JP2008292876A - Cooling device, electronic equipment and image forming device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device, electronic equipment and an image forming device capable of removing a cooling object and a heat receiving part in a small space. <P>SOLUTION: The cooling device consists of a passage connecting the heat receiving part which is closer to or contacts the cooling object and absorbs heat, a cooling fluid supply means to supply cooling fluid to the heat receiving part, and a heat dissipation means to exchange heat between the cooling fluid heated at the heat receiving part and air. At least part of the surface of the heat receiving part consists of a deformable member which is deformed by the pressure of the cooling fluid and is closer to or contacts the cooling object. Thus, the cooling device can be provided in which the heat receiving part can be placed at a position apart from the cooling object, and the cooling object and the heat receiving part can be individually removed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cooling device, an electronic apparatus, and an image forming apparatus. Specifically, the cooling target portion of an electronic apparatus such as an image forming apparatus is cooled by bringing a heat receiving portion through which a coolant flows in the internal flow path close to or in contact with each other. The present invention relates to a cooling device that is detachable from an object to be cooled.

First, an outline of heat generated in an electronic device and problems caused by the heat will be described by taking an electrophotographic image forming apparatus which is one of the electronic devices as an example.
FIG. 7 is a schematic cross-sectional view showing the configuration of the electrophotographic image forming apparatus. As shown in the figure, in the case of a copying machine as an example of an electrophotographic image forming apparatus, image information is read by an optical apparatus 101, and electrostatic latent images are formed on a photosensitive drum 102 of an image forming unit according to the image information. Light for writing an image is emitted from the writing device 103. In the image forming unit 104, a charging device 105, a developing device 106, a cleaning device 107, and a neutralizing device (not shown) are disposed around the photosensitive drum 102. The charging device 105 is a contact charging method that employs a charging roller, and uniformly charges the surface of the photosensitive drum 102 by applying a voltage while contacting the photosensitive drum 102. As the charging device 105, a non-contact charging type charging device employing non-contact scorotron charging or the like may be employed. The developing device 106 attaches toner in the developer to the latent image on the photosensitive drum 102 to form a toner image. The cleaning device 107 removes unnecessary toner on the photosensitive drum 102. As the cleaning device 102, a blade configured to be pressed against the photosensitive drum 102 can be used. The static eliminator is composed of a lamp, and initializes the surface potential of the photosensitive drum 102 by irradiating light. The recording medium on which the toner image is transferred is heated and pressurized by the fixing device 108 to fix the toner on the recording medium. Further, when recording on both sides of the recording medium, the front and back sides of the recording medium are reversed in the duplex unit 109 and conveyed again upstream, and the above process is performed again.

  These processes are accompanied by heat generation and temperature rise. That is, in the optical device 101, a scanner lamp that scans a document and a scanner motor that drives the scanner lamp generate heat, in the writing device 103, a motor that drives a polygon mirror that rotates at high speed generates heat, and in the developing device 106, toner is used. The temperature due to frictional heat due to the stirring of the toner and the developer during charging is increased. Further, in the fixing device 108, the temperature of the peripheral portion is increased due to the heat of the heater for heat fixing, and the recording medium after fixing becomes high temperature, so that the temperature of the duplex unit 109, which is the subsequent transport path, is increased. .

  Therefore, in general, each part of the apparatus is cooled by forced convection heat transfer using a cooling fan and a duct. However, in recent years, due to the increase in temperature of each unit due to the increase in speed and the increase in the density in the equipment accompanying the downsizing and colorization, the duct space becomes smaller and it is becoming difficult to supply an airflow sufficient for cooling.

  On the other hand, liquid cooling can be mentioned as a method that can be efficiently cooled even in a narrow space. Forming a flow path at a temperature rise location, or bringing a heat receiving part that has formed a flow path into close contact or proximity, and supplying heat to the flow path at a lower temperature than the temperature rise location to take heat away from the temperature rise location It is. In general, the coolant is mainly composed of water, and propylene glycol or ethylene glycol is added to lower the freezing temperature, or a rust inhibitor (for example, phosphate-based material: phosphoric acid to prevent rusting of metal components) Potassium salt, inorganic potassium salt, etc.) are added and used. Since a liquid having a larger heat capacity than air is used and a large amount of heat can be absorbed with a small flow rate, sufficient cooling can be performed without requiring a large space.

  FIG. 8 is a schematic configuration diagram showing a configuration of a general liquid cooling apparatus. As shown in the figure, the heat receiving portion 203, the reserve tank 204, the heat radiating portion 205, and the pump 206, which are in close contact with the temperature rising portion 202, are connected via a pipe 201. The cooling liquid warmed in the heat receiving unit 203 is cooled by the heat radiating unit 205 so that a predetermined amount of the cooling liquid is circulated for cooling. The heat radiating unit 205 includes a flow path formed in the good heat conductive member and fins by the good heat conductive member connected to the flow path, and cools the flow path and the fin by forced convection heat transfer using a cooling fan. As a result, the temperature of the coolant flowing in the flow path is lowered.

  By the way, in the image forming apparatus, when the maintenance or recording medium is jammed in the internal conveyance path, it is necessary to take out the developing device, the fixing device, the double-side unit, etc. out of the device or even if it is not completely removed. is there. When taking out the part having the heat receiving part, use a coupler to divide the pipe and take it out with the heat receiving part attached, or remove the heat receiving part from the temperature rising part. Generally, the method of removing the heat receiving part and taking out the other part is generally used.

  However, in the method using a coupler, since the pressure loss due to the coupler is generally large, if the pressure loss is increased, the size of the coupler must be increased, and the advantage of liquid cooling that cooling is possible in a narrow space can be utilized. Can not. Also, if a small coupler is used and a high-power pump is used to compensate for the pressure loss of the coupler, the power will be increased to drive the pump, and the coolant and the ambient temperature of the pump will be reduced due to heat generated by the pump. There is a problem of raising.

In order to solve such problems, several proposals have been made conventionally. As a method of removing the heat receiving portion, in Patent Document 1, the cooling means that removes the heat around the flow path by flowing the coolant through the flow path is installed in a part of the casing that supports the unit to be cooled. In addition, an image forming apparatus having an urging means for urging the flow path with respect to a unit set in the apparatus main body has been proposed. Patent Document 2 discloses a photosensitive drum, an exposure device, a charging roller, a developing device, a transfer device, and a cleaning device that are detachably provided on a housing and constitute an image forming unit for forming an image on transfer paper. And a fixing device, a liquid cooling device provided in the housing, and a heat exchange member for exchanging heat between the image forming unit and the liquid cooling device, and when the image forming unit is mounted on the housing An image forming apparatus configured to bring a heat exchange member into contact with a liquid cooling device has been proposed.
JP 2005-164927 A JP 2007-047540 A

  However, according to the above-mentioned Patent Document 1, an urging means must be provided, and a mechanism for releasing the urging means manually or automatically when removing it is also required. Furthermore, since the urging means and the release mechanism are arranged around the cooling means, it becomes difficult to cool in a narrow space. In addition, Patent Document 2 is arranged such that the object to be cooled is separated from the liquid cooling system, and heat exchange is performed by contact / non-contact of the heat exchange member to facilitate attachment / detachment of the object to be cooled. An increase in thermal resistance due to the replacement member is unavoidable and cooling efficiency is lowered.

  SUMMARY An advantage of some aspects of the invention is that it provides a cooling device, an electronic apparatus, and an image forming apparatus in which a cooling object and a heat receiving unit can be detached in a narrow space.

  In order to solve the above problems, the cooling device of the present invention includes a heat receiving unit that absorbs heat of a cooling target object in proximity to or in contact with the cooling target object, and a cooling liquid that supplies the cooling liquid to the heat receiving part. It is comprised using the pipe line which connects a supply means and the thermal radiation means which heat-exchanges between the cooling fluid warmed by the heat receiving part, and air. And at least one part of the surface of the heat receiving part in the cooling device of this invention is deform | transformed with the pressure of a cooling fluid, and is characterized by being comprised by the deformation member which adjoins or contacts a cooling target object. Therefore, the heat receiving part can be provided at a position separated from the object to be cooled, and a cooling device in which the object to be cooled and the heat receiving part can be individually detached can be provided.

  Moreover, it is preferable that an opening means for opening the inside and the atmosphere is provided in any one of the coolant supply means, the heat radiating means, and the conduit.

  Further, the flow passage cross-sectional area of the connection portion where the cooling liquid flows from the pipe line to the heat receiving portion is larger than the flow passage cross-sectional area of the connection portion where the cooling liquid flows from the heat receiving portion to the pipe passage. It is possible to easily increase the pressure of the cooling liquid in the heat receiving unit simply by driving, and thus the object to be cooled and the heat receiving unit can be attached and detached in a narrow space.

  Further, by providing the cooling liquid supply means with a deformation means that is deformed by the pressure of the cooling liquid downstream from the heat receiving section, the heat receiving section can be expanded simply by driving the cooling liquid supply means. The object to be cooled and the heat receiving part can be attached and detached in the space.

  Furthermore, since the deformable member is a flexible member, the deformable member can be easily deformed by the pressure of the coolant.

  Further, since the deformable member has a bellows structure, the deformable member can be easily deformed by the pressure of the coolant.

  Furthermore, an electronic device as another invention is characterized in that the cooling device is mounted.

  An image forming apparatus as another invention is characterized in that the cooling device is mounted.

  At least a part of the surface of the heat receiving portion in the cooling device of the present invention is configured by a deformable member that is deformed by the pressure of the coolant and approaches or contacts the object to be cooled. Therefore, the heat receiving part can be provided at a position separated from the object to be cooled, and the cooling object and the heat receiving part can be detached individually.

  FIG. 1 is a schematic configuration diagram showing a configuration of a cooling device for an electronic device according to a first embodiment of the present invention. The electronic apparatus cooling apparatus 10 according to the present embodiment shown in the figure includes a heat receiving portion 13 including a deformable member 11 and a liquid cooling jacket 12, a radiator 14 of a heat radiating means, a tank 15, and a coolant supply. A pump 16 as a means is connected by a copper pipe 17. (A) of the figure is a state where the pump 16 is stopped, and (b) of the figure is a state where the pump 16 is operating. In (a) of the figure, the object 18 to be cooled and the deformable member 11 in the heat receiving portion 13 are separated from each other with a predetermined interval. The pressure P1 of the coolant in this state is almost constant in the cooling device. When the atmospheric pressure is P, P1 = P. When the pump 16 is operated from this state and the pressure in the cooling jacket 12 is Pj and the pressure in the tank 15 is Pt, Pj> P1> Pt. Thereby, the deformable member 11 is deformed so as to expand. By making the distance between the cooling object 18 and the deformation member 11 smaller than the deformation amount of the deformation member 11 when the pump is stopped, the contact or separation between the cooling object 18 and the deformation member 11 is switched by operating / stopping the pump 16. be able to. In the present embodiment, the opening / closing valve 19 is provided in the tank 15, but this is not restrictive. The opening / closing valve 19 only needs to be opened when switching the operation / stop of the pump 16, and considering the mixing of dust, dust, etc. and the decrease in the coolant, the opening / closing valve 19 is opened only when switching the operation / stop of the pump 16. It is desirable to be done. Moreover, although the cooling target 18 and the deformation | transformation member 11 are contacting by operating the pump 16, you may deform | transform the deformation member 11 to the close position which does not reach a contact. For the deformable member 11, rubber such as butyl rubber or EPDM, resin, or the like can be used as the flexible member. When the deformable member 11 is cooled by being brought into contact with the temperature-rising object 18, the thermal conductivity can be improved by forming a multilayer structure with a resin layer such as polyurethane on the aluminum thin film layer. Moreover, the deformation | transformation member 11 can be more reliably restored from the deform | transformed state by comprising with a member which has elasticity.

  FIG. 2 is a schematic configuration diagram illustrating a configuration of a cooling device for an electronic device according to a second embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same components. In the cooling apparatus 20 for an electronic device according to the present embodiment shown in the figure, the tank 15 in the cooling apparatus 10 according to the first embodiment is replaced with a tank 21 made of an elastic member that can be deformed by pressure. . (A) of the figure is a state where the pump 16 of the cooling device is stopped, and (b) of the figure is a state where the pump 16 is operating. In (a) of the figure, the object to be cooled 20 and the deformable member 11 in the heat receiving portion 13 are separated from each other with a predetermined interval. Further, the elastic member of the tank 21 is not deformed. The pressure P1 of the coolant in this state is almost constant in the cooling device. When the atmospheric pressure is P, P1 = P. When the pump 16 is operated from this state and the pressure in the cooling jacket 12 is Pj and the pressure in the tank 21 is Pt, Pj> P1> Pt. As a result, the deformable member 11 is deformed so as to expand, and the tank 21 contracts. By switching the distance between the cooling object 18 and the deformation member 11 when the pump is stopped to be smaller than the deformation amount of the deformation member, the contact or separation between the cooling object 18 and the deformation member 11 is switched by operating or stopping the pump 16. Can do. The amount of deformation can be adjusted by changing the material of the deformable member 11 and the tank 21 of the heat receiving portion 13.

  FIG. 3 is a schematic cross-sectional view showing the configuration of the heat receiving portion of the cooling device according to the present invention. The heat receiving part 13 shown in the figure contacts or separates from a cooling object (not shown) via a deforming member (not shown). The heat receiving part 13 is connected to the tube 13-3 at the inflow part 13-1 and the outflow part 13-2, and the cross-sectional area of the flow path of the inflow part 13-1 is greater than the cross-sectional area of the flow path of the outflow part 13-2. Suppose it's big. When the flow velocities at the inflow portion 13-1 and the outflow portion 13-2 when the pump is operating are Vi and Vo, respectively, the flow rate is constant, so Vi <Vo.

Further, the Bernoulli's law than ^{Vi 2/2 + Pi / ρ} = Vo 2/2 + Po / ρ
ΔP = Pi−Po = (Vo ² −Vi ² ) / 2ρ> 0
It becomes.

  Therefore, the pressure in the heat receiving portion increases by ΔP. Thereby, the deformation member 11 of the heat receiving portion 13 is deformed.

  FIG. 4 is a schematic sectional view showing an example of the configuration of the heat receiving portion of the cooling device according to the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same components. (A) of the figure is a state in which the pump (not shown) of the cooling device is stopped, and the liquid cooling jacket 12 is arranged so that the surface of the deformable member 11 and the cooling target portion 18 are separated by a predetermined distance. As described above, the deformable member 11 is composed of two layers of an aluminum thin film (cooling target side) and a polyurethane layer (cooling liquid side). (B) of the figure is the state which operated the pump (not shown) of a cooling device. Due to the operation of the pump, the pressure of the coolant in the cooling jacket 12 rises, and the deformable member 11 is deformed and comes into contact with the object 18 to be cooled.

  FIG. 5 is a schematic sectional view showing another example of the configuration of the heat receiving portion of the cooling device according to the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same components. (A) of the figure shows a state in which the pump (not shown) of the cooling device is stopped, and the liquid cooling jacket 12 is arranged such that the deformable member 11 and the cooling target portion 18 are separated by a predetermined distance. The deformable member 11 is composed of two layers of an aluminum thin film (cooling target side) and a polyurethane layer (cooling liquid side), and has a bellows structure. (B) of the figure is the state which operated the pump (not shown) of a cooling device. Due to the operation of the pump, the pressure of the coolant in the cooling jacket 12 rises, and the deformable member 11 is deformed and comes into contact with the object 18 to be cooled.

  FIG. 6 is a schematic cross-sectional view showing the configuration of an image forming apparatus provided with the cooling device of the present invention. In the figure, the cooling device of the present invention cools the upper portions of the duplex unit 31, the developing unit 32, and the fixing unit 33 that need to be pulled out for maintenance or the like. In the image forming apparatus of the present embodiment, the heat receiving unit 34 provided in the duplex unit 31, the heat receiving unit 35 provided in the developing unit 32, the heat receiving unit 36 provided in the fixing unit 33, the tank 37, the radiator 38, the pump It connects by the copper pipe 40 in order of 39, and each location is cooled because a cooling fluid circulates. Since these heat receiving portions 34 to 36 can be attached to and detached from the respective portions, removal at the time of maintenance becomes easy. In this embodiment, the cooling liquid is circulated in the order of the upper part of the duplex unit 31, the developing unit 32, and the fixing unit 33. However, the order is not limited to this, and the order may be changed depending on the heat generation amount and the allowable temperature. Moreover, it can also be set as the independent structure which consists of a tank, a radiator, a pump, and a copper pipe about each location.

  In addition, this invention is not limited to the said embodiment, It cannot be overemphasized that various deformation | transformation and substitution are possible if it is description in a claim.

It is a schematic block diagram which shows the structure of the cooling device of the electronic device which concerns on the 1st Embodiment of this invention. It is a schematic block diagram which shows the structure of the cooling device of the electronic device which concerns on the 2nd Embodiment of this invention. It is a schematic sectional drawing which shows the structure of the heat receiving part of the cooling device in this invention. It is a schematic sectional drawing which shows an example of a structure of the heat receiving part of the cooling device in this invention. It is a schematic sectional drawing which shows another example of a structure of the heat receiving part of the cooling device in this invention. It is a schematic sectional drawing which shows the structure of the image forming apparatus provided with the cooling device of this invention. 1 is a schematic cross-sectional view illustrating a configuration of an electrophotographic image forming apparatus. It is a schematic block diagram which shows the structure of a general liquid cooling device.

Explanation of symbols

10, 20; cooling device, 11; deformation member, 12; liquid cooling jacket,
13; Heat receiving part, 14; Radiator, 15, 21; Tank,
16; pump, 17; copper pipe, 18; cooling object, 19;

Claims (8)

A heat receiving part that absorbs heat of the object to be cooled in proximity to or in contact with the object to be cooled, a coolant supply means for supplying a cooling liquid to the heat receiving part, and a coolant and air warmed by the heat receiving part In a cooling device configured using a pipe line connecting a heat radiating means for exchanging heat with
A cooling device, wherein at least a part of a surface of the heat receiving portion is deformed by a pressure of a cooling liquid, and is configured by a deforming member that comes close to or contacts the object to be cooled.   2. The cooling device according to claim 1, wherein an opening means for opening the inside and the atmosphere is provided in any one of the cooling liquid supply means, the heat radiation means, and the conduit.   The flow path cross-sectional area of the connection portion where the cooling liquid flows from the pipe line to the heat receiving portion is larger than the flow path cross-sectional area of the connection portion where the cooling liquid flows from the heat reception portion to the pipe line. Item 2. The cooling device according to Item 1.   The cooling device according to claim 1, wherein a deformation unit that deforms with the pressure of the cooling liquid is provided downstream of the heat receiving unit with respect to the cooling liquid supply unit.   The cooling device according to claim 1, wherein the deformable member is a flexible member.   The cooling device according to claim 1, wherein the deformable member has a bellows structure.   An electronic apparatus comprising the cooling device according to claim 1.   An image forming apparatus comprising the cooling device according to claim 1.

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