JP2008257369A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment improving maintenance, accuracy of connector fitting depth, and positioning accuracy between a card and a backplane. <P>SOLUTION: This electronic equipment has a nesting structure wherein a plurality of the cards 4 are mounted on one layer faces 131, 231 sides of the backplanes 13, 23 fixed to a nest frame 12 through connectors 41a -41d. In the electronic equipment, the backplanes 13, 23 are fixed so as to bring the one layer faces 131, 231 into contact with the nest frame 12. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an improvement in a nest structure composed of a plurality of cards and a back brain used in a test head or a main frame of a semiconductor test apparatus.

  In a semiconductor test apparatus that tests various types of electronic devices, for example, various semiconductor integrated circuits such as logic ICs and memory LSIs, a plate-like member called a back plane (also referred to as a back board) is fixed in a test head or a main frame, The card is mounted by inserting the connector of the card (printed circuit board) into the connector on the backplane.

  FIG. 3 is an exploded perspective view showing a nest structure in such a conventional semiconductor test apparatus. In the nest 1, the back plane 3 is fixed to the nest frame 2, and a plurality of cards 4 are mounted on the back plane 3 via connectors.

FIG. 4 is a cross-sectional view of the nest 1. The positioning pin 51 is fixed to the nest frame 2 by press fitting or screwing. The backplane 3 is made of a printed circuit board on which a wiring pattern is formed, is positioned by positioning pins 51, and is fixed so that the lowermost layer surface (solder surface) 32 is in contact with the nest frame 2 by screws or the like (not shown). The The positioning pin 52 is fixed to the backplane 3 by screwing or press fitting. The connectors 41 a to 41 d are fixed to the first layer surface (component mounting surface) of the back plane 3. The plurality of cards 4 are printed circuit boards on which circuit elements and wiring patterns are formed. The cards 4 are positioned by positioning pins 52, and are inserted into and mounted on the connectors 41a to 41d.

  Prior art documents related to electronic devices having a nested structure include the following.

JP-A-11-249760

In the above nest structure, the positional relationship between the card and the nest is determined by the accuracy of the positioning pins 51 and 52.

Such a nested structure has the following problems.
(1) When the backplane is large, the contractor is limited by the capacity of the production factory.
(2) Since the positioning pins 51 and 52 are independent, the positional accuracy is deteriorated due to the influence of the accumulated tolerance of machining.
(3) When the pack plane is removed during maintenance, it cannot be removed unless the card is removed, and maintenance is poor.
(4) Since the pack plane is attached to the lowermost surface, the connector fitting depth varies due to plate thickness tolerance.

  An object of the present invention is to provide an electronic device that can improve the positioning accuracy of a card and a backplane, the accuracy of a connector fitting depth, and maintenance.

In order to achieve such a problem, an electronic device according to the invention described in claim 1 is provided.
In an electronic device in which a plurality of cards are mounted via a connector on one layer surface of a backplane fixed to a nest frame,
The back plane is fixed so that the first layer surface side is in contact with the nest frame.

The invention according to claim 2
The electronic device according to claim 1,
The backplane is divided into a plurality of parts.

The invention described in claim 3
The electronic device according to claim 2,
The divided backplane has a different number of layers.

The invention according to claim 4
The electronic device according to any one of claims 2 to 3,
A reinforcing nest frame is fixed to the nest frame and fixes the divided backplane.

The invention according to claim 5
The electronic device according to any one of claims 1 to 4,
A positioning pin fixed to the nest frame and positioning the backplane and the card is provided.

The invention described in claim 6
The electronic device according to claim 4,
A positioning pin fixed to the reinforcing nest frame and positioning the backplane is provided.

  As is apparent from the above description, according to the present invention, in the electronic device in which a plurality of cards are mounted on the first layer surface of the back plane fixed to the nest frame via the connector, the back plane is the first layer surface. By being fixed so as to be in contact with the nest frame, it is possible to provide an electronic device capable of improving the positioning accuracy of the card and the backplane, the accuracy of the connector fitting depth, and the maintenance.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an example of an electronic apparatus according to an embodiment of the present invention. FIG. 1 is an exploded perspective view showing a configuration of a semiconductor test apparatus, and FIG. 3 and 4 are denoted by the same reference numerals.

In the nest 11 of FIG. 1, a reinforcing nest frame 121 is provided on the nest frame 12 so as to bridge an intermediate position. The divided backplanes 13 and 23 are fixed to the nest frame 12 and the reinforcing nest frame 121, and the plurality of cards 4 are mounted on the backplanes 13 and 23 via connectors.

In FIG. 2, the positioning pins 53a and 53b are fixed to the nest frame 12 by press fitting. Two positioning pins 53a and 53b are provided in the width direction of the pack planes 13 and 23 (perpendicular to the plane of FIG. 2). The backplanes 13 and 23 are divided so that no new wiring connection is generated between them. The backplanes 13 and 23 are positioned such that the positioning pins 53a and 53b are inserted into the positioning holes, and the backplanes 13 and 23 are positioned from the outside (lowermost layer surface). The first layer surfaces (component mounting surfaces) 131 and 231 are fixed to the nest frame 12 and the reinforcing nest frame 121 with screws or the like (not shown). As in the case of FIG. 4, the connectors 41 a to 41 d are fixed to the first layer surfaces 131 and 231 of the backplane 3 for a plurality of cards (a set corresponding to the number of cards in the direction perpendicular to the paper surface of FIG. 2). The plurality of cards 4 are positioned by passing the positioning pins 53a and 53b through the positioning holes, and are correctly inserted into the connectors 41a to 41d.

  According to the electronic device having the above-described configuration, the size of the backplane can be reduced by dividing the backplane, so that it can be manufactured in a general production factory, and there is an advantage that the contractor is not limited.

  Further, since the positioning of the backplane and the card is integrated, the positioning variation (cumulative tolerance) can be reduced.

  Further, since the positioning pins for card positioning are fixed to a machine part (nest frame 12) with high processing accuracy instead of the conventional printed circuit board (backplane 3 in FIG. 4), positioning accuracy is improved.

  Further, the backplane is fixed to the single layer surface, and the difference and variation in the thickness of the backplane does not affect the connector fitting, so the accuracy of the connector fitting depth is improved.

  Further, the backplane can have an optimum layer structure (how many layers are formed) by dividing. That is, conventionally, since the backplane has a single configuration, the layer configuration is determined by the number of signals. However, in the above configuration, the divided backplanes can have different layer configurations. For example, in FIG. 2, the common backplane 13 can have a multilayer structure, and the variation backplane 23 can have a single-layer structure.

  In addition, since the backplane can be removed from the outside of the nest structure without removing the card, it is easy to replace parts focused on the necessary part of the backplane, and the maintainability is greatly improved.

  Further, since the connector insertion / extraction load per backplane is also distributed by the division, it is easy to remove the backplane from the card. Also, the strength per backplane can be lowered.

  Further, by dividing the backplane, it is possible to develop and design a plurality of backplanes in parallel.

In the above-described embodiment, the positioning accuracy of the backplane can be further improved by fixing the short positioning pin for fixing the backplane to the reinforcing nest frame 121 by press-fitting.

  In FIG. 2, the backplane is divided into upper and lower parts. However, the present invention is not limited to this, and right and left (the depth direction of the paper) can be divided.

  In the above-described embodiment, the number of divisions is two. However, the present invention is not limited to this, and any number N can be divided into N. In this case, positioning pins and reinforcing nest frames are added according to the position and number of divisions.

  Further, the positioning and integration of the backplane and the card can be applied to the conventional nest structure shown in FIG.

  Further, the present invention can be applied not only to a semiconductor test apparatus but also to any apparatus that requires a nest (a plurality of cards and a backplane) structure.

It is a composition perspective development view showing an example of electronic equipment concerning an embodiment of the invention. It is a structure sectional drawing of the apparatus of FIG. It is a perspective developed view which shows the nest structure in the conventional semiconductor testing apparatus. 3 is a cross-sectional view of the device.

Explanation of symbols

4 cards 12 nest frames 13, 23 backplanes 41a to 41d connectors 53a, 53b positioning pins 121 reinforcing nest frames 131, 231 one layer surface

Claims (6)

In an electronic device in which a plurality of cards are mounted via a connector on one layer surface of a backplane fixed to a nest frame,
The electronic apparatus according to claim 1, wherein the backplane is fixed so that the first layer side is in contact with the nest frame.   The electronic device according to claim 1, wherein the backplane is divided into a plurality of parts.   The electronic device according to claim 2, wherein the divided backplane has a different number of layers.   The electronic device according to claim 2, further comprising a reinforcing nest frame fixed to the nest frame and fixing the divided backplane.   The electronic apparatus according to claim 6, further comprising a positioning pin that is fixed to the nest frame and positions the backplane and the card.   The electronic apparatus according to claim 4, further comprising a positioning pin that is fixed to the reinforcing nest frame and positions the backplane.

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