JP2008240052A - Film deposition system and film deposition method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method by which exact film deposition rate of a film deposited on an object to be treated can be detected and the film thickness of the film deposited on a substrate can be uniformized based on a detected potential. <P>SOLUTION: The film deposition system is equipped with: an aerosol forming vessel 100 for forming aerosol; a spray nozzle 10 for spraying the aerosol formed in the aerosol forming vessel 100 as an aerosol flow; a holder 12 for holding the object 13 to be treated so that the aerosol flow is sprayed onto the object 13 to be treated; a driving device 50 which has a conductor 15 onto one surface of which the aerosol flow is sprayed, and moves the conductor 15 relatively to the spray nozzle 10 so that the aerosol flow is sprayed successively onto an area, where the aerosol flow is not sprayed, of the one surface of the conductor 15; and a potential detection means 70 for detecting the potential of the conductor 15. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a film forming apparatus and a film forming method, and more particularly to a film forming apparatus and a film forming method for forming a film using an aerosol deposition method.

  The aerosol deposition method (hereinafter referred to as “AD method”) is a technique in which material particles prepared in advance are mixed and dispersed with a gas to form an aerosol, and sprayed onto a substrate at a high speed through a nozzle in an atmosphere under reduced pressure to form a coating. .

  In such a film forming apparatus using the AD method, in order to form a constant film thickness on the substrate, the film forming rate is controlled by controlling the concentration of aerosol, the particle diameter of particles constituting the aerosol, and the flow rate of the aerosol. It needs to be adjusted. In order to adjust the film forming rate, a film forming apparatus provided with a measuring means for measuring a potential on a film forming surface on a substrate is known (for example, see Patent Document 1).

In the film forming apparatus disclosed in Patent Document 1, the potential measured by the measuring means is utilized by utilizing the correlation between the potential on the film forming surface on the substrate (lower electrode) and the film forming rate. By controlling the flow rate of the aerosol based on the above, the film thickness of the film formed on the substrate is controlled to be constant.
JP 2006-159137 A

  However, in the film forming apparatus disclosed in Patent Document 1, the potential of the film forming surface when the raw material powder collides with the lower electrode is measured via the lower electrode. However, since the raw material powder is an insulator, when a large film is formed on the lower electrode, this becomes an insulating layer between the lower electrode and the film formation surface, and the potential of the film formation surface is reduced. It was impossible to measure with the lower electrode, and there was still room for improvement.

  The present invention has been made in view of the above problems, and even when the film thickness of the film formed on the substrate is increased, the film formation rate of the film being formed can be more accurately known, and the aerosol can be obtained. An object of the present invention is to provide a film forming apparatus and a film forming method capable of adjusting the flow rate of the film to make the film thickness uniform.

  In order to solve the above-described problems, a film forming apparatus according to the present invention includes an aerosol generator that generates an aerosol by dispersing material particles in a carrier gas, and the aerosol generated by the aerosol generator is ejected as an aerosol flow. A spray nozzle for performing the treatment, a processing object holder for holding the processing object so that the aerosol flow is sprayed on a film forming surface of the processing object, and a conductor on which the aerosol flow is sprayed on one surface. And a driving device for moving the conductor relative to the injection nozzle so that the aerosol flow is sequentially sprayed onto a region where the aerosol flow is not sprayed on the one surface, and the conductor. And a potential detecting means for detecting the potential.

  As a result, the potential of the film formed in the region where the aerosol flow of the conductor is not sprayed can be regarded as the same as the potential of the film formed on the object to be processed. Even when the film thickness increases, the accurate film formation rate can be known by detecting the electric potential of the conductor.

  Further, in the film forming apparatus according to the present invention, the driving device has a region where the aerosol flow is sprayed on the one surface of the conductor on substantially the same plane as the film forming surface of the object to be processed. The conductor may be moved relative to the spray nozzle while being arranged in a flat state.

  In the film forming apparatus according to the present invention, the rate of the film formed by spraying the aerosol flow onto the film forming surface of the object to be processed based on the potential detected by the potential detecting means. A control device for controlling the film rate may be further provided.

  In the film forming apparatus according to the present invention, the control device may control the film forming rate by controlling the concentration of the material particles in the aerosol through the aerosol generator.

  By changing the aerosol flow rate or the like based on the potential thus detected, the film thickness of the film formed on the substrate can be made uniform.

  Furthermore, the film forming apparatus according to the present invention further includes a flow rate regulator for adjusting the flow rate of the aerosol flow ejected from the spray nozzle, and the control device is configured to flow the aerosol flow through the flow rate regulator. The film formation rate may be controlled by controlling.

  In addition, the film forming method according to the present invention includes an aerosol generating step for generating an aerosol by dispersing material particles in a carrier gas, and an arranging step for arranging an object to be processed having a film forming surface at a predetermined position. An aerosol is ejected from the spray nozzle as an aerosol flow, and a part of the aerosol flow is sprayed onto the film formation surface of the object to be processed, and a conductive surface having one surface to which the aerosol flow is sprayed. A moving step of moving the body relative to the spray nozzle so that the aerosol flow is sprayed while the one surface moves, a potential detecting step of detecting a potential of the conductor, and the potential detecting step The film formation rate, which is a film rate formed by spraying the aerosol flow on the film formation surface of the object to be processed, based on the potential detected in step It includes a Gosuru control step.

  As a result, the potential of the film formed in the region where the aerosol flow of the conductor is not sprayed can be regarded as the same as the potential of the film formed on the object to be processed. Even when the film thickness increases, the accurate film formation rate can be known by detecting the electric potential of the conductor. Further, the film thickness of the film formed on the substrate can be made uniform by adjusting the flow rate of the aerosol and the like based on the detected potential. In addition, although the film-forming method of this invention arrange | positions the to-be-processed object which has a film-forming surface in a predetermined position in an arrangement | positioning process, it keeps a to-be-processed object in a predetermined position until the subsequent process. It is not limited to.

  According to the film forming apparatus and the film forming method of the present invention, since the potential of the conductor that can be regarded as the same as the potential of the film formed on the object to be processed is detected, the film is formed on the object to be processed. Even if the film thickness of the processed film increases, the accurate film formation rate of the film formed on the object to be processed can be known, and the film formation rate can be adjusted based on the detected potential, The film thickness to be formed can be made uniform.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted. (Embodiment 1)
FIG. 1 is a schematic diagram showing a schematic configuration of a film forming apparatus according to Embodiment 1 of the present invention.

  As shown in FIG. 1, a film formation apparatus 400 according to the first embodiment includes an aerosol generator 100, a film formation mechanism 200, a control apparatus 300, and a voltage detector 70 (potential detection means). is doing.

  First, the aerosol generator 100 will be described.

  The aerosol generator 100 includes a gas supply unit 1, a generation container 2, and a container driver 3. The gas supply means 1 is configured to supply gas to the production container 2, and here, a gas cylinder is used. In addition, as gas supplied to the production | generation container 2, inert gas, such as helium and argon, air, oxygen, nitrogen, etc. can be used.

  In addition, a powder 4 of material particles is accommodated inside the generation container 2, and the generation container 2 is provided above the container driver 3. The container driver 3 crushes the aggregated material particles by causing the generation container 2 to vibrate ultrasonically, swing, or rotate. The material particles are not particularly limited as long as they can be used in the AD method. For example, lead zirconate titanate (PZT) which is a piezoelectric material, inorganic powder such as alumina, and organic powder such as resin. Can be used. Further, the particle diameter of the material particles is not particularly limited as long as it is a particle diameter that can be used in the AD method, but may be, for example, several hundred nm to several tens of μm.

  The gas supply means 1 and the production container 2 are connected by a carrier gas supply path 5 configured by a pipe 5a, a first flow rate regulator 6 and a pipe 5b. The pipe 5a has a branch structure and branches into two at the downstream side. The upstream side of the pipe 5 a is connected to the gas supply means 1, and the downstream side is branched and connected to a first flow rate regulator 6 and a second flow rate regulator 9. The pipe 5 b does not have such a branch structure, and the upstream side is connected to the first flow rate regulator 6 and the downstream side is connected to the production container 2. The downstream portion of the pipe 5 b enters the generation container 2, and the downstream end reaches the vicinity of the bottom surface of the generation container 2. Therefore, when the powder 4 is accommodated in the production container 2, the opening formed at the downstream end of the pipe 5 b is buried in the powder 4. The first flow rate adjuster 6 is for adjusting the flow rate of the gas supplied to the production container 2.

  Moreover, the production | generation container 2 and the injection nozzle 10 mentioned later are connected by the aerosol supply path 7 comprised by the piping 7a. As for this piping 7a, the upstream is connected to the production | generation container 2, and the downstream is connected to the injection nozzle 10 mentioned later. The portion in the vicinity of the upstream end of the pipe 7a penetrates into the generation container 2. However, since the opening formed in the upstream end is located in the upper part of the internal space of the generation container 2, the generation container 2 Even if the powder 4 is accommodated therein, the opening is not buried in the powder 4.

  Further, the branch point of the pipe 5a and the pipe 7a are connected by a concentration adjusting gas flow path 8 constituted by the second flow rate regulator 9 and the pipe 8a. The pipe 8a has an upstream side connected to the second flow rate regulator 9, and a downstream side connected to an intermediate portion of the pipe 7a. The concentration adjustment gas flow path 8 is configured to adjust the concentration of the aerosol supplied to the film forming mechanism 200 by joining the gas (concentration adjustment carrier gas) from the gas supply means 1 to the aerosol flowing through the aerosol supply path 7. It is for adjustment.

  The second flow rate adjuster 9 is for adjusting the flow rate of the gas to be joined. The first and second flow regulators 6 and 9 use a mass flow controller here, but can perform minute flow adjustments such as a diaphragm valve, a needle valve, and a globe valve, and the response speed is fast. A flow regulator can be used. Furthermore, in the present embodiment, the concentration adjustment gas flow path 8 is branched from the carrier gas supply path 5 and the gas is supplied from one gas supply means 1, but the present invention is not limited to this. It is good also as a structure where each gas flow path is connected to the several gas supply means 1. FIG.

  Next, the film forming mechanism 200 will be described.

  The film forming mechanism 200 includes a film forming chamber 11 to which first and second vacuum pumps 61 and 62 are connected. The film forming chamber 11 is configured so that the inside thereof can be depressurized, and is depressurized by the first and second vacuum pumps 61 and 62. Here, the first vacuum pump 61 uses a known booster pump, and the second vacuum pump 62 uses a known rotary pump. A simple decompressor may be used. Here, the first and second vacuum pumps 61 and 62 and the two vacuum pumps are used. However, the present invention is not limited to this. For example, the inside of the film forming chamber 11 may be decompressed by one vacuum pump. Three or more vacuum pumps may be used.

  A pipe 7 a is connected to the film forming chamber 11 so as to penetrate the bottom wall and extend upward. The base end portion of the injection nozzle 10 is connected to the downstream end portion of the pipe 7a. The injection nozzle 10 is formed in a cylindrical shape, and is arranged so that its central axis faces the vertical direction. And it is comprised so that aerosol may flow through the internal space of the injection nozzle 10. FIG. Further, a taper portion is formed in a part of the flow path (internal space) of the injection nozzle 10 such that the cross-sectional area becomes narrower as it goes downstream, and an opening at the tip of the injection nozzle 10 (hereinafter simply referred to as injection). The opening of the nozzle 10) is formed in a slit shape.

  Inside the film forming chamber 11, a substrate holder (processing object holder) 12 is provided above the injection nozzle 10 so as to face the opening of the injection nozzle 10. The substrate holder 12 has a plate-like holder portion 12a and a support portion 12b. The holder portion 12a is configured to hold the substrate (non-processed object) 13 in a horizontal state on the lower surface thereof. On the other hand, the support portion 12b is attached to the substrate holder driving mechanism 14, and the substrate holder driving mechanism 14 is configured to drive the substrate holder 12 in the horizontal direction. Thereby, the substrate 13 held by the substrate holder 12 can move relative to the opening of the injection nozzle 10.

Further, inside the film forming chamber 11, a driving device 50 having a conductor 15, a delivery unit 16, a winding unit 17, and transport rollers 18 and 19 is disposed. The delivery unit 16 includes a bearing member 23 and a roll member 21. The roll member 21 has a rotation shaft 22 at the center thereof, and the rotation shaft 22 is supported by a bearing member 23. In addition, a tape-like conductor 15 is wound around the roll member 21.
The winding unit 17 is configured in the same manner as the sending unit 16. More specifically, the winding unit 17 includes a bearing member 26 and a roll member 24. The roll member 24 has a rotation shaft 25 at its center, and this rotation shaft 25 is supported by a bearing member 26. The roll member 24 is configured so that the conductor 15 delivered from the delivery unit 16 can be wound up.
The winding unit 17 is provided with a driver 27 made of, for example, a motor for rotating the rotary shaft 25. Moreover, as the material constituting the conductor 15, a metal having conductivity can be used. For example, various stainless steels such as SUS430 and 304, metals such as aluminum, iron and copper, or alloys thereof are used. be able to. Furthermore, the thickness dimension of the conductor 15 is preferably 0.025 to 0.500 mm from the viewpoint of flexibility for being wound around the roll members 21 and 24.

  The delivery unit 16 and the winding unit 17 are disposed so as to sandwich the ejection nozzle 10 and along the scanning direction of the substrate holder drive mechanism 14 (the direction of the arrow A shown in FIG. 1). 20 is supported. Further, a conveying roller 18 is disposed above the sending unit 16, and a conveying roller 19 is disposed above the winding unit 17.

  The two transport rollers 18 and 19 are disposed in the film forming chamber 11 so as to sandwich the substrate 13 with each other and along the scanning direction A of the substrate holder driving mechanism 14. The two conveying rollers 18 and 19 each have a bearing member and a roller member. The bearing member is fixed at a predetermined position in the film forming chamber 11. The roller member has a rotation shaft at the center thereof, and this rotation shaft is supported by the bearing member. Thus, the central axes of the two transport rollers 18 and 19 are arranged so as to be parallel in the same horizontal plane.

  The tape-like conductor 15 is wound around the roller members of the two transport rollers 18 and 19, and the conductor 15 extends flatly between the transport roller 18 and the transport roller 19. The flat portion 15 a of the conductor 15 (hereinafter referred to as the flat portion 15 a) is disposed so as to extend along the scanning direction A of the substrate holder driving mechanism 14. The diameters of the roller members of the two transport rollers 18 and 19 are the same.

  The flat portion 15a is adjacent to the substrate 13, and the lower surface of the flat portion 15a is parallel to the horizontal plane. The lower surface of the substrate 13 is a film formation surface, and the film formation surface of the substrate 13 is also parallel to the horizontal plane. The lower surface of the flat portion 15a of the conductor 15 and the film formation surface of the substrate 13 are disposed substantially in the same horizontal plane.

  Here, the positional relationship among the injection nozzle 10, the conductor 15, the substrate 13, and the substrate holder 12 will be described with reference to FIG.

  FIG. 2 is a schematic diagram showing the internal structure of the film forming chamber 11 viewed from the direction of arrow II shown in FIG. In FIG. 2, a part is omitted.

  As shown in FIG. 2, when viewed from below in the vertical direction, the flat portion 15 a of the conductor 15 is disposed to face the opening of the injection nozzle 10 and does not overlap with the substrate 13. And it arrange | positions so that it may mutually overlap with the substrate holder 12a. The opening of the injection nozzle 10 crosses the flat portion 15a beyond the width of the flat portion 15a.

  On the other hand, the substantially rectangular substrate 13 has a film formation surface facing the opening of the injection nozzle 10. When viewed from below in the vertical direction, the opening of the injection nozzle 10 has two opposite sides (two sides parallel to the scanning direction of the substrate holder driving mechanism 14) E1 around the rectangular film-forming surface of the substrate 13; It crosses the deposition surface beyond E2.

  Since the injection nozzle 10, the conductor 15, the substrate 13, and the like are arranged in such a positional relationship, when the aerosol flow is ejected from the injection nozzle 10, the flat conductor 15 a and the substrate 13 are deposited. The surface is formed by spraying an aerosol flow at the same time.

  Further, as understood from FIG. 1, a terminal 71 is provided above the transport roller 19 so as to contact the conductor 15. Here, the terminal 71 is made of a metal piece, and is always supported by a support member (not shown) so as to be in contact with the upper surface of the conductor 15 (surface opposite to the surface on which the aerosol flow is sprayed). . The terminal 71 may have any configuration as long as it is always connected to the conductor 15. The terminal 71 is connected to the voltage detector 70 via the wiring 72. The voltage detector 70 can detect a potential generated when an aerosol flow is sprayed on the lower surface of the conductor 15 to form a film. The output signal of the voltage detector 70 is sent to the control device 300.

  Next, the control device 300 will be described with reference to FIG.

  The control device 300 is configured by a computer such as a microcomputer, and includes an arithmetic processing unit including a CPU, a storage unit including a memory, a display unit such as a monitor, and an operation input unit such as a keyboard. (Not shown). The arithmetic processing unit reads out a predetermined control program stored in the storage unit and executes it to perform various controls relating to the film forming apparatus 400. The arithmetic processing unit processes data stored in the storage unit and data input from the operation input unit. In particular, the first and second flow rate adjusters 12 and 13 are controlled based on the voltage value detected by the voltage detector 70, and the aerosol concentration generated by the aerosol generator 100 and the injection nozzle are injected. The flow rate of the aerosol flow is adjusted to control the film formation rate. The adjustment of the aerosol concentration and the flow rate of the aerosol flow based on the voltage value and the control of the film formation rate will be described later.

  Here, in this specification, the control device means not only a single control device but also a control device group in which a plurality of control devices cooperate to execute control of the film forming device. For this reason, the control device does not need to be configured by a single control device, and a plurality of control devices may be arranged in a distributed manner so as to control the film forming apparatus in cooperation with each other.

  Next, the operation of the film forming apparatus 400 will be described with reference to FIGS. The following operations are controlled by the control device 300.

  First, the substrate 13 is placed on the substrate holder 12 in the film forming chamber 11 (placement step), and the powder 4 of material particles is placed inside the production container 2. Next, gas is supplied from the gas supply means 1 into the generation container 2 through the carrier gas supply path 5 (hereinafter, the gas supplied to the generation container 2 through the carrier gas supply path 5 is referred to as carrier gas). Thereby, the supplied carrier gas blows up and disperses the powder 8, and aerosol is generated in the generation container 2 (aerosol generation step).

  Next, the inside of the film forming chamber 11 is depressurized to a state close to vacuum by evacuation of the first and second pumps 61 and 62. Accordingly, due to the differential pressure between the film forming chamber 11 and the generation container 2, the aerosol in the generation container 2 flows through the aerosol supply path 7 and is supplied to the injection nozzle 10.

  As described above, the injection nozzle 10 has a tapered portion therein. For this reason, the aerosol is accelerated, the high-speed aerosol is ejected from the opening of the ejection nozzle 10 as an aerosol flow, and the ejected aerosol flow collides with the film formation surface of the substrate 13 and the lower surface of the conductor 15 (ejection process). . Thereby, the material particles constituting the aerosol are crushed, and the crushed material particles are deposited on the deposition surface of the substrate 13 and the lower surface of the conductor 15 to form a film. Then, the substrate holder driving mechanism 14 moves the substrate holder 12 in the conveying direction of the conductor 15 (direction of arrow B shown in FIGS. 1 and 2) little by little, so that the substrate 13 is relative to the injection nozzle 10. The entire film formation surface of the substrate 13 is formed. Next, the substrate holder driving mechanism 14 moves the substrate holder 12 little by little in the direction opposite to the transfer direction B of the conductor 15 to form a film on the film formed on the film formation surface of the substrate 13. In this manner, the substrate holder driving mechanism 14 repeatedly moves the substrate holder 12 in the horizontal direction, whereby a film is formed on the film formation surface of the substrate 13.

  At this time, the conductor 15 is wound around the winding portion 17 by the driver 27 and moves in the transport direction B regardless of the moving direction of the substrate holder 12. Thereby, the conductor 15 moves so that the area | region where the aerosol flow is not sprayed among the lower surfaces always opposes the opening of the injection nozzle 10 (moving process).

  The voltage detector 70 detects the potential of the conductor 15 (detection step) and sends an output signal to the control device 300. The control device 300 can know the potential of the conductor 15 based on this signal, and controls the container driver 3 and the first and second flow rate regulators 6 and 9 based on this potential to control the aerosol concentration. In addition, the flow rate of the aerosol flow is adjusted to control the film formation rate (control process). Thereby, a desired film thickness can be formed on the substrate 12. Of the aerosols that collide with the substrate 13 or the conductor 15, the aerosols that do not form a film are discharged to the outside of the film forming chamber 11 by the first and second vacuum pumps 61 and 62.

  Next, the adjustment of the aerosol concentration and the flow rate of the aerosol flow and the control of the film forming rate of the control apparatus 300 in the film forming apparatus 400 will be described.

  First, the correlation between the potential of the conductor 15, the potential of the substrate 13, and the film formation rate will be described.

  Although the mechanism by which the potential of the conductor 15 (same for the substrate 13) changes depending on the aerosol spraying conditions is not necessarily clear, (i) when the material particles collide with the lower surface of the conductor 15 and are crushed, It is presumed that electrons are ejected and hit the conductor 15 and (ii) static electricity leaks when the charged material particles in the aerosol collide with the lower surface of the conductor 15. That is, the change in the potential of the conductor 15 is considered to correlate with the number of particles colliding with the lower surface of the conductor 15 and the collision speed. Since the rate of the formed film (deposition rate) varies depending on the number of colliding particles and the collision speed, the change in potential of the conductor 15 and the deposition rate have a correlation.

  By the way, since the area | region where the aerosol flow is not sprayed among the lower surfaces is always moved so that the conductor 15 may oppose the opening of the injection nozzle 10, the electric potential of the upper surface of the conductor 15 and a lower surface are formed. The potential on the membrane surface is the same. Further, since an aerosol flow is simultaneously sprayed from the injection nozzle 10 onto the lower surface of the conductor 15 and the film formation surface of the substrate 13, the film formation rate is the same between the lower surface of the conductor 15 and the film formation surface of the substrate 13. The same. For this reason, the potential of the lower surface of the conductor 15 and the potential of the deposition surface of the substrate 13 are the same.

  Therefore, the film formation rate of the film formation surface of the substrate 13 can be known by detecting the electric potential of the upper surface of the conductor 15, and the film formation rate of the film formation surface of the substrate 13 based on the detected potential. Can be controlled.

  Therefore, the control device 300 controls the container driver 3 and the first and second flow rate regulators 6 and 9 by comparing the detected potential of the conductor 15 with a reference potential (hereinafter referred to as a reference potential). Then, the aerosol concentration and the flow rate of the aerosol flow are adjusted. Here, the reference potential refers to the potential of the conductor 15 obtained when the substrate 13 is formed at a predetermined film formation rate obtained in advance through experiments or the like.

  If the detected potential is greater than the reference potential, the control device 300 decreases the concentration of the aerosol, decreases the flow rate of the aerosol flow, or decreases both. For this purpose, for example, the generation frequency of the generation container 2 by the container driver 3 is reduced or the first flow rate regulator 6 is controlled to generate the generation container 2 via the carrier gas supply path 6. The flow rate of the carrier gas supplied to the gas may be decreased, or the second flow rate regulator 9 may be controlled to increase the flow rate of the gas supplied via the concentration adjusting gas flow path 8. Thereby, the deposition rate of the film formed on the substrate 13 is reduced.

  On the other hand, when the potential detected from the reference potential is smaller, the control device 300 controls the first and second flow rate regulators 6 and 9 to increase the concentration of the aerosol or the flow rate of the aerosol flow. Or increase both. Thereby, the film formation rate of the film formed on the substrate 13 is increased.

  As described above, in the film forming apparatus 400, the region of the lower surface of the conductor 15 where the aerosol flow is not yet sprayed is always sent to a position facing the opening of the injection nozzle 10, and the potential of the conductor 15 is detected. Is done. For this reason, even if the film thickness of the film formed on the substrate 13 increases, the film formation rate of the film formed on the substrate 13 can be accurately known, and based on the detected potential, By controlling the deposition rate, the thickness of the film formed on the substrate 13 can be made uniform.

(Embodiment 2)
FIG. 3 is a schematic diagram showing the internal structure of the film forming chamber in the film forming apparatus according to Embodiment 2 of the present invention. FIG. 4 is a schematic diagram showing the internal structure of the film forming chamber as seen from the direction of arrow IV shown in FIG. In FIG. 3, a part is omitted.

  The film forming apparatus according to the second embodiment has the same basic configuration as the film forming apparatus 400 according to the first embodiment, except for the following points.

  As shown in FIGS. 3 and 4, in the film forming apparatus according to the second embodiment, the substrate holder 12 includes a holder portion 12a, a support portion 12b, and an XY stage portion 12c, and the XY stage portion 12c. A driving device 50 is disposed on the front side. In the film forming apparatus according to the second embodiment, the substrate holder driving mechanism 14 is configured to be driven in the directions along the X axis and the Y axis shown in FIGS. The opening is formed so that the length dimension of the opening is smaller than the length dimension of one side of the substrate 13. In addition, the direction parallel to the conveyance direction (direction of arrow B shown in FIG. 3 and FIG. 4) of the substrate holder 12 for the substrate holder 12 is called the X-axis direction, and the direction perpendicular to the delivery direction of the conductor 15 is Y. It is called the axial direction.

  Specifically, a plate-like XY stage portion 12c is connected to the support portion 12b of the substrate holder 12, and a substrate holder 12a is provided on the main surface of the XY stage portion 12c. Further, on the peripheral portion of the main surface of the XY stage portion 12c, the sending portion 16 and the winding portion 17 are disposed along the side E3 of the XY stage portion 12c via the support members 20 and 20, respectively. Yes. Further, on the main surface of the XY stage unit 12 c, conveying rollers 18 and 19 are disposed between the sending unit 16 and the winding unit 17. Accordingly, the driving device 50 having the conductor 15 moves in the direction along the X axis and the Y axis as the substrate holder 12 moves.

  Next, the operation of the film forming apparatus according to the second embodiment will be described.

  The film forming apparatus according to the second embodiment is the same as the film forming apparatus 400 according to the first embodiment in the basic operation. However, since the driving of the substrate holder driving mechanism 14 is different, the following operation is performed. A substrate 13 is formed.

  As shown in FIG. 4, it is assumed that the opening at the tip of the injection nozzle 10 is at the position of the corner C1 on the side E2 side of the substrate 13 (this position is referred to as a first stop position). The substrate holder drive mechanism 14 drives the substrate holder 12 so as to move in the direction perpendicular to the transport direction of the conductor 15, that is, in the Y-axis direction. Specifically, the substrate holder 12 moves in the direction opposite to the Y-axis direction so that the opening of the injection nozzle 10 is located on the side E3 side of the XY stage portion 12c from the corner portion C1. From there, the substrate holder 12 is moved a distance in the direction opposite to the X-axis direction by the substrate holder drive mechanism 14 and moved in the Y-axis direction from the moved position. Then, it moves a distance in the opposite direction to the X-axis direction, moves from the moved position in the opposite direction to the Y-axis direction, and moves to the side E3 side of the XY stage portion 12c (this position is called a second stop position). ). As described above, the substrate holder driving mechanism 14 moves the substrate holder 12 in a serpentine shape in the direction along the X axis and the Y axis so that the aerosol flow injected from the injection nozzle 10 is sprayed on the entire lower surface of the substrate 14. The substrate holder 12 is moved. 4 indicates a relative trajectory of the opening of the injection nozzle 10 with respect to the substrate 13 when the substrate 13 is moved by the substrate holder driving mechanism 14.

  Then, when the substrate holder 12 moves in the direction along the Y axis, an aerosol flow is sprayed on the lower surface of the conductor 15 to form a film, and the voltage detector 70 detects the potential of the conductor 15. At this time, since the conductor 15 is always wound around the winding portion 17 and moves in the transport direction, the region where the film is not yet formed on the lower surface of the conductor 15 faces the opening of the injection nozzle 10 at all times. It is sent to the position where When the spray nozzle 10 moves to the first stop position or the second stop position, the movement of the substrate holder 12 is stopped once, and the lower surface of the conductor 15 is interposed between the transport roller 18 and the transport roller 19. The conductor 15 may be actuated so as to wind in the region where the film is not yet formed.

  As described above, in the film forming apparatus according to the second embodiment, the aerosol 15 is intermittently sprayed on the conductor 15 to detect the potential of the conductor 15 at a predetermined interval, and based on the potential. Control the membrane rate. Further, by controlling the film formation rate based on the detected potential, the film thickness formed on the substrate 13 can be made uniform.

  Further, with such a configuration, for example, the area of the lower surface of the substrate 13 is large, and the aerosol flow cannot be sprayed over the entire lower surface of the substrate 13 even if the substrate holder 12 is moved in one direction. However, by intermittently detecting the potential of the conductor 15, the film formation rate can be controlled, and the film thickness of the film formed on the substrate 13 can be made constant.

  In the above-described embodiment, the configuration in which the injection nozzle 10 is fixed has been described. However, the configuration is not limited thereto, and the configuration in which the injection nozzle 10 is moved relative to the substrate 13 may be employed.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[Example 1 and Comparative Example 1]
In Example 1, the film forming apparatus 400 according to Embodiment 1 described above was constructed, and the potential of the conductor 15 was detected. On the other hand, the basic configuration of Comparative Example 1 is the same as that of the film forming apparatus 400 according to the first embodiment. However, the wiring is directly provided on the substrate 13 without providing the driving device 50. It was comprised so that an electric potential might be detected (that is, it was set as the structure similar to the film-forming apparatus currently disclosed by the said patent document 1). These detected potentials were plotted.

  FIG. 5 is a graph in which the potentials detected in Example 1 and Comparative Example 1 are plotted. The solid line indicates the potential (voltage value) of the conductor 15 of Example 1, and the broken line indicates the potential (voltage value) of the substrate 13 of Comparative Example 1.

  As shown in FIG. 5, in Comparative Example 1, the potential of the substrate 13 converges to 0 as time passes. This suggests that the change in potential on the film formation surface can no longer be detected by the substrate 13 due to the formation of the insulating layer on the lower surface of the substrate 13.

  On the other hand, in the first embodiment, as shown in FIG. 5, it is shown that the potential of the conductor 15 can be detected even if time passes.

  Thus, unlike the film forming apparatus 400 of Comparative Example 1, the film forming apparatus 400 of Example 1 detects the potential of the conductor 15 even when the film thickness formed on the substrate 13 increases. Thus, it was confirmed that it can be indirectly detected as the potential of the film formed on the substrate 13.

  The film forming apparatus and the film forming method of the present invention can know the film forming rate in the film being formed more accurately, and adjust the flow rate of the aerosol based on the detected potential to adjust the film thickness. Since it can be made uniform, it is useful in the technical field of film formation.

It is a schematic diagram which shows schematic structure of the film-forming apparatus which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the internal structure of the film-forming chamber seen from the arrow II direction shown in FIG. It is a schematic diagram which shows the internal structure of the film-forming chamber in the film-forming apparatus which concerns on Embodiment 2 of this invention. It is a schematic diagram which shows the internal structure of the film-forming chamber seen from the arrow IV direction shown in FIG. 2 is a graph plotting potentials detected in Example 1 and Comparative Example 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Gas supply means 2 Generation | occurrence | production container 3 Container drive device 4 Powder 5 Carrier gas supply path 5a Pipe 5b Pipe 6 First flow regulator 7 Aerosol feed path 7a Pipe 8 Concentration gas flow path 8a Pipe 9 Second flow regulator 10 Injection nozzle 11 Deposition chamber 12 Substrate holder (non-processed material holder)
12a Substrate holder 12b Support part 12c XY stage part 13 Substrate (non-processed object)
14 Substrate holder driving mechanism 15 Conductor 15a Flat conductor 16 Sending part 17 Winding part 18 Conveying roller 19 Conveying roller 20 Support member 21 Roll member 22 Rotating shaft 23 Bearing member 24 Roll member 25 Rotating shaft 26 Bearing member 27 Driver 61 First vacuum pump 62 Second vacuum pump 70 Voltage detector (potential detection means)
71 Terminal 100 Aerosol Generator 200 Film Forming Mechanism 300 Control Device 400 Film Forming Apparatus A Scanning Direction B Transport Direction C1 Corner E1 Side E2 Side E3 Side

Claims (6)

An aerosol generator for generating an aerosol by dispersing material particles in a carrier gas;
An injection nozzle that ejects the aerosol generated by the aerosol generator as an aerosol flow;
A workpiece holder for holding the workpiece so that the aerosol flow is sprayed onto the deposition surface of the workpiece;
A conductor on which the aerosol flow is sprayed on one surface, and the conductor is directed against the spray nozzle so that the aerosol flow is sequentially sprayed on a region where the aerosol flow is not sprayed on the one surface. A relatively moving drive device,
A film forming apparatus comprising: a potential detecting unit configured to detect a potential of the conductor.   The drive device is arranged so that the area where the aerosol flow is sprayed on the one surface of the conductor is arranged in a flat state on substantially the same plane as the film formation surface of the object to be processed, The film forming apparatus according to claim 1, wherein the conductor is moved relative to the spray nozzle.   A controller for controlling a film formation rate, which is a film rate formed by spraying the aerosol flow on the film formation surface of the object to be processed, based on the electric potential detected by the electric potential detection unit; The film-forming apparatus of Claim 1 or 2 provided.   The film formation apparatus according to claim 3, wherein the control apparatus controls the film formation rate by controlling a concentration of the material particles in the aerosol through the aerosol generator. A flow regulator for adjusting the flow rate of the aerosol flow ejected from the spray nozzle;
The film formation apparatus according to claim 3 or 4, wherein the control device controls the film formation rate by controlling a flow rate of the aerosol flow through the flow rate regulator. An aerosol generating step for generating aerosol by dispersing material particles in a carrier gas;
An arrangement step of arranging an object to be processed having a film formation surface at a predetermined position;
An ejection process in which the generated aerosol is ejected from the ejection nozzle as an aerosol flow, and a part of the aerosol flow is sprayed onto a film formation surface of the object to be processed;
A moving step of moving a conductor having one surface to which the aerosol flow is sprayed relative to the injection nozzle so that the aerosol flow is sprayed while the one surface is moving;
A potential detection step of detecting a potential of the conductor;
A control step of controlling a film formation rate, which is a rate of a film formed by spraying the aerosol flow on the film formation surface of the object to be processed, based on the electric potential detected in the electric potential detection step. Film forming method.

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