JP2008235322A - Aluminum electrolytic capacitor and manufacturing method of lead wire for aluminum electrolytic capacitor - Google Patents
Aluminum electrolytic capacitor and manufacturing method of lead wire for aluminum electrolytic capacitor Download PDFInfo
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- JP2008235322A JP2008235322A JP2007068401A JP2007068401A JP2008235322A JP 2008235322 A JP2008235322 A JP 2008235322A JP 2007068401 A JP2007068401 A JP 2007068401A JP 2007068401 A JP2007068401 A JP 2007068401A JP 2008235322 A JP2008235322 A JP 2008235322A
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 62
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000003990 capacitor Substances 0.000 title claims abstract description 36
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011162 core material Substances 0.000 claims abstract description 49
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000007747 plating Methods 0.000 claims abstract description 26
- 239000011888 foil Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000005871 repellent Substances 0.000 claims description 4
- 238000005304 joining Methods 0.000 abstract description 4
- 229910052718 tin Inorganic materials 0.000 description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910000831 Steel Inorganic materials 0.000 description 13
- 239000010959 steel Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
本発明は、錫めっき線とアルミニウムタブとを接合したリード線を用いたアルミ電解コンデンサ及びそのリード線の製造方法に関するものである。 The present invention relates to an aluminum electrolytic capacitor using a lead wire obtained by joining a tin-plated wire and an aluminum tab, and a method for manufacturing the lead wire.
電子機器に使用されるアルミ電解コンデンサは、電子機器の高品質・高信頼化に伴い信頼性の向上が要求されている。 Aluminum electrolytic capacitors used in electronic devices are required to have improved reliability as the quality and reliability of electronic devices increase.
従来のアルミ電解コンデンサは、夫々アルミニウムからなる陽極箔、陰極箔にリード線を接続し、この陽極箔・陰極箔にセパレータを挟み込みロール状に捲回することにより、一対のリード線を一方向に導出したコンデンサ素子としたものである。 In conventional aluminum electrolytic capacitors, a lead wire is connected to an anode foil and a cathode foil each made of aluminum, a separator is sandwiched between the anode foil and the cathode foil, and a pair of lead wires is unidirectionally wound. This is a derived capacitor element.
図4は従来のアルミ電解コンデンサ用リード線の斜視図であり、図4に示すようにリード線は、錫または錫合金からなる錫めっき鋼芯入り銅線24を所定の長さに切断しアーク溶接によってアルミニウムタブ25に接合したものである。
4 is a perspective view of a conventional lead wire for an aluminum electrolytic capacitor. As shown in FIG. 4, the lead wire is formed by cutting a tin-plated steel cored
さらに有底筒状の金属ケースにはコンデンサ素子と電解液を収納し、ケースの開口部には一対のリード線が挿通する貫通孔を備えた封口体が設けられ、封口体は開口端を封止したものである。 Further, the bottomed cylindrical metal case accommodates the capacitor element and the electrolyte, and the opening of the case is provided with a sealing body having a through hole through which a pair of lead wires are inserted. The sealing body seals the opening end. It has stopped.
このような従来の技術としては、例えば特許文献1に記載されたものが知られている。
このような従来のアルミ電解コンデンサは、錫めっき鋼芯入り銅線24とアルミニウムタブ25との接合部29には錫及びアルミニウム・銅が混在して存在しているため、図4に示すように接合部29表面から針状の錫ウィスカ26が発生するものがあり、錫ウィスカ26によってアルミ電解コンデンサや回路基板の信頼性が悪化するという課題があった。
In such a conventional aluminum electrolytic capacitor, tin, aluminum, and copper are mixedly present at the
本発明は、上記の従来の問題点を解決し錫ウィスカの発生を防止して信頼性の優れたアルミ電解コンデンサを提供することを目的とするものである。 An object of the present invention is to solve the above-described conventional problems and to provide an aluminum electrolytic capacitor having excellent reliability by preventing the occurrence of tin whiskers.
上記目的を達成するために本発明は、芯材に錫めっき層を形成した錫めっき線とアルミニウムタブとを接合したリード線を電極箔に接続したコンデンサ素子を有し、前記リード線は、前記錫めっき線の一部に前記芯材が露出した芯材部を設けてこの芯材部の一部と前記アルミニウムタブとを接合してなるアルミ電解コンデンサとした。 In order to achieve the above object, the present invention has a capacitor element in which a lead wire obtained by joining a tin-plated wire in which a tin-plated layer is formed on a core material and an aluminum tab is connected to an electrode foil, An aluminum electrolytic capacitor is provided in which a core material portion where the core material is exposed is provided on a part of the tin-plated wire, and a part of the core material portion is bonded to the aluminum tab.
本発明によれば、錫めっき鋼線とアルミニウムタブとの接合部に錫が存在しないため錫ウィスカが発生することを防止でき信頼性の優れたアルミ電解コンデンサとすることができるという効果を奏するものである。 According to the present invention, since there is no tin in the joint between the tin-plated steel wire and the aluminum tab, it is possible to prevent the generation of tin whiskers and to produce an excellent reliability aluminum electrolytic capacitor. It is.
(実施の形態)
まず、本発明のアルミ電解コンデンサについて説明する。
(Embodiment)
First, the aluminum electrolytic capacitor of the present invention will be described.
図1は、本発明のアルミ電解コンデンサの構成を示す断面図である。 FIG. 1 is a cross-sectional view showing the configuration of the aluminum electrolytic capacitor of the present invention.
図2は、本発明のアルミ電解コンデンサ用リード線の製造方法を示す断面図であり、図2(a)は錫めっき線とアルミニウムタブとの接合前の状態、図2(b)は接合した後の状態を示す。 FIG. 2 is a cross-sectional view showing a method of manufacturing a lead wire for an aluminum electrolytic capacitor according to the present invention. FIG. 2 (a) shows a state before joining a tin-plated wire and an aluminum tab, and FIG. Shown later.
図1に示すように本発明のアルミ電解コンデンサのリード線3は、錫めっき線4の端部と丸棒のアルミニウムタブ5の端部とをアーク溶接等により接合した接合部9を設けたものである。
As shown in FIG. 1, the
リード線3のアルミニウムタブ5側はアルミニウムからなる陽極箔及び陰極箔の電極箔2と超音波溶接又は圧接によって夫々接合される。さらにセパレータを介在させて陽極箔及び陰極箔を巻回し一対のリード線3が導出したコンデンサ素子1としたものである。
The aluminum tab 5 side of the
さらにコンデンサ素子1はアルミニウムからなる有底筒状の外装ケース15に駆動用電解液又は導電性高分子からなる固体電解質等の電解質(図示せず)と共に収容され、弾性封口体16の貫通孔に一対のリード線3を挿通して封口体16によって外装ケース15の開放端を封止しアルミ電解コンデンサとしたものである。
Further, the capacitor element 1 is housed in a bottomed cylindrical
図2(a)に示すようにリード線3の錫めっき線4は、鋼芯6a上に銅層6bを形成した鋼芯入り銅線を芯材6とし、この芯材6上に錫または錫合金からなる錫めっき層8を形成したものを用いることができ、または鋼芯入り銅線の芯材6の代わりに銅または銅合金からなる芯材6を用いて錫めっき層8を形成したものでもよい。
As shown in FIG. 2A, the tin-plated wire 4 of the
芯材部7は錫めっき層8を設けない芯材6が錫めっき線4の端部に露出したものであり、リード線3の接合部9はこの芯材部7の一部とアルミニウムタブ5とが接合され錫を含まずにアルミニウムと銅とが混在したものである。
The
さらにリード線3の接合部9から芯材部7の一部が露出したもので、これによってリード線3の錫めっき層8が錫めっき線4とアルミニウムタブ5を接合する際に溶融して接合部9に流れ込まないようにしているものである。
Further, a part of the
次に、図2を用いて本発明のリード線の製造方法について説明する。 Next, the manufacturing method of the lead wire of this invention is demonstrated using FIG.
まず錫めっき線4を直線状に配置し、研削加工によって鋼芯6a及び銅層6bを残すように錫めっき層8の一部を錫めっき線4の外周に沿って除去し、一定間隔で円周に帯状に露出した芯材部7を形成した。このように直線状の錫めっき線4の途中で錫めっき層8を研削加工して除去することで芯材部7の厚みを均一にできる。
First, the tin plating wire 4 is arranged in a straight line, and a part of the tin plating layer 8 is removed along the outer periphery of the tin plating wire 4 so as to leave the steel core 6a and the copper layer 6b by grinding. The
前記研削加工は切削工具を用いて削り出す方法または砥石などを用いて研削する方法を用いることができる。また前記研削加工として樹脂や鉱物などを破砕した粒子の研磨剤を噴射して錫めっき層8を除去する方法を用いてもよく一旦除去した錫めっき層8が再付着することを防止できる。 The grinding process may be a method of cutting using a cutting tool or a method of grinding using a grindstone or the like. Further, as the grinding process, a method of removing the tin plating layer 8 by spraying particles of a crushed resin or mineral may be used, and the once removed tin plating layer 8 can be prevented from reattaching.
次に帯状に露出した芯材部7の一部を切断して、図2(a)に示すように錫めっき線4の一端に芯材部7を設けた。
Next, a part of the
さらに図2(b)に示すように錫めっき線4の芯材部7の端部とアルミニウムタブ5の端部とを当接してアーク溶接により錫めっき線4とアルミニウムタブ5を接合した。
Further, as shown in FIG. 2B, the end of the
また、芯材部7とアルミニウムタブ5との接合は、アルミニウムタブ5の端面に穴加工し、この穴内に芯材部7を挿入してガスバーナで加熱しアルミニウムタブ5に芯材部7を接合してもよい。
Further, the
なお、研削加工によって芯材部7を形成する工程はこれに限定されるものではない。
In addition, the process of forming the
以上のように、錫めっき線4とアルミニウムタブ5との接合部9に錫が混在しないため、錫ウィスカが発生することを防止できる。
As described above, since tin is not mixed in the
本発明の他の実施の形態について説明する。 Another embodiment of the present invention will be described.
図3は本発明の他のアルミ電解コンデンサ用リード線の断面図であり、図2に示す実施の形態と同じ構成については同一符号を付与し説明を省略する。 FIG. 3 is a cross-sectional view of another lead wire for an aluminum electrolytic capacitor according to the present invention. The same components as those in the embodiment shown in FIG.
図3に示すように、錫めっき線4とアルミニウムタブ5との接合部9から一部が露出した芯材部7の表面上にシリコン樹脂・フッ素樹脂などの樹脂で被覆した撥水性樹脂層10を設けたものであり、これによって芯材部7の耐水性を向上することができる。さらに錫めっき線4とアルミニウムタブ5との接合部9の表面上に撥水性樹脂層10を設けてもよい。
As shown in FIG. 3, a water-repellent resin layer 10 in which a surface of a
なお、研削加工の代わりに弗化水素などの溶液を用いて化学的または電気化学的に溶解することによって錫めっき層8を除去してもよい。 The tin plating layer 8 may be removed by chemical or electrochemical dissolution using a solution such as hydrogen fluoride instead of grinding.
次に、本発明の実施例について説明する。 Next, examples of the present invention will be described.
(実施例)
実施例のリード線は、厚み20μm〜30μmの銅層上に電気めっきにより厚み10μm〜15μmの錫めっき層を形成した直径φ0.6mmの錫めっき鋼芯入り銅線と、アルミニウムの純度99.99%で直径φ1.2mmのアルミニウムタブとを用いた。
(Example)
The lead wire of the example has a tin-plated steel cored copper wire with a diameter of 0.6 mm, in which a tin plating layer with a thickness of 10 μm to 15 μm is formed by electroplating on a copper layer with a thickness of 20 μm to 30 μm, and an aluminum purity of 99.99. % And an aluminum tab having a diameter of 1.2 mm.
直線状に配置した錫めっき鋼芯入り銅線の外周に切削刃を回転させて銅層を残して錫めっき層を除去し芯材部を形成した後、芯材部の一部を切断し、錫めっき鋼芯入り銅線の端部に長さ1.0mmの芯材部を設けた。さらに芯材部とアルミニウムタブとをアーク溶接により接合し、芯材部とアルミニウムタブとの接合部から0.2mm〜0.5mmの長さの芯材部が露出したリード線を作製した。 After rotating the cutting blade on the outer periphery of the tin-plated steel cored copper wire arranged in a straight line, leaving the copper layer and removing the tin plating layer to form the core material part, cutting a part of the core material part, A core material part having a length of 1.0 mm was provided at the end of the tin-plated steel cored copper wire. Furthermore, the core material part and the aluminum tab were joined by arc welding to produce a lead wire in which the core material part having a length of 0.2 mm to 0.5 mm was exposed from the joint part between the core material part and the aluminum tab.
(比較例)
比較例は、実施例の外周上に芯材部を設けた錫めっき鋼芯入り銅線の代わりに、外周上に芯材部を形成しないで切断した錫めっき鋼芯入り銅線を用いた以外は実施例と同様にリード線を作製した。
(Comparative example)
In the comparative example, in place of the tin-plated steel cored copper wire provided with the core part on the outer periphery of the example, a tin-plated steel cored copper wire cut without forming the core part on the outer periphery was used. Produced lead wires in the same manner as in Example.
次に、実施例および従来例のリード線の各々100本を抜き取り、60℃90%RHの高温高湿環境条件下で4000時間放置試験後に、錫ウィスカ発生の有無を倍率50倍の光学顕微鏡で観測した。 Next, 100 of each of the lead wires of the example and the conventional example are extracted, and after a 4000 hour standing test under a high temperature and high humidity environment of 60 ° C. and 90% RH, the presence or absence of tin whisker generation is checked with an optical microscope with a magnification of 50 times. Observed.
その結果、実施例では錫ウィスカの発生はなく0本であったが、比較例では5本で発生があった。さらに実施例のリード線の接合部を倍率200倍の電子顕微鏡で観察した結果、錫ウィスカはなかった。 As a result, tin whisker was not generated in the example and was zero, but in the comparative example, it was generated with five. Furthermore, as a result of observing the joint part of the lead wire of an Example with an electron microscope of 200 times magnification, there was no tin whisker.
以上のように本発明は、錫ウィスカの発生を防止することができるという効果を奏するものであり、特に、高い信頼性を要求されるアルミ電解コンデンサに有用である。 As described above, the present invention has an effect of preventing the occurrence of tin whiskers, and is particularly useful for an aluminum electrolytic capacitor that requires high reliability.
1 コンデンサ素子
2 電極箔
3 リード線
4 錫めっき線
5 アルミニウムタブ
6 芯材
6a 鋼芯
6b 銅層
7 芯材部
8 錫めっき層
9 接合部
10 撥水性樹脂層
15 外装ケース
16 封口体
DESCRIPTION OF SYMBOLS 1
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JP2008251981A (en) * | 2007-03-30 | 2008-10-16 | Nippon Chemicon Corp | Method for manufacturing lead terminal for capacitor |
JP2008311405A (en) * | 2007-06-14 | 2008-12-25 | Niyuucentral Kk | Manufacturing method for lead wire for capacitor, and lead wire for the capacitor |
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JP2010258219A (en) * | 2009-04-24 | 2010-11-11 | Nippon Chemicon Corp | Method for manufacturing electrolytic capacitor and electrolytic capacitor |
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JP2008251981A (en) * | 2007-03-30 | 2008-10-16 | Nippon Chemicon Corp | Method for manufacturing lead terminal for capacitor |
JP2008311405A (en) * | 2007-06-14 | 2008-12-25 | Niyuucentral Kk | Manufacturing method for lead wire for capacitor, and lead wire for the capacitor |
JP2009004586A (en) * | 2007-06-22 | 2009-01-08 | Nippon Chemicon Corp | Manufacturing method for capacitor lead terminal |
JP2009021318A (en) * | 2007-07-11 | 2009-01-29 | Nippon Chemicon Corp | Manufacturing method of lead terminal for capacitor |
JPWO2009107177A1 (en) * | 2008-02-26 | 2011-06-30 | 日本ケミコン株式会社 | Method for manufacturing electrode terminal for aluminum electrolytic capacitor, and electrode terminal for aluminum electrolytic capacitor |
JP2010258219A (en) * | 2009-04-24 | 2010-11-11 | Nippon Chemicon Corp | Method for manufacturing electrolytic capacitor and electrolytic capacitor |
WO2012032720A1 (en) * | 2010-09-10 | 2012-03-15 | パナソニック株式会社 | Electronic component and lead wire for electronic component |
CN102523759A (en) * | 2010-09-10 | 2012-06-27 | 松下电器产业株式会社 | Electronic component and lead wire for electronic component |
JP4962676B2 (en) * | 2010-09-10 | 2012-06-27 | パナソニック株式会社 | Electronic components and lead wires for electronic components |
CN102523759B (en) * | 2010-09-10 | 2013-08-14 | 松下电器产业株式会社 | Electronic component and lead wire for electronic component |
US8693167B2 (en) | 2010-09-10 | 2014-04-08 | Panasonic Corporation | Electronic component and lead-wire for the same |
EP2843672A4 (en) * | 2012-04-27 | 2016-04-27 | Elna Co Ltd | Aluminum electrolytic capacitor and rubber seal for same |
US9190215B2 (en) | 2012-09-24 | 2015-11-17 | Fujitsu Limited | Electrolytic capacitor and method of manufacturing the same |
CN105225840A (en) * | 2015-10-14 | 2016-01-06 | 湖南艾华集团股份有限公司 | Low-leakage current takeup type solid electrolytic capacitor and production method |
WO2022090298A3 (en) * | 2020-10-29 | 2022-08-11 | Micro Energy Technologies Gmbh | Electrical feed-through of an electrolytic capacitor |
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