piezoelectric material generated in the aerosol generating unit 3 is dispersed in the gas to the film forming unit 2.

  The film forming section 2 has a vacuum chamber 20 that is evacuated by a vacuum pump 21, and is transported by an aerosol transport pipe 4 from a nozzle 5 disposed at an end of the aerosol transport pipe 4 led into the vacuum chamber 20. The aerosol 6 is sprayed onto the substrate 7b to form the film 7a. And the ceramic structure 7 by the film | membrane 7a and the board | substrate 7b is produced.

  The substrate 7b is usually fixed to the stage 8, and the film 7a is formed while moving the substrate 7b in the XY direction 8a.

  The aerosol generation unit 3 includes an aerosol generator 30, a gas transport pipe 31, and a mass flow controller 32 that injects gas into the aerosol generator 30 through the gas transport pipe 31. The other end of the aerosol transport tube 4 is inserted into the upper part of the aerosol generator 30.

  In the ceramic structure manufacturing apparatus using the aerosol deposition method described above, the present invention uses a piezoelectric raw material such as PZT as the ceramic, and a metal elastic body of a vibration wave motor as the substrate 7b. By forming a piezoelectric material film by the same method, a piezoelectric raw material film having a uniform composition of about 10 to 100 μm can be formed in a single process.

  Next, with reference to FIGS. 2 and 3, a state in which a piezoelectric raw material is formed by an elastic body of a vibration wave motor and an aerosol deposition method will be described.

  FIG. 2 is a perspective view of the vibrating body 100 formed of the elastic body 101 and the piezoelectric material film (piezoelectric body) 102 as viewed from the top, and FIG. 3 is a perspective view of the vibrating body 100 as viewed from the back (back) thereof.

  The elastic body 101 is formed in an annular shape. A piezoelectric raw material film 102 having a thickness t of about 10 to 100 μm is formed on one plane (the back surface shown in FIG. 3) of the elastic body 101. The piezoelectric raw material film 102 is not formed on the end surface central portion 101C of the elastic body 101. This is because a fixing jig used to fix the elastic body 101 to the stage 8 at the time of film formation is installed in the end surface central portion 101C. It is.

  The elastic body 101 has a plurality of grooves 101 </ b> A and a plurality of convex portions 101 </ b> B formed between the grooves on the surface opposite to the surface on which the piezoelectric raw material film 102 is formed. When the electrode film 103 is formed on the upper surface of the piezoelectric raw material film 102 and a frequency voltage (predetermined voltage) is applied, a piezoelectric element film (piezoelectric body) is formed.

  The vibration of the piezoelectric element film excites two standing wave vibrations in the elastic body 101 by the effect of the uneven structure of the groove 101A and the protrusion 101B. At this time, the standing wave vibration is effectively excited by the uneven structure of the groove 101A and the convex portion 101B. These two standing wave vibrations are combined into a traveling wave, the surface of the elastic body 101 moves elliptically, and a rotational movement is given to a contact body (not shown) that is in pressure contact with the upper surface of the convex portion 101B.

  2 and FIG. 3 is then subjected to a heat treatment that is allowed to stand for 1 to 2 hours at a temperature of about 500 to 700 ° C., so that the piezoelectric material film 102 is formed. Bake and harden. Thereafter, the electrode film 103 is formed by a sputtering method or a printing method, and then a polarization process is performed to convert the piezoelectric raw material film 102 into a piezoelectric element (piezoelectric body, piezoelectric element film). FIG. 4 shows the vibrating body 100 after the plurality of electrode films 103 are formed.

(Second Embodiment)
As described above, the vibrating body 100 on which the piezoelectric raw material film 102 is formed is then heat-treated to perform baking of the piezoelectric raw material film 102. At that time, the piezoelectric material film 102 may be peeled off from the elastic body 101 due to the difference in thermal deformation rate between the piezoelectric material film 102 and the metal elastic body 101.

  Means for solving the problem will be described with reference to FIGS. FIG. 5 shows a state in which the mask 104 is placed on the end face of the elastic body 101, and the piezoelectric material film 102 is formed in the same state. The mask 104 has a plurality of openings 104A, and the piezoelectric raw material film 102 formed on the surface of the elastic body 101 is formed in the openings 104A. A range of the frame and the crosspiece other than the opening 104 </ b> A of the mask 104 is not formed on the elastic body 101.

  FIG. 6 shows a state where the mask 104 is removed after film formation. The formed piezoelectric raw material film 102A is divided into a plurality of parts by the frame and the crosspiece of the mask 104, and a non-deposition range 101D is formed between each piezoelectric raw material film 102A.

  As described above, when the heat treatment process is performed in a configuration in which the piezoelectric raw material film 102A is divided and formed, the film forming portion that is generated due to the difference in thermal deformation rate between the elastic body 101 and the piezoelectric raw material film 102A is formed into the elastic body 101. The stress acting in the peeling direction from the film is relaxed by the non-deposition range 101D. As a result, the separation can be prevented even at the heat treatment temperature at which the piezoelectric raw material film 102 is peeled off in the non-divided film-formed product, and the heat treatment at a higher temperature is also possible.

  FIG. 7 shows a state in which a plurality of electrode films 103 are formed after heat treatment on the elastic body 101 in which the piezoelectric raw material film 102A is divided and formed. Each of the electrode films 103 is formed in the film surface of each of the plurality of piezoelectric raw material films 102A smaller than the piezoelectric raw material film 102A by a slight distance L, but is almost the same as the piezoelectric raw material film area 102A. It is formed in the shape.

  The characteristics of the piezoelectric element are proportional to the area of the electrode film 103, and it is desirable to form the electrode film 103 with as large an area as possible. However, when the electrode film 103 is formed on the upper surface of the elastic body 101 outside the piezoelectric raw material film 102A, an electrical leak occurs between the electrode film 103 and the elastic body 101, so that a slight distance L is required.

  Unlike the embodiment described above with reference to FIGS. 5 to 7, the position and area of the plurality of divided piezoelectric raw material films 102A are set so that the plurality of grooves 101A and the plurality of grooves 101A on the surface facing the film formation surface are the same. It is also possible to form it in association with the position and area of the convex portion 101B.

  As an example, the range corresponding to the back surface of the convex portion 101B is substantially the film forming range, and the range corresponding to the back surface of the groove 101A is substantially the non-film forming range. As a result, the amplitude amplification effect due to the uneven structure of the groove 101A and the convex portion 101B can be more effectively exhibited.

(Third embodiment)
FIG. 8 shows an AA cross section in FIG. 5 after film formation using the mask 104 described above. The divided piezoelectric raw material film 102A has a thickness of about 30 μm, and the crosspiece 104B of the mask 104 shows an example having a thickness of about 0.3 mm and a width of about 0.3 mm.

  In the drawing, the vicinity of both side surfaces of the crosspiece 104B of the piezoelectric material film 102A is a tapered portion 102A1. This is due to the spraying state of the aerosol 6 including the raw material of the piezoelectric body sprayed to the elastic body 101 which is the base material at the time of film formation by the aerosol deposition method.

  That is, not all of the aerosol is injected perpendicularly to the upper surface of the elastic body 101 like the aerosol 6A, but many aerosols are injected in an oblique direction like the aerosol 6B. Of the aerosol 6B sprayed obliquely, fine powder contained in the one that collides with and bounces off the lower part of the side surface of the crosspiece 104B and reaches the upper surface in the vicinity of the crosspiece 104B of the piezoelectric raw material film 102A being formed. An etching effect is achieved by scraping the formed piezoelectric raw material film 102A. As a result, a tapered portion 102A1 is generated.

  Of the piezoelectric material film 102A, the electrode film 103 cannot be formed on the upper surface of the tapered portion 102A1. That is, when the electrode film 103 is formed on the upper surface of the tapered portion 102A1 when the electrode film is formed by the sputtering method or the printing method, the electrode material enters from the gap created by the electrode film forming mask 104 and the tapered portion 102A1. . Then, the electrode film 103 is formed on the upper surface of the elastic body 101.

  Therefore, the electrode film 103 must be formed on the plane of the piezoelectric raw material film 102A avoiding the tapered portion 102A1, and therefore the area of the electrode film 103 is formed slightly smaller as shown in FIG.

  In order to avoid the mask frame generated in the mask 104 and the tapered portion 102A1 generated in the vicinity of the crosspiece 104B when the piezoelectric raw material film 102A is formed, Japanese Patent No. 3015869 discloses the mask 104 as the elastic body 101. A technique is disclosed that floats from the top surface.

  By floating the mask 104 to a position higher than the thickness of the piezoelectric raw material film 102A, the etching effect in the vicinity of the side surface of the crosspiece 104B described above can be eliminated, and the tapered portion 102A1 can be avoided.

  In the above-mentioned patent document, an example in which the opening of the mask is smaller than the nozzle opening area for injecting the aerosol or substantially equivalent to the nozzle opening area is described. However, in order to obtain a piezoelectric raw material film having a large area for obtaining desired piezoelectric characteristics, a mask 104 having a large opening area and a small width of the crosspiece 104B is employed, and the area much larger than the nozzle opening area is employed. When forming a film, there are the following problems.

  That is, when the mask 104 is arranged so as to float from the upper surface of the elastic body 101, the above-mentioned obliquely sprayed aerosol 6B enters into the gap between the mask 104 and the elastic body 101 that is generated, and forms a film there. Then, the adjacent piezoelectric raw material films 102A formed separately are connected.

  That is, as disclosed in JP-A No. 2002-190512, the film is sufficiently formed even if it is sprayed at an angle of 30 ° to 45 ° with respect to the vertical direction of the film forming surface of the elastic body 101 as the base material. The aerosol 6B having an angle of 45 ° or less is formed in the gap between the mask 104 and the elastic body 101.

  In the case of a width of 0.3 mm as in the crosspiece 104B shown in FIG. 8, when the mask 104 is placed floating by 0.15 mm or more, the angle entering the lower side of the crosspiece 104B from both the left and right openings 104A is 45 ° or less. The following problems are caused by the aerosol 6B from the oblique direction.

  That is, the piezoelectric raw material films 102A that are originally desired to be divided are connected to each other and the effect of preventing the peeling of the piezoelectric raw material films 102A during heat treatment is lost. In particular, if the distance between the upper surface of the piezoelectric body and the mask surface is set to 0.7 mm or more recommended by the above-mentioned Patent No. 3015869, the adjacent piezoelectric raw material films 102A are likely to be completely connected.

  Therefore, in order to form the electrode film 103 having a larger area without connecting the divided piezoelectric material film 102A, a stepped surface or a slope is formed on the cross-sectional side surfaces of the frame portion and the crosspiece portion of the mask.

  FIG. 10 shows an example in which stepped portions are provided on the cross-sectional side surfaces on the opening side of the frame portion and the crosspiece portion of the mask. The mask 105 of this example has a stepped portion 105A on the cross-sectional side surface on the opening side of the frame and the crosspiece that forms the opening. The step portion 105A is formed so that the width of the frame or crosspiece on the side in contact with the elastic body 101 is reduced.

  The width on the upper surface side of the mask 105 is 0.3 mm, the overall height of the mask 105 is 0.3 mm, and the width in the vicinity of the elastic body 101 is 0.15 mm. In the same configuration, the above-mentioned obliquely injected aerosol 6B collides with the side surface in the vicinity of the step portion 105A, and the piezoelectric material film 106 forms a tapered portion 106A in the vicinity of the side surface. However, it is formed in the vicinity of the crosspiece or the narrow part of the frame that contacts the elastic body 101.

  Therefore, the piezoelectric raw material film 106 having a wider plane portion can be obtained, and the electrode film 103 having a larger area can be formed. And since the mask 105 has the part which contacts the elastic body 101 between opening parts, the adjacent piezoelectric raw material film | membrane 106 does not connect.

(Fourth embodiment)
FIG. 11 shows an example in which slopes are provided on the cross-sectional side surfaces of the frame and crosspieces of the mask. The slope of the mask 107 is formed so that the contact portion with the elastic body 101 becomes narrow. Also in this example, as in the third embodiment, the piezoelectric raw material film 108 forms a tapered portion 108A in the vicinity of the lower surface of the slope. However, it is formed in the vicinity of the narrow portion of the crosspiece or frame that contacts the elastic body 101, and the piezoelectric raw material film 108 having a wider flat portion can be obtained.

(Fifth embodiment)
In the embodiment described above, an example in which the piezoelectric raw material film 102 or 102A is formed on the flat portion on the back side facing the contact surface with the rotating contact body in contact with the elastic body 101 has been described. However, depending on the vibration amount or amplitude amount in the d31 direction and d33 direction of the piezoelectric material, it may be better to form the piezoelectric material film on the side surface of the elastic body 101.

  The embodiment will be described with reference to FIG. The vibrating body 200 is configured by forming a piezoelectric raw material film 202 with a thickness t on the side surface of an elastic body 201. The thickness t is about 10 to 100 μm as in the first embodiment. Formation of the piezoelectric raw material film 202 on such a peripheral surface is difficult with other film forming methods.

  That is, the printing method is mainly a screen printing method, and it is difficult to form a film on a peripheral surface or a curved surface. Further, in the sputtering method, the concave and convex surfaces of the groove 201A and the convex portion 201B are necessary when forming the piezoelectric raw material film 202 in a slight gap due to the property of forming the film on the side surface of the elastic body 201. It is difficult to have a jig to avoid film formation. That is, it is difficult to make the jig correspond to the elastic body 201 whose dimensions vary during mass production.

  On the other hand, if it is an elastic body in which the piezoelectric raw material fine powder of the present invention is aerosolized and sprayed to directly form the piezoelectric element, film formation on the peripheral surface is possible and The piezoelectric raw material film 202 is not formed on the vertical surface.

  Therefore, it can be said that the film formation on the side surface of the elastic body 201 is a configuration that makes the most of the features of the present invention. The specific film formation is performed by injecting the aerosol 6 from the vicinity of the circumferential side of the elastic body 201 in the vertical direction while rotating around the center of the circumference of the elastic body 201 as the central axis.

  In addition, by arranging a mask having an opening on the circumferential side surface of the elastic body 201, the piezoelectric raw material film 202 can be divided and formed, and the techniques described in the second to fourth embodiments. Can also be implemented in this embodiment.

  As described in the above embodiment of the present invention, a piezoelectric raw material film having a uniform composition of about 10 to 100 μm having a withstand voltage necessary for a vibration wave motor can be manufactured in a small number of steps that can be stably mass-produced. Thus, it is possible to provide a vibration wave motor having a vibrating body formed in this manner.

  Furthermore, a vibration wave motor having means for solving the problem that the piezoelectric material film is peeled off from the vibrating body, which may occur in the heat treatment step after the formation of the piezoelectric material film, and better piezoelectric characteristics are exhibited. Thus, a vibration wave motor having an electrode film can be provided. And it is possible to form an electrode film having a larger area without connecting the divided piezoelectric material film.

  Further, means for solving the problem that the piezoelectric raw material film may be peeled off from the vibrating body, which may occur in the heat treatment step after the formation of the piezoelectric raw material film, and the electrode disposed on the piezoelectric raw material film after the heat treatment A vibration wave motor having means for providing a wider film area can also be provided. Furthermore, it becomes possible to perform the baking process at about 1200 ° C., which is essential for conventional bulk materials, at a low temperature of about 700 to 900 ° C.

It is a schematic diagram of the production apparatus of the ceramic structure by the aerosol deposition method. It is a top perspective view for demonstrating the vibrating body which formed the piezoelectric material raw material film which comprises the vibration wave motor which concerns on the 1st Embodiment of this invention. It is a back surface perspective view for demonstrating the vibrating body which formed the piezoelectric material raw material film which comprises the vibration wave motor which concerns on the 1st Embodiment of this invention. It is a back surface perspective view for demonstrating the vibrating body after forming the electrode film which comprises the vibration wave motor which concerns on the 1st Embodiment of this invention. It is a back surface perspective view for demonstrating the mask of the vibrating body which comprises the vibration wave motor which concerns on the 2nd Embodiment of this invention. It is a back surface perspective view for demonstrating the piezoelectric material raw material film | membrane formed by dividing | segmenting and forming the vibrating body which comprises the vibration wave motor which concerns on the 2nd Embodiment of this invention. It is a back surface perspective view for demonstrating the vibrating body after forming the electrode film which comprises the vibration wave motor which concerns on the 2nd Embodiment of this invention. It is principal part sectional drawing of the vibrating body of the prior art relevant to the vibrating body which comprises the vibration wave motor which concerns on the 3rd Embodiment of this invention. It is a figure of the state which formed the electrode film in the vibrating body of FIG. It is principal part sectional drawing of the vibrating body which comprises the vibration wave motor which concerns on the 3rd Embodiment of this invention. It is principal part sectional drawing of the vibrating body which comprises the vibration wave motor which concerns on the 4th Embodiment of this invention. It is a back surface perspective view of the vibrating body which comprises the vibration wave motor which concerns on the 5th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ceramic structure production apparatus 2 Film formation part 3 Aerosol generating part 4 Aerosol conveyance pipe 5 Nozzle 6, 6A, 6B Aerosol 7 Ceramic structure 100, 200 Vibrating body 101, 201 Elastic body 101A, 201A Groove 101B, 201B Convex part 101D Non-deposition range 102, 202 Piezoelectric raw material film 102A, 106, 108 Divided piezoelectric raw material film 102A1, 106A, 108A Taper-shaped part 103 Electrode film 104, 105 Mask 104A Opening 104B Crosspiece 105A Step part

Claims (12)

  In the manufacturing method of the vibration wave motor, the frequency voltage is applied to the piezoelectric body to excite vibration in the metal elastic body, and the contact body that contacts the vibrating body made of the piezoelectric body and the elastic body is relatively moved. A method for manufacturing a vibration wave motor, comprising: spraying a piezoelectric raw material film obtained by aerosolizing the piezoelectric raw material fine powder onto an end face of an elastic body, and forming the piezoelectric body directly on the elastic body.   2. The method for manufacturing a vibration wave motor according to claim 1, wherein the piezoelectric material film is directly formed on the elastic body, and then heat treatment is performed.   3. The method of manufacturing a vibration wave motor according to claim 2, wherein an electrode film is disposed on the piezoelectric raw material film after the heat treatment.   4. The method of manufacturing a vibration wave motor according to claim 3, wherein after the electrode film is disposed, a predetermined voltage is applied through the electrode film to perform polarization treatment to form a piezoelectric element film.   4. The method of manufacturing a vibration wave motor according to claim 3, wherein the thickness of the piezoelectric raw material film after the heat treatment is 10 to 100 [mu] m.   6. The vibration wave according to claim 1, wherein a mask having an opening is disposed on an end face of the elastic body, and the piezoelectric raw material film is divided and formed on the elastic body. A method for manufacturing a motor.   The electrode film disposed on the piezoelectric material film formed by dividing and forming is formed so as to be smaller and substantially the same shape as the piezoelectric material film formed by dividing the film. The method of manufacturing a vibration wave motor according to claim 6.   8. The method of manufacturing a vibration wave motor according to claim 7, wherein a stepped portion or a slope is formed on a cross-sectional side surface on the opening side of the frame portion and the crosspiece portion of the mask.   9. The vibration wave motor according to claim 1, wherein the elastic body has an annular shape or a disk shape, and the piezoelectric material film is formed on one plane of the elastic body. Manufacturing method.   The elastic body has a plurality of grooves and a plurality of protrusions on a plane opposite to one plane, and the piezoelectric raw material film formed by dividing and forming the plurality of grooves and the plurality of protrusions on a plane. The method for manufacturing a vibration wave motor according to claim 9, wherein the film is formed by being divided in association with the position and area of the portion.   9. The elastic body according to claim 1, wherein the elastic body has an annular shape or a disk shape, and the piezoelectric raw material film is formed on a side surface of the elastic body. Manufacturing method of vibration wave motor.   In a vibration wave motor that applies a frequency voltage to a piezoelectric body to excite vibration in a metal elastic body and relatively moves a contact body that is in contact with the vibration body made of the piezoelectric body and the elastic body, A vibration wave motor characterized in that a piezoelectric raw material film obtained by aerosolizing the piezoelectric raw material fine powder is sprayed on an end face, and the piezoelectric body is directly formed on the elastic body.

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