JP2008237964A - Metallic mask for spray coating and method of forming thin film using the mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metallic mask for spray coating which is capable of efficiently preventing a coating liquid stuck on the surface of the mask during spray process from running along the inner wall of a pattern forming hole to flow into a gap between the mask and a material to be coated. <P>SOLUTION: The metallic mask for spray coating is provided with a mask main body 10 having a material-to-be-coated contact surface 10A which is abutted on the surface of the material to be coated and a coating liquid sticking surface 10B on opposite side to the material-to-be-coated contact surface 10A and at least one pattern forming hole 40 provided in the mask main body 10 so as to communicate respective surfaces 10A and 10B with each other, wherein a recessed part for forming a desired gap between the mask main body 10 and the material to be coated is provided around the opening end of the hole 4 on the material-to-be-coated contact surface 10A side and one or more grooves 43 surrounding the inner wall 41 to prevent the coating liquid stuck on the coating liquid sticking surface 10B from flowing down from the sticking surface 10B and reaching the material-to-be-coated contact surface 10A are provided on the inner wall 41 of the patter forming hole 4. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a metal mask for spray coating and a thin film manufacturing method using the mask.

Organic compounds such as polymers and oligomers, inorganic compounds, and organic-inorganic hybrid materials are often used as various thin films such as insulating films, charge transport films, protective films, and planarization films in electronic device materials.
The processes for producing these thin films can be roughly classified into a dry process typified by a vacuum deposition method and a wet process typified by a spin coating method.
When comparing the dry process with the wet process, the thin film produced by the wet process has a higher ability to coat substrates such as ITO, IZO, and films, and uniform foreign matter on the substrate surface. Can be uniformly coated. For this reason, the wet process is a method capable of manufacturing a large-area electronic device at a low cost and with a high yield, and has a high advantage.

As this wet process, a spin coating method, a printing method, an ink jet method, a spray method and the like have been widely used conventionally.
When a thin film is produced by a spin coating method or a printing method, the ratio of the amount of waste chemical solution to the amount of chemical solution required for producing the thin film is very large, and the cost performance is poor.
On the other hand, the spray method and the ink jet method can produce a thin film with high efficiency. In particular, the spray method has a large area because of the versatility of the apparatus, the ease of maintenance, and the low dependence on the chemical type of the head. It is effective as a wet process that can produce devices.

So far, the present inventors have found a charge transporting thin film suitable for an organic electroluminescence element (see, for example, Patent Document 1), and developed a technique for producing a charge transporting thin film corresponding to each electronic device by a wet process. Constructed (see, for example, Patent Document 2), in particular, continues to study charge transporting varnishes that are optimal for the spray method.
By the way, in order to create a thin film by introducing the spray method into the actual line, in addition to selecting a varnish and a substrate suitable for the spray method by trial and error, it is necessary to be able to pattern the thin film at a specific position. Is done. In order to satisfy this requirement, various metal masks provided with pattern formation holes corresponding to the pattern formed on the substrate have been developed and used (for example, see Patent Documents 3 and 4).

In the spray process using a metal mask, a metal mask is placed on a base material for forming a thin film, and after spraying a coating liquid for forming a thin film to form a pattern on the base material, the metal mask is removed, It is common to fire the substrate.
The varnish sprayed in the spraying process is not only applied to the substrate through the hole for pattern formation, but also adheres to the metal mask surface in a wet state. If the metal mask with the varnish attached is used repeatedly, the attached varnish may flow down the inner wall of the pattern forming hole and flow between the mask and the substrate, and an accurate pattern may not be produced.
Therefore, in order to accurately form a target pattern on the substrate without defects, it is ideal to replace or clean the metal mask every time the spray process is completed.

However, replacing or cleaning the metal mask for each spraying process is not realistic because it reduces the running cost and running time of the line and reduces the yield when manufacturing electronic devices. is not.
JP 2002-151272 A JP 2005-108828 A JP 2005-78892 A JP 2006-73276 A

  The present invention has been made in view of such circumstances, and the application liquid adhered to the mask surface during the spraying process flows between the mask and the object to be coated along the inner wall of the pattern forming hole. It aims at providing the metal mask for spray application which can prevent efficiently.

  As a result of intensive studies to solve the above problems, the inventors of the present invention have, as a result, a mask body having a coating object contact surface that contacts the surface of the coating object and a coating liquid adhesion surface opposite to this surface. In the metal mask having at least one pattern forming hole provided in the mask body in communication with the coating object contact surface and the coating liquid adhesion surface, the inner wall of the pattern forming hole is circulated around the inner wall. By providing one or more grooves to be applied, the coating liquid flows into the groove during the process of the coating liquid adhering to the coating liquid adhering surface flowing down from the coating liquid adhering surface to the object contacting surface. It was found that it was possible to prevent intrusion between the contact surface and the object to be coated, and the present invention was completed.

  That is, the metal mask for spray coating according to the present invention includes a plate-shaped mask main body having an object contact surface that contacts the surface of the object to be applied, and a coating liquid adhesion surface opposite to this surface, At least one pattern forming hole provided in the mask main body in communication with the object contact surface and the coating liquid adhering surface, and around the opening end of the pattern forming hole on the object contact surface side In addition, a recess for forming a desired gap is provided between the mask body and the object to be coated, and the coating liquid adhering to the coating liquid adhesion surface flows down from the coating liquid adhesion surface on the inner wall of the pattern forming hole. One or more grooves that circulate around the inner wall are provided to prevent reaching the workpiece contact surface.

In this way, by providing a recess around the opening end of the pattern forming hole on the workpiece contact surface side, a gap is formed between the mask body and the workpiece, so that the pattern forming hole passes through the pattern forming hole. Thus, it is possible to prevent the coating liquid adhering to the coating object from entering the gap between the coating object and the mask body due to a capillary phenomenon or the like.
Further, by providing one or more grooves around the inner wall on the inner wall of the pattern forming hole, this groove acts as a trap for excess coating liquid flowing down the inner wall, so that the metal mask surface (coating liquid adhesion surface) ) Even if the excess coating solution adhering to the surface diffuses and flows down along the inner wall according to gravity, the coating solution is trapped in the groove. Reaching the object contact surface can be prevented.
This makes it possible to form an accurate and defect-free pattern multiple times by repeatedly using the same metal mask, which can greatly reduce the number of times the metal mask is cleaned in the thin film fabrication process, and the process running cost and running Time can be greatly improved.

In the present invention, the cross-sectional shape of the groove is arbitrary, and the cross-section can adopt an appropriate shape such as a V-shaped groove, a U-shaped groove, and a concave groove (a U-shaped groove). In order to prevent the re-flow of the applied coating liquid, a concave groove is suitable.
Further, the number of grooves may be one or more, but the number of grooves may be two or more because trapping efficiency of excess coating liquid is increased by using a plurality of grooves. However, the use of multiple electrodes not only increases the manufacturing cost of the metal mask, but also increases the amount of time required for cleaning and drying the metal mask. The number may be set to an appropriate number in consideration of the running cost and running time. In a normal thin film manufacturing process, a sufficient effect is exhibited with one or two grooves.

Furthermore, the position of the groove is above the metal mask surface (coating liquid adhesion surface) above the bottom surface (ceiling surface in use) of the recess provided around the opening end of the pattern forming hole on the workpiece contact surface side. It is optional as long as it is below, but the trapping efficiency increases when it is located farther from the mask surface (coating liquid adhesion surface), so the central part of the inner wall of the pattern formation hole in the vertical direction (hole communication direction) It is preferable that it is provided from the bottom to the bottom of the recess.
When a plurality of grooves are formed, at least one groove may be provided between the center in the vertical direction of the inner wall of the pattern forming hole and the bottom surface of the recess.

The depth direction of the groove may be parallel to the object contact surface or toward the object contact surface as it gets deeper, but if it is parallel to the object contact surface, the excess coating liquid trap The effect is fully demonstrated.
Therefore, in order to simplify the mask manufacturing process including the formation of the groove, the depth direction of the groove is preferably parallel to the contact surface of the workpiece.

  On the other hand, the concave portion provided around the opening end of the pattern forming hole on the workpiece contact surface side has, for example, a stepped portion around the opening end as described in Patent Document 3 described above. However, the shape, size, and the like of the pattern forming hole are arbitrary as long as the end of the pattern forming hole on the object contact surface side does not directly contact the object to be coated.

In the present invention, the entire metal mask may be formed of a single member, and the grooves and recesses described above may be formed by a known technique such as etching or excavation, but it is difficult to process the grooves by etching or excavation. Therefore, it is preferable that at least the groove is formed by stacking a plurality of members.
As such a configuration, for example, a first member having an object contact surface and an upper surface, and having a pattern forming hole on the object contact surface side, an application liquid adhesion surface and a lower surface are provided. And a second member in which a pattern forming hole on the coating liquid adhesion surface side is formed and a stepped portion is formed around the opening end on the lower surface side of the pattern forming hole. And the lower surface of the second member are stacked in such a manner that the centers (axis) of the respective pattern forming holes coincide with each other, and the above-mentioned groove is formed by the stepped portion of the second member and the upper surface of the first member. Is mentioned.

  Also, it has a workpiece contact surface and an upper surface, and a pattern forming hole on the workpiece contact surface side is formed, and a stepped portion is formed around the opening end on the upper surface side of the pattern forming hole. The first member and the second member having a coating liquid adhesion surface and a lower surface and having a pattern forming hole formed on the coating liquid adhesion surface side, and the upper surface of the first member and the lower surface of the second member Are stacked in such a manner that the centers (axis) of the respective pattern forming holes coincide with each other, and the above-mentioned groove is formed by the stepped portion of the first member and the lower surface of the second member.

  Furthermore, it has a workpiece contact surface and an upper surface, and a pattern forming hole on the workpiece contact surface side is formed, and a first step shape is formed around the opening end on the upper surface side of the pattern forming hole. A pattern forming hole is formed on the coating liquid adhesion surface side, and is formed around the opening end on the lower surface side of the pattern formation hole. A second member formed with two stepped portions, the upper surface of the first member and the lower surface of the second member are laminated in such a manner that the centers of the respective pattern formation holes coincide with each other, and the first step What forms the above-mentioned groove | channel with a shape part and a 2nd step-shaped part is mentioned.

In these three configurations, either one or both of the two members to be stacked are provided with a stepped portion on the boundary surface between the two members to form a groove. As a result of forming a metal mask by stacking and forming a groove at the same time, fine groove processing is not required, and the mask manufacturing process is simplified.
In these cases, a stepped portion corresponding to the concave portion of the mask member is formed around the opening end of the pattern forming hole of the first member on the workpiece contact surface side.

Furthermore, in addition to the grooves described above, the recesses can also be configured by stacking a plurality of members.
As such a configuration, for example, a first member having an object contact surface and an upper surface, and having a pattern forming hole on the object contact surface side, an application liquid adhesion surface and a lower surface are provided. And a second member having a stepped portion formed around the opening end on the lower surface side of the pattern forming hole, a first member contact surface, The second member abutting surface and the third member having the pattern forming hole in the intermediate portion are used, and the hole diameter of the pattern forming hole in the first member is set to the pattern forming hole in the second and third members. The first member, the second member, and the third member are made larger than the hole diameter of the first member, and the upper surface of the first member and the lower surface of the second member are in contact with the third member, and the respective pattern forming holes Are stacked so that their centers (axis) coincide with each other, and the stepped portion of the second member and the second of the third member Forming a groove in the wood abutment surface, and the like to form a recess in the further first member contact surface of the first member of the patterned hole and the third member.

  In addition, the first member having a coating object contact surface and an upper surface and having a pattern formation hole on the coating object contact surface side, and a coating liquid adhesion surface and a lower surface, the coating liquid adhesion surface side A second member having a pattern forming hole, a first member contact surface and a second member contact surface, and an intermediate pattern forming hole is formed. Using a third member having a stepped portion formed around the opening end on the second member contact surface side, the hole diameter of the pattern forming hole of the first member is set to the hole diameter of the pattern forming hole of the second and third members. The first member, the second member, and the third member are made larger than the first member, the upper surface of the first member and the lower surface of the second member are in contact with the third member, and the center of each pattern forming hole. (Axes) are laminated in a matching manner, and a groove is formed by the stepped portion of the third member and the lower surface of the second member, And the like to form a recess in the first member contact surface of the first member of the patterned hole and the third member and the al.

In these two configurations, in the pattern forming hole of one of the second member and the third member, a stepped portion is provided on the boundary surface between both members to form a groove, and the pattern forming hole of the first member And the first member contact surface of the third member form a recess. In this case as well, as a result of forming the metal mask by laminating the respective members, fine grooves are not required. Thus, the mask manufacturing process is simplified.
In these configurations, the stepped portion is provided on the boundary surface between the two members in the pattern forming hole of either the second member or the third member. Wide grooves can also be formed.

And you may comprise both a groove | channel and a recessed part with multiple members.
As such a configuration, for example, a first member having an object contact surface and an upper surface, and having a pattern forming hole on the object contact surface side, an application liquid adhesion surface and a lower surface are provided. And a second member in which a pattern forming hole on the coating liquid adhesion surface side is formed, a first member contact surface and a second member contact surface, and an intermediate pattern forming hole is formed. And a third member composed of an upper member positioned on the second member side and a lower member positioned on the first member side, and the hole diameter of the pattern forming hole of the upper member is set to the pattern of the second member. The hole diameter of the pattern forming hole of the first member is made smaller than the hole diameter of the pattern forming hole of the lower member, and the hole diameter of the pattern forming hole of the lower member is made larger than the hole diameter of the pattern forming hole of the lower member, The first member, the second member, and the third member are connected to the top surface of the first member and the first member. Manner and the lower surface of the member is in contact with the third member, and include those to be stacked in a manner that the center of each of the pattern forming holes coincide.
In this configuration, a groove is formed by the lower surface of the second member, the pattern formation hole of the upper member, and the upper surface of the lower member, and the pattern formation hole of the first member and the first member abutment of the third member A concave portion is formed by the surface.
Also in this case, as a result of forming the metal mask by laminating the respective members and simultaneously forming the groove and the concave portion, the processing of the fine groove and the concave portion becomes unnecessary, and the mask manufacturing process becomes simple.

The metal mask of the type in which a plurality of members described above are stacked can be manufactured by stacking and integrating each member by a known method such as thermocompression bonding.
Moreover, what is necessary is just to form the step-shaped part which each member has by well-known methods, such as an etching and excavation.

The metal constituting the metal mask of the present invention may be appropriately selected from conventionally known ones according to the coating solution used.
Metal mask materials include magnetic materials and non-magnetic materials. The application object (base material) installation stage of the spray coating device is made of magnetic material, and the object to be applied is fixed between the metal mask and the stage. Thus, in order to eliminate the alignment process and improve the throughput and yield of the line, the metal mask preferably includes a magnetic material.
In this case, the strength of the magnetic force of the metal mask may be set to such a strength that the metal mask does not deviate from the object to be coated during the spray coating in consideration of the material of the stage of the spray coating apparatus.

When the above-mentioned laminated type is adopted as the configuration of the metal mask, in the two-layer laminated type, both or either one of the first member and the second member can be made of a magnetic material, and the properties of the substrate setting stage The magnetic force can be easily adjusted according to the condition.
In the three-layer stacking type, at least one of the first member, the second member, and the third member can be made of a magnetic material, and in this case also, the magnetic force can be easily adjusted according to the material of the substrate installation stage. It can be done.
In particular, it is preferable that at least the first member is made of a magnetic material in order to efficiently prevent the displacement of the mask during spray application after firmly fixing the object to be coated.

  Specific examples of the non-magnetic material constituting the metal mask include SUS201, SUS202, SUS301, SUS301J, SUS302, SUS302B, SUS303, SUS303Se, SUS304, SUS304L, SUS304N1, SUS304N2, SUS304LN, SUS304J1, SUS304J3, 305, JS305, 305 SUS309S, SUS310S, SUS316, SUS316L, SUS316N, SUS316LN, SUS316Ti, SUS316J1, SUS316J1L. SUS317, SUS317L, SUS317LN, SUS317J1, SUS317J2, SUS317J3L, SUS317J4L, SUS317J5L, SUS321, SUS347, SUS384, SUS329J1, SUS329J3L, SUS329J4L, SUS403, SUS410, SUS410S, SUS410F2, SUS410J1, SUS431, SUS416, SUS420F, SUS420F2, SUS429J1, SUS405, SUS410L, SUS429, SUS430, SUS430F, SUS430LX, SUS430J1L, SUS434, SUS436L, SUS436J1L, SUS444, SUS447J1, SUS440A, SUS440B, SUS440C, SUS440F, SU 420J1, SUS420J2, SUS630, SUS631, SUS631J, SUS632J1, SUSXM7, SUSXM15J1, SUSXM27 the like.

  On the other hand, specific examples of the magnetic material include SUS403, SUS410, SUS410S, SUS410F2, SUS410J1, SUS431, SUS416, SUS420F, SUS420F2, SUS429J1, SUS405, SUS410L, SUS429, SUS430, US430F, SUS430LX4, SUS430LX4, SUS430L36 Examples include SUS444, SUS447J1, SUS440A, SUS440B, SUS440C, SUS440F, SUS420J1, SUS420J2, and SUSXM27.

The metal mask for spray coating described above is placed on the coating object in such a manner that the contact surface of the coating object is in contact with the coating object, and the charge transporting varnish or the like is applied to the surface of the coating object through the pattern forming hole. Various functional thin films can be formed by spray coating the coating liquid for forming a thin film.
Here, the functional thin film has a thickness of about 1 to 1000 nm to which a function satisfying various required characteristics such as conductivity, dielectric constant, transparency, work function, optical characteristics, heat resistance, and solvent resistance is given. It is a film having.

The object to be applied (base material) is purified by performing liquid cleaning and drying with a detergent, alcohol, pure water or the like in advance, and ozone treatment, oxygen-plasma treatment, excimer-UV treatment, etc. immediately before use. It is preferable to perform the surface treatment. In addition, when a to-be-coated object (base material) has an organic substance as a main component, it is not necessary to perform surface treatment.
The process of spray-coating a coating solution for forming a thin film on the surface of a coated object (base material) that has been cleaned and surface-treated is the introduction of the coated object (base material) into the spray device and the coating material (base material) It consists of a series of steps of placing a metal mask on and spraying. In this case, parameters such as the environment in the spray coating apparatus, the specifications of the spray head, and the spray conditions may be adjusted and set so that an optimum thin film pattern and film formation surface can be produced. The spray conditions include the moving range in which the spray head scans the substrate (substrate), the pitch, the distance from the stage to the head, the scanning speed, the amount of coating liquid, the amount of air, the coating standby time, and the tank internal pressure stabilization time. Etc.

After spray coating, the coating solution is leveled, and then the substrate coated with the coating solution is baked and dried.
Leveling is performed in an appropriate atmosphere such as an air atmosphere or a nitrogen atmosphere.
Firing is performed using, for example, a hot plate, a proximity hot plate, an oven, or the like in an air atmosphere, an inert gas atmosphere such as nitrogen, or in a vacuum. In this case, the firing temperature is not particularly limited as long as the solvent can be evaporated, but it is preferably performed at 40 to 250 ° C. In addition, a temperature change of two or more steps may be applied for the purpose of expressing higher uniform film forming property or allowing the reaction to proceed on the substrate.

The leveling / firing step includes a metal mask removal step in line processing.
The metal mask may be removed after leveling or may be removed after the drying of the substrate is completed.However, when removing after drying the substrate, solids adhere to the metal mask. The order of removal is preferred.

As described above, the metal mask of the present invention has a recess that forms a desired gap between the mask body and the object to be coated around the opening end of the pattern forming hole on the object contacting surface side, The inner wall of the pattern forming hole has a groove that circulates around the inner wall to prevent the coating liquid adhering to the coating liquid adhesion surface from flowing down from the coating liquid adhesion surface and reaching the workpiece contact surface. Therefore, as long as the coating liquid flowing down the grooves can be trapped, the metal mask can be used continuously without being cleaned or replaced.
After repeated use a plurality of times, just before the coating liquid adhering to the metal mask exceeds the groove trap allowance, the metal mask may be cleaned and dried as in the prior art.

This metal mask cleaning / drying step is a step of completely drying after removing and cleaning the coating liquid adhering to the metal mask.
The metal mask cleaning process is performed using an organic solvent or water. The organic solvent is not particularly limited as long as it can dissolve and remove the coating solution and the solid matter adhering to the metal mask. For example, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, 1,3 -Dimethyl-2-imidazolidinone, dimethyl sulfoxide, acetone, methanol, ethanol, isopropyl alcohol, etc. can be used. Of these, N, N-dimethylformamide, N-methylpyrrolidone, and isopropyl alcohol are preferable. In addition, after washing | cleaning with an organic solvent, you may wash | clean with detergent, a pure water, etc. further.
The drying of the metal mask is not limited as long as it can be completely dried, but may be dried with air or a nitrogen stream, or may be dried by applying heat in an oven or the like.

  The metal mask of the present invention can be used for forming various functional thin films, for example, capacitor electrode protective film, antistatic film, gas sensor, temperature sensor, humidity sensor, pressure sensor, optical sensor, radiation sensor, ion Organic films used in sensors, biosensors, field emission transistor sensors, etc .; organic films used in primary batteries, secondary batteries, fuel cells, solar cells, polymer batteries; electromagnetic shielding films, ultraviolet absorption films, gas barrier films, It can be used for forming an organic film or the like used for an optical information recording medium or an optical integrated circuit.

According to the metal mask of the present invention, even when the number of times of cleaning is greatly reduced in the metal mask cleaning process, it is difficult to cause defects in the thin film pattern to be manufactured, so that a good thin film pattern can be efficiently manufactured. It becomes.
Thereby, it is possible to reduce the running cost and shorten the running time of an electronic device manufacturing line using a metal mask.
By using the metal mask of the present invention for an object to be coated (substrate) such as ITO, IZO, and film, the process margin of various electronic devices that require the production of a thin film pattern can be expanded. For example, when an electronic device such as a passive matrix or an active matrix in an organic EL that requires a clear distinction between a coated surface and a non-coated surface is produced, a great effect is exhibited such as an improvement in yield.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]
As shown in FIGS. 1 to 3, the metal mask 1 according to the first embodiment of the present invention is opposite to the coating object contact surface 10 </ b> A that contacts the surface 91 of the base material 90 that is the coating object. For forming four patterns having a rectangular shape in plan view, provided on the mask body 10 such that the mask body 10 having the coating liquid adhesion surface 10B on the side, the object contact surface 10A, and the coating liquid adhesion surface 10B communicate with each other. And a hole 40.
A recess 42 that forms a gap of a predetermined width is provided between the mask main body 10 and the base material 90 in the opening end periphery 40A of the pattern forming hole 40 on the workpiece contact surface 10A side (see FIG. 2 (b), see FIG.
Further, the inner wall 41 of the pattern forming hole 40 circulates around the inner wall 41 that prevents the coating liquid adhering to the coating liquid adhesion surface 10B from flowing down from the coating liquid adhesion surface 10B and reaching the workpiece contact surface 10A. A groove 43 having a U-shaped cross section is provided at a substantially central portion in the vertical direction D of the inner wall 41 (see FIGS. 1 and 3). The depth direction of the groove 43 is parallel to the workpiece contact surface 10A and the coating liquid adhesion surface 10B of the metal mask 1.

  The metal mask 1 of the present embodiment is made of a magnetic material (made of SUS430) having a workpiece contact surface 10A and an upper surface 11A, and having a pattern forming hole 11C on the workpiece contact surface 10A side. A first member 11 and a second member 12 made of a magnetic material (made of SUS430) having a coating liquid adhesion surface 10B and a lower surface 12A and having a pattern forming hole 12C on the coating liquid adhesion surface side 10B side. (See FIG. 3).

The first member 11 and the second member 12 are configured such that the upper surface 11A of the first member 11 and the lower surface 12A of the second member 12 face each other, and the centers (axis) of the pattern forming holes 11C and 12C. Are laminated in a matching manner, and are thermocompression bonded and integrated.
Here, the second member 12 has a stepped portion 12B formed by etching or the like around the opening end on the lower surface 12A side of the pattern forming hole 12C. For this reason, when the first member 11 and the second member 12 are laminated, the stepped portion 12B of the second member 12 and the upper surface 11A of the first member 11 constitute the groove 43.

  A stepped portion 11B is also formed around the opening end of the pattern forming hole 11C in the first member 11 on the workpiece contact surface 10A side by etching or the like. The stepped portion 11 </ b> B of the first member 11 also serves as a recess 42 that forms a gap between the mask main body 10 and the base material 90 described above.

In the present embodiment, as shown in FIG. 2, the metal mask 1 is a square with a length d1 = 50 mm in a plan view, and the dimension of the opening of the pattern formation hole 40 is d2 = d3 = 15 mm. is there.
As shown in FIG. 3, the dimensions of the groove 43 and the recess 42 are x1 = x2 = x3 = x4 = 2 mm and y2 = y5 = y4 = y6 = 50 μm. y1 and y3 are 150 μm.

An example of a spray coating method using the metal mask 1 configured as described above will be described with reference to FIG.
First, a base material 90 subjected to surface treatment is introduced into a spray device (not shown), and the metal mask 1 is placed on the base material 90.
In this state, a charge transporting varnish 110 (hereinafter referred to as “varnish 110”), which is a coating liquid for forming a thin film, is sprayed from a chemical liquid ejecting apparatus 100 including a chemical liquid tank 101 and a spray head 102. The sprayed varnish 110 passes through the pattern forming hole 40 of the metal mask 1 and adheres to the substrate 90. Subsequently, the attached varnish 110 is leveled, and the metal mask 1 is removed from the substrate 90. Then, the substrate 90 on which the varnish 110 is applied is baked and dried to form a pattern 120.

  Here, the varnish 110 sprayed from the spray head 102 not only passes through the pattern formation hole 40 and adheres to the substrate 90 but also the coating liquid adhesion surface 10B of the metal mask 1 and the pattern formation hole 40. Will also adhere to the inner wall 41. The surplus varnish 110A diffuses on the surface of the metal mask 1, travels along the inner wall 41 according to gravity, and flows down to the coating object contact surface 10A side. It is trapped in the groove 43 of the metal mask 1. For this reason, if it is within the trap allowable amount of the groove 43, the surplus varnish 110A is prevented from reaching the base material 90.

In addition, since the recess 42 is provided at the periphery of the opening end of the pattern forming hole 40 on the workpiece contact surface 10A side in the metal mask 1, a gap is formed between the metal mask 1 and the substrate 90. ing. For this reason, it is possible to prevent the varnish 110 adhering to the base material 90 from entering the gap between the base material 90 and the metal mask 1 due to a capillary phenomenon or the like.
Therefore, as long as it is within the trap allowable range of the groove 43, a thin film can be produced by repeatedly using the metal mask 1 without cleaning and replacing it.

[Second Embodiment]
FIG. 5 shows a metal mask 2 according to the second embodiment of the present invention. In the following description, the same members and configurations as those of the first embodiment are simply denoted by the same reference numerals, and the description thereof is omitted.
The metal mask 2 has an object contact surface 20A and an upper surface 21A, a first member 21 having a pattern forming hole 21C on the object contact surface 20A side, an application liquid adhesion surface 20B and a lower surface. An aspect in which the upper surface 21A of the first member 21 and the lower surface 22A of the second member 22 are opposed to the second member 22 having the pattern forming hole 22C on the coating liquid adhesion surface side 20B side, And it is laminated | stacked in the aspect in which the center (axis | shaft) of each pattern formation hole 21C and 22C corresponds, and it is thermocompression-bonded and integrated. As a result, the stepped portion 22 </ b> B of the second member 22 and the upper surface 21 </ b> A of the first member 21 form a groove 43.

In the metal mask 2, the thickness of the first member 21 is thicker than that of the metal mask 1, and the thickness of the second member 22 is thinner than that of the metal mask 1. The configuration is the same as that of the metal mask 1 of the first embodiment except that 41 is positioned closer to the coating liquid adhesion surface 20B than the central portion in the vertical direction D.
Specific dimensions are x1 = x2 = x3 = x4 = 2 mm, y1 = y2 = y4 = 150 μm, and y3 = 250 μm.

[Third Embodiment]
FIG. 6 shows a metal mask 3 according to the third embodiment of the present invention. In the following description, the same members and configurations as those of the first embodiment are simply denoted by the same reference numerals, and the description thereof is omitted.
The metal mask 3 has an object contact surface 30A and an upper surface 31A, a first member 31 having a pattern forming hole 31C on the object contact surface 30A side, an application liquid adhesion surface 30B and a lower surface. An aspect in which the upper surface 31A of the first member 31 and the lower surface 32A of the second member 32 are opposed to the second member 32 having the pattern forming hole 32C on the coating liquid adhesion surface side 30B side, In addition, the pattern forming holes 31C and 32C are laminated in such a manner that the centers (axes) thereof coincide with each other and are thermocompression bonded and integrated. As a result, the stepped portion 32 </ b> B of the second member 32 and the upper surface 31 </ b> A of the first member 31 form a groove 43.

In the metal mask 3, the thickness of the first member 31 is thinner than that of the metal mask 1, and the thickness of the second member 32 is thicker than that of the metal mask 1. The structure is the same as that of the metal mask 1 of the first embodiment except that the position 41 is located closer to the workpiece contact surface 30A than the center in the vertical direction D.
Specific dimensions are x1 = x2 = x3 = x4 = 2 mm, y2 = y3 = y4 = 50 μm, and y1 = 250 μm.

The present invention is not limited to those described in the above embodiments. For example, the metal mask 5 (fourth embodiment) shown in FIG. 7 or the metal mask 6 (fifth embodiment) shown in FIG. Also, a configuration such as a metal mask 7 (sixth embodiment) shown in FIG. 9 may be employed.
As shown in FIG. 7, the metal mask 5 according to the fourth embodiment has an object contact surface 50A and an upper surface 51A, and a pattern forming hole 51C on the object contact surface side is formed. A first member 51; and a second member 52 having a coating liquid adhesion surface 50B and a lower surface 52A and having a pattern formation hole 52C on the coating liquid adhesion surface 50B side.

The first member 51 and the second member 52 are configured such that the upper surface 51A of the first member 51 and the lower surface 52A of the second member 52 face each other, and the centers (axes) of the pattern forming holes 51C and 52C. Are laminated in a matching manner, and are thermocompression bonded and integrated.
Here, the first member 51 has a stepped portion 51B formed by etching or the like around the opening end on the upper surface 51A side of the pattern forming hole 51C. For this reason, when the first member 51 and the second member 52 are laminated, the stepped portion 51 </ b> B of the first member 51 and the lower surface 52 </ b> A of the second member 52 constitute the groove 43.

  As shown in FIG. 8, the metal mask 6 according to the fifth embodiment has an object contact surface 60A and an upper surface 61A, and a pattern forming hole 61C on the object contact surface 60A side is formed. The first member 61, the second member having the coating liquid attaching surface 60B and the lower surface 62A, and having the pattern forming hole 62C on the coating liquid attaching surface 60B side, the first member abutting surface 63A and the second member. And a third member 63 made of a magnetic material (made of SUS430) having a member contact surface 63B and having an intermediate pattern forming hole 63C. Here, the hole diameter of the pattern forming hole 61 </ b> C of the first member 61 is larger than the hole diameters of the pattern forming holes 62 </ b> C and 63 </ b> C of the second member 62 and the third member 63.

The first member 61, the second member 62, and the third member 63 are configured such that the upper surface 61A of the first member 61 and the lower surface 62A of the second member 62 are in contact with the third member 63, and the respective pattern forming holes. The layers 61C, 62C, and 63C are stacked in such a manner that the centers (axes) thereof coincide with each other, and are thermocompression bonded and integrated.
Here, the second member 62 has a stepped portion 62B formed by etching or the like around the opening end on the lower surface 62A side of the pattern forming hole 62C. For this reason, the groove 43 is formed by the stepped portion 62B of the second member 62 and the second member contact surface 63B of the third member 63 by stacking the second member 62 and the third member 63. become.
Further, the recess 42 is formed by the pattern forming hole 61 </ b> C of the first member 61 and the first member contact surface 63 </ b> A of the third member 63.
In such a configuration, the stepped portion may be formed not on the second member but on the third member.

As shown in FIG. 9, the metal mask 7 according to the sixth embodiment has an object contact surface 70A and an upper surface 71A, and a pattern forming hole 71C on the object contact surface 70A side is formed. The first member 71, the second member 72 having the coating liquid attachment surface 70B and the lower surface 72A and having the pattern formation hole 72C on the coating liquid attachment surface 70B side, the first member contact surface 73A and the first member contact surface 73A. A two-member contact surface 73B is formed, an intermediate pattern forming hole 73C is formed, an upper member 731 located on the second member 72 side, and a lower member 732 located on the first member 71 side And a third member 73 made of a magnetic material (made of SUS430).
Here, the hole diameters of the pattern forming holes 731 </ b> C of the upper member 731 are smaller than the hole diameters of the pattern forming holes 72 </ b> C of the second member 72 and the pattern forming holes 732 </ b> C of the lower member 732.
Further, the hole diameter of the pattern forming hole 71 </ b> C of the first member 71 is made larger than the hole diameter of the pattern forming hole 732 </ b> C of the lower member 732.

The first member 71, the second member 72, and the third member 73 are configured such that the upper surface 71A of the first member 71 and the lower surface 72A of the second member are in contact with the third member 73, and the respective pattern forming holes 71C. , 72C, 73C are laminated in such a manner that the centers (axes) thereof coincide with each other, and are thermocompression bonded and integrated.
Accordingly, the groove 43 is formed by the lower surface 72A of the second member 72, the pattern forming hole 731C of the upper member 731 and the upper surface 732A of the lower member 732, while the pattern forming hole 71C of the first member 71 is formed. The first member contact surface 73A of the third member 73 constitutes the recess 42.
In this case, the hole diameters of the pattern forming hole 731C of the upper member 731 and the pattern forming hole 71C of the first member 71 are the same, but may be different.

In each of the above embodiments, all members are made of SUS430, which is a magnetic material. However, only some members may be made of a magnetic material, and all members may be made of a nonmagnetic material. As the magnetic material and the nonmagnetic material, any materials as described above can be adopted.
Furthermore, although the number of the grooves 43 is one, it may be two or more. The depth direction of the groove 43 is parallel to the coating object contact surfaces 10A, 20A, 30A, 50A, 60A, and 70A of the metal masks 1 to 7, but the depth direction toward the coating object contact surface becomes deeper. It may be a groove, and the cross-sectional shape of the groove may be other shapes such as a U-shape.

Further, the dimensions of the groove 43 and the recess 42 are not limited to those described above. For example, x1 is preferably equal to x2 and x3 is preferably equal to x4, but x1 and x2 need not be equal to x3 and x4. That is, x1, x2> x3, x4 or x1, x2 <x3, x4 may be used.
Specific dimensions of x1, x2, x3, and x4 depend on the outer dimensions of the metal mask, but are preferably 0.1 to 100 mm, more preferably 0.1 to 10 mm, and particularly preferably 0.1 to 3 mm. preferable.

Also, y2 is preferably equal to y5 and y4 is preferably equal to y6, but y2 and y5 need not be equal to y4 and y6. That is, y2, y5> y4, y6 may be sufficient, and y2, y5 <y4, y6 may be sufficient. y1 may or may not be equal to y3.
y1 + y2 + y3 + y4 is preferably 200 to 10,000 μm from the viewpoint of strength. When the thickness is less than 200 μm, the metal mask is easily bent, and an accurate thin film pattern may not be obtained. Moreover, the mass of the metal mask may be limited, and 200 to 1000 μm is more preferable from the viewpoint of the process.

  In addition, specific materials, shapes, structures, and the like constituting the members are not limited to those described above, and can be appropriately changed as long as the object of the present invention can be achieved.

  Hereinafter, the present invention will be described more specifically with reference to experimental examples and comparative experimental examples, but the present invention is not limited to the following experimental examples. In addition, each apparatus used in the experimental example is as follows.

[Spray coating device]
An NVD coating apparatus NVD-200 manufactured by Fujimori Technology Laboratory Co., Ltd. was used. SUS430 was used as the material for the stage on which the base material was installed.
[UV-O ₃ cleaning equipment]
Techno-Vision UV-O ₃ cleaning system Model 208 was used.
[Contact angle measuring device]
A fully automatic contact angle meter CA-W type manufactured by Kyowa Interface Science Co., Ltd. was used.
[Optical microscope]
ECLIPSE E600 POL manufactured by Nikon Corporation was used.

[Reference Example 1] Preparation of charge transporting varnish A p-hydroxydiphenylamine according to Bulletin of Chemical Society of Japan, 1994, Vol. 67, p. 1749-1752 And p-phenylenediamine were used to synthesize phenyltetraaniline (hereinafter abbreviated as PTA) represented by the formula (1) (yield 85%).

  PTA 0.0637 g (0.1439 mmol) obtained above and 5-sulfosalicylic acid (5-SSA) (manufactured by Wako Pure Chemical Industries, Ltd.) 0.1256 g (0.5757 mmol) represented by the formula (2) In a nitrogen atmosphere, it was completely dissolved in 1.2410 g of 1,3-dimethyl-2-imidazolidinone (DMI). To the resulting solution, 6.2050 g of cyclohexanol (CHA) and then 4.9640 g of butyl cellosolve (BCS) were added and stirred to prepare a charge transporting varnish A (solid content 1.5%).

[Reference Example 2] Preparation of charge transporting varnish B 0.0TA 637 g (0.1439 mmol) of PTA and 0.5601 g (0.5757 mmol) of naphthalenedisulfonic acid oligomer (NSO-2) represented by the formula (3) under nitrogen atmosphere , Completely dissolved in 8.1926 g of DMI. To the resulting solution, 12.2889 g of 2,3-butanediol and then 20.4814 g of isopropyl alcohol were added and stirred to prepare a charge transporting varnish B (solid content 1.5%).
NSO-2 was synthesized according to International Publication No. 2006/025342 (yield 81%).

[Experimental Example 1]
[1] Cleaning and surface treatment of substrate A glass substrate with indium tin oxide (ITO) was used as the substrate to be coated. The thickness of the substrate was 0.7 mm, and the same 50 mm × 50 mm size as that of the metal mask was used.
The substrate was cleaned in a class 1000 clean room in the following order: pure water, neutral detergent, pure water rinse, ultrasonic water in pure water, acetone for electronics industry, isopropyl alcohol for electronics industry, and dried with dry air. Thereafter, it was further completely dried in a clean oven. The substrate after drying was introduced into a UV-O ₃ cleaning device and subjected to surface treatment. After the surface treatment, the polarity term of the ITO surface increased and the contact angle of water became 5 ° or less.

[2] Spray coating The base material 90 obtained above was introduced into a spray coating apparatus, and the metal mask 1 was placed on the base material 90.
Subsequently, a charge transporting varnish A was spray-coated as a varnish 110 from a chemical injection apparatus 100 equipped with a chemical tank 101 and a spray head 102 to produce a thin film pattern. In this case, the spray application condition A includes an XY scan range of 200 mm × 200 mm, a pitch of 12 mm, a distance from the stage to the head of 80 mm, a scan speed of 400 mm / sec, a chemical amount of 1.0 mL / min, and an air amount of 5 0.0 L / min, standby time after spraying is 30 seconds, tank internal pressure stabilization time is 10 seconds, and spray application standby time is 10 seconds.

After spray coating, the substrate with a wet film was dried on a hot plate at 80 ° C. for 5 minutes and then baked in an oven at 200 ° C. for 1 hour to obtain a thin film having a thickness of 15 nm.
After firing, the film-forming surface of the substrate that had sufficiently retained heat was observed with an optical microscope. The observed place is the edge part of the mask part and the non-mask part, and one side of the edge is the base material and the other side is the film part.
The metal mask 1 after spray application was transferred to the thin film pattern manufacturing process again without cleaning. A thin film pattern was continuously produced until a defect due to a capillary phenomenon as shown in FIG.
FIG. 12 shows the film formation surface at the edge portion of the thin film obtained in the twelfth step, and FIG. 13 shows the film formation surface at the edge portion of the thin film where the defect occurred.

  As shown in FIG. 12, the edge portion originally has only one boundary region between the substrate and the film, but the varnish 110 attached to the coating liquid attaching surface 10 </ b> B of the metal mask 1 When reaching the workpiece contact surface 10A, the varnish 110 enters the gap between the substrate 90 and the metal mask 1 by capillary action, and a plurality of boundary regions as shown in FIG. 13 are generated.

[Experiment 2]
A thin film pattern was continuously produced in the same manner as in Experimental Example 1 except that the metal mask 2 was used until a defect due to capillary action occurred.

[Experiment 3]
Except for using the metal mask 3, a thin film pattern was continuously produced in the same manner as in Experimental Example 1 until defects due to capillary action occurred.

[Comparative Experiment Example 1]
Except for using the metal mask 8 shown in FIG. 10, a thin film pattern was continuously produced in the same manner as in Experimental Example 1 until a defect due to capillary action occurred.
In the metal mask 8, four pattern forming holes 40 having the same size and depth as the metal mask 1 are formed in the mask body 80 having the workpiece contact surface 80A and the coating liquid adhesion surface 80B. It does not have the groove | channel and recessed part which were mentioned above. The metal mask 8 is a square having a length of 50 mm in plan view.

[Comparative Experiment Example 2]
Except for using the metal mask 9 shown in FIG. 11, a thin film pattern was continuously produced in the same manner as in Experimental Example 1 until a defect due to capillary action occurred.
In the metal mask 9, four pattern forming holes 40 having the same size and depth as the metal mask 1 are formed in the mask body 85 having the workpiece contact surface 85A and the coating liquid adhesion surface 85B. At the same time, the concave portion 42 is formed around the opening end of the pattern forming hole 40 on the workpiece contact surface 85A side, but does not have a groove. The metal mask 9 is a square having a length of 50 mm in plan view.

  Table 1 shows the number of coatings in which defects occurred in Experimental Examples 1 to 3 and Comparative Experimental Examples 1 and 2.

[Experimental Example 4]
A thin film pattern was continuously produced in the same manner as in Experimental Example 1 except that the spray coating condition was changed to the following spray coating condition B until a defect due to capillary action occurred.
The spray application conditions A and B differ only in the amount of the chemical solution. Since the amount of the chemical solution is larger in the spray application condition B, the chemical solution adhering to the base material and the metal mask also increases. The thin film obtained under spray coating condition B is 30 nm.
[Spray application condition B]
XY scan range 200mm x 200mm, pitch 12mm, stage to head distance 80mm, scan speed 400mm / sec, chemical volume 3.0mL / min, air volume 5.0L / min, waiting time after spraying 30 seconds, the tank internal pressure stabilization time is 10 seconds, and the spray application standby time is 10 seconds.

[Experimental Example 5]
A thin film pattern was continuously produced in the same manner as in Experimental Example 2 except that the spray application condition was changed to the following spray application condition B until a defect due to capillary action occurred.

[Experimental Example 6]
A thin film pattern was continuously produced in the same manner as in Experimental Example 3 except that the spray coating condition was changed to the following spray coating condition B until a defect due to capillary action occurred.

[Comparative Experimental Example 3]
A thin film pattern was continuously produced in the same manner as in Comparative Experimental Example 1 except that the spray coating condition was changed to the following spray coating condition B until a defect due to a capillary phenomenon occurred.

[Comparative Experimental Example 4]
A thin film pattern was continuously produced in the same manner as in Comparative Experimental Example 2 except that the spray application condition was changed to the following spray application condition B until a defect due to capillary action occurred.

  Table 2 shows the number of coatings in which defects occurred in Experimental Examples 4 to 6 and Comparative Experimental Examples 3 and 4.

[Experimental Example 7]
Except for using the charge transporting varnish B, a thin film pattern was continuously produced in the same manner as in Experimental Example 1 until defects due to capillary action occurred.

[Experimental Example 8]
Except for using the charge transporting varnish B, a thin film pattern was continuously produced in the same manner as in Experimental Example 2 until defects due to capillary action occurred.

[Experimental Example 9]
A thin film pattern was continuously produced until a defect due to capillary action occurred in the same manner as in Experimental Example 3 except that the charge transporting varnish B was used.

[Comparative Experimental Example 5]
A thin film pattern was continuously produced in the same manner as in Comparative Experimental Example 1 except that the charge transporting varnish B was used until a defect due to a capillary phenomenon occurred.

[Comparative Experimental Example 6]
A thin film pattern was continuously produced until a defect due to capillary action occurred in the same manner as in Comparative Experimental Example 2 except that the charge transporting varnish B was used.

  Table 3 shows the number of coatings in which defects occurred in Experimental Examples 7 to 9 and Comparative Experimental Examples 5 and 6.

[Experimental Example 10]
Except for using the charge transporting varnish B, a thin film pattern was continuously produced in the same manner as in Experimental Example 4 until defects due to capillary action occurred.

[Experimental Example 11]
Except for using the charge transporting varnish B, a thin film pattern was continuously produced in the same manner as in Experimental Example 5 until defects due to capillary action occurred.

[Experimental example 12]
A thin film pattern was continuously produced until a defect due to capillary action occurred in the same manner as in Experimental Example 6 except that the charge transporting varnish B was used.

[Comparative Experimental Example 7]
A thin film pattern was continuously produced in the same manner as in Comparative Experimental Example 3 except that the charge transport varnish B was used until a defect due to capillary action occurred.

[Comparative Experimental Example 8]
A thin film pattern was continuously produced in the same manner as in Comparative Experimental Example 4 except that the charge transporting varnish B was used until a defect due to capillary action occurred.

  Table 4 shows the number of coatings in which defects occurred in Experimental Examples 10 to 12 and Comparative Experimental Examples 7 and 8.

From the results of Tables 1 to 4 in which the film formation surface obtained by spray coating was observed with an optical microscope and the number of occurrences of defects was examined, even when the metal mask provided with grooves and recesses was repeatedly used without cleaning and replacement. It can be seen that defects are less likely to occur in the produced thin film pattern.
Therefore, the number of times of cleaning and replacement of the metal mask can be greatly reduced, and the running cost and the running time of an electronic device manufacturing line using the metal mask can be reduced.

It is a perspective view which shows the metal mask which concerns on 1st Embodiment of this invention. It is the top view (a) and bottom view (b) which show the metal mask which concerns on 1st Embodiment. It is an end elevation which follows the III-III line in Drawing 1 (a) showing the state where the metal mask concerning a 1st embodiment was laid in the coated object. It is a schematic diagram of the spray application process using the metal mask of 1st Embodiment. FIG. 4 is an end view corresponding to FIG. 3 showing a metal mask according to a second embodiment of the present invention. It is an end elevation equivalent to FIG. 3 which shows the metal mask which concerns on 3rd Embodiment of this invention. It is an end elevation equivalent to FIG. 3 which shows the metal mask which concerns on 4th Embodiment of this invention. It is an end elevation equivalent to FIG. 3 which shows the metal mask which concerns on 5th Embodiment of this invention. It is an end elevation equivalent to FIG. 3 which shows the metal mask which concerns on 6th Embodiment of this invention. FIG. 4 is an end view corresponding to FIG. 3 showing a metal mask according to a comparative example. FIG. 4 is an end view corresponding to FIG. 3 showing a metal mask according to a comparative example. It is an optical microscope photograph which shows the film-forming surface of the edge part of a thin film without a defect. It is an optical microscope photograph which shows the film-forming surface of the edge part of the thin film in which the defect generate | occur | produced.

Explanation of symbols

1, 2, 3, 5, 6, 7 Metal mask 10, 20, 30, 50, 60, 70 Mask body 10A, 20A, 30A, 50A, 60A, 70A Coating object contact surface 10B, 20B, 30B, 50B , 60B, 70B Application liquid adhering surface 40 Pattern forming hole 40A Peripheral contact surface side opening end periphery 41 Inner wall 42 Recess 43 Groove 11, 21, 31, 51, 61, 71 First member 11A, 21A, 31A , 51A, 61A, 71A Upper surface 11C, 21C, 31C, 51C, 61C, 71C Pattern forming holes 12, 22, 32, 52, 62, 72 on the workpiece contact surface side Second members 12A, 22A, 32A, 52A, 62A, 72A Lower surface 12C, 22C, 32C, 52C, 62C, 72C Pattern forming holes 12B, 22B, 32B, 51B, 62B on the coating liquid adhesion surface side Portions 63, 73 Third members 63A, 73A First member contact surfaces 63B, 73B Second member contact surfaces 63C, 73C Upper pattern forming hole 731 Upper member 732 Lower member 732A Lower member upper surface 731C Upper Member pattern forming hole 732C Lower member pattern forming hole 90 Base material (to-be-coated)
110 Charge transport varnish (coating solution)
D Vertical direction

Claims (15)

A mask body having an object contact surface that contacts the surface of the object to be applied and a coating liquid adhesion surface opposite to this surface, and the object contact surface and the coating liquid adhesion surface communicate with each other. And at least one pattern forming hole provided in the mask body,
A recess for forming a desired gap is provided between the mask main body and the object to be coated around the opening end of the pattern forming hole on the object contact surface side, and the pattern forming hole The inner wall of the hole is provided with one or more grooves that circulate around the inner wall to prevent the coating liquid adhering to the coating liquid adhesion surface from flowing down from the coating liquid adhesion surface and reaching the object contact surface. A metal mask for spray coating, characterized by   The metal mask for spray application according to claim 1, wherein the groove is provided between a central portion in the vertical direction of an inner wall of the pattern forming hole and a bottom surface of the recess.   The spray-applied metal mask according to claim 1 or 2, wherein the groove is provided so that a depth direction thereof is parallel to the object contact surface. A first member having the application object contact surface and an upper surface, wherein the pattern forming hole on the application object contact surface side is formed;
The pattern forming hole is formed on the coating liquid adhesion surface side, and a stepped portion is formed around the opening end on the bottom surface side of the pattern formation hole. Two members,
The upper surface of the first member and the lower surface of the second member are stacked such that the centers of the pattern formation holes coincide with each other, and the stepped portion of the second member and the upper surface of the first member The metal mask for spray application according to any one of claims 1 to 3, wherein a groove is formed. The pattern forming hole on the workpiece contact surface side is formed, and a stepped portion is formed around the opening end on the upper surface side of the pattern formation hole. A formed first member;
A second member having the coating liquid adhering surface and a lower surface, wherein the pattern forming hole on the coating liquid adhering surface side is formed;
The upper surface of the first member and the lower surface of the second member are laminated such that the centers of the respective pattern formation holes coincide with each other, and the stepped portion of the first member and the lower surface of the second member are The metal mask for spray application according to any one of claims 1 to 3, wherein the groove is configured. The pattern forming hole on the object contact surface side has a first step around the opening end on the upper surface side of the pattern contact hole. A first member having a shape portion formed thereon;
The pattern formation hole on the coating liquid adhesion surface side is formed, and a second step portion is formed around the opening end on the lower surface side of the pattern formation hole. A second member,
The upper surface of the first member and the lower surface of the second member are laminated in such a manner that the centers of the respective pattern forming holes coincide with each other, and the groove is formed between the first stepped portion and the second stepped portion. The metal mask for spray application according to any one of claims 1 to 3, wherein: A first member having the application object contact surface and an upper surface, wherein the pattern forming hole on the application object contact surface side is formed;
The pattern forming hole is formed on the coating liquid adhesion surface side, and a stepped portion is formed around the opening end on the bottom surface side of the pattern formation hole. Two members;
A third member having a first member abutting surface and a second member abutting surface, wherein the pattern forming hole in the intermediate portion is formed,
The hole diameter of the pattern forming hole of the first member is larger than the hole diameter of the pattern forming hole of the second and third members,
In the first member, the second member, and the third member, the upper surface of the first member and the lower surface of the second member are in contact with the third member, and the centers of the respective pattern forming holes are coincident with each other. The groove is constituted by the stepped portion and the second member abutting surface of the third member which are laminated in a manner, and the pattern forming hole of the first member and the first member contact of the third member The metal mask for spray application according to any one of claims 1 to 3, wherein the concave portion is constituted by a contact surface. A first member having the application object contact surface and an upper surface, wherein the pattern forming hole on the application object contact surface side is formed;
A second member having the coating liquid adhesion surface and a lower surface, wherein the pattern formation hole on the coating liquid adhesion surface side is formed;
The pattern forming hole is formed at an intermediate portion, and has a step around the opening end of the pattern forming hole on the second member contacting surface side. A third member formed with a shaped part,
The hole diameter of the pattern forming hole of the first member is larger than the hole diameter of the pattern forming hole of the second and third members,
In the first member, the second member, and the third member, the upper surface of the first member and the lower surface of the second member are in contact with the third member, and the centers of the respective pattern forming holes are coincident with each other. The groove is constituted by the stepped portion and the lower surface of the second member which are stacked in a mode, and the pattern forming hole of the first member and the first member contact surface of the third member The metal mask for spray application according to any one of claims 1 to 3, wherein a recess is formed. A first member having the application object contact surface and an upper surface, wherein the pattern forming hole on the application object contact surface side is formed;
A second member having the coating liquid adhesion surface and a lower surface, wherein the pattern formation hole on the coating liquid adhesion surface side is formed;
A third member having a first member abutting surface and a second member abutting surface, wherein the pattern forming hole in the intermediate portion is formed,
The third member includes an upper member located on the second member side and a lower member located on the first member side, and the hole diameter of the pattern forming hole of the upper member is the second member. The hole diameter of the pattern forming hole of the lower member is smaller than the hole diameter of the pattern forming hole of the member and the pattern forming hole of the lower member, and the hole diameter of the pattern forming hole of the lower member is smaller than the hole diameter of the pattern forming hole of the lower member Bigger than
In the first member, the second member, and the third member, the upper surface of the first member and the lower surface of the second member are in contact with the third member, and the centers of the respective pattern forming holes are coincident with each other. The groove is formed by the lower surface of the second member, the pattern forming hole of the upper member, and the upper surface of the lower member, and the pattern forming hole of the first member and the first The metal mask for spray application according to any one of claims 1 to 3, wherein the concave portion is constituted by a first member contact surface of three members.   The spray-applied metal mask according to claim 4, wherein at least one of the first member and the second member is made of a magnetic material.   The spray-applying metal mask according to any one of claims 7 to 9, wherein at least one of the first member, the second member, and the third member is made of a magnetic material.   The metal mask for spray application according to any one of claims 4 to 9, wherein the first member is made of a magnetic material.   The metal mask for spray coating according to any one of claims 1 to 12 is placed on an object to be coated such that the object contact surface is in contact with the object to be coated. A method for producing a thin film, comprising a step of spray-coating a coating solution for forming a thin film on a surface of an object to be coated through a hole.   The method for producing a thin film according to claim 13, wherein the coating liquid is a charge transporting varnish. A mask body having an object contact surface that contacts the surface of the object to be applied and a coating liquid adhesion surface opposite to this surface, and the object contact surface and the coating liquid adhesion surface communicate with each other. A coating liquid that prevents the coating liquid from flowing down from the coating liquid adhesion surface of the metal mask for spray coating provided with at least one pattern forming hole provided in the mask body and reaching the surface to be coated contacted A spill prevention method,
A coating liquid outflow prevention method, comprising: providing at least one groove around the inner wall on the inner wall of the pattern forming hole.