JP2008277404A - Thermoelectric module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric module wherein the specified number of p-type thermoelectric elements and n-type thermoelectric elements are arranged in a plane shape, one set of thin-film substrates with an electrode provided respectively are fitted to both end faces of the p-type and n-type thermoelectric elements, and the p-type and n-type thermoelectric elements are connected in series and that can entirely equalize stress to be loaded during assembly of the thermoelectric module, to the water cooling plate of a heat exchanging unit and an opposite member to a heat exchanging plate or the like, uniformly and thoroughly bring the thermoelectric module to the opposite member, reduce contact thermal resistance between the thermoelectric module and the opposite member, and improve its performance and quality. <P>SOLUTION: A fitting hole penetrates the central portion of one-side thin-film substrate and another-side thin-film substrate in the thermoelectric module, and such the fitting hole also penetrates the vicinity thereof. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

    In the present invention, a predetermined number of p-type thermoelectric elements and n-type thermoelectric elements are arranged in a plane, and one side electrode of one side thin film substrate is attached to one side of the p-type thermoelectric element and the n-type thermoelectric element, and the other The present invention relates to a thermoelectric module in which the other side electrode of the side thin film substrate is attached to the other surface of the p-type thermoelectric element and the n-type thermoelectric element, and the p-type thermoelectric element and the n-type thermoelectric element are connected in series.

    The basic configuration of the thermoelectric module is, as is well known, one side electrode in which all of a predetermined number of p-type thermoelectric elements and n-type thermoelectric elements arranged in a plane are attached to one surface of each thermoelectric element, It is connected in series with the other side electrode attached to the other side of the thermoelectric element, and the one side electrode and the other side electrode are respectively installed on the flexible substrate for the purpose of obtaining a large capacity in a large area. The thermoelectric module which consists of is provided (for example, refer patent document 1).

  Further, the thermoelectric module A shown in FIGS. 9 and 10 is provided to obtain flexibility, for example, for the purpose of improving assemblability when manufacturing a heat exchange unit, and a predetermined number arranged in a planar shape. Of the p-type thermoelectric element P and the n-type thermoelectric element N, the one-side thin film substrate B in which a predetermined number of one-side electrodes Bt, Bt... Are arranged on the base film Bb, and the predetermined number of one-side electrodes Ct on the base film Cb. , Ct... Are sandwiched between the thin film substrates C on one side.

  Further, in the thermoelectric module A, the one side electrodes Ct, Ct... Of the one side thin film substrate B are attached to one side of the p-type thermoelectric element P and the n-type thermoelectric element N, and the other side of the other side thin film substrate C. All the p-type thermoelectric elements P and the n-type thermoelectric elements N are connected in series by attaching the electrodes Ct, Ct... To the other surface of the p-type thermoelectric element P and the n-type thermoelectric element N.

  Incidentally, the pair of end electrodes T, T disposed on the one-side thin film substrate B are connected to one side with a plus-side lead wire W (p) and to the other side with a minus-side lead wire W (m). Is connected.

FIG. 11 shows a heat exchange unit manufactured using the above-described thermoelectric module A. The heat exchange unit U sandwiches the thermoelectric module A between the water cooling plate I and the heat exchange plate H, and A plurality of locations in the outer peripheral area of the water-cooled plate I and the heat exchange plate H that do not interfere with the module A are fastened to each other using set screws S, S.
JP 2005-507157 A

    By the way, in the heat exchange unit U using the conventional thermoelectric module A described above, a plurality of locations in the outer peripheral area of the water cooling plate I and the heat exchange plate H are fastened to each other by a set screw S. An uneven load is applied to the outer peripheral portion, and the water cooling plate I and the heat exchange plate H are warped and deformed as shown by a two-dot chain line in FIG. 11 due to the tightening force of the screw S, and the contact with the thermoelectric module A is uneven. Therefore, the contact thermal resistance with respect to the water-cooled plate I and the heat exchange plate H is increased easily, thereby causing the performance and quality of the heat exchange unit U to be reduced.

  In order to solve the above inconvenience, the thickness of the water cooling plate I and the heat exchange plate H is increased so as not to be deformed by the tightening force of the set screw S, or the rigidity is increased, or the water cooling plate I and the heat exchange plate H are increased. Although measures such as using a material with high rigidity are conceivable, there is a disadvantage that the heat exchange unit U is increased in size and the manufacturing cost is increased.

  In view of the above situation, the present invention can uniformize the stress applied to the mating members such as the water cooling plate and the heat exchange plate of the heat exchange unit throughout the assembly of the thermoelectric module. In addition, the thermoelectric module can be uniformly contacted with the mating member over the whole, and thus the contact thermal resistance with the mating member can be reduced. For example, the performance and quality of the heat exchange unit can be reduced. An object of the present invention is to provide a thermoelectric module capable of achieving improvement.

    In order to achieve the above object, a thermoelectric module according to claim 1 includes a predetermined number of p-type thermoelectric elements and n-type thermoelectric elements arranged in a plane, and one side electrode on one side thin film substrate is connected to the p-type thermoelectric element and Attaching to one side of the n-type thermoelectric element, attaching the other side electrode of the other side thin film substrate to the other side of the p-type thermoelectric element and the n-type thermoelectric element, and connecting the p-type thermoelectric element and the n-type thermoelectric element in series A thermoelectric module comprising a mounting hole penetrating through a central region of one thin film substrate and the other thin film substrate, and a mounting hole penetrating through a peripheral region of the one thin film substrate and the other thin film substrate. It is characterized by.

  The thermoelectric module related to the invention of claim 2 is the thermoelectric module related to the invention of claim 1, wherein the mounting holes are formed on the film base of the one side thin film substrate and the other side thin film substrate, and the metal formed on the surface of the film base It is characterized by being formed through the foil layer.

    According to the structure of the thermoelectric module relating to the invention of claim 1, the water cooling plate constituting, for example, the heat exchange unit is formed by penetrating the mounting holes in the central region and the peripheral region of the one side thin film substrate and the other side thin film substrate. Assembling the thermoelectric module by clamping the thermoelectric module between the central area and the peripheral area of the thermoelectric module with a setscrew that is inserted through the upper mounting hole. It is possible to equalize the stress applied at the time over the entire area, and to make the thermoelectric module uniformly contact with the mating member over the entire area, and thus contact with the mating member. It is possible to obtain a thermoelectric module that can reduce the thermal resistance and can achieve, for example, improved performance and quality in the heat exchange unit.

  According to the configuration of the thermoelectric module related to the invention of claim 2, the mounting hole is formed by penetrating the film base of the one side thin film substrate and the other side thin film substrate and the metal foil layer, so that the periphery of the mounting hole is Reinforced by the metal foil layer, the strength is greatly improved, so that inadvertent damage can be prevented in advance.

Hereinafter, the configuration of the present invention will be described in detail with reference to the drawings illustrating embodiments.
1 to 4 show an embodiment of a thermoelectric module according to the present invention. The thermoelectric module 1 includes a predetermined number of p-type thermoelectric elements P, P... Arranged in a plane and a predetermined number of n. , And one thin film substrate 10 and the other thin film substrate 20 that sandwich all the p-type thermoelectric elements P and the n-type thermoelectric elements N from above and below.

  The one side thin film substrate 10 is formed by disposing a predetermined number of one side electrodes 12, 12... On the surface of a base film 11 having a rectangular shape, and the other side thin film substrate 20 is a base having a rectangular shape. A predetermined number of the other side electrodes 22, 22... Are arranged on the surface of the film 21. The one side electrodes 12, 12... Of the one side thin film substrate 10 are connected to the p-type thermoelectric element P and the n-type thermoelectric element. All the p-type thermoelectric elements P and n-type thermoelectric elements N are soldered to the other surface of the p-type thermoelectric element P and the n-type thermoelectric element N. Type thermoelectric element P and n type thermoelectric element N are connected in series with each other.

  As shown in FIGS. 3 and 4, the pair of end electrodes 12t, 12t disposed on the base film 11 of the one-side thin film substrate 10 is soldered with a plus-side lead wire 30A on one side. On the other hand, the negative lead wire 30B is soldered.

  As shown in FIG. 2, a mounting hole 14 is formed through the central region of the base film 11 in the one-side thin film substrate 10, and the four regions of the base film 11 are also formed in the peripheral region of the base film 11. Attaching holes 14, 14... Are formed along the edge, and the base film 11 of the one-side thin film substrate 10 avoids the one-side electrodes 12, 12,. A total of nine mounting holes 14, 14... Are formed.

  On the other hand, as shown in FIG. 1, a mounting hole 24 is formed through the central region of the base film 21 in the other thin film substrate 20, and the base film 21 is also formed in the peripheral region of the base film 21. Attaching holes 24, 24... Are formed so as to penetrate along the edges of the four sides, and the base film 21 of the other side thin film substrate 20 has the above-mentioned one side thin film substrate 10 in the central region and the peripheral region. A total of nine mounting holes 24, 24... Are formed in a manner opposite to the mounting holes 14, 14.

  As shown in FIGS. 4, 5 and 6, the attachment holes 14, 14... In the one-side thin film substrate 10 are formed on the reinforcing film 13 formed on the surface of the base film 11 and formed of a rectangular metal foil layer. 11 (see FIG. 7B). Further, the three reinforcing portions 13 arranged along the side edges (upper and lower edges in the figure) of the base film 11 are connected by the crosspieces 13 (l) extending along the side edges of the base film 11. Has been.

  Similarly, the attachment holes 24, 24... In the other side thin film substrate 20 are formed through the reinforcing portion 23 made of a rectangular metal foil layer formed on the surface of the base film 21 together with the base film 21 (FIG. 7). (See (a)). Further, the three reinforcing portions 23 arranged along the side edges (upper and lower edges in the figure) of the base film 21 are connected by the crosspieces 23 (l) extending along the side edges of the base film 21. Has been.

  Here, the one-side thin film substrate 10 is provided with a base film 11 having a metal foil layer formed on the entire surface thereof, and electrode portions 13 (t), 13 (t), ... formed from the metal foil layer by etching, The one side electrodes 12, 12... Are soldered and the reinforcing portion 13 and the crosspiece portion 13 (l) are formed from a metal foil layer by etching together with the electrode portions 13 (t), 13 (t). Has been.

  Similarly, the other thin film substrate 20 is provided with a base film 21 having a metal foil layer formed on the entire surface thereof, and the electrode portions 23 (t), 23 (t),. The side electrodes 22, 22... Are joined by soldering, and the reinforcing portion 23 and the crosspiece 23 (l) are formed from a metal foil layer by etching together with the electrode portions 23 (t), 23 (t). ing.

  FIG. 8 shows an example of a heat exchange unit manufactured using the thermoelectric module 1 described above. The heat exchange unit 100 sandwiches the thermoelectric module 1 between a heat exchange plate 101 and a water cooling plate 102, and It is configured by fastening a plurality of locations of the heat exchange plate 101 and the water cooling plate 102 to each other by a plurality of set screws 103, 103... Passing through the water cooling plate 102 and the thermoelectric module 1 and screwed to the heat exchange plate 101. ing.

  Here, among the plurality of set screws 103, 103..., One set screw 103 is formed in the central region of the other side thin film substrate 10 and the other side thin film substrate 20 of the thermoelectric module 1 and faces each other. The other set screws 103, 103... Are formed in the peripheral area of the other side thin film substrate 10 and the other side thin film substrate 20 of the thermoelectric module 1 and face each other. The mounting holes 14, 14... And the mounting holes 24, 24.

  According to the heat exchange unit 100 configured as described above, in the thermoelectric module 1 which is a component of the heat exchange unit 100, the mounting holes are provided in the central region and the peripheral region of the one side thin film substrate 10 and the other side thin film substrate 20. Since the thermoelectric module 1 sandwiched between the heat exchange plate 101 and the water cooling plate 102 is formed by penetrating (14, 24), the set screws 103, 103... Passed through the plurality of mounting holes (14, 24). Thus, the central area and the peripheral area are fastened.

  In this way, the central region and the peripheral region in the thermoelectric module 1 are fastened, so that the stress applied during assembly is made uniform over the entire thermoelectric module 1, and the heat that is the counterpart member The thermoelectric module 1 can be uniformly brought into contact with the exchange plate 101 and the water cooling plate 102 throughout, and the contact thermal resistance between the heat exchange plate 101 and the water cooling plate 102 is reduced, and thus the heat exchange unit. Improvements in performance and quality can be achieved.

  Further, according to the thermoelectric module 1 having the above-described configuration, the film bases (11, 21) and the metal foil layers (13, 23) of the one-side thin film substrate 10 and the other-side thin film substrate 20 are passed through the mounting holes (14 , 24), the periphery of the mounting hole (14, 24) is reinforced by the metal foil layer (13, 23) to significantly improve the strength, thereby preventing inadvertent damage. Is possible.

  Further, according to the thermoelectric module 1 of the embodiment, the three reinforcing portions (13, 23) arranged along the side edges of the film base (11, 21) of the one side thin film substrate 10 and the other side thin film substrate 20 are provided. By connecting with the crosspieces (13 (l), 23 (l)) extending along the side edges of the base film (11, 21), the strength of the side edges of the base film (11, 21) is improved. Therefore, it is possible to prevent inadvertent damage.

  In addition, in the thermoelectric module 1 of the above-described embodiment, attachment holes (14, 24) are penetratingly formed at a total of nine locations in the central region and the peripheral region of the one side thin film substrate 10 and the other side thin film substrate 20. However, as long as the positional relationship between the central area and the peripheral area is observed, the number of installation holes and the layout (position mode) can be arbitrarily set based on the specifications of the thermoelectric module. .

  Moreover, in the thermoelectric module 1 of the Example mentioned above, a reinforcement part (13, 23) is connected along the side edge which the film base (11, 21) of the one side thin film substrate 10 and the other side thin film substrate 20 opposes. Although the crosspieces (13 (l), 23 (l)) are provided, the mounting holes (reinforcing parts) in the peripheral area are arranged close to the four edges of the film base (11, 21), and the film base A crosspiece may be formed over the entire circumference of (11, 21), thereby improving the strength of the entire circumference of the base film (11, 21) and preventing inadvertent damage. It becomes.

  Further, in the thermoelectric module 1 of the above-described embodiment, a reinforcing portion made of a metal foil layer is provided on the film base of the one side thin film substrate and the other side thin film substrate, and an attachment hole is formed through the film base and the reinforcing portion. However, the mounting holes may be formed only in the film bases of the one side thin film substrate and the other side thin film substrate without providing the reinforcing portion made of the metal foil layer. It goes without saying that the thermoelectric module can be uniformly contacted with the member over the entire member, and the contact thermal resistance with the counterpart member can be reduced.

  Furthermore, in the above-described embodiments, a heat exchange unit is disclosed in which the thermoelectric module of the present invention is sandwiched between a water cooling plate and a heat exchange plate. However, the heat exchange module is brought into contact with the counterpart member. It goes without saying that the heat exchange module according to the present invention can be applied to the various apparatuses constructed as described above.

The whole top view which shows one Example of the thermoelectric module concerning this invention. The whole bottom view of the thermoelectric module shown in FIG. FIG. 3 is a cross-sectional view taken along line III-III in FIG. The whole top view which looked at the state which removed the thin film substrate of the upper surface side from the thermoelectric module shown in FIG. 1 from upper direction. The top view which looked at the thin film substrate of the upper surface side of the thermoelectric module shown in FIG. 1 from the mounting surface. The top view which looked at the thin film substrate of the lower surface side of the thermoelectric module shown in FIG. 1 from the mounting surface. 5A is a cross-sectional view taken along the line aa in FIG. 5 showing a cross section including the mounting hole in the thin film substrate on the upper surface side, and FIG. 6B is a cross section including the mounting hole in the thin film substrate on the lower surface side. -B sectional view taken on the line. The conceptual diagram of the heat exchange apparatus which shows the assembly | attachment state of the thermoelectric module shown in FIG. (a) And (b) is the top view and side view which show the conventional thermoelectric module. XX sectional drawing in FIG. The conceptual diagram of the heat exchange apparatus which shows the assembly | attachment state of the conventional thermoelectric module.

Explanation of symbols

1 ... Thermoelectric module,
10: One side thin film substrate,
11 ... Base film,
12: One side electrode,
13 ... metal foil layer,
14: Mounting hole,
20 ... the other side thin film substrate,
21 ... Base film,
22 ... the other electrode,
23. Metal foil layer,
24 ... mounting holes,
P ... p-type thermoelectric semiconductor element (thermoelectric element),
N: n-type thermoelectric semiconductor element (thermoelectric element),
100 ... heat exchange unit,
101 ... Water-cooled plate,
102 ... heat exchange plate,
103: A set screw.

Claims (2)

A predetermined number of p-type thermoelectric elements and n-type thermoelectric elements are arranged in a plane, and one side electrode of one side thin film substrate is attached to one side of the p-type thermoelectric element and the n-type thermoelectric element, and the other side thin film A thermoelectric module in which the other electrode of the substrate is attached to the other surface of the p-type thermoelectric element and the n-type thermoelectric element, and the p-type thermoelectric element and the n-type thermoelectric element are connected in series;
A mounting hole is formed through the central region of the one side thin film substrate and the other side thin film substrate, and a mounting hole is formed through the peripheral region of the one side thin film substrate and the other side thin film substrate. Thermoelectric module to do. The mounting hole is formed through a film base in the one side thin film substrate and the other side thin film substrate and a metal foil layer formed on the surface of the film base. The thermoelectric module described.

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