JP2008248209A - Thinner composition for removing cyclic olefin polymer-containing composition - Google Patents
Thinner composition for removing cyclic olefin polymer-containing composition Download PDFInfo
- Publication number
- JP2008248209A JP2008248209A JP2007094970A JP2007094970A JP2008248209A JP 2008248209 A JP2008248209 A JP 2008248209A JP 2007094970 A JP2007094970 A JP 2007094970A JP 2007094970 A JP2007094970 A JP 2007094970A JP 2008248209 A JP2008248209 A JP 2008248209A
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- JP
- Japan
- Prior art keywords
- cyclic olefin
- group
- composition
- olefin polymer
- ene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000203 mixture Substances 0.000 title claims abstract description 87
- 229920000089 Cyclic olefin copolymer Polymers 0.000 title claims abstract description 46
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims abstract description 37
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000004094 surface-active agent Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000000758 substrate Substances 0.000 abstract description 26
- -1 ester compound Chemical group 0.000 description 62
- 239000000178 monomer Substances 0.000 description 44
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 40
- WLTSXAIICPDFKI-FNORWQNLSA-N (E)-3-dodecene Chemical compound CCCCCCCC\C=C\CC WLTSXAIICPDFKI-FNORWQNLSA-N 0.000 description 29
- 229920002120 photoresistant polymer Polymers 0.000 description 24
- 238000000034 method Methods 0.000 description 18
- 230000005855 radiation Effects 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- 125000001424 substituent group Chemical group 0.000 description 11
- 229920002554 vinyl polymer Polymers 0.000 description 11
- 239000011342 resin composition Substances 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 9
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 8
- 125000004430 oxygen atom Chemical group O* 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 238000005984 hydrogenation reaction Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 125000005462 imide group Chemical group 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 125000002887 hydroxy group Polymers [H]O* 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000007142 ring opening reaction Methods 0.000 description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 150000001336 alkenes Chemical class 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 125000004185 ester group Chemical group 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 125000005843 halogen group Chemical class 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000002685 polymerization catalyst Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004480 active ingredient Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000004093 cyano group Chemical class *C#N 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000003700 epoxy group Chemical class 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920001515 polyalkylene glycol Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XWJBRBSPAODJER-UHFFFAOYSA-N 1,7-octadiene Chemical compound C=CCCCCC=C XWJBRBSPAODJER-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- KXYAVSFOJVUIHT-UHFFFAOYSA-N 2-vinylnaphthalene Chemical compound C1=CC=CC2=CC(C=C)=CC=C21 KXYAVSFOJVUIHT-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- CJBUQOXMWGPKGP-UHFFFAOYSA-N 4-[3,3-bis(4-hydroxy-2,5-dimethylphenyl)-1-phenylpropyl]-2,5-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C(CC(C=2C(=CC(O)=C(C)C=2)C)C=2C(=CC(O)=C(C)C=2)C)C=2C=CC=CC=2)=C1C CJBUQOXMWGPKGP-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- LTBKJTHWKYUMTA-UHFFFAOYSA-N pentadeca-3,10-diene Chemical compound CCCCC=CCCCCCC=CCC LTBKJTHWKYUMTA-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- LRFQXNBPAIFQKB-UHFFFAOYSA-N (2-ethenyl-1-phenylcyclopropyl)benzene Chemical compound C=CC1CC1(C=1C=CC=CC=1)C1=CC=CC=C1 LRFQXNBPAIFQKB-UHFFFAOYSA-N 0.000 description 1
- OPIZCXOIOINPNM-UHFFFAOYSA-N (2-ethenylcyclopropyl)benzene Chemical compound C=CC1CC1C1=CC=CC=C1 OPIZCXOIOINPNM-UHFFFAOYSA-N 0.000 description 1
- LCSLWNXVIDKVGD-KQQUZDAGSA-N (3e,7e)-deca-3,7-diene Chemical compound CC\C=C\CC\C=C\CC LCSLWNXVIDKVGD-KQQUZDAGSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- TUSPQEVATCMZOM-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4-nonafluoro-4-(1,1,2,2,3,3,4,4,4-nonafluorobutylsulfonyl)butane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F TUSPQEVATCMZOM-UHFFFAOYSA-N 0.000 description 1
- ARPANWHHRGVXBN-UHFFFAOYSA-N 1,2,3,4,4a,10-hexahydroanthracene Chemical compound C1=CC=C2CC(CCCC3)C3=CC2=C1 ARPANWHHRGVXBN-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- PRJNEUBECVAVAG-UHFFFAOYSA-N 1,3-bis(ethenyl)benzene Chemical group C=CC1=CC=CC(C=C)=C1 PRJNEUBECVAVAG-UHFFFAOYSA-N 0.000 description 1
- WEERVPDNCOGWJF-UHFFFAOYSA-N 1,4-bis(ethenyl)benzene Chemical group C=CC1=CC=C(C=C)C=C1 WEERVPDNCOGWJF-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- VDNSZPNSUQRUMS-UHFFFAOYSA-N 1-cyclohexyl-4-ethenylbenzene Chemical group C1=CC(C=C)=CC=C1C1CCCCC1 VDNSZPNSUQRUMS-UHFFFAOYSA-N 0.000 description 1
- WJNKJKGZKFOLOJ-UHFFFAOYSA-N 1-dodecyl-4-ethenylbenzene Chemical group CCCCCCCCCCCCC1=CC=C(C=C)C=C1 WJNKJKGZKFOLOJ-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- JHTICDZLXFNVKL-UHFFFAOYSA-N 1-ethenyl-4-(4-phenylbutyl)benzene Chemical group C1=CC(C=C)=CC=C1CCCCC1=CC=CC=C1 JHTICDZLXFNVKL-UHFFFAOYSA-N 0.000 description 1
- LPSKSLRGCHZEDL-UHFFFAOYSA-N 1-ethenyl-4-methylcyclohexane Chemical compound CC1CCC(C=C)CC1 LPSKSLRGCHZEDL-UHFFFAOYSA-N 0.000 description 1
- VVTGQMLRTKFKAM-UHFFFAOYSA-N 1-ethenyl-4-propylbenzene Chemical compound CCCC1=CC=C(C=C)C=C1 VVTGQMLRTKFKAM-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- AVMSWPWPYJVYKY-UHFFFAOYSA-N 2-Methylpropyl formate Chemical compound CC(C)COC=O AVMSWPWPYJVYKY-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WLTSXAIICPDFKI-UHFFFAOYSA-N 3-dodecene Chemical compound CCCCCCCCC=CCC WLTSXAIICPDFKI-UHFFFAOYSA-N 0.000 description 1
- OLGHJTHQWQKJQQ-UHFFFAOYSA-N 3-ethylhex-1-ene Chemical compound CCCC(CC)C=C OLGHJTHQWQKJQQ-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- SUJVAMIXNUAJEY-UHFFFAOYSA-N 4,4-dimethylhex-1-ene Chemical compound CCC(C)(C)CC=C SUJVAMIXNUAJEY-UHFFFAOYSA-N 0.000 description 1
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 1
- CZGCPAYJJYAUOL-UHFFFAOYSA-N 4-(5-bicyclo[2.2.1]hept-2-enyl)phenol Chemical compound C1=CC(O)=CC=C1C1C(C=C2)CC2C1 CZGCPAYJJYAUOL-UHFFFAOYSA-N 0.000 description 1
- DLLSVQVOYYQPNY-UHFFFAOYSA-N 4-(5-methyl-5-bicyclo[2.2.1]hept-2-enyl)phenol Chemical compound C1C(C=C2)CC2C1(C)C1=CC=C(O)C=C1 DLLSVQVOYYQPNY-UHFFFAOYSA-N 0.000 description 1
- WXYSZTISEJBRHW-UHFFFAOYSA-N 4-[2-[4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(C(C)(C=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 description 1
- DXFURPHVJQITAC-UHFFFAOYSA-N 4-benzyl-1-ethenyl-2-ethylbenzene Chemical group C1=C(C=C)C(CC)=CC(CC=2C=CC=CC=2)=C1 DXFURPHVJQITAC-UHFFFAOYSA-N 0.000 description 1
- OPMUAJRVOWSBTP-UHFFFAOYSA-N 4-ethyl-1-hexene Chemical compound CCC(CC)CC=C OPMUAJRVOWSBTP-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- 125000002373 5 membered heterocyclic group Chemical group 0.000 description 1
- YSWATWCBYRBYBO-UHFFFAOYSA-N 5-butylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCC)CC1C=C2 YSWATWCBYRBYBO-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- QHJIJNGGGLNBNJ-UHFFFAOYSA-N 5-ethylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CC)CC1C=C2 QHJIJNGGGLNBNJ-UHFFFAOYSA-N 0.000 description 1
- VSQLAQKFRFTMNS-UHFFFAOYSA-N 5-methylhexa-1,4-diene Chemical compound CC(C)=CCC=C VSQLAQKFRFTMNS-UHFFFAOYSA-N 0.000 description 1
- WTQBISBWKRKLIJ-UHFFFAOYSA-N 5-methylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C)CC1C=C2 WTQBISBWKRKLIJ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
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- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Paints Or Removers (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Detergent Compositions (AREA)
Abstract
【課題】環状オレフィン系重合体を含有してなる組成物に対し非常に優れた除去性を発揮し、絶縁基板を充分に洗浄することができるシンナー組成物を提供すること。
【解決手段】1−メトキシ−2−プロパノール及びN,N−ジメチルアセトアミドからなる群より選ばれる少なくとも1種を含有してなる、環状オレフィン系重合体含有組成物除去用シンナー組成物。
【選択図】なしAn object of the present invention is to provide a thinner composition that exhibits excellent removability with respect to a composition containing a cyclic olefin polymer and can sufficiently clean an insulating substrate.
A thinner composition for removing a cyclic olefin polymer-containing composition comprising at least one selected from the group consisting of 1-methoxy-2-propanol and N, N-dimethylacetamide.
[Selection figure] None
Description
本発明は、環状オレフィン系重合体を含有してなる組成物の除去に好適に用いられるシンナー組成物に関する。 The present invention relates to a thinner composition suitably used for removing a composition comprising a cyclic olefin polymer.
半導体装置の製造工程におけるフォトリソグラフィ工程では、絶縁基板上に形成されたフォトレジスト膜に対して活性放射線を照射し、該膜中に潜像パターンを形成し、次いで現像液を接触させることにより潜像パターンを顕在化させて、該膜をパターン化することが行われる。 In a photolithography process in the manufacturing process of a semiconductor device, a photoresist film formed on an insulating substrate is irradiated with actinic radiation to form a latent image pattern in the film, and then a latent image pattern is brought into contact with a developer. The film is patterned by revealing an image pattern.
前記フォトレジスト膜は、通常、フォトレジストを絶縁基板上に塗布後、加熱処理(プリベイク)によりフォトレジストから溶剤を蒸発させて形成されるが、プリベイク後、活性放射線照射前において、絶縁基板のエッジ部分や裏面(フォトレジスト膜の非存在面)に付着する不要なフォトレジストの除去が行われる。フォトレジストの除去は、不要なフォトレジストの存在により、後工程のエッチング、イオン注入などにおいて多様な不良が発生し、半導体装置の生産性の低下が生ずるのを防ぐのに有効である。 The photoresist film is usually formed by evaporating the solvent from the photoresist by applying heat treatment (prebaking) after applying the photoresist on the insulating substrate, but after the prebaking and before the irradiation with active radiation, the edge of the insulating substrate is formed. Unnecessary photoresist adhering to the portion and the back surface (surface where the photoresist film is not present) is removed. The removal of the photoresist is effective in preventing the occurrence of various defects in post-etching and ion implantation due to the presence of unnecessary photoresist, resulting in a decrease in productivity of the semiconductor device.
従来、絶縁基板に存在する不要なフォトレジストの除去は、例えば、絶縁基板のエッジ部分の上下に噴射ノズルを設置し、このノズルを通して絶縁基板のエッジ部分や裏面に所定の有機溶剤成分からなるシンナー組成物を噴射し、絶縁基板を洗浄することにより行われている。 Conventionally, unnecessary photoresist existing on an insulating substrate can be removed by, for example, installing injection nozzles above and below the edge portion of the insulating substrate, and through this nozzle, a thinner composed of a predetermined organic solvent component on the edge portion and back surface of the insulating substrate. This is done by spraying the composition and cleaning the insulating substrate.
かかるシンナー組成物としては、例えば、多様なフォトレジストに対して優れた溶解能を示す組成物として、プロピレングリコールエーテルアセテートと、エチルラクテート及びエチル−3−エトキシプロピオネートよりなる群から選択される少なくとも一種のエステル化合物と、メチル−2−ハイドロキシ−2−メチルプロピオネートと、を含むシンナー組成物が開示されている(特許文献1)。また、フォトレジストの除去を安全かつ効率的に行うことができる組成物として、a)アルキルアミド及びb)アルキルエタノエイトを含むフォトレジスト除去用シンナー組成物が開示されている(特許文献2)。 The thinner composition is selected from the group consisting of propylene glycol ether acetate, ethyl lactate, and ethyl-3-ethoxypropionate, for example, as a composition having excellent solubility in various photoresists. A thinner composition containing at least one ester compound and methyl-2-hydroxy-2-methylpropionate is disclosed (Patent Document 1). Moreover, a thinner composition for removing a photoresist containing a) an alkylamide and b) an alkylethanolate is disclosed as a composition capable of safely and efficiently removing the photoresist (Patent Document 2).
これらのシンナー組成物は、フォトレジストに含まれる樹脂成分とは無関係に、一般的に使用されているフォトレジスト全般についてその除去性を訴求したものである。
しかしながら、従来のシンナー組成物を、環状オレフィン系重合体を含有してなるフォトレジストに適用したところ、該重合体の溶解性が低く、絶縁基板を充分に洗浄することができないことが分かった。 However, when a conventional thinner composition was applied to a photoresist containing a cyclic olefin polymer, it was found that the solubility of the polymer was low and the insulating substrate could not be washed sufficiently.
従って、本発明は、環状オレフィン系重合体を含有してなる組成物、特に、前記フォトレジストなどの感放射線性樹脂組成物に対し非常に優れた除去性を発揮し、絶縁基板を充分に洗浄することができるシンナー組成物を提供することを目的とする。 Therefore, the present invention exhibits excellent removability for a composition comprising a cyclic olefin polymer, particularly a radiation-sensitive resin composition such as the photoresist, and sufficiently cleans the insulating substrate. It is an object to provide a thinner composition that can be used.
本発明者らは、前記課題を解決すべく鋭意検討した結果、環状オレフィン系重合体を含有してなる組成物の除去に対しては、1−メトキシ−2−プロパノール及びN,N−ジメチルアセトアミドのいずれかを少なくとも含有してなる組成物が有効であることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that 1-methoxy-2-propanol and N, N-dimethylacetamide are suitable for removing a composition containing a cyclic olefin polymer. The inventors have found that a composition comprising at least any of the above is effective and have completed the present invention.
すなわち、本発明は、
〔1〕1−メトキシ−2−プロパノール及びN,N−ジメチルアセトアミドからなる群より選ばれる少なくとも1種を含有してなる、環状オレフィン系重合体含有組成物除去用シンナー組成物、
〔2〕1−メトキシ−2−プロパノールとN,N−ジメチルアセトアミドとの重量比(1−メトキシ−2−プロパノール/N,N−ジメチルアセトアミド)が1/9〜9/1である前記〔1〕記載のシンナー組成物、
〔3〕1−メトキシ−2−プロパノールとN,N−ジメチルアセトアミドとの合計含有量が50重量%以上である前記〔1〕又は〔2〕記載のシンナー組成物、
〔4〕界面活性剤をさらに含有してなる前記〔1〕〜〔3〕いずれか記載のシンナー組成物、
〔5〕界面活性剤がシリコーン系界面活性剤及びフッ素系界面活性剤からなる群より選択される少なくとも1種の界面活性剤である前記〔4〕記載のシンナー組成物、並びに
〔6〕前記〔1〕〜〔5〕いずれかに記載のシンナー組成物を用いて、環状オレフィン系重合体含有組成物が付着した被洗浄物を洗浄する工程を有する半導体装置又は平面表示装置の製造方法、
を提供する。
That is, the present invention
[1] A thinner composition for removing a cyclic olefin polymer-containing composition, comprising at least one selected from the group consisting of 1-methoxy-2-propanol and N, N-dimethylacetamide,
[2] The above-mentioned [1] wherein the weight ratio of 1-methoxy-2-propanol to N, N-dimethylacetamide (1-methoxy-2-propanol / N, N-dimethylacetamide) is 1/9 to 9/1 A thinner composition as described above,
[3] The thinner composition according to the above [1] or [2], wherein the total content of 1-methoxy-2-propanol and N, N-dimethylacetamide is 50% by weight or more,
[4] The thinner composition according to any one of [1] to [3], further comprising a surfactant,
[5] The thinner composition according to the above [4], wherein the surfactant is at least one surfactant selected from the group consisting of a silicone surfactant and a fluorosurfactant, and [6] the above [ 1) to [5] Using the thinner composition according to any one of the above, a method for manufacturing a semiconductor device or a flat display device, which includes a step of cleaning an object to be cleaned to which the cyclic olefin polymer-containing composition is attached,
I will provide a.
本発明のシンナー組成物によれば、例えば、半導体装置の製造時、不要な環状オレフィン系重合体含有フォトレジストが付着した絶縁基板を、フォトリソグラフ工程の後工程であるエッチングやイオン注入などの工程において不良が発生しない程度に充分に洗浄することができる。 According to the thinner composition of the present invention, for example, when manufacturing a semiconductor device, an insulating substrate to which an unnecessary cyclic olefin polymer-containing photoresist is attached is a process such as etching or ion implantation, which is a subsequent process of the photolithography process. Can be sufficiently washed to such an extent that no defects occur.
本発明の環状オレフィン系重合体含有組成物除去用シンナー組成物(以下、単にシンナー組成物という)は、1−メトキシ−2−プロパノール及びN,N−ジメチルアセトアミドからなる群より選ばれる少なくとも1種を含有してなることを特徴の1つとする。 The thinner composition for removing a cyclic olefin polymer-containing composition of the present invention (hereinafter simply referred to as a thinner composition) is at least one selected from the group consisting of 1-methoxy-2-propanol and N, N-dimethylacetamide. One of the characteristics is that it contains.
本発明のシンナー組成物は、典型的には、半導体装置用の絶縁基板に付着した、環状オレフィン系重合体を含有してなる感放射線性樹脂組成物を除去するための洗浄剤組成物として使用される。 The thinner composition of the present invention is typically used as a cleaning composition for removing a radiation-sensitive resin composition containing a cyclic olefin polymer attached to an insulating substrate for a semiconductor device. Is done.
本発明のシンナー組成物の有効成分である1−メトキシ−2−プロパノール(沸点約120℃)及びN,N−ジメチルアセトアミド(沸点約165℃)は、それぞれ常温で無色の液体であり、1−メトキシ−2−プロパノールの方が易乾燥性である。両成分は市販の溶剤として入手可能である。 1-Methoxy-2-propanol (boiling point: about 120 ° C.) and N, N-dimethylacetamide (boiling point: about 165 ° C.), which are active ingredients of the thinner composition of the present invention, are colorless liquids at room temperature. Methoxy-2-propanol is easier to dry. Both components are available as commercially available solvents.
本発明のシンナー組成物には1−メトキシ−2−プロパノール及びN,N−ジメチルアセトアミドからなる群より選ばれる少なくとも1種が含まれるが、環状オレフィン系重合体含有組成物の除去性がより良好であることからN,N−ジメチルアセトアミドを含むのが、また、除去性と乾燥性のバランスを良好に保つ観点から、1−メトキシ−2−プロパノール及びN,N−ジメチルアセトアミドを含むのが好ましい。 The thinner composition of the present invention contains at least one selected from the group consisting of 1-methoxy-2-propanol and N, N-dimethylacetamide, but has better removability of the cyclic olefin polymer-containing composition. Therefore, it is preferable to include N, N-dimethylacetamide, and from the viewpoint of maintaining a good balance between removability and drying property, it is preferable to include 1-methoxy-2-propanol and N, N-dimethylacetamide. .
本発明のシンナー組成物に1−メトキシ−2−プロパノールとN,N−ジメチルアセトアミドとが含まれる場合、両成分の重量比(1−メトキシ−2−プロパノール/N,N−ジメチルアセトアミド)としては、好ましくは1/9〜9/1、より好ましくは2/8〜8/2である。該重量比がかかる範囲にあれば、シンナー組成物は乾燥性に優れる。 When 1-methoxy-2-propanol and N, N-dimethylacetamide are contained in the thinner composition of the present invention, the weight ratio of both components (1-methoxy-2-propanol / N, N-dimethylacetamide) , Preferably 1/9 to 9/1, more preferably 2/8 to 8/2. If the weight ratio is within such a range, the thinner composition is excellent in drying properties.
本発明のシンナー組成物中、1−メトキシ−2−プロパノールとN,N−ジメチルアセトアミドとの合計含有量としては、好ましくは50重量%以上、より好ましくは70重量%以上である。該合計含有量がかかる範囲にあれば、環状オレフィン系重合体含有組成物の除去性に優れる。なお、かかる合計含有量には、いずれか一方の成分の含有量が0重量%である場合を含む。 In the thinner composition of the present invention, the total content of 1-methoxy-2-propanol and N, N-dimethylacetamide is preferably 50% by weight or more, more preferably 70% by weight or more. If the total content is within such a range, the removability of the cyclic olefin polymer-containing composition is excellent. The total content includes the case where the content of any one component is 0% by weight.
本発明のシンナー組成物には、環状オレフィン系重合体含有組成物の除去性を向上させる観点から、界面活性剤をさらに含有させるのが好適である。 From the viewpoint of improving the removability of the cyclic olefin-based polymer-containing composition, the thinner composition of the present invention preferably further contains a surfactant.
界面活性剤としては、特に限定はないが、環状オレフィン系重合体含有組成物の除去性の向上能に優れることから、シリコーン系界面活性剤及びフッ素系界面活性剤からなる群より選択される少なくとも1種の界面活性剤が好ましい。 The surfactant is not particularly limited, but is excellent in the ability to improve the removability of the cyclic olefin polymer-containing composition, so that it is at least selected from the group consisting of silicone surfactants and fluorosurfactants. One surfactant is preferred.
シリコーン系界面活性剤としては、例えば、ポリエーテル変性ポリジメチルシロキサン、ポリエーテル変性ポリメチルアルキルシロキサン、アラルキル変性ポリメチルアルキルシロキサン、ポリエステル変性水酸基含有ポリジメチルシロキサン、ポリエーテルエステル変性水酸基含有ポリジメチルシロキサンなどが挙げられる。中でも、ポリエーテル変性ポリジメチルシロキサン、ポリエーテル変性ポリメチルアルキルシロキサンが好ましい。
フッ素系界面活性剤としては、例えば、パーフルオロアルキルエチレンオキサイド付加物、パーフルオロブチルスルホン、パーフルオロアルキル基含有カルボン酸塩、パーフルオロアルキル基含有リン酸エステルなどが挙げられる。中でも、パーフルオロアルキルエチレンオキサイド付加物が好ましい。
これらのシリコーン系界面活性剤及びフッ素系界面活性剤は市販品として入手可能である。シリコーン系界面活性剤としては、例えば、ビックケミー・ジャパン株式会社製BYKシリーズ、信越化学工業株式会社製KPシリーズ、日本エマルジョン株式会社製EMALEXシリーズ等が、フッ素系界面活性剤としては、例えば、住友スリーエム株式会社製ノベックシリーズ、株式会社ネオス製フタージェントシリーズ、大日本インキ化学工業株式会社製メガファックシリーズ等が挙げられる。
Examples of the silicone-based surfactant include polyether-modified polydimethylsiloxane, polyether-modified polymethylalkylsiloxane, aralkyl-modified polymethylalkylsiloxane, polyester-modified hydroxyl group-containing polydimethylsiloxane, and polyether ester-modified hydroxyl group-containing polydimethylsiloxane. Is mentioned. Of these, polyether-modified polydimethylsiloxane and polyether-modified polymethylalkylsiloxane are preferable.
Examples of the fluorosurfactant include perfluoroalkyl ethylene oxide adducts, perfluorobutyl sulfone, perfluoroalkyl group-containing carboxylates, and perfluoroalkyl group-containing phosphate esters. Of these, perfluoroalkylethylene oxide adducts are preferred.
These silicone-based surfactants and fluorine-based surfactants are commercially available. Examples of the silicone surfactant include BYK series manufactured by Big Chemie Japan Co., Ltd., KP series manufactured by Shin-Etsu Chemical Co., Ltd., and EMALEX series manufactured by Nippon Emulsion Co., Ltd., and examples of the fluorine-based surfactant include Sumitomo 3M. Examples include the Novec series manufactured by Neoc, the aftergent series manufactured by Neos, and the MegaFuck series manufactured by Dainippon Ink and Chemicals.
シンナー組成物中の界面活性剤の含有量としては、通常、0.01〜10重量%である。 The content of the surfactant in the thinner composition is usually 0.01 to 10% by weight.
本発明のシンナー組成物には、本発明の所望の効果の発現が阻害されない範囲であれば、公知のシンナー組成物において有効成分として使用されている、例えば、セロソルブ、酢酸セロソルブ、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、エチレングリコールジ−n−ブチルエーテル、ジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジプロピレングリコールジメチルエーテル、プロピレングリコールモノメチルエーテルアセテートなどのエーテル及びエーテルアセテート類;アセトン、メチルエチルケトン、メチルイソブチルケトン、2−ペンタノン、3−ペンタノン、2−ヘキサノン、シクロヘキサノンなどのケトン類;ギ酸ブチル、ギ酸イソブチル、ギ酸ペンチル、乳酸メチル、乳酸エチル、酢酸メチル、酢酸エチル、酢酸プロピル、酢酸ブチル、酢酸イソブチル、γ-ブチロラクトンなどのエステル類などのその他の成分が含まれていてもよい。 The thinner composition of the present invention is used as an active ingredient in known thinner compositions as long as expression of the desired effect of the present invention is not inhibited, such as cellosolve, cellosolve acetate, ethylene glycol dimethyl ether, Ethers and ether acetates such as ethylene glycol diethyl ether, ethylene glycol di-n-butyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, propylene glycol monomethyl ether acetate; acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-pentanone, Ketones such as 3-pentanone, 2-hexanone, cyclohexanone; butyl formate, isobutyl formate, pentyl formate Methyl lactate, ethyl lactate, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, may contain other components such as esters such as γ- butyrolactone.
本発明のシンナー組成物は、以上の各成分を公知の方法に従って適宜混合することにより製造することができる。 The thinner composition of the present invention can be produced by appropriately mixing the above components according to a known method.
本発明のシンナー組成物は、環状オレフィン系重合体含有組成物、典型的には、環状オレフィン系重合体を含有してなる感放射線性樹脂組成物に対し非常に優れた除去性を発揮するが、それは、該シンナー組成物が環状オレフィン系重合体の溶解性に優れることによるものと考えられる。 The thinner composition of the present invention exhibits excellent removability with respect to a composition containing a cyclic olefin polymer, typically a radiation-sensitive resin composition containing a cyclic olefin polymer. It is considered that this is because the thinner composition is excellent in the solubility of the cyclic olefin polymer.
本明細書において環状オレフィン系重合体とは、環状構造(脂環又は芳香環)と炭素−炭素二重結合とを有する環状オレフィン単量体の単独重合体又は共重合体である。環状オレフィン系重合体は環状オレフィン単量体以外の単量体単位を有していてもよい。かかる環状オレフィン系重合体の全構造単位中、環状オレフィン単量体単位の割合は、通常、30〜100重量%、好ましくは50〜100重量%、より好ましくは70〜100重量%である。
前記環状オレフィン単量体としては、特に限定はないが、例えば、後述の、環状オレフィン単量体(a〜c)、ビニル脂環式炭化水素単量体(d)、及びビニル芳香族炭化水素単量体(e)が挙げられる。一方、かかる環状オレフィン単量体以外の単量体としては、特に限定はないが、例えば、後述の鎖状オレフィン(f)が挙げられる。
環状オレフィン系重合体は、これらの各単量体を任意に組合せて重合することにより形成され得る。また、得られた重合体の環状構造が不飽和結合を有するときは、これを水素化することにより、飽和の環状構造としたものであってもよい。
In this specification, the cyclic olefin polymer is a homopolymer or copolymer of a cyclic olefin monomer having a cyclic structure (alicyclic ring or aromatic ring) and a carbon-carbon double bond. The cyclic olefin polymer may have a monomer unit other than the cyclic olefin monomer. The ratio of the cyclic olefin monomer unit in all the structural units of the cyclic olefin polymer is usually 30 to 100% by weight, preferably 50 to 100% by weight, and more preferably 70 to 100% by weight.
The cyclic olefin monomer is not particularly limited, and examples thereof include a cyclic olefin monomer (ac), a vinyl alicyclic hydrocarbon monomer (d), and a vinyl aromatic hydrocarbon described later. A monomer (e) is mentioned. On the other hand, the monomer other than the cyclic olefin monomer is not particularly limited, and examples thereof include a chain olefin (f) described later.
The cyclic olefin polymer can be formed by polymerizing these monomers in any combination. Moreover, when the cyclic structure of the obtained polymer has an unsaturated bond, it may be a saturated cyclic structure by hydrogenation.
環状オレフィン単量体の第1の群として、極性基を有しない環状オレフィン単量体(a)を挙げることができる。その具体例としては、ビシクロ[2.2.1]ヘプト−2−エン(慣用名:ノルボルネン)、5−エチル−ビシクロ[2.2.1]ヘプト−2−エン、5−ブチル−ビシクロ[2.2.1]ヘプト−2−エン、5−エチリデン−ビシクロ[2.2.1]ヘプト−2−エン、5−メチリデン−ビシクロ[2.2.1]ヘプト−2−エン、5−ビニル−ビシクロ[2.2.1]ヘプト−2−エン、トリシクロ[4.3.0.12,5]デカ−3,7−ジエン(慣用名:ジシクロペンタジエン)、テトラシクロ[8.4.0.111,14.03,7]ペンタデカ−3,5,7,12,11−ペンタエン、テトラシクロ[4.4.0.12,5.17,10]デカ−3−エン(慣用名:テトラシクロドデセン)、8−メチル−テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−エチル−テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチリデン−テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−エチリデン−テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−ビニル−テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−プロペニル−テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、ペンタシクロ[6.5.1.13,6.02,7.09,13]ペンタデカ−3,10−ジエン、シクロペンテン、シクロペンタジエン、1,4−メタノ−1,4,4a,5,10,10a−ヘキサヒドロアントラセン、8−フェニル−テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、テトラシクロ[9.2.1.02,10.03,8]テトラデカ−3,5,7,12−テトラエン(「1,4−メタノ−1,4,4a,9a−テトラヒドロ−9H−フルオレン」ともいう。)、ペンタシクロ[7.4.0.13,6.110,13.02,7]ペンタデカ−4,11−ジエン、ペンタシクロ[9.2.1.14,7.02,10.03,8]ペンタデカ−5,12−ジエン等が挙げられる。
これらの環状オレフィン単量体は、それぞれ単独で使用しても2種以上を組合せて使用してもよい。
Examples of the first group of cyclic olefin monomers include cyclic olefin monomers (a) having no polar group. Specific examples thereof include bicyclo [2.2.1] hept-2-ene (common name: norbornene), 5-ethyl-bicyclo [2.2.1] hept-2-ene, 5-butyl-bicyclo [ 2.2.1] hept-2-ene, 5-ethylidene-bicyclo [2.2.1] hept-2-ene, 5-methylidene-bicyclo [2.2.1] hept-2-ene, 5- Vinyl-bicyclo [2.2.1] hept-2-ene, tricyclo [4.3.0.1 2,5 ] deca-3,7-diene (common name: dicyclopentadiene), tetracyclo [8.4 .0.1 11,14 . 0 3,7 ] pentadeca-3,5,7,12,11-pentaene, tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dec-3-ene (common name: tetracyclododecene), 8-methyl-tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-ethyl-tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methylidene-tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-ethylidene-tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-vinyl-tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-propenyl-tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, pentacyclo [6.5.1.1 3,6 . 0 2,7 . 0 9,13] pentadeca-3,10-diene, cyclopentene, cyclopentadiene, 1,4-methano -1,4,4a, 5,10,10a hexa hydro anthracene, 8-phenyl - tetracyclo [4.4. 0.1 2,5 . 1 7,10] dodeca-3-ene, tetracyclo [9.2.1.0 2,10. 0 3,8 ] tetradeca-3,5,7,12-tetraene (also referred to as “1,4-methano-1,4,4a, 9a-tetrahydro-9H-fluorene”), pentacyclo [7.4.0 .1,3,6 . 110,13.0 2,7] pentadeca-4,11-diene, pentacyclo [9.2.1.1 4,7. 0 2,10 . 0 3,8 ] pentadeca-5,12-diene and the like.
These cyclic olefin monomers may be used alone or in combination of two or more.
環状オレフィン単量体の第2の群としては、極性基を有する環状オレフィン単量体を挙げることができる。極性基を有する環状オレフィン単量体は、それぞれ単独で使用しても2種以上を組合せて使用してもよい。 The second group of cyclic olefin monomers can include cyclic olefin monomers having a polar group. The cyclic olefin monomer having a polar group may be used alone or in combination of two or more.
極性基は、プロトン性極性基と、これ以外の極性基とに分けて示すことができる。従って、極性基を有する環状オレフィン単量体は、プロトン性極性基を有する環状オレフィン単量体(b)と、プロトン性極性基以外の極性基(非プロトン性極性基)を有する環状オレフィン単量体(c)とに分けて示すことができる。 The polar group can be divided into a protic polar group and another polar group. Therefore, the cyclic olefin monomer having a polar group includes a cyclic olefin monomer (b) having a protic polar group and a cyclic olefin monomer having a polar group other than the protic polar group (aprotic polar group). It can be shown separately from the body (c).
本明細書においてプロトン性極性基とは、炭素原子以外の原子に水素原子が直接結合した原子団をいう。ここで、炭素原子以外の原子は、好ましくは周期律表第15族及び第16族に属する原子、より好ましくは周期律表第15族及び第16族の第1及び第2周期に属する原子、更に好ましくは酸素原子、窒素原子及び硫黄原子、特に好ましくは酸素原子である。 In this specification, the protic polar group refers to an atomic group in which a hydrogen atom is directly bonded to an atom other than a carbon atom. Here, the atoms other than carbon atoms are preferably atoms belonging to Groups 15 and 16 of the periodic table, more preferably atoms belonging to the first and second periods of Groups 15 and 16 of the Periodic Table, More preferred are an oxygen atom, a nitrogen atom and a sulfur atom, and particularly preferred is an oxygen atom.
プロトン性極性基の具体例としては、カルボキシル基(ヒドロキシカルボニル基)、スルホン酸基、リン酸基、ヒドロキシル基等の酸素原子を有する極性基;第一級アミノ基、第二級アミノ基、第一級アミド基、第二級アミド基(イミド基)等の窒素原子を有する極性基;チオール基等の硫黄原子を有する極性基;等が挙げられる。これらの中でも、酸素原子を有するものが好ましく、より好ましくはカルボキシル基である。 Specific examples of the protic polar group include polar groups having an oxygen atom such as carboxyl group (hydroxycarbonyl group), sulfonic acid group, phosphoric acid group, hydroxyl group; primary amino group, secondary amino group, A polar group having a nitrogen atom such as a primary amide group or a secondary amide group (imide group); a polar group having a sulfur atom such as a thiol group; Among these, those having an oxygen atom are preferable, and a carboxyl group is more preferable.
プロトン性極性基を有する環状オレフィン単量体(b)の具体例としては、5−ヒドロキシカルボニルビシクロ[2.2.1]ヘプト−2−エン、5−メチル−5−ヒドロキシカルボニルビシクロ[2.2.1]ヘプト−2−エン、5−カルボキシメチル−5−ヒドロキシカルボニルビシクロ[2.2.1]ヘプト−2−エン、5−エキソ−6−エンド−ジヒドロキシカルボニルビシクロ[2.2.1]ヘプト−2−エン、8−ヒドロキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−ヒドロキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−エキソ−9−エンド−ジヒドロキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン等のカルボキシル基を有する環状オレフィン;5−(4−ヒドロキシフェニル)ビシクロ[2.2.1]ヘプト−2−エン、5−メチル−5−(4−ヒドロキシフェニル)ビシクロ[2.2.1]ヘプト−2−エン、8−(4−ヒドロキシフェニル)テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−(4−ヒドロキシフェニル)テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン等のヒドロキシ基を有する環状オレフィン等が挙げられ、これらの中でもカルボキシル基を有する環状オレフィンが好ましい。 Specific examples of the cyclic olefin monomer (b) having a protic polar group include 5-hydroxycarbonylbicyclo [2.2.1] hept-2-ene and 5-methyl-5-hydroxycarbonylbicyclo [2. 2.1] Hept-2-ene, 5-carboxymethyl-5-hydroxycarbonylbicyclo [2.2.1] hept-2-ene, 5-exo-6-endo-dihydroxycarbonylbicyclo [2.2.1] ] Hept-2-ene, 8-hydroxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-hydroxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-exo-9-endo-dihydroxycarbonyltetracyclo [4.4.0.1 2,5 . Cyclic olefin having a carboxyl group such as 1 7,10 ] dodec-3-ene; 5- (4-hydroxyphenyl) bicyclo [2.2.1] hept-2-ene, 5-methyl-5- (4- Hydroxyphenyl) bicyclo [2.2.1] hept-2-ene, 8- (4-hydroxyphenyl) tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8- (4-hydroxyphenyl) tetracyclo [4.4.0.1 2,5 . And a cyclic olefin having a hydroxy group such as 17, 10 ] dodec-3-ene, among which a cyclic olefin having a carboxyl group is preferable.
非プロトン性極性基の具体例としては、エステル基(アルコキシカルボニル基及びアリーロキシカルボニル基を総称していう)、N−置換イミド基、エポキシ基、ハロゲン原子、シアノ基、カルボニルオキシカルボニル基(ジカルボン酸の酸無水物残基)、アルコキシ基、カルボニル基、第三級アミノ基、スルホン基、ハロゲン原子、アクリロイル基等が挙げられる。これらのうち、好ましくはエステル基、N−置換イミド基、シアノ基及びハロゲン原子であり、より好ましくはエステル基及びN−置換イミド基である。特に、N−置換イミド基が好ましい。 Specific examples of aprotic polar groups include ester groups (collectively referring to alkoxycarbonyl groups and aryloxycarbonyl groups), N-substituted imide groups, epoxy groups, halogen atoms, cyano groups, carbonyloxycarbonyl groups (dicarboxylic acid). Acid anhydride residues), alkoxy groups, carbonyl groups, tertiary amino groups, sulfone groups, halogen atoms, acryloyl groups and the like. Of these, an ester group, an N-substituted imide group, a cyano group, and a halogen atom are preferred, and an ester group and an N-substituted imide group are more preferred. In particular, an N-substituted imide group is preferable.
非プロトン性極性基を有する環状オレフィン単量体(c)としては、以下のようなものが具体的に例示される。 Specific examples of the cyclic olefin monomer (c) having an aprotic polar group include the following.
エステル基を有する環状オレフィンとしては、例えば、5−アセトキシビシクロ[2.
2.1]ヘプト−2−エン、5−メトキシカルボニルビシクロ[2.2.1]ヘプト−2−エン、5−メチル−5−メトキシカルボニルビシクロ[2.2.1]ヘプト−2−エン、8−アセトキシテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メトキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−エトキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−n−プロポキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−イソプロポキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−n−ブトキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−メトキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−エトキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−n−プロポキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−イソプロポキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−n−ブトキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−(2,2,2−トリフルオロエトキシカルボニル)テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−(2,2,2−トリフルオロエトキシカルボニル)テトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン等が挙げられる。
Examples of the cyclic olefin having an ester group include 5-acetoxybicyclo [2.
2.1] hept-2-ene, 5-methoxycarbonylbicyclo [2.2.1] hept-2-ene, 5-methyl-5-methoxycarbonylbicyclo [2.2.1] hept-2-ene, 8-acetoxytetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-ethoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-n-propoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-isopropoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-n-butoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-methoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-ethoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-n-propoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-isopropoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-n-butoxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8- (2,2,2-trifluoroethoxycarbonyl) tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8- (2,2,2-trifluoroethoxycarbonyl) tetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene and the like.
N−置換イミド基を有する環状オレフィンとしては、例えば、N−(4−フェニル)−(5−ノルボルネン−2,3−ジカルボキシイミド)等が挙げられる。 Examples of the cyclic olefin having an N-substituted imide group include N- (4-phenyl)-(5-norbornene-2,3-dicarboximide).
シアノ基を有する環状オレフィンとしては、例えば、8−シアノテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−シアノテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、5−シアノビシクロ[2.2.1]ヘプト−2−エン等が挙げられる。 Examples of the cyclic olefin having a cyano group include 8-cyanotetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-cyanotetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 5-cyanobicyclo [2.2.1] hept-2-ene, and the like.
ハロゲン原子を有する環状オレフィンとしては、例えば、8−クロロテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン、8−メチル−8−クロロテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン等が挙げられる。 Examples of the cyclic olefin having a halogen atom include 8-chlorotetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene, 8-methyl-8-chlorotetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene and the like.
また、前記ビニル脂環式炭化水素単量体(d)の例としては、ビニルシクロプロパン、ビニルシクロブタン、ビニルシクロペンタン、ビニルシクロヘキサン、ビニルシクロヘプタン等のビニルシクロアルカン;3−メチル−1−ビニルシクロヘキサン、4−メチル−1−ビニルシクロヘキサン、1−フェニル−2−ビニルシクロプロパン、1,1−ジフェニル−2−ビニルシクロプロパン等の置換基を有するビニルシクロアルカン;等を挙げることができる。 Examples of the vinyl alicyclic hydrocarbon monomer (d) include vinyl cycloalkanes such as vinyl cyclopropane, vinyl cyclobutane, vinyl cyclopentane, vinyl cyclohexane and vinyl cycloheptane; 3-methyl-1-vinyl And vinylcycloalkanes having substituents such as cyclohexane, 4-methyl-1-vinylcyclohexane, 1-phenyl-2-vinylcyclopropane, 1,1-diphenyl-2-vinylcyclopropane, and the like.
前記ビニル芳香族炭化水素単量体(e)の例としては、スチレン、1−ビニルナフタレン、2−ビニルナフタレン、3−ビニルナフタレン等のビニル芳香族類;3−メチルスチレン、4−プロピルスチレン、4−シクロヘキシルスチレン、4−ドデシルスチレン、2−エチル−4−ベンジルスチレン、4−(フェニルブチル)スチレン等の置換基を有するビニル芳香族類;m−ジビニルベンゼン、p−ジビニルベンゼン、ビス(4−ビニルフェニル)メタン等の多官能ビニル芳香族類;等を挙げることができる。 Examples of the vinyl aromatic hydrocarbon monomer (e) include vinyl aromatics such as styrene, 1-vinylnaphthalene, 2-vinylnaphthalene and 3-vinylnaphthalene; 3-methylstyrene, 4-propylstyrene, Vinyl aromatics having a substituent such as 4-cyclohexylstyrene, 4-dodecylstyrene, 2-ethyl-4-benzylstyrene, 4- (phenylbutyl) styrene; m-divinylbenzene, p-divinylbenzene, bis (4 -Polyfunctional vinyl aromatics such as vinylphenyl) methane;
前記鎖状オレフィン(f)の例としては、エチレン;プロピレン、1−ブテン、1−ペンテン、1−ヘキセン、3−メチル−1−ブテン、3−メチル−1−ペンテン、3−エチル−1−ペンテン、4−メチル−1−ペンテン、4−メチル−1−ヘキセン、4,4−ジメチル−1−ヘキセン、4,4−ジメチル−1−ペンテン、4−エチル−1−ヘキセン、3−エチル−1−ヘキセン、1−オクテン、1−デセン、1−ドデセン、1−テトラデセン、1−ヘキサデセン、1−オクタデセン、1−エイコセン等の炭素数2〜20のα−オレフィン;1,4−ヘキサジエン、4−メチル−1,4−ヘキサジエン、5−メチル−1,4−ヘキサジエン、1,7−オクタジエン等の非共役ジエン等が挙げられる。
これらの単量体は、それぞれ単独で又は2種以上を組合せて用いることができる。
Examples of the chain olefin (f) include ethylene; propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, and 3-ethyl-1- Pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, 3-ethyl- 1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene and the like α-olefins having 2 to 20 carbon atoms; 1,4-hexadiene, 4 Non-conjugated dienes such as -methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, 1,7-octadiene and the like can be mentioned.
These monomers can be used alone or in combination of two or more.
上記各単量体の重合方法は、常法に従えばよく、例えば、開環重合法や付加重合法が採用される。重合触媒としては、例えば、モリブデン、ルテニウム、オスミウム等の金属錯体が好適に用いられる。これらの重合触媒は、それぞれ単独で又は2種以上を組合せて用いることができる。例えば、環状オレフィン単量体の開環重合体及び環状オレフィン単量体の開環共重合体(以下、両者を併せて「環状オレフィン単量体の開環(共)重合体」という)を得る場合、重合触媒の量は、重合触媒中の金属化合物:環状オレフィン単量体のモル比で、通常、1:100〜1:2,000,000、好ましくは1:500〜1:1,000,000、より好ましくは1:1,000〜1:500,000の範囲である。 The polymerization method of each monomer may be in accordance with a conventional method, for example, a ring-opening polymerization method or an addition polymerization method is employed. As the polymerization catalyst, for example, metal complexes such as molybdenum, ruthenium and osmium are preferably used. These polymerization catalysts can be used alone or in combination of two or more. For example, a ring-opening polymer of a cyclic olefin monomer and a ring-opening copolymer of a cyclic olefin monomer (hereinafter referred to as “a ring-opening (co) polymer of a cyclic olefin monomer” together) are obtained. In this case, the amount of the polymerization catalyst is usually 1: 100 to 1: 2,000,000, preferably 1: 500 to 1: 1,000 in terms of a molar ratio of the metal compound to the cyclic olefin monomer in the polymerization catalyst. 1,000, more preferably in the range of 1: 1,000 to 1: 500,000.
上記重合によって得られる環状オレフィン系重合体は、所望により水素添加することができる。水素添加は、通常、水素添加触媒を用いて行われる。水素添加触媒としては、例えば、オレフィン化合物の水素添加に際して一般的に使用されているものを用いることができる。具体的には、チーグラータイプの均一系触媒、貴金属錯体触媒、担持型貴金属系触媒等が利用できる。環状オレフィン系重合体の水素化率は、好ましくは80%以上、より好ましくは90%以上である。 The cyclic olefin polymer obtained by the above polymerization can be hydrogenated as desired. Hydrogenation is usually performed using a hydrogenation catalyst. As the hydrogenation catalyst, for example, those generally used for hydrogenation of olefin compounds can be used. Specifically, Ziegler type homogeneous catalysts, noble metal complex catalysts, supported noble metal catalysts and the like can be used. The hydrogenation rate of the cyclic olefin polymer is preferably 80% or more, more preferably 90% or more.
本発明に係る環状オレフィン系重合体は、特に限定されないが、好ましくは、環状オレフィン単量体の開環(共)重合体及びそれらの水素添加物;環状オレフィン単量体とビニル脂環式炭化水素単量体との付加共重合体及びその水素添加物;並びに環状オレフィン単量体とビニル芳香族炭化水素単量体との付加共重合体及びその水素添加物;からなる群から選択される少なくとも1種であり、より好ましくは、環状オレフィン単量体の開環(共)重合体の水素添加物である。
本発明において、環状オレフィン系重合体は、組成等の異なるものを、それぞれ単独で又は2種以上を組合せたものであってもよい。
The cyclic olefin polymer according to the present invention is not particularly limited, but is preferably a ring-opening (co) polymer of a cyclic olefin monomer and a hydrogenated product thereof; a cyclic olefin monomer and a vinyl alicyclic carbonization. An addition copolymer of a hydrogen monomer and a hydrogenated product thereof; and an addition copolymer of a cyclic olefin monomer and a vinyl aromatic hydrocarbon monomer and a hydrogenated product thereof; It is at least one, and more preferably a hydrogenated product of a ring-opening (co) polymer of a cyclic olefin monomer.
In the present invention, the cyclic olefin polymers may be different from each other in composition or the like alone or in combination of two or more.
本発明のシンナー組成物は、中でも極性基を有する環状オレフィン系重合体の除去性に優れる。極性基を有する環状オレフィン系重合体に含まれる極性基の数は特に限定されず、極性基は、同一又は相異なる種類のものが含まれていてもよい。また、極性基は、環状オレフィン単量体単位に結合していても、環状オレフィン単量体以外の単量体単位に結合していてもよい。極性基を有する環状オレフィン系重合体としては、特にプロトン性極性基を有するものが好ましい。 The thinner composition of the present invention is particularly excellent in removability of a cyclic olefin polymer having a polar group. The number of polar groups contained in the cyclic olefin polymer having a polar group is not particularly limited, and the polar groups may include the same or different types. The polar group may be bonded to the cyclic olefin monomer unit or may be bonded to a monomer unit other than the cyclic olefin monomer. As the cyclic olefin polymer having a polar group, those having a protic polar group are particularly preferred.
本発明に係るプロトン性極性基含有環状オレフィン系重合体としては、以下に示すような、式(I)で表される構造単位を有するものが好適であり、式(I)で表される構造単位及び式(II)で表される構造単位を有するものがより好適である。式(I)で表される構造単位、及び式(II)で表される構造単位は、いずれも環状オレフィン単量体単位である。 As the protic polar group-containing cyclic olefin polymer according to the present invention, those having a structural unit represented by the formula (I) as shown below are preferable, and the structure represented by the formula (I) What has a unit and the structural unit represented by Formula (II) is more suitable. The structural unit represented by formula (I) and the structural unit represented by formula (II) are both cyclic olefin monomer units.
〔式(I)中、R1〜R4は、それぞれ独立して、水素原子又は-Xn-R'基(Xは二価の有機基であり、nは0又は1であり、R'は、置換基を有していてもよいアルキル基、置換基を有していてもよい芳香族基、又はプロトン性極性基である。)であり、R1〜R4のうち少なくとも1つは、R'がプロトン性極性基である-Xn-R'基であり、mは0〜2の整数である。〕 [In the formula (I), R 1 to R 4 each independently represents a hydrogen atom or a —X n —R ′ group (X is a divalent organic group, n is 0 or 1, R ′ Is an alkyl group which may have a substituent, an aromatic group which may have a substituent, or a protic polar group), and at least one of R 1 to R 4 is , R ′ is a —X n —R ′ group, which is a protic polar group, and m is an integer of 0-2. ]
〔式(II)中、R5とR6は、それらが結合する2つの炭素原子と一緒になって、置換基を有していてもよい、酸素原子又は窒素原子を含む、3員又は5員複素環構造を形成し、kは0〜2の整数である。〕 [In the formula (II), R 5 and R 6 together with the two carbon atoms to which they are bonded contain an oxygen atom or a nitrogen atom which may have a substituent. It forms a membered heterocyclic structure, and k is an integer of 0-2. ]
前記一般式(I)において、Xで示される二価の有機基としては、例えば、メチレン基、エチレン基及びカルボニル基などが挙げられる。R'の置換基を有していてもよいアルキル基は、通常、直鎖又は分岐鎖の炭素数1〜7のアルキル基であり、例えば、メチル基、エチル基、n-プロピル基、及びイソプロピル基などが挙げられる。置換基を有していてもよい芳香族基は、通常、炭素数6〜10の芳香族基であり、例えば、フェニル基及びベンジル基などが挙げられる。アルキル基や芳香族基の置換基としては、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、イソブチル基等の炭素数1〜4のアルキル基;フェニル基、キシリル基、トリル基、ナフチル基等の炭素数6〜12のアリール基;などが挙げられる。プロトン性極性基としては、前記したような基が挙げられる。 In the general formula (I), examples of the divalent organic group represented by X include a methylene group, an ethylene group, and a carbonyl group. The alkyl group which may have a substituent for R ′ is usually a linear or branched alkyl group having 1 to 7 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, and isopropyl. Groups and the like. The aromatic group that may have a substituent is usually an aromatic group having 6 to 10 carbon atoms, and examples thereof include a phenyl group and a benzyl group. Examples of substituents for alkyl groups and aromatic groups include alkyl groups having 1 to 4 carbon atoms such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group; phenyl group, xylyl group, And aryl groups having 6 to 12 carbon atoms such as a tolyl group and a naphthyl group. Examples of the protic polar group include the groups described above.
前記一般式(II)において、R5とR6が、それらが結合する2つの炭素原子と一緒になって、置換基を有していてもよい、酸素原子又は窒素原子を含んで形成する3員複素環構造としては、例えば、エポキシ構造などが挙げられる。また、R5とR6が、それらが結合する2つの炭素原子と一緒になって、置換基を有していてもよい、酸素原子又は窒素原子を含んで形成する5員複素環構造としては、例えば、ジカルボン酸無水物構造〔-C(O)-O-C(O)-〕及びジカルボキシイミド構造〔-C(O)-N-C(O)-〕などが挙げられる。酸素原子や窒素原子の置換基としては、例えば、フェニル基、ナフチル基、及びアントラセニル基などが挙げられる。 In the general formula (II), R 5 and R 6 are formed together with two carbon atoms to which they are bonded to each other and include an oxygen atom or a nitrogen atom which may have a substituent 3 Examples of the membered heterocyclic structure include an epoxy structure. In addition, as a 5-membered heterocyclic structure formed by including an oxygen atom or a nitrogen atom, R 5 and R 6 together with two carbon atoms to which they are bonded may have a substituent, Examples thereof include a dicarboxylic anhydride structure [—C (O) —O—C (O) —] and a dicarboximide structure [—C (O) —N—C (O) —]. Examples of the substituent for the oxygen atom or nitrogen atom include a phenyl group, a naphthyl group, and an anthracenyl group.
プロトン性極性基含有環状オレフィン系重合体において、プロトン性極性基を有する単量体単位とこれ以外の単量体単位との比率(プロトン性極性基を有する単量体単位/これ以外の単量体単位)は、重量比で、通常、100/0〜10/90、好ましくは90/10〜20/80、より好ましくは80/20〜30/70の範囲である。 In the protic polar group-containing cyclic olefin polymer, the ratio of the monomer unit having a protic polar group to the other monomer unit (monomer unit having a protic polar group / the other monomer) The body unit) is usually in the range of 100/0 to 10/90, preferably 90/10 to 20/80, and more preferably 80/20 to 30/70 by weight.
本発明に係る環状オレフィン系重合体の重量平均分子量(Mw)は、通常、1,000〜1,000,000、好ましくは1,500〜100,000、より好ましくは2,000〜10,000の範囲である。一方、該環状オレフィン系重合体の分子量分布は、重量平均分子量/数平均分子量(Mw/Mn)比で、通常、4以下、好ましくは3以下、より好ましくは2.5以下である。また、当該環状オレフィン系重合体のヨウ素価は、通常、200以下、好ましくは50以下、より好ましくは10以下である。 The weight average molecular weight (Mw) of the cyclic olefin polymer according to the present invention is usually 1,000 to 1,000,000, preferably 1,500 to 100,000, more preferably 2,000 to 10,000. Range. On the other hand, the molecular weight distribution of the cyclic olefin polymer is usually 4 or less, preferably 3 or less, and more preferably 2.5 or less in terms of a weight average molecular weight / number average molecular weight (Mw / Mn) ratio. Moreover, the iodine value of the said cyclic olefin polymer is 200 or less normally, Preferably it is 50 or less, More preferably, it is 10 or less.
本発明に係る、前記環状オレフィン系重合体を含有してなる感放射線性樹脂組成物としては、特に限定されるものではないが、通常、極性基を有する環状オレフィン系重合体、架橋剤、感放射線化合物、及び溶剤を含有してなるものである。 The radiation-sensitive resin composition containing the cyclic olefin polymer according to the present invention is not particularly limited, but usually a cyclic olefin polymer having a polar group, a cross-linking agent, a sensitivity. It contains a radiation compound and a solvent.
極性基を有する環状オレフィン系重合体の例としては、前記式(I)で表される構造単位及び/又は式(II)で表される構造単位を有する環状オレフィン系重合体が挙げられる。架橋剤の例としては、エポキシ基を2つ以上、好ましくはエポキシ基を3つ以上有する、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ポリフェノール型エポキシ樹脂、環状脂肪族エポキシ樹脂、脂肪族グリシジルエーテル、エポキシアクリレート重合体等の多官能エポキシ化合物が挙げられる。感放射線化合物(紫外線や電子線などの放射線の照射により、化学反応を引き起こすことができる化合物)の例としては、1,2−ナフトキノンジアジド−5−スルホン酸クロライド、1,2−ナフトキノンジアジド−4−スルホン酸クロライド、1,2−ベンゾキノンジアジド−5−スルホン酸クロライド等のキノンジアジドスルホン酸ハライドと、1,1,3−トリス(2,5−ジメチル−4−ヒドロキシフェニル)−3−フェニルプロパン、4,4'−[1−[4−[1−[4−ヒドロキシフェニル]−1−メチルエチル]フェニル]エチリデン]ビスフェノール等のフェノール性水酸基を有する化合物とのエステル化合物などの光酸発生剤が挙げられる。かかる組成物には、公知の感放射線性樹脂組成物に慣用されるその他の成分の他、無機微粒子として、例えば、コロイダルシリカが含まれていてもよい。また、溶剤の例としては、モノアルキレングリコール溶媒;ポリアルキレングリコール溶媒;モノアルキレングリコールアルキルエステル溶媒;ポリアルキレングリコールアルキルエステル溶媒;モノアルキレングリコールジエステル溶媒;ポリアルキレングリコールジエステル溶媒;などが挙げられる。 Examples of the cyclic olefin polymer having a polar group include a cyclic olefin polymer having a structural unit represented by the formula (I) and / or a structural unit represented by the formula (II). Examples of the crosslinking agent include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, polyphenol type having two or more epoxy groups, preferably three or more epoxy groups. Examples thereof include polyfunctional epoxy compounds such as epoxy resins, cycloaliphatic epoxy resins, aliphatic glycidyl ethers, and epoxy acrylate polymers. Examples of radiation-sensitive compounds (compounds that can cause a chemical reaction upon irradiation with radiation such as ultraviolet rays and electron beams) include 1,2-naphthoquinonediazide-5-sulfonic acid chloride and 1,2-naphthoquinonediazide-4. Quinonediazidesulfonic acid halides such as sulfonic acid chloride, 1,2-benzoquinonediazide-5-sulfonic acid chloride, and 1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane; Photoacid generators such as ester compounds with compounds having a phenolic hydroxyl group such as 4,4 ′-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol Can be mentioned. Such a composition may contain, for example, colloidal silica as inorganic fine particles in addition to other components commonly used in known radiation-sensitive resin compositions. Examples of the solvent include a monoalkylene glycol solvent; a polyalkylene glycol solvent; a monoalkylene glycol alkyl ester solvent; a polyalkylene glycol alkyl ester solvent; a monoalkylene glycol diester solvent; a polyalkylene glycol diester solvent;
以上の感放射線性樹脂組成物はポジ型の例であるが、ネガ型であってもよい。かかる組成物は公知の方法に従って製造され得る。 The above radiation sensitive resin composition is a positive type example, but may be a negative type. Such compositions can be prepared according to known methods.
本発明のシンナー組成物によれば、例えば、半導体装置、又は液晶表示装置や有機エレクトロルミネッセンス表示装置などの平面表示装置の製造工程において、該組成物を、環状オレフィン系重合体含有組成物が付着した被洗浄物、例えば、エッジ部分や裏面に不要なフォトレジストが付着した絶縁基板に対し、滴下するか、又はノズルを通してスプレー方式で噴射することにより、不要なフォトレジストを除去して、該基板を洗浄することができる。また、前記絶縁基板をシンナー組成物中に浸漬することにより同様に該基板を洗浄することができる。ここで、絶縁基板の材質としては、特に限定はないが、例えば、ガラスやシリコンウエハー等が挙げられる。 According to the thinner composition of the present invention, for example, in a manufacturing process of a flat panel display device such as a semiconductor device or a liquid crystal display device or an organic electroluminescence display device, the composition is attached to the cyclic olefin polymer-containing composition. The unnecessary photoresist is removed by dripping or spraying through a nozzle on an insulating substrate on which unnecessary photoresist adheres to the object to be cleaned, for example, the edge portion or the back surface, and the substrate. Can be washed. Further, the substrate can be similarly cleaned by immersing the insulating substrate in the thinner composition. Here, the material of the insulating substrate is not particularly limited, and examples thereof include glass and a silicon wafer.
本発明のシンナー組成物の滴下量又は噴射量は、フォトレジストの付着量等に応じて適宜調節すればよいが、通常、5〜100mL/分の範囲で選択すればよい。被洗浄物を浸漬して洗浄する場合は、少なくとも洗浄を要する部分がシンナー組成物中に浸かる程度、シンナー組成物を容器に入れ、その中に被洗浄物を通常、1〜5分間浸漬すればよい。本発明のシンナー組成物と被洗浄物との接触時の温度は、特に限定はないが、通常、15〜50℃とすればよい。洗浄後、所望により、シンナー組成物を乾燥する工程を採用してもよい。以上の操作により、例えば、絶縁基板は充分に洗浄されるため、フォトリソグラフィ工程の後工程で不良を生ずることなく、該基板に微細回路パターンを形成することができる。 The dripping amount or the spraying amount of the thinner composition of the present invention may be appropriately adjusted according to the amount of the deposited photoresist, etc., but is usually selected in the range of 5 to 100 mL / min. When the object to be cleaned is immersed and cleaned, the thinner composition is put in a container so that at least a portion requiring cleaning is immersed in the thinner composition, and the object to be cleaned is usually immersed in the container for 1 to 5 minutes. Good. Although the temperature at the time of contact of the thinner composition of this invention and a to-be-cleaned object does not have limitation in particular, What is necessary is just to be 15-50 degreeC normally. After washing, if desired, a step of drying the thinner composition may be employed. By the above operation, for example, the insulating substrate is sufficiently cleaned, so that a fine circuit pattern can be formed on the substrate without causing a defect in a subsequent process of the photolithography process.
また、半導体装置又は平面表示装置の製造工程において、被洗浄物としては、絶縁基板の他、フォトレジスト噴射用スリットノズルや、フォトレジストパターンの不良が発生した基板が挙げられる。前者を洗浄してフォトレジストの付着を解消することは半導体装置等の生産効率の向上に寄与し得、一方、後者を洗浄してフォトレジストパターンを除去すれば基板の再生使用が可能となる。 In the manufacturing process of a semiconductor device or a flat display device, the object to be cleaned includes an insulating substrate, a slit nozzle for photoresist injection, and a substrate on which a defective photoresist pattern has occurred. Removing the adhesion of the photoresist by washing the former can contribute to an improvement in production efficiency of a semiconductor device or the like. On the other hand, if the photoresist pattern is removed by washing the latter, the substrate can be reused.
従って、本発明の一態様として、本発明のシンナー組成物を用いて環状オレフィン系重合体含有組成物が付着した被洗浄物を洗浄する工程を有する半導体装置又は平面表示装置の製造方法が提供される。かかる方法によれば、半導体装置又は平面表示装置の製造工程を効率化して、それらの生産効率を向上させることができる。
なお、本発明の半導体装置又は平面表示装置の製造方法において、本発明のシンナー組成物による被洗浄物の洗浄工程以外の工程については、当業者であれば、例えば、特開平6−324499号公報や特開2006−085140号公報等を参照して適宜実施することができる。
Therefore, as one aspect of the present invention, there is provided a method for manufacturing a semiconductor device or a flat display device, which includes a step of cleaning an object to be cleaned to which a cyclic olefin polymer-containing composition is attached using the thinner composition of the present invention. The According to this method, the manufacturing process of the semiconductor device or the flat display device can be made efficient and the production efficiency thereof can be improved.
In addition, in the method for manufacturing a semiconductor device or a flat display device of the present invention, those skilled in the art can perform processes other than the cleaning process of the object to be cleaned with the thinner composition of the present invention, for example, Japanese Patent Laid-Open No. 6-324499. It can be appropriately implemented with reference to JP-A-2006-085140 or the like.
以下、実施例を挙げて本発明をさらに具体的に説明する。なお、各例中の部及び%は特に断りのない限り、重量基準である。 Hereinafter, the present invention will be described more specifically with reference to examples. In addition, unless otherwise indicated, the part and% in each example are a basis of weight.
参考例1 環状オレフィン系重合体の合成
8−ヒドロキシカルボニルテトラシクロ[4.4.0.12,5.17,10]ドデカ−3−エン62.5部、N−フェニル−(5−ノルボルネン−2,3−ジカルボキシイミド)37.5部、1−ヘキセン1.3部、1,3−ジメチルイミダゾリジン−2−イリデン(トリシクロヘキシルホスフィン)ベンジリデンルテニウムジクロリド0.05部、及びテトラヒドロフラン400部を、窒素置換したガラス製耐圧反応器に仕込み、攪拌しつつ70℃にて2時間反応させて重合体溶液A(固形分濃度:約20%)を得た。
Reference Example 1 Synthesis of Cyclic Olefin Polymer 8-Hydroxycarbonyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] dodec-3-ene 62.5 parts, N-phenyl- (5-norbornene-2,3-dicarboximide) 37.5 parts, 1-hexene 1.3 parts, 1,3-dimethyl Imidazolidine-2-ylidene (tricyclohexylphosphine) benzylidene ruthenium dichloride 0.05 part and 400 parts of tetrahydrofuran were charged into a nitrogen-substituted glass pressure-resistant reactor and reacted at 70 ° C. for 2 hours with stirring. Solution A (solid content concentration: about 20%) was obtained.
この重合体溶液Aの一部を攪拌機付オートクレーブに移し、150℃で水素を圧力4MPaで溶存させて5時間反応させ、水素化された重合体(水素化率100%)を含む重合体溶液B(固形分濃度:約20%)を得た。 A part of this polymer solution A is transferred to an autoclave equipped with a stirrer, and hydrogen is dissolved at a pressure of 4 MPa at 150 ° C. and reacted for 5 hours, and a polymer solution B containing a hydrogenated polymer (hydrogenation rate 100%). (Solid content concentration: about 20%) was obtained.
100部の重合体溶液Bと1部の活性炭粉末との混合液を入れた耐熱容器をオートクレーブに入れ、攪拌しつつ150℃で水素を4MPaの圧力で3時間溶存させた。次いで、溶液を取り出して孔径0.2μmのフッ素樹脂製フィルターでろ過して活性炭を分離して重合体溶液を得た。ろ過は滞りなく行えた。重合体溶液をエチルアルコール中に注いで凝固させ、生成したクラムを乾燥して重合体を得た。得られた重合体(環状オレフィン系重合体)をテトラヒドロフラン(THF)を溶離液としてゲルパーミエーションクロマトグラフィー(GPC)法により測定したところ、ポリイソプレン換算の重量平均分子量(Mw)は5,500であり、数平均分子量(Mn)は3,200であった。 A heat-resistant container containing a mixed solution of 100 parts of the polymer solution B and 1 part of activated carbon powder was placed in an autoclave, and hydrogen was dissolved at 150 ° C. under a pressure of 4 MPa for 3 hours while stirring. Next, the solution was taken out and filtered through a fluororesin filter having a pore size of 0.2 μm to separate the activated carbon to obtain a polymer solution. Filtration was performed without any delay. The polymer solution was poured into ethyl alcohol to solidify, and the produced crumb was dried to obtain a polymer. When the obtained polymer (cyclic olefin polymer) was measured by gel permeation chromatography (GPC) method using tetrahydrofuran (THF) as an eluent, the weight average molecular weight (Mw) in terms of polyisoprene was 5,500. Yes, the number average molecular weight (Mn) was 3,200.
参考例2 環状オレフィン系重合体含有感放射線性樹脂組成物の調製
参考例1の環状オレフィン系重合体100部、架橋剤としてエポキシ化合物(ダイセル化学工業社製、商品名:EHPE3150)25部、感放射線化合物として1,1,3−トリス(2,5−ジメチル−4−ヒドロキシフェニル)−3−フェニルプロパン(1モル)と1,2−ナフトキノンジアジド−5−スルホン酸クロリド(2.5モル)との縮合物25部、老化防止剤(チバ・スペシャリティーケミカルズ社製、商品名:イルガノックス1010)4部、接着助剤としてγ−グリシドキシプロピルトリメトキシシラン5部、並びに、シリコーン系界面活性剤(信越化学工業社製、商品名:KP341)0.05部を混合し、溶剤であるジエチレングリコールエチルメチルエーテル450部に溶解させた後、孔径0.45μmのポリテトラフルオロエチレン製フィルターでろ過して環状オレフィン系重合体含有感放射線性樹脂組成物を調製した。
Reference Example 2 Preparation of Cyclic Olefin Polymer-Containing Radiation Sensitive Resin Composition 100 Parts of Cyclic Olefin Polymer of Reference Example 1, 25 Parts of Epoxy Compound (trade name: EHPE3150, manufactured by Daicel Chemical Industries, Ltd.), Sensitivity 1,1,3-Tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane (1 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid chloride (2.5 mol) as radiation compounds 25 parts of condensate, 4 parts of anti-aging agent (product name: Irganox 1010, manufactured by Ciba Specialty Chemicals), 5 parts of γ-glycidoxypropyltrimethoxysilane as an adhesion assistant, and silicone-based interface Mixing 0.05 parts of an activator (Shin-Etsu Chemical Co., Ltd., trade name: KP341) and mixing it with diethylene glycol ethyl methyl solvent. After dissolving in 450 parts of ruether, it was filtered through a polytetrafluoroethylene filter having a pore diameter of 0.45 μm to prepare a cyclic olefin polymer-containing radiation sensitive resin composition.
実施例1〜6 シンナー組成物の評価
(1)被洗浄物(汚染ガラス基板)の作製
ガラス基板(コーニング社製、1737材;100×100mm)上にスピンナー(ミカサ社製)を用いて、参考例2の感放射線性樹脂組成物を塗布した後、ホットプレートで90℃、120秒間の乾燥処理を行い、触針式膜厚計P−10(テンコール社製)で測定したときに2μmになるように成膜した。
(2)シンナー組成物の調製と洗浄性能の評価
表1の配合に従って各成分を混合しシンナー組成物を調製した(実施例1〜7)。前記(1)で作製した被洗浄物(汚染ガラス基板)を、得られたシンナー組成物に、23℃で、20秒間又は40秒間浸漬した。浸漬後、目視で感放射線性樹脂組成物の除去程度を確認し、下記の評価基準に従ってシンナー組成物の洗浄性能を評価した。結果を表2に示す。
〔評価基準〕
優 :完全に除去される
良 :ほぼ除去されるが、少し残る
可 :少し除去されるが、残りが多い
不可:全く除去されない
Examples 1 to 6 Evaluation of Thinner Composition (1) Preparation of Washed Object (Contaminated Glass Substrate) Reference was made using a spinner (Mikasa Corp.) on a glass substrate (Corning Corp., 1737 material; 100 × 100 mm). After the radiation sensitive resin composition of Example 2 was applied, it was dried on a hot plate at 90 ° C. for 120 seconds and measured to 2 μm with a stylus type film thickness meter P-10 (manufactured by Tencor). The film was formed as follows.
(2) Preparation of thinner composition and evaluation of cleaning performance Each component was mixed according to the composition of Table 1 to prepare a thinner composition (Examples 1 to 7). The article to be cleaned (contaminated glass substrate) prepared in (1) was immersed in the obtained thinner composition at 23 ° C. for 20 seconds or 40 seconds. After immersion, the degree of removal of the radiation-sensitive resin composition was visually confirmed, and the cleaning performance of the thinner composition was evaluated according to the following evaluation criteria. The results are shown in Table 2.
〔Evaluation criteria〕
Excellent: Completely removed Good: Almost removed, but remains a little OK: Removed a little, but much remains Impossible: Not removed at all
比較例1〜3 シンナー組成物の評価
実施例と同様にして、表1の配合に従って各成分を混合してシンナー組成物を調製し(比較例1〜3)、得られたシンナー組成物の洗浄性能を評価した。結果を表2に示す。
Comparative Examples 1 to 3 Evaluation of Thinner Composition In the same manner as in the Examples, each component was mixed according to the formulation shown in Table 1 to prepare a thinner composition (Comparative Examples 1 to 3), and the resulting thinner composition was washed. Performance was evaluated. The results are shown in Table 2.
本発明に使用される有効成分を含まない比較例1〜3のシンナー組成物では被洗浄物(汚染ガラス基板)を洗浄できなかったのに対し、実施例1〜7のシンナー組成物によれば充分な洗浄効果が得られることが分かる。また、実施例1〜7では、1−メトキシ−2−プロパノールを多く含むほど易乾燥性であった。 According to the thinner composition of Examples 1-7, the thinner composition of Comparative Examples 1 to 3 which does not contain an active ingredient used in the present invention could not clean the object to be cleaned (contaminated glass substrate). It can be seen that a sufficient cleaning effect can be obtained. In Examples 1 to 7, the more 1-methoxy-2-propanol was contained, the easier it was to dry.
Claims (6)
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JP2016511843A (en) * | 2013-05-07 | 2016-04-21 | エルジー・ケム・リミテッド | Stripper composition for removing photoresist and photoresist stripping method using the same |
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JP2016511843A (en) * | 2013-05-07 | 2016-04-21 | エルジー・ケム・リミテッド | Stripper composition for removing photoresist and photoresist stripping method using the same |
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