JP2008205410A - Led device and illumination device provided with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED device capable of inhibiting an occurrence of glare caused by a direct-light component coming from an LED chip. <P>SOLUTION: The LED device comprises an LED chip 21; a wiring board 22 having the LED chip 21 mounted thereon and also provided with wirings to feed electric power to the LED chip 21; a first reflection member 24 provided facing the LED chip 21 and reflects light emitted from the LED chip 21 to the lateral direction of the LED chip 21; and a wavelength conversion member 23 provided laterally of the LED chip 21, which is excited by the light reflected on the first reflection member 24 to perform wavelength conversion of light and transmits the light provided through the wavelength conversion to radiate the light in the direction of transmission. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an LED device and a lighting device including the LED device.

2. Description of the Related Art Conventionally, there is known an illumination device that takes out light from the upper surface of an LED chip and collects the light with a lens provided above the LED chip to perform light distribution control (for example, see Patent Document 1). Conventionally, there is also known an illumination device that performs light distribution control using a reflector that is provided on the outer peripheral side of an LED chip without using a lens (see, for example, Patent Documents). 2).
JP 2006-278309 A JP 2006-107851 A

  However, in the thing of patent document 1, since direct light is radiate | emitted from an LED apparatus toward an irradiation direction, the glare by a direct light generate | occur | produces. Moreover, in the thing of patent document 2, although a part of light radiate | emitted from LED chip is reflected by a reflecting plate and is radiate | emitted in an irradiation direction, it radiate | emits directly toward an irradiation object without passing through a reflecting plate. Since there is also a direct light component, the problem of glare also occurs.

  This invention is made | formed in view of the said problem, and makes it a main objective to provide the LED device which can suppress generation | occurrence | production of the glare by the direct light component from an LED chip, and an illuminating device using the same. Is.

  Hereinafter, means effective for solving the above-described problems will be described. In the following, for easy understanding, a corresponding configuration example in the embodiment of the invention is appropriately shown in parentheses, but is not limited to the specific configuration example shown in parentheses.

  In order to solve the above-mentioned problem, in the invention according to claim 1, a wiring board (wiring board) having an LED chip (LED chip 21) and a wiring for mounting the LED chip and supplying power to the LED chip. 22) and a first reflecting member (first) for reflecting the light emitted from the LED chip to the side of the space formed between the LED chip and the light emitting surface of the LED chip. The reflection member 24) is provided on the side of the LED chip, and a part of the light emitted from the LED chip is wavelength-converted and transmitted, and the wavelength-converted and transmitted light is not wavelength-converted. It is characterized by comprising a wavelength conversion member (wavelength conversion member 23) that emits light synthesized with the transmitted light.

  According to this, the LED device includes the first reflecting member facing the emitting surface of the LED chip, and the light emitted from the LED chip is reflected to the side of the LED chip and the first reflecting member by the first reflecting member. The As a result, it is possible to suppress the direct light component directly irradiated to the outside from the LED chip, and thus it is possible to suppress the occurrence of glare due to the direct light component.

  According to a second aspect of the present invention, the wavelength conversion member is formed in a cylindrical shape and is disposed so as to surround the LED chip. As a result, the light reflected to the side of the LED chip by the first reflecting member can be efficiently incident on the wavelength conversion member, and the wavelength conversion can be suitably performed.

  The invention according to claim 3 is characterized in that the cylindrical wavelength conversion member is brought into contact with the wiring substrate and the first reflecting member is brought into contact with the cylindrical wavelength conversion member.

  Part of the light incident on the wavelength conversion member is absorbed by the wavelength conversion member, and the wavelength conversion member generates heat. When the wavelength conversion member generates heat, heat dissipation from the LED chip disposed inside the wavelength conversion member is hindered. If the heat dissipation of the LED chip is hindered, it causes the temperature of the LED chip to rise, so that the light emission efficiency of the LED chip is lowered and the life reliability of the LED chip may be adversely affected. In this regard, in the present invention, since the wavelength conversion member is provided in contact with the wiring board and the first reflection member, heat generated by the wavelength conversion member can be released through the wiring board and the first reflection member. As a result, since the temperature rise of the LED chip can be suppressed, the light emission efficiency of the LED chip can be improved and the lifetime reliability of the LED chip can be improved.

  The invention according to claim 4 is characterized in that the first reflecting member is made of metal. By forming the first reflecting member from metal, the heat of the wavelength conversion member is easily transmitted to the entire first reflecting member, and can be efficiently radiated from the entire first reflecting member.

  The invention according to claim 5 is characterized in that a heat radiating fin (heat radiating fin 24c) is provided on the anti-LED chip side of the first reflecting member. By forming the heat radiation fin on the anti-LED chip side of the first reflecting member, the heat dissipation from the first reflecting member to the anti-LED chip side can be further improved.

  In the invention according to claim 6, a space surrounded by the wiring board and the wavelength conversion member is filled with a light transmissive resin (resin 25), and the LED chip is embedded in the resin. It is a feature. A part of the light emitted from the LED chip is totally reflected at the boundary surface between the emitting surface of the LED chip and the medium in contact with the emitting surface. Therefore, a part of the light emitted from the LED chip is not extracted outside. In this regard, in the present invention, the LED chip is filled with a light transmissive resin. Here, the refractive index of the resin is larger than the refractive index of air. Therefore, comparing the case where the emission surface of the LED chip is brought into contact with the resin and the case where it is brought into contact with the air, the proportion of total reflection of light at the boundary surface is lower when the LED chip is brought into contact with the resin. As a result, it is possible to improve the light extraction efficiency by filling the LED chip with a light transmissive resin.

  In the invention according to claim 7, a recess (mounting portion 21 a) is formed in the wiring board, the LED chip is mounted in the recess, and an inner peripheral surface (second reflecting portion 22 b) of the recess. ) Is characterized in that a reflection surface is formed that reflects light emitted from the wavelength conversion member in a predetermined radiation direction.

  By mounting the LED chip in the recess formed in the wiring board, it becomes possible to configure an LED device having a package structure in which the wiring board also serves as a housing part, and the size of the LED device as a package can be reduced in size. It becomes possible. Moreover, the 2nd reflection part is formed in the internal peripheral surface of the recessed part formed in the wiring board. As a result, it is possible to reduce the size of the package including the second reflecting portion that reflects the light emitted to the side of the LED chip in a predetermined radiation direction.

  In addition, as described in claim 8, light emitted from the wavelength conversion member is emitted in a predetermined radiation direction on the outer peripheral side of the LED device LED device according to any one of claims 1 to 6. The illumination device (illumination device 10) can be configured by providing the second reflection member (second reflection member 30) that reflects. Thereby, it is possible to configure an illumination device capable of suppressing glare due to a direct light component and controlling light distribution in a desired reflection direction.

  In addition, as in the ninth aspect of the invention, the light guide member (light guide) is formed of a light-transmitting plate-like body and has a recess (recess 133) formed on one surface (LED disposition surface 132). A member 130) and the LED device according to any one of claims 1 to 6, wherein the LED device is disposed in the recess and emits light from the recess in a direction along a surface of the light guide member. It is possible to comprise the illuminating device (illuminating device 110). Accordingly, it is possible to configure a surface-emitting illumination device that can suppress glare due to direct light components.

In the present invention, it is possible to suppress the direct light component directly irradiated from the LED chip to the outside, and thus it is possible to suppress the occurrence of glare due to the direct light component.

[First Embodiment]
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment embodying a lighting device according to the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view of a lighting device according to the present invention. FIG. 2 is an enlarged view of a main part in FIG.

  As shown in FIGS. 1 and 2, the illumination device 10 of the present invention includes an LED device 20 having an LED chip 21, a wiring substrate 22, a wavelength conversion member 23, and a first reflection member 24, and an outer peripheral side of the LED device 20. The second reflection member 30 is provided.

  The LED chip 21 is made of, for example, a gallium nitride compound semiconductor or zinc selenide, and emits blue light. Since the element structure of the LED chip 21 is well known, detailed description thereof is omitted. The wiring board 22 is obtained by forming a predetermined electrical wiring pattern on an insulating substrate. The insulating substrate is formed by providing an insulating layer such as a ceramic film on the surface of a base material made of a good heat conductor such as aluminum or copper. The wiring pattern is formed by etching a copper foil layer fixed to a base material through an insulating layer into a predetermined circuit pattern. The LED chip 21 is mounted on the wiring board 22 so that the electrode part is connected to the wiring pattern and is fed from the power source.

  The wavelength conversion member 23 is made of a material in which a transparent silicone resin is used as a base material and a phosphor that is excited by blue light and emits yellow light is uniformly mixed. The wavelength conversion member 23 is formed in a cylindrical shape, and is fixed to the position surrounding the LED chip 21 on the wiring board 22 with an adhesive. In the wavelength conversion member 23, a part of the incident light is reflected on the inner peripheral surface of the wavelength conversion member 23, and the remaining incident light is transmitted through the wavelength conversion member 23. A part of the light transmitted through the wavelength conversion member 23 is wavelength-converted, but the rest is transmitted without being wavelength-converted.

  The first reflecting member 24 is made of a resin such as acrylic, polycarbonate, or ABS, and is disposed above the LED chip 21 so as to face the emission surface of the LED chip 21. The first reflecting member 24 is formed as an axis object with respect to the optical axis A passing through the center of the LED chip 21. Specifically, as shown in FIG. 2, the first reflecting member 24 has a rotating body shape in which an approximately ¼ arc is rotated around the optical axis A and the diameter becomes smaller as the LED chip 21 is approached. ing. The first reflecting member 24 has a reflecting surface portion 24a on the side facing the LED chip 21, and the surface of the reflecting surface portion 24a is subjected to mirror surface treatment (high reflection processing) by vapor deposition or plating of aluminum or silver. . The tip of the first reflecting member 24 is directed to the LED chip 21 side, and the outer peripheral edge 24 b is fixed to the upper end of the cylindrical wavelength conversion member 23 with an adhesive. By forming the first reflecting member 24 as described above, it is possible to reflect the light incident on the reflecting surface portion 24a from the LED chip 21 to the sides of the LED chip 21 and the first reflecting member 24. . In addition, the dimension of each part is set so that the front-end | tip part of the reflective surface part 24a may not contact the LED chip 21 in the state which has arrange | positioned the 1st reflective member 24 on the wavelength conversion member 23. FIG.

  A space surrounded by the wiring substrate 22, the wavelength conversion member 23, and the first reflection member 24 is filled with a transparent resin 25 such as silicone or epoxy. That is, the LED chip 21 is filled with the transparent resin 25.

  The second reflecting member 30 is fixed to the outer periphery of the wavelength conversion member 23 on the wiring board 22 with an adhesive or the like. The second reflecting member 30 is formed in a substantially parabolic shape by a resin such as acrylic, polycarbonate or ABS. More specifically, as shown in FIG. 1, each curve appearing on both the left and right sides of the wavelength conversion member 23 in an arbitrary cross section including the optical axis A of the LED chip 21 has a focal point F at the center in the height direction of the wavelength conversion member 23. The shape of the second reflecting member 30 is set so as to be a parabola. Thereby, the light emitted from the position of the focal point F can be reflected by the second reflecting member 30 in the direction perpendicular to the emission surface of the LED chip 21. Note that the reflecting surface of the second reflecting plate is mirror-finished by vapor deposition or plating of aluminum or silver.

  Next, the operation of the LED device 20 will be described. Most of the light emitted from the LED chip 21 is reflected by the first reflecting member 24 to the side of the LED chip 21 and enters the wavelength conversion member 23, and the remaining part directly enters the wavelength conversion member 23.

  Blue light is emitted from the LED chip 21, and the wavelength conversion member 23 converts part of the incident blue light into yellow light. As a result, white light, which is a mixture of the wavelength-converted yellow light and the blue light transmitted without wavelength conversion and mixed, is emitted from the wavelength conversion member 23.

  At this time, white light is radiated from the entire cylindrical wavelength conversion member 23. However, since there is a large amount of light that is particularly incident on the central portion in the height direction of the cylinder, this portion becomes a high luminance portion. Moreover, the light radiated | emitted from the wavelength conversion member 23 becomes light distribution which spreads in a substantially horizontal direction.

  As a result, most of the light emitted from the wavelength conversion member 23 enters the reflection surface of the second reflection member 30 disposed on the outer peripheral side of the wavelength conversion member 23. Then, light distribution is controlled in a predetermined irradiation direction on this reflecting surface.

  According to the embodiment described above in detail, the following excellent effects can be obtained.

  The LED device 20 according to the present embodiment includes a first reflecting member 24 that faces the emission surface above the LED chip 21. Therefore, most of the light emitted from the LED chip 21 is reflected in the substantially horizontal direction by the first reflecting member 24. And the light emitted in the substantially horizontal direction is reflected by the 2nd reflective member 30, and is irradiated to an irradiation target direction. That is, the light directly irradiated to the outside from the LED chip 21 without the second reflecting member 30 is suppressed. As a result, it becomes possible to suppress the double irradiation pattern due to the direct light component and the reflected light component, and the quality of the irradiation pattern is improved. In addition, since the direct light component can be suppressed, the occurrence of glare due to the direct light component can be suppressed.

  In the present embodiment, the reflecting surface of the second reflecting member 30 is formed as a parabolic surface, and the focal point F is set on the circumference of the cylindrical wavelength conversion member 23. Thereby, it is possible to appropriately control the light distribution of the light transmitted through the wavelength conversion unit in the direction of the optical axis A of the LED chip 21 by the second reflecting member 30. Further, the focal point F of the second reflecting member 30 is set to be a high luminance portion of the wavelength conversion member 23, and it is possible to overlook the entire reflection surface of the second reflecting member 30 from this high luminance portion. is there. For this reason, it becomes possible to reflect the light emitted from the high-intensity part in the whole area of the second reflecting plate and efficiently irradiate the LED chip 21 in the optical axis A direction.

  In the present embodiment, a cylindrical wavelength conversion member 23 is disposed so as to surround the LED chip 21. Thereby, the light reflected to the side of the LED chip 21 can be efficiently incident on the wavelength conversion member 23, and the wavelength conversion can be suitably performed.

  In the present embodiment, the shape of the wavelength conversion member 23 is a cylindrical shape surrounding the LED chip 21 rather than covering the entire LED chip 21 in a dome shape or the like. As a result, the size of the wavelength conversion member 23 can be reduced, the luminance of the light emitting surface of the wavelength conversion member 23 can be improved, and a more point light source can be realized.

  Part of the light incident on the wavelength conversion member 23 is absorbed by the wavelength conversion member 23 and the wavelength conversion member 23 generates heat. When the wavelength conversion member 23 generates heat, heat dissipation from the LED chip 21 disposed on the inner peripheral side of the wavelength conversion member 23 is hindered. If the heat dissipation of the LED chip 21 is hindered, the temperature of the LED chip 21 is increased, so that the light emission efficiency of the LED chip 21 is lowered and the lifetime reliability of the LED chip 21 may be adversely affected. In this regard, in this embodiment, since the wavelength conversion member 23 is fixed on the wiring substrate 22, the heat generated by the wavelength conversion member 23 is released through the wiring substrate 22. Further, since the first reflecting member 24 is fixed to the upper end portion of the cylindrical wavelength converting member 23, the heat generated by the wavelength converting member 23 is released through the first reflecting member 24. As a result, the temperature rise of the LED chip 21 can be suppressed, so that the light emission efficiency of the LED chip 21 can be improved and the lifetime reliability of the LED chip 21 can be improved.

  A part of light emitted from the LED chip 21 is totally reflected at the boundary surface between the emission surface of the LED chip 21 and the medium in contact with the emission surface. Therefore, a part of the light emitted from the LED chip 21 is not extracted outside. In this respect, in the present embodiment, a transparent resin 25 is filled in an internal space formed by the cylindrical wavelength conversion member 23 and the wiring board 22, and the LED chip 21 is filled with the resin 25. Here, the refractive index of the resin is larger than the refractive index of air. Therefore, comparing the case where the emission surface of the LED chip 21 is brought into contact with the resin and the case where it is brought into contact with the air, the ratio of the total reflection of light at the boundary surface is lower when the LED chip 21 is brought into contact with the resin. As a result, the LED device 20 of this embodiment can improve the light extraction efficiency.

  A part of the light incident on the wavelength conversion member 23 is transmitted through the wavelength conversion member 23, and the rest is reflected on the inner peripheral surface of the wavelength conversion member 23. Here, in the present embodiment, the first reflecting member 24 has a shape with a smaller diameter as it approaches the LED chip 21. That is, the light reflected by the inner peripheral side surface of the wavelength conversion member 23 passes through the side without entering the first reflection member 24 and is likely to enter the wavelength conversion member 23 again. For this reason, it is suppressed that the light reflected in the inner peripheral side surface of the wavelength conversion member 23 is re-reflected by the 1st reflection member 24, and returns to the LED chip 21, and it becomes possible to improve the light extraction efficiency.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a longitudinal sectional view of a main part of the illumination device 10 according to the present embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the present embodiment, the first reflecting member 24 is formed of a metal having high thermal conductivity such as aluminum or copper, and a heat radiating fin 24c is provided on the upper portion thereof toward the outside. In addition, the surface of the reflective surface portion 24a of the first reflective member 24 is subjected to mirror treatment such as silver vapor deposition as in the first embodiment.

  Also in the present embodiment, heat generated by the wavelength conversion member 23 can be released through the wiring substrate 22 and the first reflection member 24 as in the first embodiment. In particular, in the present embodiment, since the first reflecting member 24 is formed of a metal having high thermal conductivity, the heat of the wavelength conversion member 23 is easily transmitted to the entire first reflecting member 24, and from the entire first reflecting member 24. Heat can be radiated efficiently. In addition, since the heat radiation fins 24c are formed outward in the first reflection member 24, the heat radiation performance from the first reflection member 24 toward the outside can be further improved.

[Third Embodiment]
Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a longitudinal sectional view of the LED device 20 according to this embodiment. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  In the present embodiment, the wiring board 22 is formed by a three-dimensional circuit board (MID: Molded Interconnect Device) in which a predetermined circuit pattern is formed on the surface of an insulating board having a three-dimensional structure, and the second reflecting member 30 is wired. The point which integrated with the board | substrate 22 differs from 1st Embodiment.

  More specifically, the wiring board 22 is formed by forming a base material made of a metal such as aluminum in a three-dimensional structure and providing an insulating layer such as a ceramic film on the surface thereof. The three-dimensional structure of the substrate can be formed by various methods such as metal forging or cutting. As shown in FIG. 4, the wiring substrate 22 is formed in a concave shape on the mounting portion 21 a of the LED chip 21. The concave mounting portion 21a has a substantially parabolic shape whose inner peripheral surface extends toward the opening side of the mounting portion 21a, and the second reflecting portion 22b is formed by the inner peripheral surface.

  Also in the LED device 20 of the present embodiment, as in the first embodiment, most of the light emitted from the LED chip 21 is reflected in the substantially horizontal direction by the first reflecting member 24. And the light emitted in the substantially horizontal direction is reflected by the 2nd reflection part 22b, and is irradiated to an irradiation target direction. That is, also in the present embodiment, it is possible to suppress the double irradiation pattern due to the direct light component and the reflected light component, and it is possible to suppress the occurrence of glare due to the direct light component.

  In the present embodiment, the LED device 20 has a package structure in which the LED chip 21 is mounted on a concave mounting portion 21 a formed on the wiring board 22. That is, in the LED device 20, the wiring board 22 itself having a three-dimensional structure forms the housing of the LED device 20. Thereby, the physique of the LED device 20 as a package can be reduced in size. Further, the second reflecting portion 22 b is formed on the inner peripheral surface of the concave mounting portion 21 a formed on the wiring board 22. Thereby, compared with the case where the 2nd reflection member 30 is provided separately, it becomes possible to reduce the size of the LED device 20 including the 2nd reflection part 22b.

[Fourth Embodiment]
Next, an embodiment in which the LED device according to the present invention is applied to a surface-emitting illumination device will be described with reference to the drawings. FIG. 5 is a longitudinal sectional view of the lighting device according to the present embodiment, and FIG. 6 is a plan view of the lighting device. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  The illumination device 110 is configured by providing the LED device 20 on the light guide plate 130. More specifically, the light guide plate 130 is made of a transparent acrylic plate having a predetermined thickness. One surface of the light guide plate 130 forms a light emitting surface 131, and the other surface has no LED mounting surface 132. A plurality of recesses 133 are formed at predetermined intervals on the LED arrangement surface 132, and the LED device 20 is accommodated in each recess 133. Since the configuration of the LED device 20 housed in each recess 133 is the same as that of the LED device 20 in the first embodiment, the description thereof is omitted.

  A diffuse reflection part 134 is formed on the side surface of the light guide plate 130 and the LED arrangement surface 132. The diffuse reflection unit 134 is processed so that incident light is diffusely reflected. As a processing method thereof, dot printing by a silk screen or fine unevenness processing can be performed. Note that the diffuse reflection process is configured such that the reflectivity increases as the distance from the LED device 20 increases with the LED device 20 as the center.

  As described in the first embodiment, the LED device 20 includes the first reflecting member 24 that faces the emission surface above the LED chip 21. Therefore, there is almost no light component directly emitted upward from the LED device 20, and most of the light component is reflected by the first reflecting member 24 and emitted in a substantially horizontal direction. That is, the light emitted from each LED device 20 is emitted from the recess 133 in a substantially horizontal direction (direction in which the light guide plate 130 spreads) and is guided into the light guide plate 130. The light in the light guide plate 130 is reflected by the diffuse reflection part 134 on the side surface of the light guide plate 130 and the LED arrangement surface 132 and is emitted to the outside from the light emitting surface 131.

  In the illuminating device 110 of this embodiment, there is almost no direct light component from the LED chip 21, and most is a light component of the substantially horizontal direction by the reflection in the 1st reflection member 24. FIG. As a result, it is possible to suppress the occurrence of glare due to direct components.

  In this embodiment, since the diffuse reflection part 134 is formed on the side surface of the light guide plate 130 and the LED arrangement surface 132, it is possible to diffusely reflect light incident on these surfaces in various directions. As a result, the luminance on the light emitting surface 131 can be made uniform. In particular, in the present embodiment, the diffuse reflection processing of the diffuse reflector 134 is configured such that the reflectivity increases as the distance from the LED device 20 increases with each LED device 20 as the center, so that surface emission with more uniform luminance is performed. Is possible.

[Other Embodiments]
In addition, this invention is not limited to the content of description of the said embodiment, For example, you may implement as follows.

  In each said embodiment, although the shape of the 1st reflection member 24 was made into the circular arc shape of a cross section that becomes so small that it approached the LED chip 21, the shape of the 1st reflection member 24 is not restricted to this. That is, as the shape of the first reflecting member 24, the reflecting surface portion 24a can be conical as shown in FIG. Furthermore, as shown in FIG. 7, it is also possible to form the 1st reflection member 24 with a flat plate. Even in these cases, it is possible to reflect the light emitted from the LED chip 21 to the side of the LED chip 21.

In each of the above embodiments, the wavelength conversion member 23 has a cylindrical shape. However, the outer diameter and the inner diameter of the cylinder may be reduced as the distance from the wiring board 22 increases. The light of the light distribution in the substantially horizontal direction is radiated from the wavelength conversion member 23 of each of the above embodiments, but among the radiated components, there are components that are incident on the wiring board 22 and cause a loss. . In this regard, if the wavelength conversion member 23 is shaped so that the diameter of the wavelength conversion member 23 decreases as the distance from the wiring board 22 increases, the light emitted from the wavelength conversion member 23 has a light distribution slightly biased upward. For this reason, it becomes possible to reduce the light component which injects toward the wiring board 22, and can reduce the component which causes loss.

A cylindrical shape that does not change the outer diameter of the cross section


In the first and second embodiments, the reflection surface of the first reflecting member 24 is subjected to high reflection processing. However, the reflection surface of the first reflecting member 24 can be subjected to a diffuse reflection process. This also has the same effect as when the high reflection process is performed. Various methods can be used as the diffuse reflection processing method. For example, after forming unevenness on the surface of the first reflecting member 24 formed by pressing an aluminum plate by sandblasting, a method of coating aluminum or silver by vapor deposition can be employed. Alternatively, aluminum or silver may be vapor-deposited after the first reflecting member 24 is formed using a press mold having fine irregularities formed on the surface. Also, when depositing aluminum or silver on the reflective surface of a metal member with a smooth surface, it is also possible to adopt a method in which fine SiO2 particles with high reflectivity are mixed and applied to the undercoat or topcoat. is there. Moreover, it is also possible to diffusely reflect the first reflective member 24 by coating the reflective surface with white.

  The first reflecting member 24 of the second embodiment was formed of a highly heat conductive metal and the heat dissipating fins 24c were formed. However, both the requirements of forming with a high thermal conductivity metal and the formation of the heat radiation fins 24c are not essential, and it is possible to improve the heat dissipation even with only one of the requirements.

  In the third embodiment, the light guide plate 130 is formed of a transparent or acrylic plate, but the light guide plate 130 may be formed of a resin plate other than acrylic, a glass plate, or the like. Moreover, in the said 3rd Embodiment, although the diffuse reflection process was performed to the side surface of the light-guide plate 130 and the LED arrangement | positioning surface 132, you may perform a specular reflection process to these surfaces.

It is a longitudinal cross-sectional view of the illuminating device which concerns on 1st Embodiment of this invention. It is an enlarged view of the principal part in FIG. It is an enlarged view of the principal part of the illuminating device which concerns on 2nd Embodiment of this invention. It is a longitudinal cross-sectional view of the LED device which concerns on 3rd Embodiment of this invention. It is a longitudinal cross-sectional view of the illuminating device which concerns on 4th Embodiment of this invention. It is a top view of the illuminating device which concerns on 4th Embodiment of this invention. It is an enlarged view of the principal part of the illuminating device which concerns on other embodiment of this invention. It is an enlarged view of the principal part of the illuminating device which concerns on other embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Illuminating device, 20 ... LED device, 21 ... LED chip, 22 ... Wiring board, 23 ... Wavelength conversion member, 24 ... 1st reflection member, 25 ... Resin, 30 ... 2nd reflection member.

Claims (9)

An LED chip;
A wiring board on which the LED chip is mounted and provided with wiring for supplying power to the LED chip;
A first reflecting member provided opposite to the emitting surface of the LED chip and reflecting the light emitted from the LED chip to the side of the space formed between the LED chip;
A part of the light emitted from the LED chip is provided on the side of the LED chip, and the wavelength-converted light is transmitted, and the light that has been wavelength-converted and transmitted is combined with the light that has been transmitted without being wavelength-converted. And a wavelength conversion member that emits the emitted light.   The LED device according to claim 1, wherein the wavelength conversion member is formed in a cylindrical shape and disposed so as to surround the LED chip.   The LED device according to claim 2, wherein the cylindrical wavelength conversion member is brought into contact with the wiring substrate and the first reflecting member is brought into contact with the cylindrical wavelength conversion member.   The LED device according to claim 3, wherein the first reflecting member is made of metal.   5. The LED device according to claim 3, wherein a radiation fin is provided on a side of the first reflecting member opposite to the LED chip.   6. The space surrounded by the wiring board and the wavelength conversion member is filled with a light transmissive resin, and the LED chip is embedded in the resin. The LED device according to one item. A concave portion is formed in the wiring board,
The LED chip is mounted in the recess,
The inner peripheral surface of the concave portion forms a reflection surface that reflects light emitted from the wavelength conversion member in a predetermined radiation direction. LED device.   A second reflecting member that reflects light emitted from the wavelength conversion member in a predetermined radiation direction is provided on the outer peripheral side of the LED device according to any one of claims 1 to 6. Lighting device. A light guide member made of a light-transmitting plate and having a recess formed on one surface;
It is arrange | positioned in the said recessed part, It equips with the LED apparatus as described in any one of Claims 1-6 which radiate | emits light in the direction along the surface of the said light guide member from the said recessed part. Lighting device.

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