JP2008208398A5 - - Google Patents
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- JP2008208398A5 JP2008208398A5 JP2007044330A JP2007044330A JP2008208398A5 JP 2008208398 A5 JP2008208398 A5 JP 2008208398A5 JP 2007044330 A JP2007044330 A JP 2007044330A JP 2007044330 A JP2007044330 A JP 2007044330A JP 2008208398 A5 JP2008208398 A5 JP 2008208398A5
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- JP
- Japan
- Prior art keywords
- seconds
- layer
- trench
- thickness
- shows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
図５には、基板上に下層としてＴｉ層を１０ｎｍの厚さに形成し、その上にＣｕ層を１５０ｎｍの厚さに形成し、孔径０．２μｍ、アスペクト比約２のトレンチを備えた試料について、イオン加速電圧３００ｅＶ、イオン電流５０ｍＡに設定して時間の経過、０秒、１５秒後、３０秒、４５秒後の膜の形状の変化を示している。トレンチの底部の非対称性の改善が認められた。 FIG. 5 shows a sample in which a Ti layer is formed as a lower layer on a substrate to a thickness of 10 nm, a Cu layer is formed thereon to a thickness of 150 nm, and a trench having a hole diameter of 0.2 μm and an aspect ratio of about 2 is provided. Shows the change of the film shape after the passage of time, 0 seconds, 15 seconds, 30 seconds, and 45 seconds after setting the ion acceleration voltage to 300 eV and the ion current to 50 mA. An improvement in asymmetry at the bottom of the trench was observed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007044330A JP4880495B2 (en) | 2007-02-23 | 2007-02-23 | Deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007044330A JP4880495B2 (en) | 2007-02-23 | 2007-02-23 | Deposition equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008208398A JP2008208398A (en) | 2008-09-11 |
| JP2008208398A5 true JP2008208398A5 (en) | 2009-10-22 |
| JP4880495B2 JP4880495B2 (en) | 2012-02-22 |
Family
ID=39784956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007044330A Expired - Fee Related JP4880495B2 (en) | 2007-02-23 | 2007-02-23 | Deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4880495B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5160458B2 (en) * | 2009-01-27 | 2013-03-13 | 三ツ星ベルト株式会社 | Pulley structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01149957A (en) * | 1987-12-07 | 1989-06-13 | Hitachi Ltd | Method and device for forming thin film |
| JPH0969498A (en) * | 1995-06-21 | 1997-03-11 | Nippon Steel Corp | Film forming method and device |
| JP4052191B2 (en) * | 2003-06-24 | 2008-02-27 | 株式会社島津製作所 | Composite film forming apparatus and method for forming protective film of magnetic head using the same |
| CN1957106B (en) * | 2004-04-09 | 2011-04-13 | 株式会社爱发科 | Film forming apparatus and film forming method |
-
2007
- 2007-02-23 JP JP2007044330A patent/JP4880495B2/en not_active Expired - Fee Related
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